JP2011128693A - Input device and method for producing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an input device that reduces reflection of light in a light-transmitting part between a lower substrate and an upper substrate with respect to an optical device such as a camera, increases transmittance, and increases sensitivity of the optical device. <P>SOLUTION: The input device includes a lower substrate 22 and an upper substrate 21 each having a transparent conductor film on a surface of a translucent base material. In the input device, the lower substrate 22 and the upper substrate 21 face each other across an air layer 44 such that the transparent conductor films face each other, and a surface of the upper substrate 21 located on an operation face side. The input device includes a light-transmitting part 41 embedded with a translucent medium 42 where an absolute value of a difference between the refractive index thereof and that of the substrates is smaller than an absolute value of a difference between the refractive index of the air layer 44 and that of the substrates, in a part between the lower substrate 22 and the upper substrate 21. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an input device having a lower substrate and an upper substrate arranged to face each other, and more particularly to a light transmission structure for an optical device such as a camera.

  The resistance type touch panel has a structure in which a lower substrate and an upper substrate having a transparent conductive film formed on the surface of a translucent substrate are opposed to each other with an air layer interposed therebetween.

  The upper substrate is flexible, and when pressed with a finger or a pen, the upper substrate is deformed and the transparent conductive films facing each other come into contact with each other. By measuring the partial pressure due to the resistance of the transparent conductive film at the time of the pressing operation in the X direction and the Y direction orthogonal to each other, the pressing position can be specified.

  Touch panels are mounted on various electronic devices such as mobile phones and digital cameras. Depending on the form of the electronic device, for example, the camera may be installed near the end of the touch panel.

  In the resistive touch panel, as shown in FIG. 9, a lower substrate 1 and an upper substrate 2 are arranged to face each other with an air layer 3 interposed therebetween. An end portion between the lower substrate 1 and the upper substrate 2 is bonded through a bonding layer 4 such as a double-sided tape.

  As shown in FIG. 9, the camera 5 is installed on the lower surface 1 a side of the lower substrate 1. The camera 5 is disposed at the outer end of the input area 15 of the touch panel where a liquid crystal display (not shown) is disposed.

  In the structure shown in FIG. 9, the space between the lower substrate 1 and the upper substrate 2 facing the camera 5 is an air layer 3a.

  However, the structure shown in FIG. 9 has a problem that light is easily reflected by the air layer 3a and the transmittance is lowered. Therefore, there is a problem that the sensitivity of the camera 5 is lowered.

  As in Patent Document 3 and Patent Document 4, a technique for injecting a liquid between a lower substrate and an upper substrate is known.

  However, even if such a structure for putting a liquid is applied to the touch panel having the structure shown in FIG. 9, it is difficult to inject the liquid uniformly between the lower substrate and the upper substrate, and the productivity is poor. However, it is considered that it is difficult to appropriately improve the sensitivity of the camera 5 because bubbles are easily introduced. In addition, there is a risk of liquid leakage, which is not practical.

  Moreover, as shown in Patent Document 1, when the decorative layer is formed in a shape surrounding the display screen, a part of the decorative layer may be removed to form a light transmission part in a region facing the camera or the like. Necessary.

  For example, as shown in FIG. 10, above the upper substrate 2 constituting the touch panel, a translucent surface base material 7 having an operation surface 6 on the surface and a lower surface 7a of the surface base material 7 are printed or the like. A decorative portion 8 is provided. As shown in FIG. 10, the decoration part 8 is comprised by laminating | stacking several decoration layers 8a-8c. In this way, the plurality of decorative layers 8a to 8c are stacked and colored in a predetermined color. A space 10 is formed in the light transmission part 9 in the decoration part 8 formed by laminating a plurality of decoration layers 8a to 8c, and the end part 8d of each decoration layer 8a to 8c of the decoration part 8 is height. Match the direction. For this reason, a steep step 11 is formed between the lower surface 8 e of the decorative portion 8 (the lower surface of the decorative layer 8 c formed on the lowermost side) and the lower surface 7 a of the surface base material 7.

  And as shown in FIG. 10, the surface layer 12 which consists of the surface base material 7 and the decoration part 8, and the upper board | substrate 2 are joined via the transparent adhesive sheet 13 for optics. The transparent adhesive sheet 13 is a material that can be deformed by pressure. However, as shown in FIG. 10, there is a steep step 11 between the lower surface 8 e of the decorative portion 8 and the lower surface 7 a of the surface base material 7. In addition, it is difficult to appropriately fill the step 11 with the transparent adhesive sheet 13, and the structure shown in FIG.

