WO2019039057A1

WO2019039057A1 - Input device

Info

Publication number: WO2019039057A1
Application number: PCT/JP2018/022898
Authority: WO
Inventors: 舛本　好史; 橋田　淳二; 真一樋口; 明紘武田; 志賀　貞一; 融澤田; 幸治塚本; 高橋　亨; 美幸佐藤
Original assignee: アルプスアルパイン株式会社
Priority date: 2017-08-22
Filing date: 2018-06-15
Publication date: 2019-02-28
Also published as: JP2020201521A

Abstract

According to one aspect of the present invention, an input device is provided with: a support base having a through-hole formed therein; a sensor part provided on the support base and having a plurality of electrodes and a lead-out pattern that is electrically connected to each of the plurality of electrodes; a decorative part provided above the sensor part with a resin therebetween and having a decorative layer, the decorative layer extending at least from above a portion of the lead-out pattern to above the through-hole; a first conductive pattern provided along the decorative layer; an electrical connection part provided between the sensor part and the decorative part and connecting the lead-out pattern and the first conductive pattern electrically; and an external connection wire part which is electrically connected to the first conductive pattern and led out to the back surface of the support base via the through-hole. This input device can lead out a wire toward the back surface of a panel without causing a deterioration in detection sensitivity and without degrading design properties.

Description

Input device

The present invention relates to an input device, and more particularly to an input device provided with a touch sensor that detects a position where a finger or the like has approached.

The touch panel, which is often used as an input device, includes a touch sensor that detects a position at which a finger or the like approaches a detection area (hereinafter, the approach includes a touch). For example, in a mutual capacitive touch panel, a drive side electrode and an output side electrode are provided, a drive pulse is applied to the drive side electrode, and a capacitance change due to a finger or the like is detected by the output side electrode doing.

In such a touch panel, a flexible substrate is connected to a panel peripheral portion or the like in order to obtain conduction with a detection electrode. Moreover, in order to make the flexible substrate invisible from the front side of the touch panel or to connect with a circuit on the back side of the panel, the flexible substrate is also pulled out to the back side of the panel.

Patent Document 1 discloses an input device having a sensor film provided with a conductive layer, a lead-out portion extended from the sensor film, and a front and back panel. In this input device, the front panel and the back panel are resin-molded integrally with the sensor film, and at least one of the front panel and the back panel is provided with a support portion for supporting the lead-out portion.

Patent Document 2 discloses a method of manufacturing a touch panel in which a decorative film and a sensor film are integrally molded and in-mold molded. In this touch panel, the wiring lead-out portion is drawn to the side of the substrate, and is drawn to the back side by a through hole.

In Patent Documents 3 and 4, a resin portion, a touch sensor embedded in the resin portion, a holding portion embedded in the resin portion, and an external connection connected to the touch sensor and partially fixed to the holding portion A part module comprising a part is disclosed. In the component module, the lead-out portion of the external connection portion is led from the resin portion in the thickness direction.

In Patent Document 5, a process of forming a circuit pattern on at least one of the front surface and the back surface on the film substrate having the front surface and the back surface, and using a male mold for the film substrate on which the circuit pattern is formed Forming a film substrate so as to conform to the outer surface of the male mold, and using a mold in contact with the opposite surface of the film substrate on which the circuit pattern is formed with the surface in contact with the male mold. And forming a mold to conform to the mold.

Patent Document 6 discloses a touch panel sensor in which a decorative layer is applied by screen printing or the like on the back surface of a panel, then a sensor wiring layer is transferred and formed on the back surface, and pattern formation is performed by exposure and etching.

