TWI466603B - Flexible printed circuit board and method for making the same - Google Patents

Description

Continuing circuit board and contiguous circuit board manufacturing method

The present invention relates to a circuit board manufacturing technology, and more particularly to a method for fabricating a contiguous circuit board and a contiguous circuit board.

Generally, the finished circuit board is in the form of a single-chip circuit board. However, in order to improve efficiency and facilitate operation in the manufacturing process of the circuit board, a plurality of single-chip boards are generally designed on a single circuit board, and the whole circuit board is designed. The upper part is divided into a plurality of product areas and a waste area, the product area is an area corresponding to each single-chip circuit board, and the waste area is an area other than the product area. After the circuit board is subjected to processes such as wiring, electroplating, gold plating, soldering prevention, and printing, the plurality of product regions are separated from the non-product regions by a separate process such as punching, thereby forming a single circuit board of the circuit board finished product. However, the single-chip board after the separation process such as punching and the like needs to take the product one by one in the processing processes such as the appearance inspection and the mounting parts, and the efficiency is low; and the single-chip board is also inconvenient to be transported and stored.

In view of the above, it is necessary to provide a contiguous circuit board that connects a plurality of single-chip boards to facilitate processing, transport, and storage of a plurality of single-chip boards.

A manufacturing method of a contiguous circuit board, comprising the steps of: providing a whole circuit board, the whole circuit board comprising a plurality of circuit board units and connected to the plurality of circuit board units and surrounding the plurality of circuit board units Waste area; providing a support film, The support film is in the form of a whole sheet, the support film is attached to the whole circuit board, and the support film is bonded to each circuit board unit; Forming a slit in the chip board such that the slit surrounds the circuit board unit to separate the plurality of circuit board units from the scrap area, and the support film is still in a sheet-like manner and with a plurality of circuit board units The phases are bonded to form a contiguous circuit board.

A contiguous circuit board comprising a support film, a plurality of circuit board units and a waste area; the plurality of circuit board units and the waste area are bonded to the same surface of the support film; the plurality of circuit board units are arranged in an array A slit surrounding the circuit board unit is formed between each of the circuit board unit and the waste area to separate each circuit board unit from the waste area.

The contiguous circuit board and the manufacturing method of the technical solution have the following advantages: the plurality of separated circuit board units are bonded to a supporting film, so that the plurality of circuit board units can be separated by the action of the supporting film, thereby being convenient for The plurality of circuit board units are processed, transported, and stored; and the plurality of separated circuit board units are bonded to a support film, and the plurality of circuit board units are directly supported from the support film when the plurality of circuit board units are processed separately. The separation is performed without a separate process such as punching a plurality of circuit board units, so that a plurality of separate circuit board units can be obtained.

10‧‧‧Whole board

101‧‧‧Insulation

102‧‧‧ cover film

103‧‧‧ Conductive circuit layer

11‧‧‧Circuit unit

12‧‧‧ scrap area

13‧‧ ‧ junction line

131‧‧‧ first junction line

132‧‧‧ second boundary line

133‧‧‧ third junction

134‧‧‧ fourth junction line

14‧‧‧Support film

141‧‧‧ film layer

142‧‧‧Adhesive layer

15‧‧‧Positioning holes

120‧‧‧ first incision

121‧‧‧Second incision

30‧‧‧Continuous board

20‧‧‧Scratch fixture

201‧‧‧Next template

202‧‧‧Upper template

203‧‧‧Support column

2011‧‧‧First board

2021‧‧‧Second plate

205‧‧•foam

2012‧‧‧Positioning needle

2041‧‧‧First punch

2042‧‧‧second punch

2043‧‧ vacant area

FIG. 1 is a schematic plan view of a whole circuit board provided by an embodiment of the present technical solution.

2 is a cross-sectional view of the entire circuit board along the II-II provided by the embodiment of the present technical solution.

3 is a schematic cross-sectional view showing the laminated substrate formed after the entire circuit board of FIG. 2 is attached to the support film.

FIG. 4 is a schematic plan view showing a positioning hole formed on the laminated substrate in FIG. 3. FIG.

Fig. 5 is a schematic plan view showing a first slit formed on a laminated substrate after forming a positioning hole.

