M399404 五、新型說明： Λ 【新型所屬之技術領域]， 本創作係有關於一^藉费1工如_ > *r II ^xa JT ® 裡電子數位資料處理之周邊設 備，特別是有關於一種 里啊控面板之驅動模組。 【先前技術】M399404 V. New description: Λ [New technical field], this creation department has peripheral equipment for processing electronic digital data in _ > *r II ^xa JT ® , especially about A driving module for the control panel. [Prior Art]
科技逐日地進步’各式各樣的電子產品不斷發展至 今，都紛紛有了更不同以往的面貌。其中許多消費性電 子產A大顯自身的便利性’都紛紛採用觸控面板。所 謂的觸控面板係在顯示器上安裝—觸控面板並使該觸 控面板具有獨立的運算控制系統，可以判斷使用者壓觸 的位置，進而提供予顯示器的運算控制系統，作為執行 指令功能之依據。常用的觸控面板依照構造和感測方式 的不同可區刀為電阻式觸控面板電容式觸控面板。目 二β市场中成本為重或偏重各人使用層面應用的部分通 、電阻式觸控面板為主，但與電容式觸控面板相較 — 電令式觸控面板表現出更良好之性能，而正逐漸 獲知更多的關注與採用。 一般而言，雷阳4 Λ和， 電阻式觸控面板包含一片標準的玻璃面 板’上面覆蓋_值进 傅導層和一電阻金屬層，並且在兩層之 間以間隔器 —▲ ° 雕。在導電之後，使得電流能夠在兩層間 流動。最德合# 无嘗將—保護層覆蓋在玻璃面板之上。當使用 者壓觸面板時，# & 、 傳導層和電阻金屬層會接觸在一起1導 致電場改變而14 ’ W β、 极，·己錄為一接觸事件，再將訊號傳送到控 制Is進行處理。 电合式觸控面板採用的是一電容感測 3 M399404 器。當使用者接觸面板時’會有連續的電流通過感測器， 使感測器能夠準確地在水平·和垂直方向儲存電子，形成 • 一精密控制的電容場。當感測器的「正常」電容場被另 . 外一個電容場所改變時’表示手指已接觸到不同的位 置，這時面板每個角落中的電路就會計算出電場的改變 程度’然後將此接觸事件訊號傳送到控制器進行處理。 無論是採用何種形式的觸控面板必然都需要裝載適 • 當的驅動模組，以進行控制所屬的觸控面板。為了要使 電子產品能符合輕薄短小之要求，並降低產品的材料損 耗’進而使得觸控面板在設計上也必須更加地輕薄。所 以，以往的驅動模組通常係以軟性電路基板作為載板， 並搭載積體電路、電阻、電容等元件。之後依照所屬之 觸控面板或電子產品之空間限制而改變形狀，甚至彎折 軟性電路基板以導電接合至不同導電基板，例如我國專 利公開編號200949341號「内建觸控板暨整合電路的液 • 晶面板」與公開編號201003480號「具觸控控制震置之 顯示模組及其觸控顯示系統」。其中，觸控面板與顯示器 之間係藉由一軟性電路基板作連接，但由於軟性電路基 板係被彎折成U形，根本無法將驅動模組整合於軟性電 路基板上，而必須將驅動元件與相關被動元件設置於軟 性電路基板以外的其它部件，例如玻璃導電基板或顯示 基板，而軟性電路基板僅作為導電基板之間電性連接元 件。雖然軟性電路基板本身即具有可撓性與可三度空間 S己線之特性’但欲搭載於軟性電路基板上的各種電子零 4 M399404 件卻是無法隨軟性電路基板之彎折而改變形狀。因此， 倘若彎折以往的軟性電路基·板以導電接合至不同導電基 板’將會使軟性電路基板上所搭載之電子零件受到損 害’甚至造成報廢而增加了製造成本。 【新型内容】 為了解決上述之問題’本創作之主要目的係在於提供 一種觸控面板之驅動模組，在裝載驅動模組時毋須彎折 軟性電路基板，即可使得位於軟性電路基板同一表面之 接觸指分別導電接合至不同導電基板，進而使觸控積體 電路可覆晶結合於軟性電路基板上而不會有凸塊銲點斷 裂之問題’故達到驅動模組整合於一軟性電路基板之功 效。 本創作之再一目的係在於提供一種觸控面板之驅動 模組，將觸控積體電路覆晶接合於軟性電路基板，省略 了以往封膠體之設置，可薄化整體厚度與降低製造成本。 本創作的目的及解決其技術問題是採用以下技術方 案來實現的。本創作揭示一種觸控面板之驅動模組，包 含一軟性電路基板、一觸控積體電路、複數個被動元件、 複數個第一接觸指以及複數個第二接觸指。該軟性電路 基板係包含一晶片設置區以及位於同一側邊之一第一接 指區與一第二接指區。該觸控積體電路係覆晶接合於該 晶片設置區内。該些被動元件係設置於該晶片設置區之 周邊。該些第一接觸指係設置於該第一接指區。該些第 一接觸指係設置於該第二接指區。其中，在該第一接指 5 M399404 區與該第二接指區之間係形成有一第一開槽，使該些第 一接觸指與該些第二接觸指.分別可供不同導電基板之導 電接合。 本創作的目的及解、土甘# 解决其技術問題還可採用以下技術 措施進一步實現。 在前述的驅動模組中，該軟性電路基板係可具有一電 路圖案，係電性連接該些第一接觸指與該些第二接觸指 至該觸控積體電路。 在前述的驅動模組中，該觸控積體電路、該些第一接 觸柏與該些第二接觸指係可位於該軟性電路基板之同— 表面。 在前述的驅動模纟且中，該軟性電路基板可另具有一延 伸區’該延伸區之-侧邊形成有—第三接指區與一第四 接才曰區並且於該第二接指區與該第四接指區之間係形 成有一第二開槽。 、由以上技術方案可以看出，本創作之驅動模組，具有 以下優點與功效： 一、可藉由軟性電路基板、第一接觸指以及第二接觸指 之特定組合關係作為其中之_技術手段，由於第_ 與第二接觸指係分別設置於軟性電路基板同一側邊 之第-與第二接指區’並且在第一與第二接指區之 間形成有一開槽。因此，在裝載驅動模組時毋須彎 折軟性電路基板，即可使得位於軟性電路基板同一 表面之接觸指分別導電接合至不同導電基板，進而 6 M399404 使觸控積體電路可覆晶結合於軟性電路基板上而不 會有凸塊銲點斷裂之問·題，故達到驅動模組整合於 - 一軟性電路基板之功效。 二、可藉由軟性電路基板與觸控積體電路之特定組合關 係作為其中之一技術手段，由於將觸控積體電路覆 晶接合於軟性電路基板，故可省略了以往封膠體之 設置’進而薄化整體厚度與降低製造成本。 I 【實施方式】 以下將配合所附圖示詳細說明本創作之實施例，然應 注意的是，該些圖示均為產品之示意圖，所顯示者為實 際實施之形狀及尺寸比例’僅作為一種選置性之具體設 計’以提供更清楚的描述。在不同應用的等效性實施例 中’兀件的形狀、尺寸與數量皆可進行縮小、放大或是 簡化。 依據本創作之第一具體實施例，一種觸控面板之驅動 • 模組舉例說明於第1圖之上視示意圖與第2圖之立體示 意圖。該驅動模組100係包含一軟性電路基板n〇、一 觸控積體電路120、複數個被動元件13〇、複數個第一接 觸指140以及複數個第二接觸指150。 请參閱第1與2圖所示，該軟性電路基板11〇係包含 一晶片設置區111與位於同一侧邊之一第一接指區i 12 與一第二接指區113。詳細而言，該軟性電路基板 llOiflexible printed Circuit，FPC)可簡稱為軟板，其係在 可撓性基材上作線路佈置，以作為電子產品訊號傳輸之 M399404 媒介 〇 户 、 任~較佳實施例中’該軟性電路基板11 0之形狀 1 系 jtot σ γ ， 型’並且該晶片設置區111係位於該軟性電Technology has progressed day by day. 