JP2013008354A - Input device and method for manufacturing input device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an input device capable of inhibiting reflection unevenness on a surface side visually recognized or inhibiting the occurrence of a Newton ring in an input area with a simple configuration, and a method for manufacturing the input device.SOLUTION: The input device has a decorative base material 20, the one face of which is an input operation face, a light-transmitting adhesive layer 52 laminated on the other face of the decorative base material 20, a first transparent base material 30 whose one face is stuck on the decorative base material 20 through the adhesive layer 52, a first extracting wiring layer 32 electrically connected to a first transparent electrode layer 31 laminated on the other face of the first transparent base material 30, a first connection terminal 32 provided on the first extracting wiring layer 32, a flexible wiring substrate 60 electrically connected to the first connection terminal 33, and a first slit part 35 formed in the first transparent base material 30 near the first connection terminal 33.

Description

  The present invention relates to an input device and a method of manufacturing the input device, and more particularly to an input device and a method of manufacturing the input device that can suppress uneven reflection on the surface side to be visually observed.

  A translucent input device is configured such that a transparent electrode layer and a lead-out wiring layer from the transparent electrode layer are formed on a transparent substrate, and an input coordinate position can be detected by an operator's input operation, such as a liquid crystal display device Combined with the display screen, the menu selection and data input functions are demonstrated.

  As such a translucent input device, an electrostatic capacitance type or resistance film type input device is known. As disclosed in Patent Document 1, the resistance film type input device is configured such that a pair of transparent base materials are arranged to face each other with a space therebetween, and are joined via an insulating layer in the peripheral portion. A transparent electrode layer is formed in the light-transmitting region on the opposite surface of each transparent substrate, and a lead-out wiring layer for outputting input information is formed in the non-light-transmitting region surrounding the light-transmitting region. A flexible wiring board for connection is connected. The transparent substrate on the surface side that is the input operation surface is formed using a flexible film-like material, and when the operator presses an arbitrary portion of the input region, the transparent substrate is deformed to form a pair. The input electrode position can be detected by reading the change in resistance value caused by the contact of the transparent electrode layer.

  In recent years, there has been a demand for further thinning of such an input device. In addition, since the input device is incorporated in an electronic device and used as a part of the casing of the electronic device or a part of the operation surface, a mode in which a step with the casing does not occur is preferred. Therefore, various attempts have been made to realize a flat input device that is thin and has no irregularities on the surface side of the input device.

  Since the flexible wiring board used for the thin input device is crimped via the connecting member, the crimped trace of the flexible wiring substrate is visually recognized as light reflection unevenness on the surface side of the input device. This unevenness is irrelevant to the function of the translucent area where the input operation is performed, and is a small part of the non-translucent area. However, even in a non-light-transmitting region that does not affect the function of the input device, reflection unevenness caused by slight unevenness is rather conspicuous, and there is a possibility that the user may be concerned.

  In addition, when wrinkles and sagging are propagated to the input area due to the distortion caused by the crimping of the flexible wiring board, even a slight unevenness is likely to be visually recognized during an input operation, which may be a problem. Further, when the transparent base material is stretched by heat and pressure applied during crimping of the flexible wiring board, the transparent base material is deflected in the input region near the crimping location. Thereby, the space | interval of a pair of transparent base materials opposingly arranged in the input area | region becomes narrow, and the interference fringe of light called what is called a Newton ring will be visually recognized.

  In the input device of Patent Document 2, in order to improve the unevenness on the surface side which is the input operation surface, the flexible wiring substrate is not connected to the transparent base material on the input operation surface side so as not to be affected by the thickness of the flexible wiring substrate. In addition, a conductive connection portion from the transparent base material on the input operation surface side was provided and a through hole penetrating the front and back surfaces of the other transparent base material facing each other was provided. And the flexible wiring board was connected to the surface (back surface) on the opposite side of the other transparent base material which opposes. Furthermore, since the flexible wiring board has unevenness due to the electrodes, a space is provided in the insulating layer for opposingly arranging the pair of transparent base materials so that the unevenness of the electrodes is not transferred to the surface side.

JP 2008-21304 A JP 2011-8666 A

  However, since the unevenness on the surface side is improved by connecting the flexible wiring board through the through hole provided in the transparent base material, such an input device requires a complicated configuration, There was a problem that necessary members increased.

  The present invention is to solve the above-described problems, and in particular, an input device and an input device that can suppress reflection unevenness on the surface side to be visually observed or suppress the occurrence of Newton rings in the input region with a simple configuration. An object is to provide a manufacturing method.

  The input device of the present invention includes a decorative base material having one surface as an input operation surface, a translucent adhesive layer laminated on the other surface of the decorative base material, and the decorative base material. A first transparent substrate having one surface bonded through an adhesive layer, a first transparent electrode layer laminated on the other surface of the first transparent substrate, and an electrical connection to the first transparent electrode layer A first lead wiring layer; a first connection terminal provided in the first lead wiring layer; a flexible wiring board electrically connected to the first connection terminal; and the first connection terminal in the vicinity of the first connection terminal. And a first slit portion formed in the transparent substrate.

  The flexible wiring board is connected to the first connection terminal of the first transparent base material on the input side, and the first transparent base material is a distortion of the first connection terminal and the surrounding area due to the influence of connecting the flexible wiring board. Produce. According to the present invention, since the first slit portion is provided in the vicinity of the first connection terminal of the first transparent base material, the distortion can be absorbed by the first slit portion. Thereby, wrinkles and sagging due to distortion when the flexible wiring board is connected do not propagate to the surface of the decorative base material on the input operation surface side.

  Therefore, it is possible to suppress the reflection unevenness on the surface side to be visually observed with a simple configuration.

  Furthermore, it is preferable to have a second slit portion formed in the adhesive layer, and the second slit portion is provided at a position overlapping the first slit portion in plan view. If it carries out like this, the wrinkles and sagging by distortion when connecting a flexible wiring board will also be intercepted by the 2nd slit part about the possibility of propagating via the adhesion layer. Therefore, it is possible to more reliably suppress the uneven reflection on the surface side to be visually observed.

  More preferably, the first slit portion is provided so as to surround the first connection terminal so as to leave a laminated region of the first lead wiring layer. By providing the shape of the first slit portion so as to surround the periphery of the first connection terminal, it is possible to suppress propagation of wrinkles and sagging due to distortion when the flexible wiring board is connected. The reflection unevenness on the surface side can be suppressed.

