CN110876233A - Circuit board splicing board - Google Patents
Circuit board splicing board Download PDFInfo
- Publication number
- CN110876233A CN110876233A CN201811003446.4A CN201811003446A CN110876233A CN 110876233 A CN110876233 A CN 110876233A CN 201811003446 A CN201811003446 A CN 201811003446A CN 110876233 A CN110876233 A CN 110876233A
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- Prior art keywords
- circuit board
- circuit boards
- base
- board
- circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The invention relates to a circuit board jointed board, which comprises a plurality of circuit boards arranged along a first direction and a second direction, wherein the first direction and the second direction form a non-zero included angle, and each circuit board comprises a first base part and a second base part which are mutually connected along the second direction; in the first direction, the first base parts of two adjacent circuit boards are directly connected or/and the second base parts are directly connected; in the second direction, the first base parts of two adjacent circuit boards are directly connected or/and the second base parts are directly connected. The circuit boards in the circuit board jointed board are directly connected, so that the board utilization rate of the circuit board jointed board is greatly improved.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a circuit board splicing plate.
Background
In the manufacturing process of a Printed Circuit Board (PCB), in order to improve the mounting efficiency of electronic components such as resistors, inductors, capacitors, etc., a large-area Printed Circuit board is usually manufactured in a whole block, and a large Circuit board jointed board is formed through the process steps of etching, pressing, drilling, electroplating, etc. of each Circuit board. The formed circuit board jointed board comprises a plurality of circuit boards with respective independent circuits, micro-connection points among the circuit boards and waste edges for supporting the circuit boards. In the final forming process, large circuit board jointed boards are required to be cut, and after the cutting and forming, the separated circuit boards can be applied to the circuit board parts of products.
However, in the current circuit board makeup, the little tie point need be fished for the limit through dragging for the machine around the circuit board and forms, drag for sword exogenic action when dragging for the limit and lead to the circuit board to warp easily to make the circuit board roughness variation. The circuit boards are completely connected through the micro-connection points, and the micro-connection points occupy partial space of the circuit board jointed board, so that the number of the circuit boards obtained after the circuit board jointed board with the same size is cut is reduced, the utilization rate of the boards of the circuit board jointed board is reduced, and the manufacturing cost of the circuit board is increased.
Disclosure of Invention
Therefore, it is necessary to provide a circuit board jointed board for solving the problems of low board utilization rate and poor flatness of the circuit board jointed board.
A circuit board jointed board comprises a plurality of circuit boards which are arranged along a first direction and a second direction, wherein a non-zero included angle is formed between the first direction and the second direction, and the circuit boards comprise a first base part and a second base part which are mutually connected along the second direction; in the first direction, the first base parts of two adjacent circuit boards are directly connected or/and the second base parts are directly connected; in the second direction, the first base parts of two adjacent circuit boards are directly connected or/and the second base parts are directly connected. Compare and connect through little tie point between the circuit board among the prior art, the space that little tie point occupy among the prior art has been recycled for arrange more compactly between the adjacent circuit board, the circuit board makeup of the same dimension can obtain more circuit boards, thereby has promoted the utilization ratio of panel greatly. And, adjacent circuit board lug connection can also increase the area of contact between two adjacent circuit boards, and when carrying out laser cutting, the corner of circuit board is difficult for receiving external force to disturb, and non-deformable can maintain good roughness. In addition, when the jointed boards of the circuit board are subjected to high-temperature reflow treatment, the circuit board can resist deformation caused by thermal stress by means of sufficient supporting force at the adjacent base parts, so that good flatness of the circuit board is further maintained. Compared with the prior art, the frequency of cutting the micro-connection points is reduced by one time (the micro-connection points have certain thickness values, and the micro-connection points need to be cut back and forth twice), so that the frequency of cutting the jointed board by laser for obtaining a single circuit board is reduced, the cutting difficulty is reduced, and the production efficiency of the circuit board is improved simultaneously.