'A wide variety of electronic products have been developed all the time, and they all have a different look. Many of these consumer electronics products have their own conveniences, and they all use touch panels. The so-called touch panel is mounted on the display-the touch panel and the touch panel has an independent computing control system, which can determine the position of the user's pressure contact, and then provide the operation control system of the display as a function of executing the command. in accordance with. The commonly used touch panel can be a resistive touch panel capacitive touch panel according to different configurations and sensing methods. In the second market, the part of the beta market is mainly cost-sensitive or biased, and the resistive touch panel is mainly used. However, compared with the capacitive touch panel, the electric touch panel exhibits better performance. Gradually know more attention and adoption. In general, the Rayyang 4 Λ, the resistive touch panel consists of a standard glass panel that is covered with a value of a fusible layer and a resistive metal layer, and is engraved with a spacer - ▲ ° between the two layers. After conduction, current is allowed to flow between the two layers. Most German ## Nothing will be—the protective layer is covered on the glass panel. When the user presses the panel, the # & , the conductive layer and the resistive metal layer will be in contact with each other 1 causing the electric field to change and 14 ' W β, Pole, · have been recorded as a contact event, and then the signal is transmitted to the control Is for deal with. The electro-acoustic touch panel uses a capacitive sensing 3 M399404 device. When the user touches the panel, there is a continuous current passing through the sensor, enabling the sensor to accurately store electrons horizontally and vertically, forming a precisely controlled capacitive field. When the "normal" capacitance field of the sensor is changed by another capacitor location, 'the finger has touched a different position, then the circuit in each corner of the panel calculates the degree of change of the electric field' and then the contact event The signal is sent to the controller for processing. No matter what form of touch panel is used, it is necessary to load the appropriate driver module to control the touch panel. In order to make electronic products meet the requirements of light and thin, and reduce the material loss of the product, the touch panel must be designed to be lighter and thinner. Therefore, in the conventional drive module, a flexible circuit board is usually used as a carrier, and an integrated circuit, a resistor, a capacitor, and the like are mounted. Then, according to the space limitation of the touch panel or the electronic product, the shape is changed, and even the flexible circuit substrate is bent to be electrically conductively bonded to different conductive substrates. For example, the patent of the built-in touch panel and integrated circuit is disclosed in Chinese Patent Publication No. 200949341. "Crystal Panel" and Publication No. 201003480 "Display Module with Touch Control and Its Touch Display System". Wherein, the touch panel and the display are connected by a flexible circuit substrate, but since the flexible circuit substrate is bent into a U shape, the driving module cannot be integrated on the flexible circuit substrate, and the driving component must be The related passive components are disposed on other components than the flexible circuit substrate, such as a glass conductive substrate or a display substrate, and the flexible circuit substrate serves only as an electrical connection component between the conductive substrates. Although the flexible circuit board itself has the characteristics of flexibility and three-dimensional space S, the various electronic components of the electronic circuit board that are to be mounted on the flexible circuit board cannot be changed in shape depending on the bending of the