CN113179625A - PCB production method and system - Google Patents
PCB production method and system Download PDFInfo
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- CN113179625A CN113179625A CN202110271883.XA CN202110271883A CN113179625A CN 113179625 A CN113179625 A CN 113179625A CN 202110271883 A CN202110271883 A CN 202110271883A CN 113179625 A CN113179625 A CN 113179625A
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- board card
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- tray
- finished
- solder paste
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a PCB production method and a system, wherein the method comprises the following steps: carrying out solder paste printing and surface mounting on the reverse side of the optical board card to obtain a semi-finished board card; placing the semi-finished board card in a first area of a first tray and placing the light board card in a second area of the first tray, wherein the front side of the semi-finished board card faces upwards, and the back side of the light board card faces upwards; simultaneously printing solder paste on the front surface of the semi-finished product board card and the back surface of the light board card on the first tray; simultaneously carrying out surface mounting on the front surface of the semi-finished product board card subjected to solder paste printing and the back surface of the light board card to obtain a board card with the front surface and the back surface subjected to surface mounting and a semi-finished product board card with the back surface subjected to surface mounting; and taking down the board cards with the front and back surfaces subjected to surface mounting for packaging, placing the semi-finished board cards in a first area of a first tray, placing another optical board card in a second area of the first tray, and returning to the step of solder paste printing. The invention can reduce the cost of equipment, manpower, tools and the like.
Description
Technical Field
The invention relates to the field of PCBs, in particular to a PCB production method and a PCB production system.
Background
In the existing SMT process technology of the PCB, most PCB boards are SMT double-sided boards, and because the double-sided boards are divided into BOT surfaces and TOP surfaces, the design difference of the two surfaces is large, two production lines are needed to respectively produce the BOT surfaces and the TOP surfaces, so that the cost of equipment, manpower, tools and the like is increased. If a production line is adopted, the equipment on the production line needs to be replaced frequently (after one surface of the PCB is mounted, the mounting of the other surface needs to be completed within a certain time).
In order to overcome the defects, a yin-yang board process can be adopted, but the existing yin-yang board technology is to splice yin and yang parts through PCB makeup, and the mode has great defects: 1. research and development intervention are needed, and layout is evaluated in a yin-yang board mode in the research and development stage; 2. because most double-sided boards at present have heavy elements, whether one side of the board card has the heavy element or not needs to be considered, and the over-reflow soldering can fall off due to the heavy element.
Disclosure of Invention
In view of the above, in order to overcome at least one aspect of the above problems, an embodiment of the present invention provides a PCB production method, including the steps of:
carrying out solder paste printing and surface mounting on the reverse side of the optical board card to obtain a semi-finished board card;
placing the semi-finished board card in a first area of a first tray and placing the optical board card in a second area of the first tray, wherein the front side of the semi-finished board card faces upwards, and the back side of the optical board card faces upwards;
simultaneously performing solder paste printing on the front surface of the semi-finished board card and the back surface of the optical board card on the first tray;
carrying out surface mounting on the front surface of the semi-finished board card and the back surface of the optical board card after solder paste printing simultaneously to obtain a board card with front and back surfaces subjected to surface mounting and the semi-finished board card with the back surface subjected to surface mounting;
and taking down the board cards with the front surface and the back surface subjected to surface mounting for packaging, placing the semi-finished board cards in the second area in the first area of the first tray, placing another light board card in the second area of the first tray, and returning to the step of solder paste printing.
In some embodiments, the method further includes surface mounting the front side of the semi-finished board card and the back side of the optical board card at the same time after the solder paste printing, further including:
placing the semi-finished board card in a first area of a second tray and placing the optical board card in a second area of the second tray, wherein the front side of the semi-finished board card faces upwards, and the back side of the optical board card faces upwards;
and simultaneously carrying out surface mounting on the front surface of the semi-finished board card and the back surface of the optical board card on the second tray.