JP, 2016-106314, A JP, 2014-056565, A JP, 2014-035805, A JP, 2014-035806, A JP, 2014-170637, A JP, 2016-031503, A

In the input device which is a touch panel, in the configuration in which conduction of the electrodes is obtained by sandwiching the flexible substrate between the touch sensor and the decorative portion, a step is generated with the thickness of the flexible substrate. When the panel of the input device is integrally formed of resin, distortion occurs in the decorated portion due to the step, which causes an influence on the appearance. On the other hand, it is conceivable to place a touch sensor on the side close to the back of the panel in order to make it easier to connect the lead-out to the back side of the panel, but the touch sensor becomes far from the panel surface and the detection sensitivity decreases. Invite.

An object of the present invention is to provide an input device capable of drawing out wiring on the back side of a panel without causing a decrease in detection sensitivity and without impairing the design.

In order to solve the above problems, one aspect of the present invention is a support base provided with a through hole, and a drawing pattern provided on the support base and conducting to a plurality of electrode parts and a plurality of electrode parts. A sensor unit having the above-mentioned structure, and a decoration unit provided via a resin on the sensor unit and having a decoration layer, wherein the decoration layer is provided from at least a part of the drawing pattern to the top of the through hole A first conductive pattern provided along the decorative layer, a conductive connection portion provided between the sensor unit and the decorative portion, for electrically connecting the lead pattern and the first conductive pattern, and a first conductive pattern And a wiring portion for external connection which is conducted and drawn out to the back surface of the support base through the through hole.

According to such a configuration, the first conductive pattern is provided along the decorative layer, and the external connection wiring portion is connected via the first conductive pattern and the conductive connection portion. And the wiring part for external connection is pulled out to the back surface of a support base material through the through-hole provided in the support base material. The first conductive pattern can be formed of a thin film, and even if the first conductive pattern is sandwiched between the sensor portion and the decorative portion, the generation of the step can be suppressed. In addition, since the sensor unit is disposed on the side of the decorative portion of the support base, a decrease in detection sensitivity can be avoided.

In the above input device, the conductive connection portion may be an anisotropic conductive adhesive. As a result, by bonding the sensor portion and the decoration portion with resin and pressing, the electrode and the first conductive pattern can be reliably conducted by the anisotropic conductive adhesive. The conductive connection portion may also be used for conduction between the lead-out pattern and the first conductive pattern.

In the above input device, the external connection wiring portion may be a flexible wiring board. Thus, the flexible wiring board can be drawn out to the back surface side of the support base through the through hole, and can be well connected to an external device (circuit) using the flexibility of the flexible wiring board.

In the above input device, the external connection wiring portion may be a connector disposed in the through hole. Thereby, connection with an external device (circuit) is performed by the connector disposed in the through hole. That is, the connection with the external device (circuit) can be easily performed by the connection with the connector on the back surface side of the support base material.

The input device further includes a ground electrode pattern provided along the decorative layer, and a second conductive pattern provided along the decorative layer and electrically connected to the ground electrode pattern, the second conductive pattern being grounded The external connection wiring portion may be provided so as to be electrically connected to the second conductive pattern. Here, the ground electrode pattern serves as an electromagnetic shield. Since this ground electrode pattern is provided in the decorative portion, it is not necessary to provide a separate shield layer.

According to the present invention, it is possible to provide an input device capable of extracting wiring on the back side of the panel without causing a decrease in detection sensitivity.

It is an exploded perspective view which illustrates the input device concerning this embodiment. It is a model top view which illustrates the sensor part of the input device concerning this embodiment. It is a model top view which illustrates the decoration film of the input device concerning this embodiment. It is a schematic cross section of a part of input device concerning this embodiment. It is a schematic cross section which shows a reference example. It is a model top view which illustrates resin. It is a schematic cross section which illustrates the wiring part for other external connection. FIG. 7 is an exploded perspective view illustrating another embodiment. It is a schematic diagram which shows the application example of an input device.

Hereinafter, embodiments of the present invention will be described based on the drawings. In the following description, the same members are denoted by the same reference numerals, and the description of the members once described will be omitted as appropriate.
(Configuration of input device)
FIG. 1 is an exploded perspective view illustrating an input device according to the present embodiment.