In one embodiment, the circuit board further includes an intermediate base portion connecting the first base portion and the second base portion, and a size of the intermediate base portion is smaller than sizes of the first base portion and the second base portion in the first direction. In this way, it can be ensured that the first base parts of two adjacent circuit boards are directly connected or/and the second base parts are directly connected in the first direction and the second direction.
In one embodiment, the circuit board panels further comprise first connecting ribs, and when the first base parts of two adjacent circuit boards are arranged at intervals in the first direction, the first connecting ribs are used for connecting the first base parts of two adjacent circuit boards in the first direction; when the second base parts of two adjacent circuit boards are arranged at intervals, the first connecting rib connects the second base parts of two adjacent circuit boards in the first direction. Therefore, the connecting strength of the two adjacent circuit boards can be increased, and the phenomenon of hollow-out between the two adjacent circuit boards is avoided, so that the phenomenon that the circuit boards deform and have poor flatness when the surface mounting process is carried out subsequently is avoided.
In one embodiment, the circuit board jointed board further comprises a frame, and the circuit boards are arranged in the frame; the first base portion or the second base portion of the circuit board located at the first direction end portion is connected to the frame through the first connecting rib; and the first base part or the second base part of the circuit board positioned at the end part of the first direction is connected with the framework through the second connecting rib. Therefore, the frame provides stronger supporting strength for the circuit boards, so that the circuit board jointed board is less prone to bending when being pasted.
In one embodiment, when the first base or the second base of the circuit board at one end in the first direction is connected to the frame through the first connecting rib, and the first base or the second base of the circuit board at the other end is connected to the frame through the second connecting rib, the number of the first connecting ribs is the same as that of the circuit board, and the first connecting ribs correspond to the circuit board one to one, and identifiers for indicating the circuit board are arranged on the first connecting ribs. Therefore, the marker provides a reference mark for cutting the jointed board of the circuit board into the circuit board, and on the other hand, the marker also provides a reference mark for rapidly checking whether the circuit board before cutting is qualified, so that the material waste caused by the surface mounting process on the unqualified circuit board is avoided.
In one embodiment, the circuit board jointed board further comprises a frame, a partition board and a third connecting rib, wherein the partition board is arranged in the frame to divide the frame into a plurality of frame units along the second direction, and in the second direction, the first base part or the second base part of the circuit board is connected with the frame units through the third connecting rib. Therefore, the supporting strength of the circuit boards is further improved, and the good flatness of the circuit boards is maintained.
In one embodiment, the number of the third connecting ribs is the same as that of the circuit boards and corresponds to one another, and the third connecting ribs are provided with markers for indicating the circuit boards. Therefore, the marker provides a reference mark for cutting the jointed board of the circuit board into the circuit board, and on the other hand, the marker also provides a reference mark for rapidly checking whether the circuit board before cutting is qualified, so that the material waste caused by the surface mounting process on the unqualified circuit board is avoided.
In one embodiment, the circuit boards are distributed in an array in the first direction, and are distributed symmetrically in the second direction. So, be favorable to two adjacent circuit board lug connection, further promote the panel utilization ratio of circuit board makeup, further guarantee the good roughness of circuit board.
In one embodiment, the circuit boards are arranged in an array in the first direction and the second direction. So, be favorable to two adjacent circuit board lug connection, further promote the panel utilization ratio of circuit board makeup, further guarantee the good roughness of circuit board.
In one embodiment, the first direction is perpendicular to the second direction. Therefore, dislocation is not needed between the circuit boards, two adjacent circuit boards are directly connected, and the circuit board splicing board later-stage cutting forming is facilitated.
