WO2011152175A1

WO2011152175A1 - Input device

Info

Publication number: WO2011152175A1
Application number: PCT/JP2011/060704
Authority: WO
Inventors: 一芳山縣; 英人笹川; 潤鈴木; 裕高島
Original assignee: アルプス電気株式会社
Priority date: 2010-05-31
Filing date: 2011-05-10
Publication date: 2011-12-08
Also published as: CN102918479B; CN102918479A; JPWO2011152175A1

Abstract

The purpose is to provide an input device that: improves the structure of a lower substrate and an upper substrate that have a flexible printed substrate disposed in the region therebetween; is capable of absorbing the thickness of a flexible printed substrate; and is capable of achieving excellent connectivity. A first wiring layer (52) provided on a lower substrate (22) extends to points of connection with a flexible printed substrate (54), thereby forming first connecting units (52a). A second wiring layer (45) provided on an upper substrate (21) extends to points of connection with the flexible printed substrate (54) without overlapping the first connecting units (52a), and thereby forms second connecting units (45a). First terminal units (80) that connect to the first connecting units and second terminal units (81) that connect to the second connecting units are formed on the flexible printed substrate (54). Recesses (21a, 22a) are formed in the height direction on the upper substrate (21) that faces the first terminal unit (80) and on the lower substrate (22) that faces the second terminal unit (81).

Description

Input device

The present invention relates to an input device in which a flexible printed circuit board is interposed between an upper substrate and a lower substrate in which a transparent conductive layer and a wiring layer are formed on a substrate surface.

The following Patent Documents 1 to 3 disclose the structure of an input device in which a flexible printed board is interposed between a pair of boards. The input device includes a lower substrate and an upper substrate on which a transparent conductive layer and a wiring layer are formed on a surface of a base material, and the flexible printed circuit board is formed of the wiring layer routed in a non-input region on the outer periphery of the input region. It is electrically connected to the connection.

However, since the portion of the terminal portion of the flexible printed circuit board is thick with a structure in which a plurality of base materials and metal wiring portions are stacked, as shown in FIG. There is a problem that the region is raised and unevenness is formed on the surface of the input device.

In an FFP (Film-Film-Plastics) structure in which a flexible printed board is sandwiched between upper and lower electrode films (upper board and lower board), for example, at the connection position between the connecting part of the upper board and the terminal part of the flexible printed board, The interval at which the flexible printed board can enter is substantially determined by an interval T1 obtained by adding the thickness of the adhesive layer between the upper substrate and the lower substrate and the thickness of the connecting portion of the lower substrate. For this reason, if the thickness of the terminal portion of the flexible printed circuit board is larger than the interval T1, when the flexible printed circuit board is sandwiched between the upper and lower electrode films, the terminal section of the flexible printed circuit board has the upper electrode film. When pushed up, irregularities are formed on the surface of the input device.

In the FFP structure, the interval at which the flexible printed circuit board can enter between the upper and lower electrode films is narrowed, and the thickness of the adhesive layer also varies due to the pressure. Therefore, the interval T1 is fluid, particularly in the FFP structure. Unevenness was easily formed on the surface.

Patent Document 2 discloses a structure in which, for example, a notch is formed in a protective panel (surface member), and the exposed upper substrate is pressed to connect each terminal portion of the flexible printed circuit board to the connection portion of each substrate. However, with such a structure, a notch remains on the surface of the protective panel (surface member), or another member can be buried in the notch, but the surface can be stably manufactured at low cost. Can't promote flattening. Furthermore, since each terminal part of a flexible printed circuit board and the connection part of each board | substrate cannot be pressed directly, sufficient connection stability cannot be acquired.

Japanese Patent Laid-Open No. 2002-82774 International Publication Number WO2009 / 057628 JP 2008-21304 A

Accordingly, the present invention is to solve the above-described conventional problems, and in particular, by improving the structure of the lower substrate and the upper substrate in the region where the flexible printed circuit board is interposed, the thickness of the flexible printed circuit board is increased in each substrate. An object of the present invention is to provide an input device that can absorb and obtain excellent connectivity.