FIG. 2 is a schematic plan view illustrating the sensor unit of the input device according to the embodiment.

As shown in FIG. 1, the input device 1 according to the present embodiment includes a support base 15, a sensor unit 10 provided on the support base 15, and a decoration in which the sensor unit 10 and the first direction D1 overlap one another. A film (decorated portion) 20 is provided. A surface cover 30 may be provided on the decorative film 20. The input device 1 is, for example, a touch panel. The input device 1 is mounted on a display device 100 such as liquid crystal. In the present embodiment, the surface cover 30 side of the input device 1 is also referred to as the front side (surface side), and the side opposite to the surface cover 30 is also referred to as the back side (back side).

The supporting base 15 is, for example, a molded resin, and is a member for arranging the sensor unit 10. The support base 15 is provided with a through hole 15 h. The through holes 15 h are provided in the peripheral area outside the detection area SA in the support base 15.

The sensor unit 10 is, for example, a capacitive touch sensor, and performs position detection based on a change in electrostatic capacitance when a finger or the like approaches the detection area SA. The sensor unit 10 is disposed on the support base 15. The sensor unit 10 includes a first electrode 11 and a second electrode 12 which are translucent electrode units provided in the detection area SA of the support base 15. The first electrode 11 and the second electrode 12 are formed on a base film 110 (see FIG. 4) described later.

The base film 110 is a flexible film having translucency such as PET (polyethylene terephtalate), COP (cycloolefin polymer), COC (cyclic olefin copolymer), etc., a rigid translucent plate such as acrylic resin, polycarbonate resin, etc. The sensor film is formed by forming a translucent electrode on the base film 110.

The first electrode 11 extends in one direction (for example, the X direction) along the surface of the base film 110, and the second electrode 12 extends along the surface of the base film 110 in the direction orthogonal to the one direction (for example, Y direction) Extends to The first electrode 11 and the second electrode 12 are insulated from each other. In the present embodiment, the plurality of first electrodes 11 are disposed at a predetermined pitch in the Y direction, and the plurality of second electrodes 12 are disposed at a predetermined pitch in the X direction.

Although there are various patterns of electrodes constituting the first electrode 11 and the second electrode 12, in the present embodiment, each of the first electrode 11 and the second electrode 12 has a plurality of island-shaped electrode portions. Each insular electrode portion has, for example, a shape close to a rhombus.

Since the first electrode 11 and the second electrode 12 are provided at positions overlapping with the detection area SA, the first electrode 11 and the second electrode 12 have translucency so as to transmit an image displayed by the display device 100. Therefore, a translucent conductive material (ITO (Indium Tin Oxide), SnO ₂ , ZnO, conductive nanomaterial, metal material formed in a mesh shape, etc.) is used for the first electrode 11 and the second electrode 12 .

Terminals 155 are provided in the peripheral area outside the detection area SA of the base film 110. The lead-out pattern 150 electrically connected to the first electrode 11 and the second electrode 12 extends to the peripheral area, and is connected to the terminal portion 155. The terminal portion 155 is connected to a first conductive pattern 251 described later.

A decorative film 20 is provided on the sensor unit 10 (the side on which the first electrode 11 and the second electrode 12 are formed). The decorative film 20 has a light transmitting base film 21 and a decorative layer 22 provided on the base film 21. The decorative layer 22 is provided in the peripheral area which is the outside of the detection area SA. By covering the peripheral area with the decorative layer 22, the lead-out pattern 150 and the terminal portion 155 can be prevented from being visually recognized from the outside. Further, the decorative layer 22 can constitute a part of the appearance design.

The decorative film 20 is attached on the sensor unit 10 by a resin 50 (see FIG. 4) described later. The resin 50 is an adhesive layer, and preferably a translucent adhesive such as OCA (Optical Clear Adhesive) is used. However, the lower side of the decorative layer 22 may not have translucency, and a colored resin 50 may be used. A surface cover 30 is provided on the decorative film 20. The surface cover 30 is a thin plate-like member having translucency of glass or plastic.

