JP2012247895A - Input device and manufacturing method of input device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an input device capable of preventing uneven reflection at the viewing surface with a simple structure and a manufacturing method of the input device.SOLUTION: The input device includes: a decorative film 20 one surface of which is an input operation plane; a translucent adhesive layer laminated on the other surface of the decorative film 20; a first transparent substrate 30 one side of which is stuck via an adhesive layer 52; a first transparent electrode layer 31 laminated on the other side of the first transparent substrate 30; a first lead wiring layer 32 electrically connected to the first transparent electrode layer 31; a first connection terminal 33 formed on the first lead wiring layer 32; and a flexible wiring board 60 electrically connected to the first connection terminal 33. A window-like air gap portion 55 is formed on the adhesive layer 52 at a position which is overlapped with the first connection terminal 33 in a plane view.

Description

  The present invention relates to an input device and a method of manufacturing the input device, and more particularly to an input device and a method of manufacturing the input device that can suppress uneven reflection on the surface side to be visually observed.

  A translucent input device is configured such that a transparent electrode layer and a lead-out wiring layer from the transparent electrode layer are formed on a transparent substrate, and an input coordinate position can be detected by an operator's input operation, such as a liquid crystal display device Combined with the display screen, the menu selection and data input functions are demonstrated.

  As such a translucent input device, an electrostatic capacitance type or resistance film type input device is known. As disclosed in Patent Document 1, the resistance film type input device is configured such that a pair of transparent base materials are arranged to face each other with a space therebetween, and are joined via an insulating layer in the peripheral portion. A transparent electrode layer is formed in the light-transmitting region on the opposite surface of each transparent substrate, and a lead-out wiring layer for outputting input information is formed in the non-light-transmitting region surrounding the light-transmitting region. A flexible wiring board for connection is connected. The transparent substrate on the surface side that is the input operation surface is formed using a flexible film-like material, and when the operator presses an arbitrary portion of the input region, the transparent substrate is deformed to form a pair. The input electrode position can be detected by reading the change in resistance value caused by the contact of the transparent electrode layer.

  In recent years, there has been a demand for further thinning of such an input device. In addition, since the input device is incorporated in an electronic device and used as a part of the casing of the electronic device or a part of the operation surface, a mode in which a step with the casing does not occur is preferred. Therefore, various attempts have been made to realize a flat input device that is thin and has no irregularities on the surface side of the input device.

  Since the flexible wiring board used for the thin input device is crimped via the connecting member, the crimped trace of the flexible wiring substrate is visually recognized as light reflection unevenness on the surface side of the input device. This unevenness is irrelevant to the function of the translucent area where the input operation is performed, and is a small part of the non-translucent area. However, even in a non-light-transmitting region that does not affect the function of the input device, uneven reflection caused by slight unevenness is conspicuous, and there is a possibility that the user is concerned.

  In the input device of Patent Document 2, in order to improve the unevenness on the surface side which is the input operation surface, the flexible wiring substrate is not connected to the transparent base material on the input operation surface side so as not to be affected by the thickness of the flexible wiring substrate. In addition, a conductive connection portion from the transparent base material on the input operation surface side was provided and a through hole penetrating the front and back surfaces of the other transparent base material facing each other was provided. And the flexible wiring board was connected to the surface (back surface) on the opposite side of the other transparent base material which opposes. Furthermore, since the flexible wiring board has unevenness due to the electrodes, a space is provided in the insulating layer for opposingly arranging the pair of transparent base materials so that the unevenness of the electrodes is not transferred to the surface side.

JP 2008-21304 A JP 2011-8666 A

  However, since the unevenness on the surface side is improved by connecting the flexible wiring board through the through hole provided in the transparent base material, such an input device requires a complicated configuration, There was a problem that necessary members increased.

  The present invention has been made to solve the above-described problems, and in particular, an object of the present invention is to provide an input device and a method for manufacturing the input device that can suppress the uneven reflection on the surface side to be viewed with a simple configuration.

  The input device of the present invention includes a decorative base material having one surface as an input operation surface, a translucent adhesive layer laminated on the other surface of the decorative base material, and the decorative base material. A first transparent substrate having one surface bonded through an adhesive layer, a first transparent electrode layer formed on the other surface of the first transparent substrate, and an electrical connection to the first transparent electrode layer A first wiring layer, a first connection terminal provided on the first wiring layer, and a flexible wiring board electrically connected to the first connection terminal, wherein the adhesive layer has a window-like gap. And the gap is provided at a position overlapping the first connection terminal in plan view.

  The flexible wiring board is connected to the first connection terminal of the first transparent base material on the input side, and the first transparent base material is a distortion of the first connection terminal and the surrounding area due to the influence of connecting the flexible wiring board. Produce. According to the present invention, the void portion formed in the adhesive layer relaxes the stress due to the distortion. In addition, even if the connection region is uneven, it can be absorbed by the window-shaped gap. Thereby, the influence which connected the flexible wiring board does not propagate to the surface of the decorating base material which is an input operation surface.

  Therefore, it is possible to suppress the reflection unevenness on the surface side to be visually observed with a simple configuration.

  Further, the decorative base material has a light-transmitting region provided in a window shape and a non-light-transmitting region surrounding the light-transmitting region, and a decorative layer for coloring the non-light-transmitting region is provided. It is preferable that the decorative layer is formed on the other surface of the decorative base material. If it carries out like this, while being able to provide a decoration layer so that each lead-out wiring layer, each connection terminal, and a flexible wiring board may be arranged in a non-light-transmitting field, a decoration layer and an input operation surface of a decoration base material Is formed on the opposite surface, the surface side of the input device can be flattened.

  A second transparent substrate disposed to face the other surface of the first transparent substrate; and a second transparent electrode layer formed on the second transparent substrate to face the first transparent electrode layer. A second lead-out wiring layer electrically connected to the second transparent electrode layer; and a second connection terminal provided in the second lead-out wiring layer, wherein the first connection terminal and the second connection terminal It is preferable that the flexible wiring board is electrically connected to the second connection terminal. In this way, an input device having flexible wirings electrically connected to both of the opposing transparent electrode layers can be realized, and thus the reflection unevenness on the surface side to be visually observed can be suppressed with a simple configuration.

