JP3731511B2 - Connector integrated power module - Google Patents

Connector integrated power module Download PDF

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Publication number
JP3731511B2
JP3731511B2 JP2001262636A JP2001262636A JP3731511B2 JP 3731511 B2 JP3731511 B2 JP 3731511B2 JP 2001262636 A JP2001262636 A JP 2001262636A JP 2001262636 A JP2001262636 A JP 2001262636A JP 3731511 B2 JP3731511 B2 JP 3731511B2
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JP
Japan
Prior art keywords
power module
connector
connection
case
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2001262636A
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Japanese (ja)
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JP2003078107A (en
Inventor
政人 村上
剛 鶴見
靖仁 三浦
貴明 梅下
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Hitachi Ltd
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Hitachi Ltd
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Priority to JP2001262636A priority Critical patent/JP3731511B2/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

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  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Description

【0001】
【発明の属する技術分野】
本発明は、空気調和機等においてインバータ回路を使用して圧縮機モーターの駆動環境を制御するパワーモジュールに係わるもので、特にインバータ回路部を収納したパワーモジュールと圧縮機モーターとの接続、及びインバータ駆動制御回路のプリント配線基板との接続取付構造に関するものである。
【0002】
【従来の技術】
従来の空気調和機等におけるパワーモジュールおよび制御基板、圧縮機モーターへの接続構成図を使って説明する。
【0003】
図1はパワーモジュール10への入出力信号用端子が、全てはんだ付用リード31形状を成すものである。パワーモジュールは他の電子部品と同様に制御基板40上に実装後、自動はんだ付装置にて一括はんだ付により、モジュールと制御基板間の接続を容易にしている。
【0004】
圧縮機モーターは一般的に3相ブラシレスモーターが使用されており、接続ケーブルはUVW各相分の3本必要となる。圧縮機モーターからの3本のケーブルは方向性付きの3極コネクタ51で集合し、一方パワーモジュール側から出力される3本のケーブルも、変換ケーブル60の3極ハウジング61で集合させ、パワーモジュールからの出力ラインと圧縮機モーターとの結線作業の簡略化と誤結線防止を図っている。
【0005】
図2は圧縮機モーター出力を含む高電圧、大電流ラインの接続用として汎用的なファストン接続端子38を、小信号系の制御基板40側にはんだ付用リード31を一体的に形成したパワーモジュール10の接続構成図である。先の図1とは異なり圧縮機モーターへの出力は制御基板を中継せずファストン端子38とリセプタクル端子65の接続で直接変換ケーブル60に繋いでいる。パワーモジュールと圧縮機モーター間の配線を基板の外に出すことで、低電圧で動作する制御基板上の電子部品近傍には高電圧・高電流回路を通さないで済み、ノイズによる誤動作防止ができる。また基板の面積を占有する高圧用の幅広パターン、及び絶縁距離を考慮する必要が無く基板の小型化が可能になる。
【0006】
図7は、コネクタをケース内に内蔵する半導体装置の公知例(特開平9−120852号)である。ポッティング材310を充填するパワー素子回路収納部308とコネクタ収納部309を仕切り、内蔵するコネクタ317は成形後のケースに後付し、コネクタ端子とパワー半導体素子回路との電気的接続にワイヤーボンディング320とするため、コネクタ構造部分は耐熱性を必要とせず市販品を利用できるなど、コネクタ形状の変更に対しては柔軟な対応可能と言った利点がある。
【0007】
【発明が解決しようとする課題】
先に挙げた図1の例ではパワーモジュールからの電気的な配線接続は、パワーモジュールを他の電子部品と同様にプリント配線基板上に実装し、自動はんだ付装置による一括はんだ付のみで完了する。しかしながら、パワーモジュール本体を基板に固定する為の専用固定板70とネジ71が必要であり、電気的接続以外での部品及び取付作業が発生する。また圧縮機モーターへの出力端子も基板にはんだ付していることから、ユニットへの組込作業性や取外しサービス性を考慮すると、圧縮機モーターへの接続線は基板に直結できず、同一基板上にはんだ接続されたハウジング付変換ケーブル60が必要となるなど、本来の機能として必要の無い部品や作業が増えると言った問題が有る。
【0008】
図2の例では、パワーモジュールから直接圧縮機モーターへの出力用にファストン接続端子を備えているので、圧縮機モーターからの接続ケーブルをリセプタクル端子形状に替えて直結も可能であるが、極数分に接続本数が増える事やファストン及びリセプタクル形状が共通であることからユニットへの組込・取外しの際に誤接続を招く可能性があり、やはりハウジング付き変換ケーブルが間に必要である。また、図1及び図2のはんだ付用のリード形状部分は、電流容量を考慮しても必要線径が直径1mmに満たず強度も弱い。従ってパワーモジュール単品での取扱中に接触等により、リード間のピッチが変わり制御基板接続用の穴への挿入が困難になる事が予想される。
