US20150022744A1 - Single fpc board for connecting multiple modules and touch sensitive display module using the same - Google Patents
Single fpc board for connecting multiple modules and touch sensitive display module using the same Download PDFInfo
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- US20150022744A1 US20150022744A1 US14/511,062 US201414511062A US2015022744A1 US 20150022744 A1 US20150022744 A1 US 20150022744A1 US 201414511062 A US201414511062 A US 201414511062A US 2015022744 A1 US2015022744 A1 US 2015022744A1
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- module
- connecting portion
- thin film
- module connecting
- fpc board
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/184—Mounting of motherboards
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/185—Mounting of expansion boards
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
- G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/052—Branched
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
Definitions
- the invention relates in general to a flexible printed circuit (FPC) board, and more particularly to a single FPC board for connecting multiple modules and a touch sensitive display module using the same.
- FPC flexible printed circuit
- Touch panels have now been widely used in various electronic products. Particularly, most display panels are equipped with a touch panel for allowing users to click or press the screen with a finger or a stylus.
- the resistive touch panel detects the coordinates of the touch point by sensing voltage drop
- the capacitive touch panel calculates the coordinates of the touch point by forming a uniform electrical field on the panel and sensing the current of the touch point. Then, the coordinates of the touch point are processed through a FPC board and a control circuit so as to generate an image on the display panel and to provide a more convenient and user-friendly operating interface for the user.
- the touch sensitive display module 100 is formed by a display panel 110 , a touch panel 120 and a motherboard 130 .
- the display panel 110 has a first FPC board 142 and a connector 144 .
- the touch panel 120 has a second FPC board 140 .
- a cover 150 covers the touch panel 120 disposed on the display panel 110 , and the touch panel 120 and the display panel 110 can be bonded together with a bonding adhesive.
- the first FPC board 142 is electrically connected to the motherboard 130 through the connector 132 on the motherboard 130 .
- the disclosure is directed to a single FPC board for connecting multiple modules and a touch sensitive display module using the same.
- the disclosure allows reduction of the assembly hours of multiple modules and the assembly space of the FPC board.
- the discourse can be conformed to the thinning requirement.
- the FPC board can be formed by a single thin film, hence incurring lower cost and generating fewer wastes in the manufacturing process.
- a single FPC board for connecting multiple modules including a thin film, at least one first line and at least one second line.
- the thin film has a first module connecting portion, a second module connecting portion and a third module connecting portion. At least one first line is disposed between the first module connecting portion and the second module connecting portion. At least one second line is disposed between the first module connecting portion and the third module connecting portion.
- a touch sensitive display module including a first module, a second module, a third module and a single FPC board.
- the second module is disposed on the first module.
- the third module is adjacent to the first module located between the second module and the third module.
- the single FPC board connects the first module, the second module and the third module.
- FIGS. 1 and 2 respectively show a schematic diagram and an assembly structural diagram of a conventional touch sensitive display module
- FIGS. 3A-3C show assembly structural diagrams of a touch sensitive display module according to one embodiment of the invention.
- FIG. 4 shows a schematic diagram of a single FPC board for connecting multiple modules according to one embodiment of the invention
- FIGS. 5A-5D respectively show assembly flowcharts of a touch sensitive display module
- FIGS. 6A-6C respectively show assembly structural diagrams of a touch sensitive display module according to one embodiment of the invention.
- FIGS. 7A and 7B respectively show schematic diagram of a single FPC board for connecting multiple modules according to one embodiment of the invention.
- FIGS. 8A-8C respectively show assembly flowcharts of a touch sensitive display module
- FIGS. 9A-9B respectively show schematic diagrams of a single FPC board for connecting multiple modules according to one embodiment of the invention.
- the single FPC board for connecting multiple modules of a present embodiment adopts a single thin film design for connecting three or more modules, such as a display panel, a touch panel and a motherboard for transmitting relevant electrical signals.
- a folding connection design of the single FPC board enables the lines on the thin film to be electrically connected between the display panel and the touch panel.
- a design of branch connection of the single FPC board enables the lines on the thin film to be electrically connected between the display panel and the touch panel.
- FIGS. 3A-3C and 4 show assembly structural diagrams of a touch sensitive display module according to one embodiment of the invention.
- FIG. 4 shows a schematic diagram of a single FPC board for connecting multiple modules according to one embodiment of the invention.
- the touch sensitive display module 200 includes a first module 210 , a second module 220 , a third module 230 and a single FPC board 240 .
- the single FPC board 240 connects the first module 210 , the second module 220 and the third module 230 .
- the first module 210 is such as a display panel.
- the second module 220 such as a touch panel, is disposed on the first module 210 .
- the third module 230 is adjacent to the first module 210 .
- the first module 210 is disposed between the second module 220 and the third module 230 .
- the touch panel can be pasted on a lower surface (as indicated in FIG. 3A ) of the cover 250 according to an out cell solution; a touch-sensitive transparent conductive layer 222 (as indicated in FIG. 3B ) can be formed on the cover 250 according to a one glass solution; or, the touch-sensitive transparent conductive layer 222 can be integrated onto the display panel or embedded into the display panel (as indicated in FIG. 3C ) according to an on cell/in cell solution.
- the single FPC board 240 has a single thin film 241 , which has a first module connecting portion 242 , a second module connecting portion 244 , a third module connecting portion 246 , a folding portion 248 and a slot S.
- the first module connecting portion 242 such as a display panel connecting portion, has multiple first bonding pads B 1 such as golden fingers. Each first bonding pad B 1 can be connected to the first module 210 with a conductive glue for transmitting relevant electrical signals.
- the second module connecting portion 244 such as a touch panel connecting portion, has multiple second bonding pads B 2 such as golden fingers. Each second bonding pad B 2 can be connected to the second module 220 with a conductive glue for transmitting relevant electrical signals.
