JP2011022931A - Input device and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an input device, in which each wiring section can be easily collected to one position while suppressing dislocation each between electrode patterns, compared with in the past, and a method for manufacturing the same. <P>SOLUTION: A continuous member 20 includes a first substrate 21; a second substrate 22 juxtaposed with the first substrate; a first electrode pattern 23 formed within an area of the first substrate and a second electrode pattern 24 formed within an area of the second substrate 22; electrode wiring sections 26 and 27 connected to the electrode patterns respectively; and a connecting section 25 protruded from a side surface of the second substrate in an integrated manner. Each electrode wiring section 26, 27 is extended from each electrode pattern to the surface of the connecting section 25, and all electrode pads 28 are collected on the same surface of the connecting section. The input device 10 is constituted by folding the continuous member 20 along a boundary part 29 so that the first substrate and the second substrate are overlapped with each other in the thickness direction. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an input device capable of detecting an input coordinate position, and more particularly to a base material structure and a wiring structure.

Conventionally, for example, a capacitive touch panel has been manufactured by the following method.
FIG. 8 is a process diagram showing a conventional method for manufacturing a capacitive touch panel.

  Fig.8 (a) shows a top view and first, as shown to Fig.8 (a), each transparent base material AC is prepared. The first transparent substrate A is a large substrate for forming a large number of first substrates 1, and forms a first electrode pattern (not shown) on the surface of each first substrate 1. In FIGS. 8A and 8B, some of the base material regions 1 to 3 are illustrated in a square shape, and a large number are formed by dotted lines.

  As shown in FIG. 8A, the second transparent base material B is a large base material for forming a large number of second base materials 2, and the second transparent base material B is formed on the surface of each second base material 2. A two-electrode pattern (not shown) is formed. As shown in FIG. 8A, the third transparent base material C is a large base material for forming a large number of third base materials 3, and the surface of each third base material 3 is shielded. A layer (not shown) is formed.

  And as shown in FIG.8 (b), each transparent base material AC is bonded together through a double-sided adhesive tape etc., and the base material laminated body 4 is formed.

  In the step of FIG. 8C (FIG. 8C shows a partially enlarged plan view of the substrate laminate 4 shown in FIG. 8B), a large number of electrodes formed on the substrate laminate 4 are formed. For each region 5 (each region in which each first base material 1, each second base material 2, and each third base material 3 are overlapped in the thickness direction), the base material laminate 4 is cut, thereby A large number of input devices 6 can be manufactured (cut along the dotted line in FIG. 8C).

  However, the conventional method for manufacturing an input device shown in FIG. 8 has the following problems. That is, as the size of each large transparent substrate A to C changes due to heat or humidity, the respective transparent substrates A to C are overlapped to form the substrate laminate 4 as shown in FIG. When it did, it became easy to produce shift | offset | difference between each transparent base materials AC. Since the transparent base materials A to C are large-sized base materials, even if the rate of change in size is small, the amount of change itself becomes large. It became easy to occur. Thereby, the positional deviation became large between each 1st base material 1, each 2nd base material 2, and each 3rd base material which should oppose by the thickness direction. Moreover, the positional shift was likely to increase more and more due to the bonding shift of the transparent substrates A to C. As a result, it becomes easy to manufacture the input device 6 in which the positional deviation occurs between each first electrode pattern formed on each first base material 1 and each second electrode pattern formed on each second base material 2. Yield decreased, production efficiency deteriorated.

  Moreover, after each transparent base material AC shown to Fig.8 (a) is separated into each of each 1st base material 1, each 2nd base material 2, and each 3rd base material 3, each 1st base material 1. If each 2nd base material 2 and each 3rd base material 3 are laminated | stacked, the above-mentioned problem of position shift can be suppressed, but each 1st base material 1, each 2nd base material 2, and Laminating each of the third base materials 3 is a very complicated process, and bonding misalignment tends to occur when laminating, and as a result, production efficiency could not be improved effectively.

  Moreover, in the manufacturing method of the input device 6 shown in FIG. 8, it forms integrally with the 1st base material 1, and the connection part 7 provided with the electrode wiring part connected to a 1st electrode pattern, and the 2nd base material 2 are integrated. A connection portion 8 that is formed and includes an electrode wiring portion that is connected to the second electrode pattern, and a connection portion 9 that is integrally formed with the third base material 3 and includes a shield wiring portion that is connected to the shield layer are shown in FIG. As shown in FIG.

  As described above, since there is a step in each of the connection portions 7 to 9, it is difficult to easily and stably perform electrical connection with the counterpart wiring board. In addition, for example, by providing through wiring on the base material, it is possible to route each wiring part on the same surface of the connection part from different base material heights. There is a problem that it cannot be formed in a wiring structure having a good electrical stability.

JP 2007-272644 A Special table 2003-511799 gazette

  The invention described in Patent Document 1 discloses an invention relating to a transparent touch panel formed by bending a transparent plastic substrate having a strip-shaped transparent conductor.

  However, the invention described in Patent Document 1 does not describe the wiring structure of the electrode wiring portion connected to the strip-shaped transparent conductor.

