TW201442575A - Printed circuit board assembly and method for making the same - Google Patents

Abstract

The present disclosure provides a method for making a printed circuit board assembly. The method includes steps below. A printed circuit board is provided. The printed circuit board includes a first printed circuit board which is accepted and a second printed circuit board which is defected. The second printed circuit board is separated from the first printed circuit board assembly to form a printed circuit board for transplantation. The printed circuit board for transplantation includes a hollow-carved area corresponding to the separated second printed circuit board. A printed circuit board used for transplantation is provided. The printed circuit board used for transplantation includes a third printed circuit board which is accepted. A bearing plate with a accommodating groove matching with the printed circuit board for transplantation. Then the printed circuit board for transplantation is putted into the accommodating groove and the printed circuit board used for transplantation is put into the hollow-carved area, then the printed circuit board assembly is formed. A printed circuit board assembly made by the above method is also provided in the present disclosure.

Description

Continuing circuit board and contiguous circuit board manufacturing method

The present invention relates to a circuit board manufacturing technology, and more particularly to a method for fabricating a contiguous circuit board and a contiguous circuit board.

The contiguous circuit board is a circuit board that has formed a circuit. A contiguous circuit board includes a plurality of circuit board units and a waste area. The circuit board unit is an area where the circuit board functions are separated after the completion of the circuit board, and the waste area is the circuit. The part that needs to be removed after the board is hit. Typically, each of the circuit board units includes at least one component mounting area for mounting the components. If there is an electrical defective product in each of the circuit board units, it is not necessary to print solder paste and mounted components on the defective product to save solder paste and parts, but depending on the position of the defective product, it is necessary to The position of the defective product on the contiguous circuit board is shielded by the opening of the different positions of the printed steel plate, and the mounting process is also required to be mounted according to the position of the defective product on each contiguous circuit board. Therefore, the above operation greatly reduces the efficiency of printing solder paste and mounted parts. In order to improve printing and mounting efficiency, solder paste and mounted parts are usually printed on the defective product in actual production. Obviously, the defective product It can not be used after the parts are placed, which causes waste of solder paste and parts.

Therefore, in the manufacturing process of the circuit board, if there is a bad circuit board unit in the contiguous circuit board, the defective circuit board unit in the contiguous circuit board is removed, and then the circuit board unit to be transplanted is transplanted to On the contiguous circuit board, a new contiguous circuit board in which the circuit board units are all good is formed to facilitate mounting of the components. The circuit board unit of the good product to be transplanted needs to be accurately positioned in the contiguous circuit board. The commonly used positioning method is: forming a positioning on the circuit board unit and the contiguous circuit board of the good product to be transplanted. Positioning the contiguous circuit board on the jig by means of a jig having a locating pin, and positioning the circuit board unit of the good product to be transplanted on the jig, thereby enabling The circuit board unit of the good product to be transplanted is accurately positioned in the contiguous circuit board to form a new contiguous circuit board. However, due to factors such as the positioning accuracy of the positioning hole and the positioning pin, the size of the positioning hole and the positioning pin often differ, thereby affecting the accurate positioning of the circuit board unit of the good product to be transplanted.

In view of the above, it is necessary to provide a contiguous circuit board which is formed by transplanting a large number of products and a manufacturing method thereof, so as to reduce the waste of solder paste and parts caused by defective products during the printing, and improve the transplanted circuit board unit. Positioning accuracy.

A manufacturing method of a contiguous circuit board, comprising the steps of: providing a first circuit board, the first circuit board comprising a good first circuit board unit, and at least one defective second circuit board unit; Removing a second circuit board unit from the first circuit board to obtain a circuit board to be transplanted, the circuit board to be transplanted having a first hollow area formed by removing the second circuit board unit; a transplanting unit that matches the size and shape of the hollowed out area, the transplanting unit includes a third circuit board unit of good quality; and provides a carrying board for connecting and positioning the circuit board to be transplanted and the transplanting unit, The carrier board has a receiving slot that matches the shape of the circuit board to be transplanted; and the circuit board to be transplanted and the transplanting unit are received in the receiving slot of the carrying board, and The transplant unit is housed in the first hollow region to form a contiguous circuit board.

A contiguous circuit board comprising a carrier board, a circuit board to be transplanted, and a transplanting unit; the carrier board has a receiving slot that is shaped to match the circuit board to be transplanted; the circuit board to be transplanted includes a good product The first circuit board unit and the at least one first hollow area, the transplant unit includes a good third circuit board unit; the circuit board to be transplanted is accommodated in the receiving slot, and the transplant unit is also accommodated And in the groove and received in the first hollow region.