  The second transparent base material is formed by molding a transparent resin and has a space portion facing the flexible wiring board, and the space portion is at a position overlapping at least the first connection terminal in plan view. It is preferable to be provided. Since the transparent resin is molded, the second transparent substrate can be formed into a rigid structure. In this way, the input device can be configured with a simple structure, and can be easily integrated with a display device or an electronic device. Moreover, since the space part which opposes a flexible wiring board is provided, it can escape even if the thickness of the flexible wiring board in a 1st connection terminal varies and becomes thick. Therefore, the flatness of the surface side to be visually observed can be improved reliably.

  Furthermore, the space may be a through hole. In this way, since the electrical connection of the flexible wiring board at the first connection terminal can be performed from the second transparent base material side using the through hole, the flatness on the surface side to be visually observed is surely improved. it can.

  Alternatively, the space may be a recess. Even in this case, since there is no concern that the thickness of the flexible wiring board at the first connection terminal affects the input surface side, the flatness of the surface side to be visually observed can be reliably improved.

  The gap may be provided at a position overlapping the second connection terminal in plan view. The first connection terminal and the second connection terminal are arranged side by side at a predetermined interval in a plan view, and a gap including them is provided in a plan view, so that the flexible wiring board can be formed in the second connection terminal. There is no concern that the thickness will affect the input surface side, and connection of the flexible wiring board is facilitated.

In the method for manufacturing an input device of the present invention, a decorative base material having one surface as an input operation surface, and one surface is bonded to the other surface of the decorative base material via a translucent adhesive layer. A first transparent base material, and a first transparent electrode layer provided on the first transparent base material,
(A) a first lead wiring layer electrically connected to the first transparent electrode layer on the other surface of the first transparent substrate provided with the first transparent electrode layer; and a first lead wiring layer A step of forming a provided first connection terminal;
(B) forming a void in the adhesive layer;
(C) The other surface of the decorative substrate and the one surface of the first transparent substrate are bonded together via the adhesive layer, and the gap portion overlaps the first connection terminal in plan view. Providing the position;
(D) a step of crimping a flexible wiring board to the first connection terminal via a connection member;
It is characterized by including.

  Since the flexible wiring board is connected to the first connection terminal of the first transparent base material on the input side, distortion occurs in the first connection terminal and the surrounding area. According to the present invention, the stress caused by the distortion is applied to the adhesive layer. The gap formed in the region is relaxed. Moreover, even if unevenness is generated in the connection region, it can be absorbed by the gap. Thereby, the influence which connected the flexible wiring board does not propagate to the surface of the decorating base material which is the input operation surface side. Therefore, it is possible to improve the reflection unevenness on the surface side as viewed with a simple configuration.

  In the step (d), a second transparent base material provided with a second transparent electrode layer after forming a through-hole by molding a transparent resin is used as the second transparent electrode layer and the first transparent substrate. It is preferable that the electrode layer is disposed so as to be opposed, a device for crimping the flexible wiring board is inserted into the through hole, and the flexible wiring board is crimped to the first connection terminal via the connection member. . In this way, the flexible wiring board can be crimped from the space portion of the second transparent base material in a state where the flexible wiring board is placed on the first connection terminal of the first transparent base material. Even if thermocompression bonding is used, there is no concern of overheating.

  Furthermore, the manufacturing method of the input device according to the present invention includes a decorative base material having one surface as an input operation surface, and one surface on the other surface of the decorative base material via a translucent adhesive layer. Provided on the opposite surfaces of the bonded first transparent substrate, the second transparent substrate disposed to face the first transparent substrate, and the first transparent substrate and the second transparent substrate, respectively. A first transparent electrode layer and a second transparent electrode layer, wherein the second transparent electrode layer is provided with the first transparent electrode layer on the other surface of the first transparent substrate. Forming a first lead wiring layer electrically connected to one transparent electrode layer and a first connection terminal provided on the first lead wiring layer; and forming the second transparent substrate by molding a transparent resin. A step of forming, a step of forming a second transparent electrode layer on the second transparent substrate, and an electrical connection to the second transparent electrode layer. Forming the second lead wiring layer and the second connection terminal provided in the second lead wiring layer, and the first transparent substrate and the second transparent substrate so as to face each other at a predetermined interval. And a step of pressure-bonding a flexible wiring board to the first connection terminal and the second connection terminal via a connection member, and the decorative base material on one surface of the first transparent base material A step of bonding through an adhesive layer, wherein the adhesive layer has a gap formed in advance, and the gap is provided at a position overlapping the first connection terminal in plan view. Features.

  If it carries out like this, in order to connect a flexible wiring board with the 1st connection terminal of the 1st transparent base material of an input side, distortion will be produced in the 1st connection terminal and the field of the circumference, but according to the present invention, by the distortion The void formed in the adhesive layer relaxes the stress. Moreover, even if unevenness is generated in the connection region, it can be absorbed by the gap. Thereby, the influence which connected the flexible wiring board does not propagate to the surface of the decorating base material which is the input operation surface side. Therefore, it is possible to suppress the reflection unevenness on the surface side to be visually observed with a simple configuration.

  It is preferable that a recess is formed in the second transparent substrate, and the recess is provided at a position overlapping the first connection terminal in plan view. If it carries out like this, even if the thickness of the flexible wiring board in a 1st connection terminal varies and it becomes thick, it can escape. Therefore, the flatness of the surface side to be visually observed can be improved reliably.

  Furthermore, it is preferable that the concave portion is provided at a position overlapping the second connection terminal in plan view. By so doing, the second wiring terminal can be escaped even when the thickness of the flexible wiring board varies. Therefore, the flatness of the surface side to be visually observed can be improved reliably.

  According to the input device and the manufacturing method of the input device of the present invention, since the influence of connecting the flexible wiring board does not propagate to the surface of the decorative base material that is the input operation surface, the surface side that is visually observed with a simple configuration The reflection unevenness can be suppressed.