  In addition, the invention described in Patent Document 2 discloses an input device in which a base material provided with opposing electrode patterns and a base material provided with a shield layer are laminated. Patent Document 2 discloses, for example, an input device in which each electrode pattern is formed on the upper and lower surfaces of one substrate in FIG. 7 of Patent Document 2.

  However, in the structure in which the electrode patterns are formed on the upper and lower surfaces of the substrate as in Patent Document 2, the manufacturing process becomes complicated, and the positional shift between the electrode patterns facing each other via the equipment is likely to occur. In addition, the invention described in Patent Document 2 does not describe the wiring structure of the electrode wiring portion connected to each electrode pattern.

  Therefore, the present invention is to solve the above-described conventional problems, and in particular, compared to the conventional technique, the positional deviation between the electrode patterns is suppressed and each wiring part is easily integrated on the surface of the same connection part. It is an object of the present invention to provide an input device and a method for manufacturing the same.

The input device in the present invention is
In the developed shape, the first base material, the second base material provided in parallel with the first base material, and the first base material are formed on the same surface side and in the region of the first base material. A first electrode pattern and a second electrode pattern formed in a region of the second base material; an electrode wiring portion connected to the first electrode pattern and the second electrode pattern; the first base material and the first base material; A connecting portion formed integrally with either one of the two base materials, and a continuous member is configured,
Each electrode wiring part is formed to extend from each electrode pattern to the surface of the connection part, and the tip part of each electrode wiring part is concentrated on the surface of the connection part,
The connecting member is bent from a boundary portion between the first base material and the second base material, and the first base material and the second base material are overlapped in a thickness direction, and the connection The portion is exposed to the outside.

  In the present invention, the first base material and the second base material are arranged side by side and integrated, and the first electrode pattern and the second electrode pattern are formed in the region of each base material, respectively, The input device is configured by a continuous member that is bent from the boundary with the second base material and is arranged so that the first electrode pattern and the second electrode pattern face each other in the thickness direction. Therefore, even if a change in size due to heat, humidity, or the like occurs in the base material, the change in size between the adjacent first base material and the second base material is very small, so the connecting member is bent. Sometimes, the positional deviation between the first electrode pattern and the second electrode pattern facing each other can be effectively reduced.

  Moreover, in this invention, a 1st electrode pattern and a 2nd electrode pattern can be formed in the same continuous surface side of a 1st base material and a 2nd base material, and all the electrode wiring parts connected to each electrode pattern are said connection. It is possible to easily pull out to the surface of the part, and it is possible to easily and appropriately collect the electrode wiring parts on the surface of the same connection part. And the connection part which the front-end | tip part (electrode pad) of each electrode wiring part exposed on the surface when it bends from the boundary between a 1st base material and a 2nd base material can be formed.

  Therefore, the electrical connection with the counterpart wiring board can be reliably and easily performed. Moreover, since all the electrode wiring parts can be extended and formed on the same surface side which continued from the 1st base material or the 2nd base material to the connection part, the electrically stable wiring structure is securable.

In the present invention, the continuous member is provided with a third base material in parallel with the first base material and the second base material in a developed shape, and in the region of the third base material. A shield layer is formed on the same surface side where the first electrode pattern and the second electrode pattern are formed,
The connection part is formed integrally with any of the first base material, the second base material, and the third base material, and the tip of the shield wiring part connected to the shield layer is connected to each electrode wiring. Together with the surface of the connecting portion,
The connecting members are respectively connected from the respective boundary portions located between the first base material, the second base material, and the third base material so that the third base material including the shield layer is located outside. The first base material, the second base material, and the third base material may be folded and overlapped in the thickness direction.

  The third base material having the shield layer formed on the surface in this way is integrally formed with the first base material and the second base material, and at this time, the tip portion of the ground wiring portion is drawn together with the electrode wiring portion on the surface of the connection portion. Thus, all the wiring portions can be concentrated on the surface of the same connection portion. As a result, the positional deviation between the electrode patterns can be reduced, and a shielded input device having a wiring structure in which the tip portions (electrode pads) of all the wiring portions are concentrated on the surface of the same connection portion can be obtained. .

  Also, in the present invention, in the developed shape, the second base material is provided in the middle of the connecting member, the first base material and the third base material are provided on both sides of the second base material, The connecting portion is preferably formed integrally with the second base material. By forming the connecting portion so as to protrude from the side surface of the second base material provided in the middle, the length dimension difference of each wiring portion can be reduced.

  Moreover, in this invention, the number of the 2nd electrode wiring parts pulled out toward the surface of the said connection part from the surface of the said 2nd base material is toward the surface of the said connection part from the surface of the said 1st base material. It is preferable that the number of the first electrode wiring portions drawn out is larger than that of the first electrode wiring portions, and the connection portion is formed on a side surface of the second base material. Thereby, an electrode wiring part can be efficiently routed.

  Moreover, in this invention, the said connection member has the expansion | deployment shape in which each base material was juxtaposed in one direction, and the said connection part was formed in the side surface of the direction orthogonal to the alignment direction of each base material. Is preferred.

