JP2012203514A - Input device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an input device which can be thinned even while having a decorative layer.SOLUTION: An input device 1 of this invention comprises: a first transparent base material 30 whose one surface constitutes an input surface; a second transparent base material 40 arranged facing the first transparent base material 30 at a prescribed interval; a first transparent electrode layer 31 formed on the other surface of the first transparent base material 30; a second transparent electrode layer 41 formed on the second transparent base material 40 facing the first transparent electrode layer 31; and an adhesive layer 51 for bonding the first transparent base material 30 and the second transparent base material 40. A frame-like decorative layer 34 is formed on the other surface of the first transparent base material 30, and the first transparent electrode layer 31 is formed on the decorative layer 34 and the first transparent base material 30 following a level difference part of the decorative layer 34 and the first transparent base material 30.

Description

  The present invention relates to an input device, and more particularly to an input device that can be thinned while having a decorative layer.

  Currently, as a display unit of a portable electronic device or the like, a translucent input device for inputting coordinates by directly operating a menu item or object of a display image with a finger or the like is used. As such an input device, various methods can be mentioned. For example, Patent Document 1 describes a resistance film type input device.

  FIG. 7 is a cross-sectional view of the input device 101 disclosed in Patent Document 1. The conventional input device 101 shown in FIG. 7 has a first transparent base material 130 on which a first transparent electrode layer 131 is formed, and a second transparent base material 140 on which a second transparent electrode layer 141 is formed. It is configured. The first transparent base material 130 and the second transparent base material 140 are laminated so that the first transparent electrode layer 131 and the second transparent electrode layer 141 are opposed to each other with a gap therebetween. Moreover, the 1st lead-out wiring layer 132 and the 2nd lead-out wiring layer 142 for outputting input position information are formed in the surface which each transparent base material opposes. The decorative film 120 is laminated on the input surface side of the first transparent substrate 130, and a colored decorative layer 134 is formed on the surface of the decorative film 120 facing the first transparent substrate 130. ing. The decorative layer 134 is formed at a position overlapping the first lead wiring layer 132 and the second lead wiring layer 142 in plan view so that the first lead wiring layer 132 and the second lead wiring layer 142 are not directly visible to the operator. Has been. The decorative film 120 and the first transparent substrate 130 are laminated via the adhesive layer 122 having viscoelasticity, and the step between the decorative layer 134 and the decorative film 120 is flat due to the viscoelasticity of the adhesive layer 122. Is glued.

  In the operation of the resistance film type input device, when the decorative film 120 and the first transparent base material 130 arranged on the input surface side are pressed toward the second transparent base material 140, the opposing transparent electrode layers come into contact with each other. As a result of this contact, a change in resistance value occurs, and the input position information can be detected.

  FIG. 8 is a cross-sectional view of another input device 102 disclosed in Patent Document 1. The conventional input device 102 shown in FIG. 8 is configured by omitting the decorative film 120 and the adhesive layer 122 used in the input device 101 shown in FIG. As shown in FIG. 8, a decoration layer 134 is formed on the first transparent base material 130, and in order to flatten the step between the decoration layer 134 and the first transparent base material 130, the decoration layer 134 and An overcoat layer 121 is laminated so as to cover the surface of the first transparent substrate 130. A first transparent electrode layer 131 is formed on the surface of the overcoat layer 121.

JP 2005-173970 A

  Since the input device is superimposed on a display device such as a liquid crystal panel or an organic EL panel and mounted on a display unit of an electronic device, further reduction in thickness is required. However, in the input device 101 of the conventional example shown in FIG. 7 and the input device 102 shown in FIG. 8, the total thickness of each member laminated on the input surface side is thick, and the entire input device is thin. There was a problem that it was difficult to convert. Moreover, in order to prevent the level | step difference of the decoration layer 134 from being transcribe | transferred to the surface of the input device 1, it is necessary to thicken the adhesion layer 122 or the overcoat layer 121, and to absorb a level | step difference, and each laminated | stacked on the input surface side There is a demand for thinner members.

