JP2012113641A - Input device, and method of manufacturing input device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an input device that can effectively improve adhesion without increasing, especially, the distance between a pair of base materials, and a method of manufacturing the input device.SOLUTION: The input device includes a pair of transparent base materials which are disposed opposite each other across a space, transparent conductive layers which are formed in input regions 20 of opposite surfaces of the pair of transparent base materials respectively, wiring layers which are formed in non-input regions 21 at outer peripheries of the input regions 20 respectively, and an adhesive layer for bonding the pair of transparent base materials together. Dotted insulating members 36 are formed in a non-input region 21 of at least one transparent base material. The pair of transparent base materials are bonded together with the adhesive layer interposed over the wiring layers and the dotted insulating member 36, and a step part between the one transparent base material and wiring layer is filled with the adhesive layer.

Description

  The present invention relates to an input device and an input device manufacturing method, and more particularly to an input device in which a pair of base materials are bonded via an adhesive layer and an input device manufacturing method.

  Currently, as a display unit of a portable electronic device or the like, a translucent input device for inputting coordinates by directly operating a menu item or object of a display image with a finger or the like is used. As such an input device, various methods can be mentioned. For example, Patent Document 1 describes a resistance film type input device.

  Such a resistance film type input device is arranged so that a pair of base materials face each other with a space provided. A transparent electrode layer is formed in the input region on the opposing surface of the pair of base materials, and a wiring layer for connecting the transparent electrode layer and an external circuit is formed in the non-input region surrounding the input region. ing. The pair of base materials are bonded to each other via an adhesive layer that is stacked on the non-input region across the wiring layer.

  However, when the adhesiveness between the base material and the adhesive layer is insufficient, a slight gap is generated between the base materials, and a ventilation hole between the space sandwiched between the pair of base materials and the outside is formed. If such a vent is formed, the performance of the input device may be deteriorated due to the influence of external environmental changes (high temperature and high humidity). In addition, when a pressure difference is generated between the inside and the outside of the input device, there is a problem that a gap between the base materials cannot be maintained and Newton rings are generated.

  FIG. 13 is a cross-sectional view of the input device 101 showing the first conventional example, and is an invention described in Patent Document 1. In FIG. In FIG. 13, the detailed configuration of the upper base 131 is omitted. In the first conventional example, the step formed by the wiring layer 140 and the lower transparent base material 130 is filled with the first insulating layer 137, and the first insulating layer 137 extends from the surface of the first insulating layer 137 to the surface of the wiring layer 140. Two insulating layers 139 are stacked. With such a structure, the flatness of the surface of the second insulating layer 139 is improved, and the adhesion between the adhesive layer 161 provided on the surface of the second insulating layer 139 and the second insulating layer 139 is improved. Can be improved effectively.

  FIG. 14 is a cross-sectional view of the input device 201 of the second conventional example, which is an invention disclosed in Patent Document 2. FIG. 14 shows a cross section near the end portions of the first wiring layer 240 and the second wiring layer 241 facing each other. In the second conventional example, the first wiring layer 240 and the second wiring layer 241 are formed by screen printing, and the first structural layer 240a and the second structural layer 241a are adjacent to the respective end portions. Form. The first structure layer 240a is formed so that the thickness decreases as the distance from the end of the first wiring layer 240 increases. The second structural layer 241a is formed in the same manner. The upper base material 230 and the lower base material 231 are laminated via the adhesive layer 261 so that the first structural layer 240a and the second structural layer 241a are engaged. With such a structure, a step portion between the wiring layer and the base material surface can be relaxed, and generation of a gap between the adhesive layer 261 and the upper base material 230 and between the adhesive layer 261 and the lower base material 231 is reduced. is doing.

Japanese Patent Application No. 2010-110066 JP 2009-266025 A JP 2010-033310 A

  However, since the first conventional example shown in FIG. 13 has a two-layer structure of the first insulating layer 137 and the second insulating layer 139, the distance between the upper substrate 131 and the lower substrate 130 is different. Will become bigger. The resistance film type input device is an operation method for inputting position information by pressing and deforming a film-like upper base material 131 constituting an input surface. Therefore, when the distance between the upper base material 131 and the lower base material 130 is increased, the input load is increased and a comfortable operation feeling cannot be obtained. In addition, since the amount of deformation of the upper base member 131 at the time of input operation increases, there is a problem that the durability of the upper base member 131 tends to decrease due to repeated input operations.

  In addition, in the method of manufacturing the input device 101 of the first conventional example, a process of providing a minute gap between the first insulating layer 137 and the adjacent wiring layer 140 and filling the gap with the second insulating layer 139. is required. Therefore, the formation of the first insulating layer 137 requires high positional accuracy, and the number of processes increases, leading to an increase in manufacturing cost.

  In the input device 201 of the second conventional example shown in FIG. 14, the first structural layer 240a and the second structural layer 241a are formed by screen printing. Patent Document 2 also describes a configuration in which the first structure layer 240a is formed by a plurality of structures and the height is intermittently changed. However, when it is formed by screen printing, it is difficult to control the shape of the structural layer with high accuracy because of the occurrence of drooping at the edges or a saddle phenomenon. Therefore, there is a problem that a minute gap is generated between the first structural layer 240a and the adhesive layer 261, and between the second structural layer 241a and the adhesive layer 261.