Drawings
FIG. 1 is a schematic diagram of a circuit board assembly according to the prior art;
FIG. 2 is an enlarged schematic view at A in FIG. 1;
FIG. 3 is a schematic structural diagram of a circuit board assembly according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of the method at B in FIG. 3;
FIG. 5 is a schematic structural view of a circuit board panel according to another embodiment of the present invention;
fig. 6 is an enlarged schematic view at C in fig. 5.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, but rather should be construed as broadly as the present invention is capable of modification in various respects, all without departing from the spirit and scope of the present invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
As shown in fig. 3, the circuit board assembly 10 according to an embodiment of the present invention includes a plurality of circuit boards 100 having respective independent circuits, and when final forming, the circuit board assembly 10 needs to be cut, and after cutting and forming, the formed circuit board is the separated circuit board 100, and the circuit board 100 is a circuit board having complete independent circuits and is a part of a circuit board finally applied to a product.
In the present embodiment, the circuit board 100 is applied to a camera module. Specifically, in this embodiment, the camera module includes a circuit board 100, a photosensitive chip disposed on the circuit board 100, and a lens assembly disposed on a photosensitive path of the photosensitive chip, and light rays of the object side reach the photosensitive chip after passing through the lens assembly, thereby achieving imaging.
Referring to fig. 3 and 4, the circuit board panel 10 further includes a frame 200, a first connecting rib 300 and a second connecting rib 400. The plurality of circuit boards 100 are disposed in the frame 200, and the whole of the plurality of circuit boards 100 is connected to the frame 200 via the first connecting ribs 300 and the second connecting ribs 400. Specifically, in the present embodiment, the frame 200 includes four technical edges 201, and the four technical edges 201 are enclosed to form a closed frame. The closed frame can provide stronger support strength for a plurality of circuit boards 100, thereby making circuit board makeup 10 difficult to bend when carrying out surface mounting process, maintaining the good roughness of circuit board 100, and then making circuit board 100 when being applied to the module of making a video recording, guarantee the precision of focusing, improve image quality. It is understood that in other embodiments, the second connection rib 400 may be omitted, and the entirety of the plurality of circuit boards 100 is connected to the frame 200 only through the first connection rib 300; or the first connection rib 300 may be omitted, and the whole of the plurality of circuit boards 100 is connected to the frame 200 only through the second connection rib 300; or the frame 200, the first connecting rib 300, and the second connecting rib 400 may be omitted.
Referring to fig. 3 and 4, the plurality of circuit boards 100 are arranged in rows and columns, each row of circuit boards 100 includes a plurality of circuit boards 100 arranged along a first direction X, each row of circuit boards 100 includes a plurality of circuit boards 100 arranged along a second direction Y, and the first direction X and the second direction Y form a non-zero included angle. In this embodiment, the first direction X and the second direction Y are perpendicular to each other, and the circuit boards 100 do not need to be dislocated, which is beneficial to directly connecting two adjacent circuit boards 100 and beneficial to cutting and forming the circuit board jointed board 10 at a later stage. In the first direction X, two adjacent circuit boards 100 are arranged in an array to form each row of circuit boards 100, and in the second direction Y, two adjacent circuit boards 100 are arranged in an array (not shown) or symmetrically. As shown in fig. 4 to 6, two adjacent rows of circuit boards 100 may be regarded as a circuit board unit 100a, and the two rows of circuit boards 100 in each circuit board unit 100a are symmetrically arranged. In other embodiments, the first direction X and the second direction Y may form other included angles, and the application is not limited.
The circuit board 100 may be a rigid circuit board or a rigid-flex circuit board. Specifically, in the embodiment, as shown in fig. 4, the circuit boards 100 are rigid-flex boards, each circuit board 100 includes a first base portion 110, an intermediate base portion 120, and a second base portion 130 connected in sequence along the second direction Y, and the intermediate base portion 120 may be a flexible board or a rigid board. Specifically, in the present embodiment, the first base 110, the intermediate base 120, and the second base 130 are electrically connected in sequence, and it should be noted that, when the first base 110 is used for mounting components such as a photosensitive chip, the second base 130 is correspondingly used for mounting a connector. Conversely, when the first base 110 is used for mounting a connector, the second base 130 is used for mounting a component such as a photosensitive chip. Specifically, in the present embodiment, the first base 110 is used for mounting a connector, and the second base 130 is used for mounting components such as a photosensitive chip.