flexible circuit board. Therefore, if the flexible circuit board and the board are bent to be electrically bonded to different conductive substrates, the electronic components mounted on the flexible circuit board will be damaged, and the manufacturing cost will be increased even if it is scrapped. [New content] In order to solve the above problems, the main purpose of the present invention is to provide a driving module for a touch panel. When the driving module is loaded, it is not necessary to bend the flexible circuit substrate, so that the same surface of the flexible circuit substrate can be located. The contact fingers are electrically conductively bonded to different conductive substrates, so that the touch integrated circuit can be flip-chip bonded to the flexible circuit substrate without the problem of bump solder joint breakage. Therefore, the driving module is integrated into a flexible circuit substrate. efficacy. A further object of the present invention is to provide a driving module for a touch panel, which is formed by flip-chip bonding a touch integrated circuit to a flexible circuit substrate, omitting the installation of the conventional sealing body, thereby thinning the overall thickness and reducing the manufacturing cost. The purpose of this creation and solving its technical problems are achieved by the following technical solutions. The present invention discloses a driving module for a touch panel, comprising a flexible circuit substrate, a touch integrated circuit, a plurality of passive components, a plurality of first contact fingers, and a plurality of second contact fingers. The flexible circuit substrate includes a wafer placement area and a first contact area and a second contact area on the same side. The touch integrated circuit is flip-chip bonded to the wafer placement region. The passive components are disposed around the wafer placement area. The first contact fingers are disposed in the first finger region. The first contact fingers are disposed in the second finger region. A first slot is formed between the first finger 5 M399404 region and the second finger region, so that the first contact fingers and the second contact fingers are respectively available for different conductive substrates. Conductive bonding. The purpose and solution of this creation, Tu Gan # solve its technical problems can also be further realized by the following technical measures. In the above-mentioned driving module, the flexible circuit substrate can have a circuit pattern electrically connecting the first contact fingers and the second contact fingers to the touch integrated circuit. In the foregoing driving module, the touch integrated circuit, the first contact cymbals and the second contact fingers may be located on the same surface of the flexible circuit substrate. In the foregoing driving module, the flexible circuit substrate may further have an extension region, the side portion of the extension region is formed with a third connection finger region and a fourth connection region, and the second connection finger A second slot is formed between the zone and the fourth finger zone. It can be seen from the above technical solutions that the driving module of the present invention has the following advantages and effects: 1. The specific combination relationship of the flexible circuit substrate, the first contact finger and the second contact finger can be used as a technical means. The first and second contact fingers are respectively disposed on the first and second finger regions of the same side of the flexible circuit substrate