In some embodiments, further comprising:
and (4) enabling the second tray on which the board card with the front surface and the back surface subjected to surface mounting and the semi-finished board card with the back surface subjected to surface mounting to pass through a reflow oven, and carrying out optical inspection.
In some embodiments, simultaneously solder paste printing a front side of the semi-finished board card and a back side of the optical board card on the first tray further comprises:
after the solder paste printing is completed, the solder paste printing inspection is performed.
In some embodiments, solder paste printing and surface mounting are performed on the reverse side of the optical board card to obtain a semi-finished board card, further comprising:
replacing the tools on the production line used to generate the semi-finished cards for the subsequent steps.
Based on the same inventive concept, according to another aspect of the present invention, an embodiment of the present invention also provides a PCB production system, including:
the semi-finished product generating tool is used for carrying out solder paste printing and surface mounting on the reverse side of the optical board card to obtain a semi-finished product board card;
a first tray tool for placing the semi-finished board cards in a first area of a first tray and the light board cards in a second area of the first tray, wherein the semi-finished board cards are right side up and the light board cards are right side up;
the solder paste printing tool is used for simultaneously printing solder paste on the front surface of the semi-finished board card and the back surface of the optical board card on the first tray;
the surface mounting tool is used for simultaneously carrying out surface mounting on the front surface of the semi-finished board card and the back surface of the optical board card after solder paste printing so as to obtain a board card with front and back surfaces for completing surface mounting and the semi-finished board card with the back surface for completing surface mounting;
and the circulating tool is used for taking down the board cards with the front and back surfaces subjected to surface mounting so as to perform subsequent packaging, placing the semi-finished board card in a first area of the first tray, and placing another light board card in a second area of the first tray so as to continuously utilize the solder paste printing tool and the surface mounting tool to perform solder paste printing and surface mounting.
In some embodiments, a second pallet means is further included for:
placing the semi-finished board card in a first area of a second tray and placing the optical board card in a second area of the second tray, wherein the front side of the semi-finished board card faces upwards, and the back side of the optical board card faces upwards;
and simultaneously carrying out surface mounting on the front surface of the semi-finished board card and the back surface of the optical board card on the second tray.
In some embodiments, a reflow oven tool is also included for:
and (4) enabling the second tray on which the board card with the front surface and the back surface subjected to surface mounting and the semi-finished board card with the back surface subjected to surface mounting to pass through a reflow oven, and carrying out optical inspection.
In some embodiments, the solder paste printing tool is further configured to:
after the solder paste printing is completed, the solder paste printing inspection is performed.
In some embodiments, further comprising replacement means for:
replacing the tools used to generate the semi-finished product board cards on the production line.
The invention has one of the following beneficial technical effects: according to the scheme provided by the invention, when the PCB is produced in a large scale, a production line does not need to be frequently changed, the generation efficiency is improved, and meanwhile, only one generation line is needed for generation, so that the cost of equipment, manpower, tools and the like is reduced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other embodiments can be obtained by using the drawings without creative efforts.
Fig. 1 is a schematic flow chart of a PCB production method according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a printing tray or a mounting tray provided in an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a PCB production system according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the following embodiments of the present invention are described in further detail with reference to the accompanying drawings.
It should be noted that all expressions using "first" and "second" in the embodiments of the present invention are used for distinguishing two entities with the same name but different names or different parameters, and it should be noted that "first" and "second" are merely for convenience of description and should not be construed as limitations of the embodiments of the present invention, and they are not described in any more detail in the following embodiments.
In the embodiment of the present invention, TOP is the front side of PCB, bot (bottom) is the back side of PCB, smt (surface Mounted technology) is surface mount technology, aoi (automated Optical inspection) is automatic Optical inspection, spi (solder Paste inspection) is solder Paste printing inspection, and DIP (Dual In-line Package) is Dual In-line Package technology.