6 is a schematic cross-sectional view of the laminated substrate of FIG. 5 taken along line VI-VI.

FIG. 7 is a bottom view of the template above the punching jig provided by the embodiment of the present technical solution.

FIG. 8 is a schematic cross-sectional view of a stamping jig provided by an embodiment of the present technical solution, wherein a cross-sectional view of the upper template is a cross-sectional view of the template along FIG. 7 along VIII-VIII.

Figure 9 is a plan view showing a contiguous circuit board formed after forming a second slit on the laminated substrate after forming the first slit.

Figure 10 is a cross-sectional view of the contiguous circuit board of Figure 9 taken along line X-X.

The method for manufacturing the contiguous circuit board and the contiguous circuit board provided by the technical solution will be further described in detail below with reference to the accompanying drawings and embodiments.

The manufacturing method of the contiguous circuit board comprises the following steps:

In the first step, please refer to FIG. 1-2 to provide a whole circuit board 10.

The entire circuit board 10 is formed by processing a copper clad substrate. The whole circuit board 10 is a circuit board for completing the circuit to be mounted components, and has not been subjected to a dividing process such as punching.

In this embodiment, the whole circuit board 10 is a single-sided circuit board, and includes an insulating layer 101, a cover film layer 102, and a conductive circuit layer 103 between the insulating layer 101 and the cover film layer 102.

The entire circuit board 10 includes a plurality of circuit board units 11 and a waste area 12 connected to the plurality of circuit board units 11 and surrounding the plurality of circuit board units 11. In this embodiment, four circuit board units 11 on one entire circuit board 10 are taken as an example for description. The four circuit board units 11 are all L-shaped. Each of the circuit board units 11 forms a boundary line 13 with the waste area 12. Each of the boundary lines 13 includes an outer L-shaped first boundary line 131, an inner L-shaped second boundary line 132, a third boundary line 133 connecting the first boundary line 131 and the second boundary line 132, and a connection. The first boundary line 131 and the fourth boundary line 134 at the other end of the second boundary line 132. The circuit board units 11 are arranged in parallel, and the two adjacent circuit boards 11 are arranged opposite each other and form a snap shape, so that the third boundary line 133 of each circuit board unit 11 and the waste area 12 Both are oriented toward the board unit 11 opposite the board unit 11.

Of course, the number of the four circuit board units 11 may be arbitrary, and the shape may be any shape, and is not limited by the above shape; the whole circuit board 10 may be a single layer or multiple layers of flexible circuit boards, rigid circuit boards or soft Hard bonding board.

In the second step, referring to FIG. 3, a support film 14 is provided. The support film 14 is formed in a sheet shape, and the support film 14 is attached to the whole circuit board 10 to form a laminated substrate 40.

In this embodiment, the shape and size of the support film 14 are the same as the shape and size of the entire circuit board 10, so that the support film 14 and each of the circuit board units 11 are bonded together. The thickness of the support film 14 ranges from 50 micrometers to 200 micrometers, preferably 50 micrometers, 100 micrometers, 150 micrometers, and 200 micrometers. The support film 14 includes a film layer 141 and an adhesive layer 142. The adhesive layer 142 is directly attached to the insulating layer 101 of the entire circuit board 10. The adhesive layer 142 has a viscosity value ranging from 0.2 g/mm to 1.5 g/mm, so that the whole circuit board 10 can be firmly adhered to the support film 14. And bonding the adhesive layer 142 of the support film 14 to the whole circuit board 10 by manual or mechanical means; that is, the viscosity value is not too small, so that the entire circuit board 10 cannot be firmly The support film 14 is not bonded too much, so that the entire circuit board 10 and the support film 14 cannot be separated by a large external force, so that the separated circuit board unit 11 cannot be obtained.

Preferably, the material of the film layer 141 is polyethylene terephthalate (PET), polyethylene (PE) or polypropylene (PP). Preferably, the adhesive layer 142 is a residue-free glue to prevent the adhesive layer 142 from leaving the entire circuit board 10 when it is peeled off from the whole circuit board 10.

In the third step, referring to FIG. 4, a plurality of positioning holes 15 are formed on the laminated substrate 40.