  Moreover, in this invention, it is preferable that bending auxiliary parts, such as a hole, a slit, and a recessed part, are provided in the boundary part between each base material. Thereby, the continuous member can be easily bent from the boundary portion.

In the present invention, the plurality of first electrode patterns are formed to extend in the first direction within the light-transmitting input region, and are spaced in the second direction orthogonal to the first direction. The plurality of second electrode patterns are formed so as to extend in the second direction in the light-transmitting input region and are spaced from each other in the first direction. ,
Each electrode wiring portion connected to the end portion of each electrode pattern can be preferably applied to a configuration in which the electrode wiring portion is routed to the connection portion through the outside of the input region.

The manufacturing method of the input device in the present invention is as follows.
A first base material, a second base material arranged side by side with the first base material, and a developed shape in which connection portions formed continuously with the first base material or the second base material are integrated. Prepare a base substrate with a size that allows multiple continuous members to be formed,
Forming the first electrode pattern in each region to be the first substrate on the same surface side of the base substrate, and forming the second electrode pattern in each region to be the second substrate; Forming an electrode wiring portion connected to each electrode pattern, and at this time, extending and forming the tip portions of all the electrode wiring portions into the respective regions serving as the connection portions;
Separating the base substrate into each continuous member;
Each connecting member is bent from the boundary between the first base material and the second base material, the first base material and the second base material are overlapped in the thickness direction, and the connection portion is exposed to the outside. The process of
It is characterized by having.

  According to the present invention, even if a change in size due to heat, humidity, or the like occurs in a base substrate having a size capable of forming a plurality of connecting members, the first base member adjacent to each other in each connecting member The change in size between the two base materials is very small, and when the first base material and the second base material are overlapped in the thickness direction, the first electrode pattern and the second electrode pattern facing each other are opposed to each other. Can be effectively reduced.

  Moreover, in this invention, a 1st electrode pattern and a 2nd electrode pattern can be formed in the same continuous surface side of the said 1st base material and the said 2nd base material at the same process, and each electrode wiring part can be formed at the same process It can be formed and the formation of the electrode pattern and the electrode wiring portion can be facilitated.

  Moreover, in this invention, all the electrode wiring parts connected to each electrode pattern can be integrated on the surface of the same connection part simply and appropriately.

Moreover, in this invention, the said connection member arranges the 3rd base material in parallel in addition to the said 1st base material and the said 2nd base material, and the said connection part is a said 1st base material and a said 2nd base material. Alternatively, it has a developed shape continuously formed on the third base material,
In each region to be the third base material, a shield layer is formed on the same surface side where the first electrode pattern and the second electrode pattern are formed, and the tip of each shield wiring part connected to the shield layer Part extending into each region to be the connecting part together with each electrode wiring part,
After separating the base base material into the continuous members, the continuous base members are bent from the boundary portions between the base materials so that the third base material is located outside, and the first base material is The second base material and the third base material are preferably overlapped in the thickness direction.

  Accordingly, a shielded input device having a wiring structure in which the positional deviation between the electrode patterns can be reduced and the tip portions (electrode pads) of all the wiring portions are concentrated on the surface of the same connecting portion is manufactured. Can do.

  In the present invention, the second base material is provided in the middle of the connecting member in a developed shape, the first base material and the third base material are provided on both sides of the second base material, and the connection portion is provided. It is preferable to integrally form the second base material. By forming the connecting portion from the side surface of the second base material provided in the middle, the length dimensional difference of each wiring portion can be reduced.

  Moreover, in this invention, the number of the 2nd electrode wiring parts pulled out toward the surface of the said connection part from the surface of the said 2nd base material is toward the surface of the said connection part from the surface of the said 1st base material. It is preferable that the number of the first electrode wiring portions drawn out is greater than the number of the first electrode wiring portions, and the connection portions are integrally formed on the second base material. Thereby, an electrode wiring part can be efficiently routed.

  In the present invention, the connecting members in the base substrate are arranged such that each substrate is arranged in one direction, and the connection portion is formed on a side surface in a direction orthogonal to the arrangement direction of the substrates. It is preferable to form in a developed shape.

  Moreover, in this invention, it is preferable to form bending auxiliary parts, such as a hole, a slit, and a recessed part, in the boundary part of the said continuous member, and bend | fold the said continuous member after that. Thereby, the said continuous member can be bent easily and appropriately.

  According to the present invention, it is possible to reduce the positional deviation between the electrode patterns and to collect all the wiring parts on the surface of the same connection part, and to obtain an input device having an electrically stable wiring structure. it can.

FIG. 3 is a development view (plan view) of a continuous member constituting the input device of the first embodiment; The top view of the input device formed by bending the continuous member shown in FIG. A longitudinal sectional view of the input device of the first embodiment, FIG. 3 is a development view (plan view) of continuous members constituting the input device according to the second embodiment; The longitudinal cross-sectional view of the input device of 2nd Embodiment, FIG. 5 is a process diagram for explaining a manufacturing process of the input device in the present embodiment, a plan view of a base substrate, The perspective view for demonstrating a bending process of a continuous member, The figure for demonstrating the conventional input device ((a) is a top view, (b) is a perspective view, (c) shows an enlarged plan view), The longitudinal cross-sectional view of the conventional input device.