  If such a bubble 14 is present, irregular reflection occurs there, so that the sensitivity of an optical device such as a camera installed under the light transmitting portion 9 cannot be appropriately improved.

International Publication No. 2008/111505 JP 2009-123193 A JP-A-63-281190 JP 59-98528 A

  The present invention is intended to solve the above-described conventional problems, and in particular, to reduce the reflection of light in the light transmission portion between the lower substrate and the upper substrate with respect to an optical device such as a camera and improve the transmittance. An object of the present invention is to provide an input device that can improve the sensitivity of an optical device.

  Moreover, an object of this invention is to provide the manufacturing method of the input device which can suppress appropriately that a bubble arises between a surface layer provided with a decorating part, and an upper board | substrate.

The present invention has a lower substrate and an upper substrate on which a transparent conductive film is formed on the surface of a translucent substrate, and the lower substrate and the upper substrate have an air layer so that the transparent conductive films face each other. In an input device that is opposed to each other and the surface of the upper substrate is on the operation surface side,
A portion between the lower substrate and the upper substrate has a light transmission in which the absolute value of the difference in refractive index between each substrate is smaller than the absolute value of the difference in refractive index between the air layer and each substrate. It is characterized in that a light transmission part filled with a conductive medium is provided.

  Thereby, compared with the case where the said light transmissive part is an air layer, reflection of light can be made small and the transmittance | permeability can be improved.

  In the present invention, it is preferable that a space is formed at the position of the light transmitting portion in the bonding layer that bonds between the lower substrate and the upper substrate, and the light transmitting medium is filled in the space. . As a result, it is easy to form the light transmitting portion filled with the light transmitting medium at a predetermined position. Further, by providing a space in the bonding layer, even if the width of the bonding layer is narrowed, the space is filled with a light-transmitting medium, so that the bonding strength and mechanical strength between the lower substrate and the upper substrate can be improved. it can.

  In the invention, it is preferable that the bonding layer is formed so as to surround the periphery of the light transmission portion. The light transmission part can be partitioned, and the light transmission part can be appropriately filled with a light transmitting medium.

  In the present invention, it is preferable that a filling hole for filling the light transmitting portion with the light transmitting medium is formed in the lower substrate. For example, in a configuration in which both substrates are bonded with a translucent medium applied to at least one of the lower substrate and the upper substrate, bubbles may be generated or the translucent medium may protrude outside the input device. However, as in the present invention, by forming a filling hole in the lower substrate and injecting a translucent medium from the filling hole, the generation of bubbles can be reduced, and the translucent medium is placed outside the input device. It can be made difficult to protrude.

  In the present invention, it is preferable that an air escape hole is formed in the lower substrate for allowing air to escape when the translucent medium is filled from the filling hole. Thereby, it is possible to easily enter the translucent medium from the filling hole provided in the lower substrate.

In the present invention, the translucent medium is preferably an acrylic resin.
In the present invention, on the upper surface side of the upper substrate, a translucent surface base material provided with the operation surface, and a space provided at a position facing the light transmitting portion provided on the lower surface of the surface base material. A surface layer configured to have a decorative portion, and an adhesive layer interposed between the surface layer and the upper substrate,
A plurality of decorative layers are laminated on the decorative portion, and the end of each decorative layer is formed so as to extend into the space as the decorative layer is closer to the surface base material.
The adhesive layer preferably fills the space from the end of each decorative layer to the lower surface of the surface base material.

  For example, in a form (FIG. 10) in which the end portions of the decorative portions are aligned in the height direction, the lower surface of the decorative portion (the lower surface of the decorative layer farthest from the surface base material) and the lower surface of the surface substrate A steep step is formed between the adhesive layer and the pressure-sensitive adhesive layer cannot be appropriately filled with the step, and air bubbles are easily generated. By extending the decoration layer closer to the material into the space, a gentle slope can be formed at the end of each decoration layer, and therefore between the decoration portion and the surface substrate. Can be appropriately filled with the adhesive layer, and the generation of bubbles can be suppressed.