The first transparent substrate has an input area provided in a window shape and a non-input area surrounding the input area, and the first transparent electrode layer is provided in the input area, and The lead-out wiring layer and the first connection terminal are provided in the non-input region, and the first slit portion is on the input region side of the first connection terminal so as to leave a laminated region of the first lead-out wiring layer. Is preferably provided. According to this, since it is possible to suppress the propagation of wrinkles and sagging to the input area due to distortion when the flexible wiring board is connected, the reflection unevenness on the surface side visually observed in the input area can be reduced with a simple configuration. Can be suppressed. Moreover, even if it is a case where elongation of a 1st transparent base material arises in the crimped | bonded location, the influence of elongation can be absorbed by providing a 1st slit part. Therefore, the occurrence of deflection of the first transparent substrate in the input region can be suppressed, and the generation of Newton rings can be suppressed.

The decorative base material has a light-transmitting region provided in a window shape and a non-light-transmitting region surrounding the light-transmitting region, and is provided with a decorative layer that colors the non-light-transmitting region. The decorative layer is preferably formed on the other surface of the decorative base material. In this way, the decoration layer can be provided so that the lead-out wiring layer, the connection terminal, and the flexible wiring board are arranged in the non-translucent region, and the decoration layer is opposite to the input operation surface of the decoration substrate. Since it is formed on the side surface, the surface side of the input device can be flattened.

  The input device of the present invention includes a first transparent base material having one surface as an input operation surface, a first transparent electrode layer laminated on the other surface of the first transparent base material, and the first transparent electrode layer. A first lead wiring layer electrically connected to the first lead wiring layer, a first connection terminal provided in the first lead wiring layer, a flexible wiring board electrically connected to the first connection terminal, and the vicinity of the first connection terminal And a first slit portion formed in the first transparent substrate.

  The flexible wiring board is connected to the first connection terminal of the first transparent base material on the input side, and the first transparent base material is a distortion of the first connection terminal and the surrounding area due to the influence of connecting the flexible wiring board. Produce. According to the present invention, since the first slit portion is provided in the vicinity of the first connection terminal of the first transparent base material, the distortion can be absorbed by the first slit portion. As a result, wrinkles and sagging due to distortion when the flexible wiring board is connected do not propagate to the surface of the first transparent base material on the input operation surface side.

  Therefore, it is possible to suppress the reflection unevenness on the surface side to be visually observed with a simple configuration.

  The input device of the present invention is formed on the second transparent base material, facing the first transparent electrode layer, and a second transparent base material arranged to face the other surface of the first transparent base material. A second lead electrode layer electrically connected to the second transparent electrode layer, and a second connection terminal provided on the second lead wire layer, the first connection It is preferable that the terminal and the second connection terminal are provided at a position at a predetermined interval in a plan view, and the flexible wiring board is electrically connected to the second connection terminal. In this way, an input device having flexible wirings electrically connected to both of the opposing transparent electrode layers can be realized, and thus the reflection unevenness on the surface side to be visually observed can be suppressed with a simple configuration.

  The second transparent base material has a space part in which at least a part of the flexible wiring board is exposed, and the space part is provided at a position overlapping the first connection terminal in plan view. preferable. Thereby, since there is no worry that the thickness of the flexible wiring board affects the input operation surface side to cause unevenness, the flatness on the surface side to be visually observed can be improved more reliably.

  The second transparent substrate is preferably formed by molding a transparent resin. If it carries out like this, a 2nd transparent base material can be formed in a rigid body structure. Therefore, the input device can be configured with a simple structure and can be easily integrated with the display device and the electronic device.

In the method for manufacturing an input device of the present invention, a decorative base material having one surface as an input operation surface, and one surface is bonded to the other surface of the decorative base material via a translucent adhesive layer. A first transparent base material, and a first transparent electrode layer provided on the first transparent base material,
(A) a first lead wiring layer electrically connected to the first transparent electrode layer on the other surface of the first transparent substrate provided with the first transparent electrode layer; and a first lead wiring layer Forming a first connection terminal, and forming a slit portion in the first transparent substrate;
(B) a step of bonding the other surface of the decorative substrate and one surface of the first transparent substrate through the adhesive layer;
(C) a step of crimping a flexible wiring board to the first connection terminal via a connection member;
It is characterized by including.

  Since the flexible wiring board is connected to the first connection terminal of the first transparent base material on the input side, the first connection terminal and the surrounding area are distorted. Since the slit portion is formed in the vicinity of one connection terminal, distortion can be absorbed. Thereby, wrinkles and sagging due to distortion when the flexible wiring board is connected do not propagate to the surface of the decorative base material on the input operation surface side. Therefore, it is possible to suppress the reflection unevenness on the surface side to be visually observed with a simple configuration.

  In the step (a), it is more preferable that the first transparent base material and the adhesive layer are bonded together, and then the slit portion is formed together with the adhesive layer. In this way, it is easy to bond with the decorative base material, and wrinkles and sagging due to distortion when connecting the connection of the flexible wiring board are also propagated through the adhesive layer in the slit portion. Blocked. Therefore, it is possible to more reliably suppress the uneven reflection on the surface side to be visually observed.

  In the step (c), the second transparent substrate provided with the second transparent electrode layer is disposed so that the second transparent electrode layer and the first transparent electrode layer face each other, and then the first transparent substrate is disposed. It is preferable that the flexible wiring board is crimped to the connection terminal via the connection member. In this way, since it can be manufactured by a simple process, the cost can be reduced.

  In the step (c), a space is formed in the second transparent base material in advance, and the first transparent base material and the second transparent base material are arranged so as to face each other at a predetermined interval. It is preferable that an apparatus for crimping the flexible wiring board is inserted into the space portion and the flexible wiring board is crimped to the first connection terminal via the connection member. In this way, the flexible wiring board can be crimped from the space portion of the second transparent base material in a state where the flexible wiring board is placed on the first connection terminal of the first transparent base material. Even if thermocompression bonding is used, there is no concern of overheating.

  The slit portion can be formed by laser processing. Laser processing is excellent in mass productivity because it can be processed with high accuracy and adhesion of foreign matters can be reduced.

