CN215872564U - Shielding assembly, circuit module and electronic device - Google Patents

Abstract

The application discloses a shielding component, a circuit module and an electronic device. The shielding assembly comprises a shielding cover, a cover plate and a pressing sheet. The shield has an aperture. The cover plate is arranged on the shielding cover and covers the opening. The pressing sheet is arranged on one surface of the cover plate, which deviates from the shielding case. In the shielding component, the circuit module and the electronic device of the embodiment of the application, the pressing sheet is arranged on the cover plate and deviates from the shielding cover one side, so that the height of the shielding component can be increased by the pressing sheet, the cover plate can be pressed by the pressing sheet, the cover plate is prevented from generating undesirable phenomena such as warping, and the shielding performance of the shielding cover is ensured.

Description

Shielding assembly, circuit module and electronic device

Technical Field

The present application relates to the field of electronic devices, and more particularly, to a shielding assembly, a circuit module, and an electronic apparatus.

Background

Big devices on a main board in electronic equipment such as a mobile terminal, for example, a CPU, are often required to be glued for reinforcement due to reliability requirements, so as to reduce risks such as fracture and falling of the devices in the falling process. In the related art, a hole needs to be formed in the shield case to allow space for the dispensing process of the device. After the dispensing is finished, the opening needs to be sealed by a cover plate with an electromagnetic shielding function, so that the shielding performance is ensured. However, the problem of perk appears easily to the cover plate for the trompil is not sealed, and then makes the performance of shield cover receive the influence, appears that shielding effect is poor, signal interference problem.

SUMMERY OF THE UTILITY MODEL

The application provides a shielding component, a circuit module and an electronic device.

The shielding assembly of the embodiment of the application comprises a shielding cover, a cover plate and a pressing sheet. The shield has an aperture. The cover plate is arranged on the shielding cover and covers the opening. The pressing sheet is arranged on one surface of the cover plate, which deviates from the shielding case.

The circuit module of the embodiment of the application comprises the shielding assembly and the chip of the embodiment, wherein the chip is accommodated in the shielding cover.

The electronic device of the embodiment of the application comprises the circuit module of the above embodiment and a shell, wherein the circuit module is arranged in the shell.

In the shielding component, the circuit module and the electronic device of the embodiment of the application, the pressing sheet is arranged on the cover plate and deviates from the shielding cover one side, so that the height of the shielding component can be increased by the pressing sheet, the cover plate can be pressed by the pressing sheet, the cover plate is prevented from generating undesirable phenomena such as warping, and the shielding performance of the shielding cover is ensured.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a cross-sectional schematic diagram of a circuit module according to an embodiment of the present application;

FIG. 2 is a schematic plan view of an electronic device according to an embodiment of the present application;

FIG. 3 is a schematic, partially cross-sectional view of an electronic device according to an embodiment of the present application;

FIG. 4 is a perspective view of a shield assembly according to an embodiment of the present application;

FIG. 5 is an exploded schematic view of a shield assembly according to an embodiment of the present application;

FIG. 6 is a schematic perspective view of a shield according to an embodiment of the present application;

fig. 7 is a schematic plan view of a shield case according to an embodiment of the present application.

Description of the main element symbols:

the circuit module 200, the shielding assembly 100, the shielding cover 10, the opening 11, the third edge 111, the fourth edge 112, the top wall 12, the first edge 121, the second edge 122, the pressure bearing area 123, the side wall 13, the accommodating space 14, the cover plate 20, the pressing sheet 30, the chip 210, the circuit board 220, the electronic device 500, and the housing 510.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative and are only for the purpose of explaining the present application and are not to be construed as limiting the present application.

The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.

Referring to fig. 1, a circuit module 200 according to an embodiment of the present disclosure includes a shielding assembly 100 and a chip 210, where the shielding assembly 100 includes a shielding can 10, and the chip 210 is accommodated in the shielding can 10. Alternatively, the shielding case 10 covers the chip 210, so that the electromagnetic radiation to which the chip 210 is exposed can be reduced.

Specifically, the shield case 10 may be made of a metal material, for example, the material of the shield case 10 is stainless steel or copper, so that the shield case 10 has a function of shielding electromagnetic waves. The shield case 10 can prevent electromagnetic waves inside the shield case 10 from radiating to the outside of the shield case 10 and prevent electromagnetic waves outside the shield case 10 from radiating to the inside of the shield case 10. In one example, the shield can 10 may be formed using a single piece of sheet metal and then by a process of stamping and drawing.