  Further, when the laminated member on the input surface side is thick, the rigidity of the laminated member on the input surface side as a whole becomes large, resulting in a problem that the input load increases. If the input load is large, the operability of the input device may be impaired, and problems such as a decrease in input position detection accuracy may occur, and further improvements may be required. Furthermore, when there are many laminated members on the input surface side, there is a possibility that the manufacturing cost increases and the light transmittance decreases and the visibility of the input device is deteriorated.

  An object of the present invention is to solve the above problems and provide an input device that can be thinned while having a decorative layer.

  The input device according to the present invention includes a first transparent base material in which one surface constitutes an input surface, a second transparent base material arranged to face the first transparent base material at a predetermined interval, and the first transparent base material. A first transparent electrode layer formed on the other surface of the transparent substrate; a second transparent electrode layer formed on the second transparent substrate facing the first transparent electrode layer; and the first transparent A pressure-sensitive adhesive layer that bonds the base material and the second transparent base material, and a frame-like decorative layer is formed on the other surface of the first transparent base material, and the first transparent base material The electrode layer is formed on the decorative layer and the first transparent substrate following a stepped portion between the decorative layer and the first transparent substrate.

  According to this, since the first transparent electrode layer is formed on the other surface of the first transparent base material following the stepped portion between the decorative layer and the first transparent base material, the step of the decorative layer is input. Transfer to the surface of the apparatus can be suppressed. Therefore, the decorative film, the adhesive layer, or the overcoat layer laminated on the input surface side in the input device of the conventional example can be omitted. The apparatus can be thinned.

  Further, since the thickness of the laminated member on the input surface side is reduced, the rigidity of the laminated member constituting the input surface side is reduced, so that the first transparent substrate can be bent with a smaller load in the input operation. The input load can be reduced. Furthermore, since the light transmittance is improved by reducing the thickness of the laminated member on the input surface side, it is possible to improve the visibility of the display image when it is used overlapping with the display device.

  In the input device of the present invention, a first adhesive layer is integrally laminated on the first transparent electrode layer, and the first transparent electrode layer includes the decorative layer and the first adhesive layer. The second transparent electrode layer is bonded to the first transparent base material, and a second adhesive layer is integrally laminated on the second transparent electrode layer, and the second transparent electrode layer is interposed between the second transparent layer and the second transparent electrode layer. It is preferable that it is adhered to the substrate. According to this, by preparing a transparent electrode film for transfer in which a transparent electrode film and an adhesive layer are formed in advance, and transferring the transparent electrode film and the adhesive layer to a transparent substrate, the first transparent electrode layer and A second transparent electrode layer can be formed. By forming the film by a transfer method, it can be manufactured at a lower cost than a thin film method such as a sputtering method or a vapor deposition method, so that the manufacturing cost can be reduced.

  In the input device of the present invention, it is preferable that the first adhesive layer and the second adhesive layer are an ultraviolet curable resin. According to this, in the adhesion and curing process of the first transparent electrode layer and the second transparent electrode layer, the time required for heating and drying can be shortened, so that the manufacturing cost can be reduced.

  Moreover, it is preferable that the said adhesion layer is a double-sided tape comprised by apply | coating an adhesive to both surfaces of an insulating base material. According to this, while adhere | attaching a 1st transparent base material and a 2nd transparent base material with an adhesion layer, the electrical insulation between a 1st transparent base material and a 2nd transparent base material is securable.

  In the input device of the present invention, the first transparent wiring layer connected to the first transparent electrode layer and the second transparent electrode layer on the opposing surfaces of the first transparent substrate and the second transparent substrate, respectively. And a second lead wiring layer, and an insulating layer is preferably laminated on at least one of the first lead wiring layer and the second lead wiring layer. According to this, insulation between the first lead wiring layer and the second lead wiring layer can be obtained more reliably.