  In addition, the input device disclosed in Patent Document 3 discloses a configuration in which spacer layers are arranged on both side surfaces of a wiring layer by screen printing or the like to improve flatness. However, it is difficult to form the spacer layer with good contact with the side surface of the wiring layer by the screen printing method, and a part of the spacer layer is formed on the wiring layer, or the wiring layer and the spacer are formed. There may be a gap between the layers. It is difficult for the adhesive layer to absorb the steps and gaps formed by such wiring layers and spacers, and sufficient adhesion cannot be obtained.

  The present invention solves the above problems and provides an input device and an input device manufacturing method capable of effectively improving the adhesion between a pair of substrates without increasing the distance between the substrates. The purpose is to do.

  The input device according to the present invention includes a pair of transparent base materials arranged to face each other with a space, a transparent conductive layer formed in an input region on an opposing surface of the pair of transparent base materials, and the input region Each having a wiring layer formed in a non-input area on the outer periphery of the substrate and an adhesive layer that adheres the pair of transparent substrates, and a dot-like insulating member is formed in the non-input area of at least one of the transparent substrates. The pair of transparent base materials are bonded via the adhesive layer across the wiring layer and the dot-shaped insulating member, and a step portion between the one transparent base material and the wiring layer is the adhesive layer. It is characterized by being filled with.

  ADVANTAGE OF THE INVENTION According to this invention, the adhesiveness between an adhesion layer and a base material can be improved according to the anchor effect of the dot-shaped insulating member formed in the non-input area | region. In addition, the simple structure of laminating a pair of substrates over the wiring layer and the dot-like insulating member via the adhesive layer can improve the adhesion between the substrates, thereby increasing the distance between the pair of substrates. Adhesiveness can be effectively improved without making it.

  In the input device of the present invention, it is preferable that the dot-shaped insulating member is formed at the stepped portion. According to this, it is possible to prevent the generation of voids at the step portion between the wiring layer and the base material, and to reliably improve the adhesion between the pair of base materials.

  In the input device according to the present invention, in the non-input region, the wiring layer has a plurality of wiring portions and is formed so as to surround the input region, and the dot-shaped insulating member is formed in a gap between the plurality of wiring portions facing each other. Is preferably formed. According to this, even in the gap between the facing wiring parts, it is possible to prevent the generation of a gap between the base material and the adhesive layer, and to effectively improve the adhesion and sealing performance between the pair of base materials. Is possible.

  In the input device of the present invention, it is preferable that an end portion of the wiring portion is stacked over a part of the dot-shaped insulating member. According to this, the adhesion is improved by the anchor effect of the dot-shaped insulating member, and the stepped portion between the wiring portion and the transparent substrate is gently formed by the dot-shaped insulating member. The reliability can be improved with certainty.

  In the input device of the present invention, it is preferable that the wiring layer is formed on the other transparent base so as to face the gaps of the plurality of wiring portions in one of the transparent bases. According to this, adhesiveness and sealing performance can be effectively improved in the gaps between the plurality of wiring portions.

  In the input device of the present invention, it is preferable that a plurality of the dot-like insulating members are provided side by side, and an uneven surface facing the adhesive layer is formed. According to this, since the anchor effect by a dot-shaped insulating member becomes larger, it becomes possible to improve the adhesiveness between a pair of base materials reliably.

  The method of manufacturing an input device according to the present invention includes a step of forming a dot spacer in an input region of a transparent base material having a transparent conductive layer formed on one surface, and a dot-like insulating member in a non-input region on the outer periphery of the input region. Forming a wiring layer comprising a plurality of wiring portions in the non-input area, and laminating the adhesive layer across the wiring layer and the dot-like insulating member in the non-input area; , Including. According to this, the adhesion between the adhesive layer and the substrate can be improved by the anchor effect of the dot-like insulating member formed in the non-input area. Moreover, since the adhesiveness between base materials can be improved by the simple structure which laminates | stacks a pair of base material through an adhesion layer over a wiring layer and a dot-shaped insulating member, the distance between base materials is increased. The adhesion can be effectively improved.

  In the method for manufacturing an input device according to the present invention, it is preferable that the dot spacer and the dot-shaped insulating member are formed in the same process. According to this, the adhesiveness between the base materials can be improved effectively, and the manufacturing process of the input device can be simplified, so that the cost can be reduced.

  In the input device manufacturing method of the present invention, in the non-input region, a wiring region for forming the wiring layer is provided such that the plurality of wiring portions have a gap facing each other, and the dot is positioned in the gap. It is preferable to include a step of forming a shaped insulating member. According to this, since the dot-like insulating member can be formed in the gap between the facing wiring portions, it is possible to prevent the occurrence of a gap between the base material and the adhesive layer even in the gap between the facing wiring portions. It becomes possible to effectively improve the adhesion and sealing between the pair of substrates.

  In the input device manufacturing method according to the present invention, in the non-input area, a wiring area for forming the wiring layer is set and straddles the non-input area outside the wiring area. It is preferable to include a step of forming the dot-shaped insulating member. According to this, the adhesion is improved by the anchor effect of the dot-shaped insulating member, and the stepped portion between the wiring portion and the transparent substrate is gently formed by the dot-shaped insulating member. The reliability can be improved with certainty.