  The input device according to the present embodiment is a static detection device that detects the operation coordinate position of a finger based on, for example, a change in capacitance that occurs between the upper electrode and the lower electrode disposed in the input region and the finger when the input region is operated with a finger. Configure a capacitive touch panel.

  FIG. 1 is a developed view of a continuous member 20 constituting the input device 10 of the present embodiment. In addition, as shown in FIG.1, FIG.2, FIG.4, the wavy line is illustrated and the form in this location is abbreviate | omitted.

  As shown in FIG. 1, the connecting member 20 has a developed shape in which a first base material 21 and a second base material 22 are integrated in the X1-X2 direction. The first substrate 21 and the second substrate 22 are formed of a transparent substrate such as polyethylene terephthalate (PET).

  As shown in FIG. 1, a plurality of first electrode patterns 23 are formed on the surface 21 a of the first base material 21.

  As shown in FIG. 1, the first electrode patterns 23 extend along, for example, the Y1-Y2 direction on the XY plane, and the first electrode patterns 23 are arranged at intervals in the X1-X2 direction. .

  As shown in FIG. 1, a plurality of wide electrode portions 23 a are connected to each first electrode pattern 23 at a predetermined interval in the Y1-Y2 direction.

  In addition, a plurality of second electrode patterns 24 are formed on the surface 22a of the second substrate 22 on the same surface 21a side as the first substrate 21 in the developed shape of FIG.

  As shown in FIG. 1, the second electrode patterns 24 extend along, for example, the X1-X2 direction on the XY plane, and the second electrode patterns 24 are arranged at intervals in the Y1-Y2 direction. .

  As shown in FIG. 1, a plurality of wide electrode portions 24 a are connected to each second electrode pattern 24 at a predetermined interval in the X1-X2 direction.

  The first electrode pattern 23 and the second electrode pattern 24 are made of a transparent conductive material such as ITO (Indium Tin Oxide), and are formed by sputtering or vapor deposition, for example.

  As shown in FIG. 1, a connecting portion 25 that protrudes integrally with the second base material 22 is formed on the side surface 22 b on the Y2 side of the second base material 22. Thus, the connection part 25 protrudes from one side surface 22b of the direction (Y1-Y2 direction) orthogonal to the juxtaposition direction (X1-X2 direction) of the 1st base material 21 and the 2nd base material 22. .

  As shown in FIG. 1, the first electrode wiring portion 26 is formed so as to extend electrically connected to the end portion 23 b of each first electrode pattern 23 formed on the surface 21 a of the first base material 21. The wiring part is formed in a narrow line shape.

  As shown in FIG. 1, the first electrode wiring portion 26 is formed to extend from the surface 21 a of the first base material 21 toward the surface 25 a of the connection portion 25. The distal end portion of the first electrode wiring portion 26 forms a wide electrode pad 28 at the connection portion 25.

  Further, as shown in FIG. 1, the second electrode wiring portion 27 is electrically connected to the end portions 24 b and 24 c of the second electrode patterns 24 formed on the surface 22 a of the second base material 22 and extends. Is formed.

  As shown in FIG. 1, the second electrode wiring portion 27 is formed to extend from the surface 22 a of the second base material 22 toward the surface 25 a of the connection portion 25. The distal end portion of the second electrode wiring portion 27 forms a wide electrode pad 28 at the connection portion 25.

  As shown in FIG. 1, all the electrode pads 28 electrically connected to the electrode patterns 23 and 24 through the electrode wiring portions 26 and 27 are formed in a line on the same surface 25 a of the connection portion 25. ing.

  Unlike the first electrode pattern 23 and the second electrode pattern 24, the electrode wiring portions 26 and 27 are not formed in the input region, and pass through the outer frame region of the input region from the side surface 22b of the second base material 22. The connecting part 25 extends to the protruding connecting part 25, and the connecting part 25 forms a wide electrode pad 28. Therefore, the electrode wiring portions 26 and 27 and the electrode pad 28 do not have to be formed of a transparent conductive material. For example, the electrode wiring portions 26 and 27 and the electrode pad 28 are preferably formed of a good conductor such as Ag—Pd—Cu, Cu, Al, Ag, or Au.

  As shown in FIG. 1, a bending auxiliary portion such as a hole 33, a slit, or a recess (groove) is provided at a boundary portion 29 between the first base material 21 and the second base material 22. The bending assisting part may be provided in a part of the boundary part 29 as shown in FIG. 1 or, for example, the entire boundary part 29 may be formed into a concave shape and the entire boundary part 29 may be used as the bending assisting part. It is.

  1 is bent from the boundary portion 29 between the first base material 21 and the second base material 22, and the first base material 21 and the second base material 22 are stacked in the thickness direction. Thus, the input device 10 of this embodiment is completed.

  FIG. 2 is a plan view of the input device 10 of the present embodiment formed by bending the connecting member 20 of FIG.

  As shown in FIG. 2, the input device 10 is provided with a light transmissive input region 32 surrounded by a one-dot chain line, and the first electrode pattern 23 and the second electrode pattern 24 are arranged inside the input region 32. . When an input operation is performed on the input area 32 with a finger, the operation coordinate position of the finger can be detected based on the change in capacity. The electrode wiring portions 26 and 27 are formed to extend to the connection portion 25 through the outer frame of the input region 32.