and a slot is formed between the first and second finger regions. Therefore, when the driving module is loaded, it is not necessary to bend the flexible circuit substrate, so that the contact fingers on the same surface of the flexible circuit substrate are electrically conductively bonded to different conductive substrates, and the 6 M399404 enables the touch integrated circuit to be laminated and softened. On the circuit board, there is no problem of bump solder joint breakage, so the drive module is integrated into a soft circuit substrate. Secondly, the specific combination relationship between the flexible circuit substrate and the touch integrated circuit can be used as one of the technical means. Since the touch integrated circuit is flip-chip bonded to the flexible circuit substrate, the setting of the conventional sealant can be omitted. Further thinning the overall thickness and reducing the manufacturing cost. [Embodiment] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, and it should be noted that these drawings are schematic views of the products, and the actual shapes and sizes are shown as 'only A specific design of selectivity' to provide a clearer description. In the equivalent embodiment of the different applications, the shape, size and number of the components can be reduced, enlarged or simplified. According to a first embodiment of the present invention, a driving panel of a touch panel is illustrated in a top view of the first drawing and a perspective view of the second drawing. The driving module 100 includes a flexible circuit substrate n, a touch integrated circuit 120, a plurality of passive components 13A, a plurality of first contacts 140, and a plurality of second contacts 150. Referring to Figures 1 and 2, the flexible circuit substrate 11 includes a wafer mounting region 111 and a first finger region i 12 and a second finger region 113 on the same side. In detail, the flexible circuit board (FPC) can be simply referred to as a soft board, which is arranged on a flexible substrate as a line for the transmission of electronic product signal M399404 media. In the example, the shape 1 of the flexible circuit substrate 110 is jtot σ γ , the type ' and the wafer setting area 111 is located in the soft electric
板11〇之—端。該晶片設置區111係可用以設置各 種電子零件，例如：積體電路晶片、電阻器、電容器、 連、’„器等元件。在一較佳型態中該晶片設置區111之 側緣係可形成為圓弧狀，以使該軟性電路基板1 1 〇能 士應於欲裝载之觸控面板。或者纟一變化例中，該晶 片設置區1U亦可變化為其它形狀，以對應各種不同形 狀之觸控面板。在本實施例中，該第一接指區112與該 =二接指區113之表面係可設有金手指，以使該第一接 扎區112與該第二接指區113作為該軟性電路基板ιι〇 對外導電接合之部位。 該觸控積體電路120係覆晶接合於該晶片設置區m 内。在該驅動模組1〇〇裝載至一觸控面板（圖中未繪出， 容後詳述）之後，該觸控積體電路120之主要作用係用以 控制該觸控面板。在一較佳型態中，該觸控積體電路12〇 係可藉由熱壓合方式達成與該軟性電路基板11〇之覆晶 接合關係。此-結構將不需要封裝構造之設置，可薄化 整體厚度，更減少材料使用量，進而降低了製造成本。 此外H化型態中’如第5圖所示，亦可利用傳統 C〇B(chiP on board)製程形成一封膠體18〇於該軟性電路 基板11〇上，以密封該觸控積體電路12〇，並把該觸控 積體電路所有的對外接腳全部包覆在該封膠體18〇 之内，以避免濕氣侵入與外力破壞。該些被動it件130 8 係6又置於該晶片設置區111之周邊。一般而言，該些被 動元件130係可為電容器（resistor)、電阻器（capacit〇r) 與電感器（inductor)之其中之一或者為上述之組合，主要 作為用以儲存能量或消耗能量之元件，並能達成電子迴 路控制之功能。 該些第一接觸指140係設置於該第一接指區112，而 該些第二接觸指150係設置於該第二接指區在本 實施例中，該些第一接觸指14〇與該些第二接觸指15〇 係可為相同的導電接合端部，並且可利用電鍍方式形成 於該第一接指區112與該第二接指區113。在一較佳型 態中，該些第一接觸指14〇之配置數量係可大於該些第 二接觸指150之配置數量，以能對應於不同之基板需 求。具體而言，該觸控積體電路12〇、該些第一接觸指 1 40與該些第二接觸指！ 5〇係可位於該軟性電路基板^ 〇 之同一表面，故在製程中毋須翻轉該軟性電路基板ιι〇 印可輕易完成設置，以簡化製程步驟。