JP2012141690A - Input device - Google Patents

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JP2012141690A
JP2012141690A JP2010292701A JP2010292701A JP2012141690A JP 2012141690 A JP2012141690 A JP 2012141690A JP 2010292701 A JP2010292701 A JP 2010292701A JP 2010292701 A JP2010292701 A JP 2010292701A JP 2012141690 A JP2012141690 A JP 2012141690A
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transparent
connection
electrode layer
touch sensor
base material
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JP2010292701A
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Japanese (ja)
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Toru Sawada
融 澤田
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Alps Electric Co Ltd
アルプス電気株式会社
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Abstract

Provided is an input device using both a capacitive touch sensor and a resistive touch sensor capable of easily performing a connection process with an external circuit board and improving connection reliability. The purpose is to do.
An input device according to the present invention includes a capacitive touch sensor 4 and a resistive touch sensor 6 stacked, and includes a first transparent substrate 10 and a first transparent substrate 10 constituting the capacitive touch sensor 4. 2 The first connection electrode 12 and the second connection electrode 22 for outputting the input position information of the capacitive touch sensor 4 are provided on the transparent substrate 20, and the input position information of the resistive touch sensor 6 is output. The third connection electrode 32 and the fourth connection electrode 42 are pulled out to the first transparent base material 10 or the second transparent base material 20 through the through hole 63, and the first connection electrode 12 and the second connection electrode 22, the 3rd connection electrode 32 and the 4th connection electrode 42 are arranged in parallel by planar view.
[Selection] Figure 4

Description

  The present invention relates to an input device, and more particularly, to an input device using two systems in which a resistive touch sensor and a capacitive touch sensor are stacked.

  Currently, as a display unit of a portable electronic device or the like, a translucent input device for inputting coordinates by directly operating a menu item or object of a display image with a finger or the like is used. There are various methods for operating such an input device. For example, a resistive touch sensor that detects input position information by a change in resistance value or an electrostatic sensor that detects input position information by a change in capacitance. Many capacitive touch sensors are used.

  In the resistive film type touch sensor, a pair of transparent base materials are arranged to face each other with a gap therebetween, and transparent electrode films are formed on opposing surfaces of the pair of transparent base materials, respectively. By pressing the input surface of the resistive touch sensor, the transparent electrode films are brought into contact with each other and the resistance value is changed. The input position information can be detected by this resistance value change. The input operation is not particularly limited, such as a finger or a pen-shaped input device, and various types can be used, but it is difficult to perform multipoint input.

  In the capacitive touch sensor, a pair of transparent electrode films are arranged to face each other via an insulating transparent substrate, and a capacitance is formed between the pair of transparent electrode films. By bringing a finger or the like close to the input surface of the capacitive touch sensor, the capacitance value changes, and the input position information can be detected. Therefore, a smooth input operation can be performed and multipoint input is also possible. However, when wearing gloves or using an insulating input device, the capacitance does not change even if the input device is brought close to the input surface, so that an input operation cannot be performed.

  As an input device that can handle various input operations as described above, a two-type input device has been developed which is configured by stacking a resistive touch sensor and a capacitive touch sensor. For example, Patent Document 1 discloses a two-type combination input device in which a capacitive touch sensor is stacked on a resistive touch sensor. According to this, it is possible to input even with an input device having no conductivity, and multipoint input with a finger is also possible. Patent Document 2 discloses an invention in which a capacitance type detection unit is stacked on a pressure sensitive detection unit as an input device mounted on a personal computer or the like.

JP 2009-9249 A JP 2009-199318 A

  FIG. 13 is a schematic cross-sectional view of the conventional two-type input device 101 in which the capacitive touch sensor 104 is stacked on the resistive film type touch sensor 106. As shown in FIG. 13, in the conventional input device 101 using the two methods, the first connection electrode 112, the second connection electrode 122, and the third connection for extracting input position information to the non-input area of each transparent base material. An electrode 132 and a fourth connection electrode 142 are provided. A plurality of FPCs (Flexible Printed Circuits) 151 and 152 are connected to the connection electrodes.

  In such a configuration, the connection process of the resistive touch sensor 106 and the connection process of the capacitive touch sensor 104 need to be performed in separate processes, which makes the connection process complicated. Further, since two FPCs, that is, the FPC 152 connected to the resistive touch sensor 106 and the FPC 151 connected to the capacitive touch sensor 104 are required, there is a problem that the manufacturing cost increases.

  In addition, since the FPC 151 having two single-side connection portions and the FPC 152 having double-side connection portions are connected between the base materials and bonded to a total of four base materials, the manufacturing process and use of the input device 101 However, there is a problem that the connection reliability cannot be ensured because the stress due to thermal expansion and contraction of each of the four base materials acts on the connection portion. Moreover, in the structure which connects between each layer, it was difficult to relieve | moderate the stress added to a connection part.

  The present invention solves the above-described problems, and can easily perform a connection process with an external circuit board such as an FPC, and can improve connection reliability, and a capacitive touch sensor and a resistive film type. An object of the present invention is to provide an input device that is used in combination with a touch sensor.

  An input device according to the present invention includes a capacitive touch sensor that detects an input position based on a change in electrostatic capacitance, and a resistive film type touch sensor that detects an input position based on a change in resistance value. The capacitive touch sensor includes a first transparent base material having a first transparent electrode layer formed on one surface thereof, and a second transparent base material having a second transparent electrode layer formed on one surface thereof, One surface of the first transparent substrate and the other surface of the second transparent substrate are laminated facing each other, and the resistive touch sensor has a third transparent electrode layer formed on one surface. A third transparent substrate, and a fourth transparent substrate having a fourth transparent electrode layer formed on one surface thereof, wherein the third transparent electrode layer and the fourth transparent electrode layer are opposed to each other with a space provided. And at least one of the third transparent base and the fourth transparent base is provided with the third transparent electrode layer and the second transparent base. A through hole is formed for drawing out the transparent electrode layer to the outside, and one surface of the first transparent substrate and one surface of the second transparent substrate are connected to an external circuit board, respectively. The first connection region and the second connection region are arranged side by side in a plan view, and the first connection region is provided with a first connection electrode electrically connected to the first transparent electrode layer, A second connection electrode electrically connected to the second transparent electrode layer is provided in the second connection region, and a third electrically connected to the third transparent electrode layer through the through hole. A connection electrode and a fourth connection electrode electrically connected to the fourth transparent electrode layer through the through hole is provided in the first connection region or the second connection region, and the first connection electrode, The second connection electrode, the third connection electrode, and the fourth connection electrode There, characterized in that it is juxtaposed in a plan view.

