JP5206097B2 - Electronic equipment and grounding mechanism - Google Patents

Description

  The present invention relates to an electronic device and a grounding mechanism, and more particularly to an electronic device and a grounding mechanism that suitably ground a circuit board and other components.

  Various electronic component groups mounted on a circuit board are built in electronic devices such as mobile phones. This electronic component group is covered with a shield mechanism, and the shield mechanism prevents the emission of electromagnetic interference waves and the reception of electromagnetic interference waves from the outside (see, for example, Patent Document 1). The circuit board and the shield mechanism maintain a ground potential by contacting a frame body fixed on the circuit board with solder or the like via a lid body that is in electrical contact with the frame body.

  In some cases, another circuit board or metal component (hereinafter referred to as an external component) is disposed outside the shield mechanism.

  This external component also needs to be grounded to the circuit board shielded by the shield mechanism to maintain the ground potential. This external component is connected via a connection terminal provided on the circuit board. However, the path for grounding the external component to the circuit board is short and preferably directly grounded.

Conventionally, in order to reinforce the grounding between the external component and the circuit board, a conductive member for suitably making a contact made of a leaf spring or the like has been provided on the contact surface of the external component with the lid of the shield mechanism. It was attached via a connecting member. The external component is indirectly grounded to the circuit board by the pressure contact with the lid of the shield mechanism that is grounded to the circuit board and maintains the ground potential by the conductive member.
JP 2003-243871 A

  In order to ground the external component to the circuit board and maintain the ground potential, the contact point between the external component and the conductive member attached to the external component, and the contact where the conductive member contacts the lid of the shield mechanism The electrical connection is achieved through the points, the contact point where the lid of the shield mechanism and the frame come into contact, and the connection point between the frame and the circuit board.

  As described above, the external component indirectly grounded to the circuit board has a problem that the resistance value varies depending on the contact state of each part, and the presence or absence of contact becomes unstable. In particular, the contact point between the conductive member, which has been made conductive by simple contact without using a connection member such as solder, and the lid of the shield mechanism includes an element that makes the grounding with respect to the circuit board unstable. .

  The present invention has been made in view of such circumstances, and an electronic device and a grounding mechanism for maintaining a stable ground potential by suitably grounding an external component and a circuit board provided outside the shield mechanism. The purpose is to provide.

  In order to solve the above-described problems, an electronic device according to the present invention includes a frame that surrounds an electronic component disposed on a circuit board, is fixed to the circuit board, and is erected. A frame having a grounding surface provided in a direction facing the opening formed by the frame on a surface facing the surface fixed to the circuit board in the frame, and a part of the frame A flat plate portion that covers at least the opening, and a lid that is provided at a position facing the grounding surface in the flat plate portion and has a passage hole having a smaller occupied area than the grounding surface, and an external component The conductive elastic body is provided with a conductive elastic body on a surface facing the shield mechanism, and a grounding surface provided on the frame body is blocked by a passage hole provided in the lid body. Passes through the through hole and contacts the ground plane. Wherein the placed.

  Further, in order to solve the above-described problem, the grounding mechanism according to the present invention surrounds an electronic component disposed on the circuit board and the electronic component disposed on the circuit board, and is fixed to the circuit board. A frame provided with a grounding surface provided extending in the direction of the opening formed by the frame portion on a surface facing the surface fixed to the circuit board in the frame portion standing upright, and the frame portion; A flat plate portion that is in contact with a part of the frame body and covers at least the opening, and a through hole that is provided at a position facing the ground contact surface in the flat plate portion and has an occupied area smaller than the ground contact surface. A shield mechanism configured with a lid, and an external component disposed outside the shield mechanism so as to face the shield mechanism, and provided with a conductive elastic body on a surface facing the shield mechanism, Grounding provided on the frame There in a state of being blocked by the passage hole provided in the lid, the conductive elastic body passes through the passing holes, characterized in that arranged in contact with the ground surface.

  The electronic device and the grounding mechanism according to the present invention can suitably ground an external component arranged outside the shield mechanism to the circuit board shielded by the shield mechanism.

  Embodiments of an electronic apparatus according to the present invention will be described with reference to the accompanying drawings.

  FIG. 1 is an exploded perspective view showing a grounding mechanism for a circuit board housed in the housing of the electronic device according to the present embodiment.

  The electronic device in this embodiment corresponds to, for example, a mobile phone, a PDA (Personal Digital Assistant), a personal computer, a portable game machine, a portable music player, a portable video player, and the circuit board shown in FIG. And the like are housed inside a housing (not shown) of these electronic devices.

  A plurality of electronic components 11 are disposed on the circuit board 10. These electronic components 11 constitute a high-frequency circuit, and are covered with a shield mechanism 20 in order to prevent emission of electromagnetic interference waves and reception of electromagnetic interference waves from the outside.

  The shield mechanism 20 includes a frame body 21 and a lid body 22.