  In the present invention, the optical device can be applied to a configuration arranged on the lower surface side of the lower substrate facing the light transmission portion.

  In the present invention, as described above, since the light reflection can be reduced and the transmittance can be improved as compared with the case where the light transmission portion is an air layer, the optical device is disposed at a position facing the light transmission portion. By doing so, the sensitivity of the optical device can be improved.

  Further, the present invention is preferably applied to a configuration including an optical device including a camera and an optical sensor.

Further, the present invention provides a lower substrate and an upper substrate that are disposed to face each other and have a conductive film formed on an inner surface, a translucent surface base material that is disposed on an upper surface side of the upper substrate, and a lower surface of the surface base material In the manufacturing method of the input device having the surface layer having the decorative portion formed on the adhesive layer interposed between the surface layer and the lower substrate,
The decoration part is formed by laminating a plurality of decoration layers, and at this time, a space is formed in a predetermined region between the surface base material and the end of the decoration layer closer to the surface base material is closer to the space. A step of forming it to extend in,
Bonding the surface layer and the upper substrate through an adhesive layer, and filling the space from the end of each decorative layer to the lower surface of the surface base material with the adhesive layer; It is characterized by having.

  As in the present invention, the end of each decoration layer is formed so as to extend into the space as the decoration layer is closer to the surface base material, so that the end of each decoration section has a gentle slope. Can be formed. For this reason, when the adhesive layer is sandwiched between the surface layer and the upper substrate, the adhesive layer is deformed along the gentle inclination of the end of the decorative portion, and the space between the decorative portion and the surface base material Can be appropriately filled with the adhesive layer, and the generation of bubbles can be suppressed.

  According to the present invention, it is possible to reduce the reflection of light in the light transmitting portion between the lower substrate and the upper substrate with respect to an optical device such as a camera and improve the transmittance, and the surface layer including the decorating portion; It is possible to appropriately suppress the generation of bubbles between the upper substrate. Therefore, by installing an optical device such as a camera in the input device of the present invention, it is possible to appropriately improve the sensitivity of the optical device.

The exploded perspective view of the input device (touch panel) in this embodiment, The partial longitudinal cross-sectional view of the input device of this embodiment, Schematic diagram (vertical cross-sectional view) conceptually showing the characteristic part of the input device in the present embodiment, Schematic diagram (longitudinal sectional view) for explaining improvements of the input device of the present embodiment, (A) is the schematic diagram (vertical sectional view) which showed notionally the characteristic part of the input device in embodiment different from FIG. 3, (b) is a translucent medium in the input device of (a). Schematic diagram (longitudinal sectional view) showing the state of injected FIG. 3 is a schematic diagram (longitudinal sectional view) conceptually showing a characteristic part of an input device in an embodiment different from FIG. It is the schematic diagram (vertical cross-sectional view) which showed notionally the characteristic part different from FIG. 3 of the input device in this embodiment, (a)-(b) is a longitudinal cross-sectional view which shows a manufacturing process, An explanatory diagram showing the detection operation of the input device, Schematic diagram (vertical sectional view) for explaining the first technical problem of the input device, The schematic diagram (longitudinal sectional view) for demonstrating the 2nd technical subject of an input device.

  FIG. 1 is an exploded perspective view of an input device (touch panel) according to the present embodiment, FIG. 2 is a partial longitudinal sectional view of the input device according to the present embodiment, and shows the assembled input device of FIG. FIG. 3 is a schematic view (longitudinal sectional view) conceptually showing the characteristic part of the input device according to the present embodiment. FIG. 4 is a schematic diagram (longitudinal sectional view) conceptually showing the input device for explaining the problem, and FIG. 5A conceptually shows a characteristic part of the input device in another embodiment. It is a schematic diagram (longitudinal sectional view), (b) is a schematic diagram (vertical sectional view) showing a state in which a light-transmitting medium is injected into the input device of (a), and FIG. 6 is an input in another embodiment. Schematic diagram (longitudinal sectional view) conceptually showing the characteristic part of the device, FIG. 7 is a diagram of the input device in the present embodiment FIG. 8 is a schematic view (longitudinal sectional view) conceptually showing a characteristic part different from FIG. 2, (a) to (b) are longitudinal sectional views showing manufacturing steps, and FIG. 8 is an explanation showing a detection operation of the input device. FIG. 3 to 6 are illustrated at a ratio different from that of the cross-sectional view shown in FIG. 2 in order to emphasize the characteristic part.