- the third module connecting portion 246 such as a motherboard connecting portion, has multiple third bonding pads B 3 such as golden fingers.
- Each third bonding pad B 3 can be electrically connected to the third module 230 through the connector 232 on the third module 230 for transmitting relevant electrical signals.
- the third bonding pad B 3 can also be electrically connected to the third module 230 through other elements in addition to the connector 232 .
- the first module connecting portion 242 is divided into a first signal connecting portion 242 a and a second signal connecting portion 242 b which are electrically connected to the first line 243 and the second line 245 respectively.
- At least one first line 243 is disposed between the first module connecting portion 242 and the second module connecting portion 244 for transmitting a first type signal, such as a touch-sensitive signal, which provides the sensing data of the touch position for the control chip on the display panel to calculate the coordinates of the touch position.
- a first type signal such as a touch-sensitive signal
- At least one second line 245 is disposed between the first module connecting portion 242 and the third module connecting portion 246 for transmitting a second type signal, such as a display panel driving signal from the third module 230 and a touch position signal calculated by the control chip on the first module 210 to the third module 230 , for generating an image on the display panel according to the touch position signal so as to complete touch display operation.
- a second type signal such as a display panel driving signal from the third module 230 and a touch position signal calculated by the control chip on the first module 210 to the third module 230 , for generating an image on the display panel according to the touch position signal so as to complete touch display operation.
- FIGS. 5A-5D assembly flowcharts of a touch sensitive display module are respectively shown.
- the first module connecting portion 242 located on a first side L 1 of the thin film 241 is connected to the first module 210 .
- the second module connecting portion 244 located on a second side L 2 of the thin film 241 is connected to the second module 220 . Since the slot S separates the second module connecting portion 244 and the third module connecting portion 246 and the folding portion 248 is located between the first module connecting portion 242 and the second module connecting portion 244 , the second module connecting portion 244 can be stacked on a part of the first module connecting portion 242 through the folding design.
- the third module connecting portion 246 located on a second side L 2 of the thin film 241 is not folded. As indicated in FIG. 5D , the third module connecting portion 246 is connected to the connector 232 of the third module 230 .
- the assembly procedure for assembling the touch sensitive display module 200 can be completed, and the time required for assembling the multiple modules can be reduced.
- the above assembly process is merely an embodiment for exemplification purpose, and the invention does not have restrictions with respect to the procedures of the assembly process.
- the second module 220 does not have to be stacked on the first module 210 .
- the second module 220 can also be stacked under the first module 210 or be separated from the first module 210 for a distance in a vertical direction.
- the first module 210 and the second module 220 can be disposed in parallel or separated for a distance in a horizontal direction.
- the first bonding pad B 1 of the first module connecting portion 242 is not necessarily connected above the first module 210 , and can also be connected under the first module 210 .
- the second bonding pad B 2 of the second module connecting portion 244 is not necessarily connected under the second module 220 , and can also be connected above the second module 220 .
- the third bonding pad B 3 of the third module connecting portion 246 is not necessarily connected above the third module 230 , and can also be connected under the third module 230 .
- the single FPC board 240 is not limited to a rectangle as indicated in FIG. 4 , and can have any other shape.
- the thin film 241 can be extended towards the second module connecting portion 244 , towards the third module connecting portion 246 , towards the left side or the right side or the two sides, or towards any combination of the above extending directions for increasing the bendability or application/assembly flexibility of the single FPC board.
- the length and width of the slot S can be determined according to the needs of design and application. In the above exemplification, the slot S has a width.
- the slot can be formed by cutting a line (i.e., the width can be relatively small, e.g., to nearly zero), the shape and width of the slot can have various designs, and the extending direction can be deflected. According to the needs of design, more slots can be designed for increasing the bendability or application/assembly flexibility of the single FPC board. Thus, the above assembly process can be adjusted or combined according to actual needs, and the invention does not have further restrictions.
- FIGS. 6A-6C and 7 A- 7 B respectively show assembly structural diagrams of a touch sensitive display module according to one embodiment of the invention.
- FIGS. 7A and 7B respectively show schematic diagram of a single FPC board for connecting multiple modules according to one embodiment of the invention.
- the touch sensitive display module 300 includes a first module 310 , a second module 320 , a third module 330 and a single FPC board 340 .
- the first module 310 is such as a display panel.
- the second module 320 is such as a touch panel.
- the third module 330 is such as a motherboard.
- the touch panel can be pasted on a lower surface (as indicated in FIG.
- a touch-sensitive transparent conductive layer 322 (as indicated in FIG. 6B ) can be formed on the cover 250 according to a one glass solution; or the touch-sensitive transparent conductive layer 322 can be integrated onto the display panel or embedded into the display panel (as indicated in FIG. 6C ) according to an on cell/in cell solution.
- the single FPC board 340 has a single thin film 341 .
- the thin film 341 has a first module connecting portion 342 , a second module connecting portion 344 , a third module connecting portion 346 and a first slot S 1 .
- the first module connecting portion 342 such as a display panel connecting portion, has multiple first bonding pads B 1 such as golden fingers. Each first bonding pad B 1 can be connected to the first module 310 with a conductive glue for transmitting relevant electrical signals.
- the second module connecting portion 344 such as a touch panel connecting portion, has multiple second bonding pads B 2 such as golden fingers.
- Each second bonding pad B 2 can be connected to the second module 320 with a conductive glue for transmitting relevant electrical signals.
- the third module connecting portion 346 such as a motherboard connecting portion, has multiple third bonding pads B 3 such as golden fingers.
- the third bonding pad B 3 can be electrically connected to the third module 330 through the connector 332 on the third module 330 for transmitting relevant electrical signals.
- the third bonding pad B 3 can also be electrically connected to the third module 330 through other elements in addition to the connector 332 .
