JP2011248810A - Input device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an input device particularly capable of improving the connection reliability between connections of flexible printed boards and terminal parts of the flexible printed boards when the boards are bent.SOLUTION: A flexible printed board 54 to be connected to an input device is configured to have a wiring region 54b in which a wiring part is laid on a surface of a flexible base, a first terminal part 80 to be electrically connected to a first connection of the input device, and a second terminal part 81 to be electrically connected to a second connection of the input device. First notch parts 83-85 which communicate with the outside are formed between the first terminal part 80 and the second terminal part 81, and second notch parts 86, 87 which communicate with the outside are formed between the first terminal part 80 and the wiring region 54b, with the second terminal part 81 and the wiring region 54b formed to be continued to each other.

Description

  The present invention has a lower substrate and an upper substrate having a transparent conductive layer and a wiring layer formed on a substrate surface, and a flexible printed circuit board electrically connected to each substrate, and particularly relates to a structure of the flexible printed circuit board.

  In the following Patent Documents 1 to 4, the structure of an input device including a lower substrate and an upper substrate in which a transparent conductive layer and a wiring layer are formed on the surface of a base material, and a flexible printed circuit board electrically connected to each substrate Is disclosed.

  When the flexible printed circuit board is bent downward in the vicinity of the connection position with each board as the input side surface of the input device becomes fully flat, all the terminal parts of the flexible printed circuit board have the conventional flexible printed circuit board structure. Thus, an upward force is generated, and a peeling force is applied between the connection portion of the lower substrate and the terminal portion of the flexible printed circuit board. As a result, the connection portion of the lower substrate and the terminal portion of the flexible printed circuit board are easily peeled off, and there is a problem that connection reliability is lowered.

Japanese Patent Laid-Open No. 10-312244 International Publication Number WO2009 / 057628 JP 2006-48388 A JP 2003-288166 A

  Therefore, the present invention is for solving the above-described conventional problems, and in particular, the connection reliability between the connection portion of each substrate and each terminal portion of the flexible printed circuit board when the flexible printed circuit board is bent is more than conventional. An object is to provide an input device that can be improved.

In the input device according to the present invention, a lower substrate and an upper substrate are disposed to face each other in the height direction, and the lower substrate and the upper substrate each have a base material having a transparent conductive layer formed on a surface thereof, And a wiring layer formed in a non-input area outside the input area on the surface, and the first wiring layer provided on the lower board is extended to a connection position with the flexible printed board. The second wiring layer provided on the upper substrate is extended to a connection position with the flexible printed circuit board and is not overlapped with the first connection portion in plan view. The second connecting part,
The flexible printed circuit board includes a wiring region in which a wiring part is routed on a surface of a flexible base material, and a part of the wiring part that extends from the flexible base material and the wiring region. A first terminal portion electrically connected to the first connection portion; and a portion of the wiring portion extending from the flexible base material and the wiring region and electrically connected to the second connection portion. A second terminal portion to be connected, and
A first cutout portion that leads to the outside is formed between the first terminal portion and the second terminal portion, and a second that leads to the outside is formed between the first terminal portion and the wiring region. The second terminal portion and the wiring region are continuously formed.

  In the present invention, due to the structure of the flexible printed circuit board as described above, even if the flexible printed circuit board is bent downward, it is possible to suppress an upward force from being generated in the first terminal part. It can suppress that peeling force is added between 1st connection parts. On the other hand, when the flexible printed circuit board is bent downward, an upward force can be generated in the second terminal portion, and the second terminal portion is in close contact between the second terminal portion and the second connection portion. It is possible to apply a force in the direction. As described above, when the flexible printed board is bent downward, the connection reliability between each terminal portion and each connection portion can be effectively improved.

In the present invention, the plurality of first connection portions and the plurality of second connection portions are alternately formed in a plan view, and are electrically connected to each first connection portion and each second connection portion. A plurality of the first terminal portions and a plurality of the second terminal portions provided on the substrate are alternately arranged in parallel,
The first notch portions are formed between the first terminal portions and the second terminal portions, respectively, and the second notch portions are respectively formed between the first terminal portions and the wiring regions. Of the second notches, the second notch with respect to the first terminal provided between the second terminal portions is integrally formed with the first notch. It is preferable to communicate with the direction.