  As shown in FIG. 1, the input device 20 in the present embodiment includes an upper substrate 21, a lower substrate 22, a bonding layer 23, and a flexible substrate 24 including an output electrode portion 25. . FIG. 1 shows a state in which a surface layer 26 having a decorative portion is superimposed on the surface of the upper substrate 21.

  As shown in FIGS. 1 and 2, the upper substrate 21 and the lower substrate 22 are bonded via a bonding layer 23.

  The lower substrate 22 is formed on the translucent base material 30, the transparent conductive film 31 formed on the upper surface of the translucent base material 30 (the inner surface facing the upper substrate 21), and the surface of the transparent conductive film 31. It has lower electrodes 32 and 32. The lower electrodes 32 and 32 are disposed in a peripheral portion 34 located on the outer periphery of the input region 33.

  As shown in FIGS. 1 and 2, the upper substrate 21 that faces the lower substrate 22 at a predetermined interval in the height direction includes a translucent base material 35 and a lower surface of the translucent base material 35 ( A transparent conductive film 36 formed on the inner surface facing the lower substrate 22, and a pair of upper electrodes 37, 37 formed on the surface of the transparent conductive film 36. The upper electrodes 37 and 37 are arranged in the peripheral portion 34 located on the outer periphery of the input region 33.

  The lower translucent substrate 30 is made of polycarbonate resin (PC resin), polyethylene terephthalate resin (PET resin), polyethylene naphthalate resin (PEN resin), cyclic polyolefin (COP resin), polymethyl methacrylate resin (acrylic) ( PMMA) and the like, and a thickness of about 50 μm to 300 μm. The lower translucent substrate 30 is preferably thicker and more rigid than the upper translucent substrate 35. For example, the lower light-transmitting substrate 30 is preferably formed of polyethylene naphthalate resin (PEN resin) or the like.

  The upper translucent substrate 35 is made of polycarbonate resin (PC resin), polyethylene terephthalate resin (PET resin), polyethylene naphthalate resin (PEN resin), cyclic polyolefin (COP resin), or polymethyl methacrylate resin (acrylic). It is a transparent substrate such as (PMMA), and is formed with a thickness of about 50 μm to 300 μm.

The transparent conductive films 31 and 36 are formed by depositing an inorganic transparent conductive material such as ITO (Indium Tin Oxide), SiO ₂ or ZnO by sputtering or vapor deposition. Alternatively, a fine powder of these inorganic transparent conductive materials may be fixed. Alternatively, an organic transparent conductive material coated with an organic conductive polymer such as carbon nanotube, polythiofin, or polypyrrole may be used. The thickness of each transparent conductive film 31, 36 is about 0.005 μm to 2 μm.

  Here, in this embodiment, translucency and transparency refer to a state where the visible light transmittance is 90% or more. Further, it is preferable that the haze value is 3 or less.

  The lower electrode 32 and the upper electrode 37 are formed by printing, for example, an Ag coating film. A conductive material having a lower resistance value than the transparent conductive films 31 and 36 is used for the lower electrode 32 and the upper electrode 37.

  In FIG. 2, the surfaces (inner surfaces) of the base materials 30 and 35 are flat surfaces, but the surfaces of the base materials 30 and 35 facing the liquid crystal display 81 are suppressed in order to suppress the occurrence of interference fringes and the like. For example, it may be a prism shape.

  The input device 20 shown in FIGS. 1 and 2 has a resistance touch panel structure, and is provided with an input area 33 in which an input operation can be performed. In this embodiment, the peripheral portion 34 located on the outer periphery of the input area 33 is a non-input area. An input area different from the input area 33 can be provided in the peripheral portion 34. As shown in FIG. 2, a liquid crystal display 81 is opposed to the input area 33.

  As shown in FIG. 2, an air layer 44 is provided between the lower substrate 22 and the upper substrate 21. Although not shown, a large number of dot spacers are provided in the air layer 44.