  In the input device manufacturing method according to the present invention, it is preferable that a plurality of the dot-shaped insulating members are arranged in parallel in the non-input region. According to this, since the anchor effect by a dot-shaped insulating member becomes larger, it becomes possible to improve the adhesiveness between a pair of base materials reliably.

  In the method for manufacturing an input device according to the present invention, it is preferable that the dot spacers and the dot-shaped insulating members are formed of an acrylic resin material.

  In the manufacturing method of the input device of the present invention, it is preferable that the dot-shaped insulating member is formed by a printing method. According to this, the dot-shaped insulating member can be easily formed by a printing method such as a screen printing method or an ink jet printing method.

  In the method for manufacturing an input device according to the present invention, it is preferable that the dot-shaped insulating member is formed of an ultraviolet curable resin. According to this, since the dot-shaped insulating member can be cured without applying heat, it can be manufactured in a short time. Moreover, since there is little residual stress at the time of hardening, it becomes possible to suppress generation | occurrence | production of the curvature of a base material.

  According to the input device and the manufacturing method of the input device of the present invention, the adhesion between the adhesive layer and the substrate can be improved by the anchor effect of the dot-like insulating member formed in the non-input area. In addition, due to the anchor effect of the dot-like insulating member, it is not necessary to provide a multi-layered insulating layer, so that the adhesion can be effectively improved without increasing the distance between the pair of base materials.

It is a perspective view of the input device in the embodiment of the present invention. It is sectional drawing of the input device cut | disconnected by the II-II line | wire of FIG. It is a top view of the 1st transparent substrate in the input device of this embodiment. FIG. 4 is a partially enlarged plan view of a first transparent base material in the vicinity of a region A in FIG. 3. FIG. 5 is a partial enlarged cross-sectional view taken along a line corresponding to line VV in FIG. 4 in the input device according to the present embodiment. It is a partial enlarged plan view of the 1st transparent substrate showing the 1st modification of this embodiment. It is a partial expanded sectional view of the input device cut in the 1st modification in the position corresponding to the VII-VII line of Drawing 6. It is a partial enlarged plan view of the 1st transparent substrate showing the 2nd modification of this embodiment. It is a top view of the 2nd transparent substrate in the input device of the 3rd modification of this embodiment. FIG. 10 is a partially enlarged plan view of a second transparent base material in the vicinity of a region B in FIG. 9. FIG. 11 is a partial enlarged cross-sectional view of an input device cut at a position corresponding to the line XI-XI in FIG. 10 in an input device of a third modified example. It is process drawing which shows the manufacturing method of the input device of this embodiment. It is a partial expanded sectional view of an input device which shows the 1st conventional example. It is a partial expanded sectional view of an input device which shows the 2nd conventional example.

  FIG. 1 shows a perspective view of an input device 1 of the present invention. FIG. 2 is a cross-sectional view of the input device 1 taken along the line II-II in FIG.

  Such an input device 1 is arranged so as to overlap a display screen of a display device such as a liquid crystal display panel or an electroluminescence panel, and is a portable device such as a mobile phone or a portable information terminal, a game device, a camera, or a video photographing device. It is mounted on the display part of various electronic devices. An operator can visually recognize an image on the display device through the input device 1 and can perform various input operations by directly touching the displayed screen with a finger or the like on various displayed information.

  As shown in FIG. 1, in the input device 1 of the present invention, the first transparent base material 30 and the second transparent base material 31 are laminated via the first adhesive layer 60, and the second transparent base material 31 is placed on the input surface side. The surface member 50 is laminated via the second adhesive layer 61. The input device 1 also has a window-shaped input area 20 and a non-input area 21 that surrounds the outer periphery of the input area 20.

  As shown in FIG. 2, the first transparent substrate 30 and the second transparent substrate 31 are arranged so as to face each other with a space. A first transparent conductive layer 32 and a second transparent conductive layer 33 are formed in the input regions 20 on the opposing surfaces of the first transparent substrate 30 and the second transparent substrate 31, respectively. A first wiring layer 40 and a second wiring layer 41 are formed in the non-input areas 21 on the opposing surfaces of the first transparent base material 30 and the second transparent base material 31, respectively. The first transparent base material 30 and the second transparent base material are bonded to each other via the first adhesive layer 60 in the non-input area 21.

  The 2nd transparent base material 31 arrange | positioned at the input surface side is a film-form material which can be deform | transformed by input operation, and uses transparent resin materials, such as PET (polyethylene terephthalate). The thickness of the second transparent substrate 31 is about 100 μm to 200 μm, for example, a thickness of 188 μm. Further, the first transparent substrate 30 is formed of a transparent resin, for example, using a material such as PC (polycarbonate), PET (polyethylene terephthalate), PEN (polyethylene naphthalate), PMMA (polymethyl methacrylate resin), The thickness may be 0.5 to 1.5 mm, for example, about 1.0 mm.

Each of the first transparent conductive layer 32 and the second transparent conductive layer 33 is a transparent conductive material such as ITO (Indium Tin Oxide), SnO ₂ , ZnO or the like having translucency in the visible light region. It is formed by. In the present embodiment, ITO is used as the first transparent conductive layer 32 and the second transparent conductive layer 33, and the thickness thereof is 0.01 μm to 0.05 μm, for example, about 0.02 μm.