  As shown in the plan view of FIG. 2, the wide electrode portion 23 a of the first electrode pattern 23 provided on the first base material 21 is the wide electrode portion 24 a of the second electrode pattern 24 provided on the second base material 22. The formation positions of the wide electrode portions 23a and 24a are determined in the developed shape of FIG. 1 so as to face the non-formed regions in the thickness direction.

  In the input device 10 of the present embodiment, as shown in FIG. 2, the first base material 21 and the second base material 22 constituting the connecting member 20 are folded and face each other in the height direction (thickness direction). The connecting portion 25 formed integrally with the second base material 22 is in a state of protruding to the outside.

  The first electrode wiring portions 26 and the second electrode wiring portions 27 are aggregated toward the connection portion 25, and the front end portions of the electrode wiring portions 26 and 27 are formed on the surface 25 a of the connection portion 25. The electrode pads 28 located in the left and right sides are exposed in a line at a predetermined interval in the X1-X2 direction shown in the figure.

  Thus, in this embodiment, as demonstrated using FIG. 1, FIG. 2, the 1st base material 21 and the 2nd base material 22 are arranged side by side and integrated, The connecting member 20 is formed by forming the first electrode pattern 23 and the second electrode pattern 24 on the same surface 21a, 22a, and the input device 10 includes the first base member 21 and the second base member 21. 2 Since the first base material 21 and the second base material 22 are opposed to each other in the height direction by folding from the boundary portion 29 with the base material 22, the base material is subjected to heat, humidity, or the like during the manufacturing process. Even if a change in size occurs, the change in size between the adjacent first base material 21 and second base material 22 is very small. In addition, the first base material 21 and the second base material 22 are not separately bonded to each other as in the prior art, but in the present embodiment, a configuration in which one continuous member 20 is folded is more effective. Furthermore, it is possible to reduce the positional deviation between the first electrode pattern 23 formed on the first base material 21 and the second electrode pattern 24 formed on the second base material 22.

  Moreover, in the present embodiment, the first electrode pattern 23 and the second electrode pattern 24 are formed on the same surface 21a, 22a side in the developed shape of the continuous member 20, and are connected to the electrode patterns 23, 24. The electrode wiring portions 26 and 27 can be easily routed to the surface 25a of the connection portion 25, and all the electrode wiring portions 26 and 27 can be easily and appropriately aggregated on the surface 25a of the same connection portion 25. is there. As shown in FIG. 2, when the connecting member 20 is folded from the boundary portion 29 between the first base material 21 and the second base material 22, the connection portion 25 protrudes to the outside, and on the surface 25 a of the connection portion 25. All the formed electrode pads 28 can be exposed on the same plane.

  Therefore, in this embodiment, the electrical connection with the counterpart wiring board can be easily and reliably performed. Further, as shown in the developed shape of FIG. 1, all the electrode wiring portions 26, 27 are formed to extend to the same surface 21 a, 22 a side from the first base material 21 or the second base material 22 to the connection portion 25. Since it is a form, an electrically stable wiring structure can be realized as compared with a conventional configuration using a through wiring or the like as a base material.

  3A, the boundary 29 between the first base material 21 and the second base material 22 shown in FIG. 1 is folded in a mountain, and the second base material 22 is on the upper side and the first base material 21 is on the lower side. It is a longitudinal cross-sectional view when arrange | positioning. As shown in FIG. 3A, a transparent adhesive layer 30 is provided between the first base material 21 and the second base material 22, and the first base material 21 and the second base material 22 are bonded and fixed. ing. For the transparent adhesive layer 30, for example, a double-sided adhesive tape can be used. In the embodiment shown in FIG. 3A, the first electrode pattern 23 (upper electrode) formed on the first base material 21 and the second electrode pattern 24 (lower electrode) formed on the second base material 22 are both included. Facing outward.

  FIG. 3B shows a valley fold at the boundary 29 between the first base material 21 and the second base material 22 shown in FIG. 1, with the second base material 22 on the upper side and the first base material 21 on the lower side. It is a longitudinal cross-sectional view when arrange | positioning. In the embodiment shown in FIG. 3B, the first electrode pattern 23 (upper electrode) formed on the first base material 21 and the second electrode pattern 24 (lower electrode) formed on the second base material 22 are both included. Facing inward. As shown in FIG. 3B, a transparent insulating layer 31 is provided between the first base material 21 and the second base material 22, and thereby, between the first electrode pattern 23 and the second electrode pattern 24. Is properly insulated.

  In the embodiment shown in FIG. 4, a third base material 40 is provided in addition to the first base material 21 and the second base material 22, and the first base material 21, the second base material 22, and the third base material 40 are illustrated. The connecting member 41 is arranged side by side in the X1-X2 direction and integrated.

  The configurations of the first base material 21, the second base material 22, the electrode patterns 23 and 24, and the electrode wiring portions 26 and 27 are the same as those in FIG.