  As shown in FIGS. 1 and 2, an electrically insulating bonding layer 23 is provided between the lower substrate 22 and the upper substrate 21 and on the whole or a part of the peripheral portion 34. The space between the upper substrates 21 is fixed by the peripheral portion 34. The bonding layer 23 has, for example, a frame shape as shown in FIG. The bonding layer 23 is, for example, an acrylic resin adhesive tape, but is not limited to a material or the like. The thickness of the bonding layer 23 is about 5 μm to 200 μm. The bonding layer 23 is required to have an adhesive force capable of firmly bonding the lower substrate 22 and the upper substrate 21.

  When the operator presses the input area 33 downward with a finger or a pen, the upper substrate 21 bends downward and the transparent conductive films 31 and 36 come into contact with each other. At this time, when the transparent conductive films 31 and 36 are in contact with each other at a point P in FIG. 8, a voltage corresponding to a resistance value obtained by dividing the lower transparent conductive film 31 in the Y direction is obtained from the upper electrodes 37 and 37. A voltage corresponding to the resistance value obtained by dividing the transparent conductive film 36 in the X direction is obtained from the lower electrodes 32 and 32. And the position on the XY coordinate of P point can be detected by A / D converting each obtained voltage.

  As shown in FIG. 2, a camera 40 is installed on the lower surface 22 a of the peripheral portion 34 of the lower substrate 22. Unlike this embodiment, a support member made of a translucent base material is bonded to the lower surface 22a of the lower substrate 22 via a bonding layer, and the camera 40 may be installed on the lower surface of the support member. Good. Alternatively, in the embodiment in which the support member is provided, the support member is provided except for the area where the camera 40 and the optical sensor are installed, and the camera 40 is installed on the lower surface 22a of the lower substrate 22 as in FIG. It may be a configuration.

  As shown in FIGS. 2 and 3 (schematic diagram), a space 23 a is formed in the bonding layer 23 facing the camera 40 in the height direction (Z direction), and a light transmission portion 41 for the camera 40 is provided. Yes. The light transmitting portion 41 is formed at a position and a size at which light can be incident on the camera 40, and is formed as a region facing a lens portion (not shown) of the camera 40 or a slightly larger region. In the present embodiment, the light transmitting portion 41 is filled with a light transmitting medium 42. In the present embodiment, the absolute value of the difference in refractive index between the substrates 21 and 22 and the translucent medium 42 is smaller than the absolute value of the difference in refractive index between the substrates 21 and 22 and the air layer 44. ing. For this reason, as shown in the conventional example of FIG. 9, in this embodiment, the reflection of light can be reduced and the transmittance can be improved as compared with the case where the light transmitting portion is an air layer. For this reason, the sensitivity of the camera 40 can be improved.

  In the present embodiment, the translucent medium 42 is made of a material having a refractive index closer to the refractive index of each of the substrates 21 and 22 than air (refractive index is approximately 1.0). The refractive indexes of the substrates 21 and 22 are about 1.2 to 2.4, and the refractive index of the translucent medium 42 is about 1.2 to 2.0.

  The translucent medium 42 is not particularly limited as long as it is excellent in transparency (excellent transmittance and low haze value) and has the above-described refractive index. In the present embodiment, the UV curable acrylic type is used. Resins can be preferably used. Note that the translucent medium 42 is naturally more transparent than the bonding layer 23.

  In the form shown in FIG. 2, the lower substrate 22 and the upper substrate 21 that are in contact with the translucent medium 42 are the transparent conductive films 31 and 36, but the transparent conductive films 31 and 36 are formed in the light transmitting portion 41. Alternatively, the translucent medium 42 and the translucent base materials 30 and 35 may be in direct contact with each other.

  In the present embodiment, the lower substrate 22 and the upper substrate 21 can be bonded together with the translucent medium 42 applied to one inner surface of the lower substrate 22 or the upper substrate 21. However, in such a case, air bubbles 43 are generated in the transmissive medium 42 as shown in FIG. 4, and the transmissive medium 42 does not have a shape in which the outer side of the light transmitting portion 41 is surrounded by the bonding layer 23 as shown in FIG. There is a possibility that a part 42 a of the medium 42 protrudes outside the input device 20. In particular, when the bubble 43 is present in the light transmitting portion 41 of the camera 40, irregular reflection occurs there, causing the sensitivity of the camera 40 to decrease.