In the present embodiment, the configuration in which panel-like and film-like members such as the support base 15, the sensor unit 10, the decorative film 20, and the surface cover 30 are laminated in the first direction D1 is illustrated. The member obtained by laminating the part 10 and the decorative film 20 is integrally molded with a resin (IMD: In-mold Decoration, IML: In-Mold Laminating, TOM: Three dimension Overlay Method, etc.) You may shape | mold into the laminated structure (planar type, curved type | mold, etc.) which covered the sensor part 10 and the decoration film 20 with resin containing the surface cover 30. FIG.

In such an input device 1, the first conductive pattern 251 is provided along the decoration layer 22 of the decoration film 20. The first conductive pattern 251 is a conductive pattern electrically connected to the first electrode 11 or the second electrode 12 of the sensor unit 10. The first conductive pattern 251 is disposed from the position of the decorative layer 22 to above the through hole 15 h.

FIG. 3 is a schematic plan view illustrating the decorative film of the input device according to the embodiment.

The top view which looked at the decoration film 20 from the back surface (surface facing the sensor part 10) is shown by FIG. In addition, although the decoration layer 22 only shows the code | symbol in FIG. 3 on account of description, the decoration layer 22 is provided in the peripheral area of the outer side of detection area SA.

FIG. 4 is a schematic cross-sectional view of part of the input device according to the present embodiment.

A plurality of first conductive patterns 251 are provided in the peripheral area outside the detection area SA. The first conductive pattern 251 is provided on the sensor unit 10 side of the decorative layer 22. The end (one end 251a) proximal to the detection area SA of each of the plurality of first conductive patterns 251 is a position where it faces the terminal portion 155 of the sensor unit 10 when the decorative film 20 is superimposed on the sensor unit 10. It becomes. On the other hand, the end (the other end 251 b) distal to the detection area SA of each of the plurality of first conductive patterns 251 is located above the through hole 15 h of the support base 15.

A conductive connection portion 40 is provided between the first conductive pattern 251 of the decorative film 20 facing each other and the terminal portion 155 of the sensor portion 10 in a state in which the sensor portion 10 and the decorative film 20 are superimposed. As the conductive connection portion 40, an anisotropic conductive adhesive or the like is used. The conductive connection portion 40 electrically connects the first conductive pattern 251 and the terminal portion 155.

By such connection, a conduction path is formed from the first electrode 11 and the second electrode 12 to the first conductive pattern 251 through the lead pattern 150 and the conductive connection portion 40. The external connection wiring portion 70 is provided in the through hole 15 h of the support base 15. A flexible wiring board 710 is used for the external connection wiring portion 70.

The flexible wiring substrate 710 includes a flexible base material 711 such as polyimide, a wiring pattern 712 formed on the base material 711, and a protective layer 713 covering the wiring pattern 712. The flexible wiring board 710 is disposed in the through hole 15 h so as to bend its tip. The wiring pattern 712 in the portion bent in the through hole 15 h and the first conductive pattern 251 extended to the top of the through hole 15 h face each other and are connected by the conductive connection portion 40.

As a result, the first conductive pattern 251 and the wiring pattern 712 of the flexible wiring substrate 710 are electrically connected, and the wiring pattern 712 is drawn to the back surface side of the support base 15 by the flexible wiring substrate 710. The flexible wiring board 710 drawn to the back surface side of the support base 15 is used as a drawing member for connecting to an external device (circuit). By utilizing the flexibility of the flexible wiring board 710, the connection between the input device 1 and the external device (circuit) can be managed well.

Since the first conductive pattern 251 is formed on the decorative layer 22 by screen printing or the like, it can be formed very thinly. For example, the thickness of the first conductive pattern 251 is 4 μm. For this reason, even if the first conductive pattern 251 is sandwiched between the sensor unit 10 and the decorative film 20, almost no step due to the thickness of the first conductive pattern 251 occurs.