The input device in the present invention is
A lower substrate and an upper substrate are disposed to face each other in the height direction, and each of the lower substrate and the upper substrate includes a base material on which a transparent conductive layer is formed, and an outer surface of the input region on the surface of the base material. The first wiring layer provided on the lower substrate is extended to the connection position with the flexible printed circuit board to form the first connection portion. The second wiring layer provided on the upper substrate is extended to a connection position with the flexible printed circuit board, and the second connection portion is configured at a position not overlapping the first connection portion in plan view. And
A first terminal part electrically connected to the first connection part and a second terminal part electrically connected to the second connection part do not overlap the flexible printed circuit board in a plan view. Formed,
In the region of the upper substrate that faces the first terminal portion in the height direction and the region of the lower substrate that faces the second terminal portion in the height direction, a space portion is formed that extends in the height direction. It is characterized by being.

As described above, the thickness of the first terminal portion of the flexible printed board can be absorbed by the space portion (second space portion) formed on the upper substrate, and the thickness of the second terminal portion of the flexible printed board is formed on the lower substrate. Therefore, it is possible to appropriately suppress the formation of irregularities on the surface of the input device as compared with the conventional case. In addition, by using the space portion, the first terminal portion and the first connection portion, and the second terminal portion and the second connection portion can be directly pressed and connected to obtain excellent connectivity. I can do it.

In the present invention, the plurality of first connection portions, the plurality of second connection portions, the first connection portions, and the plurality of first connections provided on the flexible printed circuit board electrically connected to the second connection portions. One terminal portion and a plurality of second terminal portions, and a plurality of second space portions provided on the upper substrate facing each first terminal portion in the height direction and each second terminal portion in the height direction It is preferable that the plurality of first space portions provided in the opposed lower substrate are alternately formed in plan view.

Thereby, the thickness of each of the plurality of first terminal portions and the second terminal portions can be appropriately and stably absorbed in each space, and between each first terminal portion and each first connection portion. The connectivity and connectivity between each second terminal portion and each second connection portion can be stably improved. In particular, the present invention can be preferably applied to an FFP (Film-Film-Plastics) structure.

Further, in the present invention, on the upper surface side of the upper substrate, a surface layer made of a translucent base material, and a surface member having a decorative layer provided on the lower surface of the surface layer and in the non-input area, A transparent adhesive layer interposed between the upper substrate and the surface member is provided,
It is preferable that the transparent adhesive layer is formed with a space portion that extends continuously in the height direction from the second space portion formed on the upper substrate.

Further, in the present invention, a support plate is provided on the lower surface side of the lower substrate, and the support plate has a space portion that extends continuously in a height direction from the first space portion formed in the lower substrate. Is preferably formed.

In the present invention, it is preferable that the first space portion formed in the lower substrate and the second space portion formed in the upper substrate are formed in a notch shape or a hole shape.

According to the input device of the present invention, the thickness of the first terminal portion of the flexible printed circuit board can be absorbed by the space portion (second space portion) formed on the upper substrate, and the thickness of the second terminal portion of the flexible printed circuit board can be absorbed. This can be absorbed by the space portion (first space portion) formed in the lower substrate. Therefore, it is possible to appropriately suppress the formation of irregularities on the surface of the input device as compared with the conventional case. In addition, by using the space portion, the first terminal portion and the first connection portion, and the second terminal portion and the second connection portion can be directly pressed and connected to obtain excellent connectivity. I can do it.

FIG. 1 is a perspective view of an input device (touch panel) in the present embodiment, FIG. 2 is an exploded perspective view of the input device (FFP structure) in the present embodiment. FIG. 3A is a partially enlarged longitudinal sectional view taken along the line AA at the position of the hole-shaped second space portion just formed in the upper base material shown in FIG. 2, and FIG. FIG. 2 is a partially enlarged longitudinal sectional view taken along the line BB at the position of the first space portion of the notch shape formed in the lower base material shown in FIG. FIG. 4 is a partially enlarged perspective view of the input device showing the connection state of the flexible printed circuit board (however, only the second space portion and the second connection portion are illustrated by dotted lines for the upper substrate, and each member above the upper substrate is illustrated. Not shown) FIG. 5A is a plan view of the flexible printed circuit board according to the present embodiment, and FIG. 5B is a cross-sectional view taken along the line CC shown in FIG. FIG. 5C is a partially enlarged longitudinal sectional view, and FIG. 5D is a partially enlarged longitudinal sectional view of the flexible printed circuit board cut along the line DD shown in FIG. , Perspective view of the wiring part formed on the flexible printed circuit board, The partial expanded longitudinal cross-sectional view which shows the structure (FFP structure) of another input device of this embodiment, The partial expansion perspective view which shows the flexible printed circuit board of the structure different from the flexible printed circuit board shown in FIG. 5 used for the input device of this embodiment.