  According to the input device of the present invention, the first transparent electrode layer is formed on the other surface of the first transparent base material so as to follow the step portion between the decorative layer and the first transparent base material. Can be prevented from being transferred to the surface of the input device. Therefore, the decorative film, the adhesive layer, or the overcoat layer laminated on the input surface side in the input device of the conventional example can be omitted. The apparatus can be thinned.

  Further, since the thickness of the laminated member on the input surface side is reduced, the rigidity of the laminated member constituting the input surface side is reduced, so that the first transparent substrate can be bent with a smaller load in the input operation. The input load can be reduced. Furthermore, since the light transmittance is improved by reducing the thickness of the laminated member on the input surface side, it is possible to improve the visibility of the display image when it is used overlapping with the display device.

1 is a perspective view of an input device according to a first embodiment of the present invention. It is an exploded perspective view of the input device in a 1st embodiment. It is sectional drawing of the input device cut | disconnected along the III-III line of FIG. It is sectional drawing of the input device in 2nd Embodiment. It is sectional drawing of the transparent electrode film for transcription | transfer. It is sectional drawing of the input device which shows the modification of 2nd Embodiment. It is sectional drawing which shows the input device of a prior art example. It is sectional drawing which shows the input device of another prior art example.

<First Embodiment>
FIG. 1 is a perspective view of the input device 1 according to the first embodiment. FIG. 2 is an exploded perspective view of the input device 1 according to the first embodiment. 3 is a cross-sectional view of the input device 1 taken along the line III-III in FIG. In FIG. 2, the structure of the members stacked on the first transparent base material 30 is shown in an exploded manner, and the members stacked on the second transparent base material 40 are shown without being disassembled.

  As shown in FIG. 1, the input device 1 of the present embodiment includes a first transparent base material 30 and a second transparent base material 40 that are arranged to face each other with an adhesive layer 51 interposed therebetween. The 1st transparent base material 30 is arrange | positioned at the input surface side, and the one surface comprises the input surface which performs input operation. The input device 1 includes an input area 11 in which position information can be input and a non-input area 12 formed in a frame shape so as to surround the input area 11.

  As shown in FIG. 2, the non-input region 12 on the other surface of the first transparent base material 30 (the surface facing the second transparent base material 40) has a decoration layer 34, a first transparent electrode layer 31, a first One lead-out wiring layer 32 is laminated. Further, a second transparent electrode layer 41 and a second lead wiring layer 42 are laminated on the surface of the second transparent substrate 40 facing the first transparent substrate 30. The 1st transparent base material 30 and the 2nd transparent base material 40 with which each member was laminated | stacked are adhere | attached through the adhesion layer 51 arrange | positioned at the non-input area | region 12. FIG. The adhesive layer 51 can use an acrylic double-sided tape or an acrylic adhesive.

  As shown in FIG. 2, the first lead wiring layer 32 is provided in a frame shape so as to surround the input region 11 in the non-input region 12 of the first transparent base material 30, and is electrically connected to the first transparent electrode layer 31. Connected. Similarly, in the non-input area 12 of the second transparent base material 40, the second lead wiring layer 42 is routed and electrically connected to the second transparent electrode layer 41. The first lead-out wiring layer 32 and the second lead-out wiring layer 42 are pulled out to the non-input area 12 on the Y2 side, for example, and connected to a flexible printed board (not shown).

  The first lead wiring layer 32 and the second lead wiring layer 42 are formed by a printing method such as a screen printing method or an ink jet printing method using a conductive paste made of copper or silver. Each of the thicknesses can be formed to about 5 μm to 20 μm.

