TWI452768B - Single fpc board for connecting multiple modules and touch sensitive display module using the same - Google Patents

Single fpc board for connecting multiple modules and touch sensitive display module using the same Download PDF

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TWI452768B
TWI452768B TW100129439A TW100129439A TWI452768B TW I452768 B TWI452768 B TW I452768B TW 100129439 A TW100129439 A TW 100129439A TW 100129439 A TW100129439 A TW 100129439A TW I452768 B TWI452768 B TW I452768B
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Taiwan
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module
connecting portion
film
connection portion
line
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TW100129439A
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Chinese (zh)
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TW201251208A (en
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Jiun Jie Tsai
Ching Chun Lin
Tsen Wei Chang
Yu Tsung Lu
Tzu Jen Lo
Hao Jan Huang
Wing Kai Tang
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Novatek Microelectronics Corp
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Priority to US13/438,636 priority Critical patent/US9084368B2/en
Publication of TW201251208A publication Critical patent/TW201251208A/en
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Publication of TWI452768B publication Critical patent/TWI452768B/en
Priority to US14/511,062 priority patent/US20150022744A1/en

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  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
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Description

連接多模組之單片式軟性電路板及應用其之觸控顯示模組Single-chip flexible circuit board connecting multiple modules and touch display module using same

本發明是有關於一種軟性電路板(Flexible printed circuit board,FPC board),且特別是有關於一種連接多模組之單片式軟性電路板及應用其之觸控顯示模組。The present invention relates to a flexible printed circuit board (FPC board), and more particularly to a single-chip flexible circuit board for connecting multiple modules and a touch display module using the same.

觸控面板現今已廣泛地運用於各類電子產品上,尤其是目前許多顯示面板上配置有觸控面板,讓使用者得以直接以手指或操作筆點選、按壓螢幕畫面。舉例而言,電阻式觸控面板的驅動原理是利用電壓降的方式來感應受壓位置的座標點;而電容式觸控面板是形成均勻的電場在面板上並感應受壓位置的電流以計算其座標點。之後,便可藉由軟性電路板及控制電路根據此座標點進行資料處理,而於顯示面板上產生影像,以提供使用者更為便捷且人性化的操作介面。Touch panels are widely used in various electronic products today. In particular, many display panels are currently equipped with a touch panel, so that the user can directly select and press the screen with a finger or an operation pen. For example, the driving principle of the resistive touch panel is to use a voltage drop to sense the coordinate point of the pressed position; and the capacitive touch panel is to form a uniform electric field on the panel and induce the current in the pressed position to calculate Its coordinate point. After that, the flexible circuit board and the control circuit can perform data processing according to the coordinate point, and generate images on the display panel to provide a more convenient and user-friendly operation interface for the user.

請參照第1及2圖,其分別繪示傳統上一種觸控顯示模組的示意圖及組裝結構圖。觸控顯示模組100係由一顯示面板110、一觸控面板120以及一主機板130組成。顯示面板110具有一第一軟性電路板142以及一連接器144。觸控面板120具有一第二軟性電路板140。一蓋板150覆蓋於觸控面板120之上。觸控面板120係設置於顯示面板110之上,可藉由接合膠將觸控面板120及顯示面板110貼合起來。組裝時,第二軟性電路板140透過連接器144與第一軟性電路板142連接之後,第一軟性電路板142再透過主機板130上的連接器132與主機板130電性連接。Please refer to FIGS. 1 and 2 , which respectively show a schematic diagram and an assembly structure diagram of a conventional touch display module. The touch display module 100 is composed of a display panel 110, a touch panel 120, and a motherboard 130. The display panel 110 has a first flexible circuit board 142 and a connector 144. The touch panel 120 has a second flexible circuit board 140. A cover 150 covers the touch panel 120. The touch panel 120 is disposed on the display panel 110, and the touch panel 120 and the display panel 110 can be attached by bonding glue. After the second flexible circuit board 140 is connected to the first flexible circuit board 142 through the connector 144, the first flexible circuit board 142 is electrically connected to the motherboard 130 through the connector 132 on the motherboard 130.

上述之組裝結構中,必須使用兩條軟性電路板140、142,且透過連接器144相互連接,因此組裝工時增加,且必須預留較大的空間以方便組裝軟性電路板。也由於軟性電路板的數量為二,勢必增加成本及製作過程中產生更多的廢料。In the above assembled structure, two flexible circuit boards 140, 142 must be used and connected to each other through the connector 144, so assembly work is increased, and a large space must be reserved to facilitate assembly of the flexible circuit board. Also because the number of flexible boards is two, it is bound to increase costs and generate more waste in the production process.

本發明係有關於一種連接多模組之單片式軟性電路板及應用其之觸控顯示模組,其可簡化多模組的組裝工時,並能有效地消減組裝軟性電路板所需的空間,以達到薄形化的要求。此外,軟性電路板由單一片薄膜製作,故成本降低並減少製作過程中產生的廢料。The invention relates to a single-chip flexible circuit board connecting multiple modules and a touch display module using the same, which can simplify assembly time of multiple modules and can effectively reduce the need for assembling flexible circuit boards. Space to meet the requirements of thinning. In addition, the flexible circuit board is made of a single film, so the cost is reduced and the waste generated in the manufacturing process is reduced.

根據本發明之一方面,提出一種連接多模組之單片式軟性電路板,包括一薄膜、至少一第一線路以及至少一第二線路。薄膜具有一第一模組連接部、一第二模組連接部以及一第三模組連接部。至少一第一線路配置於第一模組連接部與第二模組連接部之間。至少一第二線路配置於第一模組連接部與第三模組連接部之間。According to an aspect of the invention, a single-chip flexible circuit board connected to a multi-module is provided, comprising a film, at least one first line and at least one second line. The film has a first module connecting portion, a second module connecting portion and a third module connecting portion. The at least one first line is disposed between the first module connection portion and the second module connection portion. The at least one second line is disposed between the first module connection portion and the third module connection portion.

根據本發明之另一方面,提出一種觸控顯示模組,包括一第一模組、一第二模組、一第三模組以及一單片式軟性電路板。第二模組配置於第一模組上。第三模組鄰近於第一模組,第一模組位於第二模組與第三模組之間。單片式軟性電路板連接第一模組、第二模組以及第三模組。According to another aspect of the present invention, a touch display module includes a first module, a second module, a third module, and a single-chip flexible circuit board. The second module is disposed on the first module. The third module is adjacent to the first module, and the first module is located between the second module and the third module. The monolithic flexible circuit board connects the first module, the second module, and the third module.