  The first wiring layer 40 and the second wiring layer 41 are formed by a printing method such as a screen printing method or an ink jet printing method using a conductive paste containing a conductive material such as copper or silver. In addition to the printing method, it is also possible to form a thin film by sputtering or vapor deposition as in the case of the transparent conductive layer.

  Further, the surface member 50 is laminated on the input surface side of the second transparent base material 31 via the second adhesive layer 61. The surface member 50 includes a film-like flexible decorative sheet 51 and a decorative layer 52 formed in the non-input area 21 of the decorative sheet 51. The decorative sheet 51 is made of a resin material such as PET (polyethylene terephthalate) having translucency. The decorative layer 52 is formed by printing, and is disposed so as to overlap the first wiring layer 40 and the second wiring layer 41 in a planar manner.

  For the first adhesive layer 60 and the second adhesive layer 61, an adhesive tape made of an acrylic resin that transmits visible light can be used. The first adhesive layer 60 and the second adhesive layer 61 have viscoelasticity that can be bonded so that the input surface of the input device 1 becomes flat by absorbing the steps formed by the wiring layers and the decorative layer 52. Use material and thickness. An adhesive tape having a thickness of about 25 μm was used for the first adhesive layer 60 and an adhesive tape having a thickness of about 50 μm was used for the second adhesive layer 61.

  The 2nd transparent base material 31 and the decorating sheet | seat 51 which comprise an input surface are flexible film-like materials, and are a material which can deform | transform by press operation. When the input surface is pressed with a finger or a pen-shaped input device during the input operation of the input device 1, the first transparent conductive layer 32 and the second transparent conductive layer 33 are in contact with each other. A voltage is applied to each of the first transparent conductive layer 32 and the second transparent conductive layer 33, and the voltage value changes when the conductive layers come into contact with each other at the place where the input operation is performed. The input device 1 of the present invention constitutes a resistive touch panel that can read input position information by changing the voltage value.

  In the present embodiment, a resin substrate having a thickness of 0.5 mm to 1.5 mm, for example, about 1.0 mm is used as the first transparent substrate 30. However, the present invention is not limited thereto, and a film-like resin material is used. Also good. In this case, the input device 1 is configured by pasting a transparent base material serving as a support to the lower portion of the first transparent base material 30.

  Next, the configuration of the first transparent substrate 30 will be described in detail. In FIG. 3, the top view of the 1st transparent base material 30 in which the 1st transparent conductive film 32 and the 1st wiring layer 40 were formed in the surface is shown. FIG. 4 is a partially enlarged plan view of the vicinity of the region A surrounded by the two-dot chain line in FIG. FIG. 5 shows a partially enlarged cross-sectional view of the input device 1 of the present embodiment, cut at a location corresponding to the line VV in FIG.

  As shown in FIG. 3, a first transparent conductive layer 32 is formed in the input region 20 on the surface of the first transparent substrate 30. Further, in the non-input area 21 positioned on the outer periphery of the input area 20, a first wiring layer 40 composed of a plurality of wiring portions is formed so as to surround the input area 20.

  The X1-side wiring section 40a is disposed in the non-input area 21 on the X1 side of the input area 20, and is formed to extend in the Y1-Y2 direction. Similarly, the X2-side wiring portion 40b is formed in the non-input area 21 on the X2 side of the input area 20 so as to extend in the Y1-Y2 direction. The X1-side wiring portion 40a and the X2-side wiring portion 40b are formed in a state of being electrically connected to the first transparent conductive layer 32.

  The connecting portions 40d and 40f are terminals for connecting to an external flexible printed circuit board or the like. The Y1 side end of the X1 side wiring portion 40a and the connecting portion 40d are connected by the Y1 side wiring portion 40c, and the X2 side The Y1 side end of the wiring part 40b and the connection part 40f are connected by the Y1 side wiring part 40e.

  In the non-input area 21 located on the Y2 side of the input area 20, a Y2-side dummy wiring portion 40g extending in the X1-X2 direction is formed. In FIG. 3, the Y2 side dummy wiring portion 40g is formed integrally with the Y2 side end portion of the X1 side wiring portion 40a. However, the present invention is not limited to this, and the Y2 side dummy wiring portion 40g is formed separately. May be. The Y2-side dummy wiring portion 40g is provided so that the distance between the base materials is constant over the periphery of the input region 20 when the first transparent base material 30 and the second transparent base material 31 are stacked. When the Y2-side dummy wiring portion 40g is not formed, the distance between the base materials in the Y2-side direction of the input region 20 becomes small, and problems such as Newton rings are likely to occur.

  In the input device 1 of the present embodiment, a plurality of dot-like insulating members 36 are juxtaposed in a portion where the first wiring layer 40 is not formed in the non-input region 21 of the first transparent base material 30. The dot-shaped insulating member 36 is made of, for example, an acrylic ultraviolet curable resin, has a diameter of about 20 μm to 100 μm, for example, about 50 μm, and a height of 5 μm to 30 μm, for example, about 10 μm.