FIG. 5 is a schematic cross-sectional view showing a reference example.

In the input device 2 shown in the reference example, the flexible wiring board 80 is used for connection with the lead-out pattern 150. The flexible wiring substrate 80 is sandwiched between the sensor unit 10 and the decorative film 20. The conductive pattern 82 of the flexible wiring substrate 80 and the lead-out pattern 150 of the sensor unit 10 are connected by the conductive connection portion 40 at a position sandwiching the flexible wiring substrate 80.

The flexible wiring substrate 80 has a configuration in which a conductive pattern 82 and a cover film 83 covering the conductive pattern 82 are provided on a flexible base 81 such as polyimide. The thickness of the flexible substrate 81 is about 20 μm, and the total thickness of the flexible wiring substrate 80 is about 65 μm. When the flexible wiring substrate 80 having such a thickness is sandwiched between the sensor unit 10 and the decorative film 20, a step d is generated in the decorative film 20 due to the influence of the thickness. Such a step d causes distortion in the decorative film 20 and affects the appearance.

On the other hand, in the input device 1 according to the present embodiment, no step is generated in the decorative film 20 because the base having a thickness such as the flexible wiring substrate 80 is not held. Since the first conductive pattern 251 provided along the decorative layer 22 and the flexible wiring board 710 drawn out from the through hole 15 h to the back surface side of the support base 15 are used as the lead-out wiring members to the outside, a decorative film Almost no level difference will occur at 20. In particular, even when the surface cover 30 or the like of the input device 1 is integrally formed with the sensor unit 10 and the decorative film 20, no distortion due to a step is generated in the decorative film 20, which affects the designability Absent.

Further, since the sensor unit 10 is disposed on the side of the support film 15 on the decorative film 20 side, a decrease in detection sensitivity is avoided as compared to the case where the sensor unit 10 is provided near the back surface side or back surface of the support substrate 15 can do.

In the input device 1 according to the present embodiment, the ground electrode pattern 60 (see FIG. 3) may be provided along the decorative layer 22. The ground electrode pattern 60 is provided, for example, at a position overlapping the decorative layer 22 in the peripheral area of the detection area SA. The ground electrode pattern 60 has, for example, a mesh-like pattern. The decorative film 20 is provided with a second conductive pattern 252, and the second conductive pattern 252 and the ground electrode pattern 60 are electrically connected. The second conductive pattern 252 is conductively connected to the wiring pattern 712 of the flexible wiring board 710 disposed in the through hole 15 h by the conductive connection portion 40.

The second conductive pattern 252 is at the ground potential. Thus, the ground electrode pattern 60 serves as an electromagnetic shield. Since the ground electrode pattern 60 is provided on the decorative film 20, it is not necessary to provide a separate shield layer.

FIG. 6 is a schematic plan view illustrating the resin 50. As shown in FIG.

The resin 50 is provided between the sensor unit 10 and the decorative film 20 and serves as an adhesive layer for bonding the two together. The resin 50 is in the form of a sheet, and the sensor unit 10 and the decorative film 20 are bonded together by heating and pressing the resin 50. A hole 50 h is provided in the resin 50 in the form of a sheet before being heated and pressurized. The holes 50h are provided, for example, in a rectangular shape.

When bonding the sensor unit 10 and the decorative film 20 with the resin 50, first, the sheet-like resin 50 is placed on the sensor unit 10. At this time, the terminal portion 155 of the lead-out pattern 150 is disposed inside the hole 50 h. Next, for example, an anisotropic conductive adhesive, which is the conductive connection portion 40, is applied to the terminal portion 155 in the hole 50h. Next, the decorative film 20 is placed on the resin 50 in this state. Thereby, the one end portion 251 a of the first conductive pattern 251 of the decorative film 20 and the terminal portion 155 are connected by the conductive connection portion 40 in the hole 50 h. In addition, the other end 251 b of the first conductive pattern 251 is located above the hole 50 h.