為了對本發明之上述及其他方面有更佳的瞭解,下文特舉較佳實施例,並配合所附圖式,作詳細說明如下:In order to better understand the above and other aspects of the present invention, the preferred embodiments are described below, and in conjunction with the drawings, the detailed description is as follows:

本實施例之連接多模組之單片式軟性電路板,係利用單一薄膜的設計,來連接三個或更多個模組,譬如是顯示面板、觸控面板與主機板,以傳遞相關的電子訊號。在一實施例中,單片式軟性電路板透過反折連接的設計,使其薄膜上之線路電性連接於顯示面板與觸控面板之間。在另一實施例中,單片式軟性電路板透過分岔連接的設計,使其薄膜上之線路電性連接於顯示面板與觸控面板之間。因此,僅需一條軟性電路板,不需再透過額外的連接器來連接於觸控面板與顯示面板之間,因而能簡化多模組的組裝工時,並能有效地消減組裝軟性電路板所需的空間,以達到薄形化的要求。The single-chip flexible circuit board connected to the multi-module of the embodiment uses a single film design to connect three or more modules, such as a display panel, a touch panel and a motherboard, to transmit related Electronic signal. In one embodiment, the monolithic flexible circuit board is designed to be electrically connected between the display panel and the touch panel through a reverse fold connection. In another embodiment, the monolithic flexible circuit board is electrically connected between the display panel and the touch panel through the design of the split connection. Therefore, only one flexible circuit board is needed, and no additional connector is needed to connect between the touch panel and the display panel, thereby simplifying assembly time of the multi-module and effectively reducing the assembly of the flexible circuit board. The space required to achieve the requirements of thinning.

以下係以觸控顯示模組進行詳細說明,實施例僅用以作為範例說明,並非用以限縮本發明欲保護之範圍。The following is a detailed description of the touch display module, and the embodiments are only used as an example to illustrate the scope of the present invention.

第一實施例First embodiment

請參照第3A~3C及4圖,其中第3A~3C圖分別繪示依照本發明一實施例之觸控顯示模組的組裝結構圖。第4圖繪示依照本發明一實施例之連接多模組之單片式軟性電路板的示意圖。觸控顯示模組200包括一第一模組210、一第二模組220、一第三模組230以及一單片式軟性電路板240。單片式軟性電路板240連接第一模組210、第二模組220以及第三模組230。第一模組210例如為顯示面板。第二模組220例如為觸控面板,配置於第一模組210上。第三模組230例如為主機板,可鄰近於第一模組210。較佳地,第一模組210設置於第二模組220與第三模組230之間。在一實施例中,觸控面板可貼附在蓋板250的下表面(如第3A圖所示),其為外掛方案(Out cell solution)之觸控面板,或是在蓋板250上製作觸控感測的透明導電層222(如第3B圖所示),成為單片整合方案(One glass solution)之觸控面板,或是將觸控感測的透明導電層222整合至顯示面板上或內嵌於彩色濾光片中(如第3C圖所示),成為嵌入方案(On cell/In cell solution)之觸控顯示面板。Please refer to FIGS. 3A-3C and FIG. 4 , wherein FIGS. 3A-3C are respectively assembled diagrams of the touch display module according to an embodiment of the invention. FIG. 4 is a schematic diagram of a single-chip flexible circuit board connecting multiple modules according to an embodiment of the invention. The touch display module 200 includes a first module 210, a second module 220, a third module 230, and a single-chip flexible circuit board 240. The monolithic flexible circuit board 240 is connected to the first module 210, the second module 220, and the third module 230. The first module 210 is, for example, a display panel. The second module 220 is, for example, a touch panel, and is disposed on the first module 210. The third module 230 is, for example, a motherboard, and is adjacent to the first module 210. Preferably, the first module 210 is disposed between the second module 220 and the third module 230. In one embodiment, the touch panel can be attached to the lower surface of the cover 250 (as shown in FIG. 3A ), which is an out cell solution touch panel or fabricated on the cover 250 The touch-sensing transparent conductive layer 222 (as shown in FIG. 3B ) becomes a touch panel of a single glass solution or integrates the touch-sensing transparent conductive layer 222 onto the display panel Or embedded in a color filter (as shown in FIG. 3C), it becomes a touch display panel of an on cell/in cell solution.

請參照第4圖,單片式軟性電路板240具有單一薄膜241。此薄膜241具有一第一模組連接部242、一第二模組連接部244、一第三模組連接部246、一反折部248以及一開槽S。第一模組連接部242例如是顯示面板連接部,其具有多個第一接合墊B1,例如為金手指,各個第一連接墊可藉由導電膠連接至第一模組210,以傳輸相關的電子訊號。第二模組連接部244例如是觸控面板連接部,其具有多個第二接合墊B2,例如是金手指,各個第二接合墊B2可藉由導電膠連接至第二模組220,以傳輸相關的電子訊號。此外,第三模組連接部246例如是主機板連接部,其具有多個第三接合墊B3,例如是金手指,各個第三接合墊B3可藉由第三模組230上的連接器232與第三模組230電性連接,以傳輸相關的電子訊號。除了連接器232之外,第三接合墊B3亦可以其他方式電性連接至第三模組230。Referring to FIG. 4, the monolithic flexible circuit board 240 has a single film 241. The film 241 has a first module connecting portion 242, a second module connecting portion 244, a third module connecting portion 246, a reverse folding portion 248, and a slot S. The first module connecting portion 242 is, for example, a display panel connecting portion, and has a plurality of first bonding pads B1, such as gold fingers, and each of the first connecting pads can be connected to the first module 210 by a conductive adhesive to transmit related Electronic signal. The second module connection portion 244 is, for example, a touch panel connection portion, and has a plurality of second bonding pads B2, such as gold fingers, and each of the second bonding pads B2 can be connected to the second module 220 by a conductive adhesive. Transmit relevant electronic signals. In addition, the third module connecting portion 246 is, for example, a motherboard connecting portion, and has a plurality of third bonding pads B3, such as gold fingers, and each of the third bonding pads B3 can be connected to the connector 232 on the third module 230. The third module 230 is electrically connected to transmit related electronic signals. In addition to the connector 232, the third bonding pad B3 can be electrically connected to the third module 230 in other manners.

請參照第4圖,第一模組連接部242依據訊號來源之不同而被區分為第一訊號連接部242a以及第二訊號連接部242b,並分別與第一線路243以及第二線路245電性連接。多條第一線路243(至少一條)配置於第一模組連接部242與第二模組連接部244之間,藉以傳輸第一類型之訊號,例如是觸控感應之訊號,此訊號可經由顯示面板內之控制晶片根據觸碰位置的感測資料進行座標點計算。此外,多條第二線路245(至少一條)配置於第一模組連接部242與第三模組連接部246之間,藉以傳輸第二類型之訊號,例如是顯示面板的驅動訊號,以於顯示面板上產生影像,而完成觸控顯示之操作。Referring to FIG. 4, the first module connecting portion 242 is divided into a first signal connecting portion 242a and a second signal connecting portion 242b according to different sources of signals, and is electrically connected to the first line 243 and the second line 245, respectively. connection. A plurality of first lines 243 (at least one) are disposed between the first module connection portion 242 and the second module connection portion 244 to transmit a first type of signal, such as a touch sensing signal. The control wafer in the display panel performs coordinate point calculation based on the sensed data of the touch position. In addition, a plurality of second lines 245 (at least one) are disposed between the first module connecting portion 242 and the third module connecting portion 246 to transmit a second type of signal, such as a driving signal of the display panel. The image is generated on the display panel, and the touch display operation is completed.