- the first module connecting portion 342 is divided into a first signal connecting portion 342 a and a second signal connecting portion 342 b which are electrically connected to the first line 343 and the second line 345 respectively for transmitting different types of signals such as a touch-sensitive signal from the second module 320 and a display panel driving signal/a touch position signal.
- a touch-sensitive signal from the second module 320 and a display panel driving signal/a touch position signal.
- the thin film 341 further has a second slot S 2 located on a second side L 2 of the thin film 341 , wherein the second slot S 2 separates the first line 343 and the second line 345 for increasing the bendability of the thin film 341 .
- the first slot S 1 and the second slot S 2 are located on different sides of the thin film 341 , and the lengths of the two slots are determined according to the needs of application and can thus be the same or different from each other.
- the lengths of the first slot S 1 and the second slot S 2 may be about a half of the length of the thin film for increasing the bendability of the thin film 341 .
- the second slot S 2 is not illustrated in FIG. 7B , the thin film 341 can be extended towards the second module connecting portion 346 for increasing the bendability of the single FPC board 340 .
- FIGS. 8A-8C assembly flowcharts of a touch sensitive display module are respectively shown.
- FIGS. 8A-8C are exemplified by the single FPC board 340 of FIG. 7A , and the analogy can be applied to the single FPC board 340 of FIG. 7B .
- the first module connecting portion 342 located on a first side L 1 of the thin film 341 is connected to the first module 310 .
- the second module connecting portion 344 located on a first side L 1 of the thin film 341 is connected to the second module 320 .
- the second module 320 stacks on the first module 310 .
- the branch design enables the first module connecting portion 342 and the second module connecting portion 344 to be located on the first module 310 and the second module 320 respectively.
- the third module connecting portion 346 located on a second side L 2 of the thin film 341 is connected to the connector 332 of the third module 33 .
- the second module 320 does not have to be stacked on the first module 310 .
- the second module 320 can also be stacked under the first module 310 or separated from the first module 310 for a distance in a vertical direction.
- the first module 310 and the second module 320 can be disposed in parallel or separated for a distance in a horizontal direction.
- the first bonding pad B 1 of the first module connecting portion 342 is not necessarily connected above the first module 310 , and can also be connected under the first module 310 .
- the second bonding pad B 2 of the second module connecting portion 344 is not necessarily connected under the second module 320 , and can also be connected above the second module 320 .
- the third bonding pad B 3 of the third module connecting portion 346 is not necessarily connected above the third module 330 , and can also be connected under the third module 330 .
- the single FPC board 340 is not limited to a rectangle as indicated in FIGS. 7A and 7B , and can have any other shape.
- the thin film 341 can be extended towards the first module connecting portion 342 ( 342 a or 342 b or both), towards or opposite to the second module connecting portion 344 , towards the third module connecting portion 346 , towards the left side or the right side or the two sides, or towards any combination of the above extending directions for increasing the bendability or application/assembly flexibility of the single FPC board.
- the length and width of the first slot S 1 and the second slot S 2 can be determined according to the needs of design and application.
- both the first slot S 1 and the second slot S 2 have widths.
- the slot can be formed by cutting a line (i.e. the widths of the first slot S 1 and the second slot S 2 can be relatively small, e.g., to nearly zero), the shape and width of the slot can have various designs, and the extending direction can be deflected.
- more slots can be designed for increasing the bendability or application/assembly flexibility of the single FPC board.
- the above assembly process can be adjusted or combined according to actual needs, and the invention does not have further restrictions.
- FIGS. 9A-9B respectively show schematic diagrams of a single FPC board for connecting multiple modules according to one embodiment of the invention.
- the single FPC board 440 has a single thin film 441 .
- the thin film 441 has a first module connecting portion 442 , a second module connecting portion 444 , a third module connecting portion 446 , a first slot S 1 and a second slot S 2 .
- the present embodiment is similar to the second embodiment, and the main differences are as follows: the first slot S 1 and the second slot S 2 are located on the same side of the thin film 441 , and the second module connecting portion 444 is located between the first slot S 1 and the second slot S 2 .
- the first module connecting portion 442 is divided into a first signal connecting portion 442 a and a second signal connecting portion 442 b according to the source of the signal.
- the first slot S 1 separates the first signal connecting portion 442 a and the second module connecting portion 444 .
- the second slot S 2 separates the second signal connecting portion 442 b and the second module connecting portion 444 .
- the first signal connecting portion 442 a is electrically connected to the first line 443 for transmitting a first type signal such as a touch-sensitive signal.
- the second signal connecting portion 442 b is electrically connected to the second line 445 for transmitting a second type signal such as a display panel driving signal.
- the second module connecting portion 444 further has an extension portion 447 protruded from the first side L 1 of the thin film 441 , such that the first line 443 is extended outwards for increasing the bendability of the thin film 441 .
- the first line 443 can be extended to the left or to the right for a suitable length in cooperation with the size of the thin film 441 so that the second module connecting portion 444 will not be deformed when over-bent and can further be precisely fixed on the second module 220 for increasing the assembly reliability.
- the second module connecting portion 344 can adopt similar design and be extended outside the thin film 341 .
- the single FPC board 440 is not limited to a rectangle as indicated in FIGS. 9A and 9B , and can have any other shape.
- the thin film 441 can be extended towards the first module connecting portion 342 ( 342 a or 342 b or both), towards or opposite to the second module connecting portion 344 , towards the third module connecting portion 346 , towards the left side or the right side or the two sides, or towards any combination of the above extending directions for increasing the bendability or application/assembly flexibility of the single FPC board.
- the length and width of the first slot S 1 and the second slot S 2 can be determined according to the needs of design and application. In the above exemplification, both the first slot S 1 and the second slot S 2 have widths.