  In the embodiment shown in FIG. 4, the third base material 40 is integrally provided side by side on the X1 side of the second base material 22, and a shield layer 42 made of a transparent conductive material is provided on the surface 40 a of the third base material 40. Is formed. The shield layer 42 is formed over the entire surface 40a.

  As shown in FIG. 4, the shield wiring portion 43 is connected to the shield layer 42. Since the shield wiring portion 43 is formed at the position of the outer frame that is out of the input area, like the electrode wiring portions 26 and 27, it is not necessary to be a transparent conductive material, and the electrode wiring portions 26 and 27. It is made of the same good conductor material.

  As shown in FIG. 4, the distal end portion of the shield wiring portion 43 extends to the surface 25a of the connection portion 25, and the distal end portion of the shield wiring portion 43 forms a wide electrode pad 45 on the surface 25a of the connection portion 25. It is composed.

  As in the boundary portion 29 between the first base material 21 and the second base material 22, a hole 33 is formed in the boundary portion 44 between the second base material 22 and the third base material 40 of the connecting member 41 shown in FIG. 4. In addition, bending assisting portions such as slits and concave portions (groove portions) are provided.

  Then, the connecting member 41 shown in FIG. 4 is bent from the two boundary portions 29 and 44, and at this time, the connecting member 41 is arranged so that the third base material 40 including the shield layer 42 is disposed on the outside. The first base material 21, the second base material 22, and the third base material 40 are overlapped in the height direction (thickness direction) by folding from the boundary portions 29 and 44, respectively.

  FIGS. 5A and 5B are longitudinal sectional views of the input device 50 formed by folding the connecting member 41 shown in FIG.

  The input device 50 in the present embodiment is, for example, a capacitive touch panel, and a liquid crystal display (LCD) 60 is disposed on the lower surface side of the input device 50 as shown in FIG.

  Although not shown in the drawing, a thick plastic or glass plate material is provided on the upper surface side of the input device 50, and a decorative layer can be provided on the surface of the plate material.

  As shown in FIG. 5, in the present embodiment, the shield layer 42 is provided, and the shield layer 42 is disposed on the liquid crystal display 60 side, whereby electrical noise from the liquid crystal display 60 can be effectively shielded.

  In the embodiment shown in FIG. 5A, the boundary portion 29 of the connecting member 41 shown in FIG. 4 is valley-folded, the boundary portion 44 is mountain-folded, the first base material 21 is the upper side, and the third base material 40 is. Is arranged on the lower side, and the second base material 22 is arranged at an intermediate height. As shown in FIG. 5A, the first electrode pattern 23 provided on the first base material 21 and the second electrode pattern 24 provided on the second base material 22 face each other inward. . A transparent insulating layer 31 is provided between the first base material 21 and the second base material 22, and the first base material 21 and the second base material 22 are joined (adhesion fixed). As shown in FIG. 5A, a transparent adhesive layer 30 is provided between the second base material 22 and the third base material 40, and is fixedly bonded.

  In the embodiment shown in FIG. 5B, the boundary 29 of the connecting member 41 shown in FIG. 4 is folded in a mountain, the boundary 44 is folded in a valley, the first base material 21 is the upper side, and the third base is used. 40 is a lower side, and the second base material 22 is arranged at an intermediate height. As shown in FIG. 5B, for example, a transparent adhesive layer 30 is provided and fixed between the first base material 21 and the second base material 22. Further, as shown in FIG. 5B, the second electrode pattern 24 provided on the second base material 22 and the shield layer 42 provided on the third base material 40 face each other inward. A transparent insulating layer 31 is provided between the second base material 22 and the third base material 40, and the second base material 22 and the third base material 40 are joined (adhesion fixed).

  In the embodiment shown in FIGS. 4 and 5 described above, the third base material 40 including the shield layer 42 in addition to the first base material 21 and the second base material 22 having the electrode patterns 23 and 24 is further provided. Then, as shown in FIG. 4, all the electrode pads 28 are formed by pulling out the ground wiring portion 43 toward the connection portion 25 and forming the electrode pad 45 serving as the tip of the ground wiring portion 43 on the surface 25 a of the connection portion 25. , 45 can be collected on the surface 25a of the same connecting portion 25. As shown in FIG. 4, all the electrode pads 28 and 45 are arranged in a line at a predetermined interval in the X1-X2 direction shown in the figure.

  In the embodiment of the input device 50 shown in FIG. 5, the positional deviation between the electrode patterns 23, 24 is small, and all the wiring portions 26, 27, 43 are drawn out to the same surface 21a, 22a, 40a side. All the electrode pads 28 and 45 located at the tips of the pins 26, 27 and 43 can be exposed on the same plane, and the shielded input device 50 having an electrically stable wiring structure can be configured. .

  As shown in FIG. 4, the 2nd base material 22 is arrange | positioned in the center of the connection member 41 by the expansion | deployment shape, and the 1st base material 21 and the 3rd base material 40 are arrange | positioned at the both sides. And the connection part 25 protrudes in the Y2 direction from the side surface of the 2nd base material 22 located in the middle, and is formed.