  Therefore, as shown in FIG. 5A, a filling hole 50 penetrating vertically is formed in the lower substrate 22 to fill the light transmitting portion 41 with the light transmitting medium 42, and as shown in FIG. The light transmissive medium 42 can be filled into the light transmissive portion 41 through the filling hole 50. In the structure of FIG. 5, first, the lower substrate 22 and the upper substrate 21 are bonded together via the bonding layer 23, and then the translucent medium 42 can be filled from the filling hole 50 formed in the lower substrate 22. Can be suppressed, and the translucent medium 42 can be prevented from protruding outside the input device 20.

  Further, the bonding layer 23 of the embodiment shown in FIG. 6 is formed so as to surround the periphery of the light transmission part 41 as in FIG. In FIG. 6, a filling hole 50 is formed in the lower substrate 22. Further, in the embodiment shown in FIG. 6, an air escape hole 51 is formed on the side facing the filling hole 50 with the light transmission portion 41 interposed therebetween. For this reason, the air existing in the light transmission part 41 can be released outward from the air escape hole 51 while injecting the light transmission medium 42 from the filling hole 50, and the light transmission part 41 is appropriately inserted into the light transmission part 41. Can be filled. In this embodiment, the generation of bubbles can be suppressed as in FIG. 5, and since the periphery of the light transmission part 41 is surrounded by the bonding layer 23, the translucent medium 42 can be prevented from protruding outward. .

  In the present embodiment, since the space 23a is formed in the light transmission portion 41 in the bonding layer 23, the width of the bonding layer 23 is narrowed and the bonding strength of the bonding layer 23 is likely to be reduced. In addition, since the space 23a is filled with the translucent medium 42, the bonding strength and mechanical strength can be improved, and the dust resistance and moisture resistance of the light transmitting portion 41 can be improved.

  In the present embodiment, as shown in FIG. 2, on the upper surface 21 a side of the upper substrate 21, a translucent surface base material 60 having an operation surface (the surface of the input region 33) and a lower surface of the surface base material 60 are provided. The surface layer 26 configured to include the decorated portion 61 is provided. Then, the surface layer 26 and the upper substrate 21 are bonded via an adhesive layer 62.

  As shown in FIGS. 1 and 2, the decoration unit 61 is provided in the input region 33, the camera region 63 facing the light transmission unit 41 formed between the lower substrate 22 and the upper substrate 21, and the sensor regions 64 and 65. Is not formed and is a space. This space is filled with an adhesive layer 62.

  FIG. 7A shows a partially enlarged longitudinal sectional view of the surface layer 26 in the camera region 63.

  As shown in FIG. 7A, in the decoration portion 61, a space 66 is formed in the camera region 63 (region facing the light transmission portion 41 shown in FIG. 2).

  As shown to Fig.7 (a), the decoration part 61 is comprised by laminating | stacking the some decoration layers 67-69. Each decoration layer 67-69 is formed by screen printing or the like. Each decoration layer 67-69 is colored, and the decoration part 61 seen through the surface base material 60 can be colored to a predetermined color by overlapping a plurality of decoration layers 67-69 in this way.

  In this embodiment, as shown to Fig.7 (a), the edge part of each decorating layer 67-69 is extended and formed in the space 66, so that the decorating layer near the surface base material 60 is formed. Therefore, the end portion 69 a of the upper decorative layer 69 extends most into the space 66, and the end portion 68 a of the intermediate decorative layer 68 extends into the space 66 more than the end portion 67 a of the lower decorative layer 67. I'm out. Therefore, the end part 61a of the decoration part 61 becomes a shape inclined gently compared with the form which arrange | positions the edge part of each decoration part like the structure shown in FIG.

  FIG. 7B shows the next step of FIG. As shown in FIG. 7B, the surface layer 26 and the upper substrate 21 are opposed to each other through the adhesive layer 62. A transparent adhesive sheet that can be deformed by pressure can be used for the adhesive layer 62.

  Then, the surface layer 26 and the upper substrate 21 are joined via the adhesive layer 62 as in the step shown in FIG. At this time, the pressure-sensitive adhesive layer 62 is deformed by applying pressure between the surface layer 26 and the upper substrate 21. In the present embodiment, as described with reference to FIG. 7A, the end portion 61 a of the decorating portion 61 has a gently inclined shape, so that the adhesive layer 62 is appropriately formed along the shape of the end portion 61 a. The space 66 formed from the end portion 61a of the decorative portion 61 to the lower surface of the surface base material 60 can be appropriately filled with the adhesive layer 62, and bubbles are generated compared to the structure shown in FIG. It becomes possible to suppress. Thereby, the occurrence of irregular reflection of light can be suppressed, and the sensitivity of the camera 40 can be improved more effectively.