  As shown in FIG. 5, the first transparent base material 30 and the second transparent base material 31 are bonded via the first adhesive layer 60 across the first wiring layer 40 and the dot-like insulating member 36. As shown in FIG. 3, by providing the dot-shaped insulating member 36, a minute convex portion is formed on the surface of the first transparent substrate 30, and the first adhesive layer 60 is laminated so as to cover the convex portion. Thus, a so-called anchor effect is generated between the first transparent substrate 30 and the first adhesive layer 60. Thereby, it becomes possible to improve the adhesiveness between base materials effectively. Further, the height of the dot-like insulating member 36 is formed smaller than the thickness of the first wiring layer 40, and the first insulating member 36 and the first adhesive layer 60 can be added without adding a member. Since the transparent base material 30 and the second transparent base material 31 can be bonded, the adhesion can be improved without increasing the distance between the base materials. By effectively improving the adhesion using the anchor effect, the input device 1 according to the present embodiment can be applied to the first adhesive even when there is an influence of an external use environment such as high temperature and high humidity or a change with time. The layer 60 and the 1st transparent base material 30 do not peel, but the adhesiveness between base materials can be maintained. Furthermore, since the distance between the base materials is not increased, a comfortable input operation can be performed without increasing the input load during the operation of the input device 1, and the second transparent base material 31 and the decorative sheet 51 can be operated. A decrease in durability can also be suppressed.

  As shown in FIG. 3, a plurality of dot-like insulating members 36 are arranged in parallel on the outer periphery and the inner periphery of the first wiring layer 40 in the non-input region 21 of the first transparent substrate 30. Not limited to this, even when the dot-like insulating member 36 is formed on either the outer periphery or the inner periphery of the first wiring layer 40, the adhesion between the substrates can be improved. Moreover, it is also possible to arbitrarily set a place where the dot-shaped insulating member 36 is formed, such as a part of the outer periphery or the part of the inner periphery of the first wiring layer 40.

  Further, as shown in FIG. 3, the first wiring layer 40 is formed so as to surround the input region 20, and a step portion is formed by the first wiring layer 40 and the first transparent base material 30. The step portion is filled with the viscoelasticity of the first adhesive layer 60, and the first transparent substrate 30 and the second transparent substrate 31 are bonded. However, if the adhesiveness is lowered due to a change with time or a use environment such as high temperature and high humidity, the first adhesive layer 60 may be peeled off in the vicinity of the stepped portion, and a gap may be generated. In the input device 1 according to the present embodiment, by providing the dot-shaped insulating member 36 in the vicinity of the stepped portion, it is possible to improve the adhesion more reliably and prevent the generation of a gap in the stepped portion.

  As shown in FIG. 4, the Y2-side dummy wiring portion 40g extending in the X1-X2 direction and the X2-side wiring portion 40b extending in the Y1-Y2 direction are formed with a gap. As shown in FIG. 5, the cross-sectional shape of this portion includes a concave portion formed by the opposing Y2 side dummy wiring portion 40 g, X2 side wiring portion 40 b, and first transparent base material 30. Adhesiveness between the first adhesive layer 60 and the first transparent substrate 30 in such a recess when the first transparent substrate 30 and the second transparent substrate 31 are bonded together via the first adhesive layer 60. Is lower than the adhesion between each wiring portion around the recess and the first adhesive layer 60. Therefore, there is a possibility that a gap is generated in the concave portion, and there is a possibility that a vent hole that connects the space sandwiched between the base materials of the input device 1 and the outside is formed.

  In the input device 1 of this embodiment, the dot-shaped insulating member 36 is provided on the surface of the first transparent base material 30 between the facing wiring portions. Due to the anchor effect of the dot-like insulating member 36, the adhesion and sealing performance between the first adhesive layer 60 and the first transparent base material 30 in the recess can be reliably improved.

  Further, as shown in FIG. 5, it is preferable that the second wiring layer 41 of the second transparent base material 31 is formed to face the gaps between the plurality of wiring portions. In this way, the gap between the bases can be reduced around the concave portions formed by the opposing Y2 side dummy wiring part 40g, X2 side wiring part 40b, and the first transparent base material 30, so that the adhesion and sealing properties are improved. Can be improved effectively

  Thus, by improving the airtightness of the input device 1 of this embodiment, it becomes difficult to be influenced by the external environment such as temperature and humidity, and the durability of the input device 1 can be improved. In addition, the pressure in the space sandwiched between the base materials of the input device 1 is not reduced, and the gap between the base materials can be maintained for a long period of time, so it is possible to suppress the occurrence of Newton rings.

  FIG. 6 is a partially enlarged plan view of the first transparent base material 30 showing a first modification of the embodiment of the present invention. Moreover, about the input device 1 of the 1st modification which laminated | stacked the 1st transparent base material 30 and the 2nd transparent base material 31, it is a partial expanded sectional view cut | disconnected in the position corresponding to the VII-VII line of FIG. 7 shows.

  As shown in FIGS. 6 and 7, in the first modification, dot-like insulating members 36 are formed in the opposing gaps of the respective wiring parts constituting the first wiring layer 40, and the opposing wiring parts Are formed so as to straddle part of the dot-like insulating member 36. By providing the dot-like insulating member 36 and the wiring portion in this manner, the step formed by the first wiring layer 40 and the first transparent base material 30 can be relaxed. As a result, the first adhesive layer 60 is filled without a gap in the step portion between the first wiring layer 40 and the first transparent substrate 30, and the first transparent substrate 30 and the second transparent substrate 31 have good adhesion. Are pasted together. In particular, as shown in FIG. 7, in the concave portion formed by the pair of wiring portions arranged in opposition to each other and the first transparent base material 30, there is a gap when pasted through the first adhesive layer 60. Since it is likely to occur, it is possible to improve the sealing performance as well as the adhesion by providing the dot-like insulating member 36 as in this modification.