  According to this, the 1st connection electrode, the 2nd connection electrode, the 3rd connection electrode, and the 4th connection electrode are collected on the transparent base material of an electrostatic capacity type touch sensor, and are arranged in parallel by plane view. Therefore, since each connection electrode and the connection part of the external circuit board can be connected in a planar manner in the same process, the connection process can be easily performed. Also, the input device and the external circuit board are gathered on the two transparent base materials and arranged side by side in a plan view, so that the connection electrodes are formed on the four transparent base materials. It is possible to reduce the influence of the stress acting on the connecting portion, and the connection reliability can be improved.

  In the input device according to the aspect of the invention, it is preferable that the resistive touch sensor is stacked on the input surface side of the capacitive touch sensor. According to this, the input resistance of the resistive touch sensor can be kept small, a comfortable input operation can be performed, and a multi-point input device using a capacitive touch sensor can be provided. can do.

  In the input device of the present invention, it is preferable that a through hole penetrating the fourth transparent base material, the first transparent base material, and the second transparent base material is provided. According to this, the third connection electrode formed in the first connection region or the second connection region and the third transparent electrode layer constituting the resistive touch sensor are electrically connected through the through hole. Can do. Moreover, the 4th connection electrode formed in the 1st connection area | region or the 2nd connection area | region and the 4th transparent electrode layer which comprises a resistive film type touch sensor can be electrically connected through a through hole. Furthermore, through holes are provided through the surface of the input device, so that the conductive paste can be filled into the through holes after laminating each transparent base material, and the connection reliability between the layers can be easily secured. It becomes.

  According to the input device of the present invention, the other surface of the third transparent substrate constitutes an input surface, and the fourth transparent substrate and the first transparent substrate are composed of the same common substrate. The fourth transparent electrode layer is formed on one surface of the common base material, and the first transparent electrode layer is formed on the other surface of the common base material. It is preferable that through holes for connecting the third transparent electrode layer and the fourth transparent electrode layer to the third connection electrode and the fourth connection electrode are formed. According to this, since the thickness of the adhesive layer for bonding between the transparent base material and the transparent base material can be omitted, the input device can be made thin.

  In the input device of the present invention, it is preferable that a through hole penetrating the common base material and the second transparent base material is provided. According to this, the third connection electrode formed in the first connection region or the second connection region and the third transparent electrode layer constituting the resistive touch sensor are electrically connected through the through hole. Can do. Moreover, the 4th connection electrode formed in the 1st connection area | region or the 2nd connection area | region and the 4th transparent electrode layer which comprises a resistive film type touch sensor can be electrically connected through a through hole. Furthermore, after laminating each transparent base material, the conductive paste can be filled in the through holes, and the connection reliability between the layers can be easily secured.

  In the input device of the present invention, it is preferable that the capacitive touch sensor is stacked on the input surface side of the resistive touch sensor. According to this, the input sensitivity of the capacitive touch sensor is good, and even when a glove is worn or an insulating input device formed of, for example, a resin is used, a resistive touch sensor Thus, it is possible to provide an input device using a combination of the two methods that can be input at the same time.

  In the input device of the present invention, it is preferable that a through hole penetrating the third transparent substrate and the fourth transparent substrate is provided. According to this, the third connection electrode formed in the first connection region or the second connection region and the third transparent electrode layer constituting the resistive touch sensor are electrically connected through the through hole. Can do. Moreover, the 4th connection electrode formed in the 1st connection area | region or the 2nd connection area | region and the 4th transparent electrode layer which comprises a resistive film type touch sensor can be electrically connected through a through hole. Furthermore, since the conductive paste can be filled into the through-holes after laminating the transparent substrates, it is possible to easily ensure the connection reliability between the layers.

  In the input device of the present invention, the other surface of the first transparent base material constitutes an input surface, and the second transparent base material and the third transparent base material are composed of the same common base material, The second transparent electrode layer is formed on one surface of the common base material, and the third transparent electrode layer is formed on the other surface of the common base material. It is preferable that through-holes for connecting the third transparent electrode layer and the fourth transparent electrode layer to the third connection electrode and the fourth connection electrode are formed. According to this, since the thickness of the adhesive layer for bonding between the transparent base material and the transparent base material can be omitted, the input device can be made thin.

  In the input device of the present invention, it is preferable that a through hole penetrating the common base material and the fourth transparent base material is provided. According to this, the third connection electrode formed in the first connection region or the second connection region and the third transparent electrode layer constituting the resistive touch sensor are electrically connected through the through hole. Can do. Moreover, the 4th connection electrode formed in the 1st connection area | region or the 2nd connection area | region and the 4th transparent electrode layer which comprises a resistive film type touch sensor can be electrically connected through a through hole. Furthermore, since the conductive paste can be filled into the through-holes after laminating the transparent substrates, it is possible to easily ensure the connection reliability between the layers.

  According to the input device of the present invention, the first connection electrode, the second connection electrode, the third connection electrode, and the fourth connection electrode are concentrated on the transparent base material of the capacitive touch sensor and arranged in parallel in a plan view. Is done. Therefore, since each connection electrode and the connection part of the external circuit board can be connected in a planar manner in the same process, the connection process can be easily performed. Also, the input device and the external circuit board are gathered on the two transparent base materials and arranged side by side in a plan view, so that the connection electrodes are formed on the four transparent base materials. It is possible to reduce the influence of the stress acting on the connecting portion, and the connection reliability can be improved.