【0009】
図7の例では、成形後のケースにコネクタを後付しコネクタ端子とパワー半導体素子回路との電気的接続はワイヤーボンディングとするため、パワーモジュールの組立工程が増加する欠点がある。
【0010】
本発明の課題は、圧縮機モーター、制御基板等の外部装置とパワーモジュールとの手作業による接続配線数及び取付の為の部品数・工数を減らし、省スペース化が図れ且つ安価なコネクタ一体型プリント基板実装用パワーモジュールを提供することである。
【0011】
【課題を解決するための手段】
上記課題は、金属をベース材としてパワー半導体素子が実装されたプリント配線基板と、このプリント配線基板を囲み電動機に接続するコネクタを一体成形したケースと、前記金属ベースとこのケースとに囲まれた内部に注入された絶縁性樹脂材と、電源用及び前記パワー半導体素子スイッチング信号を供給する半田付け用リードを前記ケースと分離した状態でモールドするモールド樹脂とを備えたコネクタ一体形パワーモジュールとすることで達成できる。
【0012】
【発明の実施の形態】
以下、本発明の実態の形態について図3〜6を用いて説明する。図3は発明品の外観図である。構成はパワー半導体素子を内蔵した回路収納部12、パワーモジュールへの電源およびパワー半導体のスイッチング信号を供給する外部プリント基板に接続するはんだ付用リード31と電動機負荷等への出力接続側を、リード線接続に対応した成形コネクタ形状34から成る。図4は内部断面を、図5は接続端子を一体成形したケースの外観図である。
【0013】
回路収納部を構成する配線部材は、熱伝導性の良い金属をベース材としたプリント配線基板で、パワー半導体素子は、半導体チップとリードフレームの接合および樹脂封止パッケージ成形品で基板上の接合面に配置し、外部装置への接続端子は、リードフレームを立体成形し予め配線部材の接合面に接続端子の接合部を位置決めした状態でインサートモー ルド成形されたケースを同様にプリント配線基板上の接合面に配置する。各々は、はんだにより接合されている。
【0014】
パワーモジュールの組立工程は金属ベース材としたプリント配線基板20上に、接続に必要な位置に適量のクリームはんだを印刷する。予めプリント基板回路接続側を表面実装用に、また外部装置への接続用にリードフレームを立体成形しインサートモールド成形されたケース30と、同じく表面実装用のリード付パワー半導体素子24や抵抗・コンデンサ部品を基板上に配置し、一括してリフローはんだ付を行う。
【0015】
ケース及び外部装置への接続端子は、パワーモジュールから電動機等負荷への出力接続側を、リード線接続に対応したコネクタ又はハウジングの収納構造及び端子形状としている。
【0016】
最後に金属ベースとケースに囲まれた内部に絶縁性の樹脂材11を注入し硬させ完成する。またケースの外部プリント基板接続側は、実装はんだ付用のリード部分の一部を樹脂でモールドし回路収納部のケースとは分離したコネクタ形状31としており、リードの中間部分には曲げ形状33を形成する。すなわち、パワーモジュールへの電源およびパワー半導体のスイッチング信号を供給する外部プリント基板接続側は、実装はんだ付用リード部分の一部をケース本体とは分離した状態で樹脂モールドし、基板実装型のコネクタ形状を成す。この曲げ形状33の目的は、本発明品を外部プリント基板に実装する際、はんだ付接続後に、電動機等負荷へのコネクタ接続時、パワーモジュールを放熱フィン構造体に取付時、そして冷熱衝撃によるはんだ付部に加わる応力緩和が主である。更に、図6に示す如く、基板接続側のモールド部分の両サイドには本発明品を実装する基板への位置決め及び固定用の爪形状36と、電気的接続はなさず、はんだ接合強度確保のみを目的とした金属片37が爪形状36の内側にインサート成形されている。すなわち、外部プリント基板接続側で、実装はんだ付用のコネクタ形状を構成する樹脂モールド部分に基板位置決め固定用の爪形状か、または基板との密着性及びはんだ接合強度を増す目的で金属片が、少なくとも1ヶ所以上一体的に形成されている。
【0017】
【発明の効果】
本発明品により、圧縮機モーター、制御基板等の外部装置とパワーモジュールとの手作業による接続配線数及び取付の為の部品数・工数を減らし、省スペース化が図れ且つ安価なコネクタ一体型プリント基板実装用パワーモジュールが供給できる。
【図面の簡単な説明】
【図1】 従来の基板実装用パワーモジュール接続例を示す図。
【図2】 従来のファストン端子を備えたパワーモジュール接続例を示す図。
【図3】 本発明の実施例でパワーモジュールの斜視図。
【図4】 図3のパワーモジュール断面および接続例を示す図。
【図5】 図3のケースのみの斜視図。
【図6】 図3の基板固定爪、およびはんだ付部の拡大図。
【図7】 従来のコネクタ内蔵パワーモジュールの実施例を示す図。
【符号の説明】
10…パワーモジュール、11…絶縁性樹脂、12…パワー素子収納部、20プリント基板、24…パワー半導体素子、30…ケース、31…基板実装リード、34…成形コネクタ、40…制御基板、50…圧縮機接続用ケーブル、60…変換ケーブル、70…パワーモジュール固定板。
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a power module that controls the driving environment of a compressor motor using an inverter circuit in an air conditioner or the like, and in particular, a connection between a power module housing an inverter circuit unit and a compressor motor, and an inverter. The present invention relates to a connection mounting structure of a drive control circuit to a printed wiring board.
