JPH0870195A - Shielding of printed circuit board - Google Patents

Shielding of printed circuit board

Info

Publication number
JPH0870195A
JPH0870195A JP20383794A JP20383794A JPH0870195A JP H0870195 A JPH0870195 A JP H0870195A JP 20383794 A JP20383794 A JP 20383794A JP 20383794 A JP20383794 A JP 20383794A JP H0870195 A JPH0870195 A JP H0870195A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
cover
shield
cover member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20383794A
Other languages
Japanese (ja)
Inventor
Osamu Kitagawa
修 北川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Radio Co Ltd
Original Assignee
Japan Radio Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Radio Co Ltd filed Critical Japan Radio Co Ltd
Priority to JP20383794A priority Critical patent/JPH0870195A/en
Publication of JPH0870195A publication Critical patent/JPH0870195A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To make it possible to mount simply a cover member on a miniaturized printed circuit board and moreover, to bring the cover member into contact with the circuit board stably and firmly as well as to increase the contact area of the cover member to the circuit board to make it possible to obtain a good shielding effect for the printed board. CONSTITUTION: When a shielding cover 22 is incorporated in a housing 44, a force, which is inclined to separate the cover 22 from a printed circuit board 18 by the resilient force of pawl pieces 26 provided in the cover 22, acts, while a force A, which presses the cover 22 to the side of the board 18 by the housing 44, acts in the opposite direction to the above force. Accordingly, the cover 22 is attached on the board 18 by the pressing force of the housing 44 to fulfill a shielding effect for the board 18.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、例えば、小型携帯用の
電話機等のハウジング内に組み込まれるプリント回路基
板のシールド方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for shielding a printed circuit board incorporated in a housing of, for example, a small portable telephone.

【0002】[0002]

【従来の技術】通常、電界の影響力から免れるために、
装置の周囲や装置との間に、接地された金属スクリー
ン、シート、囲い等のシールド手段が設けられる。
2. Description of the Related Art Normally, in order to avoid the influence of an electric field,
A shield means such as a grounded metal screen, sheet, or enclosure is provided around the device or between the device and the device.

【0003】例えば、小型携帯用の電話機では、ロジッ
ク系回路部品等から発せられた電波により無線周波受信
部にノイズが混入し、前記無線周波受信部における受信
感度の低下を招来することから、図9に示されるよう
に、プリント回路基板に配設されたロジック系回路部品
等を囲繞して静電的に遮蔽するシールドケースが設けら
れ、前記シールドケースによって無線周波受信部に妨害
電波が受信されることを防止している。
For example, in a small portable telephone, noise is mixed into the radio frequency receiving section by radio waves emitted from logic circuit parts and the like, which causes a reduction in the receiving sensitivity of the radio frequency receiving section. As shown in FIG. 9, a shield case for surrounding and electrostatically shielding the logic circuit parts and the like arranged on the printed circuit board is provided, and the shield case allows the radio frequency receiver to receive the interference radio waves. Is prevented.

【0004】このシールドケース1は、表面にCPU等
のロジック系部品2が配設され、裏面にアース層3(図
10参照)が形成されたプリント回路基板4と、前記プ
リント回路基板4の表面に形成された配線パターン5を
囲繞し、該プリント回路基板4の表面にハンダ付けして
固着されるシールド板金ケース枠6と、前記シールド板
金ケース枠6に取着されるケースカバー7とから構成さ
れる。
The shield case 1 has a printed circuit board 4 on the front surface of which a logic system component 2 such as a CPU is disposed, and a ground layer 3 (see FIG. 10) formed on the back surface, and the front surface of the printed circuit board 4. A shielded sheet metal case frame 6 surrounding the wiring pattern 5 formed on the printed circuit board 4 and fixed to the surface of the printed circuit board 4 by soldering, and a case cover 7 attached to the shielded sheet metal case frame 6. To be done.

【0005】前記プリント回路基板4には、その表面に
形成された配線パターン5と裏面に形成されたアース層
3とを導通接続するためのスルーホール8が複数個画成
されている。前記スルーホール8は、配線パターン5の
外周に沿ってロジック系部品2等を囲繞し、所定間隔離
間して画成されている。
The printed circuit board 4 is formed with a plurality of through holes 8 for electrically connecting the wiring pattern 5 formed on the front surface and the ground layer 3 formed on the back surface. The through holes 8 are formed along the outer periphery of the wiring pattern 5 so as to surround the logic components 2 and the like, and are separated by a predetermined distance.