In the circuit board single board 100, in the first direction X, the size of the middle base 120 is smaller than the sizes of the first base 110 and the second base 130, so that two adjacent circuit boards 100 are directly connected in the first direction X and the second direction Y. In the circuit board assembly 10, two adjacent circuit board boards 100 are directly connected in the first direction X and the second direction Y. That is, in the first direction X, the first base portions 110 of two adjacent circuit boards 100 are directly connected or/and the second base portions 130 are directly connected; in the second direction Y, the first base portions 110 of two adjacent circuit boards 100 are directly connected or/and the second base portions 130 are directly connected.
In the first direction X, the first base portions 110 of two adjacent circuit boards 100 are directly connected or/and the second base portions 130 are directly connected to form three types. The first case, as shown in fig. 4: when the size of the first base portion 110 of the circuit board 100 is larger than the size of the second base portion 130 in the first direction X, the first base portions 110 in two adjacent circuit boards 100 are directly connected. The second case, as shown in fig. 6: when the size of the second base portion 130 of the circuit board 100 is larger than the size of the first base portion 110 in the first direction X, the second base portions 130 of two adjacent circuit boards 100 are directly connected. Third case (not shown): when the size of the first base portion of the circuit board is equal to the size of the second base portion in the first direction X, the first base portions of the adjacent two circuit boards are directly connected, and the second base portions of the adjacent two circuit boards are directly connected.
In the second direction Y, the first base portions 110 of two adjacent circuit boards 100 are directly connected or/and the second base portions 130 are directly connected to form three types. First case (as shown in fig. 4): in the case where two columns of circuit boards 100 are arranged symmetrically in each circuit board unit 100a, the first base portions of the circuit boards 100 of adjacent two circuit board units 100a are directly connected. Second case (as shown in fig. 4 or fig. 6): in the case where two rows of circuit boards 100 are arranged symmetrically in each circuit board unit 100a, the second base portions 130 of two adjacent circuit boards 100 in one circuit board unit 100a are directly connected. Third case (not shown): under the arrangement of two columns of circuit board arrays in each circuit board unit, the first base part and the second base part of two adjacent circuit boards are directly connected.
Specifically, in an embodiment, with continued reference to fig. 3 and 4, in the first direction X, the size of the first base portion 110, the size of the second base portion 130, and the size of the middle base portion 120 of the circuit board 100 are sequentially reduced. The number of the circuit board units 100a is plural, and in each circuit board unit 100a, the first base parts 110 of two adjacent circuit boards 100 in the same column of circuit boards 100 are directly connected in the first direction X; the second base portions 130 of two adjacent circuit boards 100 in the same row of circuit boards 100 are spaced apart, and at this time, the second base portions 130 of two adjacent circuit boards 100 in the same row of circuit boards 100 are connected by the first connecting rib 300. The connection strength of the second base portion 130 can be increased by the first connecting ribs 300, and the hollow-out phenomenon of the second base portion 130 is avoided, so that the phenomenon that the surface flatness of the base portion is poor due to the deformation of the second base portion 130 in the subsequent surface mounting process is avoided.
In the second direction Y, in each circuit board unit 100a, the second base portions 130 of two adjacent circuit boards 100 in the same row of circuit boards 100 are directly connected; in the second direction Y, the first substrates 110 of the circuit boards 100 of the adjacent two circuit board units 100a are directly connected. Therefore, the board utilization rate of the jointed board 10 of the circuit board can be further improved, and the deformation between two adjacent circuit board units 100a can be avoided when the surface mounting process of the circuit board 100 is carried out, so that the good flatness of the circuit board 100 is further ensured.