In this embodiment, the plurality of positioning holes 15 are formed by the punching process on the scrap area 12 at the edge of the entire circuit board 10 and the support film 14 at the corresponding position. The plurality of positioning holes 15 simultaneously penetrate the entire circuit board 10 and the support film 14. The positioning hole 15 is used for positioning when the entire circuit board 10 is punched in a subsequent step.

In the fourth step, referring to FIG. 5-6, a first slit 120 extending in one or more segments along the boundary line 13 of each of the circuit board units 11 is formed in the laminated substrate 40 by a first punching. .

The plurality of first slits 120 simultaneously penetrate the entire circuit board 10 and the support film 14. Each of the first slits 120 extends toward the waste zone 12 along one or more sections of the boundary line 13 of each of the circuit board units 11. The first slit 120 does not completely separate the circuit board unit 11 from the waste area 12.

In this embodiment, the first slits 120 are all square, the number of the first slits 120 is eight, and each of the circuit board units 11 is provided with two first slits 120 on the boundary. The first slit 120 is formed by performing a first punching on the laminated substrate 40 along the third boundary line 133 and the fourth boundary line 134 on the entire circuit board 10, thereby The first circuit board 10 and the support film 14 are formed with a plurality of the first slits 120 penetrating therethrough. The first slit 120 is the third boundary line 133 or the fourth boundary line 134 on one side of the circuit board unit 11 .

In the fifth step, a second slit 121 is formed on the entire circuit board 10 by a second punch pattern to form a plurality of second slits 121 extending along the boundary portion 13 of each of the circuit board units 11 toward the waste region 12. The first slit 120 of each of the circuit board units 11 and the second slit 121 communicate with each other to separate the plurality of circuit board units 11 from the waste area 12, and the support film 14 is still in a sheet shape and plural The board unit 11 is bonded to form a contiguous circuit board 30.

First, referring to Figures 7-8, a punch fixture 20 is provided.

The punch fixture 20 includes a lower template 201, an upper template 202, and four foams 205.

The lower template 201 includes a first plate body 2011 and a plurality of positioning pins 2012 extending from the first plate body 2011. The plurality of positioning pins 2012 correspond to the positions of the plurality of positioning holes 15.

The upper template 202 is disposed opposite to the lower template 201 and at a certain distance. The upper template 202 includes a second plate 2021, four first punches 2041, four second punches 2042, and a plurality of support columns 203 extending from the second plate 2021.

The four first punches 2041 and the four second punches 2042 are disposed on a surface of the second plate body 2021 opposite to the first plate body 2011. The four first punches 2041 and the four second punches 2042 are both L-shaped. The four first punches 2041 respectively correspond to the position of the first circuit line 131 of the four circuit board units 11 and the waste area 12, and both ends of the first punch 2041 are slightly longer than the first boundary. a line 131, four of the second punches 2042 respectively corresponding to the positions of the four circuit board units 11 and the second boundary line 132 of the waste area 12, and both ends of the second punch 2042 are slightly longer than the second line Second boundary line 132. The first punch 2041 and the second punch 2042 extend from the surface of the second plate 2021 opposite to the first plate body 2011 to the first plate body 2011 by a certain height. The height is H ₂ . A vacant area 2043 is formed at a position on the second plate body 2021 between the first punch 2041 and the second punch 2042 corresponding to the circuit board unit 11.

The plurality of support columns 203 extend perpendicularly from the second plate body 2021 toward the first plate body 2011, that is, the first plate body 2011 and the second plate body 2021 can be coupled by the support column 203 The height of the support column 203 is the minimum distance that the first plate body 2011 and the second plate body 2021 can approach. In this embodiment, the plurality of support columns 203 are located at four corners of the second plate body 2021. The height of the support column 203 is defined as H ₁ , that is, the minimum distance between the first plate body 2011 and the second plate body 2021 is H ₁ , then H ₂ <H ₁ , in this embodiment The thickness of the support film 14 is defined as L ₁ , and then H ₁ = H ₂ + 2 / 3 L ₁ .