  Moreover, in this invention, the said flexible printed circuit board is the structure by which the said wiring part intervenes between the 1st base material located in the lower side which is the said flexible base material, and the 2nd base material located in an upper side, The first base material is removed at the position of the first terminal portion, a part of the wiring portion is exposed from the flexible base material, and the second base material at the position of the second terminal portion. It is preferable that a part of the wiring part is exposed from the flexible base material.

  According to the input device of the present invention, even when the flexible printed circuit board is bent downward, it is possible to suppress the upward force from being generated in the first terminal portion, and accordingly, the first terminal portion and the first connecting portion. It can suppress that peeling force is added in between. On the other hand, when the flexible printed circuit board is bent downward, an upward force can be generated in the second terminal portion, and the second terminal portion is in close contact between the second terminal portion and the second connection portion. It is possible to apply a force in the direction. As described above, when the flexible printed board is bent downward, the connection reliability between each terminal portion and each connection portion can be effectively improved.

FIG. 1 is a perspective view of an input device (touch panel) in the present embodiment, FIG. 2 is an exploded perspective view of the input device (FFP structure) in the present embodiment. FIG. 3A is a partially enlarged longitudinal sectional view taken along the line AA at the position of the hole-shaped second space portion just formed in the upper base material shown in FIG. 2, FIG. FIG. 2 is a partially enlarged longitudinal sectional view taken along the line BB at the position of the first space portion of the notch shape formed in the lower base material shown in FIG. FIG. 4 is a partially enlarged perspective view of the input device showing the connection state of the flexible printed circuit board (however, only the second space portion and the second connection portion are illustrated by dotted lines for the upper substrate, and each member above the upper substrate is illustrated. Not shown) FIG. 5A is a plan view of the flexible printed circuit board in the present embodiment, and FIG. 5B is a sectional view of the flexible printed circuit board cut along the line CC shown in FIG. FIG. 5C is a partially enlarged longitudinal sectional view, and FIG. 5D is a partially enlarged longitudinal sectional view of the flexible printed circuit board cut along the line DD shown in FIG. , Perspective view of the wiring part formed on the flexible printed circuit board, The partial expanded longitudinal cross-sectional view which shows the structure (FFP structure) of another input device of this embodiment, The disassembled perspective view which shows the structure (FP structure) of the input device of this embodiment different from FIG.

  FIG. 1 is a perspective view of an input device (touch panel) according to the present embodiment, FIG. 2 is an exploded perspective view of the input device according to the present embodiment, and FIG. 3A is formed on the upper base material shown in FIG. FIG. 3B is a partially enlarged longitudinal sectional view taken along the line AA at the position of the hole-shaped second space portion, and FIG. 3B is a first notch-shaped first formed in the lower base material shown in FIG. FIG. 4 is a partially enlarged perspective view of the input device showing a connection state of the flexible printed circuit board (however, for the upper substrate, the second space portion). And only the second connection portion is indicated by dotted lines, and each member above the upper substrate is not shown.) FIG. 5A is a plan view of the flexible printed circuit board according to the present embodiment, and FIG. ) Is an arrow cut along the line CC shown in FIG. FIG. 5C is a partially enlarged longitudinal sectional view of the flexible printed circuit board viewed from the direction, and is a partially enlarged longitudinal sectional view of the flexible printed circuit board cut along the line DD shown in FIG. FIG. 5D is a perspective view of a wiring portion formed on the flexible printed circuit board.

  The input device 20 shown in FIG. 1 constitutes a resistance input device having an FFP structure (Film-Film-Plastics). As shown in FIG. 2, the input device 20 includes a lower substrate 22, an upper substrate 21, a surface member 60, and a flexible printed circuit board 54.

  As shown in FIGS. 2 and 3, the lower substrate 22 includes a film-like lower base material 50 in which a transparent conductive layer such as ITO is formed on the surface of a translucent base material, and a first wiring layer 52. Configured.

  Here, in this embodiment, “translucency” and “transparent” indicate a state where the visible light transmittance is 70% or more. Further, it is preferable that the haze value is 6 or less.

  As shown in FIGS. 2 and 3, a support plate 55 made of a translucent substrate is provided on the lower surface side of the lower substrate 22, and an optical transparent adhesive layer (OCA) is provided between the lower substrate 22 and the support plate 55. 56 is joined. The support plate 55 is formed of a plastic plate that is thicker than the lower substrate 22.