According to an aspect of the present invention, an embodiment of the present invention provides a PCB panel production method, as shown in fig. 1, which may include the steps of:
s1, performing solder paste printing and surface mounting on the reverse side of the optical board card to obtain a semi-finished board card;
s2, placing the semi-finished board card in a first area of a first tray and placing the light board card in a second area of the first tray, wherein the front side of the semi-finished board card faces upwards, and the reverse side of the light board card faces upwards;
s3, simultaneously performing solder paste printing on the front surface of the semi-finished product board card and the back surface of the optical board card on the first tray;
s4, carrying out surface mounting on the front surface of the semi-finished board card and the back surface of the optical board card after solder paste printing to obtain a board card with front and back surfaces subjected to surface mounting and the semi-finished board card with the back surface subjected to surface mounting;
and S5, taking down the board cards with the front and back surfaces subjected to surface mounting for packaging, placing the semi-finished board cards in the second area in the first area of the first tray, placing another light board card in the second area of the first tray, and returning to the step of solder paste printing.
According to the scheme provided by the invention, when the PCB is produced in a large scale, a production line does not need to be frequently changed, the generation efficiency is improved, and meanwhile, only one generation line is needed for generation, so that the cost of equipment, manpower, tools and the like is reduced.
In some embodiments, the method further includes surface mounting the front side of the semi-finished board card and the back side of the optical board card at the same time after the solder paste printing, further including:
placing the semi-finished board card in a first area of a second tray and placing the optical board card in a second area of the second tray, wherein the front side of the semi-finished board card faces upwards, and the back side of the optical board card faces upwards;
and simultaneously carrying out surface mounting on the front surface of the semi-finished board card and the back surface of the optical board card on the second tray.
In some embodiments, further comprising:
and (4) enabling the second tray on which the board card with the front surface and the back surface subjected to surface mounting and the semi-finished board card with the back surface subjected to surface mounting to pass through a reflow oven, and carrying out optical inspection.
In some embodiments, simultaneously solder paste printing a front side of the semi-finished board card and a back side of the optical board card on the first tray further comprises:
after the solder paste printing is completed, the solder paste printing inspection is performed.
In some embodiments, solder paste printing and surface mounting are performed on the reverse side of the optical board card to obtain a semi-finished board card, further comprising:
replacing the tools on the production line used to generate the semi-finished cards for the subsequent steps.
Specifically, a production line may be used to produce a preset number of semi-finished boards, and then the jig on the production line is replaced to install the step production boards of any of the above embodiments.
The following describes the method for producing a PCB according to the present invention with reference to specific embodiments.
As shown in fig. 2, a plurality of (e.g. 10) semi-finished board cards (only the BOT side is surface mounted, and the TOP side is not performed) can be produced by using the BOT side printing tray, the BOT side steel net and the BOT side mounting tray, and then the PCB board production process is started: as shown in fig. 2, the printing tray is for limiting the board, and the size of the printing tray may be larger than the PCB to be produced, for example, if a 4-up PCB with the size of 151.8mm 98.6mm as shown in fig. 2 is produced, the size of the printing tray may be 290mm 195mm, then the BOT face semi-finished product is placed in the TOP position with the BOT face facing downward and the TOP face to be welded facing upward, the optical board card (both faces are the board cards subjected to surface mounting) is placed in the BOT position with the BOT face to be welded facing upward, then the steel mesh is used to perform the solder paste printing and SPI inspection, then the mounting tray is replaced, similarly to the printing tray, the TOP face and the BOT face are placed in the corresponding positions, then the surface board card mounting, the reflow oven and the AOI are performed, and after the above process is completed, the SMT process placed in the TOP area of the mounting tray is performed, and the next process DIP is performed. And the board card placed in the BOT area becomes a semi-finished board card, and at the moment, the semi-finished board card is taken down and turned over to be placed in the TOP area of the printing tray, the optical board card is placed in the BOT area of the printing tray, and the process is repeated. The method ensures that the TOP surface of the board card only passes through TOP reflow soldering upwards and does not pass through the TOP reflow soldering downwards, so that the problem of dropping a large inductor is completely avoided.