  The decorative layer 34 is formed in a frame shape in the non-input area 12 so as to surround the input area 11, and is arranged at a position overlapping the first lead wiring layer 32 and the second lead wiring layer 42 in plan view. The decorative layer 34 is colored and formed, and has an effect of shielding the first lead wiring layer 32, the second lead wiring layer 42, and the like from being directly viewed by the operator. In addition to being colored, the decorative layer 34 has an effect of improving the appearance of the input device 1 by drawing a pattern, a mark, a character, or the like. The decorative layer 34 is not limited to being formed as a single layer, but may be formed in multiple layers for the purpose of improving the shielding effect or for improving the design of the input device 1.

  The decorative layer 34 can be formed by a printing method such as a screen printing method or an ink jet printing method. The thickness is about 2 μm to 10 μm, and a step is formed between the decorative layer 34 and the first transparent substrate 30.

  As shown in FIG. 3, the first transparent base material 30 and the second transparent base material 40 are disposed so that the first transparent electrode layer 31 and the second transparent electrode layer 41 face each other with a space provided. . And the 1st transparent electrode layer 31 follows the level | step-difference part of the decorating layer 34 and the 1st transparent base material 30, and the 1st transparent base material 30 in which the decorating layer 34 and the decorating layer 34 are not formed. It is laminated on the other surface.

  As shown in FIG. 3, an insulating layer 52 (not shown in FIGS. 1 and 2) is formed to cover the first lead wiring layer 32. The insulating layer 52 is provided to ensure electrical insulation between the opposing first lead wiring layer 32 and second lead wiring layer 42. The insulating layer 52 is formed with a thickness of about 10 μm to 40 μm, and a resist material such as a resin can be used.

  The first transparent substrate 30 disposed on the input surface side is a flexible film-like material that can be deformed by an input operation, and has a thickness of about 100 μm to 200 μm, for example, about 125 μm. As the first transparent substrate 30, a transparent resin material such as PET (polyethylene terephthalate) can be used. The second transparent base material 40 is formed to have higher rigidity than the first transparent base material 30 so that the deformation of the first transparent base material 30 due to the input operation can be supported. The second transparent substrate 40 is formed with a thickness of about 0.5 mm to 2.0 mm, for example, about 0.9 mm. PC (polycarbonate), PET (polyethylene terephthalate), PEN (polyethylene naphthalate), PMMA ( A transparent resin material such as polymethyl methacrylate resin) can be used.

The first transparent electrode layer 31 and the second transparent electrode layer 41 are made of a transparent conductive material such as ITO (Indium Tin Oxide), SnO ₂ , or ZnO having translucency in the visible light region by a sputtering method or a vapor deposition method. A film is formed. The thickness is 0.01 μm to 0.05 μm, for example, about 0.02 μm. Further, as a method other than the sputtering method or the vapor deposition method, it is also possible to form a film by a method of applying a conductive polymer, Ag nanowire, or the like.

  During the input operation of the input device 1, when the input area 11 on the input surface is pressed with a finger or a pen-shaped input device, the flexible first transparent base material 30 is bent and the first transparent electrode layer 31 and the first transparent electrode layer 31 are 2 The transparent electrode layer 41 comes into contact. For example, a voltage is applied to the first transparent electrode layer 31 in the Y1-Y2 direction, and the Y coordinate can be detected by a partial pressure ratio in the Y1-Y2 direction corresponding to the contact position of each transparent electrode layer by the pressing operation. it can. Similarly, a voltage is applied to the second transparent electrode layer 41 in the X1-X2 direction, and the X coordinate can be detected based on the partial pressure ratio generated by the contact of each transparent electrode layer.

  As shown in FIG. 3, in the input device 1 of this embodiment, the first transparent electrode layer 31 follows the step portion between the decorative layer 34 and the first transparent base material 30, and the decorative layer 34 and the first transparent layer 31. It is formed on the base material 30. Thereby, it can suppress that the influence of the level | step difference of the decoration layer 34 and the 1st transparent base material 30 is transcribe | transferred on the surface of the input device 1, and showed to the input device 101 of the prior art example of FIG. The decorative film 120, the adhesive layer 122, or the overcoat layer 121 shown in FIG. 8 can be omitted. Therefore, the total thickness of the laminated members on the input surface side can be reduced, and the input device 1 can be reduced in thickness.