  As shown in FIGS. 2 and 3, the upper substrate 21 faces the lower substrate 22 with a predetermined interval in the height direction (Z). The upper substrate 21 has the same configuration as the lower substrate 22. That is, the upper substrate 21 includes a film-like upper base material 66 in which a transparent conductive layer such as ITO is formed on the surface of the translucent base material and the second wiring layer 45.

  Translucent base materials used for the lower substrate 22 and the upper substrate 21 are polycarbonate resin (PC resin), polyethylene terephthalate resin (PET resin), polyethylene naphthalate resin (PEN resin), cyclic polyolefin (COP resin), polymethacrylic acid It is formed of a transparent substrate such as methyl resin (acrylic) (PMMA).

The transparent conductive layer used for the lower substrate 22 and the upper substrate 21 is formed by forming an inorganic transparent conductive material such as ITO (Indium Tin Oxide), SnO ₂ , or ZnO by sputtering or vapor deposition. Alternatively, a fine powder of these inorganic transparent conductive materials may be fixed. Alternatively, an organic transparent conductive material coated with an organic conductive polymer such as carbon nanotube, polythiofin, or polypyrrole may be used.

  The wiring layers 45 and 52 formed on the surfaces of the lower base material and the upper base material are formed by screen printing an Ag coating film, for example. Each wiring layer 45, 52 is formed on a transparent conductive layer formed on the surface of the translucent substrate. Or a part of wiring layers 45 and 52 may be formed in the surface of the translucent base material which the transparent conductive layer removed and exposed.

  As shown in FIGS. 2 and 3, the lower substrate 22 and the upper substrate 21 are bonded to each other via an adhesive layer 40 in a non-input region 20b located on the outer periphery of the input region 20a. The adhesive layer 40 is an acrylic double-sided tape or an acrylic adhesive.

  As shown in FIG. 3, the surface of the first wiring layer 52 of the lower substrate 22 is covered with an insulating layer 53, and the surface of the second wiring layer 45 of the upper substrate 21 is covered with an insulating layer 57. The insulating layers 53 and 57 are joined by the adhesive layer 40. For the insulating layers 53 and 57, a resist material, a thermosetting resin, a thermoplastic resin, or the like can be used.

  In the input area 20a, the adhesive layer 40 is not provided between the lower substrate 22 and the upper substrate 21, and an air layer is provided.

  2 and 3 includes a surface layer 61 and a decorative layer 62 formed on the lower surface of the surface layer 61. The surface layer 61 is formed of a flexible translucent substrate. The decoration layer 62 is formed in the non-input area 20b. The surface member 60 and the upper substrate 21 are joined via an optical transparent adhesive layer (OCA) 63.

  When the operator presses the input region 20a located on the surface of the surface layer 61 shown in FIG. 1 downward with a finger or a pen, the upper substrate 21 bends downward, and the lower substrate 22 and the upper substrate located in the input region 20a. Each of the 21 transparent conductive layers abuts. At this time, in the wiring layer electrically connected to each transparent conductive layer, a detection output (voltage) corresponding to the contact position between the transparent conductive layers can be obtained, and based on the detection output, in the input region 20a The operation position can be detected.

  As shown in FIGS. 2, 3A, and 4, the upper substrate 21 has a plurality of hole-shaped second space portions 21a and 21a that penetrate in the height direction (Z) at intervals in the X1-X2 direction. Are formed. Each 2nd space part 21a, 21a is formed in the non-input area | region 20b.

  As shown in FIGS. 2 and 3A, the optical transparent adhesive layer 63 interposed between the upper substrate 21 and the surface member 60 has the second space portions 21 a and 21 a formed on the upper substrate 21 and a high height. Hole-shaped spaces 63a and 63a communicating in the vertical direction are formed. Therefore, as shown in FIG. 3A, a part of the decorative layer 62 is exposed downward through the second space portions 21a and 21a formed on the upper substrate 21 and the space portion 63a formed on the optical transparent adhesive layer 63. is doing.

  As shown in FIGS. 2, 3 (b), and 4, the second wiring layer 45 provided on the upper substrate 21 is connected to a plurality of second terminal portions 81, 81 formed on the flexible printed circuit board 54. It is extended to the connection position and constitutes the second connection parts 45a and 45a. As shown in FIG. 4, one second connection portion 45 a is formed at a position between the second space portions 21 a and 21 a formed on the upper substrate 21, and the other second connection portion 45 a It is formed in the side part located in the X2 side of the space part 21a. Therefore, as shown in FIG. 4, the plurality of second space portions 21a, 21a and the plurality of second connection portions 45a, 45a are alternately arranged in parallel in the X1-X2 direction.