1 is a perspective view of an input device according to a first embodiment of the present invention. It is a disassembled perspective view of the input device in the 1st Embodiment of this invention. It is sectional drawing of the input device cut | disconnected by the III-III line | wire of FIG. It is sectional drawing of the input device cut | disconnected by the IV-IV line | wire of FIG. In the first embodiment, (a) a partially enlarged plan view of a first transparent substrate, (b) a partially enlarged plan view of a second transparent substrate, (c) a first transparent substrate and a second transparent substrate, FIG. It is sectional drawing of the input device cut | disconnected by the III-III line of FIG. 1, which shows the modification in 1st Embodiment. It is sectional drawing of the input device of the input device cut | disconnected by the IV-IV line | wire of FIG. 1 which shows the modification in 1st Embodiment. It is a disassembled perspective view of the input device in the 2nd Embodiment of this invention. It is sectional drawing of the input device cut | disconnected by the IX-IX line of FIG. It is sectional drawing of the input device cut | disconnected by the XX line of FIG. It is sectional drawing of the input device cut | disconnected by the IX-IX line of FIG. 8, which shows the modification in 2nd Embodiment. It is sectional drawing of the input device cut | disconnected by the XX line of FIG. 8, which shows the modification in 2nd Embodiment. It is a schematic cross section of the vicinity of the connecting portion in the conventional input device.

<First Embodiment>
FIG. 1 is a perspective view of an input device 1 according to the first embodiment of the present invention. FIG. 2 is an exploded perspective view of the input device 1 of the present embodiment. 3 is a cross-sectional view of the input device 1 cut along the line III-III in FIG. 1, and FIG. 4 is a cross-sectional view of the input device 1 cut along the line IV-IV in FIG. In addition, in order to make the drawing easy to see, the ratio of dimensions of each component is appropriately changed.

  As shown in FIG. 1, the input device 1 according to the present embodiment is a dual-type input device 1 in which a resistive touch sensor 6 is laminated on the input surface side of a capacitive touch sensor 4. The capacitive touch sensor 4 includes a first transparent base material 10 and a second transparent base material 20, and the resistive touch sensor 6 includes a third transparent base material 30 and a fourth transparent base material 40. It is configured to face each other. A decorative film 61 is laminated on the input surface side of the resistive touch sensor 6.

  The input device 1 of this embodiment is connected to an external circuit board such as an FPC (Flexible Printed Circuit) 64, for example, and input position information from the capacitive touch sensor 4 and the resistive touch sensor 6 is output as an electrical signal. Is done. In the input device 1 of this embodiment, a first connection electrode 12, a second connection electrode 22, a third connection electrode 32, and a fourth connection electrode 42 for outputting input position information are formed. Each connection electrode is connected to face the FPC connection terminal 65 formed on one surface of the FPC 64.

  As shown in the exploded perspective view of the input device 1 in FIG. 2, the capacitive touch sensor 4 includes a first transparent substrate 10 and a second transparent substrate 20. A first transparent electrode layer 11 composed of a plurality of transparent electrode layers formed in the input region on one surface of the first transparent substrate 10 and extending in the X1-X2 direction with a predetermined interval in the Y1-Y2 direction. Are stacked. A second transparent electrode comprising a plurality of transparent electrode layers formed in the input region on one surface of the second transparent substrate 20 extending in the Y1-Y2 direction and having a predetermined interval in the X1-X2 direction. Layer 21 is laminated.

  In addition, a first wiring pattern 14 and a second wiring pattern 24 for extracting input position information are formed in non-input areas surrounding the input areas of the first transparent substrate 10 and the second transparent substrate 20, respectively. .

  As shown in FIGS. 3 and 4, the first transparent base material 10 and the second transparent base material 20 are laminated via the adhesive layer 66, and the first transparent electrode layer 11 and the second transparent electrode layer 21 are formed. Have capacitance between. When the finger or a conductive input instrument is brought close to any part of the input surface during the input operation of the input device 1, the capacitance between the first transparent electrode layer 11 and the second transparent electrode layer 21. The value of changes. It is possible to calculate the input position information based on this capacity change.

  A transparent film-like resin material such as PET (polyethylene terephthalate) can be used for each of the first transparent substrate 10 and the second transparent substrate 20. The thickness can be about 25 μm to 200 μm, for example, a thickness of 125 μm.

The first transparent electrode layer 11 and the second transparent electrode layer 21 are each formed of a transparent conductive film such as ITO (Indium Tin Oxide), SnO 2 , or ZnO that has translucency in the visible light region. The first transparent electrode layer 11 and the second transparent electrode layer 21 are formed by a thin film method such as a sputtering method or a vapor deposition method, and the thicknesses thereof are both 0.01 μm to 0.05 μm, for example, about 0.02 μm. . In addition to the sputtering method and the vapor deposition method, a method in which a film on which a transparent conductive film is formed in advance is prepared and only the transparent conductive film is transferred to a transparent substrate, or a method in which a conductive polymer or Ag nanowire is applied is used. It is also possible to form by.

  As shown in FIGS. 3 and 4, the resistive touch sensor 6 includes a third transparent substrate 30 and a fourth transparent substrate 40, and the input surface side of the capacitive touch sensor 4. Placed in. A third transparent electrode layer 31 is formed in the input region on one surface of the third transparent substrate 30, and the fourth transparent electrode layer 41 is formed in the input region on one surface of the fourth transparent substrate 40. Is formed. As shown in FIG. 3, the third transparent substrate 30 and the fourth transparent substrate 40 are bonded via an adhesive layer 68 disposed in the non-input area, and the third transparent electrode layer 31 and the fourth transparent substrate are bonded. The electrode layers 41 are stacked so as to face each other with a gap.