The chip 210 is, for example, a central processing unit, a radio frequency chip, and the like, and the chip 210 is accommodated in the shielding case 10, so that the chip 210 meets the requirement of electromagnetic radiation, and the chip 210 can normally operate.

Referring to fig. 2 and fig. 3, the circuit module 200 according to the embodiment of the present disclosure may be applied to an electronic device 500, or the electronic device 500 includes the circuit module 200. The electronic device 500 is a mobile terminal such as a mobile phone, a tablet computer, and a smart wearable device. Specifically, the electronic device 500 may further include a housing 510, and the circuit module 200 is disposed in the housing 510. In this manner, the housing 510 may protect the circuit module 200, thereby reducing the impact and damage to the circuit module 200. The housing 510 may be made of a metallic material or a non-metallic material. For example, the material of the housing 510 is one of stainless steel, ceramic, and plastic.

As shown in fig. 1, in some embodiments, the circuit module 200 further includes a circuit board 220, and the chip 210 and the shield can 10 are fixed on the circuit board 220. In this manner, the circuit board 220 may provide a carrier for the mounting of the chip 210 and the shield can 10 so that the circuit module 200 may function properly. Specifically, the chip 210 and the shield case 10 may be fixed on the circuit board 220 by soldering. The chip 210 may be electrically connected to the circuit board 220. The Circuit Board 220 may be a Printed Circuit Board (PCB) 220.

Referring to fig. 4 and 5, in the present embodiment, the shielding assembly 100 includes a shielding can 10, a cover plate 20 and a pressing sheet 30. The shield case 10 has an opening 11. The cover plate 20 is disposed on the shield case 10 and covers the opening hole 11. The pressing piece 30 is arranged on the side of the cover plate 20 facing away from the shielding case 10.

So, the preforming 30 sets up the one side that deviates from shield cover 10 at apron 20 for preforming 30 can increase the height of shielding component 100, and preforming 30 can compress tightly apron 20, prevents that apron 20 from producing unfavorable phenomena such as warpage, guarantees shield cover 10's shielding performance.

Specifically, the opening 11 of the shield case 10 may have a regular shape such as a square shape or a circular shape. Of course, the openings 11 may also have an irregular shape. The cover plate 20 may be made of an electromagnetic shielding material, for example, the cover plate 20 is made of copper sheet, stainless steel sheet, copper carbon sheet, copper foil graphite sheet, or the like. The cover plate 20 may be fixed to the shield case 10 by welding or bonding.

Note that the cover 20 covers the opening 11, which means that the opening 11 is completely shielded by the cover 20, and the opening 11 is not visible outside the shield case 10. The sheeting 30 may be made of PET, foam, etc., and the material of the sheeting 30 is not limited in this application. The pressing plate 30 may be fixed to the cover plate 20 by means of bonding, welding, or the like.

In one example, the circuit module 200 is mounted by mounting the chip 210 on the circuit board 220, then covering the chip 210 with the shielding can 10 and fixing the shielding can 10 to the circuit board 220, dispensing around the chip 210 through the opening 11 to fix the chip 210 on the circuit board 220, and finally covering the opening 11 with the cover plate 20 having the pressing sheet 30 and fixing the cover plate 20 and the shielding can 10 together.

As shown in fig. 3, in some embodiments, the housing 510 is pressed against the cover plate 20 by the sheeting 30. Or, a certain interference exists between the pressing sheet 30 and the housing 510, and the interference is, for example, 0.02mm, so that the cover plate 20 does not warp under the pressing action of the housing 510.

Referring to fig. 6 and 7, in some embodiments, the shielding case 10 includes a top wall 12 and a side wall 13 connected to the top wall 12, the top wall 12 and the side wall 13 enclose a receiving space 14, the top wall 12 has an opening 11, and a cover plate 20 covers the opening 11. In this way, the shielding case 10 may form the accommodating space 14, and the chip 210 may be accommodated in the accommodating space 14. In particular, the top wall 12 may be rectangular, such that the shield can 10 is substantially rectangular parallelepiped. Of course, the top wall 12 may also be circular, such that the shielding cage 10 is substantially cylindrical.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

Referring to fig. 5 and 7, in some embodiments, the top wall 12 includes a first edge 121 and a second edge 122, and the first edge 121 is connected to the second edge 122. Both the first edge 121 and the second edge 122 are connected to the side wall 13. The opening 11 includes a third edge 111 and a fourth edge 112 connecting the third edge 111, the third edge 111 being opposite to the first edge 121. The fourth edge 112 is opposite the second edge 122. The distance between the first edge 121 and the third edge 111 is smaller than the distance between the second edge 122 and the fourth edge 112. The first edge 121 and the third edge 111 form a pressed area 123 therebetween, and the pressing sheet 30 is pressed on the cover plate 20 at a position corresponding to the pressed area 123.