It should be noted that, when mass production of PCB boards is performed, only a predetermined number of semi-finished board cards are obtained at an initial stage, and then the tooling of the production line is replaced, the production line does not need to be replaced, thereby improving the production efficiency. When the board card production is about to be finished, because no optical board card exists, the TOP surface printing tray, the TOP surface steel mesh and the TOP surface mounting tray can be adopted to carry out TOP surface printing solder paste and surface mounting on the rest semi-finished board cards, namely after the production is finished, the BOT surface is completely produced, only a small amount of semi-finished products are left to be used as TOP surfaces, and the line change is carried out by using a TOP tool to finish tail sweeping work.
In some embodiments, the mounting tray needs to be high-temperature resistant due to the fact that the surface mounting needs to pass through a reflow oven, accuracy needs to be guaranteed when solder paste is printed, and therefore the accuracy of the printing tray is higher than that of the mounting tray.
According to the scheme provided by the invention, when the PCB is produced in a large scale, a production line does not need to be frequently changed, the generation efficiency is improved, and meanwhile, only one generation line is needed for generation, so that the cost of equipment, manpower, tools and the like is reduced.
Based on the same inventive concept, according to another aspect of the present invention, an embodiment of the present invention further provides a PCB production system 400, as shown in fig. 3, including:
a semi-finished product generating tool 401, configured to perform solder paste printing and surface mounting on the reverse side of the optical board card to obtain a semi-finished product board card;
a first tray tool 402 for placing the semi-finished board cards in a first area of a first tray and the optical board cards in a second area of the first tray, wherein the semi-finished board cards are right side up and the optical board cards are right side up;
a solder paste printing tool 403, configured to perform solder paste printing on the front side of the semi-finished board card and the back side of the optical board card on the first tray simultaneously;
a surface mounting tool 404 for simultaneously performing surface mounting on the front surface of the semi-finished board card and the back surface of the optical board card after solder paste printing to obtain a board card with front and back surfaces subjected to surface mounting and a semi-finished board card with a back surface subjected to surface mounting;
and the circulating tool 405 is used for taking down the board cards with the front and back surfaces subjected to surface mounting for subsequent packaging, placing the semi-finished board card in a first area of the first tray, and placing another light board card in a second area of the first tray so as to continuously utilize the solder paste printing tool and the surface mounting tool to perform solder paste printing and surface mounting.
In some embodiments, a second pallet means is further included for:
placing the semi-finished board card in a first area of a second tray and placing the optical board card in a second area of the second tray, wherein the front side of the semi-finished board card faces upwards, and the back side of the optical board card faces upwards;
and simultaneously carrying out surface mounting on the front surface of the semi-finished board card and the back surface of the optical board card on the second tray.
In some embodiments, a reflow oven tool is also included for:
and (4) enabling the second tray on which the board card with the front surface and the back surface subjected to surface mounting and the semi-finished board card with the back surface subjected to surface mounting to pass through a reflow oven, and carrying out optical inspection.
In some embodiments, the solder paste printing tool is further configured to:
after the solder paste printing is completed, the solder paste printing inspection is performed.
In some embodiments, further comprising replacement means for:
replacing the tools used to generate the semi-finished product board cards on the production line.
Finally, it should be noted that, as will be understood by those skilled in the art, all or part of the processes in the methods for implementing the embodiments described above may be implemented by a computer program that instructs associated hardware to implement the methods described above, and the program may be stored in a computer-readable storage medium.
Further, it should be appreciated that the computer-readable storage media (e.g., memory) herein can be either volatile memory or nonvolatile memory, or can include both volatile and nonvolatile memory.