或者，該觸控積 體電路12〇、該些第一接觸指14〇與該些第二接觸指15〇 亦可设置於該軟性電路基板11〇之不同表面，例如：該 觸控積體電路120係位於該軟性電路基板11〇之上The board 11 is the end. The wafer setting area 111 can be used to set various electronic parts, such as integrated circuit chips, resistors, capacitors, connectors, etc. In a preferred form, the side edge of the wafer setting area 111 can be It is formed in an arc shape so that the flexible circuit substrate 1 1 can be applied to the touch panel to be mounted. Alternatively, in the variation, the wafer setting area 1U can be changed to other shapes to correspond to various shapes. The touch panel of the shape. In the embodiment, the surface of the first finger region 112 and the second finger region 113 can be provided with a gold finger, so that the first connection region 112 and the second connection The finger 113 is a portion of the flexible circuit substrate that is electrically conductively bonded to the substrate. The touch integrated circuit 120 is flip-chip bonded to the chip mounting region m. The driving module 1 is mounted on a touch panel ( The main function of the touch integrated circuit 120 is to control the touch panel. In a preferred embodiment, the touch integrated circuit 12 can be used. The flip-chip bonding with the flexible circuit substrate 11 is achieved by thermocompression bonding Relationship: This structure will not require the installation of the package structure, which can reduce the overall thickness and reduce the amount of material used, thereby reducing the manufacturing cost. In addition, in the H-type, as shown in Figure 5, the conventional C can also be utilized. The PB (chiP on board) process forms a gel 18 on the flexible circuit substrate 11 , to seal the touch integrated circuit 12 〇 and completely wrap all the external pins of the touch integrated circuit Within the sealing body 18〇, to avoid moisture intrusion and external force destruction, the passive components 130 8 are placed in the periphery of the wafer setting area 111. In general, the passive components 130 can be One of the capacitors, capacitors, and inductors, or a combination thereof, is mainly used as an element for storing energy or consuming energy, and can realize the function of electronic loop control. The first contact fingers 140 are disposed on the first finger region 112, and the second contact fingers 150 are disposed in the second finger region. In the embodiment, the first contact fingers 14 Some of the second contact fingers 15 can be the same The first contact region 112 and the second finger region 113 are formed by electroplating. In a preferred embodiment, the number of the first contact fingers 14〇 can be greater than The number of the second contact fingers 150 is configured to correspond to different substrate requirements. Specifically, the touch integrated circuit 12, the first contact fingers 140 and the second contact fingers! The lanthanide system can be located on the same surface of the flexible circuit substrate, so that the flexible circuit board can be easily flipped in the process to easily complete the process, thereby simplifying the process steps. Alternatively, the touch integrated circuit 12〇, the first A contact finger 14 〇 and the second contact fingers 15 〇 can also be disposed on different surfaces of the flexible circuit substrate 11 , for example, the touch integrated circuit 120 is located on the flexible circuit substrate 11 〇
該觸控積體電路120 β 係可具有一單層或多層之電路圖案115，係 由第一接觸指140與該些第二接觸指15〇至 t路120。該電路圖# "5係可形成於該軟 M399404 性電路基板110之一表面，即，設置有該觸控積體電路 120、該些該些第一接觸指140與該些第二接觸指150 之同一表面。在一較佳實施例中，該電路圖案11 5係可 由一種選自碳納米管（Carbon Nano-Tube)、銦錫氧化物 (Indium Tin Oxide, IT0)、銦鋅氡化物（indium Zinc Oxide， IZO)、氧化銦、氧化錫以及氧化辞戶斤組成的組群材料， 或者以金 '銅、鉬、鋁、銳以及其合金所製成。 特別的是，在該第一接指區112與該第二接指區ι13 之間係形成有一第一開槽11 4，使該些第一接觸指i 4 〇 與該些第二接觸指150分別可供不同導電基板之導電接 合。在一較佳型態中，該第一開槽丨丨4係由該軟性電路 基板1 1 0之邊緣朝向該晶片設置區1丨丨内延伸，而呈現 為一 U型缺口 ’但不阻斷位於該晶片設置區n丨内之線 路。在一較佳實施例中，該第一開槽丨14向内延伸之長 度係可不小於該些第一接觸指14〇與該些第二接觸指 15〇之長度，故可避免該第一開槽114影響了該些第_ 接觸指140與該些第二接觸指15〇之導電接合。 