  A third wiring pattern 34 is formed in the non-input region of the third transparent substrate 30 so as to surround the input region, and a voltage can be applied in the X1-X2 direction of the third transparent electrode layer 31. Similarly, a fourth wiring pattern 44 is formed in the non-input area of the fourth transparent substrate 40 so as to surround the input area, and a voltage is applied in the Y1-Y2 direction of the fourth transparent electrode layer 41. Can do.

  In the input operation of the resistive touch sensor 6, when an arbitrary portion of the input surface is pressed, the flexible third transparent substrate 30 is bent, and the third transparent electrode layer 31, the fourth transparent electrode layer 41, Touch. By this contact, a potential gradient is generated in the X1-X2 direction in the voltage applied in the third transparent electrode layer 31, and the X coordinate can be detected. Also. The voltage applied in the fourth transparent electrode layer 41 has a potential gradient in the Y1-Y2 direction, whereby the Y coordinate can be detected.

  The third transparent substrate 30 can be made of a transparent film-like resin material such as PET (polyethylene terephthalate) that can be deformed according to an input operation, and has a thickness of about 100 μm to 200 μm, for example, a thickness of about 188 μm. Formed with. The fourth transparent substrate 40 is made of a transparent resin, for example, a resin such as PC (polycarbonate), PET (polyethylene terephthalate), PES (polyether sulfone), PMMA (methyl methacrylate resin), or norbornene resin. Can be used. The thickness should just be the extent which can support the deformation | transformation of the 3rd transparent base material 30 by pressing operation, and is formed in thickness of 0.5 mm-1.5 mm, for example, about 1.0 mm.

Moreover, the 3rd transparent electrode layer 31 and the 4th transparent electrode layer 41 are ITO (Indium Tin Oxide) which has translucency in visible region similarly to the 1st transparent electrode layer 11 and the 2nd transparent electrode layer 21. , SnO 2 , ZnO or the like, and formed by a thin film method such as a sputtering method or a vapor deposition method. The thickness of each layer is 0.01 μm to 0.05 μm, for example, about 0.02 μm. In addition to the thin film method, it can be formed by the above-described transfer method or coating method.

  As shown in FIGS. 1 to 4, a decorative film 61 on which a decorative layer 62 is printed is laminated on the input surface side of the resistive touch sensor 6. The decorative layer 62 is formed by coloring a non-input area surrounding the input area, and has an effect of shielding the wiring pattern of each transparent substrate from being directly recognized by the operator. In addition, a pattern, a mark, a character, or the like other than coloring may be drawn on the decorative layer 62, and a part of the design of the electronic device to be mounted can be configured. The decorative film 61 may be a film-like transparent resin material such as PET that can be deformed by a pressing operation, and may have a thickness of, for example, about 125 μm.

  Moreover, the capacitive touch sensor 4 and the resistive film type touch sensor 6, and the resistive film type touch sensor 6 and the decorative film 61 are laminated via an adhesive layer 67 and an adhesive layer 69, respectively. For the pressure-sensitive adhesive layer that bonds the layers, a translucent acrylic resin-based pressure-sensitive adhesive tape can be used, and the thickness thereof is about 10 μm to 100 μm. Similarly, a translucent acrylic resin adhesive tape can be used for the adhesive layers 66 and 68 for bonding the transparent substrates of the capacitive touch sensor 4 and the resistive touch sensor 6 together.

  Since the capacitive touch sensor 4 can be input by bringing a finger or the like in close proximity, the input operation can be performed smoothly and multipoint input is possible. However, since the input position information is detected based on a change in capacitance, there is a problem that the input operation cannot be performed, for example, with a gloved state or an input device formed of an insulator such as resin. . In addition, since the resistive film type touch sensor 6 can detect the input position information by contact between the transparent electrode films, the material of the instrument used for the input operation is not particularly limited, and a finger or an insulating pen-shaped input instrument or the like can be used. Can be used. However, it is difficult to perform multipoint input.

  Since the input device 1 according to the present embodiment includes the capacitive touch sensor 4 and the resistive touch sensor 6, the input device 1 is not limited to an input device, and an input operation using an insulating input device is also possible. In addition, multipoint input with a finger is also possible. Thus, by stacking touch sensors with different input methods, it is possible to cope with more complicated operations. In the present embodiment, since the resistive touch sensor 6 is arranged on the input surface side, the input resistance of the resistive touch sensor 6 can be kept small, so that a pressing operation with a finger or a pen-shaped input device is performed. It can be done smoothly.

  Next, the configuration for outputting the input position information in the input device 1 of the present embodiment will be described in more detail.

  As shown in FIG. 2, in the first transparent base material 10 constituting the capacitive touch sensor 4, a first connection electrode 12 for connecting to an external circuit board is formed in the Y1 direction of the non-input area. Yes. The first wiring pattern 14 is formed in a non-input region of the first transparent substrate 10 and electrically connects the first connection electrode 12 and the first transparent electrode layer 11. The second transparent base material 20 is provided with a second connection electrode 22 in the Y1 direction of the non-input area, and the second wiring pattern 24 is connected to the second transparent electrode layer 21 on the Y1 side and the second end. The connection electrode 22 is connected.

  Also, as shown in FIGS. 2 and 4, input position information from the resistive film type touch sensor 6 is output to the first transparent base material 10, the second transparent base material 20, and the fourth transparent base material 40. For this purpose, a through hole 63 is formed to penetrate therethrough. The through hole 63 is filled with a conductive paste containing a metal material such as silver or copper, whereby the layers can be electrically connected. The diameter of the through hole 63 is preferably about 0.1 mm to 2.0 mm. If the thickness is smaller than 0.1 mm, it may be difficult to ensure the connection reliability between the layers when a stacking deviation occurs. When the diameter is larger than 2 mm, there is a possibility that a crack or a hole is generated inside the through hole 63 due to the volume shrinkage of the conductive paste, and conduction cannot be obtained. Moreover, since the quantity of the electrically conductive paste to use will increase when a diameter is enlarged, it is unpreferable in terms of manufacturing cost.