FIG. 1 is a perspective view of an input device (touch panel) according to the present embodiment, FIG. 2 is an exploded perspective view of the input device according to the present embodiment, and FIG. 3A is formed on the upper base material shown in FIG. FIG. 3B is a partially enlarged longitudinal sectional view taken along the line AA at the position of the hole-shaped second space, and FIG. 3B is a first notch-shaped first formed in the lower base material shown in FIG. FIG. 4 is a partial enlarged longitudinal sectional view taken along the line BB at the position of the space portion, and FIG. 4 is a partial enlarged perspective view of the input device showing a connection state of the flexible printed circuit board (however, the second space portion is shown for the upper substrate). And only the second connection portion is indicated by dotted lines, and each member above the upper substrate is not shown.) FIG. 5A is a plan view of the flexible printed circuit board according to the present embodiment, and FIG. ) Is cut along the line CC shown in FIG. FIG. 5C is a partially enlarged longitudinal sectional view of the flexible printed circuit board as viewed from the direction. FIG. 5C is a partially enlarged longitudinal sectional view of the flexible printed circuit board cut along the line DD shown in FIG. FIG. 5D is a perspective view of a wiring portion formed on the flexible printed circuit board.

The input device 20 shown in FIG. 1 constitutes an FFP structure (Film-Film-Plastics) resistance input device. As shown in FIG. 2, the input device 20 includes a lower substrate 22, an upper substrate 21, a surface member 60, and a flexible printed circuit board 54.

As shown in FIGS. 2 and 3, the lower substrate 22 includes a film-like lower base material 50 in which a transparent conductive layer such as ITO is formed on the surface of a translucent base material, and a first wiring layer 52. Configured.

Here, in the present embodiment, “translucency” and “transparency” indicate a state where the visible light transmittance is 70% or more. Further, it is preferable that the haze value is 6 or less.

As shown in FIGS. 2 and 3, a support plate 55 made of a translucent base material is provided on the lower surface side of the lower substrate 22, and an optical transparent adhesive layer (OCA) is provided between the lower substrate 22 and the support plate 55. 56 is joined. The support plate 55 is formed of a plastic plate that is thicker than the lower substrate 22.

As shown in FIGS. 2 and 3, the upper substrate 21 is opposed to the lower substrate 22 with a predetermined interval in the height direction (Z). The upper substrate 21 has the same configuration as the lower substrate 22. That is, the upper substrate 21 includes a film-like upper base material 66 in which a transparent conductive layer such as ITO is formed on the surface of the translucent base material and the second wiring layer 45.

Translucent base materials used for the lower substrate 22 and the upper substrate 21 are polycarbonate resin (PC resin), polyethylene terephthalate resin (PET resin), polyethylene naphthalate resin (PEN resin), cyclic polyolefin (COP resin), polymethacrylic acid It is formed of a transparent substrate such as methyl resin (acrylic) (PMMA).

The transparent conductive layer used for the lower substrate 22 and the upper substrate 21 is formed by forming an inorganic transparent conductive material such as ITO (Indium Tin Oxide), SnO ₂ , or ZnO by sputtering or vapor deposition. Alternatively, a fine powder of these inorganic transparent conductive materials may be fixed. Alternatively, an organic transparent conductive material coated with an organic conductive polymer such as carbon nanotube, polythiofin, or polypyrrole may be used.

The wiring layers 45 and 52 formed on the surfaces of the lower base material and the upper base material are formed by screen printing an Ag coating film, for example. Each

wiring layer

45, 52 is formed on a transparent conductive layer formed on the surface of the translucent substrate. Or a part of wiring layers 45 and 52 may be formed in the surface of the translucent base material which the transparent conductive layer removed and exposed.

As shown in FIGS. 2 and 3, the lower substrate 22 and the upper substrate 21 are bonded to each other via an adhesive layer 40 in a non-input region 20b located on the outer periphery of the input region 20a. The adhesive layer 40 is an acrylic double-sided tape or an acrylic adhesive.

As shown in FIG. 3, the surface of the first wiring layer 52 of the lower substrate 22 is covered with an insulating layer 53, and the surface of the second wiring layer 45 of the upper substrate 21 is covered with an insulating layer 57. The insulating layers 53 and 57 are joined by the adhesive layer 40. For the insulating

layers

53 and 57, a resist material, a thermosetting resin, a thermoplastic resin, or the like can be used.

In the input area 20a, there is no adhesive layer 40 between the lower substrate 22 and the upper substrate 21, and an air layer is provided.