In the present embodiment, the entirety of the plurality of circuit boards 100 is connected to the frame 200 by the first connection rib 300 and the second connection rib 400. Specifically, in each circuit board unit 100a, in the first direction X, the second base portion 130 of the circuit board 100 located at one end in the first direction X is connected to the frame 200 by the first connection rib 300, and the second base portion 130 of the circuit board 100 located at the other end in the first direction X is connected to the frame 200 by the second connection rib 400. At this time, the number of the first connection ribs 300 is the same as that of the circuit boards 100, and the first connection ribs 300 are in one-to-one correspondence, and the first connection ribs 300 are further provided with markers 301 for indicating the circuit boards 100. Thus, the marker 301 provides a reference mark for cutting the circuit board jointed board 10 into the circuit board 100, and on the other hand, provides a reference mark for rapidly checking whether the circuit board 100 before cutting is qualified, thereby avoiding material waste caused by the mounting process performed on the unqualified circuit board 100. It is understood that in other embodiments, the markers may be disposed on the frame, as long as each marker is associated with each circuit board. When the circuit board 100 corresponding to the marker 301 is not qualified, the marker 301 may be blackened to be used as a discard marker.
It is understood that in other embodiments, as shown in fig. 5 and 6, the size of the second base portion 130, the size of the first base portion 110, and the size of the intermediate base portion 120 of the circuit board 100 are sequentially reduced in the first direction X. In each circuit board unit 100a, in the first direction X, two adjacent second base portions 130 in the same row of circuit boards 100 are directly connected, and the first base portions 110 of two adjacent circuit boards 100 in the same row of circuit board single boards 100 are connected by first connecting ribs (not shown); in the second direction Y, in each circuit board unit 100a, the two second base portions 130 of adjacent two circuit boards 100 in the same row of circuit boards 100 are directly connected.
The circuit board panels 10 further include a plurality of partition boards 500 and a plurality of third connecting ribs 600, the plurality of partition boards 500 are disposed in the frame 200 to divide the frame 200 into a plurality of frame units 200a, the number of the circuit board units 100a is plural, each circuit board unit 100a is disposed in each frame unit 200a, and the first base portion 110 of the circuit board 100 of each circuit board unit 100a is connected to the frame unit 200a through the third connecting ribs 600.
Further, in this embodiment, the number of the third connecting ribs 600 is the same as that of the circuit boards 100, and the third connecting ribs 600 correspond to the circuit boards 100 one by one, and the markers 601 for indicating the circuit boards 100 are disposed on the third connecting ribs 600.
It should be noted that, in other embodiments (not shown), when the size of the first base portion is equal to the size of the second base portion in the first direction, and the size of the middle base portion is smaller than the sizes of the first base portion and the second base portion, in each circuit board unit, in the first direction, the first base portions of two adjacent circuit boards are directly connected, and the second base portions of two adjacent circuit boards can also be directly connected at the same time. In the second direction, the first base part and the second base part in two adjacent circuit boards are directly connected. Alternatively, in the second direction, the first base portions of two adjacent circuit boards are directly connected, and the second base portions of two adjacent circuit boards can also be directly connected at the same time.
As shown in fig. 1 and fig. 2, the circuit boards 21 in the circuit board panels 20 in the prior art are spaced apart and completely connected by the micro connection points 22, and the micro connection points 22 occupy a part of the area of the circuit board panels 20, so that the number of the circuit boards 21 in the circuit board panels 20 with the same size is reduced, the utilization rate of the circuit board panels 20 is reduced, and the manufacturing cost of the circuit boards 21 is increased. In addition, in the actual process, the micro connection points 22 are formed by hollowing out the board around the circuit board 21 by the milling cutter, the circuit board 21 is easy to deform under the action of external force contacting the milling cutter, which is not beneficial to improving the flatness of the circuit board 21 in the processing process, and when the circuit board jointed board 20 is subjected to high-temperature reflow treatment, the micro connection points 22 lack sufficient supporting force to resist deformation caused by thermal stress, so that the flatness of the circuit board 21 is further reduced.