When the sensor unit 10 and the decorative film 20 sandwiching the resin 50 in this state are heated and pressurized, a laminated structure in which both are bonded with the resin 50 is configured. By providing the holes 50 h in the resin 50, the one end portion 251 a of the first conductive pattern 251 and the terminal portion 155 can be surely connected by the conductive connection portion 40 without being blocked by the resin 50. Here, in the case where the resin 50 is formed over the entire formation region and the non-formation region of the decorative layer 22 in the decorative film 20, it is preferable to use a translucent resin as the resin 50. However, in the formation region of the decorative layer 22 in the decorative film 20, a colored light shielding resin 50 may be used. In this case, a translucent resin can be used in the non-formation region of the decoration layer 22 of the decoration film 20, and a coloring resin can be used in the formation region of the decoration layer 22. Furthermore, when the decorative layer 22 is formed over the whole of the decorative film 20, either a translucent resin or a colored resin may be used as the resin 50.

Thereafter, the flexible wiring board 710 is inserted into the through hole 15 h, and the wiring pattern 712 of the flexible wiring board 710 and the other end 251 b of the first conductive pattern 251 are connected by the conductive connection portion 40. The flexible wiring substrate 710 is previously connected to the other end 251 b of the first conductive pattern 251 of the decorative film 20 before the sensor unit 10 and the decorative film 20 are attached to each other, and When bonding the decorative film 20 with the resin 50, the end portion of the flexible wiring substrate 710 may be passed through the through hole 15h, and then bonding may be performed.

FIG. 7 is a schematic cross-sectional view illustrating another external connection wiring portion.

A connector 720 is used for the external connection wiring portion 70 shown in FIG. The connector 720 is disposed in the through hole 15 h of the support base 15. The terminal 721 of the connector 720 is connected to the first conductive pattern 251 and the second conductive pattern 252 in the through hole 15 h by the conductive connection portion 40.

The connector 720 may be inserted into the through hole 15 h after forming the support base 15, or may be incorporated by insert molding when the support base 15 is formed.

Connected to the connector 720 is a mating connector 750 attached to a wire electrically connected to the outside (circuit). Thereby, the connection with the external device (circuit) can be easily performed by the connection with the connector 720 and the mating connector 750 on the back surface side of the support base 15. Further, by using the connector 720, it is possible to freely attach and detach to and from the mating connector 750. Furthermore, it is not necessary to extend the member for pulling out from the back surface side of the support base 15.
(Other embodiments)
FIG. 8 is an exploded perspective view illustrating another embodiment.

In the input device 1 </ b> B shown in FIG. 8, the decorative layer 22 is provided on substantially the entire surface of the decorative film 20. A button display unit 221 is provided on part of the decorative layer 22. The button display portion 221 may be a portion where the light transmittance of the decorative layer 22 is adjusted, or may be a portion where color and shape (pattern) are different from those of other portions, or where the decorative layer 22 is not provided. It may be a light (for example, transparent) part.

At least one of the display device 100 and the light source 200 is provided on the opposite side of the sensor unit 10 to the decorative film 20. For example, the light source 200 is used when the button display portion 221 is a portion where the light transmittance of the decorative layer 22 is adjusted or a portion where color and shape (pattern) are changed from other portions. That is, the light source 200 is used as a backlight, and the button display unit 221 is displayed in place of other parts. Moreover, when the button display part 221 is a light transmission part, the display apparatus 100 is used. As a result, the display image of the display device 100 can be displayed on the button display unit 221. The light source 200 may be used when the button display portion 221 is a light transmitting portion. In this case, light emitted from the light source 200 can be transmitted from the button display unit 221.
(Example of application)
FIG. 9 is a schematic view showing an application example of the input device.