  In the first modification shown in FIGS. 6 and 7, the dot-shaped insulating member 36 is formed in the recess formed by the facing wiring portion and the first transparent base material 30. Not limited to this, as shown in FIGS. 3 and 4, a plurality of dot-shaped insulating members 36 may be arranged in parallel on the outer periphery and the inner periphery of the first wiring layer 40. If it carries out like this, the adhesiveness and sealing property between base materials can be improved more reliably. Further, even when the dot-shaped insulating member 36 is formed on either the outer periphery or the inner periphery of the first wiring layer 40, a part of the outer periphery of the first wiring layer 40, or a part of the inner periphery. It is possible to improve the adhesion and sealing between the substrates.

  The dot-like insulating members 36 shown in FIG. 3 to FIG. 7 are arranged at intervals from each other. However, the present invention is not limited to such an embodiment, and a plurality of dot-like insulating members 36 are connected and formed. Also good. FIG. 8 is a partially enlarged plan view of the first transparent base material 30 showing a second modification example of the first embodiment. In the second modified example, a plurality of dot-shaped insulating members 36 are formed so as to be densely connected to the surface of the first transparent substrate 30 in the gap where the Y2-side dummy wiring portion 40g and the X2-side wiring portion 40b face each other. is doing. Even in such a configuration, a large number of minute convex portions are formed in a region where a plurality of dot-shaped insulating members 36 are densely packed, so that the substrate is interposed between the substrate via the first adhesive layer 60 across the dot-shaped insulating members 36. When bonded, an anchor effect is produced by the convex portions of the dot-like insulating member 36, and adhesion is improved.

  In addition, when a plurality of dot-like insulating members 36 are connected so as to be densely connected to the concave portions formed by the facing wiring portions, the distance between the first transparent base material 30 and the second transparent base material 31 in the concave portions is small. Therefore, the level difference formed by the first wiring layer 40 is reduced, and it becomes possible to further improve the adhesion and the sealing performance.

  Next, a third modification of the present embodiment will be described. In FIG. 9, the top view of the surface which opposes the 1st transparent base material 30 about the 2nd transparent base material 31 is shown. FIG. 10 is a partial enlarged cross-sectional view of the second transparent base material 31 in FIG. 9 near the region B, and FIG. 11 corresponds to the XI-XI line in FIG. 10 for the input device 1 of the third modification. The partial expanded sectional view cut | disconnected by the position is shown.

  As shown in FIG. 9, the second transparent conductive layer 33 is formed in the input region 20 of the second transparent base material 31, and the input region 20 is formed in the non-input region 21 located on the outer periphery of the input region 20. A second wiring layer 41 is formed so as to surround it.

  The second wiring layer 41 includes a plurality of wiring portions, and the Y1-side wiring portion 41a is formed to extend in the X1-X2 direction in the non-input region 21 on the Y1 side of the input region 20. The Y2-side wiring portion 41b is formed to extend in the X1-X2 direction in the non-input region 21 on the Y2 side of the input region 20. The Y1 side wiring portion 41a and the Y2 side wiring portion 41b are in a state of being electrically connected to the second transparent conductive layer 33.

  The connection part 41e and the connection part 41f are terminals for connecting to an external flexible printed circuit board or the like, and are electrically connected to the Y2-side wiring part 41b and the Y1-side wiring part 41a, respectively. The non-input area 21 located on the X2 side of the input area 20 is formed with an X2-side dummy wiring portion 41d extending in the Y1-Y2 direction. Although the X2-side dummy wiring portion 41d in FIG. 9 is integrally connected to the Y1-side wiring portion 41a, the X2-side dummy wiring portion 41d is not limited to this and may be formed separately. The X2-side dummy wiring portion 41d is provided to make the distance between the base materials constant over the periphery of the input region 20 when the first transparent base material 30 and the second transparent base material 31 are stacked.

  In the input device 1 of the third modified example, a plurality of dot-like insulating members 36 are arranged in parallel in the non-input area 21 on the surface of the second transparent substrate 31 facing the first transparent substrate 30. The dot-shaped insulating member 36 is made of, for example, an acrylic ultraviolet curable resin and has a diameter of 20 μm to 100 μm, for example, about 50 μm, and a height of 5 μm to 30 μm, for example, about 10 μm.

  In the input device 1 of the third modified example of the present embodiment, the first transparent base material 30 and the second transparent base material are disposed across the second wiring layer 41 and the dot-like insulating member 36 via the first adhesive layer 60. 31 is bonded together. According to this, the adhesiveness between the 2nd transparent base material 31 and the 1st adhesion layer 60 can be improved.

  When the dot-like insulating member 36 is provided on either the first transparent base material 30 or the second transparent base material 31, the adhesion between the base materials can be improved. It becomes possible to improve. Further, the height of the dot-like insulating member 36 is formed smaller than the thickness of the first wiring layer 40 and the second wiring layer 41, and when the first transparent substrate 30 and the second transparent substrate 31 are bonded together. Since no member other than the first adhesive layer 60 and the dot-like insulating member 36 is required, the adhesion can be improved without increasing the distance between the substrates.