2 and 3 includes a surface layer 61 and a decorative layer 62 formed on the lower surface of the surface layer 61. The surface layer 61 is formed of a flexible translucent substrate. The decoration layer 62 is formed in the non-input area 20b. The surface member 60 and the upper substrate 21 are joined via an optical transparent adhesive layer (OCA) 63.

When the operator presses the input region 20a located on the surface of the surface layer 61 shown in FIG. 1 downward with a finger or a pen, the upper substrate 21 bends downward, and the lower substrate 22 and the upper substrate located in the input region 20a. Each of the 21 transparent conductive layers abuts. At this time, in the wiring layer electrically connected to each transparent conductive layer, a detection output (voltage) corresponding to the contact position between the transparent conductive layers can be obtained, and based on the detection output, in the input region 20a The operation position can be detected.

As shown in FIG. 2, FIG. 3 (a), and FIG. 4, the upper substrate 21 has a plurality of hole-shaped

second space portions

21a and 21a that penetrate in the height direction (Z) with an interval in the X1-X2 direction. Are formed. Each

2nd space part

21a, 21a is formed in the non-input area | region 20b.

As shown in FIGS. 2 and 3A, the optical transparent adhesive layer 63 interposed between the upper substrate 21 and the surface member 60 has the

second space portions

21 a and 21 a formed on the upper substrate 21 and a high height. Hole-shaped

spaces

63a and 63a communicating in the vertical direction are formed. Therefore, as shown in FIG. 3A, a part of the decorative layer 62 is exposed downward through the

second space portions

21a and 21a formed on the upper substrate 21 and the space portion 63a formed on the optical transparent adhesive layer 63. is doing.

As shown in FIGS. 2, 3 (b), and 4, the second wiring layer 45 provided on the upper substrate 21 is connected to a plurality of second

terminal portions

81, 81 formed on the flexible printed circuit board 54. It is extended to the connection position and constitutes the

second connection parts

45a and 45a. As shown in FIG. 4, one second connection portion 45 a is formed at a position between the

second space portions

21 a and 21 a formed on the upper substrate 21, and the other second connection portion 45 a It is formed in the side part located in the X2 side of the space part 21a. Therefore, as shown in FIG. 4, the plurality of

second space portions

21a, 21a and the plurality of

second connection portions

45a, 45a are alternately arranged in parallel in the X1-X2 direction.

The plurality of second

terminal portions

81 and 81 formed on the flexible printed circuit board 54 shown in FIG. 3B and FIG. 4 and the plurality of

second connection portions

45a and 45a formed on the upper substrate 21 are electrically connected. Connected.

As shown in FIGS. 2, 3B, and 4, the lower substrate 22 has notched

first space portions

22a and 22a that penetrate in the height direction (Z) with an interval in the X1-X2 direction. Are formed. Each

first space

22a, 22a is formed in the non-input area 20b.

As shown in FIG. 4, the

first space portions

22a and 22a formed in the lower substrate 22 are formed in regions facing the second

terminal portions

81 and 81 of the flexible printed circuit board 54 in the height direction (Z). The Therefore, as shown in FIG. 3B and FIG. 4, the

first space portions

22a and 22a, the second

terminal portions

81 and 81, and the second connection portions 45a and 45b are aligned in the height direction (Z). Yes.

As shown in FIGS. 2, 3 (b), and 4, the support plate 55 has a hole shape that extends continuously in the height direction (Z) with the

first spaces

22 a and 22 a formed in the lower substrate 22. A plurality of the

space portions

55a and 55a are formed.

As shown in FIGS. 2 and 3B, the transparent optical adhesive layer 56 interposed between the lower substrate 22 and the support plate 55 is continuous with the first space 22a formed in the lower substrate 22. A plurality of notch-shaped

space portions

56a, 56a are formed.

As shown in FIGS. 2, 3 (a), and 4, the first wiring layer 52 provided on the lower substrate 22 is connected to a plurality of first

terminal portions

80 and 80 formed on the flexible printed board 54. It is extended to the connection position and constitutes a plurality of

first connection parts

52a, 52a.

As shown in FIG. 4, one first connection portion 52 a is formed at a position between the

first space portions

22 a and 22 a formed on the lower substrate 22, and the other first connection portion 52 a It is formed in the side part located in the X1 side of the space part 22a. Therefore, as shown in FIG. 4, the plurality of

first space portions

22a, 22a and the plurality of

first connection portions

52a, 52a are alternately arranged in the X1-X2 direction.