Referring to fig. 1 to 6, in the circuit board jointed board 10 of the present invention, two adjacent circuit boards 100 are directly connected, and compared with the circuit boards 21 in the prior art that are connected by the micro connection points 22, the space occupied by the micro connection points 22 in the prior art is reused, so that the arrangement between the adjacent circuit boards 100 is more compact, and the circuit board jointed board 10 with the same size can obtain more circuit boards 100, thereby greatly improving the utilization rate of the board. Compared with the prior art, the circuit board jointed board 10 of the invention reduces the times of cutting the micro-connection points 22 by one time (the micro-connection points 22 have a certain thickness value, and the micro-connection points 22 need to be cut twice back and forth), thereby reducing the times of cutting the jointed board by laser in order to obtain a single circuit board 100, reducing the cutting difficulty and simultaneously improving the production efficiency of the circuit board 100. In addition, the direct connection of the adjacent circuit boards 100 can also increase the contact area between the two adjacent circuit boards 100, and when laser cutting is performed, the corners of the circuit boards 100 are not easily interfered by external force and are not easily deformed, so that good flatness can be maintained. In addition, when the circuit board assembly 10 is subjected to a high temperature reflow process, the circuit board 100 can resist deformation caused by thermal stress by virtue of sufficient supporting force at the adjacent base parts, so that good flatness of the circuit board 100 can be further maintained.
In one embodiment, the circuit boardPanel 10 is a rectangular panel having a length of 190mm and a width of 118mm, and the number of circuit boards 100 in the panel is 168 (12 x 14), each having an area of 87.64mm2. The area utilization of the circuit board panel 10 can thus be calculated to be 65.67% (ratio of number to total panel area). Taking a common jigsaw (which is completely connected by micro connection points) of the prior art, the length value is 180mm, the width value is 118mm, the number of circuit boards in the jigsaw is 121 (10 multiplied by 11), and the area of each circuit board is 87.64mm2. Thus, the board utilization rate of the common circuit board spliced board can be calculated to be 45.39%. Comparing the circuit board jointed board 10 with a common jointed board, it can be found that the board utilization rate of the circuit board jointed board 10 is improved by 44.68%. Therefore, the utilization rate of the circuit board jointed board 10 of the invention is obviously improved compared with the board of the common jointed board, and the raw materials are saved.
To obtain the individual circuit boards 100, the circuit board assembly 10 needs to be drilled, plated, pressed, processed, surface-treated, and cut. In one embodiment, the number of circuit board panels 10 of the present invention is 100, and the number of circuit boards 100 in each circuit board panel 10 is 168. Meanwhile, a common jointed board in the prior art is taken, the number of the jointed boards is 100, and the number of the circuit boards in each jointed board is 110. The results of comparing the efficiency of drilling, electroplating, pressing, circuit processing, surface processing and cutting board division under the identical processing conditions show that the efficiency of drilling is basically unchanged (the drilling is one hole, the more the holes are, the slower the efficiency is, the holes are the same for two boards, the drilling efficiency is unchanged) for the circuit board jointed board 10 of the invention compared with the common jointed board, the efficiency of electroplating, pressing, circuit processing and surface processing is improved by 52% (the same time, the circuit board jointed board 10 of the invention has the same number as that of the common jointed board, but the circuit boards 100 in each jointed board of the circuit board jointed board 10 of the invention are 168, and the common jointed board is 110, the efficiency of the circuit board jointed board 10 of the invention is improved by 52%), the efficiency of cutting board division is reduced by 69% (the circuit boards 100 in the single circuit board jointed board 10 of the invention need 542s for complete cutting, cutting speed was 0.31 pieces/second, 110s was required for full cutting of ordinary panels, and cutting speed was 1 piece/second). By integrating the efficiency values of each processing step, the production efficiency of the circuit board 100 in the circuit board jointed board 10 of the invention can be improved by 22.8% (average value of the efficiency values of each step). Therefore, the production efficiency of the circuit board jointed board 10 of the invention is obviously improved compared with the common jointed board.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A circuit board jointed board is characterized by comprising a plurality of circuit boards which are arranged along a first direction and a second direction, wherein the first direction and the second direction form a non-zero included angle, and the circuit boards comprise a first base part and a second base part which are mutually connected along the second direction; in the first direction, the first base parts of two adjacent circuit boards are directly connected or/and the second base parts are directly connected; in the second direction, the first base parts of two adjacent circuit boards are directly connected or/and the second base parts are directly connected.