  The conductive paste can be filled into the through hole 63 by a printing method such as screen printing or a dispenser. Moreover, as shown in FIG. 4, when the through hole 63 is penetrated to the surface of the input device 1, it is practical to fill the conductive paste with a dispenser after laminating each transparent base material. This makes it easy to connect the layers.

  As shown in FIG. 2, the third wiring pattern 34 and the fourth wiring are formed in the non-input areas on the opposing surfaces of the third transparent substrate 30 and the fourth transparent substrate 40 constituting the resistive film type touch sensor 6, respectively. A pattern 44 is formed. The third wiring pattern 34 is formed to extend in the Y1-Y2 direction so as to sandwich the third transparent electrode layer 31 in the X1-X2 direction, and connects the third transparent electrode layer 31 and the through hole 63. . The fourth wiring pattern 44 is formed to extend in the X1-X2 direction so as to sandwich the fourth transparent electrode layer 41 in the Y1-Y2 direction, and connects the fourth transparent electrode layer 41 and the through hole 63. To do. As shown in FIGS. 2 and 4, the third transparent electrode layer 31 and the third transparent electrode layer 31 are electrically connected to one surface (the surface on which the second transparent electrode layer 21 is formed) of the second transparent substrate 20 through a through hole 63. The third connection electrode 32 and the fourth connection electrode 42 electrically connected to the fourth transparent electrode layer 41 through the through hole 63 are formed. In this way, the input position information of the resistive touch sensor 6 is drawn out to one surface of the second transparent substrate 20 through the through hole 63.

  The first wiring pattern 14, the second wiring pattern 24, the third wiring pattern 34, and the fourth wiring pattern 44 formed on each transparent base material use a conductive paste including silver, copper, etc., and screen It can be formed by a printing method such as a printing method or an inkjet printing method. Or you may form by thin film methods, such as a sputtering method and a vapor deposition method.

  FIGS. 5A and 5B are partial enlarged plan views of the first transparent substrate 10 and the second transparent substrate 20 near the non-input area in the Y1 direction, respectively. In FIG.5 (c), the partial enlarged plan view when the 1st transparent base material 10 and the 2nd transparent base material 20 are laminated | stacked is shown. 5A to 5C are partially enlarged plan views when viewed from the surface on which the first transparent electrode layer 11 and the second transparent electrode layer 21 are formed.

  As shown to Fig.5 (a), the 1st connection area | region 13 for connecting with FPC64 is provided in the non-input area | region of the 1st transparent base material 10 at the Y1 direction. A first connection electrode 12 that is electrically connected to the first transparent electrode layer 11 is formed in the first connection region 13 and is electrically connected to the FPC connection terminal 65. Further, as shown in FIG. 5B, a second connection region 23 for connecting to the FPC 64 is provided in the non-input region in the Y1 direction of the second transparent base material 20. A second connection electrode 22 that is electrically connected to the second transparent electrode layer 21 is formed in the second connection region 23. The second connection region 23 is electrically connected to the third connection electrode 32 electrically connected to the third transparent electrode layer 31 through the through hole 63 and electrically connected to the fourth transparent electrode layer 41 through the through hole 63. The 4th connection electrode 42 connected to is formed.

  As shown in FIG. 5C, the first connection region 13 of the first transparent base material 10 and the second connection region 23 of the second transparent base material 20 are formed side by side in a plan view. In addition, a cutout is provided in a portion of the second transparent base material 20 that overlaps the first connection region 13, and the first connection region 13 is provided side by side with the second connection region 23, so that one of the input devices 1 Exposed to the surface.

  By adopting such a configuration, the first connection electrode 12, the second connection electrode 22, the third connection electrode 32, and the fourth connection electrode 42 are viewed in a plan view in the non-input region on one surface of the input device 1. It is installed side by side. Thereby, since it can oppose with one side of FPC64 and it can connect in a plane, a connection process can be performed easily. Moreover, since each connection electrode can be aggregated on two transparent base materials and is connected to one surface of the FPC 64, compared to the case where each connection electrode is formed on four conventional transparent base materials, Even when thermal expansion and thermal contraction of each base material of the input device 1 occur, it is easy to relieve stress acting on each connection electrode, and connection reliability can be ensured.

  Furthermore, since the connection process of the capacitive touch sensor 4 and the connection process of the resistive touch sensor 6 can be performed in the same connection process using the same FPC 64, the manufacturing cost is suppressed. In addition, the conventional input device requires a plurality of FPCs for connection to each connection electrode. However, the input device 1 according to the present embodiment can be connected to each connection electrode by one FPC 64. Costs can be reduced.

  Further, since one surface of the input device 1 and one surface of the FPC 64 are connected, the input device 1 has an uneven surface on the input surface side due to the influence of the thickness of the FPC 64 and the thickness of the adhesive between the FPC 64 and each connection region. Swelling can be suppressed. Therefore, it is possible to provide the input device 1 having a flat input surface.

  An anisotropic conductive adhesive can be used for bonding each connection electrode to the FPC connection terminal 65. The anisotropic conductive adhesive is obtained by uniformly dispersing conductive particles such as metal-plated resin beads in a binder material having no conductivity such as an epoxy resin. When the anisotropic conductive adhesive is sandwiched between the connection electrodes and the FPC connection terminal 65 and cured by applying heat and pressure, the conductive particles come into contact with the opposing electrodes in the thickness direction. Can be maintained in an insulating state in the planar direction.