The plurality of first

terminal portions

80, 80 formed on the flexible printed board 54 shown in FIGS. 3A and 4 and the plurality of

first connection portions

52a, 52a formed on the lower substrate 22 are electrically connected. Connected.

Next, the structure of the flexible printed circuit board 54 will be described with reference to FIG.
5 (b) and 5 (c), the flexible printed circuit board 54 is formed between the second base material 70 located on the upper side and the first base material 75 located on the lower side, as shown in FIG. b) A configuration in which a plurality of wiring portions 72 shown in (c) and (d) are interposed.

As shown in FIGS. 5B and 5C, the second base material 70 and the first base material 75 are directly bonded via the adhesive layer 71 at a place where the wiring portion 72 is not interposed.

As shown in FIG. 5D, a total of four wiring portions 72 are arranged at intervals, and each wiring portion 72 extends from the front end (Y1 side) to the rear end (Y2 side) of the flexible printed circuit board 54. ) Is extended toward. The distal end portion 54a of the flexible printed circuit board 54 includes a wiring region 54b in which each wiring portion 72 is routed, a plurality of first terminal portions 80 and a plurality of second terminal portions 81 formed on the Y1 side of the wiring region 54b. It is comprised.

In the wiring area 54b of the flexible printed circuit board 54, each wiring part 72 is interposed between the second base material 70 and the first base material 75, and each wiring part 72 is not exposed to the outside.

On the other hand, in the first terminal portion 80, as shown in FIG. 5B, the first base material 75 is removed and a part of the wiring portion 72 is exposed downward. At the position of the first terminal portion 80, as shown in FIG. 5D, a part of the wiring portion 72 is a wide pad portion 72a. In the present embodiment, an electrode layer 73 is formed on the surface of the wiring portion 72 (pad portion 72 a) exposed at the first terminal portion 80, and the electrode layer 73 is covered with an anisotropic conductive layer 74. It has become. Thus, the thickness of the first terminal portion 80 is increased by adding the electrode layer 73 and the anisotropic conductive layer 74. As shown in FIG. 3A, the first terminal portion 80 and the first connection portion 52 a are electrically connected via the anisotropic conductive layer 74.

Also, in the second terminal portion 81, as shown in FIG. 5C, the second base material 70 is removed and a part of the wiring portion 72 is exposed upward. At the position of the second terminal portion 81, as shown in FIG. 5D, a part of the wiring portion 72 is a wide pad portion 72a. In the present embodiment, an electrode layer 76 is formed on the surface of the wiring portion 72 (pad portion 72 a) exposed at the second terminal portion 81, and the electrode layer 76 is covered with an anisotropic conductive layer 77. It has become. As described above, the thickness of the second terminal portion 81 is increased by adding the electrode layer 76 and the anisotropic conductive layer 77. As shown in FIG. 3B, the second terminal portion 81 and the second connection portion 45 a are electrically connected via the anisotropic conductive layer 77.

Further, as shown in FIG. 5C, an adhesive layer (double-sided tape) 78 bonded to the support plate 55 is provided on the lower surface of the first base 75.

The second base material 70 and the first base material 75 are formed of, for example, a polyimide film. The wiring part 72 is mainly formed of a copper foil layer, for example. The electrode layers 73 and 76 are made of, for example, a silver layer.

As shown in FIGS. 5A and 5D, the two first terminal portions 80 and the two second terminal portions 81 are alternately arranged in parallel at an interval in the X1-X2 direction. Between the first terminal portions 80 and the second terminal portions 81,

first cutout portions

83, 84, and 85 are formed in the Y1-Y2 direction and communicate with the outside on the Y1 side. Has been. A part of the first terminal portion 80 is connected to the second terminal portion 81 at a position where the

first cutout portions

83, 84, 85 are not formed.

Further, as shown in FIGS. 5A and 5D, there is an X1− between the first terminal portion 80 formed on the most X1 side and the wiring region 54b located on the Y2 side of the first terminal portion 80. A second cutout portion 86 is formed that extends in the X2 direction and communicates outward on the X1 side. Further, as shown in FIGS. 5A and 5D, between the first terminal portion 80 located between the second

terminal portions

81, 81 and the wiring region 54 b located on the Y2 side of the first terminal portion 80. The second notch 87 is formed in the X1-X2 direction, and the second notch 87 is integrated with the first notch 84 and communicates outward on the Y1 side.