[0002]
[Prior art]
A description will be given using a connection configuration diagram of a power module, a control board, and a compressor motor in a conventional air conditioner or the like.
[0003]
In FIG. 1, input / output signal terminals to the power module 10 all have the shape of solder leads 31. Like the other electronic components, the power module is mounted on the control board 40 and then soldered together by an automatic soldering apparatus to facilitate connection between the module and the control board.
[0004]
As the compressor motor, a three-phase brushless motor is generally used, and three connecting cables for each UVW phase are required. The three cables from the compressor motor are gathered by the directional three-pole connector 51, while the three cables output from the power module side are also gathered by the three-pole housing 61 of the conversion cable 60. The connection work between the output line from the compressor and the compressor motor is simplified and misconnection is prevented.
[0005]
FIG. 2 shows a power module in which a general-purpose faston connection terminal 38 for connecting a high voltage and large current line including a compressor motor output is formed, and a soldering lead 31 is integrally formed on the small signal control board 40 side. FIG. 10 is a connection configuration diagram of 10; Unlike the previous FIG. 1, the output to the compressor motor is directly connected to the conversion cable 60 by connecting the faston terminal 38 and the receptacle terminal 65 without relaying the control board. By connecting the wiring between the power module and the compressor motor outside the board, it is not necessary to pass a high-voltage / high-current circuit in the vicinity of the electronic components on the control board that operates at a low voltage, thus preventing malfunction due to noise. . Further, it is not necessary to consider the high-voltage wide pattern that occupies the area of the substrate and the insulation distance, and the substrate can be downsized.
[0006]
FIG. 7 shows a known example (Japanese Patent Laid-Open No. 9-120852) of a semiconductor device in which a connector is built in a case. The power element circuit storage portion 308 and the connector storage portion 309 filled with the potting material 310 are partitioned, and the built-in connector 317 is retrofitted to the molded case, and wire bonding 320 is used for electrical connection between the connector terminal and the power semiconductor element circuit. Therefore, the connector structure portion does not require heat resistance, and a commercially available product can be used. For example, there is an advantage that it is possible to flexibly respond to changes in the connector shape.