  In the input device 1 of the present embodiment, the third connection electrode 32 and the fourth connection electrode 42 are formed in the second connection region 23 of the second transparent base material 20, and the output from the resistive film type touch sensor 6 is extracted. Yes. However, the present invention is not limited to this aspect, and it is possible to provide the third connection electrode 32 and the fourth connection electrode 42 drawn out from the resistive touch sensor 6 in the first connection region 13 of the first transparent substrate 10. In this case, while increasing the area of the 1st connection area | region 13, the area of the notch of the part which planarly overlaps with the 1st connection area | region 13 of the 2nd transparent base material 20 is also enlarged. As a result, the first connection region 13 is juxtaposed with the second connection region 23 and exposed on one surface of the input device 1, and the first connection electrode 12, the second connection electrode 22, the third connection electrode 32, and the first connection region 13 are exposed. Four connection electrodes 42 are juxtaposed in plan view. Further, the through hole 63 may penetrate the first transparent base material 10 and the fourth transparent base material 40 to connect the layers.

  FIG. 6 is a cross-sectional view of the input device 1 taken along a line corresponding to the line III-III in FIG. 1, showing a modification of the first embodiment. As shown in FIG. 6, the fourth transparent electrode layer 41 constituting the resistive film type touch sensor 6 is laminated on one surface of the common base material 50, and the capacitive touch sensor 4 is formed on the other surface. The 1st transparent electrode layer 11 which comprises is laminated | stacked. That is, in the input device 1 of this modification, the first transparent base material 10 and the fourth transparent base material 40 shown in FIGS. 1 to 4 can be shared by a single layer of the common base material 50. For the common base material 50, a transparent resin substrate such as PC, PET, PES, PMMA or the like is used similarly to the fourth transparent base material 40, and the thickness is about 0.5 mm to 1.5 mm, for example, about 1.0 mm. It is formed.

  FIG. 7 is a cross-sectional view of the input device 1 taken along the line IV-IV in FIG. 1, showing a modification of the first embodiment. In this modification, the first connection region 13 (not shown) is formed on the other surface of the common base material 50, and the first connection electrode 12 electrically connected to the first transparent electrode layer 11 is formed. ing. Further, as shown in FIG. 7, a through hole 63 is formed through the common base material 50 and the second transparent base material 20, and the input position information from the resistive film type touch sensor 6 is the through hole 63. Through the third connection electrode 32 and the fourth connection electrode 42 formed on one surface of the second transparent substrate 20. As a result, the first connection electrode 12, the second connection electrode 22, the third connection electrode 32, and the fourth connection electrode 42 are arranged side by side in a plan view on one surface of the input device 1.

  Also in this modification, since it can be connected to each connection electrode in a plan view so as to face one surface of the FPC 64, the connection process can be easily performed. Moreover, each connection electrode can be collected on two transparent base materials, and even when thermal expansion and thermal contraction of each base material of the input device 1 occur, the stress acting on each connection electrode is alleviated compared to the conventional case. It is easy to do, and connection reliability can be ensured. Moreover, since one transparent base material and one adhesion layer can be omitted from the input device 1 shown in FIGS. 1 to 4, cost reduction and thickness reduction can be realized.

  In the present modification, the third connection electrode 32 and the fourth connection electrode 42 can be provided in the first connection region 13 of the common base material 50. In this case, if the through hole 63 is formed in the common base material 50, the input position information from the resistive film type touch sensor 6 can be taken out.

<Second Embodiment>
FIG. 8 is an exploded perspective view of the input device 2 according to the second embodiment. 9 is a cross-sectional view of the input device 2 cut along line IX-IX in FIG. 8, and FIG. 10 is a cross-sectional view of the input device 2 cut along line XX in FIG.

  As shown in FIGS. 8 to 10, in the input device 2 of the second embodiment, the capacitive touch sensor 4 is stacked on the input surface side of the resistive touch sensor 6. In addition, a decorative film 61 in which a decorative layer 62 is formed is laminated on the input surface side of the capacitive touch sensor 4. The same contents as those of the input device 1 of the first embodiment are repeated for each transparent substrate, each transparent electrode layer, and each wiring pattern constituting the capacitive touch sensor 4 and the resistive touch sensor 6. Therefore, detailed description is omitted.

  Also in the input device 2 of the present embodiment, since the capacitive touch sensor 4 and the resistive touch sensor 6 are used in combination, it is possible to cope with various input operations without being limited to input devices. it can. In this embodiment, since the capacitive touch panel 4 is arranged on the input surface side, the sensitivity of the capacitive touch sensor 4 is good, and a smooth input operation with a finger or a conductive input device is possible. It becomes.

  Next, a configuration for extracting input position information in the input device 2 of the present embodiment will be described. Also in the present embodiment, as in FIGS. 5A and 5B, the first connection region 13 and the first connection region 13 are respectively formed in the Y1 side non-input region of the first transparent substrate 10 and the second transparent substrate 20. Two connection regions 23 are provided. A first connection electrode 12 electrically connected to the first transparent electrode layer 11 is formed in the first connection region 13, and a second connection region 23 is electrically connected to the second transparent electrode layer 21. Two connection electrodes 22 are formed.

  The first connection region 13 and the second connection region 23 are provided so as to be juxtaposed in a plan view, and a cutout is formed at a location of the second transparent substrate 20 facing the first connection region 13. ing. Moreover, the notch is formed also in the location which opposes the 1st connection area | region 13 and the 2nd connection area | region 23 of the 3rd transparent base material 30 and the 4th transparent base material 40. FIG. As a result, the first connection region 13 and the second connection region 23 are juxtaposed on one surface of the input device 2 and exposed.

  Further, as shown in FIGS. 8 and 10, a through hole 63 penetrates the Y1 side non-input area of the third transparent base material 30 and the fourth transparent base material 40 constituting the resistive film type touch sensor 6. Is provided. The input position information detected by the third transparent electrode layer 31 and the fourth transparent electrode layer 41 is drawn out to one surface of the second transparent substrate 20 through the through hole 63. In the second connection region 23 of the second transparent base material 20, the third connection electrode 32 and the fourth connection electrode 42 are arranged in parallel, and the third transparent electrode layer 31 and the third connection electrode 32 are connected to the through hole 63. In addition, the fourth transparent electrode layer 41 and the fourth connection electrode 42 are electrically connected through the through hole 63.