- the slot can be formed by cutting a line (i.e., the widths of the first slot S 1 and the second slot S 2 can be relatively small, e.g., to nearly zero), the shape and width of the slot can have various designs, and the extending direction can be deflected. According to the needs of design, more slots can be designed for increasing the bendability or application/assembly flexibility of the single FPC board. Relevant assembly structure and assembly process of the touch sensitive display module of FIGS. 9A and 9B can be obtained from the analogy of the second embodiment, and the similarities are not repeated here.
- the single FPC board for connecting multiple modules disclosed in above embodiments of the invention adopts the design of single thin film for connecting at least two modules for transmitting relevant electrical signals. Since only one FPC board is used and the lines on the thin film can be electrically connected between the display panel and the touch panel through one FPC board without using extra connector, the assembly procedure can be made more convenient and the time for assembling multiple modules can thus be reduced.
- the FPC board is formed by a single thin film, and a largest number of thin films can be manufactured if a smallest size is adopted. Therefore, unnecessary wastes can be avoided during the manufacturing process, and the cost can be further reduced.
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
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Abstract
A single flexible printed circuit (FPC) board for connecting multiple modules including a thin film is provided. The thin film has a first module connecting portion, a second module connecting portion and a third module connecting portion. The first module connecting portion is located on a first side of the thin film. The second module connecting portion and the third module connecting portion are located on a second side of the thin film. The first side is opposite to the second side. At least one first line is disposed between the first module connecting portion and the second module connecting portion. At least one second line is disposed between the first module connecting portion and the third module connecting portion.
Description
- This application is a continuation of U.S. patent application Ser. No. 13/438,636, filed Apr. 3, 2012. This application claims the benefits of U.S. provisional application Ser. No. 61/497,505, filed Jun. 15, 2011 and Taiwan application Serial No. 100129439, filed Aug. 17, 2011, the subject matters of which are incorporated herein by reference.
- 1. Field of the Invention
- The invention relates in general to a flexible printed circuit (FPC) board, and more particularly to a single FPC board for connecting multiple modules and a touch sensitive display module using the same.
- 2. Description of the Related Art
- Touch panels have now been widely used in various electronic products. Particularly, most display panels are equipped with a touch panel for allowing users to click or press the screen with a finger or a stylus. For example, the resistive touch panel detects the coordinates of the touch point by sensing voltage drop, and the capacitive touch panel calculates the coordinates of the touch point by forming a uniform electrical field on the panel and sensing the current of the touch point. Then, the coordinates of the touch point are processed through a FPC board and a control circuit so as to generate an image on the display panel and to provide a more convenient and user-friendly operating interface for the user.
- Referring to
FIGS. 1 and 2 , a schematic diagram and an assembly structural diagram of a conventional touch sensitive display module are respectively shown. The touchsensitive display module 100 is formed by adisplay panel 110, atouch panel 120 and amotherboard 130. Thedisplay panel 110 has afirst FPC board 142 and aconnector 144. Thetouch panel 120 has asecond FPC board 140. Acover 150 covers thetouch panel 120 disposed on thedisplay panel 110, and thetouch panel 120 and thedisplay panel 110 can be bonded together with a bonding adhesive. During assembly, after thesecond FPC board 140 is connected to thefirst FPC board 142 through theconnector 144, thefirst FPC board 142 is electrically connected to themotherboard 130 through theconnector 132 on themotherboard 130. - In the above assembly structure, two
FPC boards connector 144, and more assembly hours and a larger space are required for assembling the two FPC boards. Since two FPC boards are used, more cost will be incurred and more wastes will be generated in the manufacturing process. - The disclosure is directed to a single FPC board for connecting multiple modules and a touch sensitive display module using the same. The disclosure allows reduction of the assembly hours of multiple modules and the assembly space of the FPC board. In addition, the discourse can be conformed to the thinning requirement. Moreover, the FPC board can be formed by a single thin film, hence incurring lower cost and generating fewer wastes in the manufacturing process.
- According to an aspect of the present invention, a single FPC board for connecting multiple modules including a thin film, at least one first line and at least one second line is provided. The thin film has a first module connecting portion, a second module connecting portion and a third module connecting portion. At least one first line is disposed between the first module connecting portion and the second module connecting portion. At least one second line is disposed between the first module connecting portion and the third module connecting portion.
- According to another aspect of the present invention, a touch sensitive display module including a first module, a second module, a third module and a single FPC board is provided. The second module is disposed on the first module. The third module is adjacent to the first module located between the second module and the third module. The single FPC board connects the first module, the second module and the third module.
- The above and other aspects of the invention will become better understood with regard to the following detailed description of the preferred but non-limiting embodiment(s). The following description is made with reference to the accompanying drawings.
-
FIGS. 1 and 2 respectively show a schematic diagram and an assembly structural diagram of a conventional touch sensitive display module; -
FIGS. 3A-3C show assembly structural diagrams of a touch sensitive display module according to one embodiment of the invention; -
FIG. 4 shows a schematic diagram of a single FPC board for connecting multiple modules according to one embodiment of the invention; -
FIGS. 5A-5D respectively show assembly flowcharts of a touch sensitive display module; -
FIGS. 6A-6C respectively show assembly structural diagrams of a touch sensitive display module according to one embodiment of the invention; -
FIGS. 7A and 7B respectively show schematic diagram of a single FPC board for connecting multiple modules according to one embodiment of the invention; -
FIGS. 8A-8C respectively show assembly flowcharts of a touch sensitive display module; and -
FIGS. 9A-9B respectively show schematic diagrams of a single FPC board for connecting multiple modules according to one embodiment of the invention. - The single FPC board for connecting multiple modules of a present embodiment adopts a single thin film design for connecting three or more modules, such as a display panel, a touch panel and a motherboard for transmitting relevant electrical signals. In one embodiment, a folding connection design of the single FPC board enables the lines on the thin film to be electrically connected between the display panel and the touch panel. In another embodiment, a design of branch connection of the single FPC board enables the lines on the thin film to be electrically connected between the display panel and the touch panel. Thus, the lines on the thin film can be electrically connected between the display panel and the touch panel through one FPC board without using an extra connector, so that the time for assembling the multiple modules and the space for assembling the FPC board can be reduced and the thinning requirement can be satisfied.