FIG. 9 shows an example in which the

input devices

1 and 1B of the present embodiment are applied to an instrument panel P and a floor console C of a mobile unit V such as an automobile.

The sensor unit 10 of the

input device

1 or 1B may be provided continuously from the instrument panel P to the floor console C, or is divided into a portion of the instrument panel P and a portion of the floor console C. It is also good. When divided, the conduction of the sensor unit 10 divided by the extending portion 25 of the decorative film 20 may be obtained.

For example, the instrument panel P has a portion (non-forming area 22b) where the decorative layer 22 of the decorative film 20 is not provided, and the display device 100 is disposed here. A sensor unit 10 is provided on the display device 100 and functions as a touch panel. In the example shown in FIG. 10, the button panel 221 or the floor console C is provided with the button display unit 221 by the decorative layer 22, and the sensor unit 10 and the display device 100 or the light source are provided on the back side of these button display units 221. Two hundred are provided. Thereby, displaying a desired design on the button display portion 221 of the decorative layer 22 is realized, and various operations can be performed by touching the button display portion 221.

As described above, according to the present embodiment, the input device 1 can be provided that can draw the wiring on the back surface side of the support base 15 without causing a decrease in detection sensitivity and without impairing the design. It becomes possible.

Although the present embodiment has been described above, the present invention is not limited to these examples. For example, those skilled in the art may appropriately add, delete, or change the design of the components from the above-described embodiments, or may appropriately combine the features of the embodiments and the features of the present invention. As long as it is, it is included in the scope of the present invention. For example, the moving body V may be other than a car, and is exemplified by an aircraft, a ship, a motorcycle and the like. Further, the input device can be used as an input unit of various devices such as portable terminals, personal computers, home appliances, machine tools and the like.

1, 1 B, 2 Input device 10 Sensor portion 11 First electrode 12 Second electrode 15 Support base 15 h Through hole 20 Decorative film 21 Base film 22 Decorative layer 22 b Non-forming area Reference Signs List 30 surface cover 40 conductive connection portion 50 resin 50 h hole 60 ground electrode pattern 70 wiring portion 80 for external connection flexible wiring substrate 81 flexible base material 82 conductive pattern 83 cover film 100 display Device 110: Base film 150: Draw-out pattern 155: Terminal portion 200: Light source 221: Button display portion 251: First conductive pattern 251a: One end portion 251b: Other end portion 252: Second conductive pattern 710: Flexible wiring board 711: Base Material 712 ... Wiring pattern 713 ... Protective layer 720 ... Connector 721 ... Terminal 750 ... Counterpart connector C ... Floor conso D1 ... first direction P ... instrument panel SA ... detection region V ... mobile d ... step

Claims

A supporting substrate provided with a through hole;
A sensor section provided on the support base material and having a plurality of electrode sections and a lead pattern electrically connected to each of the plurality of electrode sections;
A decorative portion provided on the sensor portion via a resin and having a decorative layer, wherein the decorative layer is provided from at least a portion of the lead-out pattern to above the through hole;
A first conductive pattern provided along the decorative layer;
A conductive connection portion provided between the sensor portion and the decorative portion and electrically connecting the lead-out pattern and the first conductive pattern;
An external connection wiring portion electrically connected to the first conductive pattern and drawn out to the back surface of the support base via the through hole;
An input device equipped with
The input device according to claim 1, wherein the conductive connection portion is an anisotropic conductive adhesive.
The input device according to claim 1, wherein the external connection wiring portion is a flexible wiring board.
The input device according to claim 1, wherein the external connection wiring portion is a connector disposed in the through hole.
A ground electrode pattern provided along the decorative layer;
A second conductive pattern provided along the decorative layer and electrically connected to the ground electrode pattern;
And further
The second conductive pattern is drawn from the connection position with the ground electrode pattern to above the through hole,
The input device according to any one of claims 1 to 4, wherein the external connection wiring portion is electrically connected to the second conductive pattern.