It is a perspective view which shows the input device of 1st Embodiment. It is a disassembled perspective view which shows the input device of 1st Embodiment. It is a perspective schematic diagram explaining 1st Embodiment, and is a partial enlarged plan view. It is a mimetic diagram explaining a 1st embodiment, and is a partial expanded sectional view. It is a schematic plan view which shows the structural example of the flexible wiring board in 1st Embodiment. It is a schematic diagram which shows the manufacturing method of the input device of 1st Embodiment, and is sectional drawing in the middle process. It is a schematic diagram explaining the modification of 1st Embodiment, and is a partial enlarged plan view of a 1st transparent base material. It is a schematic diagram which shows the input device of 2nd Embodiment, and is a partial expanded sectional view. It is a schematic plan view which shows the structural example of the flexible wiring board in 2nd Embodiment. It is a schematic diagram which shows the manufacturing method of the input device of 2nd Embodiment, and is sectional drawing in the middle process. It is a schematic diagram explaining the modification of 2nd Embodiment, and is a partial expanded sectional view. It is a schematic diagram which shows the input device of 3rd Embodiment, and is a partial expanded sectional view.

<First Embodiment>
FIG. 1 is a perspective view showing an input device 10 according to the first embodiment, and FIG. 2 is an exploded perspective view thereof. In the present specification, the ratio of dimensions of each component is appropriately changed for easy understanding of the drawings.

  The input device 10 of the first embodiment constitutes a resistance film type input device. As shown in FIGS. 1 and 2, the input device 10 includes a flexible decorative base material 20, a flexible first transparent base material 30, and a second transparent base material 40. The In addition, the input device 10 includes a light-transmitting region 11 that allows a screen or the like of the display device to be visually recognized, and a non-light-transmitting region 12 that is provided in a frame shape so as to surround the light-transmitting region 11.

  Here, “translucent” or “transparent” refers to a state where the transmittance of visible light is approximately 70% or more. Furthermore, the haze value is preferably 6 or less.

  The 1st transparent base material 30 and the 2nd transparent base material 40 are adhere | attached in the state electrically insulated via the insulating layer 51 provided in the non-light-transmissive area | region 12. As shown in FIG. In addition, the decorative substrate 20 is bonded to the input operation surface side of the flexible first transparent substrate 30 via an adhesive layer 52. An acrylic double-sided tape is used for the insulating layer 51 and the adhesive layer 52. Furthermore, it is preferable to print the resist layer 56 in order to ensure electrical insulation.

  As shown in FIG. 2, the first transparent electrode layer 31 and the second transparent electrode layer 41 for detecting input position information are respectively provided on the opposing surfaces of the first transparent substrate 30 and the second transparent substrate 40. Are stacked. In addition, a first lead wiring layer 32 for outputting input position information is routed in the non-transparent region 12 of the first transparent base material 30 and is electrically connected to the first transparent electrode layer 31. ing. Similarly, the second lead wiring layer 42 is routed around the non-light-transmitting region 12 of the second transparent substrate 40, and the second lead wiring layer 42 and the second transparent electrode layer 41 are electrically connected. ing. The first lead wiring layer 32 and the second lead wiring layer 42 are connected to the flexible wiring board 60 at the first connection terminal 33 and the second connection terminal 43 provided in the non-light-transmissive region 12 on the Y2 side. . Accordingly, the first transparent electrode layer 31 and the second transparent electrode layer 41 facing each other are electrically connected to the flexible wiring board 60 with a simple configuration.

  Here, the 1st connection terminal 33 and the 2nd connection terminal 43 are arrange | positioned in the position used as the predetermined space | interval by planar view. The adhesive layer 52 is provided with a gap 55 at a position overlapping the first connection terminal 33 in plan view. The insulating layer 51 is provided with an opening at a position overlapping the first connection terminal 33 and the second connection terminal 43 in plan view, and the resist layer 56 is provided with an opening at a position overlapping with the first connection terminal 33 in plan view. It has been. The flexible wiring board 60 is drawn out through a through hole 46 a of an opening 46 provided in the second transparent base material 40.

  When an input operation of the resistance film type input device 10 is performed, if the translucent region 11 of the input operation surface is pressed with a finger or a pen-shaped input instrument, the first transparent base material 30 and the decorative base material having flexibility 20 is bent, and the first transparent electrode layer 31 and the second transparent electrode layer 41 come into contact with each other. For example, when a voltage is applied to the first transparent electrode layer 31 in the Y1-Y2 direction, the Y coordinate can be detected by the partial pressure ratio in the Y1-Y2 direction corresponding to the contact position of each transparent electrode layer by the pressing operation. . Similarly, when a voltage is applied to the second transparent electrode layer 41 in the X1-X2 direction, the X coordinate can be detected by the partial pressure ratio generated by the contact of each transparent electrode layer.

  The first transparent substrate 30 disposed on the input operation surface side is a flexible film-like material having a thickness of about 100 μm to 200 μm, and a transparent resin material such as PET (polyethylene terephthalate) is used. Can be used. The second transparent base material 40 is formed by molding with a thickness of about 0.5 mm to 2.0 mm so as to have higher rigidity than the first transparent base material 30, and is a transparent resin material such as PC (polycarbonate). Can be used.

The first transparent electrode layer 31 and the second transparent electrode layer 41 are made of a transparent conductive material such as ITO (Indium Tin Oxide), SnO ₂ , or ZnO having translucency in the visible light region by a sputtering method or a vapor deposition method. A film is formed. The thickness is 0.01 μm to 0.05 μm, for example, about 0.02 μm. For methods other than sputtering and vapor deposition, a film on which a transparent electrode film has been formed in advance is prepared, and only the transparent electrode film is transferred to a substrate, or a liquid material is applied. Is also possible.

  The first lead-out wiring layer 32 and the second lead-out wiring layer 42 formed in connection with the first transparent electrode layer 31 and the second transparent electrode layer 41 use a conductive paste of copper or silver, and are screen-printed or inkjet. It is formed by a printing method or the like. Each lead-out wiring layer can be formed to a thickness of about 5 μm to 30 μm.

  A flexible decorative substrate 20 is provided on the input operation surface side of the first transparent substrate 30. The decorative substrate 20 is made of a transparent resin material such as PET, and has a thickness of about 100 μm to 200 μm. In this embodiment, a PET film having a thickness of about 130 μm is used. Moreover, it is desirable that the input operation surface side of the decorative substrate 20 has a hard coat layer such as urethane acrylate resin. And it is preferable that the decoration layer 21 is formed in the surface different from the input operation surface of the decorating base material 20. FIG. The decorative layer 21 is printed by a screen printing method, an ink jet printing method, or the like to form the non-translucent region 12. If it carries out like this, when it sees from the input operation surface side of the decorating base material 20, the decorating base material 20 is flat.