[0007]
[Problems to be solved by the invention]
In the example shown in Fig. 1 above, the electrical wiring connection from the power module is completed by mounting the power module on a printed wiring board in the same way as other electronic components, and only by batch soldering using an automatic soldering device. . However, a dedicated fixing plate 70 and screws 71 for fixing the power module main body to the substrate are necessary, and parts and mounting work other than electrical connection are required. In addition, since the output terminal to the compressor motor is also soldered to the board, the connection line to the compressor motor cannot be directly connected to the board, taking into account the workability of assembly into the unit and the serviceability of removal. There is a problem that the number of parts and operations that are not necessary for the original function increase, such as the need for the housing-equipped conversion cable 60 that is soldered to the top.
[0008]
In the example of FIG. 2, the Faston connection terminal is provided for direct output from the power module to the compressor motor. Therefore, the connection cable from the compressor motor can be directly connected to the receptacle terminal shape. Since the number of connections increases and the faston and receptacle shapes are common, there is a possibility of erroneous connection when mounting and dismounting from the unit, and a conversion cable with a housing is still necessary. Further, the lead-shaped portion for soldering in FIGS. 1 and 2 has a required wire diameter of less than 1 mm and a low strength even when the current capacity is taken into consideration. Therefore, it is expected that the pitch between the leads will change due to contact or the like during handling of the power module alone and it will be difficult to insert it into the control board connection hole.
[0009]
In the example of FIG. 7, since a connector is retrofitted to the case after molding and the electrical connection between the connector terminal and the power semiconductor element circuit is wire bonding, there is a disadvantage that the assembly process of the power module increases.
[0010]
An object of the present invention is to reduce the number of connecting wires by hand and the number of parts and man-hours for mounting between an external device such as a compressor motor and a control board and a power module, to save space, and to be an inexpensive connector integrated type. A power module for mounting a printed circuit board is provided.
[0011]
[Means for Solving the Problems]
The above problems are surrounded by a printed wiring board on which a power semiconductor element is mounted using a metal as a base material, a case in which a connector that surrounds the printed wiring board and is connected to an electric motor is integrally formed, and the metal base and the case. A connector-integrated power module comprising: an insulating resin material injected therein; and a mold resin for molding a power supply and a solder lead for supplying the power semiconductor element switching signal in a state separated from the case. Can be achieved.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the actual form of the present invention will be described with reference to FIGS. FIG. 3 is an external view of the invention. The configuration consists of a circuit housing 12 with built-in power semiconductor elements, a lead 31 for soldering connected to an external printed circuit board that supplies power to the power module and a power semiconductor switching signal, and an output connection side to the motor load, etc. It consists of a molded connector shape 34 corresponding to line connection. 4 is an internal cross-sectional view, and FIG. 5 is an external view of a case in which connection terminals are integrally formed.
[0013]
The wiring member that constitutes the circuit housing part is a printed wiring board based on a metal having good thermal conductivity, and the power semiconductor element is bonded to the semiconductor chip and the lead frame, and the resin-encapsulated package molded product is bonded to the substrate. was arranged on the surface, external connection terminals to the apparatus, the lead frame steric molded prewired member Similarly printed wiring board cases insert-mode field molding while positioning the junction of the connection terminal to the bonding surface of the Place on the joint surface. Each is joined by solder.
[0014]
In the assembly process of the power module, an appropriate amount of cream solder is printed on a printed wiring board 20 made of a metal base material at a position necessary for connection. Case 30 in which lead frame is three-dimensionally molded and insert-molded in advance for surface mounting on the printed circuit board connection side and for connection to external devices, and power semiconductor element 24 with leads and resistors / capacitors for surface mounting Components are placed on the board and reflow soldered together.
[0015]
As for the connection terminals to the case and the external device, the output connection side from the power module to the load such as the electric motor has a connector or housing housing structure and terminal shape corresponding to the lead wire connection.