  In the present embodiment, it is possible to project and form the connecting portion 25 from the side surface of the first base material 21 or the side surface of the third base material 40 located in both side regions of the connecting member 41 in a developed shape. By forming the connecting portion 25 so as to protrude from the side surface of the second base material 22 arranged in the middle, the electrode wiring part 26 drawn from the surface 21a of the first base material 21 and the surface 22a of the second base material 22 It can be suppressed that the wiring length of any one of the drawn electrode wiring portion 27 and the shield wiring portion 43 drawn from the surface 40a of the third base material 40 is extremely long, that is, the length of each wiring portion. A dimensional difference can be reduced, and a wiring structure excellent in electrical stability can be realized.

  As shown in FIGS. 1 and 4, the number of second electrode wiring portions 27 drawn from the surface 22 a of the second base material 22 to the surface 25 a of the connection portion 25 is connected from the surface 21 a of the first base material 21. More than the number of first electrode wiring portions 26 drawn to the surface 25 a of the portion 25. And the connection part 25 is integrally formed from the side surface 22b of the 2nd base material 22 with many electrode wiring parts. As a result, the second electrode wiring portions 27 having a large number can be easily drawn out to the surface 25a of the connection portion 25, and all the electrode wiring portions 26 and 27 can be efficiently routed within a limited area.

  In the embodiment shown in FIG. 4, the connecting portion 25 is integrally formed on the second base material 22 having a large number of electrode wiring portions to be routed, and the second base material 22 is connected to the connecting member 41 in a developed shape. Therefore, the wiring portions can be routed more efficiently and the difference in length between the wiring portions can be reduced, thereby realizing a wiring structure excellent in electrical stability.

Next, a method for manufacturing the input device 50 in this embodiment will be described.
FIG. 6 shows a plan view of the base substrate 70. The base substrate 70 is a transparent substrate such as polyethylene terephthalate (PET), and is formed to have a size capable of forming a large number of connecting members 41. In FIG. 6, a plurality of connecting members indicated by dotted lines are illustrated, but only one connecting member 41 is denoted by a reference numeral.

  As shown in FIG. 6, on the same surface 70a side of the base substrate 70, the first electrode pattern 23 is formed in the region of each first substrate 21 of each connecting member 41, and each second substrate The second electrode pattern 24 is formed in the region 22, and the shield layer 42 is formed in the region of each third substrate 40. Further, wiring portions 26, 27, and 43 (see FIG. 4) connected to the first electrode pattern 23, the second electrode pattern 24, and the shield layer 42 are formed to the connection portion 25, and each wiring portion 26, Electrode pads 28 and 45 (see FIG. 4) located at the tips of 27 and 43 are formed in a line at a predetermined interval on the surface of the connecting portion 25.

Next, each continuous member 41 is cut out from the base substrate 70 of FIG.
Next, the individually separated connecting members 41 are bent from the boundary portions 29 and 44 as shown in FIG. 7, and the first base material 21, the second base material 22, and the third base material 40 are arranged in the height direction (thickness). (Direction). At this time, the transparent adhesive layer 30 and the transparent insulating layer 31 are interposed between the substrates, and the substrates are joined.

  According to the manufacturing method of the present embodiment, even if there is a change in size due to heat, humidity, or the like in the base substrate 70 having a size capable of forming a plurality of connecting members 41, the base members 70 are adjacent in each connecting member 41. The change in size among the first base material 21, the second base material 22, and the third base material 40 is very small. Therefore, the first base material 21 and the second base material 22 are folded as shown in FIG. When the folded and overlapped, the positional deviation in the thickness direction between the first electrode pattern 23 formed on the first base material 21 and the second electrode pattern 24 formed on the second base material 22 is effectively reduced. can do.

  Further, according to the manufacturing method of the present embodiment, the first electrode pattern 23, the second electrode pattern 24, and the shield layer 42 can be formed on the same surface side in the developed shape of each connecting member 41 in the same process, Since the wiring portions 26, 27, and 43 can be formed in the same process, the formation of the electrode patterns 23 and 24 and the shield layer 42 and the formation of the wiring portions 26, 27, and 43 can be facilitated.

  Further, according to the manufacturing method of the present embodiment, the electrode wiring portions 26 and 27 and the shield wiring portion 43 can be easily extended from the surface of each base material 21, 22, 40 to the surface of the connection portion 25, The wiring portions 26, 27, and 43 can be easily and appropriately collected on the surface of the same connecting portion 25.

  Further, according to the manufacturing method of the present embodiment, as described above, the connecting portion 25 in which the positional deviation between the first electrode pattern 23 and the second electrode pattern 24 is small and all the electrode pads 28 and 45 are exposed on the same plane. Many input devices 50 can be manufactured at the same time, and the production efficiency is excellent.

  The manufacturing method of the input device 10 shown in FIGS. 1 to 3 can be realized by a manufacturing method according to FIGS.