  The decorative layer 21 is provided so as to overlap the connection portions with the respective lead wiring layers and the flexible wiring board 60, and has an effect of shielding the lead wiring layers and the like from being directly recognized by the operator. In addition, since the input device 10 is mounted on a display unit of an electronic device and the decoration layer 21 is directly visually recognized by an operator, the appearance of the decoration region 22 in which the decoration layer 21 is formed is particularly important. Strict quality is required. For example, since the decorative layer 21 is colored or a pattern, a mark, a character, or the like is drawn, it is easy for an operator to visually recognize the reflection unevenness caused by slight unevenness, which may be a defect in appearance quality. .

  3 and 4 are schematic diagrams for explaining this embodiment. FIG. 3 shows a partially enlarged plan view seen from the input operation surface side, but the decorative base material 20 and the adhesive layer 52 are omitted, and the first surface formed on the other surface of the first transparent base material 30 is shown. FIG. 5 is a perspective schematic diagram that makes it easy to understand the planar position of the gap portion 55 (the inner region indicated by a two-dot chain line) formed in the adhesive layer 52 by showing the lead wiring layer 32 and the first connection terminal 33 by solid lines. . 4 is a partially enlarged cross-sectional view taken along line IV-IV in FIG.

  As shown in FIGS. 2 and 3, the input device 10 of the present embodiment has a configuration in which a window-like gap 55 is formed in the adhesive layer 52. The gap portion 55 is provided at the same position as the first connection terminal 33 in a plan view in the non-light-transmitting region 12 on the Y2 side. On the other hand, as shown in FIG. 4, the first connection terminal 33 is connected to the flexible wiring board 60 via the connection member 71.

  Correspondingly, the flexible wiring board 60 has a first terminal 64 connected to the first connection terminal 33 and is electrically connected to the outside through a wiring layer 63 formed on the insulating base film 61. It is configured to be able to. Further, except for the vicinity of the first terminal 64, the wiring layer 63 is covered with an insulating cover film 62 and electrically insulated. Similarly, the flexible wiring board 60 is also connected to the second connection terminal 43.

  FIG. 5 is a schematic plan view showing a structural example of the flexible wiring board 60. As shown in FIGS. 4 and 5, the flexible wiring substrate 60 has a wiring layer 63 formed on an insulating and flexible base film 61. An insulating cover film 62 is laminated on the base film 61 via an adhesive layer (not shown).

  The flexible wiring board 60 has the cover film 62 or the base film 61 removed in the crimping region. The wiring layer 63 is composed of four lead patterns arranged side by side at intervals, and the end portions of the respective lead patterns are exposed in areas where the cover film 62 or the base film 61 is not formed, First terminals 64a and 64b and second terminals 65a and 65b are formed.

  The pressure-bonding surface can be changed depending on whether the cover film 62 or the base film 61 is removed. That is, in FIG. 5, the first terminals 64 a and 64 b are laminated on the wiring layer 63 formed on the base film 61, and are exposed to the first transparent base material 30 side from the cutout of the cover film 62. . On the other hand, the second terminals 65a and 65b have notches in the base film 61, are laminated on the cover film 62 and the wiring layer 63, and are exposed to the second transparent substrate 40 side. Thereby, it inserts between the 1st transparent base material 30 and the 2nd transparent base material 40 which oppose, and it connects to the 1st connection terminal 33 and the 2nd connection terminal 43 which are formed in each surface. Is possible.

  For the base film 61 and the cover film 62, a flexible organic resin such as a polyimide film can be used. The wiring layer 63 is formed of copper foil or the like. In general, the base film 61 and a film-like copper foil are bonded together via an adhesive layer (not shown), the pattern of the wiring layer 63 is processed, and the cover film 62 is further attached to the adhesive layer (not shown). It is done to stick together. The first terminals 64a and 64b and the second terminals 65a and 65b are formed by laminating a silver conductive paste or the like on the wiring layer 63 by printing. The terminal portion is preferably laminated with a conductive paste after gold plating or the like is performed on the surface of the copper foil. Each terminal portion has irregularities due to these electrode materials.

  The connection between the first terminals 64 a and 64 b and the first connection terminals 33 a and 33 b is connected by thermocompression bonding via the connection member 71. At this time, the connection member 71 covers the first terminals 64a and 64b and the first connection terminals 33a and 33b, and absorbs the unevenness thereof. When the connection member 71 is solidified by thermocompression bonding, the first connection terminal 33 receives stress due to contraction at that time. Therefore, the 1st transparent base material 30 produces the distortion of the surface direction (XY surface direction) centering on the 1st connection terminal 33, and is wrinkled (Z direction) visually recognized from the input operation surface side of the decorating base material 20 It was found that the unevenness of This wrinkle becomes inconspicuous over time (for example, one day later) immediately after the crimping. This is considered because the adhesive layer 52 and the like slowly relax the stress. However, if the remaining wrinkles are visually recognized as reflection unevenness, a favorable appearance cannot be obtained.

  In this embodiment, since the space | gap part 55 is formed in the adhesion layer 52, the space | gap part 55 relieves the stress by the distortion. Further, even if the connection region of the first connection terminal 33 is uneven, it can be absorbed by the window-shaped gap 55. Thereby, the influence of the shrinkage | contraction of the connection member 71 for connecting the flexible wiring board 60 does not propagate to the surface of the decorating base material 20 which is an input operation surface.

  The gap 55 has a rectangular window shape as shown in FIGS. 2 to 4 and the length of one side is about 3 mm to 5 mm. As long as it has a window shape, the shape is not limited to a rectangle but may be a circle or the like. For the purpose of absorbing unevenness, a notch from the edge on the Y2 side may be used. However, in the case where the gap 55 is notched, a gap corresponding to the thickness of the adhesive layer 52 is exposed to the outside on the side surface on the Y2 side, and distortion of the first transparent base material 30 can be seen or cause of peeling. In addition, the first connection terminal 33 is likely to be affected by moisture permeation of the first transparent substrate 30 in a high humidity environment. For this reason, it is more preferable that it is the window shape which does not have a clearance gap outside.

  Thus, the input device 10 can be configured with the simple structure in which the first connection terminal 33 is provided on the first lead wiring layer 32 formed on the first transparent substrate 30 on the input operation side surface, and the surface to be visually observed. The uneven reflection on the side can be suppressed.