  The plurality of second terminal portions 81 and 81 formed on the flexible printed circuit board 54 shown in FIG. 3B and FIG. 4 and the plurality of second connection portions 45a and 45a formed on the upper substrate 21 are electrically connected. Connected.

  As shown in FIG. 2, FIG. 3B, and FIG. 4, the lower substrate 22 has notched first space portions 22a and 22a that penetrate in the height direction (Z) with an interval in the X1-X2 direction. Are formed. Each first space 22a, 22a is formed in the non-input area 20b.

  As shown in FIG. 4, the first space portions 22a and 22a formed in the lower substrate 22 are formed in regions facing the second terminal portions 81 and 81 of the flexible printed circuit board 54 in the height direction (Z). The Therefore, as shown in FIG. 3B and FIG. 4, the first space portions 22a and 22a, the second terminal portions 81 and 81, and the second connection portions 45a and 45b are aligned in the height direction (Z). Yes.

  As shown in FIGS. 2, 3 (b), and 4, the support plate 55 has a hole shape that extends continuously in the height direction (Z) with the first spaces 22 a and 22 a formed in the lower substrate 22. A plurality of the space portions 55a and 55a are formed.

  As shown in FIGS. 2 and 3B, the transparent optical adhesive layer 56 interposed between the lower substrate 22 and the support plate 55 is continuous with the first space 22a formed in the lower substrate 22. A plurality of notch-shaped space portions 56a, 56a are formed.

  As shown in FIGS. 2, 3 (a), and 4, the first wiring layer 52 provided on the lower substrate 22 is connected to a plurality of first terminal portions 80 and 80 formed on the flexible printed board 54. It is extended to the connection position and constitutes a plurality of first connection parts 52a, 52a.

  As shown in FIG. 4, one first connection portion 52 a is formed at a position between the first space portions 22 a and 22 a formed on the lower substrate 22, and the other first connection portion 52 a It is formed in the side part located in the X1 side of the space part 22a. Therefore, as shown in FIG. 4, the plurality of first space portions 22a and 22a and the plurality of first connection portions 52a and 52a are alternately arranged in parallel in the X1-X2 direction.

  The plurality of first terminal portions 80, 80 formed on the flexible printed board 54 shown in FIGS. 3A and 4 and the plurality of first connection portions 52a, 52a formed on the lower substrate 22 are electrically connected. Connected.

Next, the structure of the flexible printed circuit board 54 will be described with reference to FIG.
5 (b) and 5 (c), the flexible printed circuit board 54 is formed between the second base material 70 located on the upper side and the first base material 75 located on the lower side, as shown in FIG. b) A plurality of wiring portions 72 shown in (c) and (d) are interposed.

  As shown in FIGS. 5B and 5C, the second base material 70 and the first base material 75 are directly bonded via the adhesive layer 71 at a place where the wiring portion 72 is not interposed.

  As shown in FIG. 5D, a total of four wiring portions 72 are arranged at intervals, and each wiring portion 72 extends from the front end (Y1 side) to the rear end (Y2 side) of the flexible printed circuit board 54. ) Is extended toward. The distal end portion 54a of the flexible printed circuit board 54 includes a wiring region 54b in which each wiring portion 72 is routed, a plurality of first terminal portions 80 and a plurality of second terminal portions 81 formed on the Y1 side of the wiring region 54b. It is comprised.

  In the wiring area 54b of the flexible printed circuit board 54, each wiring part 72 is interposed between the second base material 70 and the first base material 75, and each wiring part 72 is not exposed to the outside.

  On the other hand, in the first terminal portion 80, as shown in FIG. 5B, the first base material 75 is removed, and a part of the wiring portion 72 is exposed downward. At the position of the first terminal portion 80, as shown in FIG. 5D, a part of the wiring portion 72 is a wide pad portion 72a. In the present embodiment, an electrode layer 73 is formed on the surface of the wiring portion 72 (pad portion 72 a) exposed at the first terminal portion 80, and the electrode layer 73 is covered with an anisotropic conductive layer 74. It has become. Thus, the thickness of the first terminal portion 80 is increased by adding the electrode layer 73 and the anisotropic conductive layer 74. As shown in FIG. 3A, the first terminal portion 80 and the first connection portion 52 a are electrically connected via the anisotropic conductive layer 74.