  Note that the arrangement of the dot-like insulating member 36 can be changed in various ways in the second transparent substrate 31, and the stepped portion of the second wiring layer 41 and the second transparent substrate 31 or a plurality of wiring portions are opposed to each other. By forming the gap in the gap, it is possible to more effectively improve the adhesion and sealing performance. Furthermore, the end portions of the wiring portions are stacked over a part of the dot-like insulating member 36, so that the adhesion and the sealing performance can be improved more reliably.

<Manufacturing method of input device>
Next, the manufacturing method of the input device 1 of this embodiment is demonstrated. In particular, a process of forming the dot-like insulating member 36 in the non-input area 21 of the first transparent base material 30 is shown in FIGS.

  First, the first transparent conductive layer 32 is formed on one surface of the first transparent substrate 30. The first transparent conductive layer 32 was formed by a sputtering method or a vapor deposition method using a transparent conductive material such as ITO (Indium Tin Oxide). Moreover, it is also possible to use the 1st transparent base material 30 in which the 1st transparent conductive layer 32 was formed previously. Next, as shown in FIG. 12A, dot spacers 38 are formed in the input region 20 of the first transparent base material 30 on which the first transparent conductive layer 32 is formed. The dot spacers 38 are formed by screen printing using an acrylic ultraviolet curable resin. The dot spacer 38 has a diameter of 20 μm to 100 μm, for example, a diameter of about 50 μm, and a height of 5 μm to 30 μm, for example, about 10 μm.

  A plurality of dot spacers 38 are arranged at intervals, and the first transparent conductive layer 32 and the second transparent conductive layer 33 are in contact with each other between the adjacent dot spacers 38 during the input operation of the input device 1, and input is performed. Detect location information. The dot spacer 38 is provided to prevent erroneous input and to prevent the conductive layers from always contacting each other.

  Next, the dot-shaped insulating member 36 is formed in the non-input area 21 of the first transparent base material 30 in the step of FIG. The dot-like insulating member 36 is formed by screen printing using an acrylic ultraviolet curable resin. The dot-shaped insulating member 36 is formed to have a diameter of 20 μm to 100 μm, for example, about 50 μm, and a height of 5 μm to 30 μm, for example, about 10 μm.

  After the step of FIG. 12B, ultraviolet rays are irradiated to cure the dot-like insulating members 36 and the dot spacers 38. By using an ultraviolet curable resin for the dot spacers 38 and the dot-like insulating members 36, a step of curing by heating is not required, so that it is possible to manufacture in a short time. Moreover, since there is little residual stress at the time of hardening, the curvature of the 1st transparent base material 30 does not arise.

  It is desirable to use the same acrylic ultraviolet curable resin for the dot-shaped insulating member 36 and the dot spacer 38, and form the dot-shaped insulating member 36 and the dot spacer 38 in the same printing process. According to this, since the dot-shaped insulating member 36 can be formed without adding a new process, the manufacturing cost can be reduced.

  Next, in the step of FIG. 12C, the first wiring layer 40 is formed so as to surround the input region 20 in the non-input region 21 of the first transparent base material 30. The first wiring layer 40 is formed by using a conductive paste containing a conductive material such as silver or copper by a printing method such as screen printing or inkjet printing. By using the printing method, the first wiring layer 40 can be easily formed at low cost.

  Next, the 2nd transparent base material 31 which consists of a film-form resin material is prepared, and the 2nd transparent conductive layer 33 and the 2nd wiring layer 41 are formed similarly to the 1st transparent base material 30. FIG. You may use the 2nd transparent base material 31 in which the 2nd transparent conductive layer 33 and the 2nd wiring layer 41 were formed previously. And on the input surface side of the 2nd transparent base material 31, the surface member 50 which consists of the decorating sheet 51 by which the decorating layer 52 was printed on the surface is bonded together.

  Next, in the non-input area 21 of the first transparent base material 30 formed in the steps of FIG. 12A to FIG. 12C, the first adhesive layer 60 extends across the first wiring layer 40 and the dot-shaped insulating member 36. Are laminated. Then, the input device 1 as shown in FIG. 1 is formed by bonding the first transparent base material 30 and the second transparent base material 31 through the first adhesive layer 60.

  According to the manufacturing method of the input device 1 of the present embodiment, the first transparent base material 30 and the second transparent base material 31 have the first adhesive layer 60 across the first wiring layer 40 and the dot-shaped insulating member 36. Glued through. By providing the dot-like insulating member 36, a minute convex portion is formed on the surface of the non-input area 21 of the first transparent base material 30. Thereby, an anchor effect occurs between the 1st transparent substrate 30 and the 1st adhesion layer 60, and it becomes possible to improve adhesiveness effectively. The height of the dot-like insulating member 36 is smaller than the thickness of the first wiring layer 40, and the dot-like insulating member 36 is bonded when the first transparent base material 30 and the second transparent base material 31 are bonded. Since no other member is required, the adhesion can be improved without increasing the distance between the substrates.