  The first transparent electrode layer 31 and the second transparent electrode layer 41 may be laminated in the input operation area and connected to the first lead wiring layer 32 and the second lead wiring layer 42, respectively. The first transparent electrode layer 31 may be laminated on almost the entire surface of the first transparent substrate 30 as long as a predetermined insulating region is provided, and the first lead-out wiring layer 32 is the first transparent electrode layer 31. And may be laminated. If laser trimming is used, it is easy to form an insulating region in a linear shape. Similarly, as long as a predetermined insulating region is provided, the second transparent electrode layer 41 may be laminated on almost the entire surface of the second transparent substrate 40, and the second lead wiring layer 42 may be the second transparent electrode. It may be a laminate with the layer 41.

  In order to improve the flatness of the decorative base material 20 on the input operation surface side, a dummy wiring layer and a resist layer 56 are provided in the non-light-transmitting region 12, and various film thicknesses in the region bonded by the insulating layer 51 can be as much as possible. It is preferable to keep it constant.

  In addition to the acrylic double-sided tape, an acrylic pressure-sensitive adhesive or a transparent adhesive may be used for the insulating layer 51 and the pressure-sensitive adhesive layer 52. However, the insulating layer 51 is preferably a double-sided tape that can ensure insulation that prevents a short circuit between the first lead-out wiring layer 32 and the second lead-out wiring layer 42. The resist layer 56 is preferably provided in order to improve the insulation and to flatten the unevenness caused by the first lead wiring layer 32.

  For the second transparent substrate 40, a transparent resin material such as PET (polyethylene terephthalate), PEN (polyethylene naphthalate), PMMA (polymethyl methacrylate resin), etc. can be used in addition to PC (polycarbonate). Since the 2nd transparent base material 40 can be formed in a rigid structure by a shaping | molding process, while being able to comprise the input device 10 with a simple structure, integration with a display apparatus and an electronic device is easy.

  Further, the flexible wiring board 60 can be pulled out through the through hole 46a of the opening 46 provided in the second transparent base material 40 and can be connected so as not to be seen from the input operation surface side.

  As shown in FIG. 4, a through hole 45 a of the space 45 is formed in the second transparent base material 40 in addition to the through hole 46 a of the opening 46 for drawing out the flexible wiring board 60. The through hole 45a of the space portion 45 is provided at a position overlapping the first connection terminal 33 in plan view, and the crimping region of the flexible wiring board 60 is viewed inside the space portion 45 from the side opposite to the input operation surface. Can do. Therefore, even if the thickness of the flexible wiring board 60 at the first connection terminal 33 varies, it can be escaped.

  In the present embodiment, the second transparent base material 40 is molded using a transparent resin material having a thickness of about 0.5 mm to 2.0 mm so as to have higher rigidity than the first transparent base material 30. However, a flexible film-like transparent resin material similar to the first transparent base material 30 may be used. If it carries out like this, it can form with the same raw material as the same process as the 1st transparent base material 30 only in patterns, such as the 1st extraction wiring layer 32 differing. In this case, it is preferable that a third transparent resin base material having sufficient rigidity is bonded to the other surface of the second transparent base material 40 through the same material as the adhesive layer 52. In any configuration, the input device 10 can be configured with a relatively simple structure, and can be easily integrated with a display device or an electronic device.

  The space 45 may be provided integrally with the opening 46.

  Note that the opening 46 provided in the second transparent base material 40 may not be the through hole 46a as long as the flexible wiring board 60 can pass therethrough, and the notch provided on the Y2 side of the second transparent base material 40. It may be. Moreover, it is preferable that the opening of the insulating layer 51 is provided over the applicable region so that the flexible wiring board 60 and the insulating layer 51 do not interfere with each other.

  FIG. 6 is a schematic diagram illustrating a method for manufacturing the input device 10 according to the first embodiment, and is a cross-sectional view in an intermediate process. Details of each constituent member are omitted, and in order to show a state in a process to be described, the side that becomes the input operation surface is set to the lower side.

  In FIG. 6 (a), the flexible first transparent base material 30 is formed, for example, after a first transparent electrode layer 31 is provided on a roll-shaped film and cut into a predetermined size, and then a predetermined insulating pattern is formed. It is formed by laser trimming. Next, the first lead wiring layer 32 and the first lead wiring layer are electrically connected to the first transparent electrode layer 31 by printing and heating a silver conductive paste having a thickness of about 10 μm by screen printing. And a first connection terminal 33 provided on 32. Furthermore, the protective film 81 with the weak adhesive layer 82 is bonded together to protect the surface on which the first lead wiring layer 32 is formed, and the protective film 83 with the weak adhesive layer 84 is bonded to the opposite surface.

  On the other hand, as shown in FIG. 6B, a gap 55 is formed in the adhesive layer 52 by pressing or the like. Next, the adhesive layer 52 is bonded to the decorative base material 20 that has undergone a predetermined process so that the gap portion 55 is disposed at a predetermined position. Thereafter, as shown in FIG. 6C, the protective film 83 with the weak adhesive layer 84 is peeled off, the surface on which the decorative layer 21 of the decorative base material 20 is provided, and the first transparent base material. The surface on which the first lead wiring layer 32 or the like of 30 is not provided is bonded through the adhesive layer 52.

  The second transparent substrate 40 is also bonded to the first transparent substrate 30 after performing a predetermined process. Further, as shown in FIG. 6D, the flexible wiring board 60 is crimped to the first connection terminal 33 via the connection member 71 using the crimping device 90. At this time, in the gap portion 55, the flexible first transparent base material 30 is deformed. However, when the pressure applied by pressure bonding is released, it returns to the original state, and the solidification shrinkage of the connection member 71 becomes a residual stress.

  Thus, if the through hole 45a of the space 45 is provided in the second transparent base material 40, the crimping device 90 can be inserted from the opposite side of the input operation surface using the through hole 45a. The flexible wiring board 60 can be crimped to the connection terminal 33 via the connection member 71. By so doing, the decorative base material 20 only needs to be placed on a flat jig, so that the surface side does not distort during crimping, and there is no concern of excessive heating even when thermocompression bonding is used. . Furthermore, since the crimping | compression-bonding area | region of the flexible wiring board 60 in thermocompression bonding can be heated directly, the connection member 71 can be reliably thermosetted and it is excellent in connection reliability.