在本創作中，可藉由該軟性電路基板n〇、該些第— 接觸指140與該些第二接觸指15〇之特定組合關係作為 其中之—技術手段，由於該些第一接觸指14〇與該些第 二接觸指150係分別設置於該軟性電路基板11〇同一側 邊之該第一接指區112與該第二接指區113，並且在該 些第一接指區112與該些第二接指區113之間形成有該 第開槽U4。因此，在裝載該驅動模組1 〇〇時毋須彎 10 折該軟性電路基板1 i Ο，即可使得位於該軟性電路基板 110同一表面之接觸指14〇與15〇分別導電接合至不同 導電基板，進而使該觸控積體電路12〇可覆晶結合於該 軟性電路基板11 〇上不會有凸塊銲點斷裂之問題，故達 到驅動模組整合於一軟性電路基板之功效。 再μ參閱第1與2圖所示，該軟性電路基板1丨〇可另 具有一延伸區1丨6,該延伸區116之一側邊形成有一第 三接指區117與一第四接指區118，並且於該第三接指 區11 7與該第四接指區11 8之間係形成有一第二開槽 119»在本實施例中，該第三接指區117與該第四接指區 11 8亦可分別設置有複數個第三接觸指1 6 〇與複數個第 四接觸指170。該些第三接觸指16〇與該些第四接觸指 170亦可利用電鍍方式形成，故該些接觸指14〇、 160、170皆可在同一製程步驟中完成。在一較佳型態 中’該些第三接觸指160與該些第四接觸指17〇之配置 數置係可分別相等於該些第二接觸指15〇與該些第一接 觸指140之配置數量，並且該些第一接觸指14〇與該些 第四接觸指170係導電接合至同一基板，而該些第二接 觸指150與該些第三接觸指16〇係導電接合至另一基 板。此外，該軟性電路基板110可另具有一排線區116Α， 該排線區11 6Α係由該延伸區116未形成有該些接指區 11 7與1 1 8之另一側邊向外延伸，以使該驅動模組1 〇〇 可電性連接至一外部顯示器（圖中未繪出）。 清參閱第3與4圖所示’其為本創作之驅動模組1 〇〇 M399404 裝載於一觸控面板ίο時之上視示意圖與立體示意圖。該 觸控面板10係包含有一外棰U、一第一導電基板12與 一第二導電基板13。該外框11係具有一顯露表面Ua 與一裝載面lib’其中該顯露表面lla係為該觸控面板 10展示於外之外觀表面’該裝載面llb則作為該觸控面 板10用以設置電子零件之表面。該第一導電基板12係 黏合於該外框11之該裝載面llb，並且於該第一導電基 板12之一側邊形成有複數個第一接合區i2a。該第二導 電基板13係平貼設置於該第一導電基板12上，而使得 該第一導電基板12介於該第二導電基板13與該外框η 之間’並且該第二導電基板丨3之一側邊形成有複數個第 二接合區13a。具體而言，該些第一接合區12a係較該 些第二接合區13a接近於該觸控面板1〇之中央部位，以 能分別對應於該驅動模組1 〇 〇之該些接指區丨丨3、丨丨7。 當該驅動模組100裝載至該觸控面板時，在該些接指 區113、117之該些第二接觸指15〇與該些第三接觸指 160則導電接合至該第一導電基板12之該些第一接合區 12a ’而藉由該些開槽丨14與丨19的錯開，該驅動模組 100在其餘接指區112、118之該些第一接觸指140與該 些第四接觸指170係可導電接合至該第二導電基板13 之該些第二接合區13a，並且不會相互影響彼此的訊號 傳遞功能。 再請參閱第4圖所示，雖然該第一導電基板12與該 第二導電基板13係為上下兩層之不同結構，但由於本創 ----. 12 M399404 作之驅動模組100之該些接指區n2、113、117、118係 、。：開槽11 4肖1 1 9錯開，可以插接至該觸控面板】〇 不同導電基板之該些接合區12a、13a。因此’在裝載時 毋須¥折该軟性電路基板丨丨〇之該晶片設置區1 1 1與該 延伸區116，即可使該些接觸指140、150、160、170與 該些導電基板12、13達成導電接合之關係，並能夠^The touch integrated circuit 120 can have a single or multiple circuit pattern 115, which is connected by the first contact finger 140 and the second contact fingers 15 to the t 120. The circuit diagram # "5 can be formed on one surface of the soft M399404 circuit substrate 110, that is, the touch integrated circuit 120, the first contact fingers 140 and the second contact fingers 150 are disposed. The same surface. In a preferred embodiment, the circuit pattern 11 5 may be selected from the group consisting of carbon nanotubes (Carbon Nano-Tube), indium tin oxide (IT0), indium zinc oxide (indium Zinc Oxide, IZO). ), indium oxide, tin oxide, and a group of materials consisting of oxidized reciprocal jin, or made of gold 'copper, molybdenum, aluminum, sharp, and alloys thereof. In particular, a first slot 11 4 is formed between the first finger region 112 and the second finger region ι13, such that the first contact fingers i 4 〇 and the second contact fingers 150 Conductive bonding of different conductive substrates respectively. In a preferred embodiment, the first slotted slot 4 extends from the edge of the flexible circuit substrate 110 to the inside of the wafer setting area 1 and presents a U-shaped notch but does not block A line located in the wafer setting area n丨. In a preferred embodiment, the length of the first slot 14 extending inwardly is not less than the length of the first contact fingers 14 〇 and the second contact fingers 15 ,, so the first opening can be avoided. The slot 114 affects the conductive engagement of the first contact fingers 140 with the second contact fingers 15A. In the present invention, a specific combination relationship of the flexible circuit substrate n, the first contact fingers 140 and the second contact fingers 15 is used as a technical means, since the first contact fingers 14 And the second contact fingers 150 are respectively disposed on the first finger region 112 and the second finger region 