  12A to 12C show the step of forming the dot spacer 38, the dot-like insulating member 36, and the first wiring layer 40 on the surface of the first transparent substrate 30, the second transparent substrate The dot-like insulating member 36 can be formed also on the material 31. In the second transparent base material 31, it is not necessary to form the dot spacer 38, and the dot-shaped insulating member 36 is formed by the printing method in the non-input area 21 of the second transparent base material 31 on which the second transparent conductive layer 33 is formed. To do. It is possible to improve the adhesion between the substrates by providing the dot-shaped insulating member 36 on one of the first transparent substrate 30 and the second transparent substrate 31, but it is more reliable if provided on both. It is possible to improve the adhesion.

  In the step of FIG. 12B, the first wiring region 42 for forming the first wiring layer 40 is formed in the non-input region 21 of the first transparent base material 30 so as to have gaps where the plurality of wiring portions face each other. It is preferable to form the dot-shaped insulating member 36 so as to be provided in the gap. By so doing, when the first transparent base material 30 and the second transparent base material 31 are bonded together via the first adhesive layer 60, the first in the concave portion between the opposing wiring portion and the first transparent base material 30 is obtained. The adhesion between the transparent substrate 30 and the first adhesive layer 60 can be improved.

  Furthermore, a part of the dot-like insulating member 36 may be formed across the first wiring region 42. In this way, since the end portion of the first wiring layer 40 is stacked across a part of the dot-like insulating member 36, the stepped portion between the first transparent substrate 30 and the first wiring layer 40 is It is relieved by the dot-like insulating member 36. Therefore, it becomes easy to fill the stepped portion with the first adhesive layer 60 and bond the substrates together, so that it is possible to provide the input device 1 with good adhesion and airtightness.

1 ... Input device,
20 ... Input area 21 ... Non-input area 30 ... 1st transparent substrate 31 ... 2nd transparent substrate 32 ... 1st transparent conductive layer 33 ... 2nd transparent conductive layer 36 ... dot-like insulating member 38 ... dot spacer 40 ... first wiring layer 40a ... X1 side wiring part 40b ... X2 side wiring part 40g ... Y2 side dummy wiring part 41 ... 2nd wiring layer 41a ... Y1 side wiring part 41b ... Y2 side wiring part 41d ... X2 side dummy wiring part 42 ... 1st wiring area 50 ... Surface member 51 ... Decorating sheet 52 ... decorative layer 60 ... first adhesive layer 61 ... second adhesive layer

Claims (14)

A pair of transparent substrates arranged to face each other with a space;
A transparent conductive layer formed in each of input regions on opposite surfaces of the pair of transparent substrates;
A wiring layer formed in each non-input region on the outer periphery of the input region;
Having an adhesive layer for bonding the pair of transparent substrates;
A dot-shaped insulating member is formed in the non-input region of at least one of the transparent base materials,
The pair of transparent base materials are bonded via the adhesive layer across the wiring layer and the dot-shaped insulating member, and a step portion between the one transparent base material and the wiring layer is formed by the adhesive layer. An input device characterized by being filled.   The input device according to claim 1, wherein the dot-shaped insulating member is formed in the stepped portion.   In the non-input area, the wiring layer has a plurality of wiring portions and is formed so as to surround the input area, and the dot-shaped insulating member is formed in a gap between the plurality of facing wiring portions. The input device according to claim 1, wherein the input device is characterized.   The input device according to claim 3, wherein an end portion of the wiring portion is stacked over a part of the dot-shaped insulating member.   The said wiring layer is formed in the said other transparent base material facing the said clearance gap between these wiring parts in one said transparent base material, The Claim 3 or Claim 4 characterized by the above-mentioned. Input device.   The input device according to any one of claims 1 to 5, wherein a plurality of the dot-shaped insulating members are arranged side by side, and an uneven surface facing the adhesive layer is formed. A method for manufacturing an input device, comprising:
Forming a dot spacer in an input region of a transparent substrate having a transparent conductive layer formed on one surface;
Forming a dot-like insulating member in a non-input region on the outer periphery of the input region;
Forming a wiring layer comprising a plurality of wiring portions in the non-input region;
Laminating the adhesive layer across the wiring layer and the dot-like insulating member in the non-input region;
The manufacturing method of the input device characterized by including.   The method for manufacturing an input device according to claim 7, wherein the dot spacer and the dot-shaped insulating member are formed in the same process.   A wiring region for forming the wiring layer is provided in the non-input region so as to have a gap where the plurality of wiring portions face each other, and the step of forming the dot-shaped insulating member so as to be positioned in the gap. The method for manufacturing an input device according to claim 7 or 8, wherein:   In the non-input region, a step of setting a wiring region for forming the wiring layer and forming the dot-shaped insulating member across the wiring region and the non-input region outside the wiring region is included. 10. The method for manufacturing an input device according to claim 7, wherein any one of claims 7 to 9 is provided.   11. The method of manufacturing an input device according to claim 7, wherein a plurality of the dot-shaped insulating members are arranged side by side in the non-input area.   The method for manufacturing an input device according to claim 7, wherein the dot spacers and the dot-shaped insulating members are formed of an acrylic resin material.   The method for manufacturing an input device according to claim 7, wherein the dot-shaped insulating member is formed by a printing method. The method for manufacturing an input device according to claim 7, wherein the dot-shaped insulating member is formed of an ultraviolet curable resin.

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