  According to the input device and the manufacturing method of the input device of the present invention, since the influence of connecting the flexible wiring board does not propagate to the surface of the decorative base material on the input operation surface side, the surface that is visually observed with a simple configuration The uneven reflection on the side can be suppressed. In addition, since the occurrence of deflection in the input region can be suppressed, the generation of Newton rings can be suppressed.

It is a perspective view which shows the input device of 1st Embodiment. It is a disassembled perspective view which shows the input device of 1st Embodiment. It is a perspective schematic diagram explaining 1st Embodiment, and is a partial enlarged plan view. It is a mimetic diagram explaining a 1st embodiment, and is a partial expanded sectional view. It is a schematic diagram explaining 1st Embodiment, and is a partial enlarged plan view of a 1st transparent base material. It is a schematic diagram explaining the 1st modification of 1st Embodiment, and is a partial enlarged plan view of a 1st transparent base material. It is a mimetic diagram explaining the 2nd modification of a 1st embodiment, and is a partial expansion top view of the 1st transparent substrate. It is a schematic diagram explaining a 2nd modification, and is a partial expanded sectional view. It is a schematic diagram explaining 2nd Embodiment, and is a partial expanded sectional view. It is a mimetic diagram explaining a 3rd embodiment, and is a partial expanded sectional view. It is a schematic diagram explaining the modification of 3rd Embodiment, and shows a partial expanded sectional view. It is a schematic diagram which shows the manufacturing method of the input device of this embodiment, and is sectional drawing in the middle process. It is a schematic plan view which shows the structural example of a flexible wiring board.

<First Embodiment>
FIG. 1 is a perspective view showing an input device 10 according to the first embodiment, and FIG. 2 is an exploded perspective view thereof. In the present specification, the ratio of dimensions of each component is appropriately changed for easy understanding of the drawings.

  The input device 10 of the first embodiment constitutes a resistance film type input device. As shown in FIGS. 1 and 2, the input device 10 includes a flexible decorative base material 20, a flexible first transparent base material 30, and a second transparent base material 40. The In addition, the input device 10 includes a light-transmitting region 11 that allows a screen or the like of the display device to be visually recognized, and a non-light-transmitting region 12 that is provided in a frame shape so as to surround the light-transmitting region 11. In the present embodiment, the input area 13 for performing an input operation is provided at a position that substantially overlaps the translucent area 11.

  Here, “translucent” or “transparent” refers to a state where the transmittance of visible light is approximately 70% or more. Furthermore, the haze value is preferably 6 or less.

  The 1st transparent base material 30 and the 2nd transparent base material 40 are adhere | attached in the state electrically insulated via the insulating layer 51 provided in the non-light-transmissive area | region 12. As shown in FIG. In addition, the flexible decorative substrate 20 is bonded to the input operation surface side of the flexible first transparent substrate 30 via an adhesive layer 52. An acrylic double-sided tape is used for the insulating layer 51 and the adhesive layer 52. Furthermore, it is preferable to print the resist layer 56 in order to ensure electrical insulation.

  As shown in FIG. 2, the first transparent electrode layer 31 and the second transparent electrode layer 41 for detecting input position information are respectively provided on the opposing surfaces of the first transparent substrate 30 and the second transparent substrate 40. Are stacked. In addition, a first lead wiring layer 32 for outputting input position information is routed in the non-transparent region 12 of the first transparent base material 30 and is electrically connected to the first transparent electrode layer 31. ing. Similarly, the second lead wiring layer 42 is routed around the non-light-transmitting region 12 of the second transparent substrate 40, and the second lead wiring layer 42 and the second transparent electrode layer 41 are electrically connected. ing. The first lead wiring layer 32 and the second lead wiring layer 42 are connected to the flexible wiring board 60 at the first connection terminal 33 and the second connection terminal 43 provided in the non-light-transmissive region 12 on the Y2 side. . Accordingly, the first transparent electrode layer 31 and the second transparent electrode layer 41 facing each other are electrically connected to the flexible wiring board 60 with a simple configuration.

  The 1st connection terminal 33 and the 2nd connection terminal 43 are arrange | positioned in the position used as predetermined spacing by planar view. Correspondingly, the flexible wiring board 60 includes a first terminal 64 connected to the first connection terminal 33 and a second terminal 65 connected to the second connection terminal 43. The second terminal 65 is formed on a different surface and is branched so that it can be connected to the first transparent substrate 30 side and the second transparent substrate 40 side. The flexible wiring board 60 is drawn out through an opening 46 provided in the second transparent base material 40.

  During the input operation of the resistance film type input device 10, when the translucent region 11 (input region 13) of the input operation surface is pressed with a finger or a pen-shaped input device, the first transparent base material 30 having flexibility is provided. And the decoration base material 20 bends and the 1st transparent electrode layer 31 and the 2nd transparent electrode layer 41 contact. For example, when a voltage is applied to the first transparent electrode layer 31 in the Y1-Y2 direction, the Y coordinate can be detected by the partial pressure ratio in the Y1-Y2 direction according to the contact position of each transparent electrode layer by the pressing operation. . Similarly, when a voltage is applied to the second transparent electrode layer 41 in the X1-X2 direction, the X coordinate can be detected by the partial pressure ratio generated by the contact of each transparent electrode layer.

  The first transparent substrate 30 disposed on the input operation surface side is a flexible film-like material having a thickness of about 100 μm to 200 μm, and a transparent resin material such as PET (polyethylene terephthalate) is used. Can be used. The second transparent base material 40 is formed by molding with a thickness of about 0.5 mm to 2.0 mm so as to have higher rigidity than the first transparent base material 30, and is a transparent resin material such as PC (polycarbonate). Can be used. The second transparent substrate 40 may use a film material having a thickness of about 100 μm to 200 μm, similarly to the first transparent substrate 30.

The first transparent electrode layer 31 and the second transparent electrode layer 41 are made of a transparent conductive material such as ITO (Indium Tin Oxide), SnO ₂ , or ZnO having translucency in the visible light region by a sputtering method or a vapor deposition method. A film is formed. The thickness is 0.01 μm to 0.05 μm, for example, about 0.02 μm. For methods other than sputtering and vapor deposition, a film on which a transparent electrode film has been formed in advance is prepared, and only the transparent electrode film is transferred to a substrate, or a liquid material is applied. Is also possible.