The contiguous circuit board of the technical solution and the manufacturing method thereof have the following advantages: the graft unit including the third circuit board unit of the good product is connected to the circuit board to be transplanted by the carrier board, thereby forming a contiguous circuit board, so that The number of the circuit board units in the contiguous circuit board is increased, which can reduce the waste of the solder paste and the parts caused by the defective products when the parts are printed; the splicing circuit board of the technical solution does not need to use the positioning holes. And the positioning pin, so as to avoid the positioning deviation caused by the difference of the positioning hole and the positioning pin size.

10. . . First board

101. . . First circuit board unit

102. . . Second circuit board unit

103. . . Fourth circuit board unit

104. . . First waste area

105. . . Second waste area

1041. . . First micro connection

1051. . . Second micro connection

106. . . Second hollow area

107. . . Third hollow area

30. . . Removal unit

20. . . Board to be planted

108. . . First hollow area

40. . . Transplant unit

410. . . Third circuit board unit

4101. . . Third micro connection

4102. . . Fourth micro connection

50. . . Carrier board

510. . . First surface

520. . . Second surface

530. . . Storage slot

531. . . Bottom

532. . . First bulge

533. . . Second bump

534. . . First area

535. . . Second area

536. . . Third area

541. . . First through hole

542. . . Second through hole

543. . . Third through hole

60. . . Connected circuit board

610. . . Fourth hollow area

620. . . Fifth hollow area

FIG. 1 is a schematic plan view of a first circuit board provided by an embodiment of the present technical solution.

FIG. 2 is a schematic plan view of a circuit board to be transplanted obtained after separating the second circuit board unit according to an embodiment of the present technical solution.

FIG. 3 is a schematic plan view of a transplant unit provided by an embodiment of the present technical solution.

4 is a schematic plan view of a carrier board provided by an embodiment of the present technical solution.

Figure 5 is a schematic cross-sectional view of the carrier plate of Figure 4.

FIG. 6 is a schematic plan view showing the circuit board to be transplanted in FIG. 2 housed in the carrier board of FIG. 4.

Figure 7 is a plan view showing the contiguous circuit board formed by accommodating the grafting unit of Figure 3 in a carrier board.

Figure 8 is a schematic cross-sectional view of the contiguous circuit board of Figure 7.

The method for manufacturing the contiguous circuit board and the contiguous circuit board provided by the technical solution will be further described in detail below with reference to the accompanying drawings and embodiments.

The manufacturing method of the contiguous circuit board comprises the following steps:

In the first step, a first circuit board 10 is provided.

Referring to FIG. 1, a first circuit board 10 is provided. The first circuit board 10 includes a plurality of circuit board units and a waste portion other than the circuit board unit. The waste portion surrounds and connects the plurality of circuit board units. Wherein, a hollowed out area is formed between two adjacent circuit board units to space the two circuit board units. At least one of the plurality of circuit board units is a defective circuit board unit and at least one good circuit board unit.

In this embodiment, the number of the circuit board units is three, which are the first circuit board unit 101, the second circuit board unit 102, and the fourth circuit board unit 103, respectively. The second circuit board unit 102 is a circuit board unit of a defective product, and the first circuit board unit 101 and the fourth circuit board unit 103 are good circuit board units. The first circuit board unit 101, the second circuit board unit 102, and the fourth circuit board unit 103 are all the same in shape and are substantially elongated. The waste portion includes a strip-shaped first scrap region 104, a strip-shaped second scrap region 105, a plurality of first micro-joins 1041, and a plurality of second micro-joins 1051, the first scrap region 104 and the second scrap The area 105 is relatively set. The first circuit board unit 101, the second circuit board unit 102, and the fourth circuit board unit 103 are both located between the first waste area 104 and the second waste area 105, and the first circuit board unit 101. The second circuit board unit 102 and the fourth circuit board unit 103 are arranged in parallel. The first waste area 104 is connected to one end of the first circuit board unit 101, the second circuit board unit 102, and the fourth circuit board unit 103 by a plurality of first micro connections 1041, respectively. 105 is connected to the other ends of the first circuit board unit 101, the second circuit board unit 102, and the fourth circuit board unit 103 by a plurality of second micro connections 1051, respectively. a gap between the first circuit board unit 101 and the second circuit board unit 102 forms a second hollow region 106, and a gap between the second circuit board unit 102 and the fourth circuit board unit 103 is formed. The third hollow area 107.