【0006】図10に示されるように、前記ケースカバ
ー7の外周部9aは断面略L字状に内側に所定角度折曲
して形成され、その外周部9aの端縁部9bに弾発力F
を付与している。前記弾発力Fによってケースカバー7
の端縁部9bがシールド板金ケース枠6の外壁面を矢印
方向に押圧することにより、該ケースカバー7がシール
ド板金ケース枠6に取着されている。
As shown in FIG. 10, the outer peripheral portion 9a of the case cover 7 is formed by bending it inward at a predetermined angle in a substantially L-shaped cross section, and an elastic force is exerted on an end edge portion 9b of the outer peripheral portion 9a. F
Has been granted. Due to the elastic force F, the case cover 7
The case cover 7 is attached to the shield sheet metal case frame 6 by pressing the outer wall surface of the shield sheet metal case frame 6 in the direction of the arrow by the end edge portion 9b.

【0007】[0007]

【発明が解決しようとする課題】この場合、従来技術に
係る前記シールドケース1では、シールド板金ケース枠
6の外壁面をケースカバー7の端縁部9bが一方向から
押圧して該ケースカバー7とシールド板金ケース枠6と
を接触させているため、前記ケースカバー7とシールド
板金ケース枠6との接触状態が弱いとともに、端縁部9
bの折曲角度によって接触状態にばらつきが生ずるとい
う不都合がある。また、前記ケースカバー7とシールド
板金ケース枠6との接触面積が少ないという不都合もあ
る。このため、所望のシールド効果を発揮することがで
きないという問題がある。
In this case, in the shield case 1 according to the prior art, the outer wall surface of the shield sheet metal case frame 6 is pressed by the end edge portion 9b of the case cover 7 from one direction to cause the case cover 7 to move. And the shield sheet metal case frame 6 are in contact with each other, the contact state between the case cover 7 and the shield sheet metal case frame 6 is weak and the edge 9
There is a disadvantage that the contact state varies depending on the bending angle of b. Further, there is also a disadvantage that the contact area between the case cover 7 and the shield sheet metal case frame 6 is small. Therefore, there is a problem that a desired shield effect cannot be exhibited.

【0008】さらに、携帯用の電話機に対する小型化の
要請に伴って、前記携帯用の電話機のハウジング内に組
み込まれるプリント回路基板も小型化が要求され、前記
小型化されたプリント回路基板に対してシールド板金ケ
ース枠をハンダ付けする作業が煩雑であるという不都合
がある。
Further, in response to the demand for miniaturization of portable telephones, miniaturization of printed circuit boards incorporated in the housing of the portable telephones is also required. There is an inconvenience that the work of soldering the shield sheet metal case frame is complicated.

【0009】本発明は、前記の不都合を克服するために
なされたものであり、小型化されたプリント回路基板に
対して簡便にカバー部材を装着することができ、さら
に、カバー部材とプリント回路基板とを安定的且つ強固
に接触させるとともに、接触面積を増大させて良好なシ
ールド効果を得ることが可能なプリント回路基板のシー
ルド方法を提供することを目的とする。
The present invention has been made in order to overcome the above-mentioned inconvenience, and a cover member can be easily attached to a miniaturized printed circuit board, and further, the cover member and the printed circuit board can be mounted. It is an object of the present invention to provide a method of shielding a printed circuit board, capable of stably and firmly contacting with each other and increasing a contact area to obtain a good shielding effect.

【0010】[0010]

【課題を解決するための手段】前記の目的を達成するた
めに、本発明は、移動用の小型無線通信機のハウジング
内に組み付けられ、一方の面に形成された配線パターン
上に回路部品が配設され、他方の面にアース層が形成さ
れたプリント回路基板のシールド方法であって、前記ハ
ウジングの押圧力によって、弾発力が付与されたカバー
部材と前記プリント回路基板とが相互に押圧し合ってハ
ウジング内に保持され、前記回路部品をカバー部材で閉
塞することを特徴とする。
In order to achieve the above-mentioned object, the present invention is to install a circuit component on a wiring pattern formed on one surface, which is assembled in a housing of a mobile radio communication device. A method of shielding a printed circuit board disposed on the other surface of which a ground layer is formed, wherein a cover member to which elastic force is applied is pressed against the printed circuit board by a pressing force of the housing. It is characterized in that the circuit components are held in the housing in opposition to each other and the circuit component is closed by a cover member.