- The invention is elaborated below with the exemplification of a touch sensitive display module. However, the embodiments below are for exemplification purpose only, not for limiting the scope of protection of the invention.
- Referring to
FIGS. 3A-3C and 4.FIGS. 3A-3C show assembly structural diagrams of a touch sensitive display module according to one embodiment of the invention.FIG. 4 shows a schematic diagram of a single FPC board for connecting multiple modules according to one embodiment of the invention. The touchsensitive display module 200 includes afirst module 210, asecond module 220, athird module 230 and asingle FPC board 240. Thesingle FPC board 240 connects thefirst module 210, thesecond module 220 and thethird module 230. Thefirst module 210 is such as a display panel. Thesecond module 220, such as a touch panel, is disposed on thefirst module 210. Thethird module 230, such as a motherboard, is adjacent to thefirst module 210. Preferably, thefirst module 210 is disposed between thesecond module 220 and thethird module 230. In one embodiment, the touch panel can be pasted on a lower surface (as indicated inFIG. 3A ) of thecover 250 according to an out cell solution; a touch-sensitive transparent conductive layer 222 (as indicated inFIG. 3B ) can be formed on thecover 250 according to a one glass solution; or, the touch-sensitive transparentconductive layer 222 can be integrated onto the display panel or embedded into the display panel (as indicated inFIG. 3C ) according to an on cell/in cell solution. - Referring to
FIG. 4 , thesingle FPC board 240 has a singlethin film 241, which has a firstmodule connecting portion 242, a secondmodule connecting portion 244, a thirdmodule connecting portion 246, afolding portion 248 and a slot S. The firstmodule connecting portion 242, such as a display panel connecting portion, has multiple first bonding pads B1 such as golden fingers. Each first bonding pad B1 can be connected to thefirst module 210 with a conductive glue for transmitting relevant electrical signals. The secondmodule connecting portion 244, such as a touch panel connecting portion, has multiple second bonding pads B2 such as golden fingers. Each second bonding pad B2 can be connected to thesecond module 220 with a conductive glue for transmitting relevant electrical signals. In addition, the thirdmodule connecting portion 246, such as a motherboard connecting portion, has multiple third bonding pads B3 such as golden fingers. Each third bonding pad B3 can be electrically connected to thethird module 230 through theconnector 232 on thethird module 230 for transmitting relevant electrical signals. The third bonding pad B3 can also be electrically connected to thethird module 230 through other elements in addition to theconnector 232. - Referring to
FIG. 4 , based on the source of the signal, the firstmodule connecting portion 242 is divided into a firstsignal connecting portion 242 a and a secondsignal connecting portion 242 b which are electrically connected to thefirst line 243 and thesecond line 245 respectively. At least onefirst line 243 is disposed between the firstmodule connecting portion 242 and the secondmodule connecting portion 244 for transmitting a first type signal, such as a touch-sensitive signal, which provides the sensing data of the touch position for the control chip on the display panel to calculate the coordinates of the touch position. In addition, at least onesecond line 245 is disposed between the firstmodule connecting portion 242 and the thirdmodule connecting portion 246 for transmitting a second type signal, such as a display panel driving signal from thethird module 230 and a touch position signal calculated by the control chip on thefirst module 210 to thethird module 230, for generating an image on the display panel according to the touch position signal so as to complete touch display operation. - Referring to
FIGS. 5A-5D , assembly flowcharts of a touch sensitive display module are respectively shown. As indicated inFIG. 5A , the firstmodule connecting portion 242 located on a first side L1 of thethin film 241 is connected to thefirst module 210. As indicated inFIG. 5B , the secondmodule connecting portion 244 located on a second side L2 of thethin film 241 is connected to thesecond module 220. Since the slot S separates the secondmodule connecting portion 244 and the thirdmodule connecting portion 246 and thefolding portion 248 is located between the firstmodule connecting portion 242 and the secondmodule connecting portion 244, the secondmodule connecting portion 244 can be stacked on a part of the firstmodule connecting portion 242 through the folding design. Meanwhile, the thirdmodule connecting portion 246 located on a second side L2 of thethin film 241 is not folded. As indicated inFIG. 5D , the thirdmodule connecting portion 246 is connected to theconnector 232 of thethird module 230. Thus, the assembly procedure for assembling the touchsensitive display module 200 can be completed, and the time required for assembling the multiple modules can be reduced. The above assembly process is merely an embodiment for exemplification purpose, and the invention does not have restrictions with respect to the procedures of the assembly process. - In the above assembly process, the
second module 220 does not have to be stacked on thefirst module 210. Thesecond module 220 can also be stacked under thefirst module 210 or be separated from thefirst module 210 for a distance in a vertical direction. Instead of the stacking design, thefirst module 210 and thesecond module 220 can be disposed in parallel or separated for a distance in a horizontal direction. In addition, the first bonding pad B1 of the firstmodule connecting portion 242 is not necessarily connected above thefirst module 210, and can also be connected under thefirst module 210. The second bonding pad B2 of the secondmodule connecting portion 244 is not necessarily connected under thesecond module 220, and can also be connected above thesecond module 220. The third bonding pad B3 of the thirdmodule connecting portion 246 is not necessarily connected above thethird module 230, and can also be connected under thethird module 230. Thesingle FPC board 240 is not limited to a rectangle as indicated inFIG. 4 , and can have any other shape. For example, thethin film 241 can be extended towards the secondmodule connecting portion 244, towards the thirdmodule connecting portion 246, towards the left side or the right side or the two sides, or towards any combination of the above extending directions for increasing the bendability or application/assembly flexibility of the single FPC board. Besides, the length and width of the slot S can be determined according to the needs of design and application. In the above exemplification, the slot S has a width. However, in practical application, the slot can be formed by cutting a line (i.e., the width can be relatively small, e.g., to nearly zero), the shape and width of the slot can have various designs, and the extending direction can be deflected. According to the needs of design, more slots can be designed for increasing the bendability or application/assembly flexibility of the single FPC board. Thus, the above assembly process can be adjusted or combined according to actual needs, and the invention does not have further restrictions. - Referring to