請參照第5A~5D圖,其繪示觸控顯示模組的組裝流程圖之一實施例。在第5A圖中,將位於薄膜241之第一側L1的第一模組連接部242接合至第一模組210上。在第5B圖中,將位於薄膜241之第二側L2的第二模組連接部244接合至第二模組220上。由於開槽S分隔於第二模組連接部244與第三模組連接部246之間,且反折部248位於該第一模組連接部242與該第二模組連接部244之間,因此,第二模組連接部244可經由反折設計而疊置於部分第一模組連接部242之上。此時,位於薄膜241之第二側L2的第三模組連接部246並未受到反折。在第5D圖中,再將第三模組連接部246接合至第三模組230的連接器232。如此,即完成觸控顯示模組200的組裝製程,以簡化多模組的組裝工時。上述之組裝流程僅為一實施例,本發明對組裝流程的步驟不加以限制。Please refer to FIGS. 5A-5D for an embodiment of an assembly flowchart of the touch display module. In FIG. 5A, the first module connecting portion 242 on the first side L1 of the film 241 is joined to the first module 210. In FIG. 5B, the second module connection portion 244 on the second side L2 of the film 241 is joined to the second module 220. The slot S is separated between the second module connecting portion 244 and the third module connecting portion 246, and the folding portion 248 is located between the first module connecting portion 242 and the second module connecting portion 244. Therefore, the second module connecting portion 244 can be stacked on the portion of the first module connecting portion 242 via a reverse folding design. At this time, the third module connecting portion 246 located on the second side L2 of the film 241 is not folded back. In FIG. 5D, the third module connection portion 246 is joined to the connector 232 of the third module 230. In this way, the assembly process of the touch display module 200 is completed to simplify the assembly man-hour of the multi-module. The above assembly process is only an embodiment, and the present invention does not limit the steps of the assembly process.

值得注意的是,在上述之組裝流程中,第二模組220不限定疊置於第一模組210之上,亦可疊置於第一模組210之下,或與第一模組210在垂直方向上保持一適當間距。若第一模組210與第二模組220不相互疊置,亦可平行並列,並亦可在水平方向上保持一適當間距。此外,第一模組連接部242之第一接合墊B1不限定連接於第一模組210的上方,亦可連接於第一模組210的下方。第二模組連接部244之第二接合墊B2不限定連接於第二模組220的下方,亦可連接於第二模組220的上方。第三模組連接部246之第三接合墊B3不限定連接於第三模組230的上方,亦可連接於第三模組230的下方。另外,亦不限制於第4圖所示之單片式軟性電路板240之矩形,而可以具有任何形狀,舉例而言,薄膜241可往第二模組連接部244之方向作區域性延伸,或是往第三模組連接部246之方向作區域性延伸,或是可往左側或右側或兩側作區域性延伸,或是上述各延伸方向之任意組合,以增加單片式軟性電路板之可撓度或應用/組裝彈性。另外,開槽S之長度與寬度可根據設計或應用需求而定,譬如雖然以上所示之開槽S具有寬度,然實際上可僅切出一條線(亦即開槽S之寬度將近為零),或是開槽本身之形狀或寬窄作出變化或延伸方向作出轉折。另外,根據設計需求,亦可設計更多的開槽以增加單片式軟性電路板之可撓度或應用/組裝彈性。因此,上述之組裝流程可依照實際需求調整並組合,本發明不加以限制。It should be noted that, in the above assembly process, the second module 220 is not limited to be stacked on the first module 210, or may be stacked under the first module 210, or with the first module 210. Maintain an appropriate spacing in the vertical direction. If the first module 210 and the second module 220 are not overlapped with each other, they may be juxtaposed in parallel, and may also maintain an appropriate spacing in the horizontal direction. In addition, the first bonding pad B1 of the first module connecting portion 242 is not limited to be connected to the upper side of the first module 210, and may be connected to the lower side of the first module 210. The second bonding pad B2 of the second module connecting portion 244 is not limited to be connected to the lower side of the second module 220, and may be connected to the upper side of the second module 220. The third bonding pad B3 of the third module connecting portion 246 is not limited to be connected to the upper side of the third module 230, and may be connected to the lower side of the third module 230. In addition, it is not limited to the rectangular shape of the single-chip flexible circuit board 240 shown in FIG. 4, and may have any shape. For example, the film 241 may extend in a direction to the second module connecting portion 244. Or extending to the direction of the third module connecting portion 246, or extending to the left or the right or both sides, or any combination of the above extending directions to add a single-chip flexible circuit board Flexibility or application/assembly flexibility. In addition, the length and width of the slot S may be determined according to design or application requirements. For example, although the slot S shown above has a width, in practice, only one line may be cut (ie, the width of the slot S is nearly zero). ), or the shape or width of the slot itself changes to make a change or extend direction to make a turn. In addition, depending on the design requirements, more slots can be designed to increase the flexibility or application/assembly flexibility of the monolithic flexible circuit board. Therefore, the above assembly process can be adjusted and combined according to actual needs, and the invention is not limited.

第二實施例Second embodiment

請參照第6A~6C及7A~7B圖,其中第6A~6C圖分別繪示依照本發明一實施例之觸控顯示模組的組裝結構圖。第7A及7B圖繪示依照本發明之兩實施例之連接多模組之單片式軟性電路板的示意圖,分別皆可應用於第6A~6C圖之組裝結構。觸控顯示模組300包括一第一模組310、一第二模組320、一第三模組330以及一單片式軟性電路板340。第一模組310例如為顯示面板。第二模組320例如為觸控面板。第三模組330例如為主機板。在一實施例中,觸控面板可貼附在蓋板350的下表面(如第6A圖所示),其為外掛方案(Out cell solution)之觸控面板,或是在蓋板350上製作觸控感測的透明導電層322(如第6B圖所示),而成為單片整合方案(One glass solution)之觸控面板,或是將觸控感測的透明導電層322整合至顯示面板上或內嵌於彩色濾光片中(如第6C圖所示),而成為嵌入方案(On cell/In cell solution)之觸控顯示面板。Please refer to FIGS. 6A-6C and 7A-7B. FIG. 6A to FIG. 6C respectively show the assembled structure of the touch display module according to an embodiment of the invention. 7A and 7B are schematic diagrams showing a single-chip flexible circuit board connected to a multi-module according to two embodiments of the present invention, which are respectively applicable to the assembly structure of FIGS. 6A-6C. The touch display module 300 includes a first module 310, a second module 320, a third module 330, and a monolithic flexible circuit board 340. The first module 310 is, for example, a display panel. The second module 320 is, for example, a touch panel. The third module 330 is, for example, a motherboard. In one embodiment, the touch panel can be attached to the lower surface of the cover 350 (as shown in FIG. 6A ), which is an out cell solution touch panel or fabricated on the cover 350 The touch-sensing transparent conductive layer 322 (as shown in FIG. 6B) becomes a touch panel of a single glass solution or integrates the touch-sensing transparent conductive layer 322 to the display panel It is mounted on a color filter (as shown in FIG. 6C), and becomes a touch display panel of an on cell/in cell solution.