  Further, in the input device 1 of the present embodiment, the thickness of the laminated member on the input surface side is reduced, so that its rigidity is reduced as compared with the conventional case. Accordingly, the first transparent base material 30 and the first transparent electrode layer 31 are easily deformed in accordance with the pressing operation during the input operation, so that the input load is reduced and a smooth input operation can be performed. By reducing the input load, it is possible to detect with high accuracy even in continuous input such as input of handwritten characters and figures, and it is possible to cope with various input operations.

  Furthermore, since the laminated member on the input surface side is thinned, the light transmittance can be improved. The input device 1 is used by being overlapped with a display device such as a liquid crystal panel or an organic EL panel, and the operator can visually recognize a display image from the display device through the input device 1. Further, since the number of members used is reduced and the manufacturing process can be simplified, the manufacturing cost is reduced.

  Even if the 1st transparent electrode layer 31 and the 2nd transparent electrode layer 41 are formed using the same transparent conductive material, the thing from which an electrical property and a mechanical characteristic differ with the manufacturing method is obtained. It is known that a thin film method such as a sputtering method or a vapor deposition method can provide a transparent electrode layer having a higher density and higher hardness than those formed by a coating method. The input device 1 is an operation method in which input position information is detected by contact between the first transparent electrode layer 31 and the second transparent electrode layer 41 by a pressing operation. Therefore, when the first transparent electrode layer 31 and the second transparent electrode layer 41 are formed by different methods, the transparent electrode layer with low hardness is easily damaged, and the occurrence of cracks and the linearity of detection sensitivity are deteriorated. Problems arise. In the input device 1 of the present embodiment, the first transparent electrode layer 31 and the second transparent electrode layer 41 are preferably formed by the same method. By so doing, the first transparent electrode layer 31 and the second transparent electrode layer 41 are formed so as to have substantially the same electrical characteristics and mechanical characteristics, so that one of the transparent electrode layers is prevented from being damaged, and the sliding is prevented. It is possible to improve reliability such as dynamic tests and durability in repeated input operations.

<Second Embodiment>
In FIG. 4, sectional drawing of the input device 1 in 2nd Embodiment is shown. In addition, about the same member as 1st Embodiment, the same code | symbol is attached | subjected and shown, The detailed description is abbreviate | omitted.

  In the second embodiment, a first adhesive layer 33 is integrally laminated on the first transparent electrode layer 31, and the first transparent electrode layer 31 is connected to the decorative layer 34 and the first layer via the first adhesive layer 33. 1 Adhered to the transparent substrate 30. The first transparent electrode layer 31 and the first adhesive layer 33 are formed following the stepped portion between the decorative layer 34 and the first transparent substrate 30. In addition, a second adhesive layer 43 is integrally laminated on the second transparent electrode layer 41, and the second transparent electrode layer 41 is adhered to the second transparent substrate 40 via the second adhesive layer 43.

  The first adhesive layer 33 and the second adhesive layer 43 are preferably made of an acrylic ultraviolet curable resin. According to this, in the bonding and curing process of the first adhesive layer 33 and the second adhesive layer 43, the time required for heating and drying is short, and a simple manufacturing apparatus can be used, thereby reducing the manufacturing cost. can do. Moreover, the residual stress after adhesion | attachment can be restrained small, and the curvature and deformation | transformation of the 1st transparent base material 30 and the 2nd transparent base material 40 can be suppressed.

  In this embodiment, the first transparent electrode layer 31, the first adhesive layer 33, the second transparent electrode layer 41, and the second adhesive layer 43 are a transparent electrode film for transfer in which a transparent electrode film and an adhesive layer are formed in advance. 60 can be prepared and formed by a method of transferring the transparent electrode film and the adhesive layer to the substrate.