  According to the manufacturing method of 1st Embodiment, the influence of the shrinkage | contraction of the connection member 71 for connecting the flexible wiring board 60 does not propagate to the surface of the decorating base material 20 which is an input operation surface. Therefore, it is possible to suppress uneven reflection on the surface side that is visually observed.

  The connecting member 71 is preferably an anisotropic conductive resin. An anisotropic conductive resin is an insulating material such as an epoxy resin in which conductive particles such as metal-plated resin beads are dispersed. And has insulation in the planar direction. Therefore, even if the first terminals 64a and 64b or the second terminals 65a and 65b are adjacent to each other in the plane direction and the anisotropic conductive resin is applied so as to cover them together, they are short-circuited in the plane direction. Never do.

  In addition, it is preferable to bond the first transparent base material 30 after the second connection terminals 43 of the second transparent base material 40 and the second terminals 65a and 65b of the flexible wiring board 60 are connected by pressure bonding. If it carries out like this, when connecting the 1st connection terminal 33 and the 1st terminal 64a, 64b of the 1st transparent base material 30, only the location of the 1st connection terminal 33 can be crimped | bonded by planar view.

  The first lead wiring layer 32 and the first connection terminal 33 are preferably protected in advance by the resist layer 56 except for the crimping region covered with the connection member 71.

  FIG. 7 is a schematic diagram illustrating a modification of the first embodiment, and is a partially enlarged plan view of the input device 10. The gap 55 formed in the adhesive layer 52 is provided so as to include a position overlapping the second connection terminal 43 in plan view.

  If it carries out like this, even if the thickness of the flexible wiring board 60 varies and becomes thick in the connection of the 2nd connection terminal 43, the flexible wiring board 60 is connected to the surface of the decorating base material 20 which is an input operation surface. Therefore, the influence of contraction of the connecting member 71 does not propagate. Therefore, the flatness of the surface side to be visually observed can be improved.

<Second Embodiment>
FIG. 8 is a schematic diagram for explaining the second embodiment, and is a partially enlarged sectional view of the input device 10. Also in the second embodiment, a resistive film type input device is configured, and the same reference numerals are used for the constituent members.

  As shown in FIG. 8, the first connection terminal 33 is connected to the first terminal 64 of the flexible wiring board 60 via the connection member 71, and the second connection terminal 43 that is not visible in FIG. 8 is similarly connected to the second terminal 65. It is connected via a connection member 72. The flexible wiring board 60 is drawn out in the Y2 direction through the notch of the insulating layer 51. A gap 55 of the adhesive layer 52 is provided at a position overlapping the first connection terminal 33 in plan view. More preferably, the gap portion 55 is also provided at a position overlapping the second connection terminal 43 in plan view.

  FIG. 9 is a schematic plan view showing a structural example of the flexible wiring board 60 in the second embodiment. In this case, the base film 61 is provided with through holes 61a and 61b. The second terminals 65a and 65b are laminated by printing a silver conductive paste or the like. The through holes 61a and 61b are filled with a conductive paste or the like, and the second terminals 65a and 65b and the wiring layer 63 are connected.

  The connection members 71 and 72 (not shown) are provided so as to cover the first terminals 64a and 64b and the second terminals 65a and 65b in plan view from the connection strength of the flexible wiring board 60 and the stability of the electrical connection. preferable. With such a structure, the first transparent substrate 30 and the second transparent substrate are bonded to each other by the pressure bonding between the first connection terminal 33 and the first terminal 64 and the pressure bonding between the second connection terminal 43 and the second terminal 65. By the crimping device 90 that sandwiches the material 40, it can be performed simultaneously in a lump.

  In the present embodiment, it is preferable that the decorative base material 20 is bonded to the input operation surface side of the first transparent base material 30 via the adhesive layer 52 after the flexible wiring board 60 is crimped and connected.

  In this embodiment, since the space | gap part 55 is formed in the adhesion layer 52, the space | gap part 55 relieves the stress by the distortion. Further, even if the connection region of the first connection terminal 33 is uneven, it can be absorbed by the gap 55. Thereby, the influence of the shrinkage | contraction of the connection member 71 for connecting the flexible wiring board 60 does not propagate to the surface of the decorating base material 20 which is an input operation surface. Therefore, it is possible to suppress uneven reflection on the surface side that is visually observed.

  The gap 55 is preferably window-shaped.

  Also in the second embodiment, the same material as in the first embodiment can be selected.

  FIG. 10 is a schematic diagram illustrating a method for manufacturing the input device 10 according to the second embodiment, and is a cross-sectional view in an intermediate process. Details of each constituent member are omitted, and in order to show a state in a process to be described, the side that becomes the input operation surface is set to the lower side.

  In FIG. 10 (a), the flexible first transparent substrate 30 is formed, for example, after a first transparent electrode layer 31 is provided on a roll-shaped film and cut into a predetermined size, and then a predetermined insulating pattern is formed. It is formed by laser trimming. Next, the first lead wiring layer 32 and the first lead wiring layer are electrically connected to the first transparent electrode layer 31 by printing and heating a silver conductive paste having a thickness of about 10 μm by screen printing. And a first connection terminal 33 provided on 32. Furthermore, the protective film 81 with the weak adhesive layer 82 is bonded and protected on the surface on which the first lead wiring layer 32 is formed, and the protective film 83 with the weak adhesive layer 84 is bonded to the opposite surface.

  As shown in FIG. 10B, after the predetermined process is performed on the second transparent substrate 40, the first transparent substrate 30 and the second transparent substrate 40 are bonded together. Furthermore, the flexible wiring board 60 is inserted, and the flexible wiring board 60 and the first transparent base material 30 and the second transparent base material 40 are pressure-bonded and connected using the crimping device 90. At this time, the unevenness of each electrode is almost absorbed by the connecting member 71. However, the solidification shrinkage of the connection member 71 is a residual stress.

  On the other hand, the gap portion 55 is formed in the adhesive layer 52 by pressing or the like, and is bonded to the decorative base material 20 that has undergone a predetermined process. Thereafter, the protective film 83 with the weak adhesive layer 84 is peeled off, and as shown in FIG. 10C, the surface on which the decorative layer 21 of the decorative base material 20 is provided, and the first transparent base material. The surface on which the first lead wiring layer 32 or the like of 30 is not provided is bonded through the adhesive layer 52.