【0011】[0011]

【作用】上記の本発明に係るプリント回路基板のシール
ド方法では、ハウジング内に組み込まれた際、弾発力が
付与されたカバー部材によって該カバー部材をプリント
回路基板から離間させようとする力が作用する一方、前
記ハウジングから前記離間させようとする力とは反対方
向にカバー部材をプリント回路基板側に押圧する力が作
用する。従って、カバー部材をプリント回路基板から離
間させようとする力とハウジングによってカバー部材を
プリント回路基板側に押圧する力とが対向することによ
り、前記カバー部材とプリント回路基板とを安定的に且
つ強固に接触させることができる。
In the printed circuit board shielding method according to the present invention described above, when the cover member is incorporated in the housing, the force for separating the cover member from the printed circuit board by the cover member to which the elastic force is applied is applied. On the other hand, a force that presses the cover member toward the printed circuit board acts in a direction opposite to the force that attempts to separate the cover member from the housing. Therefore, the force for separating the cover member from the printed circuit board and the force for pressing the cover member toward the printed circuit board by the housing face each other, so that the cover member and the printed circuit board are stably and firmly bonded. Can be contacted with.

【0012】また、カバー部材に設けられた爪面または
導電性ゴムがプリント回路基板の上面部に接触すること
により、カバー部材とプリント回路基板との接触面積を
増大させることができる。
Further, the contact surface between the cover member and the printed circuit board can be increased by bringing the claw surface or the conductive rubber provided on the cover member into contact with the upper surface portion of the printed circuit board.

【0013】この結果、カバー部材によって閉塞された
回路部品から放射される電波が遮蔽される。
As a result, the radio waves radiated from the circuit component blocked by the cover member are shielded.

【0014】[0014]

【実施例】次に、本発明に係るプリント回路基板のシー
ルド方法について、これを実施するシールドケースとの
関係において好適な実施例を挙げ、添付の図面を参照し
ながら以下詳細に説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, a method for shielding a printed circuit board according to the present invention will be described in detail below with reference to the accompanying drawings, with reference to preferred embodiments in relation to a shield case for carrying out the method.

【0015】図1は、本発明の実施例に係るプリント回
路基板のシールド方法を適用したシールドケースの分解
斜視図、図2Aは、図1に示すプリント回路基板の平面
図、図2Bは、図1に示すプリント回路基板の底面図、
図3は、図1に示すシールドケースの一側面図、図4
は、図1に示すシールドカバーの部分拡大斜視図を夫々
示す。
FIG. 1 is an exploded perspective view of a shield case to which a method of shielding a printed circuit board according to an embodiment of the present invention is applied, FIG. 2A is a plan view of the printed circuit board shown in FIG. 1, and FIG. 1 is a bottom view of the printed circuit board shown in FIG.
3 is a side view of the shield case shown in FIG. 1, FIG.
3A and 3B respectively show partially enlarged perspective views of the shield cover shown in FIG.

【0016】このシールドケース10は、好適には、小
型携帯用の電話機等の移動用小型無線通信機のハウジン
グ内に組み付けられるものであり、基本的には、表面に
CPU等のロジック系回路部品12を含む回路部品14
a〜14cが配設され、裏面にアース層16(図2B参
照)が印刷されたプリント回路基板18と、前記プリン
ト回路基板18に形成された配線パターン20を囲繞
し、該プリント回路基板18を押圧した状態で取着され
るシールドカバー22(カバー部材)とから構成され
る。なお、プリント回路基板18の裏面に形成されたア
ース層16は、図2A、図2Bに示されるように、表面
に形成される配線パターン20に対応する位置に形成さ
れている。
The shield case 10 is preferably assembled in a housing of a small mobile radio communication device such as a small portable telephone, and basically, a logic system circuit component such as a CPU is provided on the surface. Circuit parts 14 including 12
The printed circuit board 18 on which the ground layers 16 (see FIG. 2B) are printed and the wiring patterns 20 formed on the printed circuit board 18 are surrounded, and the printed circuit board 18 is provided. It is composed of a shield cover 22 (cover member) attached in a pressed state. The ground layer 16 formed on the back surface of the printed circuit board 18 is formed at a position corresponding to the wiring pattern 20 formed on the front surface, as shown in FIGS. 2A and 2B.