DESCRIPTION OF SYMBOLS 10, 50 Input device 20, 41 Connecting member 21 1st base material 22 2nd base material 23 1st electrode pattern 24 2nd electrode pattern 25 Connection part 26 1st electrode wiring part 27 2nd electrode wiring part 28, 45 Electrode Pad 32 Input area 33 Hole 40 Third base material 42 Shield layer 43 Shield wiring part 60 Liquid crystal display 70 Base base material

Claims (13)

In the developed shape, the first base material, the second base material provided in parallel with the first base material, and the first base material are formed on the same surface side and in the region of the first base material. A first electrode pattern and a second electrode pattern formed in a region of the second base material; an electrode wiring portion connected to the first electrode pattern and the second electrode pattern; the first base material and the first base material; A connecting portion formed integrally with either one of the two base materials, and a continuous member is configured,
Each electrode wiring part is formed to extend from each electrode pattern to the surface of the connection part, and the tip part of each electrode wiring part is concentrated on the surface of the connection part,
The connecting member is bent from a boundary portion between the first base material and the second base material, and the first base material and the second base material are overlapped in a thickness direction, and the connection An input device characterized in that a portion is exposed to the outside. In addition to the first base material and the second base material, a third base material is juxtaposed on the connecting member in a developed shape, and the first base material has the first base material in the region of the third base material. A shield layer is formed on the same surface side where the electrode pattern and the second electrode pattern are formed,
The connection part is formed integrally with any of the first base material, the second base material, and the third base material, and the tip of the shield wiring part connected to the shield layer is connected to each electrode wiring. Together with the surface of the connecting portion,
The connecting members are respectively connected from the respective boundary portions located between the first base material, the second base material, and the third base material so that the third base material including the shield layer is located outside. The input device according to claim 1, wherein the first base material, the second base material, and the third base material are folded and overlapped in the thickness direction.   The second base material is provided in the middle of the connecting member in an unfolded shape, the first base material and the third base material are provided on both sides of the second base material, and the connection portion is the second part. The input device according to claim 2, wherein the input device is formed so as to protrude from a side surface of the substrate.   The number of second electrode wiring portions drawn from the surface of the second base material toward the surface of the connection portion is the first number drawn from the surface of the first base material toward the surface of the connection portion. 4. The input device according to claim 1, wherein the number of electrode wiring portions is larger than the number of electrode wiring portions, and the connection portion is formed integrally with the second base material.   5. The connecting member has a developed shape in which the respective base materials are arranged in parallel in one direction, and the connection portion is formed on a side surface in a direction orthogonal to the alignment direction of the respective base materials. The input device according to any one of the above.   The input device according to any one of claims 1 to 5, wherein a bending assisting portion is provided at a boundary portion between the base materials. A plurality of first electrode patterns are formed to extend in the first direction within the light-transmitting input region and are arranged at intervals in a second direction orthogonal to the first direction. A plurality of second electrode patterns are formed to extend in the second direction in the light-transmissive input region and are spaced from each other in the first direction;
The input device according to claim 1, wherein each electrode wiring portion connected to an end portion of each electrode pattern is routed to the connection portion through the outside of the input region. A first base material, a second base material arranged side by side with the first base material, and a developed shape in which connection portions formed continuously with the first base material or the second base material are integrated. Prepare a base substrate with a size that allows multiple continuous members to be formed,
Forming the first electrode pattern in each region to be the first substrate on the same surface side of the base substrate, and forming the second electrode pattern in each region to be the second substrate; Forming an electrode wiring portion connected to each electrode pattern, and at this time, extending and forming the tip portions of all the electrode wiring portions into the respective regions serving as the connection portions;
Separating the base substrate into each continuous member;
Each connecting member is bent from the boundary between the first base material and the second base material, the first base material and the second base material are overlapped in the thickness direction, and the connection portion is exposed to the outside. The process of
A method for manufacturing an input device. The connecting member includes a third base material in parallel with the first base material and the second base material, and the connection portion is the first base material, the second base material, or the third base material. It has an unfolded shape formed continuously on the material,
In each region to be the third base material, a shield layer is formed on the same surface side where the first electrode pattern and the second electrode pattern are formed, and the tip of each shield wiring part connected to the shield layer Part extending into each region to be the connection part together with each electrode wiring part,
After separating the base base material into the continuous members, the continuous base members are bent from the boundary portions between the base materials so that the third base material is located outside, and the first base material is The method for manufacturing an input device according to claim 8, wherein the second base material and the third base material are overlapped in the thickness direction.   The second base material is provided in the middle of the connecting member in an unfolded shape, the first base material and the third base material are provided on both sides of the second base material, and the connection portion is the second base material. The method for manufacturing an input device according to claim 9, wherein the input device is integrally formed with the device.   The number of second electrode wiring portions drawn from the surface of the second base material toward the surface of the connection portion is the first number drawn from the surface of the first base material toward the surface of the connection portion. 11. The method of manufacturing an input device according to claim 8, wherein the number of the electrode wiring portions is larger than the number of the electrode wiring portions, and the connection portions are integrally formed on the second base material.   The connecting members in the base base material are formed in a developed shape in which the base materials are arranged side by side in one direction, and the connection portion is formed on a side surface in a direction perpendicular to the arrangement direction of the base materials. The method for manufacturing an input device according to claim 8.   The method for manufacturing an input device according to any one of claims 8 to 12, wherein a folding assisting portion is formed at a boundary portion of the continuous member, and then the continuous member is bent.

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