FIGS. 6A-6C and 7A-7B.FIGS. 6A-6C respectively show assembly structural diagrams of a touch sensitive display module according to one embodiment of the invention.FIGS. 7A and 7B respectively show schematic diagram of a single FPC board for connecting multiple modules according to one embodiment of the invention. The touchsensitive display module 300 includes afirst module 310, asecond module 320, athird module 330 and asingle FPC board 340. Thefirst module 310 is such as a display panel. Thesecond module 320 is such as a touch panel. Thethird module 330 is such as a motherboard. In one embodiment, the touch panel can be pasted on a lower surface (as indicated inFIG. 6A ) of thecover 350 according to an out cell solution; a touch-sensitive transparent conductive layer 322 (as indicated inFIG. 6B ) can be formed on thecover 250 according to a one glass solution; or the touch-sensitive transparentconductive layer 322 can be integrated onto the display panel or embedded into the display panel (as indicated inFIG. 6C ) according to an on cell/in cell solution. - Referring to
FIGS. 7A and 7B . Thesingle FPC board 340 has a singlethin film 341. Thethin film 341 has a firstmodule connecting portion 342, a secondmodule connecting portion 344, a thirdmodule connecting portion 346 and a first slot S1. The firstmodule connecting portion 342, such as a display panel connecting portion, has multiple first bonding pads B1 such as golden fingers. Each first bonding pad B1 can be connected to thefirst module 310 with a conductive glue for transmitting relevant electrical signals. The secondmodule connecting portion 344, such as a touch panel connecting portion, has multiple second bonding pads B2 such as golden fingers. Each second bonding pad B2 can be connected to thesecond module 320 with a conductive glue for transmitting relevant electrical signals. In addition, the thirdmodule connecting portion 346, such as a motherboard connecting portion, has multiple third bonding pads B3 such as golden fingers. The third bonding pad B3 can be electrically connected to thethird module 330 through theconnector 332 on thethird module 330 for transmitting relevant electrical signals. The third bonding pad B3 can also be electrically connected to thethird module 330 through other elements in addition to theconnector 332. - Referring to
FIGS. 7A and 7B . Based on the source of the signal, the firstmodule connecting portion 342 is divided into a firstsignal connecting portion 342 a and a secondsignal connecting portion 342 b which are electrically connected to thefirst line 343 and thesecond line 345 respectively for transmitting different types of signals such as a touch-sensitive signal from thesecond module 320 and a display panel driving signal/a touch position signal. The details are disclosed in the first embodiment, and the similarities are not repeated here. - The main differences between
FIG. 7A andFIG. 7B are as follows: As indicated inFIG. 7A , thethin film 341 further has a second slot S2 located on a second side L2 of thethin film 341, wherein the second slot S2 separates thefirst line 343 and thesecond line 345 for increasing the bendability of thethin film 341. The first slot S1 and the second slot S2 are located on different sides of thethin film 341, and the lengths of the two slots are determined according to the needs of application and can thus be the same or different from each other. For example, the lengths of the first slot S1 and the second slot S2 may be about a half of the length of the thin film for increasing the bendability of thethin film 341. Despite the second slot S2 is not illustrated inFIG. 7B , thethin film 341 can be extended towards the secondmodule connecting portion 346 for increasing the bendability of thesingle FPC board 340. - Referring to
FIGS. 8A-8C , assembly flowcharts of a touch sensitive display module are respectively shown.FIGS. 8A-8C are exemplified by thesingle FPC board 340 ofFIG. 7A , and the analogy can be applied to thesingle FPC board 340 ofFIG. 7B . As indicated inFIG. 8A , the firstmodule connecting portion 342 located on a first side L1 of thethin film 341 is connected to thefirst module 310. As indicated inFIG. 8B , the secondmodule connecting portion 344 located on a first side L1 of thethin film 341 is connected to thesecond module 320. Meanwhile, thesecond module 320 stacks on thefirst module 310. Since the first slot S1 separates the firstmodule connecting portion 342 and the secondmodule connecting portion 344, the branch design enables the firstmodule connecting portion 342 and the secondmodule connecting portion 344 to be located on thefirst module 310 and thesecond module 320 respectively. As indicated inFIG. 8C , the thirdmodule connecting portion 346 located on a second side L2 of thethin film 341 is connected to theconnector 332 of the third module 33. Thus, the assembly procedure of the touchsensitive display module 300 can be completed, and the time required for assembling the multiple modules can be reduced. The above assembly process is merely an embodiment for exemplification purpose, and the invention does not have restrictions with respect to the procedures of the assembly process. - In the above assembly process, the
second module 320 does not have to be stacked on thefirst module 310. Thesecond module 320 can also be stacked under thefirst module 310 or separated from thefirst module 310 for a distance in a vertical direction. Instead of the stacking design, thefirst module 310 and thesecond module 320 can be disposed in parallel or separated for a distance in a horizontal direction. In addition, the first bonding pad B1 of the firstmodule connecting portion 342 is not necessarily connected above thefirst module 310, and can also be connected under thefirst module 310. The second bonding pad B2 of the secondmodule connecting portion 344 is not necessarily connected under thesecond module 320, and can also be connected above thesecond module 320. The third bonding pad B3 of the thirdmodule connecting portion 346 is not necessarily connected above thethird module 330, and can also be connected under thethird module 330. Thesingle FPC board 340 is not limited to a rectangle as indicated inFIGS. 