  By doing so, the structure of the input device 10 and the assembly process of the input device 10 can be simplified, which is excellent in mass productivity.

  According to the manufacturing method of the second embodiment, since the flexible wiring board 60 is connected to the first connection terminal 33 of the first transparent base material 30, distortion occurs in the first connection terminal 33 and the surrounding area. The void portion 55 formed in the adhesive layer 52 relaxes the stress due to the distortion. Further, even if the connection region of the first connection terminal 33 is uneven, it can be absorbed by the gap 55. Thereby, the influence which connected the flexible wiring board 60 does not propagate to the surface of the decorating base material 20 which is an input operation surface side. Therefore, it is possible to suppress the reflection unevenness on the surface side to be visually observed with a simple configuration.

  In addition, in FIG.10 (b), you may bond with the 2nd transparent base material 40 in the state which mounted the flexible wiring board 60 in the 1st transparent base material 30. FIG. By so doing, there is no process failure in which the flexible wiring board 60 cannot be inserted after bonding. Alternatively, the first transparent base material 30 can be bonded with the input operation surface up and the flexible wiring board 60 mounted on the second transparent base material 40. Also in this case, the process defect that the flexible wiring board 60 cannot be inserted after bonding does not occur. Following the bonding of the first transparent base material 30 and the second transparent base material 40 with the flexible wiring board 60 placed thereon, the flexible wiring board 60 and the first transparent base material 30 are used by using the crimping device 90. And the 2nd transparent base material 40 is crimped | bonded and connected.

  FIG. 11 is a schematic diagram for explaining a modification of the second embodiment, and is a partially enlarged cross-sectional view of the input device 10.

  As shown in FIG. 11, the recess 45 a of the space 45 is formed in the second transparent substrate 40 in the non-light-transmitting region 12. Since the 2nd transparent base material 40 can be formed by a shaping | molding process, if the recessed part 45a is provided at this time, an additional process will not be required.

  The recess 45a is formed at least at a position overlapping the first connection terminal 33 in plan view, and even when the thickness of the flexible wiring board 60 is thick, the surface of the decorative base material 20 that is the input operation surface is formed on the flexible wiring board 60. The influence of the contraction of the connecting member 71 for connecting is not propagated. Therefore, the flatness of the surface side to be visually observed can be improved.

  The case where the recess 45a is formed in a region including the second lead wiring layer 42 and the second connection terminal 43 or the case where the recess 45a is formed in a region not including the second lead wiring layer 42 and the second connection terminal 43 This embodiment is also possible. In the case of the recess 45a formed in the region including the second lead wiring layer 42 and the second connection terminal 43, the side surface of the recess 45a is tapered so that the second lead wiring layer 42 is not disconnected.

  Thereby, also in the 2nd connection terminal 43, there is no fear that the thickness of the flexible wiring board 60 will affect the input operation surface side and produce unevenness. Therefore, it is possible to improve the flatness of the surface side to be visually observed more reliably. Further, there is a demand for making the input device 10 thinner, and this embodiment is also excellent as a configuration for reducing the thickness.

  Furthermore, as shown in FIG. 11, if the recessed part 45a is provided over the position which overlaps with the flexible wiring board 60 by planar view, the flexible wiring board 60 can also be thickened. If the flexible wiring board 60 is thickened, the flexibility is lowered, but it is difficult to break, and the reliability can be improved. Or it becomes easy to use PET film etc. as a material of the flexible wiring board 60 instead of a polyimide film.

<Third Embodiment>
FIG. 12 is a schematic diagram for explaining the third embodiment, and is a partial enlarged cross-sectional view of the input device 10. The input device 10 of the third embodiment constitutes a capacitance type input device, but the same reference numerals as those of the first embodiment are used for the constituent members.

  As shown in FIG. 12, the input device 10 includes a decorative base material 20 and a first transparent base material 30. A decorative layer 21 is provided on the decorative substrate 20, and the non-light-transmitting region 12 is formed. A first transparent electrode layer 31 is laminated on the first transparent substrate 30, and predetermined patterning is performed on the first transparent electrode layer 31 to form a capacitance detection electrode pattern (not shown). A first lead wire 32 is connected in accordance with the electrode pattern of the first transparent electrode layer 31, and a first connection terminal 33 is provided.

  The first terminal 64 of the flexible wiring board 60 is connected to the first connection terminal 33 via the connection member 71. Thus, the capacitance between the plurality of capacitance detection electrode patterns is read out by an external electric circuit through the flexible wiring board 60, and the capacitance changes when an input operation is performed. Can be detected.

  Here, the flexible wiring board 60 can be connected by thermocompression bonding. An anisotropic conductive resin is used for the connection member 71, and the connection member 71 is connected and fixed by being heated and cured to about 200 degrees. At this time, the first transparent base material 30 is thermally expanded, and is thermally contracted by returning to room temperature after completion of the pressure bonding, and receives stress due to solidification contraction of the connection member 71. Thereby, when the space | gap part 55 is not provided, the decoration layer 21 is also heated, thermal expansion and thermal contraction occur, and the stress from the connection member 71 propagates. Therefore, if the decorative base material 20 has flexibility, the input operation surface may be uneven. Even when the non-flexible decorative base material 20 is used, the effect of heating the decorative layer 21 may be visually recognized as reflection unevenness on the surface.

  By providing the gap portion 55 in the adhesive layer 52, the heating of the decorative layer 21 is suppressed even when thermocompression bonding is used, and thermal expansion and thermal contraction are suppressed, and the connecting member 71 and the first transparent layer The deformation and stress of the base material 30 do not propagate. Therefore, the input device 10 can be configured with the simple structure in which the first connection terminal 33 is provided on the first lead wiring layer 32 formed on the first transparent base material 30 on the input operation side surface, and the surface side to be visually observed. The reflection unevenness can be suppressed.

  If it carries out like this, after bonding the decorating base material 20 and the 1st transparent base material 30 with the adhesion layer 52, it can be set as the process of connecting the flexible wiring board 60. FIG. Thereby, when the decorative base material 20 is bonded to the first transparent base material 30 to which the flexible wiring board 60 is connected, the flexible wiring board 60 becomes an obstacle to the bonding, while there is no obstacle. Bonding is possible, and mass productivity and process yield are improved.

  The gap 55 is preferably window-shaped.