請參照第7A及7B圖,單片式軟性電路板340具有單一薄膜341。此薄膜341具有一第一模組連接部342、一第二模組連接部344、一第三模組連接部346以及一第一開槽S1。第一模組連接部342例如是顯示面板連接部,其具有多個第一接合墊B1,例如為金手指,各個第一接合墊B1可藉由導電膠連接至第一模組310,以傳輸相關的電子訊號。第二模組連接部344例如是觸控面板連接部,其具有多個第二接合墊B2,例如是金手指,各個第二接合墊B2可藉由導電膠連接至第二模組320,以傳輸相關的電子訊號。此外,第三模組連接部346例如是主機板連接部,其具有多個第三接合墊B3,例如是金手指,第三接合墊B3可藉由第三模組330上的連接器332與第三模組330電性連接,以傳輸相關的電子訊號。除了連接器332之外,第三接合墊B3亦可以其他方式電性連接至第三模組330。Referring to FIGS. 7A and 7B, the monolithic flexible circuit board 340 has a single film 341. The film 341 has a first module connecting portion 342, a second module connecting portion 344, a third module connecting portion 346, and a first slot S1. The first module connecting portion 342 is, for example, a display panel connecting portion, and has a plurality of first bonding pads B1, such as gold fingers, and each of the first bonding pads B1 can be connected to the first module 310 by a conductive adhesive for transmission. Related electronic signals. The second module connecting portion 344 is, for example, a touch panel connecting portion, and has a plurality of second bonding pads B2, such as gold fingers, and each of the second bonding pads B2 can be connected to the second module 320 by a conductive adhesive. Transmit relevant electronic signals. In addition, the third module connecting portion 346 is, for example, a motherboard connecting portion, and has a plurality of third bonding pads B3, such as gold fingers, and the third bonding pads B3 can be connected by the connector 332 on the third module 330. The third module 330 is electrically connected to transmit related electronic signals. In addition to the connector 332, the third bonding pad B3 can be electrically connected to the third module 330 in other manners.

請參照第7A及7B圖,第一模組連接部342依據訊號來源之不同而被區分為第一訊號連接部342a以及第二訊號連接部342b,並分別與第一線路343與第二線路345電性連接,以傳輸不同類型之訊號,例如是觸控感應訊號及驅動訊號,如第一實施例所述,在此不再贅述。Referring to FIGS. 7A and 7B, the first module connecting portion 342 is divided into a first signal connecting portion 342a and a second signal connecting portion 342b according to different sources of signals, and is respectively associated with the first line 343 and the second line 345. The electrical connection is used to transmit different types of signals, such as the touch sensing signal and the driving signal, as described in the first embodiment, and details are not described herein.

第7A圖與第7B圖之主要差異在於:於第7A圖中,薄膜24341還具有一第二開槽S2,位於薄膜24341的第二側L2,且第二開槽S2分隔於第一線路24343與該第二線路24345之間,以增加薄膜24341的可撓性。第一開槽S1與第二開槽S2位於薄膜24341的不同側,而兩者各自的長度可依設計或應用需求來決定,兩者的長度可相同或不同。舉例而言,第一開槽S1與第二開槽S2的長度分別可約為薄膜長度的一半,方以增加薄膜241的可撓性。另外,於第7B圖中,雖然未具有第二S2開槽,然而薄膜341可往第二模組連接部346之方向作區域性延伸,以增加單片式軟性電路板340之可撓度。The main difference between the 7A and 7B is that in the 7A, the film 24341 further has a second slot S2 on the second side L2 of the film 24341, and the second slot S2 is separated from the first line 24343. Between the second line 24345 and the second line 24345 to increase the flexibility of the film 24341. The first slot S1 and the second slot S2 are located on different sides of the film 24341, and the respective lengths of the two can be determined according to design or application requirements, and the lengths of the two can be the same or different. For example, the lengths of the first slot S1 and the second slot S2 may each be about half of the length of the film to increase the flexibility of the film 241. In addition, in FIG. 7B, although the second S2 slot is not provided, the film 341 can be extended to the direction of the second module connecting portion 346 to increase the flexibility of the single-chip flexible circuit board 340.

請參照第8A~8C圖,其繪示觸控顯示模組的組裝流程圖之一實施例。雖然其以第7A圖所示的單片式軟性電路板340為例來作說明,但可類推至第7A圖所示的單片式軟性電路板340之情況。在第8A圖中,將位於薄膜341之第一側L1的第一模組連接部342接合至第一模組310上。在第8B圖中,將位於薄膜341之第一側L1的第二模組連接部344接合至第二模組320上。此時,第二模組320疊置於第一模組310之上。由於第一開槽S1分隔於該第一模組連接部342與該第二模組連接部344之間。因此,第一模組連接部342與第二模組連接部344可經由分叉設計而分別位於第一模組310及第二模組320之上。此外,在第8C圖中,再將位於薄膜341之第二側L2的第三模組連接部346接合至第三模組330的連接器332。如此,即完成觸控顯示模組300的組裝製程,以簡化多模組的組裝工時。上述之組裝流程僅為一實施例,本發明對組裝流程的步驟不加以限制。Please refer to FIGS. 8A-8C for an embodiment of an assembly flowchart of the touch display module. Although the single-chip flexible circuit board 340 shown in FIG. 7A is taken as an example, it can be analogized to the case of the one-chip flexible circuit board 340 shown in FIG. In FIG. 8A, the first module connecting portion 342 on the first side L1 of the film 341 is joined to the first module 310. In FIG. 8B, the second module connecting portion 344 on the first side L1 of the film 341 is joined to the second module 320. At this time, the second module 320 is stacked on the first module 310. The first slot S1 is separated between the first module connecting portion 342 and the second module connecting portion 344. Therefore, the first module connecting portion 342 and the second module connecting portion 344 can be respectively located on the first module 310 and the second module 320 via the bifurcation design. Further, in FIG. 8C, the third module connecting portion 346 located on the second side L2 of the film 341 is joined to the connector 332 of the third module 330. In this way, the assembly process of the touch display module 300 is completed to simplify the assembly man-hour of the multi-module. The above assembly process is only an embodiment, and the present invention does not limit the steps of the assembly process.