113 on the same side of the flexible circuit substrate 11 , and in the first finger regions 112 and The first opening U4 is formed between the second finger regions 113. Therefore, when the driving module 1 is mounted, the flexible circuit substrate 1 i Ο is bent 10 times, so that the contact fingers 14 〇 and 15 位于 on the same surface of the flexible circuit substrate 110 are electrically bonded to different conductive substrates, respectively. Therefore, the touch integrated circuit 12 can be flip-chip bonded to the flexible circuit substrate 11 without the problem of bump solder joint breakage, so that the driving module is integrated into a flexible circuit substrate. Referring to FIGS. 1 and 2, the flexible circuit substrate 1 can further have an extension region 1丨6, and a side of the extension region 116 is formed with a third finger region 117 and a fourth finger. a second slot 119 is formed between the third finger region 11 7 and the fourth finger region 11 8 . In this embodiment, the third finger region 117 and the fourth portion The finger region 11 8 may also be provided with a plurality of third contact fingers 16 6 〇 and a plurality of fourth contact fingers 170, respectively. The third contact fingers 16 and the fourth contact fingers 170 can also be formed by electroplating, so that the contact fingers 14 〇, 160, 170 can be completed in the same process step. In a preferred embodiment, the number of the third contact fingers 160 and the fourth contact fingers 17A can be equal to the second contact fingers 15 and the first contact fingers 140, respectively. The number of the first contact fingers 14 and the fourth contact fingers 170 are electrically connected to the same substrate, and the second contact fingers 150 are electrically conductively bonded to the third contact fingers 16 to another Substrate. In addition, the flexible circuit board 110 may further have a line area 116Α, and the line area 16 6 is extended outward from the other side of the extension area 116 where the finger areas 11 7 and 1 18 are not formed. So that the driving module 1 can be electrically connected to an external display (not shown). See Figures 3 and 4 for details. The drive module 1 〇〇 M399404 is a top view and a perspective view of a touch panel. The touch panel 10 includes an outer casing U, a first conductive substrate 12 and a second conductive substrate 13. The outer frame 11 has a display surface Ua and a loading surface lib', wherein the exposed surface 11a is an appearance surface of the touch panel 10. The loading surface 11b is used as the touch panel 10 for setting the electronic The surface of the part. The first conductive substrate 12 is adhered to the loading surface 11b of the outer frame 11, and a plurality of first bonding regions i2a are formed on one side of the first conductive substrate 12. The second conductive substrate 13 is disposed on the first conductive substrate 12 such that the first conductive substrate 12 is interposed between the second conductive substrate 13 and the outer frame η and the second conductive substrate 丨One of the sides 3 is formed with a plurality of second land portions 13a. Specifically, the first bonding regions 12a are closer to the central portion of the touch panel 1A than the second bonding regions 13a, so as to be respectively corresponding to the connecting regions of the driving module 1丨丨3, 丨丨7. When the driving module 100 is loaded to the touch panel, the second contact fingers 15 〇 and the third contact fingers 160 of the plurality of finger regions 113 , 117 are electrically conductively bonded