【0017】シールドカバー22は板金材料によって好
適に形成され、略長方形状の平面部24aと前記平面部
24aの外周形状に沿って折曲する枠部24bとが一体
的に形成されている。前記枠部24bの端縁には、複数
個に分割され且つ内側に折曲して弾力性を発揮する爪片
26が形成されている(図4参照)。なお、複数の前記
爪片26、…は、その根本部分から平板状に折り曲げて
形成し、あるいは湾曲させて折り曲げて形成してもよ
い。さらに、前記シールドカバー22の外周部には、該
シールドカバー22をプリント回路基板18に対して圧
接した状態で取着する際、位置決めの機能を営むガイド
片32a〜32g(32e〜32gは図示せず)が複数
個設けられている。
The shield cover 22 is preferably formed of a sheet metal material, and is formed integrally with a substantially rectangular flat surface portion 24a and a frame portion 24b which is bent along the outer peripheral shape of the flat surface portion 24a. On the edge of the frame portion 24b, a claw piece 26 that is divided into a plurality of parts and is bent inward to exhibit elasticity is formed (see FIG. 4). Note that the plurality of claw pieces 26, ... May be formed by bending the base portion thereof into a flat plate shape, or may be formed by bending and bending. Further, guide pieces 32a to 32g (32e to 32g are not shown in the drawing) that perform a positioning function when the shield cover 22 is attached to the outer peripheral portion of the shield cover 22 while being pressed against the printed circuit board 18. Multiple) are provided.

【0018】プリント回路基板18の表面には配線パタ
ーン20が形成され、前記配線パターン20にロジック
系回路部品12を含む複数の回路部品14a〜14cが
電気的に接続されている。また、前記プリント回路基板
18には、前記配線パターン20の外周形状に沿って等
間隔に複数のスルーホール38、…が画成され、前記ス
ルーホール38、…を介して該配線パターン20とアー
ス層16とが導通接続される。さらに、前記配線パター
ン20の外周部には、シールドカバー22のガイド片3
2a〜32gと係合する孔部40および凹部42が画成
されている。
A wiring pattern 20 is formed on the surface of the printed circuit board 18, and a plurality of circuit components 14a to 14c including the logic circuit component 12 are electrically connected to the wiring pattern 20. Further, a plurality of through holes 38, ... Are defined on the printed circuit board 18 at equal intervals along the outer peripheral shape of the wiring pattern 20, and the wiring pattern 20 and the ground are formed through the through holes 38 ,. The layer 16 is electrically connected. Further, the guide piece 3 of the shield cover 22 is provided on the outer peripheral portion of the wiring pattern 20.
A hole 40 and a recess 42 that engage with 2a to 32g are defined.

【0019】本発明の実施例に係るプリント回路基板の
シールド方法を適用したシールドケース10は基本的に
は以上のように構成されるものであり、次にその作用効
果をシールドケース10の製造方法に基づいて説明す
る。
The shield case 10 to which the printed circuit board shield method according to the embodiment of the present invention is applied is basically constructed as described above. Next, the operation and effect thereof will be described. It will be described based on.

【0020】先ず、プリント回路基板18に形成された
配線パターン20の外周部に沿って等間隔離間する複数
のスルーホール38、…を穿設する。この場合、前記ス
ルーホール38、…によってプリント回路基板18の表
面に形成された配線パターン20と裏面に形成されたア
ース層16とを導通接続させる。
First, a plurality of through holes 38, ... Are formed at equal intervals along the outer peripheral portion of the wiring pattern 20 formed on the printed circuit board 18. In this case, the wiring pattern 20 formed on the front surface of the printed circuit board 18 and the ground layer 16 formed on the back surface are electrically connected by the through holes 38.

【0021】続いて、前記プリント回路基板18の孔部
40および凹部42にシールドカバー22のガイド片3
2a〜32gを夫々係合させ両者を位置決めする。この
ように位置決めされた状態において、小型携帯用の電話
機等のハウジング44による押圧力を介してシールドカ
バー22をプリント回路基板18に押圧して圧接する
(図3参照)。従って、前記ハウジング44の押圧力に
よってシールドカバー22とプリント回路基板18とは
相互に押圧された状態で取着され、且つハウジング44
内で保持される。
Subsequently, the guide piece 3 of the shield cover 22 is inserted into the hole 40 and the recess 42 of the printed circuit board 18.
2a to 32g are engaged with each other to position them. In the thus positioned state, the shield cover 22 is pressed against the printed circuit board 18 by pressing force by the housing 44 of a small portable telephone or the like (see FIG. 3). Therefore, the shield cover 22 and the printed circuit board 18 are attached while being pressed against each other by the pressing force of the housing 44, and the housing 44 is attached.
Retained within.