值得注意的是,在上述之組裝流程中,第二模組320不限定疊置於第一模組310之上,亦可疊置於第一模組310之下,或與第一模組310在垂直方向上保持一適當間距。若第一模組310與第二模組320不相互疊置,亦可平行並列,並亦可在水平方向上保持一適當間距。此外,第一模組連接部342之第一接合墊B1不限定連接於第一模組310的上方,亦可連接於第一模組310的下方。第二模組連接部344之第二接合墊B2不限定連接於第二模組320的上方,亦可連接於第二模組320的下方。第三模組連接部346之第三接合墊B3不限定連接於第三模組330的上方,亦可連接於第三模組330的下方。另外,亦不限制於第7A與7B圖所示之單片式軟性電路板340之矩形,而可以具有任何形狀,舉例而言,薄膜341可往第一模組連接部342(342a或342b或兩者)之方向作區域性延伸,或往第二模組連接部344之方向或反向作區域性延伸,或是往第三模組連接部346之方向作區域性延伸,或是可往左側或右側或兩側作區域性延伸,或是上述各延伸方向之任意組合,以增加單片式軟性電路板之可撓度或應用/組裝彈性。另外,第一開槽S1與第二開槽S2之長度與寬度可根據設計或應用需求而定,譬如雖然以上所示之第一開槽S1與第二開槽S2皆具有寬度,然實際上可僅切出一條線(亦即第一開槽S1與第二開槽S2之寬度將近為零),或是開槽本身之形狀或寬窄作出變化或延伸方向作出轉折。另外,根據設計需求,亦可設計更多的開槽以增加單片式軟性電路板之可撓度或應用/組裝彈性。因此,上述之組裝流程可依照實際需求調整,本發明不加以限制。It should be noted that, in the above assembly process, the second module 320 is not limited to be stacked on the first module 310, or may be stacked under the first module 310, or with the first module 310. Maintain an appropriate spacing in the vertical direction. If the first module 310 and the second module 320 are not overlapped with each other, they may be juxtaposed in parallel, and may also maintain an appropriate spacing in the horizontal direction. In addition, the first bonding pad B1 of the first module connecting portion 342 is not limited to be connected to the upper side of the first module 310, and may be connected to the lower side of the first module 310. The second bonding pad B2 of the second module connecting portion 344 is not limited to be connected to the upper side of the second module 320, and may be connected to the lower side of the second module 320. The third bonding pad B3 of the third module connecting portion 346 is not limited to be connected to the upper side of the third module 330, and may be connected to the lower side of the third module 330. In addition, it is not limited to the rectangular shape of the single-chip flexible circuit board 340 shown in FIGS. 7A and 7B, and may have any shape. For example, the film 341 may be connected to the first module connecting portion 342 (342a or 342b or The direction of the two is extended regionally, or extends in the direction of the second module connecting portion 344 or in the opposite direction, or extends in the direction of the third module connecting portion 346, or can be The left side or the right side or both sides are regionally extended, or any combination of the above extending directions, to increase the flexibility or application/assembly flexibility of the single-chip flexible circuit board. In addition, the length and width of the first slot S1 and the second slot S2 may be determined according to design or application requirements. For example, although the first slot S1 and the second slot S2 have widths as described above, actually Only one line can be cut out (ie, the width of the first slot S1 and the second slot S2 is nearly zero), or the shape or width of the slot itself can be changed or extended to make a turning. In addition, depending on the design requirements, more slots can be designed to increase the flexibility or application/assembly flexibility of the monolithic flexible circuit board. Therefore, the above assembly process can be adjusted according to actual needs, and the invention is not limited.

第三實施例Third embodiment

第9A~9B圖分別繪示依照本發明之兩實施例之連接多模組之單片式軟性電路板的示意圖。單片式軟性電路板440具有單一薄膜441。此薄膜441具有一第一模組連接部442、一第二模組連接部444、一第三模組連接部446、一第一開槽S1以及一第二開槽S2。此兩實施例與第二實施例相近,主要差異在於,第一開槽S1與第二開槽S2位於薄膜441的同一側,且第二模組連接部444位於第一開槽S1與第二開槽S2之間。9A-9B are schematic views respectively showing a single-chip flexible circuit board connecting multiple modules according to two embodiments of the present invention. The monolithic flexible circuit board 440 has a single film 441. The film 441 has a first module connecting portion 442, a second module connecting portion 444, a third module connecting portion 446, a first slot S1 and a second slot S2. The two embodiments are similar to the second embodiment. The main difference is that the first slot S1 and the second slot S2 are located on the same side of the film 441, and the second module connecting portion 444 is located at the first slot S1 and the second slot. Slot between S2.

在此兩實施例中,第一模組連接部442依據訊號來源之不同而被區分為第一訊號連接部442a以及第二訊號連接部442b。其中,第一開槽S1分隔於第一訊號連接部442a與第二模組連接部444之間,第二開槽S分隔於第二訊號連接部442b與第二模組連接部444之間。第一訊號連接部442a與第一線路443電性連接,以傳輸第一類型之訊號,例如是觸控感應訊號。第二訊號連接部442b與第二線路445電性連接,以傳輸第二類型之訊號,例如是顯示面板的驅動訊號。In the two embodiments, the first module connecting portion 442 is divided into the first signal connecting portion 442a and the second signal connecting portion 442b according to the source of the signal. The first slot S1 is separated between the first signal connecting portion 442a and the second module connecting portion 444, and the second slot S is separated between the second signal connecting portion 442b and the second module connecting portion 444. The first signal connection portion 442a is electrically connected to the first line 443 to transmit a first type of signal, such as a touch sensing signal. The second signal connection portion 442b is electrically connected to the second line 445 to transmit a second type of signal, such as a driving signal of the display panel.

第9A圖與第9B圖之差異在於:於第9B圖中,第二模組連接部444更具有一延伸部447,凸出於薄膜441之該第一側L1,以使第一線路443向外延伸,以增加薄膜441的可撓性。此外,第一線路443亦可配合薄膜441的尺寸設計向左或向右延伸適當長度,讓第二模組連接部444不會因過度的撓曲而變形,並可準確地固定在第二模組220上,以提高組裝的可靠度。值得注意的是,在第7A及7B圖中,第二模組連接部344亦可採用相同的設計而延伸出薄膜341之外。另外,亦不限制於第9A與9B圖所示之單片式軟性電路板440之矩形,而可以具有任何形狀,舉例而言,薄膜441可往第一模組連接部342(342a或342b或兩者)之方向作區域性延伸,或往第二模組連接部344之方向或反向作區域性延伸,或是往第三模組連接部346之方向作區域性延伸,或是可往左側或右側或兩側作區域性延伸,或是上述各延伸方向之任意組合,以增加單片式軟性電路板之可撓度或應用/組裝彈性。另外,第一開槽S1與第二開槽S2之長度與寬度可根據設計或應用需求而定,譬如雖然以上所示之第一開槽S1與第二開槽S2皆具有寬度,然實際上可僅切出一條線(亦即第一開槽S1與第二開槽S2之寬度將近為零),或是開槽本身之形狀或寬窄作出變化或延伸方向作出轉折。另外,根據設計需求,亦可設計更多的開槽以增加單片式軟性電路板之可撓度或應用/組裝彈性。另外,關於第9A與9B圖相關之觸控顯示模組的組裝結構以及組裝流程可由第二實施例之說明類推而得,在此為簡明起見不多加贅述。The difference between the 9A and 9B is that in the 9B, the second module connecting portion 444 further has an extending portion 447 protruding from the first side L1 of the film 441 to make the first line 443 The outer extension is to increase the flexibility of the film 441. In addition, the first line 443 can also extend to the left or right by an appropriate length in accordance with the size design of the film 441, so that the second module connecting portion 444 is not deformed by excessive deflection, and can be accurately fixed to the second mode. Group 220 to improve the reliability of the assembly. It should be noted that in the 7A and 7B drawings, the second module connecting portion 344 can also extend out of the film 341 by the same design. In addition, it is not limited to the rectangular shape of the single-chip flexible circuit board 440 shown in FIGS. 9A and 9B, and may have any shape. For example, the film 441 may be connected to the first module connection portion 342 (342a or 342b or The direction of the two is extended regionally, or extends in the direction of the second module connecting portion 344 or in the opposite direction, or extends in the direction of the third module connecting portion 346, or can be The left side or the right side or both sides are regionally extended, or any combination of the above extending directions, to increase the flexibility or application/assembly flexibility of the single-chip flexible circuit board. In addition, the length and width of the first slot S1 and the second slot S2 may be determined according to design or application requirements. For example, although the first slot S1 and the second slot S2 have widths as described above, actually Only one line can be cut out (ie, the width of the first slot S1 and the second slot S2 is nearly zero), or the shape or width of the slot itself can be changed or extended to make a turning. In addition, depending on the design requirements, more slots can be designed to increase the flexibility or application/assembly flexibility of the monolithic flexible circuit board. In addition, the assembly structure and assembly process of the touch display module related to the drawings of FIGS. 9A and 9B can be derived from the description of the second embodiment, and will not be further described herein for the sake of brevity.