As shown in FIGS. 5A and 5D, each second terminal portion 81 and the wiring region 54b are formed continuously. That is, unlike each of the first terminal portion 80 and the wiring region 54b, a second cutout portion extending in the Y1-Y2 direction and leading to the outside is formed between each second terminal portion 81 and the wiring region 54b. Not.

In the flexible printed circuit board 54 of this embodiment shown in FIGS. 5A and 5D, a part of the first terminal portion 80 is in the X1-X2 direction in a region near the wiring region 54b of the second terminal portion 81. The

second cutout portions

86 and 87 are formed between the first terminal portions 80 and the wiring regions 54b, and the wirings extend from the pad portions 72a of the first terminal portions 80 in the X1-X2 direction. The first terminal portion 80 is formed so as to be completely separated from the second terminal portion 81 and connected to the wiring region 54b via the detour. Also good.

On the other hand, unlike the first terminal unit 80, the second terminal unit 81 does not bypass the wiring, and the wiring is drawn out substantially straight from the wiring region 54b and connected to the pad 72a of the second terminal unit 81. The second terminal portion 81 and the wiring region 54b can be continuously formed ”.

In the present embodiment, as shown in FIG. 3A, the upper substrate 21 is formed with a second space portion 21 a in a region facing the first terminal portion 80 formed on the flexible printed circuit board 54. Accordingly, the thickness of the first terminal portion 80 of the flexible printed circuit board 54 can be appropriately absorbed by the second space portion 21a of the upper substrate 21 (the first terminal portion 80 can escape into the second space portion 21a). Yes).

As shown in FIG. 3A, the upper substrate 21 has a hole-shaped second space portion 21a, so that a part 21b of the upper substrate 21 remains in the outer region of the second space portion 21a. However, the portion of the flexible printed circuit board 54 that opposes the part 21 b of the upper substrate 21 is a thin portion that is out of the first terminal portion 80. For this reason, even if a part 21 b of the upper substrate 21 is left, unevenness is hardly formed on the surface of the surface member 60. Rather, it is preferable that the second space portion 21a is formed in a hole shape instead of a notch shape, and a part 21b of the upper substrate 21 is left on the outer peripheral portion so that the sealing performance can be improved.

In the present embodiment, as shown in FIGS. 2 and 4, the first connection portion 52 a formed on the lower substrate 22 and the second connection portion 45 a formed on the upper substrate 21 are viewed in plan (viewed from the Z direction). They are arranged in parallel so as not to overlap each other. Therefore, the first terminal portions 80 and the second terminal portions 81 formed on the flexible printed circuit board 54 are alternately arranged in parallel so as not to overlap in a plan view.

As shown in FIG. 2 and FIG. 3B, the first substrate 22 a is formed in the lower substrate 22 in a region facing each second terminal portion 81 in the height direction. The first space portions 22a do not overlap the second space portions 21a formed on the upper substrate 21 in plan view, and the first space portions 22a and the second space portions 21a are alternately arranged in parallel. Yes.

With the configuration of the present embodiment, as shown in FIG. 3B, the thickness of the second terminal portion 81 of the flexible printed circuit board 54 can be appropriately absorbed by the first space portion 22a of the lower substrate 22 (first The two terminal portions 81 can escape into the first space portion 22a).

Therefore, in this embodiment, it can suppress appropriately that an unevenness | corrugation is formed in the surface of the surface member 60 compared with the past.

In the present embodiment, the upper substrate 21 is utilized by utilizing the space portion 55a formed in the support plate 55 and the first space portion 22a formed in the lower substrate 22 shown in FIGS. The second connection part 45a and the second terminal part 81 of the flexible printed circuit board 54 can be directly pressed and connected. In addition, the first connection portion 52a of the lower substrate 22 and the first terminal of the flexible printed circuit board 54 are utilized using the second space portion 21a formed in the upper substrate 21 shown in FIGS. The portions 80 can be directly pressed and connected. Note that the connection between the first connection portion 52 a and the first terminal portion 80 is performed before the surface member 60 is provided on the upper substrate 21. Moreover, you may connect between a connection part and a terminal part using only one of the 1st space part 22a and the 2nd space part 21a. For example, before joining the upper substrate 21, the flexible printed circuit board 54 is installed on the lower substrate 22 as shown in FIG. 4, and the first connecting portion 52 a of the lower substrate 22 and the flexible printed circuit board 54 are exposed as a whole. The first terminal portions 80 can be directly pressed and connected. Then, the upper substrate 21 is joined to the lower substrate 22 via the adhesive layer 40, and the upper portion is utilized using the space portion 55a of the support plate 55 and the first space portion 22a of the lower substrate 22 shown in FIG. The second connection portion 45a of the substrate 21 and the second terminal portion 81 are directly pressed and connected.