The first circuit board 10 may be a single-layer or multi-layer flexible circuit board, or may be a single-layer, double-layer or multi-layer rigid circuit board, or a rigid-flex board. In addition, the circuit board unit of the defective product generally refers to a circuit board unit with poor electrical measurement, and of course, other circuit board units that are defective, such as poor appearance.

In the second step, referring to FIG. 2, the second circuit board unit 102 is removed from the first circuit board 10 to obtain the circuit board 20 to be transplanted.

Specifically, the first and second micro-connections 1041, 1051 connected to the second circuit board unit 102 are cut off, thereby the second circuit board unit 102 and the first and second waste areas 104, 105 separated. The second circuit board unit 102 may be disconnected from the end of the first and second micro-connections 1041, 1051 connected to the second circuit board unit 102, and the second circuit board unit 102 may be separated from the first A portion of the circuit board 10 that is separated is a removal unit 30. In this case, the removal unit 30 is the second circuit board unit 102; and may also be associated with the first and second micro connections 1041, 1051. The ends of the first and second scrap regions 104, 105 are disconnected to separate the second circuit board unit 102. In this case, the removing unit 30 includes the second circuit board unit 102 and The first and second micro-connects 1041, 1051 connected to the second circuit board unit 102; and may be cut at any position between the two ends of the first and second micro-connections 1041, 1051, thereby separating The second circuit board unit 102, in this case, the removing unit 30 includes the second circuit board unit 102 and a portion of the first and second micro-connections 1041, 1051 connected to the second circuit board unit 102 .

In this embodiment, the first and second micro-connects 1041, 1051 are disconnected from the connected ends of the first and second scrap regions 104, 105, and the first circuit board 10 is cut off. It is separated into two parts, one part is the circuit board 20 to be transplanted, and the other part is the removal unit 30. The circuit board 20 to be transplanted is a circuit board formed on the first circuit board 10 after the removal unit 30 is separated, and the position of the circuit board 20 to be transplanted corresponding to the removal unit 30 is formed. a first hollow region 108, that is, the removal unit 30 is formed to form the first hollow region 108, and the first hollow region 108 is connected to the second hollow region 106 and the third hollow region 107 through. The removing unit 30 is the first and second micro-connects 1041, 1051 including the second circuit board unit 102 and the second circuit board unit 102.

The manner in which the second circuit board unit 102 is separated from the first circuit board 10 may be laser cutting, milling cutting, punch cutting or the like.

Of course, if the first circuit board 10 includes the second circuit board unit 102 of a plurality of defective products, it is necessary to separate the plurality of corresponding removal units 30.

In a third step, referring to FIG. 3, a graft unit 40 is provided that matches the first hollow region 108.

The number, shape, and size of the transplant unit 40 and the removal unit 30 are the same. In this embodiment, the number of the removing units 30 is one, and therefore, the number of the transplanting units 40 is also one. The transplant unit 40 includes a good third circuit board unit 410, a plurality of third micro connections 4101, and a plurality of fourth micro connections 4102. The third circuit board unit 410 and the second circuit board unit 102 of the removal unit 30 are substantially identical in shape, size, and wiring, except for the electrical connection measured by the electrical measurement. The number, position, shape and size of the third micro connection 4101 are the same as the number, position, shape and size of the first micro connection 1041 connected to the second circuit board unit 102, and the The number, position, shape and size of the four micro connections 4102 are the same as the number, position, shape and size of the second micro connections 1051 connected to the second circuit board unit 102.

The forming unit 40 is formed in a manner similar to the manner in which the removing unit 30 is formed, that is, separated from other circuit boards; and, similarly to the first circuit board 10, the transplanting unit 40 may be Flexible circuit boards, rigid circuit boards, and rigid-flex boards.

In the fourth step, referring to FIG. 4-5, a carrier board 50 is provided for connecting and positioning the circuit board 20 to be transplanted and the transplant unit 40.