本發明上述實施例所揭露之連接多模組之單片式軟性電路板,係利用單一薄膜的設計,來連接至少兩個以上之模組,以傳遞相關的電子訊號。由於僅需一條軟性電路板,不需再透過連接器連接於觸控面板與顯示面板之間,組裝上更方便,以簡化多模組的組裝工時。此外,軟性電路板以單一薄膜製作,在設計尺寸時,可用最小化的尺寸來製作數量最多的薄膜,故可減少生產過程中不必要的廢料,進而減少成本。The single-chip flexible circuit board connected to the multi-module disclosed in the above embodiments of the present invention uses a single film design to connect at least two modules to transmit related electronic signals. Since only one flexible circuit board is needed, it is not necessary to connect between the touch panel and the display panel through the connector, which is more convenient to assemble, so as to simplify assembly time of the multi-module. In addition, the flexible circuit board is made of a single film, and when the size is designed, the largest number of films can be produced with the smallest size, so that unnecessary waste in the production process can be reduced, thereby reducing the cost.

綜上所述,雖然本發明已以較佳實施例揭露如上,然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾。因此,本發明之保護範圍當視後附之申請專利範圍所界定者為準。In conclusion, the present invention has been disclosed in the above preferred embodiments, and is not intended to limit the present invention. A person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

100...觸控顯示模組100. . . Touch display module

110...顯示面板110. . . Display panel

120...觸控面板120. . . Touch panel

130...主機板130. . . motherboard

132...連接器132. . . Connector

140...第二軟性電路板140. . . Second flexible circuit board

142...第一軟性電路板142. . . First flexible circuit board

144...連接器144. . . Connector

200、300...觸控顯示模組200, 300. . . Touch display module

210、310...第一模組210, 310. . . First module

220、320...第二模組220, 320. . . Second module

222、322...透明導電層222, 322. . . Transparent conductive layer

230、330...第三模組230, 330. . . Third module

232、332...連接器232, 332. . . Connector

240、340、440...單片式軟性電路板240, 340, 440. . . Monolithic flexible circuit board

241、341、441...薄膜241, 341, 441. . . film

242、342、442...第一模組連接部242, 342, 442. . . First module connection

242a、342a、442a...第一訊號連接部242a, 342a, 442a. . . First signal connection

242b、342b、442b...第二訊號連接部242b, 342b, 442b. . . Second signal connection

243、343、443...第一線路243, 343, 443. . . First line

244、344、444...第二模組連接部244, 344, 444. . . Second module connection

245、345、445...第二線路245, 345, 445. . . Second line

246、346、446...第三模組連接部246, 346, 446. . . Third module connection

248...反折部248. . . Reverse folding

447...延伸部447. . . Extension

B1...第一接合墊B1. . . First bond pad

B2...第二接合墊B2. . . Second bonding pad

B3...第三接合墊B3. . . Third bonding pad

L1...第一側L1. . . First side

L2...第二側L2. . . Second side

S、S1、S2...開槽S, S1, S2. . . Slotting

第1及2圖分別繪示傳統上一種觸控顯示模組的示意圖及組裝結構圖。The first and second figures respectively show a schematic diagram and an assembly structure diagram of a conventional touch display module.

第3A~3C圖分別繪示依照本發明一實施例之觸控顯示模組的組裝結構圖。3A-3C are respectively assembled structural diagrams of a touch display module according to an embodiment of the invention.

第4圖繪示依照本發明一實施例之連接多模組之單片式軟性電路板的示意圖。FIG. 4 is a schematic diagram of a single-chip flexible circuit board connecting multiple modules according to an embodiment of the invention.

第5A~5D圖繪示觸控顯示模組的組裝流程圖。5A-5D illustrate a flow chart of assembly of the touch display module.

第6A~6C圖分別繪示依照本發明一實施例之觸控顯示模組的組裝結構圖。6A-6C are respectively assembled structural diagrams of a touch display module according to an embodiment of the invention.

第7A及7B圖分別繪示依照本發明一實施例之連接多模組之單片式軟性電路板的示意圖。7A and 7B are schematic views respectively showing a single-chip flexible circuit board connecting multiple modules according to an embodiment of the invention.

第8A~8C圖繪示觸控顯示模組的組裝流程圖。8A-8C are diagrams showing the assembly of the touch display module.

第9A~9B圖分別繪示依照本發明一實施例之連接多模組之單片式軟性電路板的示意圖。9A-9B are schematic diagrams respectively showing a single-chip flexible circuit board connecting multiple modules according to an embodiment of the invention.

240...單片式軟性電路板240. . . Monolithic flexible circuit board

241...薄膜241. . . film

242...第一模組連接部242. . . First module connection

242a...第一訊號連接部242a. . . First signal connection

242b...第二訊號連接部242b. . . Second signal connection

243...第一線路243. . . First line

244...第二模組連接部244. . . Second module connection

245...第二線路245. . . Second line

246...第三模組連接部246. . . Third module connection

248...反折部248. . . Reverse folding

B1...第一接合墊B1. . . First bond pad

B2...第二接合墊B2. . . Second bonding pad

B3...第三接合墊B3. . . Third bonding pad

L1...第一側L1. . . First side

L2...第二側L2. . . Second side

S...開槽S. . . Slotting

Claims (18)