As described above, according to the present embodiment, the first connection portion 52a and the first terminal portion 80 and the second connection portion 45a and the second terminal portion 81 can be directly pressed and connected, and excellent connectivity is achieved. Can be obtained.

In the present embodiment, as shown in FIG. 4, a plurality of second space portions 21a formed in the upper substrate 21 and a plurality of first space portions 22a formed in the lower substrate 22 are X1- It is formed alternately in the X2 direction, and the thicknesses of the first terminal portions 80 and the second terminal portions 81 of the flexible printed circuit board 54 are absorbed appropriately and stably in the

spaces

21a and 22a, respectively. be able to. Further, in order to alternately form the plurality of second space portions 21a formed on the upper substrate 21 and the plurality of first space portions 22a formed on the lower substrate 22 in plan view, the space between the second space portions 21a In addition, between the first space portions 22a, the substrate remains wide (exists), and the strength of the lower substrate 22 and the upper substrate 21 in the vicinity where the space portions are formed can be appropriately maintained. Further, in the state of FIG. 4, for example, after each first connection portion 52 a and each first terminal portion 80 are directly pressed and connected by a pressing device, the input device (touch panel) in the manufacturing process is turned over 180 degrees. In this case, each second connecting portion 45a and each second terminal portion 81 can be directly pressed and connected by the pressing device. Therefore, each first connection part 52a and each first terminal part 80 and each second connection part 45a and each second terminal part 81 can be connected easily and appropriately.

In this embodiment, on the upper surface side of the upper substrate 21, the surface member 60 including the surface layer 61 and the decorative layer 62, and the optical transparent adhesive layer 63 is provided between the upper substrate 21 and the surface member 60. The optical transparent adhesive layer 63 is formed with a space portion 63a that extends continuously in the height direction (Z) from the second space portion 21a formed on the upper substrate 21. Therefore, it is possible to appropriately prevent the optical transparent adhesive layer 63 from entering the second space portion 21a of the upper substrate 21. Further, when the optical transparent adhesive layer 63 is exposed on the upper surface of the second space portion 21a, dust or the like tends to adhere to the exposed surface of the optical transparent adhesive layer 63, and the flexible printed circuit board 54 that has entered the second space portion 21a. May stick to the surface of the optically transparent pressure-sensitive adhesive layer 63 exposed, but such a problem can be suppressed according to this embodiment. Further, by forming a continuous space portion 63a in the optical transparent adhesive layer 63 together with the second space portion 21a formed in the upper substrate 21, a large space portion that leads from the second space portion 21a to the space portion 63a is formed. The thickness of the first terminal portion 80 can be absorbed more effectively.

In this embodiment, a plastic plate support plate 55 is provided on the lower surface side of the film-like lower substrate 22. The support plate 55 is formed with a space portion 55a that is continuous with the first space portion 22a formed in the lower substrate 22 and extends in the height direction (Z). In this way, it is possible to reinforce by bonding the support plate 55 of a highly rigid plastic plate to the lower surface side of the lower substrate 22, and a space portion that communicates from the first space portion 22 a of the lower substrate 22 to the space portion 55 a of the support plate 55. Using the space portion, the second connecting portion 45a of the upper substrate 21 and the second terminal portion 81 can be directly pressed and connected.

FIG. 6 is a partially enlarged longitudinal sectional view of an input device showing another embodiment. FIG. 6 is a longitudinal section at the same position as FIG. As shown in FIG. 6, the flexible printed circuit board 54 can be bent downward in the input device, and the flexible printed circuit board 54 can be extended downward from a through hole 88 formed in the support plate 55. Accordingly, the flexible printed circuit board 54 can be prevented from protruding from the outer peripheral portion of the input device, and the full flattening of the input side surface of the input device can be effectively promoted.

Further, in this embodiment, by using the flexible printed circuit board 54 shown in FIG. 5, when the flexible printed circuit board 54 is bent downward as shown by symbol E in FIG. 1 or as shown in the structure of FIG. It is possible to suppress an upward force from being generated in the first terminal portion 80 that is electrically connected to the first connection portion 52a of the lower substrate 22, so that a peeling force is generated between the first terminal portion 80 and the first connection portion 52a. It can be suppressed from occurring. On the other hand, when the flexible printed circuit board 54 is bent downward between the second terminal portion 81 and the second connection portion 45a, a force in the contact direction can be generated.

