WO2017154617A1

WO2017154617A1 - Electrostatic capacity sensor

Info

Publication number: WO2017154617A1
Application number: PCT/JP2017/007071
Authority: WO
Inventors: 笹川　英人; 朝川　隆司; 威史大坂; 裕高島
Original assignee: アルプス電気株式会社
Priority date: 2016-03-11
Filing date: 2017-02-24
Publication date: 2017-09-14
Also published as: JP2019079081A

Abstract

As an electrostatic capacity sensor capable of providing ESD countermeasures and suppressing discoloration of a display part containing an electroconductive material, the provided electrostatic capacity sensor 1 has, in a non-detection area 25 at a part between a panel 3 and a base material 2, a display part 41 which contains an electroconductive material and shield wiring 18 which can be electrically connected to an electroconductive part set to the ground potential, wherein a distance D1 between the most proximal end face 3c of the panel 3 closest to the display part 41 and the end of the display part 41 proximal to the most proximal end face 3c is longer than a distance D2 between the end of the shield wiring 18 proximal to the most proximal end face 3c and the most proximal end face 3c.

Description

Capacitive sensor

The present invention relates to a capacitance type sensor, and more particularly to a capacitance type sensor capable of improving electrostatic discharge resistance.

Patent Document 1 discloses a portable electronic device having a metal decoration layer on the back surface facing the bottom surface of a recessed portion of a display transparent window. In the mobile phone device described in Patent Document 1, a communication hole penetrating into the housing is formed in the wall portion that forms the bottom surface of the recess. In addition, a conductive portion electrically connected to the ground conductor of the circuit board is disposed on the inner wall surface side opposite to the concave bottom surface of the wall portion.

According to the cellular phone device described in Patent Document 1, even if static electricity flows between the display transparent window and the recess, the static electricity can be released to the ground conductor of the circuit board through the communication hole.

JP 2005-322994 A

However, in the mobile phone device described in Patent Document 1, the metal decoration layer is disposed on the side of the display translucent window as viewed from the communication hole. Moreover, the distance between the edge part of the light transmission window for a display and a metal decoration layer is shorter than the distance between the edge part of the light transmission window for a display, and the edge part of a communicating hole. Therefore, when ESD (Electro Static Discharge) occurs and creeping discharge occurs along the end face of the display light transmission window, electricity generated by ESD may pass through the metal decoration layer before passing through the communication hole. There is. When electricity generated by ESD flows to the communication hole via the metal decoration layer, the metal decoration layer undergoes a state change based on the flow of electricity, and is visually recognized as a discoloration of the metal decoration layer. There is.

The present invention is for solving the above-described conventional problems, and can take measures against ESD and suppress discoloration of a display unit (corresponding to the metal decoration layer of Patent Document 1) including a conductive material. An object of the present invention is to provide a capacitive sensor.

In one aspect, the capacitive sensor of the present invention has a light-transmitting panel having one light-transmitting surface as an operation surface, and a light-transmitting base material provided with a transparent electrode on at least one main surface. And the base material is disposed opposite to a main surface opposite to the operation surface of the panel, and the capacitance sensor is a method of operating the panel. A detection region that can detect an operation on the operation surface when viewed from the direction along the line, and a non-detection region located on the outer peripheral side of the detection region, and the panel and the base material in the non-detection region A decorative layer that reduces the light transmittance of the non-detection region, a display portion including a conductive material, and a shield wiring that can be electrically connected to a portion that is conductive and set to a ground potential. The end of the panel closest to the display The distance between the most proximal end surface and the end proximal to the most proximal end surface of the display portion is between the proximal end end closest to the most proximal end surface and the most proximal end surface of the shield wiring. It is longer than the distance.

In this specification, “a member is provided on a surface (including a case where the member is a part of the surface)” means that the member adheres (deposits) to the member constituting the surface. This means not only the case where the member is in contact with the surface but also the case where another member is interposed between the member and the surface.

In the above-described capacitance type sensor, the shield wiring is located closer to the display unit than the display unit, as viewed from the nearest end surface of the panel located at the nearest position of the display unit. For this reason, ESD (Electro Static Discharge) occurs in the capacitive sensor due to, for example, an operator's finger touching the operation surface of the panel. Even when creeping discharge occurs, electricity that tries to flow between the panel and the base material flows preferentially to the shield wiring rather than to the display section. . In this way, electricity generated by ESD flows through the shield wiring to a portion set to the ground potential, so that the electricity generated by ESD can be prevented from flowing through the display portion by the shield wiring.

In the above capacitive sensor, the display unit may be located between the panel and the decorative layer. In this case, when viewed from the operation surface side, the display unit is arranged with the decoration layer as a background, and thus the design of the display unit may be improved.

The shield wiring may be located between the base material and the decorative layer. In this case, when viewed from the operation surface side, the shield wiring is hidden by the decorative layer and is not visually recognized, so the degree of freedom in selecting the material of the shield wiring is increased.

In the above-described capacitance type sensor, the decoration layer and the display unit may be provided on a main surface of the panel opposite to the operation surface. In this case, since the member positioned between the decorative layer and the display unit and the base material is not visually recognized from the operation surface side, various members (such as wiring) may be provided on the surface of the base material facing the panel. it can.

In the above capacitive sensor, the distance between the proximal end surface of the display unit proximal to the proximal end surface and the proximal end surface is the distance from the proximal end surface of the shield wiring to the distal end surface. It may be longer than the distance between the nearest end face. In this case, since the entire display unit is farther from the most proximal end face than the shield wiring, when electricity generated by ESD flows between the panel and the substrate from the nearest end face, The possibility of electricity flowing is reduced more stably.

The shield wiring may include a first shield wiring provided on a surface of the base material facing the panel, or provided on a main surface of the panel opposite to the operation surface. The second shield wiring may be included. Since the shield wiring has both the first shield wiring and the second shield wiring, when electricity generated by ESD flows between the panel and the base material from the nearest end face, the electricity is displayed on the display unit. In some cases, the possibility of flowing into the tank is reduced in a particularly stable manner.