The carrier plate 50 is a plate-shaped body including an opposite first surface 510 and a second surface 520. The receiving plate 50 is formed with a receiving slot 530 extending from the first surface 510 to the second surface 520. The receiving slot 530 is matched with the circuit board 20 to be transplanted, so that The circuit board 20 to be transplanted is just received in the receiving slot 530. The receiving slot 530 has a bottom surface 531 parallel to the first surface 510. The bottom surface 531 is configured to carry the circuit board 20 to be transplanted and the transplanting unit 40. The bottom surface 531 vertically extends at least one protrusion, the number of the protrusions being the same as the number of hollow areas between the respective circuit board units of the first circuit board 10, and the protrusions and the The cutouts between the individual circuit board units of a circuit board 10 are matched. The bumps are used to limit the plurality of circuit board units. In this embodiment, the number of the protrusions is two, which are a first protrusion 532 and a second protrusion 533, respectively. The first protrusion 532 and the second protrusion 533 are both elongated, the first protrusion 532 is matched with the second hollow area 106, and the second protrusion 533 and the third hollow Area 107 matches. The first protrusion 532 and the second protrusion 533 are used to limit the first, third and fourth circuit board units 101, 410, 103. The first protrusion 532 and the second protrusion 533 divide the bottom surface 531 into three regions, which are respectively a first area 534 corresponding to the first circuit board unit 101 of the circuit board 20 to be transplanted. a second area 535 corresponding to the first hollow area 108 of the circuit board 20 to be transplanted and a third area 536 corresponding to the first hollow area 108 of the circuit board 20 to be transplanted. The first through hole 541 , the second through hole 542 , and the third through hole 543 penetrating the carrier plate 50 are formed on the second surface 520 from the bottom surface 531 of the carrier plate 50 . The first through hole 541 is located in the first region 534 , the second through hole 542 is located in the second region 535 , and the third through hole 543 is located in the third region 536 . The first through hole 541, the second through hole 542, and the third through hole 543 are used to assist in taking out the circuit board 20 to be transplanted and the transplanting unit 40 that are carried in the receiving slot 530. Specifically, When the circuit board 20 to be transplanted and the transplanting unit 40 that are carried in the receiving slot 530 are removed from the receiving slot 530, a finger or other strip tool is simultaneously or simultaneously from the second surface 520. The first through hole 541 and the third through hole 543 are respectively disposed in the first through hole 541 and the third through hole 543, and are moved toward the circuit board 20 to be transplanted and the transplanting unit 40 until the circuit board 20 to be transplanted and the The loading unit 40 is pushed out of the receiving slot 530, so that the circuit board 20 to be transplanted and the transplanting unit 40 can be easily taken out from the receiving slot 530.

The shape and size of the first through hole 541, the second through hole 542, and the third through hole 543 may be any square hole, round hole, etc., and the size is preferably 1 cm to 2 cm in diameter. a hole so that the circuit board 20 to be transplanted and the transplanting unit 40 can be taken out by a finger; the number of the first through hole 541, the second through hole 542, and the third through hole 543 can be plural Because the first circuit board unit 101 and the fourth circuit board unit 103 are connected to the waste area as a whole, only the first through hole 541 and the second through hole 542 may be formed. The first through hole 541 is taken out of the circuit board 20 to be transplanted, and the transplanting unit 40 is taken out by the second through hole 542;

In addition, the first protrusion 532 may be equal to the second hollow area 106, or may be smaller than the length of the second hollow area 106, and may also be composed of multiple segments, and the second protrusion 533 may be The third hollow region 107 may be equal in length, and may be smaller than the length of the third hollow region 107, and may also be composed of multiple segments.

In the fifth step, referring to FIG. 6 , the circuit board 20 to be transplanted is received in the receiving slot 530 of the carrying board 50 .

The first circuit board unit 101 is limited to the first area 534, and one side of the first circuit board unit 101 in the long direction is attached to the slot wall of the receiving slot 530. The other side of the long direction is attached to the first protrusion 532, so that the fourth circuit board unit 103 is confined within the third area 536, and one of the long sides of the fourth circuit board unit 103 is made. The side edge is attached to the groove wall of the receiving groove 530, and the other side of the long direction is attached to the second protrusion 533.

In the sixth step, referring to FIG. 7-8, the transplanting unit 40 is received in the receiving slot 530 of the carrying board 50, thereby forming a contiguous circuit board 60 after the transplantation.