【0022】このようにしてシールドカバー22がプリ
ント回路基板18に取着された際、シールドカバー22
の外周部に設けられた複数の爪片26、…は弾力性を有
することから、該シールドカバー22をプリント回路基
板18から離間させようとする力(図示せず)が作用す
る。この場合、図3に示されるように、シールドケース
10が組み込まれた前記ハウジング44によって、前記
離間させる力より大なる力Aが矢印方向(シールドカバ
ー22およびプリント回路基板18に対し略垂直方向)
に作用する。従って、シールドケース10は、前記シー
ルドカバー22をプリント回路基板18から離間させよ
うとする力とハウジング44によってシールドカバー2
2をプリント回路基板18側に押圧する力Aとが相互に
対向して作用することにより、前記シールドカバー22
とプリント回路基板18とを安定的且つ強固に接触した
状態に保持することができる。
In this way, when the shield cover 22 is attached to the printed circuit board 18, the shield cover 22 is attached.
Since the plurality of claw pieces 26, ... Provided on the outer peripheral portion of, have elasticity, a force (not shown) for separating the shield cover 22 from the printed circuit board 18 acts. In this case, as shown in FIG. 3, due to the housing 44 in which the shield case 10 is incorporated, a force A larger than the separating force is in the arrow direction (the direction substantially perpendicular to the shield cover 22 and the printed circuit board 18).
Act on. Therefore, the shield case 10 has a force to move the shield cover 22 away from the printed circuit board 18 and the shield cover 2 by the housing 44.
2 and the force A that presses the printed circuit board 18 toward the printed circuit board 18 face each other, so that the shield cover 22
The printed circuit board 18 and the printed circuit board 18 can be stably and firmly contacted with each other.

【0023】また、シールドカバー22の折曲する複数
の爪片26、…がプリント回路基板18の上面部に接触
するため、図9および図10に示す従来例と比較して、
シールドカバー22とプリント回路基板18との接触面
積を増大させることができる。
Further, since the plurality of bent claw pieces 26 of the shield cover 22 come into contact with the upper surface portion of the printed circuit board 18, as compared with the conventional example shown in FIGS. 9 and 10,
The contact area between the shield cover 22 and the printed circuit board 18 can be increased.

【0024】以上のように、本発明の実施例に係るプリ
ント回路基板のシールド方法を適用したシールドケース
10では、従来例に係るシールドケース1と比較してシ
ールド効果をより一層増大させることができる。この結
果、シールドケース10内に配設されたロジック系回路
部品12からの妨害電波が遮蔽され、小型携帯用の電話
機内に組み込まれた無線周波受信部に混入するノイズが
減少し、受信感度を向上させることができる。
As described above, in the shield case 10 to which the printed circuit board shielding method according to the embodiment of the present invention is applied, the shield effect can be further increased as compared with the shield case 1 according to the conventional example. . As a result, the interfering radio waves from the logic circuit components 12 arranged in the shield case 10 are shielded, the noise mixed in the radio frequency receiver incorporated in the small portable telephone is reduced, and the reception sensitivity is reduced. Can be improved.

【0025】また、シールドカバー22とプリント回路
基板18とをハンダ付けすることなく取着することがで
きるため、携帯用の電話機等のハウジング44内に組み
付けられる小型化されたプリント回路基板18に対して
簡便にシールドカバー22を取着することができる。
Further, since the shield cover 22 and the printed circuit board 18 can be attached to each other without soldering, the miniaturized printed circuit board 18 can be assembled in the housing 44 of a portable telephone or the like. Thus, the shield cover 22 can be easily attached.

【0026】さらに、ハウジング44の押圧力によって
シールドカバー22をプリント回路基板18に取着して
いるため、該シールドカバー22の反り、捩じれ、浮き
等の発生を防止することができる。
Further, since the shield cover 22 is attached to the printed circuit board 18 by the pressing force of the housing 44, it is possible to prevent the shield cover 22 from warping, twisting or floating.