The electrostatic capacitance sensor may further include a wiring portion that is positioned between the decorative layer and the base material and electrically connects the transparent electrode and the external connection portion. In this case, the distance between the end portion proximal to the nearest end face and the nearest end face in the wiring portion is such that the end portion proximal to the nearest end face and the nearest end face in the shield wire are It is preferable that it is longer than the distance between. According to this, the shielding effect with respect to a wiring part can be improved. That is, even when creeping discharge based on ESD occurs, the electricity flowing between the panel and the base material from the nearest end face flows preferentially to the shield wiring rather than the wiring part, and the current flowing through the wiring part It is possible to prevent the wiring portion from being damaged due to excessively large.

In the case where the wiring portion and the shield wiring are arranged as described above, the wiring portion has a portion overlapping with the display portion when viewed from the direction along the normal line of the operation surface of the panel. Also good. When there is an overlapping portion as described above in the wiring portion and the display portion, if an excessive current flows in the wiring portion, there is a possibility that electricity from the wiring portion flows into the display portion in the overlapping portion. However, as described above, since the wiring portion is protected from ESD by the shield wiring, it is appropriately suppressed that an excessive current flows in the wiring portion. Therefore, even if there is a portion overlapping with the wiring portion, electricity generated by ESD hardly flows through the display portion. Therefore, the arrangement relationship between the wiring portion and the display portion can be set more freely.

The shield wiring may have at least one of a portion provided on the end surface of the base material and a portion provided on the end surface of the panel. Even when a creeping discharge based on ESD occurs, a part where the shield wiring is provided on the end face of the base material and / or the panel rather than electricity flowing between the panel and the base material from the nearest end face Preferentially flows into the portion provided on the end face. For this reason, it can suppress that electricity flows into the display part located between a panel and a base material.

According to the aspect of the present invention, even when creeping discharge occurs due to ESD in the capacitance type sensor, it is shielded that electricity based on the creeping discharge flows to the display unit located between the panel and the substrate. Suppressed by wiring. For this reason, the electrostatic capacitance type sensor which can suppress the discoloration of the display part containing an electroconductive material while taking an ESD countermeasure is provided.

It is a typical perspective view showing the electrostatic capacitance type sensor which concerns on this embodiment. It is a typical top view showing the capacitive sensor which concerns on this embodiment. FIG. 3 is a schematic enlarged view showing a region A shown in FIG. 2 in an enlarged manner. It is a typical top view showing the composition of the capacitance type sensor concerning this embodiment. FIG. 5 is a schematic cross-sectional view taken along a cutting plane C1-C1 shown in FIG. FIG. 5 is a schematic cross-sectional view taken along a cutting plane C2-C2 shown in FIG. It is a typical top view showing other shield wiring of this embodiment. It is a typical sectional view showing other shield wiring of this embodiment. It is a typical sectional view showing other shield wiring of this embodiment. It is a typical top view showing other shield wiring of this embodiment. It is a typical sectional view showing other shield wiring of this embodiment.

Embodiments of the present invention will be described below with reference to the drawings. In addition, in each drawing, the same code | symbol is attached | subjected to the same component and detailed description is abbreviate | omitted suitably.
FIG. 1 is a schematic perspective view showing a capacitive sensor according to the present embodiment. FIG. 2 is a schematic plan view showing the capacitive sensor according to the present embodiment. FIG. 3 is a schematic enlarged view showing the area A shown in FIG. 2 in an enlarged manner.

In the present specification, “transparent” and “translucent” refer to a state where the visible light transmittance is 50% or more (preferably 80% or more). Furthermore, the haze value is preferably 6% or less. In the present specification, “light shielding” and “light shielding” refer to a state where the visible light transmittance is less than 50% (preferably less than 20%).

As shown in FIG. 1, the capacitive sensor 1 according to this embodiment includes a base material 2 and a panel 3. The base material 2 has translucency and is formed of a film-like transparent base material such as polyethylene terephthalate (PET), a glass base material, or the like. A transparent electrode or the like is provided on one main surface of the substrate 2. Details of this will be described later. The panel 3 has translucency. The material of the panel 3 is not particularly limited. As a material of the panel 3, a glass substrate or a plastic substrate is preferably applied.

As shown in FIGS. 1 to 3, the capacitive sensor 1 includes a detection region 11 and a non-detection region 25 when viewed from the direction along the normal of the surface on the panel 3 side. The detection area 11 is an area where an operation body such as a finger can be operated, and the non-detection area 25 is a frame-shaped area located on the outer peripheral side of the detection area 11. The non-detection region 25 is shielded by a decorative layer 9 described later, and light (external light is exemplified) from the surface on the panel 3 side to the surface on the base material 2 side in the capacitive sensor 1 and the base material. Light from the surface on the second side to the surface on the panel 3 side (light from the backlight of the display device used in combination with the capacitive sensor 1 is not easily transmitted through the non-detection region 25). It has become. A display unit 41 is provided in the non-detection area 25. The display part 41 is provided as a logo part (logotype (logotype)), for example, and includes a conductive material. Examples of the material of the display unit 41 include conductive materials such as Cu-based, Al-based, Cr-based, Au-based, and Ag-based materials. As described above, an example of the material of the display unit 41 is a conductive material having a metal mirror effect. Thereby, a mirror effect is obtained in the display unit 41 and a high-class feeling is obtained.

As shown in FIG. 3, a shield wiring 18 is provided in the non-detection region 25. The shield wiring 18 has conductivity and is formed of a material having a metal such as Cu, Cu alloy, CuNi alloy, Ni, Ag, or Au. The shield wiring 18 is formed of an ink containing a metal material, for example, by screen printing. Alternatively, the shield wiring 18 may be formed of a material having a metal by sputtering or vapor deposition. Alternatively, the shield wiring 18 may be formed of ink containing a carbon-based conductive material, for example, by screen printing.