The graft unit 40 is confined in the second region 535, and one side of the long direction of the third circuit board unit 410 is attached to the first protrusion 532, so that the first The other side of the third circuit board unit 410 in the long direction is attached to the second protrusion 533 such that one side of the width direction of the third circuit board unit 410 is attached to the first waste area 104, so that the The other side of the width direction of the third circuit board unit 410 is attached to the second waste area 105, that is, the transplant unit 40 is placed in the first hollow area 108 of the circuit board 20 to be transplanted. The third circuit board unit 410 of the good product replaces the position of the second circuit board unit 102 of the defective product, and the third circuit board unit 410 of the good product is connected to the circuit board 20 to be transplanted by the carrier board 50, thereby forming a A contiguous circuit board 60 of the entire good after transplantation.

The contiguous circuit board 60 includes a carrier board 50, a circuit board 20 to be transplanted, and a graft unit 40. The carrier plate 50 is a plate-shaped body including an opposite first surface 510 and a second surface 520. The receiving plate 50 is formed with a receiving groove 530 extending from the first surface 510 to the second surface 520. The receiving groove 530 has a bottom surface 531 parallel to the first surface 510, the bottom surface A first protrusion 532 and a second protrusion 533 extend perpendicularly from the back to the second surface 520. The circuit board 20 to be transplanted includes a first circuit board unit 101, a fourth circuit board unit 103, a first waste area 104, a second waste area 105, a plurality of first micro connections 1041, and a plurality of second micro connections 1051. The transplant unit 40 includes a third circuit board unit 410, a third micro connection 4101, and a fourth micro connection 4102. The first circuit board unit 101, the fourth circuit board unit 103, and the third circuit board unit 410 are all good circuit board units. The circuit board 20 to be transplanted is matched with the outer shape of the receiving slot 530, and the circuit board 20 to be transplanted is just accommodated in the receiving slot. The transplanting unit 40 is also received in the receiving slot 530. The first scrap zone 104 is disposed opposite the second scrap zone 105. The first circuit board unit 101, the third circuit board unit 410, and the fourth circuit board unit 103 are all the same in shape and are substantially elongated. The first circuit board unit 101 and the third circuit board unit 410 are And the fourth circuit board unit 103 is located between the first waste area 104 and the second waste area 105, and the first circuit board unit 101, the second circuit board unit 102, and the fourth circuit board unit 103 Arrange in parallel. The first waste area 104 is connected to one end of the first circuit board unit 101 and the fourth circuit board unit 103 by a plurality of first micro connections 1041, and the second waste area 105 is multiplied by a second The connection 1051 is connected to the other ends of the first circuit board unit 101 and the fourth circuit board unit 103, respectively. The third circuit board unit 410 is attached to the first waste area 104 and the second waste area 105 by the third micro connection 4101 and the fourth micro connection 4102, respectively. a gap between the first circuit board unit 101 and the third circuit board unit 410 forms a fourth hollow region 610, and a gap between the third circuit board unit 410 and the fourth circuit board unit 103 is formed. The fifth hollow area 620. The first protrusion 532 is disposed in the fourth hollow area 610 and matches the fourth hollow area 610. The second protrusion 533 is disposed in the fifth hollow area 620 and is The fifth hollow areas 620 are matched. The carrier plate 50 is formed with a first through hole 541, a second through hole 542, and a third through hole 543 penetrating from the bottom surface 531 toward the second surface 520. The first through hole 541 is located in a region of the carrier board 50 corresponding to the first circuit board unit 101, and the second through hole 542 is located in the carrier board 50 and the third circuit board. In a region corresponding to the unit 410, the third through hole 543 is located in a region of the carrier board 50 corresponding to the fourth circuit board unit 103.

The splicing circuit board 60 may be a flexible circuit board, a rigid circuit board, a rigid flexible board, etc.; the first protrusion 532 may be equal to the fourth hollow area 610, or may be smaller than The length of the fourth hollow region 610 may also be composed of multiple segments. The second protrusion 533 may be equal to the fifth hollow region 620 or may be smaller than the length of the fifth hollow region 620. Can consist of multiple segments.

The contiguous circuit board of the present invention and the manufacturing method thereof have the following advantages: the graft unit 40 including the third circuit board unit 410 of the good product is connected to the circuit board 20 to be transplanted by the carrier board 50, thereby forming a contiguous piece. The circuit board 60 increases the number of circuit board units in the contiguous circuit board 60, which can reduce the waste of solder paste and parts caused by defective products during the writing process; the splicing circuit board 60 of the present technical solution The positioning does not need to use the positioning hole and the positioning pin, so that the positioning deviation caused by the difference of the positioning hole and the positioning pin size can be avoided.