  The first lead-out wiring layer 32 and the second lead-out wiring layer 42 formed in connection with the first transparent electrode layer 31 and the second transparent electrode layer 41 use a conductive paste of copper or silver, and are screen-printed or inkjet. It is formed by a printing method or the like. Each lead-out wiring layer can be formed to a thickness of about 5 μm to 30 μm.

  A decorative substrate 20 is provided on the input operation surface side of the first transparent substrate 30. The decorative substrate 20 is made of a transparent resin material such as PET, and has a thickness of about 100 μm to 200 μm. In this embodiment, a PET film having a thickness of about 130 μm is used. Moreover, it is desirable that the input operation surface side of the flexible decorative substrate 20 has a hard coat layer such as urethane acrylate resin. And the decoration layer 21 is formed in the surface different from the input operation surface of the decorating base material 20. FIG. The decorative layer 21 is printed by a screen printing method, an ink jet printing method, or the like to form the non-translucent region 12. When viewed from the input operation surface side of the decorative substrate 20, the decorative substrate 20 is flat.

  The decorative layer 21 is provided so as to overlap the connection portions with the respective lead wiring layers and the flexible wiring board 60, and has an effect of shielding the lead wiring layers and the like from being directly recognized by the operator. In addition, since the input device 10 is mounted on a display unit of an electronic device and the decoration layer 21 is directly visually recognized by an operator, the appearance of the decoration region 22 in which the decoration layer 21 is formed is particularly important. Strict quality is required. For example, since the decorative layer 21 is colored or a pattern, a mark, a character, or the like is drawn, it is easy for an operator to visually recognize the reflection unevenness caused by slight unevenness, which may be a defect in appearance quality. .

  3 and 4 are schematic diagrams for explaining this embodiment. FIG. 3 shows a partially enlarged plan view seen from the input operation surface side, but the decorative base material 20 and the adhesive layer 52 are omitted, and the first surface formed on the other surface of the first transparent base material 30 is shown. FIG. 5 is a perspective schematic view that makes it easy to understand the planar position with respect to the first slit portion 35 by showing the lead wiring layer 32 and the first connection terminal 33 by solid lines. 4 is a partially enlarged cross-sectional view taken along line IV-IV in FIG.

  As shown in FIGS. 2 and 3, the input device 10 of the present embodiment has a configuration in which a first slit portion 35 and a second slit portion 55 are formed in the first transparent base material 30 and the adhesive layer 52, respectively. ing. The first slit portion 35 and the second slit portion 55 are provided at a position overlapping the first connection terminal 33 in the Y2 side non-light-transmitting region 12 in plan view, so that the stacked region of the first lead wiring layer 32 remains. The first connection terminal 33 is enclosed.

  As shown in FIG. 4, since the 1st connection terminal 33 is connected with the flexible wiring board 60 via the connection member 71, when the connection member 71 used for an electrical connection solidifies, it will receive stress by the shrinkage | contraction in that case. Therefore, the 1st transparent base material 30 produces the distortion of the surface direction (XY surface direction) centering on the 1st connection terminal 33, and is wrinkled (Z direction) visually recognized from the input operation surface side of the decorating base material 20 It was found that the unevenness of This wrinkle becomes inconspicuous over time (for example, one day later) immediately after the crimping. This is considered because the adhesive layer 52 and the like slowly relax the stress. However, if the remaining wrinkles are still visible, a product that is favorable in appearance cannot be obtained.

  In the present embodiment, since the first slit portion 35 is formed, the distortion can be absorbed by the first slit portion 35. Thereby, wrinkles due to shrinkage distortion of the connection member 71 for connecting the flexible wiring board 60 do not propagate to the surface of the decorative base material 20 on the input operation surface side. Therefore, the flatness of the surface side to be visually observed can be improved.

  Further, by forming the second slit portion 55 at a position overlapping in a plan view, the second slit portion may also be used for the possibility that wrinkles and sagging due to distortion when the flexible wiring board is connected propagate through the adhesive layer 52. Blocked at 55. Therefore, the flatness of the surface side to be visually observed can be improved more reliably.

  Accordingly, the input device 10 can be configured and visually observed with the simple structure in which the first connection terminal 33 is provided in the first lead-out wiring layer 32 formed on the first transparent base material 30 on the input operation surface side. The flatness on the surface side can be improved.

  The first transparent electrode layer 31 and the second transparent electrode layer 41 may be laminated in the input region 13 and connected to the first lead wiring layer 32 and the second lead wiring layer 42, respectively. The first transparent electrode layer 31 may be laminated on almost the entire surface of the first transparent substrate 30 as long as a predetermined insulating region is provided, and the first lead-out wiring layer 32 is the first transparent electrode layer 31. And may be laminated. If laser trimming is used, it is easy to form an insulating region in a linear shape. Similarly, as long as a predetermined insulating region is provided, the second transparent electrode layer 41 may be laminated on almost the entire surface of the second transparent substrate 40, and the second lead wiring layer 42 may be the second transparent electrode. It may be a laminate with the layer 41.

  In order to improve the flatness of the decorative base material 20 on the input operation surface side, a dummy wiring layer and a resist layer 56 are provided in the non-light-transmitting region 12, and various film thicknesses in the region bonded by the insulating layer 51 can be as much as possible. It is preferable to keep it constant.

  In addition to the acrylic double-sided tape, an acrylic pressure-sensitive adhesive or a transparent adhesive may be used for the insulating layer 51 and the pressure-sensitive adhesive layer 52. However, the insulating layer 51 is preferably a double-sided tape that can ensure insulation that prevents a short circuit between the first lead-out wiring layer 32 and the second lead-out wiring layer 42. The resist layer 56 is preferably provided in order to improve the insulation and to flatten the unevenness caused by the first lead wiring layer 32.

  For the second transparent substrate 40, a transparent resin material such as PET (polyethylene terephthalate), PEN (polyethylene naphthalate), PMMA (polymethyl methacrylate resin), etc. can be used in addition to PC (polycarbonate). Since the 2nd transparent base material 40 can be formed in a rigid structure by a shaping | molding process, while being able to comprise the input device 10 with a simple structure, integration with a display apparatus and an electronic device is easy.

  Further, the flexible wiring board 60 can be drawn out through the through hole of the opening 46 provided in the second transparent base material 40 and can be connected so as not to be seen from the input operation surface side.