一種連接多模組之單片式軟性電路板,包括:一薄膜,具有一第一模組連接部、一第二模組連接部以及一第三模組連接部,該第一至第三模組連接部分別為一顯示面板連接部、一觸控面板連接部以及一主機板連接部,其中該第一模組連接部、該第二模組連接部以及該第三模組連接部中每一者設置於該薄膜之一第一側或一第二側,該第一側與該第二側相對;至少一第一線路,連接於該第一模組連接部與該第二模組連接部之間;以及至少一第二線路,連接於該第一模組連接部與該第三模組連接部之間;其中,該第一模組連接部位於該薄膜之該第一側,該第一模組連接部區分為一第一訊號連接部以及一第二訊號連接部,並分別與該至少一第一線路以及該至少一第二線路電性連接,該第二模組連接部及該第三模組連接部位於該薄膜之該第二側,該第二模組連接部透過該至少一第一線路與該第一訊號連接部電性連接,該第三模組連接部透過該至少一第二線路與該第二訊號連接部電性連接,該薄膜更具有一開槽,該開槽自該薄膜之該第二側往該薄膜之內部延伸,以分隔該第二模組連接部及該第三模組連接部。 A single-chip flexible circuit board connected to a multi-module, comprising: a film having a first module connecting portion, a second module connecting portion and a third module connecting portion, the first to third modes The group connection portion is a display panel connection portion, a touch panel connection portion, and a motherboard connection portion, wherein each of the first module connection portion, the second module connection portion, and the third module connection portion One of the first side or the second side of the film, the first side is opposite to the second side; at least one first line is connected to the first module connecting portion and the second module And the at least one second line is connected between the first module connecting portion and the third module connecting portion; wherein the first module connecting portion is located on the first side of the film, The first module connection portion is divided into a first signal connection portion and a second signal connection portion, and is electrically connected to the at least one first line and the at least one second line respectively, the second module connection portion and The third module connecting portion is located on the second side of the film, and the second module The connection portion is electrically connected to the first signal connection portion through the at least one first line, and the third module connection portion is electrically connected to the second signal connection portion through the at least one second line. Slotting, the slot extending from the second side of the film to the inside of the film to separate the second module connecting portion and the third module connecting portion. 如申請專利範圍第1項所述之單片式軟性電路 板,其中該薄膜更具有一反折部,該反折部位於該第一模組連接部之該第一訊號連接部與該第二模組連接部之間。 The one-chip flexible circuit as described in claim 1 The board has a reflexed portion, and the reflexed portion is located between the first signal connecting portion and the second module connecting portion of the first module connecting portion. 一種觸控顯示模組,包括:第一至第三模組;以及如申請專利範圍第1項所述之單片式軟性電路板,其中第一至第三模組連接部分別連接至該第一至第三模組。 A touch display module comprising: first to third modules; and the one-chip flexible circuit board according to claim 1, wherein the first to third module connecting portions are respectively connected to the first One to third modules. 如申請專利範圍第3項所述之觸控顯示模組,其中該第二與第三模組分別位於該第一模組之上下兩側。 The touch display module of claim 3, wherein the second and third modules are respectively located on the upper and lower sides of the first module. 一種觸控顯示模組,包括:一第一模組;一第二模組,配置於該第一模組上;一第三模組,鄰近於該第一模組,該第一模組位於該第二模組與該第三模組之間;其中該第一模組為顯示面板,該第二模組為觸控面板,該第三模組為主機板;以及一單片式軟性電路板,連接該第一模組、該第二模組以及該第三模組,該單片式軟性電路板包括:一薄膜,該薄膜具有一第一模組連接部、一第二模組連接部以及一第三模組連接部,其中該第一模組連接部、該第二模組連接部以及該第三模組連接部中每一者設置於該薄膜之一第一側或一第二側,該第一側與該第二側相對;至少一第一線路,連接於該第一模組連接部與該第二模組連接部之間;以及至少一第二線路,連接於該第一模組連接部與 該第三模組連接部之間;其中,該第一模組連接部位於該薄膜之該第一側,該第一模組連接部區分為一第一訊號連接部以及一第二訊號連接部,並分別與該至少一第一線路以及該至少一第二線路電性連接,該第二模組連接部及該第三模組連接部位於該薄膜之該第二側,該第二模組連接部透過該至少一第一線路與該第一訊號連接部電性連接,該第三模組連接部透過該至少一第二線路與該第二訊號連接部電性連接,該薄膜更具有一開槽,該開槽自該薄膜之該第二側往該薄膜之內部延伸,以分隔該第二模組連接部及該第三模組連接部。 A touch display module includes: a first module; a second module disposed on the first module; a third module adjacent to the first module, the first module is located Between the second module and the third module; wherein the first module is a display panel, the second module is a touch panel, the third module is a motherboard; and a single-chip flexible circuit The first module, the second module, and the third module are connected to the first module, the second module, and the third module. The single-chip flexible circuit board includes: a film having a first module connection portion and a second module connection And a third module connection portion, wherein each of the first module connection portion, the second module connection portion, and the third module connection portion is disposed on a first side of the film or a first On the two sides, the first side is opposite to the second side; at least one first line is connected between the first module connecting portion and the second module connecting portion; and at least one second line is connected to the First module connection and The first module connecting portion is located on the first side of the film, and the first module connecting portion is divided into a first signal connecting portion and a second signal connecting portion. And electrically connected to the at least one first line and the at least one second line, the second module connecting portion and the third module connecting portion are located on the second side of the film, the second module The connection portion is electrically connected to the first signal connection portion through the at least one first line, and the third module connection portion is electrically connected to the second signal connection portion through the at least one second line. Slotting, the slot extending from the second side of the film to the inside of the film to separate the second module connecting portion and the third module connecting portion. 如申請專利範圍第5項所述之觸控顯示模組,其中該薄膜更具有一反折部,該反折部位於該第一模組連接部之該第一訊號連接部與該第二模組連接部之間。 The touch display module of claim 5, wherein the film further has a reversed portion, the folded portion is located at the first signal connecting portion and the second mode of the first module connecting portion Between the group connections. 一種連接多模組之單片式軟性電路板,包括:一薄膜,具有一第一模組連接部、一第二模組連接部以及一第三模組連接部,其中該第一模組連接部、該第二模組連接部以及該第三模組連接部中每一者設置於該薄膜之一第一側或一第二側,該第一側與該第二側相對;至少一第一線路,連接於該第一模組連接部與該第二模組連接部之間;以及至少一第二線路,連接於該第一模組連接部與該第三模組連接部之間;其中,該第一模組連接部及該第二模組連接部位於該 薄膜之該第一側,該第一模組連接部區分為一第一訊號連接部以及一第二訊號連接部,該第二模組連接部透過該至少一第一線路與該第一訊號連接部電性連接,該第三模組連接部位於該薄膜之該第二側,該第三模組連接部透過該至少一第二線路與該第二訊號連接部電性連接,該薄膜更具有一第一開槽以及一第二開槽,該第一開槽位於該薄膜之該第一側,以分隔該第一模組連接部及該第二模組連接部,該第二開槽位於該薄膜之該第一側或該第二側,以分隔該至少一第一線路及該至少一第二線路。 A single-chip flexible circuit board connected to a multi-module, comprising: a film having a first module connecting portion, a second module connecting portion and a third module connecting portion, wherein the first module is connected Each of the second module connection portion and the third module connection portion is disposed on a first side or a second side of the film, the first side being opposite to the second side; at least one a line connected between the first module connecting portion and the second module connecting portion; and at least one second line connected between the first module connecting portion and the third module connecting portion; The first module connecting portion and the second module connecting portion are located at the The first module connection portion is divided into a first signal connection portion and a second signal connection portion, and the second module connection portion is connected to the first signal through the at least one first line. The third module connection portion is electrically connected to the second signal connection portion, and the third module connection portion is electrically connected to the second signal connection portion through the at least one second line. a first slot and a second slot, the first slot is located on the first side of the film to separate the first module connection portion and the second module connection portion, the second slot is located The first side or the second side of the film to separate the at least one first line and the at least one second line. 