However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

101. . . First circuit board unit

103. . . Fourth circuit board unit

104. . . First waste area

105. . . Second waste area

1041. . . First micro connection

1051. . . Second micro connection

410. . . Third circuit board unit

4101. . . Third micro connection

4102. . . Fourth micro connection

50. . . Carrier board

532. . . First bulge

533. . . Second bump

60. . . Connected circuit board

Claims (14)

A method for manufacturing a contiguous circuit board, comprising the steps of:
Providing a first circuit board, the first circuit board comprising a good first circuit board unit, and at least one defective second circuit board unit;
Removing the second circuit board unit from the first circuit board to obtain a circuit board to be transplanted, the circuit board to be transplanted having a first hollow area formed by removing the second circuit board unit;
Providing a transplant unit matching the size and shape of the first hollow area, the transplant unit comprising a third circuit board unit of good quality;
Providing a carrier board for connecting and positioning the circuit board to be transplanted and the transplanting unit, the carrying board having a receiving slot that matches a shape of the circuit board to be transplanted; The circuit board to be transplanted and the transplanting unit are received in the receiving slots of the carrying board, and the transplanting unit is received in the first hollowing area to form a continuous circuit board. The method for fabricating a contiguous circuit board according to claim 1, wherein in the first circuit board, a second hollow area is formed between each circuit board unit, and the second hollow area is used for each The circuit board units are spaced apart. The manufacturing method of the contiguous circuit board of claim 2, wherein the bottom surface of the groove extends perpendicularly to the protrusion, and the protrusion corresponds to the second hollow area. The method of manufacturing the contiguous circuit board of claim 3, wherein the circuit board to be transplanted and the transplanting unit are received in a recess of the connecting board, and the transplanting unit is After being disposed in the first hollow region, one side of the first circuit board unit is attached to one side of the protrusion, and one side of the third circuit board unit is The other side of the bump is attached. The manufacturing method of the contiguous circuit board of claim 1, wherein the carrier board includes an opposite first surface and a second surface, the groove from the first surface to the second surface Extendingly, the carrier plate is formed with a first through hole and a second through hole penetrating the carrier plate from the bottom surface toward the second surface, wherein the first through hole is located on the carrier plate and the first through hole In a region corresponding to a circuit board unit, the second through hole is located in a region of the carrier board corresponding to the third circuit board unit. The method for fabricating a contiguous circuit board according to claim 5, wherein the first through hole and the second through hole are both circular holes having a diameter of 1 cm to 2 cm. The method of fabricating a contiguous circuit board according to claim 1, wherein the first circuit board further comprises a waste area and a micro connection, and the first circuit board unit and the second circuit board unit are connected by micro connection Connecting to the waste area, the second circuit board unit is removed from the first circuit board by cutting the micro connection connected to the second circuit board unit. The method for fabricating a contiguous circuit board according to claim 1, wherein the second circuit board unit is removed from the first circuit board by laser cutting, milling cutting or punch cutting. The method of fabricating a contiguous circuit board according to claim 1, wherein the first circuit board is a flexible circuit board, a rigid circuit board or a rigid flexible board. A contiguous circuit board comprising a carrier board, a circuit board to be transplanted, and a transplanting unit; the carrier board has a receiving slot that is shaped to match the circuit board to be transplanted; the circuit board to be transplanted includes a good product The first circuit board unit and the at least one first hollow area, the transplant unit includes a good third circuit board unit; the circuit board to be transplanted is accommodated in the receiving slot, and the transplant unit is also accommodated And in the groove and received in the first hollow region. The contiguous circuit board of claim 10, wherein a bottom surface of the groove extends vertically with a protrusion; a fourth hollow area is formed between each of the circuit board units, and the fourth hollow area is used. Separating each of the circuit board units; the protrusions are disposed in the fourth hollow region and are matched with the fourth hollow regions. The contiguous circuit board of claim 10, wherein the carrier board includes opposing first and second surfaces, the recess extending from the first surface toward the second surface, The carrier board is formed with a first through hole and a second through hole penetrating from the bottom surface toward the second surface, and the first through hole is located on the carrier board corresponding to the first circuit board unit In the area, the second through hole is located in a region of the carrier board corresponding to the third circuit board unit. The contiguous circuit board of claim 12, wherein the first through hole and the second through hole are both circular holes having a diameter of 1 cm to 2 cm. The contiguous circuit board of claim 10, wherein the contiguous circuit board is a flexible circuit board, a rigid circuit board or a rigid flexible board.