The shield wiring 18 is provided on the outer side (the side away from the detection region 11) when viewed from the display unit 41, and can be electrically connected to a portion of the flexible printed circuit board 29 that is set to a ground potential as a reference potential, for example. Has been. This will be further described with reference to the drawings.

FIG. 4 is a schematic plan view showing the configuration of the capacitive sensor according to the present embodiment. Although the transparent electrode is transparent and cannot be visually recognized, FIG. 4 shows the outer shape of the transparent electrode for easy understanding.
FIG. 5 is a schematic cross-sectional view taken along the cutting plane C1-C1 shown in FIG.
FIG. 6 is a schematic cross-sectional view taken along the section C2-C2 shown in FIG.

The capacitive sensor 1 according to this embodiment includes a base material 2, a first electrode 8, a second electrode 12, a panel 3, a shield wiring 18, a display unit 41, and a decoration layer 9. And comprising.

The first electrode 8 is disposed in the detection region 11 and has a plurality of first transparent electrodes 4. As shown in FIG. 5, the plurality of first transparent electrodes 4 are principal surfaces located on the Z1 side (hereinafter referred to as “O”) of the principal surfaces having the direction along the Z1-Z2 direction in the substrate 2 as a normal line. It may be abbreviated as “front surface”.) 2a. Each first transparent electrode 4 is connected in the Y1-Y2 direction (first direction) via an elongated connecting portion 7. The first electrodes 8 having a plurality of first transparent electrodes 4 connected in the Y1-Y2 direction are arranged at intervals in the X1-X2 direction.

The first transparent electrode 4 and the connecting portion 7 are made of a transparent conductive material such as ITO (Indium Tin Oxide) by sputtering or vapor deposition. Examples of the transparent conductive material include, besides ITO, metal nanowires typified by silver nanowires, thin metals formed in a mesh shape, or conductive polymers. This also applies to the transparent conductive material described later. *

The second electrode 12 is disposed in the detection region 11 and has a plurality of second transparent electrodes 5. As shown in FIG. 6, the plurality of second transparent electrodes 5 are provided on the front surface 2 a of the substrate 2. Thus, the 2nd transparent electrode 5 is provided in the same surface (front surface 2a of the base material 2) as the 1st transparent electrode 4. FIG. As shown in FIGS. 5 and 6, each second transparent electrode 5 is connected to the X1-X2 direction (second direction) via the elongated bridge wiring 10. The second electrodes 12 having a plurality of second transparent electrodes 5 connected in the X1-X2 direction are arranged at intervals in the Y1-Y2 direction. Note that the X1-X2 direction intersects the Y1-Y2 direction. For example, the X1-X2 direction intersects the Y1-Y2 direction perpendicularly.

The second transparent electrode 5 is formed of a transparent conductive material such as ITO by sputtering or vapor deposition. The bridge wiring 10 is formed of a transparent conductive material such as ITO. Alternatively, the bridge wiring 10 may have a first layer containing a transparent conductive material such as ITO and a second layer made of a transparent metal having a lower resistance than the first layer. When the bridge wiring 10 has a laminated structure of the first layer and the second layer, the second layer is preferably formed of any one selected from the group consisting of Au, Au alloy, CuNi, and Ni. It is. Among these, it is more preferable to select Au. When the second layer is formed of Au, the bridge wiring 10 can obtain good environmental resistance (humidity resistance, heat resistance).

As shown in FIGS. 5 and 6, an insulating layer 20 is provided on the surface of the connecting portion 7 that connects the first transparent electrodes 4 to each other. As shown in FIG. 6, the insulating layer 20 fills the space between the connecting portion 7 and the second transparent electrode 5, and is slightly on the surface of the second transparent electrode 5. As the insulating layer 20, for example, a novolac resin (resist) is used.

5 and 6, the bridge wiring 10 is provided from the surface 20a of the insulating layer 20 to the surface of each second transparent electrode 5 located on both sides of the insulating layer 20 in the X1-X2 direction. The bridge wiring 10 electrically connects the second transparent electrodes 5.

As shown in FIGS. 5 and 6, an insulating layer 20 is provided on the surface of the connecting portion 7 that connects the first transparent electrodes 4, and each second transparent electrode 5 is provided on the surface of the insulating layer 20. A bridge wiring 10 is provided to connect the two. As described above, the insulating layer 20 is interposed between the connecting portion 7 and the bridge wiring 10, and the first transparent electrode 4 and the second transparent electrode 5 are electrically insulated. In the present embodiment, since the first transparent electrode 4 and the second transparent electrode 5 are provided on the same surface (the front surface 2a of the base material 2), the capacitive sensor 1 can be thinned. realizable.

Note that the connecting portion 7, the insulating layer 20, and the bridge wiring 10 are all located in the detection region 11, and have translucency similarly to the first transparent electrode 4 and the second transparent electrode 5.

As shown in FIG. 4, in the non-detection region 25, a plurality of wiring portions 6 led out from the first electrodes 8 and the second electrodes 12 are formed. Each of the first electrode 8 and the second electrode 12 is electrically connected to the wiring portion 6 via the connection wiring 16. As shown in FIG. 4, each wiring unit 6 is connected to an external connection unit 27 that is electrically connected to the flexible printed circuit board 29. That is, each wiring part 6 electrically connects the first electrode 8 and the second electrode 12 and the external connection part 27. The external connection unit 27 is electrically connected to the flexible printed circuit board 29 through, for example, a conductive paste.

Each wiring part 6 is formed of a material having a metal such as Cu, Cu alloy, CuNi alloy, Ni, Ag, or Au. The connection wiring 16 is made of a transparent conductive material such as ITO, and extends from the detection region 11 to the non-detection region 25. The wiring portion 6 is stacked on the connection wiring 16 in the non-detection region 25 and is electrically connected to the connection wiring 16.