  In the present embodiment, the second transparent base material 40 is molded using a transparent resin material having a thickness of about 0.5 mm to 2.0 mm so as to have higher rigidity than the first transparent base material 30. However, a flexible film-like transparent resin material similar to the first transparent base material 30 may be used. If it carries out like this, it can form with the same raw material as the same process as the 1st transparent base material 30 only in patterns, such as the 1st extraction wiring layer 32 differing. In this case, it is preferable that a third transparent resin base material having sufficient rigidity is bonded to the other surface of the second transparent base material 40 through the same material as the adhesive layer 52. In any configuration, the input device 10 can be configured with a relatively simple structure, and can be easily integrated with a display device or an electronic device.

  FIG. 5 is a partially enlarged plan view schematically showing the first transparent substrate 30 of the present embodiment. It is seen from the side opposite to the input operation surface.

  A first transparent electrode layer 31 is laminated on a surface opposite to the input operation surface of the first transparent base material 30, and a first lead wiring layer 32a is connected to the Y1 side of the first transparent electrode layer 31 (not shown). The first connection terminal 33a is provided at one end on the Y2 side of the first lead wiring layer 32a. Similarly, the first lead-out wiring layer 32b is connected to the Y2 side of the first transparent electrode layer 31, and the first lead-out wiring layer 32b is also provided with the first connection terminal 33b. The first lead wiring layer 32b has a dummy wiring for flattening on the X1 side. Further, the first transparent substrate 30 is formed with a first slit portion 35.

  The first slit portion 35 is provided so as to surround the three sides of the first connection terminal 33 so as to leave the laminated region of the first lead wiring layer 32 so as not to interfere with the first lead wiring layer 32. A connection member 71 (not shown) for crimping the flexible wiring board 60 is disposed in an inner region surrounded by the first slit portion 35, and electrical connection and fixation between the first connection terminal 33 and the flexible wiring board 60 are performed. Can be done at the same time.

  In the present embodiment, the opening width of the first slit portion 35 shown in FIG. 5 is about 0.1 mm to 1 mm, and the length of one side is about 3 mm to 5 mm.

  FIG. 6 is a schematic diagram for explaining a first modification of the first embodiment, and is a partially enlarged plan view of the first transparent base material 30. The same reference numerals as those of the first embodiment are also used for the constituent members of this modification. In FIG. 5, the first slit portion 35 is provided in a shape having three straight sides, but is not limited to such a straight shape. A rounded U-shape or J-shape as in the first modification shown in FIG. 6 may be used, or another shape may be employed. In any shape, by providing the first slit portion 35 in the vicinity of the first connection terminal 33, it is possible to suppress the propagation of wrinkles and sagging due to distortion connecting the flexible wiring board 60 in the surface direction. With a simple configuration, it is possible to suppress uneven reflection on the surface side that is visually observed.

  FIG. 7 is a schematic diagram illustrating a second modification of the first embodiment, and is a partially enlarged plan view of the first transparent substrate 30. FIG. 8 is a partially enlarged cross-sectional view taken along line VIII-VIII in FIG.

  The first transparent substrate 30 has an input area 13 provided in a window shape and a non-input area 14 surrounding the input area 13. A first transparent electrode layer 31 is provided in the input region 13, and first lead-out wiring layers 32 a and 32 b and first connection terminals 33 a and 33 b are provided in the non-input region 14. As shown in FIG. 7, the first slit portion 35 is linear in the X1-X2 direction on the input region 13 side of the first connection terminal 33a so as to leave the stacked region of the first lead wiring layers 32a and 32b. Is provided. In the present modification, the first slit portion 35 is provided between the first lead wiring layer 32a and the first lead wiring layer 32b. Further, the first slit portion 35 is provided in the vicinity of the X1 side of the first connection terminal 33b on the input region 13 side.

  In this modification, the opening width of the first slit portion 35 is about 0.1 mm to 1 mm, and the length of one side is about 1 mm to 5 mm.

  Further, as shown in FIG. 8, the adhesive layer 52 is provided with a second slit portion 55 at a position overlapping the first slit portion 35 in plan view. By providing the first slit portion 35 and the second slit portion 55 in this way, distortion due to the connection of the flexible wiring board 60 can be absorbed by the first slit portion 35 and the second slit portion 55. Thereby, wrinkles due to shrinkage distortion of the connection member 71 for connecting the flexible wiring board 60 do not propagate to the surface of the decorative base material 20 in the input region 13. Therefore, the flatness of the surface side to be visually observed can be improved.

  As shown in FIG. 8, the first connection terminal 33 of the first transparent base material 30 is connected to the flexible wiring board 60 via the connection member 71. Further, on the Y1 side and the Y2 side of the first connection terminal 33, the first transparent base material 30 is fixed to the second transparent base material 40 by the insulating layer 51. When heat and pressure can be applied when the flexible wiring board 60 is pressure-bonded, the first transparent base material 30 and the decorative base material 20 may be stretched. As shown in FIG. 8, since both the Y1 side and the Y2 side of the first connection terminal 33 are fixed by the insulating layer 51, the conventional input device in which the first slit portion 35 and the second slit portion 55 are not provided. In, the 1st transparent base material 30 and the decorating base material 20 deform | transform so that it may become convex upwards by the elongation at the time of crimping | compression-bonding. Along with this, in the input region 13, the first transparent base material 30 is deformed so as to bend downward. Therefore, the interval between the first transparent base material 30 and the second transparent base material 40 in the input region 13 becomes narrow, and Newton rings are likely to occur.

  In the second modification, by providing the first slit portion 35 and the second slit portion 55 on the input region 13 side of the first connection terminal 33, the influence of the extension of the first transparent base material 30 at the time of pressure bonding is absorbed. it can. Therefore, even if the first transparent base material 30 is stretched at the crimped portion, the first transparent base material 30 and the second transparent base material are suppressed by suppressing the occurrence of the deflection of the first transparent base material 30 in the input region 13. Since the distance to 40 can be maintained, the occurrence of Newton rings can be suppressed.