7A and 7B , and can have any other shape. For example, thethin film 341 can be extended towards the first module connecting portion 342 (342 a or 342 b or both), towards or opposite to the secondmodule connecting portion 344, towards the thirdmodule connecting portion 346, towards the left side or the right side or the two sides, or towards any combination of the above extending directions for increasing the bendability or application/assembly flexibility of the single FPC board. Besides, the length and width of the first slot S1 and the second slot S2 can be determined according to the needs of design and application. In the above exemplification, both the first slot S1 and the second slot S2 have widths. However, in practical applications, the slot can be formed by cutting a line (i.e. the widths of the first slot S1 and the second slot S2 can be relatively small, e.g., to nearly zero), the shape and width of the slot can have various designs, and the extending direction can be deflected. According to the needs of design, more slots can be designed for increasing the bendability or application/assembly flexibility of the single FPC board. Thus, the above assembly process can be adjusted or combined according to actual needs, and the invention does not have further restrictions. -
FIGS. 9A-9B respectively show schematic diagrams of a single FPC board for connecting multiple modules according to one embodiment of the invention. Thesingle FPC board 440 has a singlethin film 441. Thethin film 441 has a firstmodule connecting portion 442, a secondmodule connecting portion 444, a thirdmodule connecting portion 446, a first slot S1 and a second slot S2. The present embodiment is similar to the second embodiment, and the main differences are as follows: the first slot S1 and the second slot S2 are located on the same side of thethin film 441, and the secondmodule connecting portion 444 is located between the first slot S1 and the second slot S2. - Based on the source of the signal, the first
module connecting portion 442 is divided into a firstsignal connecting portion 442 a and a secondsignal connecting portion 442 b according to the source of the signal. The first slot S1 separates the firstsignal connecting portion 442 a and the secondmodule connecting portion 444. The second slot S2 separates the secondsignal connecting portion 442 b and the secondmodule connecting portion 444. The firstsignal connecting portion 442 a is electrically connected to thefirst line 443 for transmitting a first type signal such as a touch-sensitive signal. The secondsignal connecting portion 442 b is electrically connected to thesecond line 445 for transmitting a second type signal such as a display panel driving signal. - The main differences between
FIG. 9A andFIG. 9B are as follows: As indicated inFIG. 9B , the secondmodule connecting portion 444 further has anextension portion 447 protruded from the first side L1 of thethin film 441, such that thefirst line 443 is extended outwards for increasing the bendability of thethin film 441. In addition, thefirst line 443 can be extended to the left or to the right for a suitable length in cooperation with the size of thethin film 441 so that the secondmodule connecting portion 444 will not be deformed when over-bent and can further be precisely fixed on thesecond module 220 for increasing the assembly reliability. It is noted that inFIGS. 7A and 7B , the secondmodule connecting portion 344 can adopt similar design and be extended outside thethin film 341. Thesingle FPC board 440 is not limited to a rectangle as indicated inFIGS. 9A and 9B , and can have any other shape. For example, thethin film 441 can be extended towards the first module connecting portion 342 (342 a or 342 b or both), towards or opposite to the secondmodule connecting portion 344, towards the thirdmodule connecting portion 346, towards the left side or the right side or the two sides, or towards any combination of the above extending directions for increasing the bendability or application/assembly flexibility of the single FPC board. Besides, the length and width of the first slot S1 and the second slot S2 can be determined according to the needs of design and application. In the above exemplification, both the first slot S1 and the second slot S2 have widths. However, in practical applications, the slot can be formed by cutting a line (i.e., the widths of the first slot S1 and the second slot S2 can be relatively small, e.g., to nearly zero), the shape and width of the slot can have various designs, and the extending direction can be deflected. According to the needs of design, more slots can be designed for increasing the bendability or application/assembly flexibility of the single FPC board. Relevant assembly structure and assembly process of the touch sensitive display module ofFIGS. 9A and 9B can be obtained from the analogy of the second embodiment, and the similarities are not repeated here. - The single FPC board for connecting multiple modules disclosed in above embodiments of the invention adopts the design of single thin film for connecting at least two modules for transmitting relevant electrical signals. Since only one FPC board is used and the lines on the thin film can be electrically connected between the display panel and the touch panel through one FPC board without using extra connector, the assembly procedure can be made more convenient and the time for assembling multiple modules can thus be reduced. The FPC board is formed by a single thin film, and a largest number of thin films can be manufactured if a smallest size is adopted. Therefore, unnecessary wastes can be avoided during the manufacturing process, and the cost can be further reduced.
- While the invention has been described by way of example and in terms of the preferred embodiments, it is to be understood that the invention is not limited thereto. On the contrary, it is intended to cover various modifications and similar arrangements and procedures, and the scope of the appended claims therefore should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements and procedures.
Claims (26)
1. A single FPC board for connecting multiple modules, comprising:
a thin film having a first module connecting portion, a second module connecting portion and a third module connecting portion, wherein the first to the third module connecting portions are a display panel connecting portion, a touch panel connecting portion and a motherboard connecting portion, respectively;
at least one first line disposed between the first module connecting portion and the second module connecting portion; and
at least one second line disposed between the first module connecting portion and the third module connecting portion.
2. The single FPC board according to claim 1 , wherein the first module connecting portion is located on a first side of the thin film, the second module connecting portion and the third module connecting portion are located on a second side of the thin film, and the first side is opposite to the second side.