The wiring part 6 is provided in the part located in the non-detection area | region 25 in the front surface 2a of the base material 2, as shown in FIG.5 and FIG.6. Similarly to the wiring portion 6, the external connection portion 27 is also provided in a portion located in the non-detection region 25 on the front surface 2 a of the base material 2.

In FIG. 4, for ease of understanding, the wiring portion 6 and the external connection portion 27 are displayed so as to be visually recognized. However, in actuality, as shown in FIGS. A panel 3 is provided so as to face the front surface 2a. The panel 3 has translucency. Of the main surfaces of the panel 3 having a direction along the Z1-Z2 direction as a normal line, the main surface located on the Z1 side (the main surface opposite to the main surface 3b facing the front surface 2a of the substrate 2) ) 3a is a surface on the side where the capacitive sensor 1 is operated, and is also referred to as an “operation surface” in this specification. The material which comprises the panel 3 is not limited. Examples of such materials include organic materials such as polycarbonate and inorganic materials such as glass. The panel 3 may have a laminated structure. A specific example of the laminated structure is a laminated structure in which a hard coat layer made of an inorganic material is formed on a film made of an organic material. The shape of the panel 3 may be a flat plate shape or another shape. For example, the operation surface 3a of the panel 3 may be a curved surface, and the surface shape of the operation surface 3a of the panel 3 and the Z2 side of the main surface with the direction along the Z1-Z2 direction in the panel 3 as a normal line. The surface shape of the positioned main surface (in other words, the main surface opposite to the operation surface 3a and may be abbreviated as “back surface” hereinafter) 3b may be different.

A decorative layer 9 having a light-shielding property is provided in a portion located in the non-detection region 25 on the back surface 3b of the panel 3. In the capacitive sensor 1 according to this embodiment, the decoration layer 9 is provided on the entire portion located in the non-detection region 25 on the back surface 3 b of the panel 3. For this reason, when the capacitive sensor 1 is viewed from the operation surface 3 a side of the panel 3, the wiring portion 6 and the external connection portion 27 are hidden by the decorative layer 9 and are not visually recognized. The material which comprises the decoration layer 9 is arbitrary as long as it has light-shielding property. The decorative layer 9 may have insulating properties.

As shown in FIGS. 5 and 6, the panel 3 is joined to the base material 2 via an optical transparent adhesive layer (OCA) 30 provided between the base material 2 and the panel 3. . The optical transparent adhesive layer (OCA) 30 is made of an acrylic adhesive, a double-sided adhesive tape, or the like.

In the capacitive sensor 1 shown in FIG. 1, when a finger F is brought into contact with the operation surface 3 a of the panel 3 as an example of an investigation team as shown in FIG. 6, the first transparent electrode close to the finger F and the finger F is used. 4 and between the finger F and the second transparent electrode 5 close to the finger F, capacitance occurs. The capacitive sensor 1 can calculate the contact position of the finger F based on the capacitance change at this time. The capacitance type sensor 1 detects the X coordinate of the position of the finger F based on the capacitance change between the finger F and the first electrode 8, and detects the X coordinate between the finger F and the second electrode 12. The Y coordinate of the position of the finger F is detected based on the capacitance change (self-capacitance detection type).

Alternatively, the capacitance type sensor 1 may be a mutual capacitance detection type. In other words, the capacitive sensor 1 applies a driving voltage to one of the first electrode 8 and the second electrode 12, and either the first electrode 8 or the second electrode 12 is applied. A change in capacitance between the other electrode and the finger F may be detected. Thereby, the capacitive sensor 1 detects the Y coordinate of the position of the finger F by the other electrode, and detects the X coordinate of the position of the finger F by the one electrode.

The arrangement of the first transparent electrode 4 and the second transparent electrode 5 shown in FIGS. 4 to 6 is an example, and is not limited to this. The capacitance type sensor 1 only needs to detect a change in capacitance between the operation body such as the finger F and the transparent electrode, and calculate the contact position of the operation body with respect to the operation surface 3a. For example, the first transparent electrode 4 and the second transparent electrode 5 may be provided on different main surfaces of the substrate 2.

As shown in FIG. 4, a display portion 41 is provided in a portion located in the non-display area 25 on the back surface 3 b of the panel 3. As described above with reference to FIGS. 1 to 3, the display unit 41 is provided as a logo unit, for example, and includes a conductive material. In FIG. 5, the display unit 41 is located between the back surface 3 b of the panel 3 and the decoration layer 9. By arrange | positioning in this way, when the electrostatic capacitance type sensor 1 is seen from the operation surface 3a side, the display part 41 is arrange | positioned by using the decoration layer 9 as a background. As a result, the design of the display unit 41 may be improved. In this case, the capacitive sensor 1 can give a higher sense of quality. In addition, as above, the display part 41 may be located between the back surface 3b of the panel 3 and the decoration layer 9, or between the back surface 3b of the panel 3 and the decoration layer 9. It may have a part which is not located in.

The shield wiring 18 is located between the base material 2 and the decorative layer 9 in the non-detection region 25 and is provided on the outer peripheral side (side away from the detection region 11) from the wiring unit 6 and the display unit 41. As described above with reference to FIGS. 1 to 3, the shield wiring 18 has conductivity, and can be electrically connected to a portion of the flexible printed circuit board 29 that is set to a ground potential, for example, as a reference potential. .

In the cross-sectional view shown in FIG. 5, the distance D 1 between the closest end surface 3 c that is the end surface of the panel 3 closest to the display unit 41 and the end portion of the display unit 41 that is proximal to the closest end surface 3 c of the panel 3 is The distance D2 between the most proximal end face 3c of the panel 3 and the end portion of the shield wiring 18 that is proximal to the nearest end face 3c of the panel 3 is longer.

The distance D1 between the most proximal end surface 3c of the panel 3 and the end portion of the display unit 41 that is proximal to the nearest end surface 3c of the panel 3 is the distance between the most proximal end surface 3c of the panel 3 and the panel 3 in the shield wiring 18. It is longer than the distance D11 between the distal end face 3c and the distal end (end proximal to the detection region 11). That is, an end portion of the shield wiring 18 that is distal from the most proximal end face 3c of the panel 3 (between the nearest end face 3c of the panel 3 and an end portion of the display unit 41 that is proximal to the nearest end face 3c of the panel 3). That is, the end portion proximal to the detection region 11 is located. According to this, the display unit 41 is located inside the shield wiring 18 (proximal to the detection region 11).

For this reason, in the capacitive sensor 1, ESD (Electro Static Discharge) occurs due to the proximity of the finger F to the operation surface 3a of the panel 3, for example, and creeping discharge occurs based on the ESD. Even in this case, since the display unit 41 is located inside the shield wiring 18 (proximal to the detection region 11), the electricity flowing between the panel 3 and the base material 2 due to creeping discharge is It flows preferentially to the shield wiring 18 over 41. For this reason, the electricity generated by the ESD flows to the portion of the flexible printed circuit board 29 that is set to the ground potential, for example, as the reference potential via the shield wiring 18 and is prevented from flowing to the display unit 41. Thus, by appropriately setting the arrangement of the shield wiring 18 and the display unit 41, it is possible to take measures against ESD and suppress discoloration of the display unit 41 including a conductive material.

The shield wiring 18 is provided on the front surface 2a of the base material 2. Therefore, in the step of forming the first transparent electrode 4 and the second transparent electrode 5 on the front surface 2a of the base material 2, the shield wiring 18 can be formed on the front surface 2a of the base material 2. it can. Thereby, the efficiency of the process which forms the shield wiring 18 can be improved, and manufacturing cost can be reduced.

Note that the wiring part 6 may be provided at a position closer to the detection region 11 than the shield wiring 18, like the two-dot chain line wiring part 6 shown in the cross-sectional view of FIG. 5. In this case, as shown in FIG. 5, the distance D12 between the most proximal end surface 3c of the panel 3 and the end portion of the wiring portion 6 that is proximal to the most proximal end surface 3c is the most proximal position of the panel 3. The distance D2 is longer than the distance D2 between the end face 3c and the end of the shield wiring 18 that is proximal to the most proximal end face 3c of the panel 3. Then, when viewed from the direction along the normal line of the operation surface 3a of the panel 3 (Z1-Z2 direction in FIG. 5), the wiring portion 6 has a portion overlapping the display portion 41.

According to this, the shielding effect with respect to the wiring part 6 can be enhanced. In the above configuration, the end portion of the wiring portion 6 that is proximal to the most proximal end surface 3c of the panel 3 is inside the end portion of the shield wiring 18 that is proximal to the most proximal end surface portion 3c of the panel 3 (in the detection region 11). (Proximal). Therefore, even when creeping discharge based on ESD occurs, the electricity that flows between the panel 3 and the base material 2 from the nearest end face 3c flows preferentially to the shield wiring 18 rather than the wiring portion 6. It is suppressed that the electric current which flows through the wiring part 6 becomes excessive, and the wiring part 6 is damaged.

In addition, since the wiring unit 6 has a portion overlapping the display unit 41 as described above, the arrangement relationship between the wiring unit 6 and the display unit 41 can be set more freely. When the wiring part 6 and the display part 41 have overlapping portions as described above, if an excessive current flows in the wiring part 6, electricity from the wiring part 6 may flow into the display part 41 in the overlapping part. There is. However, since the wiring part 6 is protected from ESD by the shield wiring 18 as described above, an excessive current is prevented from flowing through the wiring part 18 appropriately. Therefore, even if there is an overlapping part with the wiring part 6, it is difficult for electricity generated by ESD to flow through the display part 41.

Note that the shield wiring 18 is not limited to being directly connected to the portion set to the ground potential as long as electricity can flow through the portion set to the ground potential. That is, the shield wiring 18 only needs to be able to flow electricity to the portion set to the ground potential when the electricity generated by the ESD flows, and is electrically floating before the electricity generated by the ESD flows. Also good.

Further, the shield wiring 18 may have at least one of a portion provided on the end surface 2 c of the substrate 2 and a portion provided on the end surface of the panel 3. Even in the case where creeping discharge based on ESD occurs in the capacitance type sensor 1, the electricity generated by ESD is generated in the portion of the shield wiring 18 provided on the end surface 2 c of the substrate 2 or in the shield wiring 18. A portion provided on the end face such as the nearest end face 3c of the panel 3 preferentially flows, and electricity generated by ESD is suppressed from flowing between the panel 3 and the base material 2 to reach the display unit 41. . Thereby, the display part 41 containing an electroconductive material can be efficiently protected from ESD, and the discoloration of the display part 41 can be suppressed more.

FIG. 7 is a schematic plan view showing another shield wiring of this embodiment. FIG. 7 corresponds to a schematic enlarged view in which the area A shown in FIG. 2 is enlarged.

The shield wiring 18 of the capacitive sensor 1 shown in FIG. 3 is arranged linearly in the vicinity of the display unit 41, whereas the shield wiring 18A of the capacitive sensor 1A shown in FIG. In the vicinity of the display 41, it has a bent portion. In such a bent portion, the distance D1 between the proximal end surface 3c of the panel 3 and the end portion proximal to the proximal end surface 3c of the panel 3 in the display unit 41 is the shield 3 of the panel 3 and the shield. It is longer than the distance D3 between the end of the wiring 18A and the proximal end to the most proximal end face 3c of the panel 3. Since the shield wiring 18A and the display unit 41 are arranged in this manner, the electricity generated by ESD is suppressed from flowing to the display unit 41 as in the case of the capacitive sensor 1 shown in FIG. The

On the other hand, in a portion other than the portion where the display unit 41 is provided, the distance D1 between the nearest end surface 3c of the panel 3 and the end portion of the display unit 41 proximal to the nearest end surface 3c of the panel 3 is The distance D9 is shorter than the distance D9 between the most proximal end surface 3c of the panel 3 and the end of the shield wiring 18A that is proximal to the most proximal end surface 3c of the panel 3. That is, the shield wiring 18 A is disposed so as to surround the display unit 41 at the bent portion. Since the shield wiring 18 A has such a bent portion, it is possible to achieve both suppression of the electricity generated by ESD flowing to the display unit 41 and securing the degree of freedom of arrangement of the shield wiring 18.

FIG. 8 is a schematic cross-sectional view showing still another shield wiring of the present embodiment. FIG. 8 corresponds to a schematic cross-sectional view taken along the cutting plane C1-C1 shown in FIG.

8, the shield wiring 18 B is provided on the surface 9 a proximal to the base material 2 of the decorative layer 9. Since the decoration layer 9 is provided on the back surface 3b of the panel, in other words, the shield wiring 18B is provided on the back surface 3b of the panel with the decoration layer 9 as an intervening member. In this specification, for easy understanding, the shield wiring provided on the front surface 2a of the substrate 2 is referred to as “first shield wiring” (the shield wiring 18 shown in FIG. 5 corresponds). The shield wiring provided on the back surface 3b of the panel 3 may be referred to as “second shield wiring” (the shield wiring 18B shown in FIG. 8 corresponds).

As shown in the cross-sectional view of FIG. 8, the distance D1 between the most proximal end face 3c of the panel 3 and the end proximal to the nearest end face 3c of the panel 3 in the display unit 41 is the nearest end face 3c of the panel 3. And a distance D4 between the shield wiring 18B and the end portion proximal to the nearest end face 3c of the panel 3 in the shield wiring 18B. In addition, the distance D1 between the most proximal end surface 3c of the panel 3 and the end portion of the display unit 41 that is proximal to the nearest end surface 3c of the panel 3 is the distance between the most proximal end surface 3c of the panel 3 and the panel 3 in the shield wiring 18B. It is longer than the distance D13 between the distal end face 3c and the distal end (end proximal to the detection region 11). That is, between the proximal end face 3c of the panel 3 and the end proximal to the proximal end face 3c of the panel 3 in the display unit 41, an end (distal from the proximal end face 3c of the panel 3 in the shield wiring 18B) The end proximal to the detection region 11) is located. According to this, the display part 41 will be located inside the shield wiring 18B (proximal to the detection region 11). The other structure is the same as the structure of the capacitive sensor 1 described above with reference to FIGS.

In this case, the shield wiring 18B can be positioned closer to the display unit 41 than when the shield wiring is provided on the front surface 2a of the base member 2. Therefore, even when creeping discharge based on ESD occurs in the capacitive sensor 1B, the electricity flowing between the base material 2 and the panel 3 is more preferential to the shield wiring 18B than the display unit 41. Flowing into. For this reason, electricity generated by ESD more stably flows through the shield wiring 18B to the portion of the flexible printed circuit board 29 that is set to the ground potential, for example, as the reference potential. Therefore, electricity generated by ESD flows to the display unit 41 more stably by the shield wiring 18B. Thus, by appropriately setting the arrangement of the shield wiring 18B and the display unit 41, it is possible to take ESD countermeasures and more stably suppress discoloration of the display unit 41 including a conductive material.

FIG. 9 is a schematic cross-sectional view showing still another shield wiring of the present embodiment. FIG. 9 corresponds to a schematic cross-sectional view taken along the cutting plane C1-C1 shown in FIG.

The capacitive sensor 1C shown in the sectional view of FIG. 9 has a first shield wiring 18C and a second shield wiring 18D. The first shield wiring 18C is a shield wiring provided on the front surface 2a of the base material 2 as described above. The distance D1 between the end portion 3c of the panel 3 and the end portion of the display unit 41 that is proximal to the nearest end surface 3c of the panel 3 is the nearest end surface 3c of the panel 3 and the nearest distance of the panel 3 in the first shield wiring 18C. It is longer than the distance D5 between the end portion proximal to the distal end surface 3c.

Further, the distance D1 between the most proximal end surface 3c of the panel 3 and the end portion of the display unit 41 proximal to the nearest end surface 3c of the panel 3 is the panel at the most proximal end surface 3c of the panel 3 and the first shield wiring 18C. 3 is longer than the distance D14 between the distal end (the end proximal to the detection region 11) from the most proximal end face 3c. That is, an end of the first shield wiring 18 C distal from the most proximal end surface 3 c of the panel 3 between the most proximal end surface 3 c of the panel 3 and the end of the display unit 41 proximal to the most proximal end surface 3 c of the panel 3. (The end proximal to the detection region 11) is located. According to this, the display part 41 will be located inside (proximal to the detection area | region 11) rather than the 1st shield wiring 18C.

The second shield wiring 18 D is provided on the surface 9 a proximal to the base material 2 in the decorative layer 9. Since the decoration layer 9 is provided on the back surface 3b of the panel, in other words, the second shield wiring 18D is provided on the back surface 3b of the panel 3 with the decoration layer 9 as an interposed member. Similar to the first shield wiring 18C, the second shield wiring 18D has conductivity and is formed of a material having a metal such as Cu, Cu alloy, CuNi alloy, Ni, Ag, or Au. The second shield wiring 18D is formed of ink containing a metal material, for example, by screen printing. Alternatively, the second shield wiring 18D may be formed of a material having a metal by sputtering, vapor deposition, or the like. Alternatively, the second shield wiring 18D may be formed of an ink containing a carbon-based conductive material, for example, by screen printing.

The second shield wiring 18D has conductivity, and can be electrically connected to a portion of the flexible printed circuit board 29 that is set to a ground potential, for example, as a reference potential. As shown in the cross-sectional view of FIG. 9, the distance D 1 between the most proximal end surface 3 c of the panel 3 and the end portion 3 c proximal to the end portion 3 c of the display unit 41 is the distance from the most proximal end surface 3 c of the panel 3. It is longer than the distance D6 between the second shield wiring 18D and the end portion proximal to the most proximal end face 3c of the panel 3.

In addition, the distance D1 between the most proximal end surface 3c of the panel 3 and the end portion of the display unit 41 that is proximal to the most proximal end surface 3c is the panel at the most proximal end surface 3c of the panel 3 and the second shield wiring 18D. 3 is longer than a distance D15 between the distal end (the end proximal to the detection region 11) from the most proximal end face 3c. That is, an end of the second shield wiring 18D that is distal to the most proximal end surface 3c of the panel 3 is located between the most proximal end surface 3c of the panel 3 and an end of the display unit 41 that is proximal to the most proximal end surface 3c. (The end proximal to the detection region 11) is located. The other structure is the same as the structure of the capacitive sensor 1 described above with reference to FIGS. According to this, the display unit 41 is located on the inner side (proximal to the detection region 11) than the second shield wiring 18D.

Therefore, even when creeping discharge based on ESD occurs in the capacitive sensor 1C, the display unit 41 is located on the inner side (proximal to the detection region 11) than the first shield wiring 18C and the second shield wiring 18D. Therefore, the electricity flowing between the panel 3 and the base material 2 flows preferentially to at least one of the first shield wiring 18C and the second shield wiring 18D rather than the display unit 41. For this reason, the electricity generated by the ESD flows through the first shield wiring 18C and / or the second shield wiring 18D to the portion of the flexible printed circuit board 29 that is set to the ground potential as the reference potential, for example, and is generated by the ESD. It is suppressed that the electricity which flowed to the display part 41 flows. Thus, by providing at least one of the first shield wiring 18C and the second shield wiring 18D and appropriately setting the arrangement of the shield wiring and the display unit 41, ESD countermeasures are taken and a conductive material is included. Suppressing discoloration of the display unit 41 is more stably realized.

In the capacitance type sensor 1 C shown in FIG. 9, the first shield wiring 18 C and the second shield wiring 18 D are arranged so as to have overlapping portions when viewed from the operation surface 3 a side of the panel 3. However, the present invention is not limited to this. The first shield wiring 18C and the second shield wiring 18D do not have an overlapping portion, and the shield wiring is disposed so as to protect the display unit 41 as a double wall when viewed from the nearest end face 3c. May be.

FIG. 10 is a schematic plan view showing still another shield wiring of the present embodiment. FIG. 11 is a schematic cross-sectional view showing still another shield wiring of the present embodiment. FIG. 10 corresponds to a schematic enlarged view in which the region A shown in FIG. 2 is enlarged. FIG. 11 corresponds to a schematic cross-sectional view taken along the cutting plane C1-C1 shown in FIG.

The capacitive sensor 1D shown in FIGS. 10 and 11 includes a first shield wiring 18E and a second shield wiring 18F. When viewed perpendicularly to the front surface 2a of the base material 2 or the operation surface 3a of the panel 3, the first shield wiring 18E is a portion of the non-detection region 25 other than the portion where the display unit 41 is provided. 2 is provided on the front surface 2a of the substrate 2. On the other hand, when viewed perpendicularly to the front surface 2a of the substrate 2 or the operation surface 3a of the panel 3, the second shield wiring 18F is a portion of the non-detection region 25 where the display unit 41 is provided. The surface 9a of the decorative layer 9 proximal to the substrate 2 is, in other words, provided on the back surface 3b of the panel 3 with the decorative layer 9 as an intervening member. The first shield wiring 18E can be electrically connected to a portion of the flexible printed circuit board 29 that is set to a ground potential as a reference potential, for example. The second shield wiring 18F is not directly and electrically connected to the first shield wiring 18E. However, when a large current flows, the second shield wiring 18F is electrically connected between the first shield wiring 18E and the second shield wiring 18F. The relative position with respect to the 2nd shield wiring 18F is set so that it may arise. Therefore, the second shield wiring 18F can be electrically connected to the portion set to the ground potential via the first shield wiring 18E.

As shown in the cross-sectional view of FIG. 11, when viewed from the normal direction of the cross section, between the most proximal end surface 3 c of the panel 3 and the end portion proximal to the most proximal end surface 3 c of the panel 3 in the display unit 41. The distance D1 is longer than the distance D7 between the closest end surface 3c of the panel 3 and the end portion of the first shield wiring 18E proximal to the end portion 3c of the panel 3. Further, the distance D1 between the most proximal end surface 3c of the panel 3 and the end portion proximal to the most proximal end surface 3c of the panel 3 in the display unit 41 is the panel at the most proximal end surface 3c of the panel 3 and the second shield wiring 18F. 3 is longer than the distance D8 between the proximal end to the most proximal end face 3c. The other structure is the same as that of the capacitive sensor 1 described above with reference to FIG.

Even in the case where creeping discharge based on ESD occurs in the capacitive sensor 1D, the display unit 41 is located on the inner side (proximal to the detection region 11) than the second shield wiring 18F. The current that flows into the material 2 preferentially flows to the second shield wiring 18 F rather than the display unit 41. Then, the electricity that has flowed to the second shield wiring 18F flows to the first shield wiring 18E, and flows through the first shield wiring 18E to a portion of the flexible printed circuit board 29 that is set to the ground potential, for example, as the reference potential. . Therefore, the first shield wiring 18E and the second shield wiring 18F suppress the electricity generated by the ESD from flowing to the display unit 41. Thus, by appropriately setting the arrangement of the first shield wiring 18E and the second shield wiring 18F and the display unit 41, it is possible to take ESD countermeasures and suppress discoloration of the display unit 41 including a conductive material. .

At least one of the first shield wiring 18E and the second shield wiring 18F, specifically, a large current is applied to the shield wiring that directly protects the display unit 41 (receiving preferentially electricity generated by ESD). As long as it is arranged so that electrical connection can occur between the first shield wiring 18E and the second shield wiring 18F, electricity from the shield wiring that directly protects the display unit 41 can be obtained. Arrangement of the shield wiring for flowing is arbitrary. Specifically, in the capacitive sensor 1D, the second shield wiring 18F is a shield wiring that directly protects the display unit 41, and the first shield wiring 18E allows electricity from the second shield wiring 18F to flow. Therefore, the relationship between the distance D1 and the distance D7 is arbitrary. Therefore, in the capacitive sensor 1D, the degree of freedom of arrangement of the first shield wiring 18E can be increased.