In the second modification, the first slit portion 35 and the second slit portion 55 are provided, but even when only the first slit portion 35 is provided, the flexible wiring board 60 and the first connection terminal 33 are provided. It is possible to absorb wrinkles and sagging due to the distortion of the connection to the surface and improve the flatness of the surface side to be visually observed. However, by providing the second slit portion 55 in the adhesive layer 52, the second slit portion 55 also blocks the possibility that wrinkles and sagging due to distortion when the flexible wiring board is connected propagates through the adhesive layer 52. Therefore, the flatness on the surface side to be visually observed can be improved more reliably.

<Second Embodiment>
FIG. 9 is a schematic diagram for explaining the second embodiment, and is a partially enlarged sectional view. Also in the second embodiment, the same reference numerals are used for the constituent members.

  In the second transparent base material 40, a space 45 is formed separately from the opening 46 for drawing out the flexible wiring board 60. The space 45 is provided at a position that overlaps at least the first connection terminal 33 in plan view, and a part of the flexible wiring board 60 (crimp region of the first connection terminal 33) is spaced from the side opposite to the input operation surface. It can be seen inside the part 45.

  Thereby, since there is no worry that the thickness of the flexible wiring board 60 affects the input operation surface side to cause unevenness, the flatness on the surface side to be visually observed can be improved more reliably. Further, there is a demand for making the input device 10 thinner, and this embodiment is also excellent as a configuration for reducing the thickness.

  Moreover, the flexible wiring board 60 can be pressure-bonded to the first connection terminal 33 via the connection member 71 from the side opposite to the input operation surface using the space portion 45. In this way, the flexible decorative base material 20 only needs to be placed on a flat jig, so that the surface side is not distorted at the time of pressure bonding, and it is excessively heated even when thermocompression bonding is used. There is no worry. Furthermore, since the crimping | compression-bonding area | region of the flexible wiring board 60 in thermocompression bonding can be heated directly, the connection member 71 can be reliably thermosetted and it is excellent in connection reliability.

  The space 45 may be provided integrally with the opening 46.

The opening 46 may not be a through hole as long as the flexible wiring substrate 60 can be passed therethrough, and may be a notch provided on the Y2 side of the second transparent substrate 40. Moreover, it is preferable to provide the opening of the insulating layer 51 in a corresponding region so that the flexible wiring board 60 and the insulating layer 51 do not interfere with each other.
<Third Embodiment>
FIG. 10 is a schematic diagram for explaining the third embodiment, and shows a partially enlarged cross-sectional view when cut at the same place as FIG. 8. In FIG. 10, the same reference numerals are used for the same constituent members as those in the first embodiment and the second embodiment.

  As shown in FIG. 10, the decorative base material 20 is not provided in the present embodiment. Therefore, the surface (one surface) of the first transparent base material 30 becomes an input operation surface, and the operator can perform an input operation by pressing the input area 13 on the surface of the first transparent base material 30. And on the back surface (the other surface) of the first transparent base material 30, as in FIGS. 5 to 7, the first transparent electrode layer 31 and the first lead wiring electrically connected to the first transparent electrode layer 31. Layers 32a and 32b and first connection terminals 33a and 33b provided in the first lead wiring layers 32a and 32b are provided. In addition, the flexible wiring board 60 is connected to the first connection terminals 33 a and 33 b via a connection member 71.

  In the present embodiment, the first slit portion 35a does not interfere with the first lead wiring layers 32a and 32b in the vicinity of the first lead wiring layer 32a as in FIG. 5, and the first lead wiring layers 32a and 32b. The first connection terminals 33a and 33b are provided so as to leave the stacked region. Similarly to FIG. 7, the first slit portion 35b is provided on the input region 13 side of the first connection terminal 33 so as to leave the laminated region of the first lead wiring layer 32.

  Thereby, while suppressing the unevenness | corrugation of the surface of the 1st transparent base material 30 at the time of the crimping | compression-bonding of the flexible wiring board 60, it can suppress that the influence of the extension of the 1st transparent base material 30 propagates to the input area | region 13. . Therefore, it is possible to improve the flatness on the surface side of the first transparent base material 30 to be visually observed, and to suppress the uneven reflection due to the unevenness on the surface of the first transparent base material 30 and the occurrence of Newton rings in the input region 13. it can.

  In addition, in this embodiment, although both the 1st slit part 35a and the 1st slit part 35b are formed, even if it is a case where any one is formed, the 1st transparent base material 30 visually observed. The effect of improving the flatness on the surface side can be obtained.

FIG. 11 shows a schematic diagram for explaining a modification of the third embodiment shown in FIG. 10, and shows a partially enlarged sectional view. In this modification, a flexible film-like transparent resin material is used as the second transparent substrate 40 in the same manner as the first transparent substrate 30. A third transparent base material 47 having sufficient rigidity is bonded to the lower surface of the second transparent base material 40 through a material (not shown) similar to that of the adhesive layer 52. If it carries out like this, it can form with the same process and the same raw material as the 1st transparent base material 30 only in patterns, such as the 1st extraction wiring layer 32 differing. Even with such a configuration, the input device 10 can be configured with a relatively simple structure, and can be easily integrated with a display device and an electronic device. In addition to PC (polycarbonate), transparent resin materials such as PET (polyethylene terephthalate), PEN (polyethylene naphthalate), and PMMA (polymethyl methacrylate resin) can be used for the third transparent substrate 47.
<Manufacturing method>
FIG. 12 is a schematic diagram showing a method for manufacturing the input device 10, and is a cross-sectional view in an intermediate process. Details of each constituent member are omitted, and in order to show a state in a process to be described, the side that becomes the input operation surface is set to the lower side.

  In FIG. 12 (a), the flexible first transparent substrate 30 has a predetermined insulating pattern after a first transparent electrode layer 31 is provided on a roll-shaped film and cut into a predetermined size, for example. It is formed by laser trimming. Next, the first lead wiring layer 32 and the first lead wiring layer are electrically connected to the first transparent electrode layer 31 by printing and heating a silver conductive paste having a thickness of about 10 μm by screen printing. And a first connection terminal 33 provided on 32. Further, the protective film 81 with the weak adhesive layer 82 is bonded to protect the surface on which the first lead wiring layer 32 is formed, and the adhesive layer 52 with the protective film 83 is bonded to the opposite surface. The first slit portion 35 and the second slit portion 55 are collectively formed by processing. The protective films 81 and 82 are used in the manufacturing process and are not necessarily required. However, the protective films 81 and 82 are effective in preventing scratches and foreign matter adhesion in the process, and are preferably manufactured as shown in FIG. .