2. The circuit board panel according to claim 1, wherein the circuit board further includes an intermediate base portion connecting the first and second base portions, the intermediate base portion having a dimension smaller than the dimensions of the first and second base portions in the first direction.
3. Circuit board panel according to claim 1 or 2, further comprising a first connecting rib, in the first direction,
when the first base parts of two adjacent circuit boards are arranged at intervals, the first connecting ribs connect the first base parts of two adjacent circuit boards in the first direction;
when the second base parts of two adjacent circuit boards are arranged at intervals, the first connecting rib connects the second base parts of two adjacent circuit boards in the first direction.
4. The circuit board panel according to claim 3, further comprising a frame, wherein a plurality of the circuit boards are disposed within the frame;
the first base portion or the second base portion of the circuit board located at the first direction end portion is connected to the frame through the first connecting rib; or/and
the circuit board jointed board further comprises a second connecting rib, and the first base portion or the second base portion of the circuit board located at the end portion of the first direction is connected with the frame through the second connecting rib.
5. The circuit board panel according to claim 4, wherein when the first base or the second base of the circuit board at one end in the first direction is connected to the frame through the first connecting rib, and the first base or the second base of the circuit board at the other end is connected to the frame through the second connecting rib, the number of the first connecting ribs is the same as that of the circuit board, and the first connecting ribs are in one-to-one correspondence, and the first connecting ribs are provided with markers for indicating the circuit board.
6. The circuit board panel according to claim 1 or 2, further comprising a frame, a partition plate and a third connecting rib, wherein the partition plate is disposed in the frame to divide the frame into a plurality of frame units along the second direction, and in the second direction, the first base portion or the second base portion of the circuit board is connected to the frame units through the third connecting rib.
7. The circuit board panel according to claim 6, wherein the number of the third connecting ribs is the same as the number of the circuit boards and corresponds to one another, and the third connecting ribs are provided with markers for indicating the circuit boards.
8. The circuit board panel as defined in claim 1, wherein the circuit boards are arranged in an array in the first direction and are arranged symmetrically in the second direction.
9. The circuit board panel as defined in claim 1, wherein the circuit boards are arranged in an array in the first and second directions.
10. A circuit board panel as defined in claim 1, 8 or 9, wherein the first direction is perpendicular to the second direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811003446.4A CN110876233A (en) | 2018-08-30 | 2018-08-30 | Circuit board splicing board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811003446.4A CN110876233A (en) | 2018-08-30 | 2018-08-30 | Circuit board splicing board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110876233A true CN110876233A (en) | 2020-03-10 |
Family
ID=69715061
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811003446.4A Withdrawn CN110876233A (en) | 2018-08-30 | 2018-08-30 | Circuit board splicing board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110876233A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111975220A (en) * | 2020-08-14 | 2020-11-24 | 乐健科技（珠海）有限公司 | Heat-conducting metal block splicing plate and processing method of heat-conducting metal block |
-
2018
- 2018-08-30 CN CN201811003446.4A patent/CN110876233A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111975220A (en) * | 2020-08-14 | 2020-11-24 | 乐健科技（珠海）有限公司 | Heat-conducting metal block splicing plate and processing method of heat-conducting metal block |
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Application publication date: 20200310 |
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