【0027】次に、本発明の他の実施例に係るプリント
回路基板のシールド方法を適用したシールドケース50
を図5〜図8に示す。なお、図1に示す前記実施例と同
一の構成要素には同一の参照符号を付し、その詳細な説
明を省略する。
Next, a shield case 50 to which the method for shielding a printed circuit board according to another embodiment of the present invention is applied.
Are shown in FIGS. The same components as those of the embodiment shown in FIG. 1 are designated by the same reference numerals, and detailed description thereof will be omitted.

【0028】このシールドケース50は、シールドカバ
ー52の端縁部に、複数の爪片26に代替して導電性ゴ
ム54a、54bを該端縁部に沿って付着している点で
前記実施例と異なる。なお、前記導電性ゴム54a、5
4bによってシールドカバーに弾力性を付与している点
は同様である。
The shield case 50 has a structure in which the conductive rubbers 54a and 54b are attached to the end edge portion of the shield cover 52 instead of the plurality of claw pieces 26 along the end edge portion. Different from The conductive rubbers 54a, 5 are
The point that elasticity is imparted to the shield cover by 4b is the same.

【0029】この導電性ゴム54a、54bの形状を、
図8Aに示されるように、シールドカバー52と略同一
の肉厚からなり、断面略正方形状に形成し、あるいは、
図8Bに示されるように、凹部56内にシールドカバー
52の端縁部を嵌着するように形成してもよい。なお、
その他の作用効果は前記実施例と略同一であるのでその
詳細な説明を省略する。
The shapes of the conductive rubbers 54a and 54b are
As shown in FIG. 8A, the shield cover 52 has a thickness substantially the same as that of the shield cover 52 and has a substantially square cross section, or
As shown in FIG. 8B, the edge portion of the shield cover 52 may be formed to fit inside the recess 56. In addition,
Other functions and effects are substantially the same as those of the above-described embodiment, and thus detailed description thereof will be omitted.

【0030】[0030]

【発明の効果】本発明に係るプリント回路基板のシール
ド方法によれば、以下の効果が得られる。
According to the printed circuit board shield method of the present invention, the following effects can be obtained.

【0031】すなわち、ハウジングの押圧力によってカ
バー部材とプリント回路基板とを安定的且つ強固な接触
状態とするとともに、前記カバー部材とプリント回路基
板との接触面積を増大させることができる。従って、よ
り一層シールド効果を向上させることができる。
That is, the cover member and the printed circuit board can be brought into a stable and strong contact state by the pressing force of the housing, and the contact area between the cover member and the printed circuit board can be increased. Therefore, the shield effect can be further improved.

【0032】また、ハウジングの押圧力によってカバー
部材をプリント回路基板に取着していることから、従来
技術のようにハンダ付けの作業を要することなく簡便に
シールドすることが可能となる。
Further, since the cover member is attached to the printed circuit board by the pressing force of the housing, it is possible to shield easily without the need for soldering work as in the prior art.

【0033】さらに、携帯用の電話機等のように、プリ
ント回路基板の小型化が要求される場合であっても、カ
バー部材をプリント回路基板に簡便に取着してシールド
することができる。
Further, even when the printed circuit board is required to be downsized, such as a portable telephone, the cover member can be easily attached to the printed circuit board for shielding.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施例に係るプリント回路基板のシー
ルド方法を適用したシールドケースの分解斜視図であ
る。
FIG. 1 is an exploded perspective view of a shield case to which a method of shielding a printed circuit board according to an embodiment of the present invention is applied.

【図2】図2Aは、図1に示すプリント回路基板の平面
図、図2Bは、図1に示すプリント回路基板の底面図で
ある。
2A is a plan view of the printed circuit board shown in FIG. 1, and FIG. 2B is a bottom view of the printed circuit board shown in FIG.

【図3】図1に示すシールドケースをハウジング内に組
み込んだ状態を示す一側面図である。
FIG. 3 is a side view showing a state in which the shield case shown in FIG. 1 is incorporated in a housing.

【図4】図1に示すシールドカバーの部分拡大斜視図で
ある。
FIG. 4 is a partially enlarged perspective view of the shield cover shown in FIG.

【図5】本発明の他の実施例に係るプリント回路基板の
シールド方法を適用したシールドケースの分解斜視図で
ある。
FIG. 5 is an exploded perspective view of a shield case to which a method of shielding a printed circuit board according to another embodiment of the present invention is applied.