Those of skill would further appreciate that the various illustrative logical blocks, modules, circuits, and algorithm steps described in connection with the disclosure herein may be implemented as electronic hardware, computer software, or combinations of both. To clearly illustrate this interchangeability of hardware and software, various illustrative components, blocks, modules, circuits, and steps have been described above generally in terms of their functionality. Whether such functionality is implemented as software or hardware depends upon the particular application and design constraints imposed on the overall system. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the disclosed embodiments of the present invention.
The foregoing is an exemplary embodiment of the present disclosure, but it should be noted that various changes and modifications could be made herein without departing from the scope of the present disclosure as defined by the appended claims. The functions, steps and/or actions of the method claims in accordance with the disclosed embodiments described herein need not be performed in any particular order. Furthermore, although elements of the disclosed embodiments of the invention may be described or claimed in the singular, the plural is contemplated unless limitation to the singular is explicitly stated.
It should be understood that, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly supports the exception. It should also be understood that "and/or" as used herein is meant to include any and all possible combinations of one or more of the associated listed items.
The numbers of the embodiments disclosed in the embodiments of the present invention are merely for description, and do not represent the merits of the embodiments.
It will be understood by those skilled in the art that all or part of the steps of implementing the above embodiments may be implemented by hardware, or may be implemented by a program instructing relevant hardware, and the program may be stored in a computer-readable storage medium, and the above-mentioned storage medium may be a read-only memory, a magnetic disk or an optical disk, etc.
Those of ordinary skill in the art will understand that: the discussion of any embodiment above is meant to be exemplary only, and is not intended to intimate that the scope of the disclosure, including the claims, of embodiments of the invention is limited to these examples; within the idea of an embodiment of the invention, also technical features in the above embodiment or in different embodiments may be combined and there are many other variations of the different aspects of the embodiments of the invention as described above, which are not provided in detail for the sake of brevity. Therefore, any omissions, modifications, substitutions, improvements, and the like that may be made without departing from the spirit and principles of the embodiments of the present invention are intended to be included within the scope of the embodiments of the present invention.
Claims (10)
1. A PCB production method is characterized by comprising the following steps:
carrying out solder paste printing and surface mounting on the reverse side of the optical board card to obtain a semi-finished board card;
placing the semi-finished board card in a first area of a first tray and placing the optical board card in a second area of the first tray, wherein the front side of the semi-finished board card faces upwards, and the back side of the optical board card faces upwards;
simultaneously performing solder paste printing on the front surface of the semi-finished board card and the back surface of the optical board card on the first tray;
carrying out surface mounting on the front surface of the semi-finished board card and the back surface of the optical board card after solder paste printing to obtain a board card with front and back surfaces subjected to surface mounting and a semi-finished board card with back surface subjected to surface mounting;
and taking down the board cards with the front surface and the back surface subjected to surface mounting for packaging, placing the semi-finished board cards in the first area of the first tray, placing another light board card in the second area of the first tray, and returning to the step of solder paste printing.
2. The method of claim 1, wherein the simultaneous surface mounting of the front side of the semi-finished board card and the back side of the optical board card after solder paste printing further comprises:
placing the semi-finished board card in a first area of a second tray and placing the optical board card in a second area of the second tray, wherein the front side of the semi-finished board card faces upwards, and the back side of the optical board card faces upwards;
and simultaneously carrying out surface mounting on the front surface of the semi-finished board card and the back surface of the optical board card on the second tray.
3. The method of claim 2, further comprising:
and (4) enabling the second tray on which the board card with the front surface and the back surface subjected to surface mounting and the semi-finished board card with the back surface subjected to surface mounting to pass through a reflow oven, and carrying out optical inspection.
4. The method of claim 1, wherein simultaneously solder paste printing a front side of the semi-finished board card and a back side of the optical board card on the first tray further comprises:
after the solder paste printing is completed, the solder paste printing inspection is performed.
5. The method of claim 1, wherein the reverse side of the optical board card is solder paste printed and surface mounted to obtain a green sheet card, further comprising:
replacing the tools on the production line used to generate the semi-finished cards for the subsequent steps.