  With this configuration, the first connection electrode 12, the second connection electrode 22, the third connection electrode 32, and the fourth connection electrode 42 are juxtaposed in a plan view in the non-input region of the input device 2. . Accordingly, since one surface of the FPC 64 and each connection electrode can be opposed to each other and connected in a plane, the connection process is facilitated. In addition, even when stress is applied to the input device 2 or when thermal expansion or thermal contraction of each base material occurs, the stress can be relaxed, so that connection reliability can be ensured.

  In the present embodiment, if the through hole 63 is formed in the third transparent base material 30, it is possible to draw the input position information of the resistive film type touch sensor 6 to one surface of the second transparent base material 20. However, as shown in FIG. 10, it is more preferable to provide the through hole 63 through the third transparent substrate 30 and the fourth transparent substrate 40. In this way, since the conductive paste can be filled in the through holes 63 after laminating the transparent substrates, the process of electrically connecting the layers becomes easy and the interlayer connection reliability can be improved. it can.

  In the input device 2 of the present embodiment, the third connection electrode 32 and the fourth connection electrode 42 can be formed in the first connection region 13 of the first transparent substrate 10. In this case, if the through hole 63 is formed in the second transparent base material 20 and the third transparent base material 30, input position information of the resistive film type touch sensor 6 can be taken out to the first transparent base material 10.

  11 and 12 show a modification of the second embodiment. FIG. 11 is a cross-sectional view of the input device 2 cut at a position corresponding to the line IX-IX in FIG. As shown in FIG. 8, the second transparent electrode layer 21 constituting the capacitive touch sensor 4 is laminated on one surface of the common base 51, and the resistive touch sensor 6 is disposed on the other surface. A third transparent electrode layer 31 is stacked. That is, the input device 2 of this modification can share the second transparent base material 20 and the third transparent base material 30 shown in FIGS. 8 to 10 with a single common base material 51. The common base material 51 of this modification is disposed on the input surface side of the resistive touch sensor 6 and uses a film-like material that can be flexibly deformed in accordance with the pressing operation. For the common base material 51, for example, a transparent resin material such as PET can be used. Further, the thickness is formed to be 100 μm to 200 μm, for example, about 188 μm.

  In this modification, since the transparent base material for one layer and the adhesive layer for one layer can be omitted from the input device 2 shown in FIGS. 8 to 10, the cost and thickness can be reduced. it can. Further, since the total thickness of the transparent base material and the adhesive layer laminated on the input surface side of the resistive film type touch sensor 6 can be reduced, the input resistance during the pressing operation can be reduced.

  FIG. 12 is a cross-sectional view of the input device 2 taken along a line corresponding to the line XX in FIG. 8, showing a modification of the second embodiment. In the input device 2 in the present modification, a through hole 63 is provided through the common base material 51 and the fourth transparent base material 40. Further, the third connection electrode 32 and the fourth connection electrode 42 are provided in the non-input region on one surface of the common base material 51. The third transparent electrode layer 31 of the resistive touch sensor 6 is electrically connected to the third connection electrode 32 through the through hole 63, and the fourth transparent electrode layer 41 is connected to the fourth connection electrode 42 through the through hole 63. And electrically connected. Thereby, the input position information of the resistive film type touch sensor 6 is drawn to one surface of the common base material 51 (the surface on which the second transparent base material 20 is laminated).

  In the present modification, the first connection region 13 is formed in the non-input region of the first transparent substrate 10, and the first connection electrode 12 connected to the first transparent electrode layer 11 is formed. Further, a second connection region 23 is formed in the non-input region of the second transparent base material 20, and the third transparent electrode 22 is connected to the second transparent electrode layer 21 through the through hole 63. A third connection electrode 32 connected to the electrode layer 31 and a fourth connection electrode 42 connected to the fourth transparent electrode layer 41 through the through hole 63 are formed.

  Also in this modification, the first connection electrode 12, the second connection electrode 22, the third connection electrode 32, and the fourth connection electrode 42 are juxtaposed in a plan view in the non-input region of the input device 2. As a result, since one surface of the FPC 64 and each connection electrode can be opposed to each other and connected in a plane, the connection process is facilitated, and stress can be relieved, thereby improving connection reliability. To do.

DESCRIPTION OF SYMBOLS 1, 2 Input device 4 Capacitance type touch sensor 6 Resistive film type touch sensor 10 1st transparent base material 11 1st transparent electrode layer 12 1st connection electrode 13 1st connection area 20 2nd transparent base material 21 2nd transparent Electrode layer 22 Second connection electrode 23 Second connection region 30 Third transparent substrate 31 Third transparent electrode layer 32 Third connection electrode 34 Third wiring pattern 40 Fourth transparent substrate 41 Fourth transparent electrode layer 42 Fourth connection Electrode 50, 51 Common base material 63 Through hole 64 FPC
65 FPC connection terminal 66, 67, 68, 69 Adhesive layer

Claims (9)