However, instead of the structure of the flexible printed circuit board 54 shown in FIG. 5, a flexible printed circuit board 89 shown in FIG. 7 may be used. A flexible printed circuit board 89 shown in FIG. 7 has a plurality of first terminal portions 90 and a plurality of second terminal portions 91 formed at the tip, similarly to the flexible printed circuit board 54 of FIG. Each first terminal portion 90 may be the same as or different from the structure of the first terminal portion 90 which is a portion electrically connected to the first connection portion 52a of the lower substrate 22 as shown in FIG. May be. Each second terminal portion 91 is a portion that is electrically connected to the second connection portion 45 a of the upper substrate 21. The structure of the second terminal portion 91 may be the same as or different from that shown in FIG.

The flexible printed circuit board 89 shown in FIG. 7 is different from the flexible printed circuit board 54 in FIG. 5 in that the second notch is not formed between each first terminal portion 90 and the wiring region 89a.

As in the present embodiment, the configuration in which the space portion for escaping the terminal portion is formed at each position of the upper substrate and the lower substrate facing each terminal portion of the flexible printed circuit board 54 is shown in FIGS. This is effectively applied to an FFP (Film-Film-Plastics) structure in which both the lower substrate 22 and the upper substrate 21 shown in FIG.

However, the transparent conductive layer and the first wiring layer constituting the lower substrate 22 are directly formed on the base material which is a plastic plate, while the upper substrate 21 is also in the FP (Film-Plastics) structure which is a film. Can be applied.

20 Input device

20a Input area

20b Non-input area 21 Upper substrate 21a Second space 22 Lower substrate 22a First space 40 Adhesive layer 45 Second wiring layer 45a Second connection part 52 First wiring layer 52a

First connection part

54 , 89 Flexible printed circuit board

54a Tip portion

54b, 89a Wiring area 55

Support plates

55a, 56a,

63a Space

56, 63 Optical transparent adhesive layer 60 Surface member 61 Surface layer 62 Decorating layer 70 Second base material 72

Wiring section

73 , 76 Electrode layers 74, 77 Anisotropic conductive layer 75

First base material

80, 90 First

terminal portion

81, 91 Second

terminal portion

83, 84, 85

First notch portion

86, 87 Second notch portion

Claims

A lower substrate and an upper substrate are disposed to face each other in the height direction, and each of the lower substrate and the upper substrate includes a base material on which a transparent conductive layer is formed, and an outer surface of the input region on the surface of the base material. The first wiring layer provided on the lower substrate is extended to the connection position with the flexible printed circuit board to form the first connection portion. The second wiring layer provided on the upper substrate is extended to a connection position with the flexible printed circuit board and constitutes the second connection portion at a position not overlapping the first connection portion in plan view. And
A first terminal part electrically connected to the first connection part and a second terminal part electrically connected to the second connection part do not overlap the flexible printed circuit board in a plan view. Formed,
In the region of the upper substrate that faces the first terminal portion in the height direction and the region of the lower substrate that faces the second terminal portion in the height direction, a space portion is formed that extends in the height direction. An input device characterized by that.
A plurality of first terminal portions provided on the flexible printed circuit board electrically connected to the plurality of first connection portions, the plurality of second connection portions, the first connection portions, and the second connection portions; The plurality of second terminal portions, and the plurality of second space portions provided on the upper substrate facing the first terminal portions in the height direction, and the lower portion facing the second terminal portions in the height direction. The input device according to claim 1, wherein the plurality of first space portions provided on the substrate are alternately formed in plan view.
On the upper surface side of the upper substrate, a surface layer made of a translucent base material, a surface member having a decorative layer provided on the lower surface of the surface layer and in the non-input area, the upper substrate, and the A transparent adhesive layer interposed between the surface members,
The input device according to claim 1, wherein the transparent adhesive layer is formed with a space portion extending continuously in a height direction from a second space portion formed on the upper substrate.
A support plate is provided on the lower surface side of the lower substrate, and the support plate is formed with a space portion that extends continuously in the height direction from the first space portion formed in the lower substrate. The input device according to any one of claims 1 to 3.
5. The first space portion formed in the lower substrate and the second space portion formed in the upper substrate are formed in a cutout shape or a hole shape. 6. Input device.