  The frame body 21 of the shield mechanism 20 includes a frame portion 24 provided with a grounding surface 23. The frame part 24 surrounds and stands up the electronic component 11 installed on the circuit board 10. The frame portion 24 is a continuous frame-shaped thin plate made of a metal member, and is fixed to the circuit board 10 via an adhesive member such as solder.

  The grounding surface 23 provided on the frame portion 24 is provided on the upper side surface 24 a facing the surface fixed to the circuit board 10 in the frame portion 24. The ground surface 23 is provided by extending a predetermined portion of the upper side surface 24a of the frame portion 24 in a triangular shape toward the opening.

  In addition, a predetermined number of recesses 28 are provided on the outer surface 24 b of the frame portion 24 so as to be capable of fitting with the projections 29 provided on the lid 22.

  The lid 22 of the shield mechanism 20 includes a flat plate portion 26 provided with a passage hole 25. The flat plate portion 26 is formed of a flat metal member having a dimension that covers the opening formed of the frame body 21. A side plate portion 27 extending vertically downward from the flat plate portion 26 is provided on the outer edge of the flat plate portion 26. The side plate portion 27 is provided with a predetermined number of convex portions 29 and is configured to be able to fit into the concave portions 28 provided in the frame body 21.

  The through hole 25 provided at a position facing the ground plane 23 in the flat plate portion 26 is configured in a triangular shape, for example, having a smaller area than the ground plane 23 provided in the frame body 21.

  Outside the shield mechanism 20, an external component 30 connected to the illustrated back surface of the circuit board 10 through a connection terminal (not shown) and conducted is disposed. The external component 30 is composed of a circuit board or a metal component, and is disposed to face the shield mechanism 20.

  A leaf spring 31 as an example of a conductive elastic body is provided on the surface of the external component 30 facing the shield mechanism 20. One end of the leaf spring 31 is fixed to the external component 30 via an adhesive member such as solder, and the other end is in contact with the ground plane 23 provided on the frame body 21 of the shield mechanism 20.

  Further, in the vicinity of the leaf spring 31 in the external component 30, two pressure contact springs 32 as pressure contact members are provided. The pressure contact spring 32 is configured by a plate spring, one end is fixed to the external component 30 via an adhesive member such as solder, and the other end is a flat plate portion 26 near the passage hole 25 provided in the lid body 22 of the shield mechanism 20. Is pressed in the direction of the frame body 21.

  FIG. 2 is a partial cross-sectional view of the grounding mechanism for the circuit board housed in the housing of the electronic device according to the present embodiment, and is a vertical cross-sectional view taken along line AA of the grounding mechanism shown in FIG.

  Here, conventionally, when an external component is grounded to the circuit board to maintain the ground potential, it is indirectly contacted with the circuit board by directly contacting the lid surface of the shield mechanism via the conductive elastic body. It was grounded. However, the external component indirectly grounded to the circuit board has a problem that the resistance value varies depending on the contact state of each part, and the presence or absence of contact becomes unstable. In particular, the contact point between the conductive member, which has been made conductive by simple contact without using a connection member such as solder, and the lid of the shield mechanism includes an element that makes the grounding with respect to the circuit board unstable. .

  On the other hand, the grounding mechanism provided in the electronic device according to the present embodiment can stably ground the external potential 30 and the circuit board 10 provided outside the shield mechanism 20 to stably maintain the ground potential. .

  The shield mechanism 20 is configured such that the convex portion 29 provided on the side plate portion 27 of the lid body 22 and the concave portion 28 provided on the frame portion 24 of the frame body are fitted to each other, so that the gap between the lid body 22 and the frame body 21 is fitted. Electrical contact is ensured. As a result, the lid body 22 is also grounded with respect to the circuit board 10 to which the frame body 21 is fixed, and a ground potential is secured.

  The front end portion of the leaf spring 31 fixed to the external component 30 passes through the passage hole 25 provided in the lid body 22 and contacts the grounding surface 23 provided in the frame body 21 that closes the passage hole 25 from below in the figure. Arranged. The external component 30 is in pressure contact with the ground plane 23 via the leaf spring 31, so that it is indirectly grounded to the circuit board 10 to which the frame body 21 is fixed, and the ground potential can be maintained.

  Further, the distal end portion of the pressure contact spring 32 fixed to the external component 30 is pressed against the lid body 22 of the shield mechanism 20 by utilizing the weight of the external component 30. Thereby, the cover body 22 and the frame body 21 of the shield mechanism 20 can be more closely attached, and the emission of the original electromagnetic interference wave of the shield mechanism 20 and the reception of the electromagnetic interference wave from the outside are effectively prevented.

  According to the electronic device and the grounding mechanism provided in the electronic device, the leaf spring 31 fixed to the external component 30 and the frame body 21 of the shield mechanism 20 fixed to the circuit board 10 are brought into contact with each other. Contact with the lid 22 of the shield mechanism 20 can be omitted when the substrate 10 is grounded. That is, the resistance value of the external component 30 varies depending on the contact state between the external component 30 and the cover 22 of the shield mechanism 20 and the contact point between the cover 22 and the frame 21 of the shield mechanism 20. In addition, since a contact location including an element that makes the presence or absence of contact unstable can be omitted, the ground can be effectively grounded and the ground potential can be stably maintained.