  In the second terminal portion 81, as shown in FIG. 5C, the second base material 70 is removed and a part of the wiring portion 72 is exposed upward. At the position of the second terminal portion 81, as shown in FIG. 5D, a part of the wiring portion 72 is a wide pad portion 72a. In the present embodiment, an electrode layer 76 is formed on the surface of the wiring portion 72 (pad portion 72 a) exposed at the second terminal portion 81, and the electrode layer 76 is covered with an anisotropic conductive layer 77. It has become. As described above, the thickness of the second terminal portion 81 is increased by adding the electrode layer 76 and the anisotropic conductive layer 77. As shown in FIG. 3B, the second terminal portion 81 and the second connection portion 45 a are electrically connected via the anisotropic conductive layer 77.

  Further, as shown in FIG. 5C, an adhesive layer (double-sided tape) 78 that is bonded to the support plate 55 is provided on the lower surface of the first base material 75.

  The 2nd base material 70 and the 1st base material 75 are formed with a polyimide film, for example. The wiring part 72 is mainly formed of a copper foil layer, for example. The electrode layers 73 and 76 are made of, for example, a silver layer.

  As shown in FIGS. 5A and 5D, the two first terminal portions 80 and the two second terminal portions 81 are alternately arranged in parallel at an interval in the X1-X2 direction. And between each 1st terminal part 80 and each 2nd terminal part 81, it forms in the Y1-Y2 direction and the 1st notch part 83, 84, 85 which leads to the outward of Y1 side is formed. Has been. A part of the first terminal portion 80 is connected to the second terminal portion 81 at a position where the first cutout portions 83, 84, 85 are not formed.

  Further, as shown in FIGS. 5A and 5D, there is X1- between the first terminal portion 80 formed on the most X1 side and the wiring region 54b located on the Y2 side of the first terminal portion 80. A second cutout portion 86 is formed that extends in the X2 direction and communicates outward on the X1 side. Further, as shown in FIGS. 5A and 5D, between the first terminal portion 80 located between the second terminal portions 81, 81 and the wiring region 54 b located on the Y2 side of the first terminal portion 80. The second notch 87 is formed in the X1-X2 direction, and the second notch 87 is integrated with the first notch 84 and communicates outward on the Y1 side.

  Further, as shown in FIGS. 5A and 5D, each second terminal portion 81 and the wiring region 54b are formed continuously. That is, unlike each of the first terminal portions 80 and the wiring region 54b, a second cutout portion extending in the Y1-Y2 direction and leading to the outside is formed between each second terminal portion 81 and the wiring region 54b. Not.

  In the flexible printed circuit board 54 of the present embodiment shown in FIGS. 5A and 5D, a part of the first terminal portion 80 is in the X1-X2 direction in a region near the wiring region 54b of the second terminal portion 81. The second cutout portions 86 and 87 are formed between each first terminal portion 80 and the wiring region 54b, and the wiring is routed from the pad portion 72a of each first terminal portion 80 in the X1-X2 direction. The first terminal portion 80 is formed so as to be completely separated from the second terminal portion 81 and connected to the wiring region 54b via the detour. Also good.

  On the other hand, unlike the first terminal unit 80, the second terminal unit 81 does not bypass the wiring, and the wiring is drawn out substantially straight from the wiring region 54b and connected to the pad 72a of the second terminal unit 81. The second terminal portion 81 and the wiring region 54b can be continuously formed ”.

  In this embodiment, the flexible printed circuit board 54 drawn out from the side portion of the input device 20 is bent downward as the input side surface of the input device is fully flattened, as indicated by symbol E in FIG.

  Alternatively, as shown in the structure of FIG. 6, the flexible printed circuit board 54 can be bent downward inside the input device, and the flexible printed circuit board 54 can be extended downward from the through hole 88 formed in the support plate 55. .

  As shown in FIGS. 5A and 5D, the flexible printed circuit board 54 of the present embodiment has first cutout portions 83 to 85 communicating between the first terminal portion 80 and the second terminal portion 81. Are formed, and second notches 86 and 87 leading to the outside are formed between the first terminal portion 80 and the wiring region 54b.