  Then, the said protective film 83 is peeled off, and as shown in FIG.12 (b), the surface in which the decorating layer 21 of the decorating base material 20 which has flexibility is provided, and the 1st transparent base material 30 The surface on which the first lead wiring layer 32 or the like is not provided is bonded through the adhesive layer 52.

  The second transparent substrate 40 is also bonded to the first transparent substrate 30 after performing a predetermined process. Further, as shown in FIG. 12C, the flexible wiring board 60 is crimped to the first connection terminal 33 via the connection member 71 using the crimping device 90.

  FIG. 13 is a schematic plan view showing a structural example of the flexible wiring board 60. The flexible wiring board 60 has a wiring layer 63 formed on an insulating and flexible base film 61. As shown in FIG. 13, an insulating cover film 62 is laminated on the base film 61 via an adhesive layer (not shown).

  The flexible wiring board 60 has the cover film 62 or the base film 61 removed in the crimping region. The wiring layer 63 is composed of four lead patterns arranged side by side at intervals, and the end portions of the respective lead patterns are exposed in areas where the cover film 62 or the base film 61 is not formed, First terminals 64a and 64b and second terminals 65a and 65b are formed. The pressure-bonding surface can be changed depending on whether the cover film 62 or the base film 61 is removed. Thereby, it inserts between the 1st transparent base material 30 and the 2nd transparent base material 40 which oppose, and it connects to the 1st connection terminal 33 and the 2nd connection terminal 43 which are formed in each surface. Is possible.

  For the base film 61 and the cover film 62, a flexible organic resin such as a polyimide film can be used. The wiring layer 63 is formed of copper foil or the like. In general, the base film 61 and a film-like copper foil are bonded together via an adhesive layer (not shown), the pattern of the wiring layer 63 is processed, and the cover film 62 is further attached to the adhesive layer (not shown). It is done to stick together. The first terminals 64a and 64b and the second terminals 65a and 65b are formed by laminating a silver conductive paste or the like on the wiring layer 63 by printing.

  The connection between the first terminals 64 a and 64 b and the first connection terminals 33 a and 33 b is connected by thermocompression bonding via the connection member 71. The connection between the second terminals 65a and 65b and the second connection terminal 43 is the same.

  The connecting member 71 is preferably an anisotropic conductive resin. An anisotropic conductive resin is an insulating material such as an epoxy resin in which conductive particles such as metal-plated resin beads are dispersed. And has insulation in the planar direction. Therefore, even if the first terminals 64a and 64b or the second terminals 65a and 65b are adjacent to each other in the plane direction and the anisotropic conductive resin is applied so as to cover them together, they are short-circuited in the plane direction. Never do.

  It is preferable to bond the first transparent base material 30 after connecting the second connection terminals 43 of the second transparent base material 40 and the second terminals 65a and 65b of the flexible wiring board 60 by pressure bonding. If it carries out like this, when connecting the 1st connection terminal 33 and the 1st terminal 64a, 64b of the 1st transparent base material 30, only the location of the 1st connection terminal 33 can be crimped | bonded by planar view.

  The first lead wiring layer 32 and the first connection terminal 33 are preferably protected in advance by the resist layer 56 except for the crimping region covered with the connection member 71.

  Although the 2nd transparent base material 40 shown in FIG.12 (c) forms the space part 45, when the space part 45 is not provided, the 1st transparent base material 30 and the 2nd transparent base material 40 are used. What is necessary is just to crimp | crimp so that it may pinch | interpose.

  If the space part 45 is provided in the 2nd transparent base material 40, since the crimping | compression-bonding apparatus 90 can be inserted from the opposite side to an input operation surface using the space part 45, the connection member 71 is attached to the 1st connection terminal 33. The flexible wiring board 60 can be pressure-bonded. In this way, the flexible decorative base material 20 only needs to be placed on a flat jig, so that the surface side is not distorted at the time of pressure bonding, and it is excessively heated even when thermocompression bonding is used. There is no worry. Furthermore, since the crimping | compression-bonding area | region of the flexible wiring board 60 can be heated directly, the connection member 71 can be reliably thermosetted and it is excellent in connection reliability.

  According to the manufacturing method of the present embodiment, wrinkles due to shrinkage distortion of the connection member 71 for connecting the flexible wiring board 60 do not propagate to the surface of the decorative substrate 20 on the input operation surface side. Therefore, the flatness of the surface side to be visually observed can be improved.

  In the step of FIG. 12A, before forming the first lead wiring layer 32 and the first connection terminal 33 on the first transparent substrate 30, the first slit portion 35 is formed in advance by pressing. Also good. In this case, there is no step of forming the second slit portion 55 in the adhesive layer 52, but since the slit portion is provided in the first transparent base material 30, the surface of the decorative base material 20 on the input operation surface side is provided. Does not propagate wrinkles due to shrinkage distortion of the connection member 71 for connecting the flexible wiring board 60. Therefore, the flatness of the surface side to be visually observed can be improved.

  In that case, it is preferable that the first slit portion 35 is processed after a weak adhesive protective film is bonded to both surfaces of the first transparent substrate 30. In this way, unnecessary foreign matter adhesion and scratches can be prevented. However, in the step of FIG. 12B and the like, the adhesive layer 52 is exposed at the first slit portion 35, so that attention should be paid to the adhesion of foreign matter, and the adhesive layer 52 is also provided with the second slit portion 55. More preferred.

  The slit portion can also be formed by laser processing. Compared with press processing, laser processing makes it easy to change the pattern, making it easy to study the optimum shape. Furthermore, if laser processing is performed, it is possible to perform processing with high accuracy, and it is possible to reduce the adhesion of foreign matter, so that it is excellent in mass productivity.

  The present invention can be applied to devices other than resistive film type input devices. The capacitance type input device can use the first transparent electrode layer 31 as a capacitance detection electrode pattern. Further, by providing a third transparent electrode layer that is insulated from the first transparent electrode layer 31, the first transparent electrode layer 31 and the third transparent electrode layer may have a two-layer capacitance detection electrode pattern configuration. . In any case, the first connection terminal 33 provided on the first lead wiring layer 32 electrically connected to the first transparent electrode layer 31 is connected to the flexible wiring board 60, but in the vicinity of the first connection terminal 33. By having the 1st slit part 35 formed in the 1st transparent base material 30, the reflective nonuniformity of the surface side visually observed can be suppressed.