to the first conductive substrate 12 . The first lands 14a ′ are separated from the 丨 19 by the slotted 丨 14 and the 丨 19 , and the first contact fingers 140 of the driving module 100 in the remaining finger regions 112 , 118 and the fourth The contact fingers 170 are electrically conductively bonded to the second land portions 13a of the second conductive substrate 13 and do not affect each other's signal transfer functions. Referring to FIG. 4 again, although the first conductive substrate 12 and the second conductive substrate 13 are different structures of the upper and lower layers, the drive module 100 is used by the present invention---- 12 M399404. The finger regions n2, 113, 117, and 118 are. : Slots 11 4 XI 1 1 9 are staggered, and can be plugged into the touch panel 〇 接合 the different junction areas 12a, 13a of the conductive substrate. Therefore, the mounting fingers 140, 150, 160, 170 and the conductive substrate 12 can be made by folding the flexible circuit substrate 晶片 the wafer setting area 112 and the extension region 116 during loading. 13 reached the relationship of conductive bonding, and can ^
位於該aW設置區⑴與該延伸區116之電子零件因弯 折而受損或報廢。 以上所迷，僅是本創作的較佳實施例而已，並非對本 創作作任何形式上的限制，隸本創作已以較佳實施例 揭露如上，然、而並非用以限定本創作，任何熟悉本項技 術者，在不脫離本創作之申請專利範圍内所作的任和 簡單修改、等效性變化與修飾，皆涵蓋於本創作的技^ 範圍内。 ^ 【圖式簡單說明】 第1圖：依據本創作之—具體實施例的_種驅動模組之 上視示意圖。 第2圖：依據本創作之一具體實施例的驅動模組之立體 示意圖。 第3圖：依據本創作之一具體實施例的驅動模組裝載於 觸控面板時之上視示意圖。 第4圖：依據本創作之一具體實施例的驅動模組裳載於 觸控面板時之立體示意圖。 第5圖：依據本創作之一具體實施例的驅動模 13 M399404 化例中之上視示意圖。· 【主 要元 件 符 號說 明】 10 觸 控 面 板 11 外 框 11a 顯露表面 lib 裝' 载面 12 第 一 導 電 基板 12a 第一 接 合 區 13 第 二 導 電 基板 13a 第二 接 合 區 100 驅 動 模 組 110 軟 性 電 路 基板 111 晶 片 設 置 區 112 第一接指 區 113 第二 接 指 區 114 第 一 開 槽 115 電路圖案 116 延 伸 區 116A 排線區 117 第 二 接 指 區 118 第四接指 區 119 第二 .開 槽 120 觸 控 積 體 電路 130 被動 丨元 件 140 第 一 接 觸 指 150 第二接觸 指 160 第 三 接 觸 指 170 第四接觸 指 180 封膠體 14The electronic components located in the aW setting area (1) and the extension area 116 are damaged or scrapped due to bending. The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way. The present invention has been disclosed in the preferred embodiments as above, but is not intended to limit the creation, any familiarity. Any and all modifications, equivalent changes, and modifications made by those skilled in the art without departing from the scope of the present invention are covered by the scope of the present invention. ^ [Simple description of the drawing] Fig. 1 is a top view of a driving module according to the present invention. Figure 2 is a perspective view of a drive module in accordance with one embodiment of the present invention. Fig. 3 is a top plan view of a driving module according to a specific embodiment of the present invention when mounted on a touch panel. Fig. 4 is a perspective view showing a driving module according to a specific embodiment of the present invention when it is carried on a touch panel. Fig. 5 is a top plan view of a driving mode according to a specific embodiment of the present invention. · [Main component symbol description] 10 Touch panel 11 outer frame 11a exposed surface lib mounted 'carrier surface 12 first conductive substrate 12a first bonding region 13 second conductive substrate 13a second bonding region 100 driving module 110 flexible circuit substrate 111 wafer setting area 112 first finger area 113 second finger area 114 first slot 115 circuit pattern 116 extension area 116A line area 117 second finger area 118 fourth finger area 119 second. slot 120 Touch integrated circuit 130 passive 丨 element 140 first contact finger 150 second contact finger 160 third contact finger 170 fourth contact finger 180 sealant 14