  As the transfer transparent electrode film 60, for example, one having a structure as shown in FIG. 5 can be used. As shown in FIG. 5, the transparent electrode film for transfer 60 has a configuration in which a transparent electrode film 63 and an adhesive layer 64 are sandwiched between a support base 61 and a cover film 62.

  The transparent electrode film 63 of the transfer transparent electrode film 60 can be formed by a sputtering method or a coating method. When produced by the sputtering method, it is excellent in that a transparent electrode film 63 having a dense structure and low electric resistance can be obtained. However, since the manufacturing apparatus is large and it takes a long time to form a film, there is a problem that the manufacturing cost is high for manufacturing a large-area electrode film. In the coating method, the transparent electrode film 63 is formed by applying a coating material in which conductive fine particles are dispersed in a binder, applying the coating material onto the support base 61, and drying and curing the coating material. In the coating method, a manufacturing apparatus is simple and a large-area electrode film can be easily manufactured, so that manufacturing costs can be reduced. However, the transparent electrode film formed by the coating method has a problem that the electrical resistance increases because the contact area between the conductive fine particles is smaller than that of the sputtering method.

  For the support substrate 61 and the cover film 62, a resin film such as PET (polyethylene terephthalate) is used. The adhesive layer 64 is formed of an acrylic ultraviolet curable resin. The transfer transparent electrode film 60 is not limited to the configuration shown in FIG. 5 and may be any film that can transfer the adhesive layer 64 and the transparent electrode film 63.

  In the present embodiment, in the step of transferring the first transparent electrode layer 31 using the transfer transparent electrode film 60, first, the cover film 62 of the transfer transparent electrode film 60 is peeled to expose the adhesive layer 64. The adhesive layer 64 and the transparent electrode film 63 are bonded to the surfaces of the decorative layer 34 and the first transparent base material 30 so as to follow the stepped portion between the decorative layer 34 and the first transparent base material 30. And after irradiating an ultraviolet-ray and hardening the contact bonding layer 64, the support base material 61 is peeled. As a result, the first adhesive layer 33 and the first transparent electrode layer 31 are transferred to the first transparent substrate 30 and the decorative layer 34. Similarly, the second adhesive layer 43 and the second transparent electrode layer 41 can be transferred to the second transparent substrate 40 using the transfer transparent electrode film 60.

  Since the first transparent electrode layer 31 and the second transparent electrode layer 41 are formed by a transfer method using the transfer transparent electrode film 60, the input device 1 can be manufactured in a short time with a simple device. The manufacturing cost can be reduced.

  In the present embodiment, the first transparent electrode layer 31 and the second transparent electrode layer 41 have a thickness of about 0.5 μm to 2 μm, for example, about 0.7 μm, and the thickness of the first adhesive layer 33 and the second adhesive layer 43. Is formed to be about 1 to 10 μm, for example, about 2 μm.

  As shown in FIG. 4, the laminated member disposed on the input surface side of the input device 1 includes a first transparent base material 30, a first adhesive layer 33, and a first transparent electrode layer 31. Since the first transparent electrode layer 31 and the first adhesive layer 33 are formed by a transfer method following the stepped portion between the decorative layer 34 and the first transparent base material 30, the effect of the step of the decorative layer 34 is affected. Reflection on the surface of the input device 1 can be suppressed. Thereby, the decorative film 120, the adhesive layer 122, or the overcoat layer 121 shown in FIG. 8 of the input device 101 of the conventional example shown in FIG. 7 can be omitted. Therefore, the input device 1 can be made thinner by reducing the total thickness of the laminated members arranged on the input surface side as compared with the conventional case.

  Also in the present embodiment, by reducing the thickness of the laminated member disposed on the input surface side, the rigidity can be reduced and the input load can be reduced. Further, the light transmittance of the input device 1 is improved, and the visibility can be improved.