[0016]
Finally the metal base and the inside surrounded by the casing is injected hardening the insulating resin material 11 is completed. Also, the external printed circuit board connection side of the case has a connector shape 31 in which a part of the lead part for mounting solder is molded with resin and separated from the case of the circuit housing part, and a bent shape 33 is provided in the middle part of the lead Form. That is, the external printed circuit board connection side that supplies the power supply to the power module and the power semiconductor switching signal is resin-molded with a part of the mounting solder lead part separated from the case body, and the board mounted connector Form the shape. The purpose of this bent shape 33 is to mount the product of the present invention on an external printed circuit board, after soldering connection, when connecting a connector to a load such as an electric motor, when mounting a power module to a heat radiating fin structure, and by soldering due to thermal shock The main purpose is stress relaxation applied to the attachment. Furthermore, as shown in FIG. 6, the claw shape 36 for positioning and fixing to the board on which the product of the present invention is mounted is not formed on both sides of the mold part on the board connection side, and only the solder joint strength is ensured. A target metal piece 37 is insert-molded inside the claw shape 36. That is, on the external printed circuit board connection side, a metal piece for the purpose of increasing the adhesion and solder joint strength to the substrate mold or the claw shape for fixing the substrate positioning to the resin mold part constituting the connector shape for mounting solder, At least one is integrally formed.
[0017]
【The invention's effect】
The product of the present invention reduces the number of connecting wires by hand and the number of parts and man-hours for mounting between external devices such as compressor motors and control boards and power modules, and saves space and is an inexpensive connector-integrated print. Board mounting power modules can be supplied.
[Brief description of the drawings]
FIG. 1 is a diagram showing an example of connection of a conventional board mounting power module.
FIG. 2 is a diagram showing an example of connecting a power module having a conventional faston terminal.
FIG. 3 is a perspective view of a power module in an embodiment of the present invention.
4 is a diagram showing a cross section of the power module of FIG. 3 and a connection example.
FIG. 5 is a perspective view of only the case of FIG. 3;
6 is an enlarged view of a board fixing claw and a soldering part in FIG. 3;
FIG. 7 is a diagram showing an example of a conventional power module with a built-in connector.
[Explanation of symbols]
10 ... Power module, 11 ... Insulating resin, 12 ... Power element housing, 20 printed circuit board, 24 ... Power semiconductor element, 30 ... Case, 31 ... Board mounting lead, 34 ... Molded connector, 40 ... Control board, 50 ... Compressor connection cable, 60 ... Conversion cable, 70 ... Power module fixing plate.

Claims (3)

金属をベース材としてパワー半導体素子が実装されたプリント配線基板と、このプリント配線基板を囲み電動機に接続するコネクタを一体成形したケースと、前記金属ベースとこのケースとに囲まれた内部に注入された絶縁性樹脂材と、電源用及び前記パワー半導体素子スイッチング信号を供給する半田付け用リードを前記ケースと分離した状態でモールドするモールド樹脂とを備えたコネクタ一体形パワーモジュール。  A printed wiring board on which a power semiconductor element is mounted using a metal as a base material, a case in which a connector that surrounds the printed wiring board and is connected to an electric motor, and an interior surrounded by the metal base and the case are injected. A connector-integrated power module comprising: an insulating resin material; and a mold resin for molding a power lead and a solder lead for supplying the power semiconductor element switching signal in a state separated from the case. 請求項1において、前記リードの途中に曲げ形状を形成したコネクタ一体形パワーモジュール。  The connector-integrated power module according to claim 1, wherein a bent shape is formed in the middle of the lead. 請求項1において、前記モールド樹脂に設けられた基板位置決め用の固定爪と、前記モールド樹脂にインサート成形された半田接合用の金属片とを備えたコネクタ一体形パワーモジュール。  The connector-integrated power module according to claim 1, comprising: a fixed claw for positioning a substrate provided in the mold resin; and a metal piece for solder joining that is insert-molded in the mold resin.
JP2001262636A 2001-08-31 2001-08-31 Connector integrated power module Expired - Fee Related JP3731511B2 (en)

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DE102004021927B4 (en) * 2004-05-04 2008-07-03 Semikron Elektronik Gmbh & Co. Kg Method for internal electrical insulation of a substrate for a power semiconductor module
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US7518236B2 (en) * 2005-10-26 2009-04-14 General Electric Company Power circuit package and fabrication method
JP4609504B2 (en) 2008-03-04 2011-01-12 株式会社豊田自動織機 Electronics
DE112012006842B4 (en) 2012-08-24 2022-06-09 Mitsubishi Electric Corporation semiconductor device
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