3. The single FPC board according to claim 2 , wherein the thin film further has a slot separating the second module connecting portion and the third module connecting portion.
4. The single FPC board according to claim 3 , wherein the thin film further has a folding portion located between the first module connecting portion and the second module connecting portion.
5. The single FPC board according to claim 1 , wherein the first module connecting portion is divided into a first signal connecting portion and a second signal connecting portion, which are electrically connected to the at least one first line and the at least one second line, respectively.
6. The single FPC board according to claim 1 , wherein the first module connecting portion and the second module connecting portion are located on a first side of the thin film, the third module connecting portion is located on a second side of the thin film, and the first side is opposite to the second side.
7. The single FPC board according to claim 6 , wherein the thin film further has a first slot separating the first module connecting portion and the second module connecting portion.
8. The single FPC board according to claim 7 , wherein the first module connecting portion is divided into a first signal connecting portion and a second signal connecting portion, which are electrically connected to the at least one first line and the at least one second line, respectively.
9. The single FPC board according to claim 8 , wherein the thin film further has a second slot located on the second side of the thin film, and the second slot separates the at least one first line and the at least one second line.
10. The single FPC board according to claim 8 , wherein the thin film further has a second slot located on the first side of the thin film, and the second module connecting portion is located between the first slot and the second slot.
11. The single FPC board according to claim 10 , wherein the first slot separates the first signal connecting portion and the second module connecting portion, and the second slot separates the second signal connecting portion and the second module connecting portion.
12. The single FPC board according to claim 11 , wherein the second module connecting portion has an extension portion protruded from the first side of the thin film, such that the at least one first line is extended outwards.
13. A touch sensitive display module, comprising:
a first to a third module; and
the single FPC board according to claim 1 , wherein the first to the third module connecting portions are connected to the first to the third modules, respectively.
14. The touch sensitive display module according to claim 13 , wherein the second and the third module are located on top and bottom sides of the first module, respectively.
15. A touch sensitive display module, comprising:
a first module;
a second module disposed on the first module;
a third module adjacent to the first module, wherein the first module is located between the second module and the third module; and
a single FPC board connecting the first module, the second module and the third module, wherein the first module is a display panel, the second module is a touch panel, and the third module is a motherboard.
16. The touch sensitive display module according to claim 15 , wherein the single FPC board comprises:
a thin film having a first module connecting portion, a second module connecting portion and a third module connecting portion, wherein the first module connecting portion is located on a first side of the thin film, the second module connecting portion and the third module connecting portion are located on a second side of the thin film, and the first side is opposite to the second side;
at least one first line disposed between the first module connecting portion and the second module connecting portion; and
at least one second line disposed between the first module connecting portion and the third module connecting portion.
17. The single FPC board according to claim 16 , wherein the thin film further has a slot separating the second module connecting portion and the third module connecting portion.
18. The single FPC board according to claim 16 , wherein the thin film further has a folding portion located between the first module connecting portion and the second module connecting portion.
19. The touch sensitive display module according to claim 16 , wherein the first module connecting portion is divided into a first signal connecting portion and a second signal connecting portion, which are electrically connected to the at least one first line and the at least one second line respectively.
20. The touch sensitive display module according to claim 15 , wherein the first module connecting portion and the second module connecting portion are located on a first side of the thin film, the third module connecting portion is located on a second side of the thin film, and the first side is opposite to the second side.
21. The touch sensitive display module according to claim 20 , wherein the thin film further has a first slot separating the first module connecting portion and the second module connecting portion.
22. The touch sensitive display module according to claim 21 , wherein the first module connecting portion is divided into a first signal connecting portion and a second signal connecting portion, which are electrically connected to the at least one first line and the at least one second line, respectively.
23. The touch sensitive display module according to claim 22 , wherein the thin film further has a second slot located on the second side of the thin film, and the second slot separates the at least one first line and the at least one second line.
24. The touch sensitive display module according to claim 22 , wherein the thin film further has a second slot located on the first side of the thin film, and the second module connecting portion is located between the first slot and the second slot.
25. The touch sensitive display module according to claim 24 , wherein the first slot separates the first signal connecting portion and the second module connecting portion, and the second slot separates the second signal connecting portion and the second module connecting portion.
26. The touch sensitive display module according to claim 25 , wherein the second module connecting portion has an extension portion protruded from the first side of the thin film, such that the at least one first line is extended outwards.
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US14/511,062 US20150022744A1 (en) | 2011-06-15 | 2014-10-09 | Single fpc board for connecting multiple modules and touch sensitive display module using the same |
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US201161497505P | 2011-06-15 | 2011-06-15 | |
TW100129439A TWI452768B (en) | 2011-06-15 | 2011-08-17 | Single fpc board for connecting multiple modules and touch sensitive display module using the same |
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US13/438,636 US9084368B2 (en) | 2011-06-15 | 2012-04-03 | Single FPC board for connecting multiple modules and touch sensitive display module using the same |
US14/511,062 US20150022744A1 (en) | 2011-06-15 | 2014-10-09 | Single fpc board for connecting multiple modules and touch sensitive display module using the same |
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US14/511,062 Abandoned US20150022744A1 (en) | 2011-06-15 | 2014-10-09 | Single fpc board for connecting multiple modules and touch sensitive display module using the same |
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Also Published As
Publication number | Publication date |
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US9084368B2 (en) | 2015-07-14 |
US20120319967A1 (en) | 2012-12-20 |
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AS | Assignment |
Owner name: NOVATEK MICROELECTRONICS CORP., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:TSAI, JIUN-JIE;LIN, CHING-CHUN;CHANG, TSEN-WEI;AND OTHERS;SIGNING DATES FROM 20140814 TO 20141006;REEL/FRAME:033926/0216 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |