CN203104942U - A flexible printed circuit - Google Patents
A flexible printed circuit Download PDFInfo
- Publication number
- CN203104942U CN203104942U CN 201220746432 CN201220746432U CN203104942U CN 203104942 U CN203104942 U CN 203104942U CN 201220746432 CN201220746432 CN 201220746432 CN 201220746432 U CN201220746432 U CN 201220746432U CN 203104942 U CN203104942 U CN 203104942U
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- CN
- China
- Prior art keywords
- reinforcing chip
- fpc
- circuit board
- flexible circuit
- reinforcing sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model discloses a flexible printed circuit (FPC) comprising a substrate and a reinforcing sheet fixed on the bottom surface of the substrate. The flexible printed circuit is characterized in that the reinforcing sheet comprises positioning ribs protruding downwardly. Compared with a product in the prior art, not only does the reinforcing sheet used by the FPC have stronger reinforcing effects than a planar reinforcing sheet, but also the protruding positioning ribs of the reinforcing sheet can be used for the installation and positioning of the FPC in order to achieve convenient and fast fixing and installation.
Description
Technical field
The utility model relates to the circuit board structure design field, especially relates to a kind of flexible circuit board.
Background technology
Flexible circuit board (Flexible Printed Circuit, initialism are FPC) is widely used in the electronic product field, particularly on consumer electronics products such as mobile phone, notebook computer.Along with market is outstanding to the demand of the frivolous miniaturization of this electronic product, it is diversified that the application mode of FPC also becomes.
Traditional FPC design and manufacturing field when the FPC of flexible circuit board 100 substrate 11 one sides have electronic device or structure devices 10, can to increase FPC hardness and planarization, be convenient to weld at the back side of FPC substrate 11 by applying glue 12 lamination reinforcement sheets 13.
The supporting material of mainly using at present has: polyimides (Polyimide, initialism are PI), epoxy glass cloth laminated board (FR-4), steel disc etc., but be the plane supporting material.
Summary of the invention
Technical problem to be solved in the utility model is, a kind of flexible circuit board is provided, and makes its reinforcing chip have positioning function.
Technical problem of the present utility model is solved by following technological means:
A kind of flexible circuit board comprises substrate and the reinforcing chip that is fixed in substrate bottom surface, and described reinforcing chip comprises the positioning bar of downward protrusion.
Preferably:
Described reinforcing chip is the metal reinforcement sheet.The optimum stainless steel reinforcing chip that adopts.
The thickness of described metal reinforcement sheet is between 0.15mm ~ 0.5mm.
Described reinforcing chip is the screening cover of the radome of electronic product.
Compared with prior art, the reinforcing chip that FPC of the present utility model adopted not only has stronger reinforcing effect than the plane reinforcing chip, and the positioning bar of its protrusion can be used for the installing and locating of FPC, makes that fixed installation is more convenient.
In the preferred version, the screening cover of the radome of employing electronic product has been saved material cost as reinforcing chip, has also reduced installing and fixing needed accessory simultaneously, has saved installing space.
Description of drawings
Fig. 1 is the structural representation of the FPC of prior art;
Fig. 2 is the FPC structural representation of the specific embodiment of the invention.
Embodiment
Preferred embodiment the utility model is described in further detail for contrast accompanying drawing and combination below.
As shown in Figure 2, the flexible circuit board 101 of present embodiment comprises FPC substrate 11, is mounted on the device 10 of FPC substrate 11 upper surfaces, and three-dimensional reinforcing chip 14 is fixed on the lower surface of FPC substrate by 12 applyings of applying glue, this solid reinforcing chip 14 comprises the outstanding positioning bar 15 that forms downwards, and this positioning bar 15 can be used for pre-determined bit or the location that the FPC plate is installed.
The three-dimensional reinforcing chip of present embodiment preferably adopts the metal material reinforcing chip, the optimum stainless steel material that adopts.
Present embodiment also can utilize the intrinsic element of electronic product as reinforcing chip, for example, in the existing electronic product, be used for the form that the radome of shield electromagnetic interference adopts screening cover and shield bracket two parts to assemble mostly, present embodiment can adopt this screening cover as three-dimensional reinforcing chip, after being fitted in screening cover on the FPC substrate, directly be assembled on the shield bracket, the installation of FPC location and installation and radome is disposable finishing, convenient and swift, and can save needed space and part are installed respectively, reduce cost.
Above content be in conjunction with concrete preferred implementation to further describing that the utility model is done, can not assert that concrete enforcement of the present utility model is confined to these explanations.For the utility model person of ordinary skill in the field; under the prerequisite that does not break away from the utility model design; can also make some being equal to substitutes or obviously distortion, and performance or purposes are identical, all should be considered as belonging to protection range of the present utility model.
Claims (5)
1. a flexible circuit board comprises substrate and the reinforcing chip that is fixed in substrate bottom surface, and it is characterized in that: described reinforcing chip comprises the positioning bar of downward protrusion.
2. flexible circuit board according to claim 1 is characterized in that: described reinforcing chip is the metal reinforcement sheet.
3. according to the flexible circuit board under the claim 2, it is characterized in that: the thickness of described metal reinforcement sheet is between 0.15mm ~ 0.5mm.
4. flexible circuit board according to claim 2 is characterized in that: described reinforcing chip is the screening cover of the radome of electronic product.
5. flexible circuit board according to claim 2 is characterized in that: described reinforcing chip is the stainless steel reinforcing chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220746432 CN203104942U (en) | 2012-12-31 | 2012-12-31 | A flexible printed circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220746432 CN203104942U (en) | 2012-12-31 | 2012-12-31 | A flexible printed circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203104942U true CN203104942U (en) | 2013-07-31 |
Family
ID=48856309
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220746432 Expired - Lifetime CN203104942U (en) | 2012-12-31 | 2012-12-31 | A flexible printed circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203104942U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105263257A (en) * | 2015-10-31 | 2016-01-20 | 张南国 | Foldable circuit board for luminescent lamp |
| CN110267454A (en) * | 2019-06-26 | 2019-09-20 | 深圳市新宇腾跃电子有限公司 | A kind of FPC production technology and structure |
-
2012
- 2012-12-31 CN CN 201220746432 patent/CN203104942U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105263257A (en) * | 2015-10-31 | 2016-01-20 | 张南国 | Foldable circuit board for luminescent lamp |
| CN105263257B (en) * | 2015-10-31 | 2018-04-20 | 张南国 | A kind of flexible folding wiring board of electroluminescent lamp |
| CN110267454A (en) * | 2019-06-26 | 2019-09-20 | 深圳市新宇腾跃电子有限公司 | A kind of FPC production technology and structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130731 |