  For this reason, even if the flexible printed circuit board 54 is bent downward as described above, the second cutout portions 86 and 87 are provided, so that upward force is hardly generated in each first terminal portion 80 through the wiring region 54b. (If it occurs, the upward force can be made smaller than before). On the other hand, an upward force is easily generated in the second terminal portion 81 continuous to the wiring region 54b by bending the flexible printed circuit board 54 downward, but the first terminal portion 80 and the second terminal portion 81 are By forming the first cutout portions 83 to 85, an upward force is hardly generated in each first terminal portion 80 through each second terminal portion 81.

  Thus, according to the structure of the flexible printed circuit board 54 of the present embodiment, even if the flexible printed circuit board 54 is bent downward, it is possible to suppress an upward force from being generated in each first terminal portion 80 as compared to the conventional case. Therefore, it is possible to suppress a peeling force from being generated between each first terminal portion 80 and each first connection portion 52a, 52a of the lower substrate 22.

  On the other hand, since each second terminal portion 81 is formed continuously with the wiring region 54b, when the flexible printed circuit board 54 is bent downward, an upward force is applied to the second terminal portion 81, and each second terminal portion 81 A force in a close contact direction is generated between the second connection portions 45 a and 45 a formed on the upper substrate 21 and 81.

  As described above, in the present embodiment, when the flexible printed board 54 is bent downward, the connection reliability between each terminal portion and each connection portion can be effectively improved.

  In the present embodiment, as shown in FIGS. 5A and 5B, a plurality of first terminal portions 80 and a plurality of second terminal portions 81 are alternately arranged in parallel in the X1-X2 direction. And the 1st notch parts 83-85 which face the Y1-Y2 direction between each 1st terminal part 80 and each 2nd terminal part 81 are formed, and each 1st terminal part 80 and the wiring area | region 54b are formed. The second notches 86 and 87 are formed in the direction X1-X2. Of the second cutout portions 86 and 87, the second cutout portion 87 formed with respect to the first terminal portion 80 located between the second terminal portions 81 and 81 is connected to the first cutout portion 84. Together, it leads to the outside.

  With the structure of the flexible printed circuit board 54 described above, the first cutout portions 83 to 85 and the second cutout portions 86 and 87 for the plurality of first terminal portions 80 can be easily and appropriately formed.

  As shown in FIGS. 5B and 5C, the flexible printed circuit board 54 of the present embodiment has a wiring portion 72 interposed between the second base material 70 and the first base material 75, which are flexible base materials. The first base material 75 is removed at the position of the first terminal portion 80 and a part of the wiring portion 72 is exposed from the flexible base material, and at the position of the second terminal portion 81, The second base material 70 is removed, and a part of the wiring part 72 is exposed from the flexible base material. Furthermore, electrode layers 73 and 76 are provided on each first terminal portion 80 and each second terminal portion 81. The electrode layers 73 and 76 and the connection portions 45a and 52a are electrically connected through anisotropic conductive layers (ACP) 74 and 77, respectively. Note that conductive connection can be made by a method other than the anisotropic conductive layers 74 and 77.

  In the present embodiment, the first terminal portion 80 and the second terminal portion 81 can be formed with a simple and thin structure by adopting the laminated structure of the flexible printed board shown in FIG.

  In the present embodiment, in the input device having the FFP structure shown in FIG. 3A, the second substrate 21a is formed on the upper substrate 21 in a region facing the first terminal unit 80 formed on the flexible printed circuit board 54. Has been. Accordingly, the thickness of the first terminal portion 80 of the flexible printed circuit board 54 can be appropriately absorbed by the second space portion 21a of the upper substrate 21 (the first terminal portion 80 can escape into the second space portion 21a). Yes).

  In the present embodiment, in the FFP structure input device shown in FIG. 3B, the first substrate 22a is formed on the lower substrate 22 in a region facing the second terminal portion 81 formed on the flexible printed circuit board 54. Has been. Therefore, the thickness of the second terminal portion 81 of the flexible printed circuit board 54 can be appropriately absorbed by the first space portion 22a of the lower substrate 22 (the second terminal portion 81 can escape into the first space portion 22a). Yes).

  As described above, in the present embodiment, in the FFP structure, the flexible printed circuit board 54 can escape to the respective spaces formed in the lower substrate 22 and the upper substrate 21, and it is appropriate that the surface member 60 has irregularities on the surface. Can be suppressed.