  In the present embodiment, it is preferable that the first transparent electrode layer 31 and the second transparent electrode layer 41 use a transfer transparent electrode film 60 produced by the same manufacturing method. In this way, the first transparent electrode layer 31 and the second transparent electrode layer 41 are formed to have the same level of electrical characteristics, mechanical strength, etc., and reliability such as repeated input operations and sliding tests can be achieved. In the property test, only one of the transparent electrode layers can be prevented from being damaged. Therefore, the durability of the input device 1 can be improved, and the deterioration of the linearity of the detection sensitivity can be suppressed.

  FIG. 6 is a cross-sectional view of the input device 1 showing a modification of the present embodiment. In this modification, an acrylic double-sided tape is used as the adhesive layer 51 for bonding the first transparent substrate 30 and the second transparent substrate 40. The acrylic double-sided tape is configured by applying an adhesive made of an acrylic resin on both surfaces of a thin insulating substrate such as PET (polyethylene terephthalate) or PE (polyethylene). In the present modification, insulation between the opposing first lead wiring layer 32 and second lead wiring layer 42 is ensured by the adhesive layer 51, so that the insulating layer 52 shown in FIG. 4 can be omitted.

  The adhesive layer 51 has a thickness of about 20 to 60 μm, and the insulating layer 52 has a thickness of about 10 to 40 μm. By omitting the insulating layer 52, the first transparent base material 30 and the second transparent base material 40 The interval can be reduced, and the input device 1 can be further reduced in thickness. In addition, since the process of forming the insulating layer 52 is not necessary, the manufacturing cost of the input device 1 is reduced. Note that this modification can also be applied to the input device 1 of the first embodiment. In this case as well, the input device 1 can be thinned and the manufacturing cost can be reduced.

DESCRIPTION OF SYMBOLS 1 Input device 11 Input area 12 Non-input area 30 1st transparent base material 31 1st transparent electrode layer 32 1st extraction wiring layer 33 1st adhesion layer 34 Decorating layer 40 2nd transparent base material 41 2nd transparent electrode layer 42 Second lead-out wiring layer 43 Second adhesive layer 51 Adhesive layer 52 Insulating layer 60 Transparent electrode film for transfer 61 Support substrate 62 Cover film 63 Transparent electrode film 64 Adhesive layer

Claims (5)

A first transparent base material in which one surface constitutes an input surface;
A second transparent substrate disposed opposite to the first transparent substrate at a predetermined interval;
A first transparent electrode layer formed on the other surface of the first transparent substrate;
Opposing to the first transparent electrode layer, a second transparent electrode layer formed on the second transparent substrate;
An adhesive layer that adheres the first transparent substrate and the second transparent substrate;
A frame-shaped decorative layer is formed on the other surface of the first transparent substrate, and the first transparent electrode layer follows the stepped portion between the decorative layer and the first transparent substrate. The input device is formed on the decorative layer and the first transparent substrate. A first adhesive layer is integrally laminated on the first transparent electrode layer, and the first transparent electrode layer is adhered to the decorative layer and the first transparent substrate via the first adhesive layer. ,
A second adhesive layer is integrally laminated on the second transparent electrode layer, and the second transparent electrode layer is bonded to the second transparent substrate via the second adhesive layer. The input device according to claim 1.   The input device according to claim 2, wherein the first adhesive layer and the second adhesive layer are made of an ultraviolet curable resin.   The pressure-sensitive adhesive layer is a double-sided tape configured by applying a pressure-sensitive adhesive to both surfaces of an insulating substrate. The input device according to any one of claims 1 to 3. A first lead wiring layer and a second lead wiring layer connected to the first transparent electrode layer and the second transparent electrode layer, respectively, on the opposing surfaces of the first transparent substrate and the second transparent substrate. The insulating layer is laminated on at least one of the first lead wiring layer and the second lead wiring layer, and is formed according to any one of claims 1 to 4. Input device.