  The step structure of the end 61 a of the decoration 61 provided on the surface layer 26 shown in FIG. 7 can also be applied to the end structure of the decoration 61 in the sensor regions 64 and 65 and the input region 33. Similar to the camera 40, the sensor areas 64 and 65 are areas facing an optical sensor (not shown) provided on the lower surface side of the lower substrate 22. In addition, a light transmission part filled with a translucent medium is formed between the lower substrate 22 and the upper substrate 21 facing the optical sensor. The optical sensor is a sensor that can sense ambient light or identify a fingerprint, but the type is not particularly limited. In addition, the manufacturing method described in FIG. 7 can be applied to any portion where the space is formed as long as the space is formed in the decorative portion and the space is filled with an adhesive layer. The present invention can be applied even when the input device is not a resistance type but a capacitance type touch panel.

  The input device in this embodiment is used for a mobile phone, a digital camera, a PDA, a game machine, a car navigation system, and the like.

20 Input device 21 Upper substrate 22 Lower substrate 23 Bonding layer 23a, 66 Space 26 Surface layer 30, 35 Translucent base material 31, 36 Transparent conductive film 32, 37 Electrode 33 Input region 34 Peripheral part 40 Camera 41 Light transmission part 42 Translucent medium 44 Air layer 50 Filling hole 51 Air escape hole 60 Surface base material 61 Decorating part 62 Adhesive layer 63 Camera region 64, 65 Sensor region 67 to 69 Decorating layer 81 Liquid crystal display

Claims (10)

It has a lower substrate and an upper substrate on which a transparent conductive film is formed on the surface of a translucent base material, and the lower substrate and the upper substrate face each other through an air layer so that the transparent conductive films face each other. In the input device in which the surface of the upper substrate is on the operation surface side,
A portion between the lower substrate and the upper substrate has a light transmission in which the absolute value of the difference in refractive index between each substrate is smaller than the absolute value of the difference in refractive index between the air layer and each substrate. An input device comprising a light transmission portion buried in a conductive medium.   The input device according to claim 1, wherein a space is formed at a position of the light transmission portion in a bonding layer that bonds the lower substrate and the upper substrate, and the light transmissive medium is filled in the space. .   The input device according to claim 2, wherein the bonding layer is formed so as to surround the periphery of the light transmission portion.   4. The input device according to claim 1, wherein a filling hole for filling the light transmitting portion with the light transmissive medium is formed in the lower substrate. 5.   The input device according to claim 4, wherein an air escape hole is formed in the lower substrate to allow air to escape when the translucent medium is filled from the filling hole.   The input device according to claim 1, wherein the translucent medium is an acrylic resin. On the upper surface side of the upper substrate, there is provided a translucent surface base material provided with the operation surface, and a decoration portion provided on the lower surface of the surface base material and provided with a space at a position facing the light transmission portion. A surface layer configured as described above, and an adhesive layer interposed between the surface layer and the upper substrate,
A plurality of decorative layers are laminated on the decorative portion, and the end of each decorative layer is formed so as to extend into the space as the decorative layer is closer to the surface base material.
The input device according to claim 1, wherein the adhesive layer fills the space from the end of each decorative layer to the lower surface of the surface base material.   The input device according to claim 1, wherein an optical device is disposed on a lower surface side of the lower substrate facing the light transmission part.   The input device according to claim 8, wherein the optical device is a camera or an optical sensor. A lower substrate and an upper substrate that are arranged to face each other and have a conductive film formed on the inner surface, a translucent surface base material that is disposed on the upper surface side of the upper substrate, and an additive formed on the lower surface of the surface base material. In the manufacturing method of the input device having the surface layer having the decorative portion, and the adhesive layer interposed between the surface layer and the lower substrate,
The decoration part is formed by laminating a plurality of decoration layers, and at this time, a space is formed in a predetermined region between the surface base material and the end of the decoration layer closer to the surface base material is closer to the space. A step of forming it to extend in,
Bonding the surface layer and the upper substrate through an adhesive layer, and filling the space from the end of each decorative layer to the lower surface of the surface base material with the adhesive layer; A method for manufacturing an input device, comprising:

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