  In addition, it is preferable that the surface where the 1st transparent electrode layer 31 of the 1st transparent base material 30 is laminated | stacked is covered with the protective layer which is not shown except the 1st connection terminal 33. FIG. By doing so, the first transparent electrode layer 31 and the first lead wiring 32 can be protected from corrosion and the like, so that the reliability is improved. The protective layer can be formed by printing an acrylic resin or by bonding members of the same material as the first transparent base material 30 and the adhesive layer 52.

  The capacitance detection pattern may be configured by the first transparent electrode layer 31 laminated on the first transparent substrate 30 as described above, but the third transparent substrate on which the third transparent electrode layer is laminated is the first transparent electrode layer 31. It is good also as a structure which prepares separately from 1 transparent base material 30, and consists of two layers of transparent electrode layers which bonded them together. In that case, it is preferable that a third connection terminal different from the first connection terminal 33 is provided and connected to the flexible wiring board 60 together with the first connection terminal 33.

  The input device 10 in this embodiment is used for a mobile phone, a digital camera, a PDA, a game machine, a car navigation, and the like.

DESCRIPTION OF SYMBOLS 10 Input device 11 Translucent area | region 12 Non-transparent area | region 20 Decorating base material 21 Decorating layer 30 1st transparent base material 31 1st transparent electrode layer 32, 32a, 32b 1st extraction | drawer wiring layers 33, 33a, 33b 1st Connection terminal 40 2nd transparent base material 41 2nd transparent electrode layer 42 2nd extraction wiring layer 43 2nd connection terminal 45 Space 45a, 46a Through-hole 45b Recess 46 Opening 51 Insulating layer 52 Adhesive layer 55 Cavity 56 Resist layer 60 flexible wiring board 61 base film 61a, 61b through hole 62 cover film 63 wiring layer 64, 64a, 64b first terminal 65a, 65b second terminal 71, 72 connecting member 81, 83 protective film 82, 84 weak adhesive layer 90 pressure bonding apparatus

Claims (12)

A decorative base material having one side as an input operation side;
A translucent adhesive layer laminated on the other surface of the decorative substrate;
A first transparent base material having one surface bonded to the decorative base material via the adhesive layer, a first transparent electrode layer formed on the other surface of the first transparent base material, and the first A first lead wiring layer electrically connected to the transparent electrode layer; a first connection terminal provided in the first lead wiring layer;
A flexible wiring board electrically connected to the first connection terminal,
The input device, wherein the adhesive layer has a window-like gap portion, and the gap portion is provided at a position overlapping the first connection terminal in plan view. The decorative base material has a light-transmitting region provided in a window shape and a non-light-transmitting region surrounding the light-transmitting region, and is provided with a decorative layer that colors the non-light-transmitting region. ,
The input device according to claim 1, wherein the decorative layer is formed on the other surface of the decorative base material. A second transparent substrate disposed to face the other surface of the first transparent substrate; and a second transparent electrode layer formed on the second transparent substrate to face the first transparent electrode layer. A second lead wiring layer electrically connected to the second transparent electrode layer, and a second connection terminal provided on the second lead wiring layer,
The first connection terminal and the second connection terminal are provided at a position at a predetermined interval in plan view,
The input device according to claim 1, wherein the flexible wiring board is electrically connected to the second connection terminal. The second transparent base material is formed by molding a transparent resin, and has a space portion facing the flexible wiring board,
The input device according to claim 3, wherein the space portion is provided at a position overlapping at least the first connection terminal in plan view.   The input device according to claim 4, wherein the space portion is a through hole.   The input device according to claim 4, wherein the space is a recess.   The input device according to claim 3, wherein the gap is provided at a position overlapping the second connection terminal in plan view. A decorative base material having one surface as an input operation surface; a first transparent base material in which one surface is bonded to the other surface of the decorative base material via a translucent adhesive layer; A first transparent electrode layer provided on one transparent substrate, and a manufacturing method of an input device comprising:
(A) a first lead wiring layer electrically connected to the first transparent electrode layer on the other surface of the first transparent substrate provided with the first transparent electrode layer; and a first lead wiring layer A step of forming a provided first connection terminal;
(B) forming a void in the adhesive layer;
(C) The other surface of the decorative substrate and the one surface of the first transparent substrate are bonded together via the adhesive layer, and the gap portion overlaps the first connection terminal in plan view. Providing the position;
(D) a step of crimping a flexible wiring board to the first connection terminal via a connection member;
The manufacturing method of the input device characterized by including. In the step (d), a second transparent base material provided with a second transparent electrode layer after forming a through-hole by molding a transparent resin is used as the second transparent electrode layer and the first transparent substrate. Arrange so that the electrode layer faces,
9. The method of manufacturing an input device according to claim 8, wherein a device for crimping the flexible wiring board is inserted into the through hole, and the flexible wiring substrate is crimped to the first connection terminal via a connection member. . A decorative base material having one surface as an input operation surface; a first transparent base material in which one surface is bonded to the other surface of the decorative base material via a translucent adhesive layer; A second transparent substrate disposed opposite to the one transparent substrate, and a first transparent electrode layer and a second transparent electrode provided on the opposing surfaces of the first transparent substrate and the second transparent substrate, respectively. A method of manufacturing an input device comprising a layer,
The first lead wiring layer electrically connected to the first transparent electrode layer and the first lead wiring layer are provided on the other surface of the first transparent substrate on which the first transparent electrode layer is provided. Forming a first connection terminal;
Forming the second transparent substrate by molding a transparent resin, forming a second transparent electrode layer on the second transparent substrate, and a second lead wire electrically connected to the second transparent electrode layer Forming a layer and a second connection terminal provided in the second lead wiring layer;
The first transparent base material and the second transparent base material are arranged so as to face each other at a predetermined interval, and a flexible wiring board is crimped to the first connection terminal and the second connection terminal via a connection member. And a step of attaching the decorative base material to the one surface of the first transparent base material via the adhesive layer,
The method for manufacturing an input device according to claim 1, wherein the adhesive layer has a gap formed in advance, and the gap is provided at a position overlapping the first connection terminal in plan view.   11. The method of manufacturing an input device according to claim 10, wherein a recess is formed in the second transparent base material, and the recess is provided at a position overlapping the first connection terminal in plan view.   The method for manufacturing an input device according to claim 11, wherein the concave portion is provided at a position overlapping the second connection terminal in plan view.