Contrary to the above configuration, of the first shield wiring 18E and the second shield wiring 18F, the first shield wiring 18E is a shield wiring that directly protects the display unit 41, and the second shield wiring 18F is the first shield wiring 18F. A configuration may be adopted in which electricity from the one shield wiring 18E is received and supplied to a portion set to the ground potential. In this case, it may be possible to reduce the distance D1.

It should be noted that the second shield wiring 18F may be electrically connectable to a portion set to the ground potential without passing through the first shield wiring 18E.

Although the present embodiment and its application examples have been described above, the present invention is not limited to these examples. For example, those in which the person skilled in the art appropriately added, deleted, or changed the design of the above-described embodiments or application examples thereof, or combinations of the features of the embodiments as appropriate are also included in the present invention. As long as the gist is provided, it is included in the scope of the present invention.

For example, in the above-described embodiment, the decorative layer 9 is provided on the entire portion located in the non-detection region 25 on the back surface 3b of the panel 3, and the entire non-detection region 25 is shielded from light. It is not limited to. There may be a portion where the decorative layer 9 is not provided in the portion located in the non-detection region 25 of the back surface 3 b of the panel 3. Moreover, although the decoration layer 9 is provided in the back surface 3b of the panel 3, it is not limited to this, What is necessary is just to be located between the panel 3 and the base material 2. FIG. For example, it may be embedded in the optical transparent adhesive layer 30. At this time, if the display unit 41 is located between the back surface 3b of the panel 3 and the decorative layer 9, the design of the display unit 41 is enhanced, which is preferable. If at least a part of the shield wiring 18 and the wiring part 6 is located between the base material 2 and the decorative layer 9, when the capacitive sensor 1 is viewed from the operation surface 3a side, the part is added. Since it is concealed by the decoration layer 9 and is not visually recognized, the design of the non-detection region 25 may be increased.

The second shield wiring 18D is provided on the back surface 3b of the panel 3 with the decorative layer 9 as an interposed member. However, the second shield wiring 18D is provided directly on the back surface 3b of the panel 3, and the back surface 3b of the panel 3 is provided. And the decorative layer 9. In this case, it may be preferable that the second shield wiring 18D is made of a transparent conductive material.

DESCRIPTION OF

SYMBOLS

1, 1A, 1B, 1C, 1D Capacitance type sensor 2 Base material 2a Front surface 2c End surface 3 Panel

3a Operation surface

3b Back surface 3c Nearest end surface 4 1st transparent electrode 5 2nd transparent electrode 6 Wiring part 7 connecting portion 8 first electrode 9 decoration layer 9a surface of decoration layer 9 proximal to substrate 2 10 bridge wiring 11 detection region 12 second electrode 16

connection wiring

18, 18A,

18B shield wiring

18C, 18E

First shield wiring

18D, 18F Second shield wiring 20 Insulating layer 20a Surface 25 Non-detection area 27 External connection part 29 Flexible printed circuit board 30 Optical transparent adhesive layer 41 Display part D1, D2, D3, D4, D5, D6, D7, D8, D9, D11, D12, D13, D14, D15 Distance F Finger

Claims

A panel having translucency and one main surface serving as an operation surface; and a base material having translucency provided with a transparent electrode on at least one main surface, wherein the base material is the operation surface of the panel. A capacitive sensor disposed opposite to the main surface on the opposite side,
The capacitive sensor includes a detection region that can detect an operation on the operation surface as viewed from a direction along a normal line of the operation surface of the panel, and a non-detection region that is located on the outer peripheral side of the detection region. Become
In a portion between the panel and the base material in the non-detection region, a decoration layer that reduces the light transmittance of the non-detection region, a display unit including a conductive material, and a conductive and ground potential With shield wiring that can be electrically connected to the set part,
The distance between the proximal end surface, which is the end surface of the panel closest to the display portion, and the end portion of the display portion proximal to the proximal end surface is proximal to the proximal end surface of the shield wiring. A capacitance type sensor characterized by being longer than a distance between an end portion and the nearest end face.
The capacitive sensor according to claim 1, wherein the display unit is located between the panel and the decorative layer.
The electrostatic capacitance sensor according to claim 1 or 2, wherein the shield wiring is located between the base material and the decorative layer.
The capacitance type sensor according to any one of claims 1 to 3, wherein the decoration layer and the display unit are provided on a main surface of the panel opposite to the operation surface.
The distance between the proximal end surface of the display unit proximal to the proximal end surface and the proximal end surface is a distance between the distal end portion of the shield wiring and the proximal end surface that is distal from the proximal end surface. The capacitive sensor according to claim 1, which is longer than the capacitance sensor.
The capacitance type sensor according to any one of claims 1 to 5, wherein the shield wiring includes a first shield wiring provided on a surface of the base material facing the panel.
The capacitance type sensor according to any one of claims 1 to 6, wherein the shield wiring includes a second shield wiring provided on a main surface of the panel opposite to the operation surface.
It is located between the decorative layer and the base material, and further has a wiring part that electrically connects the transparent electrode and the external connection part,
The distance between the end closest to the nearest end face and the nearest end face in the wiring portion is the distance between the end proximal to the nearest end face and the nearest end face in the shield wiring. The capacitive sensor according to any one of claims 1 to 7, wherein the capacitive sensor is longer.
The capacitance type sensor according to claim 8, wherein the wiring portion has a portion overlapping with the display portion when viewed from a direction along a normal line of the operation surface of the panel.
The capacitance type according to any one of claims 1 to 9, wherein the shield wiring has at least one of a portion provided on an end surface of the base material and a portion provided on an end surface of the panel. Sensor.