  In particular, the capacitance type input device is effective in realizing a flexible structure. For example, an electronic device that can be bent can be obtained by combining with a flexible display device.

  The input device 10 in this embodiment is used for a mobile phone, a digital camera, a PDA, a game machine, a car navigation, and the like.

DESCRIPTION OF SYMBOLS 10 Input device 11 Translucent area | region 12 Non-transparent area | region 13 Input area 14 Non-input area | region 20 Decorating base material 21 Decorating layer 30 1st transparent base material 31 1st transparent electrode layer 32, 32a, 32b 1st extraction wiring layer 33, 33a, 33b 1st connection terminal 35, 35a, 35b 1st slit part 40 2nd transparent base material 41 2nd transparent electrode layer 42 2nd extraction wiring layer 43 2nd connection terminal 45 Space part 46 Opening part 47 3rd Transparent substrate 51 Insulating layer 52 Adhesive layer 55 Second slit portion 56 Resist layer 60 Flexible wiring board 61 Base film 62 Cover film 63 Wiring layers 64, 64a, 64b First terminals 65a, 65b Second terminals 71 Connecting members 81, 83 Protective film 82 Weak adhesive layer 90 Crimping device

Claims (16)

A decorative base material having one side as an input operation side;
A translucent adhesive layer laminated on the other surface of the decorative substrate;
A first transparent base material having one surface bonded to the decorative base material via the adhesive layer, a first transparent electrode layer stacked on the other surface of the first transparent base material, and the first A first lead wiring layer electrically connected to the transparent electrode layer; a first connection terminal provided in the first lead wiring layer;
A flexible wiring board electrically connected to the first connection terminal;
A first slit portion formed in the first transparent substrate in the vicinity of the first connection terminal;
An input device comprising:   The input device according to claim 1, further comprising: a second slit portion formed in the adhesive layer, wherein the second slit portion is provided at a position overlapping the first slit portion in plan view. .   The input device according to claim 1, wherein the first slit portion is provided so as to surround the first connection terminal so as to leave a laminated region of the first lead wiring layer. The first transparent substrate has an input area provided in a window shape, and a non-input area surrounding the input area,
The first transparent electrode layer is provided in the input region, and the first lead wiring layer and the first connection terminal are provided in the non-input region,
The said 1st slit part is provided in the said input area side of the said 1st connection terminal so that the lamination | stacking area | region of the said 1st extraction wiring layer may be left, The any one of Claims 1-3 characterized by the above-mentioned. The input device according to item 1. The decorative base material has a light-transmitting region provided in a window shape and a non-light-transmitting region surrounding the light-transmitting region, and is provided with a decorative layer that colors the non-light-transmitting region. ,
The input device according to any one of claims 1 to 4, wherein the decorative layer is formed on the other surface of the decorative base material. A first transparent substrate having one surface as an input operation surface;
A first transparent electrode layer laminated on the other surface of the first transparent substrate; a first lead wiring layer electrically connected to the first transparent electrode layer; and a first lead layer provided on the first lead wiring layer. 1 connection terminal,
A flexible wiring board electrically connected to the first connection terminal;
A first slit portion formed in the first transparent substrate in the vicinity of the first connection terminal;
An input device comprising:   The input device according to claim 6, wherein the first slit portion is provided so as to surround the first connection terminal so as to leave a laminated region of the first lead wiring layer. The first transparent substrate has an input area provided in a window shape, and a non-input area surrounding the input area,
The first transparent electrode layer is provided in the input region, and the first lead wiring layer and the first connection terminal are provided in the non-input region,
The said 1st slit part is provided in the said input area side of the said 1st connection terminal so that the lamination | stacking area | region of the said 1st extraction wiring layer may be left, The Claim 6 or Claim 7 characterized by the above-mentioned. Input device. A second transparent substrate disposed to face the other surface of the first transparent substrate; and a second transparent electrode layer formed on the second transparent substrate to face the first transparent electrode layer. A second lead wiring layer electrically connected to the second transparent electrode layer, and a second connection terminal provided on the second lead wiring layer,
The first connection terminal and the second connection terminal are provided at a position at a predetermined interval in plan view,
The input device according to claim 1, wherein the flexible wiring board is electrically connected to the second connection terminal. The second transparent substrate has a space where at least a part of the flexible wiring board is exposed,
The input device according to claim 9, wherein the space portion is provided at a position overlapping the first connection terminal in plan view.   The input device according to claim 9 or 10, wherein the second transparent substrate is formed by molding a transparent resin. A decorative base material having one surface as an input operation surface; a first transparent base material in which one surface is bonded to the other surface of the decorative base material via a translucent adhesive layer; A first transparent electrode layer provided on one transparent substrate, and a manufacturing method of an input device comprising:
(A) a first lead wiring layer electrically connected to the first transparent electrode layer on the other surface of the first transparent substrate provided with the first transparent electrode layer; and a first lead wiring layer Forming a first connection terminal, and forming a slit portion in the first transparent substrate;
(B) a step of bonding the other surface of the decorative substrate and the one surface of the first transparent substrate via the adhesive layer;
(C) a step of crimping a flexible wiring board to the first connection terminal via a connection member;
The manufacturing method of the input device characterized by including.   13. The input according to claim 12, wherein in the step (a), the slit portion is formed together with the adhesive layer after the first transparent base material and the adhesive layer are bonded together. Device manufacturing method.   In the step (c), the second transparent substrate provided with the second transparent electrode layer is disposed so that the second transparent electrode layer and the first transparent electrode layer face each other, and then the first transparent substrate is disposed. The method for manufacturing an input device according to claim 12, wherein the flexible wiring board is crimped to a connection terminal via the connection member. In the step (c), a space is formed in the second transparent base material in advance, and the first transparent base material and the second transparent base material are arranged so as to face each other at a predetermined interval.
A device for crimping the flexible wiring board is inserted into the space,
The method of manufacturing an input device according to claim 14, wherein the flexible wiring board is pressure-bonded to the first connection terminal via the connection member.   The method for manufacturing an input device according to claim 12, wherein, in the step (a), the slit portion is formed by laser processing.