【図6】図5に示すシールドケースをハウジング内に組
み込んだ状態を示す一側面図である。
FIG. 6 is a side view showing a state in which the shield case shown in FIG. 5 is incorporated in a housing.

【図7】図5に示すシールドカバーの部分拡大斜視図で
ある。
7 is a partially enlarged perspective view of the shield cover shown in FIG.

【図8】図8Aおよび図8Bは、夫々図7に示すシール
ドカバーの端縁部に設けられた導電性ゴムを示す断面図
である。
8A and 8B are cross-sectional views showing a conductive rubber provided on an edge portion of the shield cover shown in FIG. 7, respectively.

【図9】従来技術に係るシールドケースの分解斜視図で
ある。
FIG. 9 is an exploded perspective view of a shield case according to a conventional technique.

【図10】図9に示すシールドケースの側面図である。FIG. 10 is a side view of the shield case shown in FIG.

【符号の説明】[Explanation of symbols]

10、50…シールドケース 12…ロジック系
回路部品 16…アース層 18…プリント回
路基板 20…配線パターン 22、52…シー
ルドカバー 26…爪片 32a〜32g…
ガイド片 40…孔部 42…凹部 44…ハウジング 54a、54b…
導電性ゴム
10, 50 ... Shield case 12 ... Logic circuit component 16 ... Ground layer 18 ... Printed circuit board 20 ... Wiring pattern 22, 52 ... Shield cover 26 ... Claw pieces 32a to 32g ...
Guide piece 40 ... Hole portion 42 ... Recessed portion 44 ... Housing 54a, 54b ...
Conductive rubber

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】移動用の小型無線通信機のハウジング内に
組み付けられ、一方の面に形成された配線パターン上に
回路部品が配設され、他方の面にアース層が形成された
プリント回路基板のシールド方法であって、 前記ハウジングの押圧力によって、弾発力が付与された
カバー部材と前記プリント回路基板とが相互に押圧し合
ってハウジング内に保持され、前記回路部品をカバー部
材で閉塞することを特徴とするプリント回路基板のシー
ルド方法。
1. A printed circuit board assembled in a housing of a mobile radio communication device, in which circuit components are arranged on a wiring pattern formed on one surface and an earth layer is formed on the other surface. The cover member and the printed circuit board to which elastic force is applied are pressed against each other by the pressing force of the housing and held in the housing, and the circuit component is closed by the cover member. A method for shielding a printed circuit board, comprising:
【請求項2】請求項1記載のシールド方法において、カ
バー部材の端縁部に設けられ、且つ複数個に分割され内
側に向かって折り曲げられた爪片によって前記カバー部
材に弾発力が付与されることを特徴とするプリント回路
基板のシールド方法。
2. The shield method according to claim 1, wherein an elastic force is applied to the cover member by a claw piece provided at an edge portion of the cover member and divided into a plurality of pieces and bent inward. A method for shielding a printed circuit board, comprising:
【請求項3】請求項1記載のシールド方法において、カ
バー部材の端縁部に沿って付着された導電性ゴムによっ
て前記カバー部材に弾発力が付与されることを特徴とす
るプリント回路基板のシールド方法。
3. The shield method according to claim 1, wherein an elastic force is applied to the cover member by the conductive rubber attached along the edge of the cover member. Shield method.
【請求項4】請求項1記載のシールド方法において、移
動用の小型無線通信機は携帯用の電話機からなることを
特徴とするプリント回路基板のシールド方法。
4. The method of shielding a printed circuit board according to claim 1, wherein the mobile radio communication device comprises a portable telephone.
JP20383794A 1994-08-29 1994-08-29 Shielding of printed circuit board Pending JPH0870195A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20383794A JPH0870195A (en) 1994-08-29 1994-08-29 Shielding of printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20383794A JPH0870195A (en) 1994-08-29 1994-08-29 Shielding of printed circuit board

Publications (1)

Publication Number Publication Date
JPH0870195A true JPH0870195A (en) 1996-03-12

Family

ID=16480527

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20383794A Pending JPH0870195A (en) 1994-08-29 1994-08-29 Shielding of printed circuit board

Country Status (1)