  In addition to the FFP (Film-Film-Plastics) structure shown in FIGS. 1, 2, and 3, the flexible printed circuit board 54 in this embodiment is preferably applied to an FP (Film-Plastics) structure shown in FIG. 7. I can do it.

  The input device shown in FIG. 7 includes a lower substrate 90, a pressure-sensitive adhesive layer 91, an insulating layer 92, a second wiring layer 93, and a surface in which a transparent transparent conductive layer and a first wiring layer are formed on the surface of a plastic substrate from below. In this structure, an upper substrate 95, a decorative layer 96, and a film-like surface layer 97 are laminated in this order. Although not shown, the surface member 98 composed of the decorative layer 96 and the surface layer 97 and the upper substrate 95 are joined by an optical transparent adhesive layer (OCA).

  And the 1st terminal parts 80 and 80 of the flexible printed circuit board 54 of this embodiment are electrically connected to the 1st connection parts 90a and 90a of the lower board | substrate 90, and the 2nd terminal parts 81 and 81 of the flexible printed circuit board 54 are connected. The second connection portions 95a and 95a of the upper substrate 95 are electrically connected. The lower substrate 90 has a concave portion 90b formed in a region facing each terminal portion of the flexible printed circuit board 54, and the distal end portion of the flexible printed circuit board 54 can be accommodated in the concave portion 90b. Is preferred.

  In the input device having the FP structure shown in FIG. 7, when the vicinity of the tip of the flexible printed circuit board 54 having the structure shown in FIG. 5 is bent downward, the connection reliability between each terminal part and each connection part is higher than that of the conventional case. It can be improved effectively.

20 input device 20a input area 20b non-input area 21, 95 upper substrate 21a, 95a second space 22, 90 lower substrate 22a first space 40, 91 adhesive layer 45, 93 second wiring layer 45a second connection 52 First wiring layers 52a, 90a First connection portion 54 Flexible printed circuit board 54a Tip portion 54b Wiring region 55 Support plates 55a, 56a, 63a Space portions 56, 63 Optical transparent adhesive layers 60, 98 Surface members 61, 97 Surface layer 62 96 Decorating layer 70 Second base material 72 Wiring parts 73, 76 Electrode layers 74, 77 Anisotropic conductive layer 75 First base material 80 First terminal part 81 Second terminal parts 83, 84, 85 First notch Part 86, 87 second notch

Claims (3)

A lower substrate and an upper substrate are disposed to face each other in the height direction, and each of the lower substrate and the upper substrate includes a base material on which a transparent conductive layer is formed, and an outer surface of the input region on the surface of the base material The first wiring layer provided on the lower substrate is extended to the connection position with the flexible printed circuit board to form the first connection portion. The second wiring layer provided on the upper substrate is extended to a connection position with the flexible printed circuit board, and the second connection portion is configured at a position not overlapping the first connection portion in plan view. And
The flexible printed circuit board includes a wiring region in which a wiring part is routed on a surface of a flexible base material, and a part of the wiring part that extends from the flexible base material and the wiring region. A first terminal portion electrically connected to the first connection portion, and a part of the wiring portion extending from the flexible base material and the wiring region, and electrically connected to the second connection portion A second terminal portion to be connected, and
A first cutout portion that leads to the outside is formed between the first terminal portion and the second terminal portion, and a second that leads to the outside is formed between the first terminal portion and the wiring region. The input device is characterized in that the second terminal portion and the wiring region are formed continuously. The plurality of first connection portions and the plurality of second connection portions are alternately formed in a plan view, and are provided on the flexible printed circuit board that is electrically connected to each first connection portion and each second connection portion. The plurality of first terminal portions and the plurality of second terminal portions are alternately arranged in parallel,
The first notch portions are formed between the first terminal portions and the second terminal portions, respectively, and the second notch portions are respectively formed between the first terminal portions and the wiring regions. Of the second notches, the second notch with respect to the first terminal provided between the second terminal portions is integrally formed with the first notch. The input device according to claim 1, wherein   The flexible printed circuit board has a configuration in which the wiring portion is interposed between a first base material located on the lower side which is the flexible base material and a second base material located on the upper side, and the first terminal portion. The first base material is removed at the position, a part of the wiring part is exposed from the flexible base material, the second base material is removed at the position of the second terminal part, The input device according to claim 1, wherein a part of the wiring portion is exposed from the flexible base material.

Images