CN113079685A

CN113079685A - Shielding cover, shielding assembly and electronic equipment

Info

Publication number: CN113079685A
Application number: CN202110321045.9A
Authority: CN
Inventors: 梁建煊
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2021-03-25
Filing date: 2021-03-25
Publication date: 2021-07-06
Anticipated expiration: 2041-03-25
Also published as: CN113079685B

Abstract

The embodiment of the application provides a shielding cover, a shielding assembly and electronic equipment, wherein the shielding cover comprises a cover body and a plurality of first connecting parts, the cover plate comprises a plurality of compression areas, a plurality of elastic areas and a connecting area, one elastic area surrounds the edge of one compression area, the connecting area is connected with the elastic areas, the elastic areas can generate elastic deformation, and the compression areas are used for being abutted against the shielding frame to limit the shielding frame; the first connecting portions are connected to the connecting areas in a bent mode and are used for being connected with the shielding frame. The embodiment of the application can realize good contact between the shielding cover and the shielding frame.

Description

Shielding cover, shielding assembly and electronic equipment

Technical Field

The present application relates to the field of electronic technologies, and in particular, to a shielding cover, a shielding assembly, and an electronic device.

Background

Electronic devices in electronic equipment and the like emit high-frequency electromagnetic waves during operation, which interfere with normal operation of electronic products, and the electromagnetic waves radiate to the outside to cause harm to human bodies, so as to reduce interference and radiation of the electromagnetic waves. In the related art, the electromagnetic wave radiated by the electronic device disposed on the circuit board is usually shielded by the shielding case, but the connection between the shielding case and the circuit board is unstable, which may cause the leakage of the electromagnetic wave.

Disclosure of Invention

The embodiment of the application provides a shielding cover, a shielding assembly and electronic equipment, which can realize good contact between the shielding cover and a shielding frame.

In a first aspect, an embodiment of the present application provides a shielding cover, for covering a shielding frame, including:

the cover comprises a cover body, wherein the cover plate comprises a plurality of compression areas, a plurality of elastic areas and a connection area, one elastic area surrounds the edge of one compression area, the connection area is connected with the plurality of elastic areas, the elastic areas can generate elastic deformation, and the compression areas are used for being abutted against the shielding frame to limit the shielding frame;

and the first connecting parts are connected with the connecting areas in a bent mode and are used for being connected with the shielding frame.

In a second aspect, an embodiment of the present application provides a shielding assembly, including:

a shield cover as described in the embodiments of the above application;

one or more shield frames, the shield cover is located the one or more shield frames, and one at least a part of the shield frame with one compress tightly regional butt in order to spacing the one or more shield frames.

In a second aspect, an embodiment of the present application provides an electronic device, including:

a circuit board having a ground plane;

a plurality of electronic devices disposed on the circuit board; and

the shielding assembly is as described in the above application embodiments, one of the shielding frame covers is disposed on one or more of the electronic devices, and the second connecting portion is electrically connected to the ground plane.

The shielding lid of this application embodiment is including covering body and a plurality of connecting portion, and the lid body is including compressing tightly region, elastic zone and connection area, and elastic zone produces deformation and produces pulling force to compressing tightly the region under the effect of the extrusion force of shielding frame, compresses tightly the region and compresses tightly the shielding frame under the combined action of the extrusion force of shielding frame and the pulling force of elastic zone to realize the good contact of shielding lid and shielding frame.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly introduced below. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 2 is a schematic structural diagram of a circuit board, an electronic device, and a shielding assembly in the electronic device shown in fig. 1.

Fig. 3 is an exploded view of the circuit board, electronic device and shield assembly shown in fig. 2.

Fig. 4 is a partial schematic structural view of a circuit board, an electronic device, and a shielding assembly in the electronic device shown in fig. 1.

Fig. 5 is a schematic structural view of the circuit board, the electronic device, and the shield cover of the shield assembly shown in fig. 1 shown in fig. 2.

Fig. 6 is a first partial structural view of the shield cover shown in fig. 5.

Fig. 7 is an enlarged view of a portion a of the shield cover shown in fig. 6.

Fig. 8 is an enlarged schematic view of a portion B of the circuit board, the electronic device, and the shield assembly shown in fig. 4.

Fig. 9 is a second partial structural view of the shield cover shown in fig. 5.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Embodiments of the present application provide a shielding cover, a shielding assembly and an electronic device, which will be described in detail below. As shown in fig. 1, fig. 1 is a schematic structural diagram of an electronic device provided in an embodiment of the present application. Embodiments of the present application provide an electronic device 20, where the electronic device 20 may be a computing device such as a laptop computer, a computer monitor containing an embedded computer, a tablet computer, a cellular telephone, a media player, or other handheld or portable electronic device, a smaller device (such as a wristwatch device, a hanging device, an earphone or earpiece device, a device embedded in eyeglasses, or other device worn on the head of a user, or other wearable or miniature device), a television, a computer display that does not contain an embedded computer, a gaming device, a navigation device, an embedded system (such as a system where an electronic device with a display is installed in a kiosk or automobile), a device that implements the functionality of two or more of these devices, or other electronic devices. In the exemplary configuration of fig. 1, the electronic device 20 is a portable device, such as a cellular telephone, media player, tablet, or other portable computing device. Other configurations may be used for the electronic device 20, if desired. The example of fig. 1 is merely exemplary.

The electronic device 20 may include a circuit board 100, a plurality of electronic devices 200, and a shield assembly 300. The circuit board 100 may provide a platform for supporting the electronic devices 200 and the shielding assembly 300, and the electronic devices 200 and the shielding assembly 300 are disposed on the circuit board 100.

Some or all of the electronic devices 200 may generate electromagnetic waves during operation, and the electromagnetic waves may cause some of the electronic devices 20 to be interfered and affect their normal operation. The shielding assembly 300 of the embodiment of the present application can shield the electromagnetic wave to reduce the electromagnetic interference of different electronic devices.

Referring to fig. 2 to 4, fig. 2 is a schematic structural diagram of a circuit board, an electronic device and a shielding assembly in the electronic device shown in fig. 1, fig. 3 is a schematic structural diagram of an explosion of the circuit board, the electronic device and the shielding assembly shown in fig. 2, and fig. 4 is a schematic structural diagram of a part of the circuit board, the electronic device and the shielding assembly in the electronic device shown in fig. 1. The shielding assembly 300 may include a shielding cover 320 and a shielding frame 340, the shielding cover 320 being disposed over an exterior of one or more shielding frames 340, the shielding frame 340 being disposed over one or more electronic devices 320 of the plurality of electronic devices 320. For example, the plurality of electronic devices 320 may include two electronic devices 320, one shielding frame 340 may cover the outside of one electronic device 320, or one shielding frame 340 may cover the outside of two electronic devices 320 at the same time.

Referring to fig. 4 and 5, fig. 5 is a schematic structural view of the circuit board, the electronic device, and the shielding cover of the shielding assembly shown in fig. 1 and shown in fig. 2. The shield cover 320 may include a cover body 322 and a plurality of first connection portions 324. The cover body 322 may include a plurality of pressing regions 3222, a plurality of elastic regions 3224, and a connection region 3226, one elastic region 3224 being defined around an edge of one pressing region 3222, the connection region 3226 connecting the plurality of elastic regions 3224 to be integrated therewith. The elastic region 3224 can be elastically deformed, and the pressing region 3222 abuts against the shielding frame 340 to limit the shielding frame 340. The plurality of first connecting portions 324 are all bent and connected to the connecting area 3226 to form a receiving space, and the shielding frame 340 can be received in the receiving space. And the plurality of first connection portions 324 are connected to the shield frame 340 so that the shield cover 320 is fixed to the shield frame 340.

In practical applications, the limited area of actual contact between the shield cover 320 and the shield frame 340 cannot be guaranteed due to flatness tolerance and surface oxidation that may exist during the manufacturing process. Based on this, the structure of the shielding assembly 300 is improved from practical application, so that when the shielding frame 340 covers the electronic device 320, the shielding frame 340 generates a pressing force on the shielding cover 320 under the action of the electronic device 320, the elastic region 3224 generates a deformation under the action of the pressing force to generate a pulling force on the pressing region 3222, and the pressing region 3222 presses the shielding frame 340 under the combined action of the pressing force on the shielding frame 340 and the pulling force on the elastic region 32224, thereby achieving good contact between the shielding cover 320 and the shielding frame 340.

When the electronic device 200 radiates and couples the electromagnetic signal to the shielding cover 320, the shielding cover 320 may conduct the electromagnetic signal to the shielding frame 340 corresponding to the electronic device 200, the shielding frame 340 corresponding to the electronic device 200 may conduct the electromagnetic signal to the other shielding frames 340, and the shielding frame 340 and the other shielding frames 340 corresponding to the electronic device 200 are conducted to the ground plane of the circuit board 100, so that more electromagnetic signals are conducted to the ground plane, and the electromagnetic interference to other electronic devices and other components outside is reduced by reducing the parasitic of the residual electromagnetic signal on the shielding cover 320. Due to the good contact of the shield cover 320 and the shield frame 340, the efficiency of conducting the electromagnetic signal on the shield cover 320 to the ground plane may be improved.

One resilient region 3224 may include one or more convex edges, each protruding from one side of at least a portion of the pressing region 3222 connected thereto. At least a portion of the plurality of resilient regions 3224 includes a plurality of convex edges, a portion of two adjacent convex edges of the plurality of convex edges are connected to each other, at least a portion of a first convex edge of the plurality of convex edges is connected to at least a portion of the pressing region 3222, and at least a portion of a last convex edge of the plurality of convex edges is connected to at least a portion of the connecting region 3226.

Exemplarily, referring to fig. 5 to 7, fig. 6 is a first partial structural schematic diagram of the shielding cover shown in fig. 5, and fig. 7 is an enlarged structural schematic diagram of a portion a of the shielding cover shown in fig. 6. At least a portion of the resilient regions 3224 may include a first convex edge 3224a and a second convex edge 3224 b. A portion of the first convex edge 3224a is connected to the pressing region 3222, and the first convex edge 3224a protrudes from one side of the pressing region 3222, a portion of the second convex edge 3224b is connected to the first convex edge 3224a, and a portion of the second convex edge 3224b is connected to the connecting region 3226.

Wherein the first convex edge 3224a and the second convex edge 3224a may be formed by a half-cutting process for the shielding cover 320. The semi-shearing process described in the embodiments of the present application refers to a method of punching the first convex edge 3224a and the second convex edge 3224b out of the shielding cover 320 without punching.

The first convex edge 3224a and the second convex edge 3224a may both be in regular shapes, for example, the first convex edge 3224a and the second convex edge 3224b may both be in a rectangular parallelepiped structure, the first convex edge 3224a may have a first side surface and a second side surface which are oppositely disposed, a portion of the first side surface is connected to the pressing region 3222, another portion of the first side surface is exposed, a portion of the second side surface is connected to the second convex edge 3224b, and another portion of the second side surface is exposed. The second convex edge 3224b may have a third side and a fourth side opposite to each other, wherein a portion of the third side is connected to a portion of the second side, another portion of the third side is exposed, a portion of the fourth side is connected to the connecting region 3226, and another portion of the fourth side is exposed. Of course, the first convex edge 3224a and the second convex edge 3224a may also have other regular or irregular shapes.

It can be understood that, since the first convex edge 3224a and the pressing region 3222, the first convex edge 3224a and the second convex edge 3224b, and the second convex edge 3224b and the connecting region 3226 are all partially connected, compared to the entire connection, the thickness of the connecting position is thinner than the overall thickness of the pressing region 3222, so that the connecting position of the first convex edge 3224a and the pressing region 3222, the connecting position of the first convex edge 3224a and the second convex edge 3224b, and the connecting position of the second convex edge 3224b and the connecting region 3226 are easily deformed, thereby implementing the elastic deformation of the elastic region 3224.

As shown in fig. 8, fig. 8 is an enlarged schematic structural view of a portion B of the circuit board, the electronic device, and the shield assembly shown in fig. 4. The shielding frame 340 may include a frame body 342 and a second connecting portion 344, the second connecting portion 344 is disposed around an edge of the frame body 342 to form a shielding space 346, the shielding space 346 may be used to accommodate the electronic device 200, and the second connecting portion 344 is further electrically connected to the ground plane of the circuit board 100 to achieve grounding of the shielding frame 340. The frame body 342 may be provided with a plurality of openings.

The pressing area 3222 covers a portion of the frame body 342 and abuts against a portion of the frame body 342, the elastic area 3224 covers a portion of the frame body 342, the first convex edge 3224a abuts against a portion of the frame body 342, the second convex edge 3224b has a gap with the frame body 342, the connecting area 3226 covers a portion of the frame body 342 and the connecting area 326 abuts against a portion of the frame body 342, and the at least one first connecting portion 324 is connected with at least a portion of the second connecting portion 344 so that the shielding frame 340 and the shielding cover 320 are fixedly connected to each other.

It should be noted that the number of convex edges is not limited, for example, a portion of the elastic regions 3224 or the entire elastic region 3224 in the plurality of elastic regions 3224 may include three convex edges, four convex edges, five convex edges or other numbers of convex edges. Wherein the specific number of convex edges can be designed by the desired elastic strength of the elastic region 3224. Of course, at least a portion of the resilient areas 3224 may include a protrusion 3224.

Illustratively, as shown in fig. 9, fig. 9 is a second partial structural view of the shielding cover shown in fig. 5. A portion of the resilient regions 3224 of the plurality of resilient regions 3224 may include a third convex edge 3224c, the third convex edge 3224c may include a fifth side and a sixth side that are oppositely disposed, a portion of the fifth side may be connected with a portion of the pressing region 3222, and a portion of the sixth side may be connected with a portion of the connecting region 3226. Of course, all of the resilient areas 3224 in the plurality of resilient areas 3224 may include only one raised edge.

In other embodiments, the elastic area 3224 may also be formed by injection molding an elastic material on the edge of the pressing area 3222, and the formed elastic area 3224 may be deformed. The elastic material may be Thermoplastic Rubber such as TPR (Thermoplastic Rubber), TPV (Thermoplastic Vulcanizate), TPU (Thermoplastic polyurethane elastomer), or other elastic material that can be injection molded.

Wherein an outer surface of each of the plurality of pinched regions 3222 is flush with each other. Illustratively, as shown in fig. 5, the cover body 322 may include a first pressing area 3222a, a second pressing area 3222b, a third pressing area 3222c and a fourth pressing area 3222d, wherein a periphery of each pressing area is surrounded by an elastic area 3224, and each elastic area 3224 is connected to each other by a connecting area 3226 to form an integral structure. The outer surfaces of the first and

second pinch areas

3222a, 3222b, third and

fourth pinch areas

3222c, 3222d are flush with one another.

Of course, in other embodiments, the outer surface of each of the plurality of pinched regions 3222 may not be flush. For example, the layout of the plurality of compaction regions can be designed according to the height of each electronic device. For example, the outer surface of the first pressing area 3222a is higher than that of the second pressing area 3222b, and the first electronic device is disposed under the first pressing area 3222a, and the second electronic device is disposed under the second pressing area 3222b, so that the electronic devices with different heights can be accommodated in different shielding spaces, and the device stacking in the inner space of the electronic apparatus 20 is more reasonable.

With reference to fig. 5, the connecting area 3226 is provided with a plurality of through holes 3228, a portion of the plurality of first connecting portions 324 is accommodated in the plurality of through holes 3228, such as a portion of one first connecting portion 324 is accommodated in one through hole 3228, or several (such as two, three, or four) first connecting portions 324 of the plurality of first connecting portions 324 are accommodated in one through hole 3227. A portion of the plurality of first connecting portions 324 is bent and connected to the edge of the connecting area 3226. The first connecting portions 324 may or may not have the same size.

Those skilled in the art will appreciate that the configuration of the electronic device 20 shown in fig. 1 does not constitute a limitation of the electronic device 20. The electronic device 20 may include more or fewer components than shown, or some components may be combined, or a different arrangement of components. The electronic device 20 may further include a processor, a memory, a bluetooth module, etc., which are not described in detail herein.

The shielding cover, the shielding assembly and the electronic device provided by the embodiments of the present application are described in detail above. The principles and implementations of the present application are described herein using specific examples, which are presented only to aid in understanding the present application. Meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims

1. A shield cover for covering a shield frame, comprising:

the cover comprises a cover body, wherein the cover plate comprises a plurality of compression areas, a plurality of elastic areas and a connection area, one elastic area surrounds the edge of one compression area, the connection area is connected with the plurality of elastic areas, the elastic areas can deform, and the compression areas are used for being abutted against the shielding frame to limit the shielding frame;

2. The shielding cover of claim 1, wherein one of the resilient regions comprises one or more raised edges each raised to one side of at least a portion of the clamping region to which it is attached.

3. The shielding cover according to claim 1, wherein at least a portion of the elastic regions of the plurality of elastic regions comprises a plurality of the convex edges, a portion of two adjacent convex edges of the plurality of convex edges are connected to each other, at least a portion of a first convex edge of the plurality of convex edges is connected to at least a portion of the pressing region, and at least a portion of a last convex edge of the plurality of convex edges is connected to at least a portion of the connecting region.

4. The shielding cover according to claim 3, wherein at least a portion of the plurality of resilient regions comprises a first flange and a second flange, the first flange comprises a first side and a second side opposite to each other, a portion of the first side is connected to a portion of the pressing region, the second flange comprises a third side and a fourth side opposite to each other, a portion of the third side is connected to a portion of the second side, and a portion of the fourth side is connected to a portion of the connecting region.

5. The shielding cover according to any one of claims 2 to 4, wherein at least a portion of the plurality of resilient regions comprises a third raised edge, the third raised edge comprises a fifth side and a sixth side disposed opposite to each other, a portion of the fifth side is connected to a portion of the pressing region, and a portion of the sixth side is connected to a portion of the connecting region.

6. The shielding cover of claim 4, wherein an outer surface of each pinched region of the plurality of pinched regions is flush with each other.

7. The shielding cover according to any one of claims 1 to 4, wherein the connecting area is provided with a plurality of through holes, a portion of the plurality of first connecting portions being received in the plurality of through holes, and a portion of the plurality of first connecting portions being connected to an edge of the connecting area by bending.

8. A shield assembly, comprising: a shield cover according to any one of claims 1 to 7;

9. The shielding assembly of claim 8, wherein the shielding frame includes a frame body and a second connecting portion, a portion of the frame body abuts against the compression region and a portion of the frame body abuts against the elastic region, the second connecting portion is disposed around an edge of the frame body to form a shielding space, and at least a portion of the second connecting portion is connected to at least one of the first connecting portions.

10. An electronic device, comprising:

a circuit board having a ground plane;

a plurality of electronic devices disposed on the circuit board; and

a shield assembly as claimed in any one of claims 8 to 10, wherein one of the shield housings is provided to one or more of the electronic devices, and the second connecting portion is electrically connected to the ground plane.