Country Link
JP (1) JPH0870195A (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0936581A (en) * 1995-07-25 1997-02-07 Toshiba Corp Shielding case and electronic equipment
WO1997040655A1 (en) * 1996-04-23 1997-10-30 Ericsson Inc. Electromagnetic shield for a radiotelephone
WO1997041718A1 (en) * 1996-05-02 1997-11-06 Ericsson, Inc. Slotted shield can
EP0833466A2 (en) * 1996-09-26 1998-04-01 Matsushita Electric Industrial Co., Ltd. Isolation apparatus for electronic equipment
US6178318B1 (en) 1997-04-16 2001-01-23 Telefonaktiebolaget L M Ericsson Shielding housing and a method of producing a shielding housing
KR100480869B1 (en) * 1996-04-23 2005-09-07 에릭슨 인코포레이티드 Electronic shield for wireless telephone
KR100729708B1 (en) * 2005-09-26 2007-06-19 주식회사 케이와이에스 A method for manufacturing a shield can of a cellular phone
KR100729709B1 (en) * 2005-09-26 2007-06-21 주식회사 케이와이에스 A shield can of a cellular phone
WO2007086177A1 (en) * 2006-01-30 2007-08-02 Murata Manufacturing Co., Ltd. Irreversible circuit element and communication device
KR100779924B1 (en) * 2006-02-21 2007-11-29 후지쯔 가부시끼가이샤 Shield structure for information technology equipments
WO2008093559A1 (en) * 2007-01-29 2008-08-07 Nec Corporation Shield structure of electronic apparatus, shield member and electronic apparatus equipped with the shield structure
US7541986B2 (en) 2003-07-23 2009-06-02 Lg Electronics Inc. Internal antenna and mobile terminal having the internal antenna

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0936581A (en) * 1995-07-25 1997-02-07 Toshiba Corp Shielding case and electronic equipment
AU724581B2 (en) * 1996-04-23 2000-09-28 Ericsson Inc. Electromagnetic shield for a radiotelephone
WO1997040655A1 (en) * 1996-04-23 1997-10-30 Ericsson Inc. Electromagnetic shield for a radiotelephone
KR100480869B1 (en) * 1996-04-23 2005-09-07 에릭슨 인코포레이티드 Electronic shield for wireless telephone
WO1997041718A1 (en) * 1996-05-02 1997-11-06 Ericsson, Inc. Slotted shield can
US5724234A (en) * 1996-05-02 1998-03-03 Ericsson Inc. Slotted shield can
US6501019B2 (en) 1996-09-26 2002-12-31 Matsushita Electric Industrial Co., Ltd. Isolation apparatus for electronic equipment
EP0833466A3 (en) * 1996-09-26 1998-05-20 Matsushita Electric Industrial Co., Ltd. Isolation apparatus for electronic equipment
EP0833466A2 (en) * 1996-09-26 1998-04-01 Matsushita Electric Industrial Co., Ltd. Isolation apparatus for electronic equipment
US6178318B1 (en) 1997-04-16 2001-01-23 Telefonaktiebolaget L M Ericsson Shielding housing and a method of producing a shielding housing
US7541986B2 (en) 2003-07-23 2009-06-02 Lg Electronics Inc. Internal antenna and mobile terminal having the internal antenna
KR100729708B1 (en) * 2005-09-26 2007-06-19 주식회사 케이와이에스 A method for manufacturing a shield can of a cellular phone
KR100729709B1 (en) * 2005-09-26 2007-06-21 주식회사 케이와이에스 A shield can of a cellular phone
WO2007086177A1 (en) * 2006-01-30 2007-08-02 Murata Manufacturing Co., Ltd. Irreversible circuit element and communication device
US7319369B2 (en) 2006-01-30 2008-01-15 Murata Manufacturing Co., Ltd. Non-reciprocal circuit element and communication device
KR100779924B1 (en) * 2006-02-21 2007-11-29 후지쯔 가부시끼가이샤 Shield structure for information technology equipments
WO2008093559A1 (en) * 2007-01-29 2008-08-07 Nec Corporation Shield structure of electronic apparatus, shield member and electronic apparatus equipped with the shield structure
US7983058B2 (en) 2007-01-29 2011-07-19 Nec Corporation Shielding structure and member for electronic device and electronic device including the same
JP5233677B2 (en) * 2007-01-29 2013-07-10 日本電気株式会社 Electronic device shield structure, shield member, and electronic device including the same

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