如申請專利範圍第7項所述之單片式軟性電路板,其中該第一開槽及該第二開槽自該薄膜之該第一側往該薄膜之內部延伸。 The one-piece flexible circuit board of claim 7, wherein the first slot and the second slot extend from the first side of the film toward the inside of the film. 如申請專利範圍第7項所述之單片式軟性電路板,其中該第一開槽自該薄膜之該第一側往該薄膜之內部延伸,該第二開槽自該薄膜之該第二側往該薄膜之內部延伸。 The one-piece flexible circuit board of claim 7, wherein the first slot extends from the first side of the film toward the inside of the film, and the second slot is from the second of the film The side extends to the inside of the film. 一種觸控顯示模組,包括:第一至第三模組;以及如申請專利範圍第7項所述之單片式軟性電路板,其中第一至第三模組連接部分別連接至該第一至第三模組。 A touch display module comprising: first to third modules; and the one-chip flexible circuit board according to claim 7, wherein the first to third module connecting portions are respectively connected to the first One to third modules. 如申請專利範圍第10項所述之觸控顯示模組,其中該第二與第三模組分別位於該第一模組之上下兩側。 The touch display module of claim 10, wherein the second and third modules are respectively located on the upper and lower sides of the first module. 一種觸控顯示模組,包括:一第一模組; 一第二模組,配置於該第一模組上;一第三模組,鄰近於該第一模組,該第一模組位於該第二模組與該第三模組之間;以及一單片式軟性電路板,連接該第一模組、該第二模組以及該第三模組,該單片式軟性電路板包括:一薄膜,該薄膜具有一第一模組連接部、一第二模組連接部以及一第三模組連接部,其中該第一模組連接部、該第二模組連接部以及該第三模組連接部中每一者設置於該薄膜之一第一側或一第二側,該第一側與該第二側相對;至少一第一線路,連接於該第一模組連接部與該第二模組連接部之間;以及至少一第二線路,連接於該第一模組連接部與該第三模組連接部之間;其中,該第一模組連接部及該第二模組連接部位於該薄膜之該第一側,該第一模組連接部區分為一第一訊號連接部以及一第二訊號連接部,該第二模組連接部透過該至少一第一線路與該第一訊號連接部電性連接,該第三模組連接部位於該薄膜之該第二側,該第三模組連接部透過該至少一第二線路與該第二訊號連接部電性連接,該薄膜更具有一第一開槽以及一第二開槽,該第一開槽位於該薄膜之該第一側,以分隔該第一模組連接部及該第二模組連接部,該第二開槽位於該薄膜之該第一側或該第二側,以分隔該至少一第一線路及該至少一第二 線路。 A touch display module includes: a first module; a second module disposed on the first module; a third module adjacent to the first module, the first module being located between the second module and the third module; a single-chip flexible circuit board, the first module, the second module, and the third module, the single-chip flexible circuit board includes: a film, the film has a first module connection portion, a second module connecting portion and a third module connecting portion, wherein each of the first module connecting portion, the second module connecting portion and the third module connecting portion is disposed on one of the films a first side or a second side, the first side is opposite to the second side; at least one first line is connected between the first module connecting portion and the second module connecting portion; and at least one The second circuit is connected between the first module connecting portion and the third module connecting portion; wherein the first module connecting portion and the second module connecting portion are located on the first side of the film, The first module connecting portion is divided into a first signal connecting portion and a second signal connecting portion, and the second module connecting portion transmits the through The first circuit is electrically connected to the first signal connection portion, the third module connection portion is located on the second side of the film, and the third module connection portion is transmitted through the at least one second line and the second signal The connecting portion is electrically connected, the film further has a first slot and a second slot, the first slot is located on the first side of the film to separate the first module connecting portion and the second die a second connecting slot on the first side or the second side of the film to separate the at least one first line and the at least one second line. 如申請專利範圍第12項所述之觸控顯示模組,其中該第一至第三模組連接部分別為一顯示面板連接部、一觸控面板連接部以及一主機板連接部。 The touch display module of claim 12, wherein the first to third module connection portions are a display panel connection portion, a touch panel connection portion, and a motherboard connection portion. 如申請專利範圍第12項所述之觸控顯示模組,其中該第一開槽及該第二開槽自該薄膜之該第一側往該薄膜之內部延伸。 The touch display module of claim 12, wherein the first slot and the second slot extend from the first side of the film toward the inside of the film. 如申請專利範圍第12項所述之觸控顯示模組,其中該第一開槽自該薄膜之該第一側往該薄膜之內部延伸,該第二開槽自該薄膜之該第二側往該薄膜之內部延伸。 The touch display module of claim 12, wherein the first slot extends from the first side of the film toward the inside of the film, and the second slot is from the second side of the film Extending into the interior of the film. 一種連接多模組之單片式軟性電路板,包括:一薄膜,具有一第一模組連接部、一第二模組連接部以及一第三模組連接部,該第一至第三模組連接部分別為一顯示面板連接部、一觸控面板連接部以及一主機板連接部,其中該第一模組連接部、該第二模組連接部以及該第三模組連接部中每一者設置於該薄膜之一第一側或一第二側,該第一側與該第二側相對;至少一第一線路,連接於該第一模組連接部與該第二模組連接部之間;以及至少一第二線路,連接於該第一模組連接部與該第三模組連接部之間;其中,該薄膜更具有一第一開槽,該第一開槽自該薄 膜之該第一側或該第二側往該薄膜之內部延伸,使該薄膜之該第一側或該第二側具有一缺口或一斷口。 A single-chip flexible circuit board connected to a multi-module, comprising: a film having a first module connecting portion, a second module connecting portion and a third module connecting portion, the first to third modes The group connection portion is a display panel connection portion, a touch panel connection portion, and a motherboard connection portion, wherein each of the first module connection portion, the second module connection portion, and the third module connection portion One of the first side or the second side of the film, the first side is opposite to the second side; at least one first line is connected to the first module connecting portion and the second module And the at least one second line is connected between the first module connecting portion and the third module connecting portion; wherein the film further has a first slot, the first slot is from the thin The first side or the second side of the film extends toward the interior of the film such that the first side or the second side of the film has a notch or a fracture. 一種觸控顯示模組,包括:第一至第三模組;以及如申請專利範圍第16項所述之單片式軟性電路板,其中第一至第三模組連接部分別連接至該第一至第三模組。 A touch display module comprising: first to third modules; and the one-chip flexible circuit board according to claim 16, wherein the first to third module connecting portions are respectively connected to the first One to third modules. 一種觸控顯示模組,包括:一第一模組;一第二模組,配置於該第一模組上;一第三模組,鄰近於該第一模組,該第一模組位於該第二模組與該第三模組之間;其中該第一模組為顯示面板,該第二模組為觸控面板,該第三模組為主機板;以及一單片式軟性電路板,該單片式軟性電路板包括:一薄膜,該薄膜具有一第一模組連接部、一第二模組連接部以及一第三模組連接部,其中該第一模組連接部、該第二模組連接部以及該第三模組連接部中每一者設置於該薄膜之一第一側或一第二側,該第一側與該第二側相對,該第一至第三模組連接部分別連接該第一模組、該第二模組以及該第三模組;至少一第一線路,連接於該第一模組連接部與該第二模組連接部之間;以及至少一第二線路,連接於該第一模組連接部與 該第三模組連接部之間;其中,該薄膜更具有一開槽,該開槽自該薄膜之該第一側或該第二側往該薄膜之內部延伸,使該薄膜之該第一側或該第二側具有一缺口或一斷口。 A touch display module includes: a first module; a second module disposed on the first module; a third module adjacent to the first module, the first module is located Between the second module and the third module; wherein the first module is a display panel, the second module is a touch panel, the third module is a motherboard; and a single-chip flexible circuit The single-chip flexible circuit board includes: a film having a first module connecting portion, a second module connecting portion, and a third module connecting portion, wherein the first module connecting portion, Each of the second module connecting portion and the third module connecting portion is disposed on a first side or a second side of the film, the first side is opposite to the second side, the first to the first The third module connecting portion is respectively connected to the first module, the second module and the third module; at least one first line is connected between the first module connecting portion and the second module connecting portion And at least one second line connected to the first module connection portion and Between the third module connecting portions, wherein the film further has a slot extending from the first side or the second side of the film toward the inside of the film to make the first film The side or the second side has a gap or a fracture.
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