It can be understood that the connection area of the pressure bearing area 123 of the cover plate 20 between the first edge 121 and the third edge 111 is small, and the warping phenomenon is easily generated. Therefore, the pressing sheet 30 of the embodiment of the present application is pressed on the cover plate 20 at the position corresponding to the pressure-bearing area 123, so that the pressing sheet 30 can press the cover plate 20, and the cover plate 20 is prevented from warping.

In the embodiments of the present application, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

As shown in fig. 7, in some embodiments, the distance D between the first edge 121 and the third edge 111 ranges from 1.8mm or greater to 2.5mm or less. For example, the distance D may be 1.8mm, 1.9mm, 2.0mm, 2.2mm, 2.5mm, etc. Thus, under the condition that the size of the opening 11 meets the requirement, the size of the shielding case 10 can be ensured to be smaller, and the volume of the circuit module 200 is reduced, so that the structure of the electronic device 500 is more compact, and the electronic device 500 is favorably miniaturized.

As shown in fig. 1, in some embodiments, an orthographic projection of the sheeting 30 on the top wall 12 covers the third edge 111. Therefore, the pressing sheet 30 can completely cover the pressure bearing area 123, and the cover plate 20 on the pressure bearing area 123 is prevented from being warped.

In some embodiments, the first edge 121 and the third edge 111 are disposed equidistant. In this manner, the shape of the opening 11 substantially matches the shape of the top wall 12, facilitating the shape of the opening 11. In particular, the first edge 121 and the third edge 111 may both be linear. The openings 11 may be formed by means of laser cutting.

In summary, in one embodiment of the present application, the shield assembly 100 includes a shield case 10, a cover plate 20, and a pressing piece 30. The shield case 10 has an opening 11. The cover plate 20 is disposed on the shield case 10 and covers the opening hole 11. The pressing piece 30 is arranged on the side of the cover plate 20 facing away from the shielding case 10.

So, the preforming 30 sets up the one side that deviates from shield cover 10 at apron 20 for preforming 30 can increase the height of shielding component 100, makes casing 510 can compress tightly apron 20 through preforming 30, prevents that apron 20 from producing unfavorable phenomena such as warpage, guarantees shield cover 10's shielding performance.

In the description herein, references to the description of the terms "one embodiment," "certain embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: numerous changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims (10)

1. A shield assembly for an electronic device, the shield assembly comprising:

a shield case having an opening;

a cover plate disposed on the shield case and covering the opening; and

the pressing sheet is arranged on one surface, deviating from the shielding case, of the cover plate.

2. The shielding assembly of claim 1, wherein the shielding can includes a top wall and a side wall connected to the top wall, the top wall and the side wall define a receiving space, the top wall has the opening, and the cover plate covers the opening.

3. The shield assembly of claim 2, wherein the top wall includes a first edge and a second edge, the first edge being connected to the second edge, the first edge and the second edge both being connected to the side wall, the aperture including a third edge and a fourth edge connected to the third edge, the third edge being opposite the first edge, the fourth edge being opposite the second edge, a distance between the first edge and the third edge being less than a distance between the second edge and the fourth edge, a pressure bearing area being formed between the first edge and the third edge, the tab press fit being at a location on the cover plate corresponding to the pressure bearing area.

4. The shielding assembly of claim 3, wherein a distance between the first edge and the third edge ranges from 1.8mm or greater to 2.5mm or less.

5. The shield assembly of claim 3 wherein an orthographic projection of said sheeting on said top wall overlies said third edge.

6. The shielding assembly of claim 3, wherein the first edge and the third edge are disposed equidistantly.

7. A circuit module, comprising:

the shielding assembly of any one of claims 1-6; and

a chip housed within the shield can.

8. The circuit module of claim 7, further comprising a circuit board, wherein the chip and the shield are both secured to the circuit board.

9. An electronic device, comprising:

the circuit module of claim 7 or 8; and

a housing, the circuit module disposed within the housing.

10. The electronic device of claim 9, wherein the housing presses the cover plate via the pressing piece.

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