6. A PCB board production system, comprising:
the semi-finished product generating tool is used for carrying out solder paste printing and surface mounting on the reverse side of the optical board card to obtain a semi-finished product board card;
a first tray tool for placing the semi-finished board cards in a first area of a first tray and the light board cards in a second area of the first tray, wherein the semi-finished board cards are right side up and the light board cards are right side up;
the solder paste printing tool is used for simultaneously printing solder paste on the front surface of the semi-finished board card and the back surface of the optical board card on the first tray;
the surface mounting tool is used for simultaneously carrying out surface mounting on the front surface of the semi-finished board card and the back surface of the optical board card after solder paste printing so as to obtain a board card with front and back surfaces for completing surface mounting and a semi-finished board card with back surface for completing surface mounting;
and the circulating tool is used for taking down the board cards with the front and back surfaces subjected to surface mounting so as to perform subsequent packaging, placing the semi-finished board cards in the first area of the first tray, and placing another light board card in the second area of the first tray so as to continuously utilize the solder paste printing tool and the surface mounting tool to perform solder paste printing and surface mounting.
7. The system of claim 6, further comprising a second tray tool for:
placing the semi-finished board card in a first area of a second tray and placing the optical board card in a second area of the second tray, wherein the front side of the semi-finished board card faces upwards, and the back side of the optical board card faces upwards;
and simultaneously carrying out surface mounting on the front surface of the semi-finished board card and the back surface of the optical board card on the second tray.
8. The system of claim 7, further comprising a reflow oven tool for:
and (4) enabling the second tray on which the board card with the front surface and the back surface subjected to surface mounting and the semi-finished board card with the back surface subjected to surface mounting to pass through a reflow oven, and carrying out optical inspection.
9. The system of claim 6, wherein the solder paste printing tool is further configured to:
after the solder paste printing is completed, the solder paste printing inspection is performed.
10. The system of claim 6, further comprising a replacement tool for:
replacing the tools used to generate the semi-finished product board cards on the production line.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110271883.XA CN113179625A (en) | 2021-03-12 | 2021-03-12 | PCB production method and system |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110271883.XA CN113179625A (en) | 2021-03-12 | 2021-03-12 | PCB production method and system |
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| CN113179625A true CN113179625A (en) | 2021-07-27 |
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| CN109588038A (en) * | 2018-12-29 | 2019-04-05 | 华讯方舟科技有限公司 | The attaching method of circuit board |
| CN111629529A (en) * | 2020-06-03 | 2020-09-04 | 重庆金茂联合电子有限公司 | SMT surface mounting technology for PCBA mainboard processing |
| CN112243318A (en) * | 2019-07-16 | 2021-01-19 | 东莞新能德科技有限公司 | Surface mounting method of circuit board and production line of single-track male-female patch |
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2021
- 2021-03-12 CN CN202110271883.XA patent/CN113179625A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018099123A1 (en) * | 2016-12-01 | 2018-06-07 | 威创集团股份有限公司 | Printed circuit board and surface mount method |
| CN107171158A (en) * | 2017-04-18 | 2017-09-15 | 深圳市宇隆宏天科技有限公司 | A kind of production method of USB TYPE C modules |
| CN107231762A (en) * | 2017-06-02 | 2017-10-03 | 江苏久正光电有限公司 | A kind of SMT system of processing and its technique |
| CN109588038A (en) * | 2018-12-29 | 2019-04-05 | 华讯方舟科技有限公司 | The attaching method of circuit board |
| CN112243318A (en) * | 2019-07-16 | 2021-01-19 | 东莞新能德科技有限公司 | Surface mounting method of circuit board and production line of single-track male-female patch |
| CN111629529A (en) * | 2020-06-03 | 2020-09-04 | 重庆金茂联合电子有限公司 | SMT surface mounting technology for PCBA mainboard processing |
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