  1. A capacitive touch sensor that detects an input position by a change in capacitance;
    A resistive film type touch sensor that detects an input position by a change in resistance value is laminated,
    The capacitive touch sensor has a first transparent substrate having a first transparent electrode layer formed on one surface and a second transparent substrate having a second transparent electrode layer formed on one surface. And one surface of the first transparent substrate and the other surface of the second transparent substrate are laminated facing each other,
    The resistive film type touch sensor includes a third transparent substrate having a third transparent electrode layer formed on one surface and a fourth transparent substrate having a fourth transparent electrode layer formed on one surface. The third transparent electrode layer and the fourth transparent electrode layer are laminated to face each other with a space,
    At least one of the third transparent substrate and the fourth transparent substrate is formed with a through hole for drawing out the third transparent electrode layer and the fourth transparent electrode layer to the outside.
    A first connection region and a second connection region for connecting to an external circuit board are arranged side by side in plan view on one surface of the first transparent substrate and one surface of the second transparent substrate, respectively. Has been
    The first connection region is provided with a first connection electrode electrically connected to the first transparent electrode layer,
    In the second connection region, a second connection electrode electrically connected to the second transparent electrode layer is provided,
    A third connection electrode electrically connected to the third transparent electrode layer via the through hole, and a fourth connection electrode electrically connected to the fourth transparent electrode layer via the through hole, Provided in the first connection region or the second connection region;
    The input device, wherein the first connection electrode, the second connection electrode, the third connection electrode, and the fourth connection electrode are juxtaposed in a plan view.
  2.   The input device according to claim 1, wherein the resistive touch sensor is stacked on an input surface side of the capacitive touch sensor.
  3.   The input device according to claim 2, wherein a through-hole penetrating the fourth transparent base material, the first transparent base material, and the second transparent base material is provided.
  4.   The other surface of the third transparent substrate constitutes an input surface, the fourth transparent substrate and the first transparent substrate are composed of the same common substrate, and the fourth transparent electrode layer is The first transparent electrode layer is formed on one surface of the common base material, and the first transparent electrode layer is formed on the other surface of the common base material. The input device according to claim 2, wherein a through hole for connecting the fourth transparent electrode layer, the third connection electrode, and the fourth connection electrode is formed.
  5.   The input device according to claim 4, wherein a through-hole penetrating the common base material and the second transparent base material is provided.
  6.   The input device according to claim 1, wherein the capacitive touch sensor is laminated on an input surface side of the resistive touch sensor.
  7.   The input device according to claim 6, wherein a through-hole penetrating the third transparent substrate and the fourth transparent substrate is provided.
  8.   The other surface of the first transparent substrate constitutes an input surface, the second transparent substrate and the third transparent substrate are composed of the same common substrate, and the second transparent electrode layer is The third transparent electrode layer is formed on one surface of the common base material, and the third transparent electrode layer is formed on the other surface of the common base material. The input device according to claim 6, wherein through-holes for connecting the fourth transparent electrode layer, the third connection electrode, and the fourth connection electrode are formed.
  9. The input device according to claim 8, wherein a through hole penetrating the common base material and the fourth transparent base material is provided.
JP2010292701A 2010-12-28 2010-12-28 Input device Withdrawn JP2012141690A (en)

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Cited By (10)

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CN103218098A (en) * 2013-04-11 2013-07-24 深圳富泰宏精密工业有限公司 Hybrid touch input device and hybrid touch input panel
JP5347096B1 (en) * 2012-09-13 2013-11-20 株式会社ワンダーフューチャーコーポレーション Touch panel manufacturing method, touch panel, and input / output integrated device including touch panel and display device
JP2014044680A (en) * 2012-08-28 2014-03-13 Fujitsu Component Ltd Hybrid touch panel
JP2014081908A (en) * 2012-10-15 2014-05-08 Samsung Display Co Ltd Touch sensing system
JP2014191779A (en) * 2013-03-28 2014-10-06 Kyocera Corp Display device with input function, and electronic apparatus
WO2015015691A1 (en) * 2013-07-29 2015-02-05 シャープ株式会社 Touch panel sensor sheet module and method for manufacturing touch panel system module
JP5801947B1 (en) * 2014-09-05 2015-10-28 グンゼ株式会社 touch panel
JP2016126455A (en) * 2014-12-26 2016-07-11 富士通コンポーネント株式会社 Touch panel unit
WO2017154959A1 (en) * 2016-03-11 2017-09-14 株式会社フジクラ Wiring body assembly, wiring structure, and touch sensor
WO2019169882A1 (en) * 2018-03-08 2019-09-12 京东方科技集团股份有限公司 Touch substrate and preparation method therefor, and display device

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014044680A (en) * 2012-08-28 2014-03-13 Fujitsu Component Ltd Hybrid touch panel
JP5347096B1 (en) * 2012-09-13 2013-11-20 株式会社ワンダーフューチャーコーポレーション Touch panel manufacturing method, touch panel, and input / output integrated device including touch panel and display device
KR20150004372A (en) 2012-09-13 2015-01-12 가부시키가이샤 원더 퓨쳐 코포레이션 Touch panel, method for manufacturing touch panel, and touch panel integrated display device
JP2014081908A (en) * 2012-10-15 2014-05-08 Samsung Display Co Ltd Touch sensing system
JP2014191779A (en) * 2013-03-28 2014-10-06 Kyocera Corp Display device with input function, and electronic apparatus
CN103218098A (en) * 2013-04-11 2013-07-24 深圳富泰宏精密工业有限公司 Hybrid touch input device and hybrid touch input panel
WO2015015691A1 (en) * 2013-07-29 2015-02-05 シャープ株式会社 Touch panel sensor sheet module and method for manufacturing touch panel system module
JP5801947B1 (en) * 2014-09-05 2015-10-28 グンゼ株式会社 touch panel
CN105404409A (en) * 2014-09-05 2016-03-16 郡是株式会社 Touch panel
US10013928B2 (en) 2014-09-05 2018-07-03 Gunze Limited Touch panel
JP2016126455A (en) * 2014-12-26 2016-07-11 富士通コンポーネント株式会社 Touch panel unit
WO2017154959A1 (en) * 2016-03-11 2017-09-14 株式会社フジクラ Wiring body assembly, wiring structure, and touch sensor
JPWO2017154959A1 (en) * 2016-03-11 2018-09-13 株式会社フジクラ Wiring body assembly, wiring structure, and touch sensor
WO2019169882A1 (en) * 2018-03-08 2019-09-12 京东方科技集团股份有限公司 Touch substrate and preparation method therefor, and display device

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