  Further, the reduction of the shielding effect due to the provision of the passage hole 25 in the lid body 22 of the shield mechanism 20 can be ensured by providing the pressure contact spring 32.

  Furthermore, the electronic device provided with such a grounding mechanism can maintain high quality because the electronic component housed inside the housing operates stably.

  In the present embodiment, the pressing spring 32 is provided as a pressing member on the external component 30, but this may be omitted.

  FIG. 3 is a partial cross-sectional view showing a modification of the grounding mechanism for the circuit board housed inside the housing of the electronic device according to the present embodiment.

  In the grounding mechanism shown in FIG. 3, the pressure contact spring 32 provided on the external component 30 is omitted, and only the pin-coupled plate spring 33 is provided. Further, the upper surface 24a of the frame portion 24 may be applied as the grounding surface 23 by applying a pin-coupled leaf spring 33 having a thin and sharp tip to the conductive elastic body. The pin-coupled plate spring 33 is a conductive elastic body in which an elastic body such as a plate spring is accommodated in an internal pin sliding portion and a pin-shaped conductive contact member is provided at the tip.

  Furthermore, although the ground surface 23 provided in the frame body 21 and the passage hole 25 provided in the lid body 22 have been described by applying an example configured on a triangle, the present invention is not limited to this and may have other shapes. Good. Moreover, the passage hole 25 should just have an occupation area smaller than the ground surface 23, and the shape of the passage hole 25 and the ground surface 23 may differ.

  Furthermore, the shape, material, position, and number of the shield mechanism 20 and the leaf spring 31 (conductive elastic body) provided in the electronic device and the grounding mechanism in the present embodiment are examples, and have other shapes and materials. You may comprise in multiple places with a member. For example, a conductive resin or a resin coated with a conductive material may be used, and a grounding mechanism may be provided at two or more locations.

The disassembled perspective view which shows the grounding mechanism with respect to the circuit board accommodated in the inside of the housing | casing of the electronic device in this embodiment. It is a fragmentary sectional view of the grounding mechanism with respect to the circuit board accommodated inside the housing | casing of the electronic device in this embodiment, and is the longitudinal cross-sectional view between AA of the grounding mechanism shown in FIG. The fragmentary sectional view which shows the modification of the grounding mechanism with respect to the circuit board accommodated in the inside of the housing | casing of the electronic device in this embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Circuit board 11 Electronic component 20 Shield mechanism 21 Frame body 22 Cover body 23 Ground surface 24 Frame part 24a Upper side surface 24b Outer side surface 25 Passing hole 26 Flat plate part 27 Side plate part 28 Recessed part 29 Convex part 30 External component 31 Leaf spring 32 For pressure contact Spring 33 Pin-coupled leaf spring

Claims (5)

A circuit board on which an electronic component covered with a shield mechanism is disposed, an external component disposed opposite to the shield mechanism outside the shield mechanism, and a housing for incorporating the circuit board and the external component. In electronic equipment,
The shield mechanism surrounds an electronic component disposed on the circuit board, and is fixed to the circuit board, and a frame portion that is erected, and a surface that faces the surface fixed to the circuit board in the frame portion. A frame having a grounding surface provided extending in the direction of the opening formed by the frame, a flat plate that contacts at least a portion of the frame and covers the opening, and the flat plate It is provided at a position facing the grounding surface, and is configured with a lid body having a passage hole having an occupied area smaller than the grounding surface,
The external component is provided with a conductive elastic body on a surface facing the shield mechanism,
An electronic apparatus , wherein the conductive elastic body is disposed in contact with the grounding surface through the passage hole in a state where the passage hole is blocked by the grounding surface . The electronic device according to claim 1, wherein the external component further includes a pressure contact member that presses the lid in the direction of the frame. The electronic apparatus according to claim 1, wherein the conductive elastic body is a leaf spring. The electronic device according to claim 1, wherein the external component includes a circuit board and a metal component. A circuit board on which electronic components are arranged;
A frame portion surrounding the electronic component disposed on the circuit board and fixed to the circuit board, and a surface of the frame portion facing the surface fixed to the circuit board. A frame having a grounding surface provided extending in the direction of the configured opening, a flat plate portion that contacts at least a part of the frame and covers at least the opening, and the ground plane in the flat plate portion is opposed to the grounding surface A shield mechanism configured with a lid provided with a passage hole having an occupied area smaller than the ground plane,
Outside the shield mechanism, provided to face the shield mechanism, provided with an external component provided with a conductive elastic body on the surface facing the shield mechanism,
A grounding mechanism , wherein the conductive elastic body is disposed in contact with the grounding surface through the passage hole in a state where the passage hole is blocked by the grounding surface .

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