The four foams 205 are respectively disposed in the vacant area 2043 of the second plate body 2021, and the four foams 205 are all attached to the surface of the second plate body 2021. The foam is used to limit the depth of the punch. The original thickness of the foam 205 is defined as L ₂ , and the ratio of the thickness of the foam 205 after being pressed to the original thickness L ₂ of the foam 205 is defined as the foam compression ratio A, and the circuit is defined. The thickness of the plate unit 11 is L ₃ , then L ₂ = (H ₂ - 1/3L _{1 -} L ₃ ) / A; wherein the compression ratio of the commonly used foam 205 is 1% to 10%. That is, according to the first punch 2041 and the second punch 2042, a height H ₂ extending from the surface of the second plate body 2021 opposite to the first plate body 2011 toward the lower template 201, the thickness of the support film 14 of L _1, the thickness of the circuit board unit 11 of L ₃ and a compression rate of foam 205 A, to choose the appropriate thickness of the foam 205.

Of course, the number of the punched area 204 and the foam 205 may be other, and only needs to correspond to the number of the circuit board unit 11.

Next, the entire circuit board 10 is positioned on the lower die plate 201.

The whole circuit board 10 and the support film 14 are positioned on the lower template 201 by arranging the plurality of positioning pins 2012 on the corresponding positioning holes 15 and the supporting film is A film layer 141 of 14 is attached to the first plate body 2011.

Again, please refer to FIG. 9-10 together, and the whole circuit board 10 is subjected to a second punching type using the punching jig 20.

A plurality of second slits 121 are formed on the entire circuit board 10 by a second punching pattern, and the plurality of second slits 121 extend along the second portion of the remaining portion of each of the circuit board units 11 to form a second slit 121. The first slit 120 surrounding each of the circuit board units 11 and the second slit 121 communicate with each other to separate the plurality of circuit board units 11 from the waste area 12, even if the plurality of circuit board units 11 are separated from each other. The second punching type does not form a hole on the support film 14, that is, the support film 14 is still in a sheet shape, and the support film 14 is bonded to the plurality of mutually separated circuit board units 11 by an adhesive layer. They are not separated, thereby forming a contiguous circuit board 30.

In this embodiment, the second slits 121 are all L-shaped, and the number of the second slits 121 is also eight, and each of the circuit board units 11 is connected to the two second slits 121. First The two slits 121 are specifically formed by using the punching jig 20 along the first boundary line 131 and the second boundary line 132 on the entire circuit board 10 for the second punching type on the entire circuit board. A plurality of L-shaped second slits 121 are formed in the waste area 12 of 10 at positions corresponding to the first punch 2041 and the second punch 2042. The L-shaped side of the inner side of each of the second slits 121 is the first boundary line 131 or the second boundary line 132. Two ends of each of the second slits 121 are respectively in communication with one end of one of the first slits 120 such that the two first slits 120 and the two second slits 121 surround a circuit board unit 11.

In addition, since the thickness L _{2 of the} foam 205 is set to (H ₂ -1/3L ₁ -L ₃ )/A, that is, L ₂ *A+L ₃ +1/3L ₁ =H ₂ , that is, the compressed bubble The sum of the thickness of the cotton 205, the thickness of the circuit board unit 11, and the thickness of the support film 14 of 1/3 and the first punch 2041 and the second punch 2042 from the second plate 2021 The surface of the template 201 is equal to the height of the lower template 201, that is, the first punch 2041 and the second punch 2042 are not high enough to break the support film 14, so the bubble The cotton 205 can block the first punch 2041 and the second punch 2042 from moving downward, so that the punch jig 20 forms a slit only on the entire circuit board 10 and cannot cut the support film 14 The support film 14 does not form a new slit through the support film 14 after the second punching, that is, the support film 14 is also in a sheet shape.

The contiguous circuit board 30 formed after the second punching type includes a support film 14, a plurality of circuit board units 11, and a waste area 12. The plurality of circuit board units 11 and the waste area 12 are bonded to the same surface of the support film 14. The plurality of circuit board units 11 are distributed in an array. A plurality of first slits 120 and second slits 121 are formed between each of the circuit board unit 11 and the scrap area 12, and each of the two first slits 120 communicates with the two second slits 121 and surrounds one of the The circuit board unit 11 such that each circuit board unit 11 is The waste zone 12 is phase separated. Each of the first slits 120 penetrates the support film 14.

Among them, the purpose of the two-punch type is to split the part that needs to be punched, and to divide the punch which is more complicated and more complicated, and to divide the punch with a simpler number and less bend. Therefore, the structure of the punch of the punching die can be simplified, thereby reducing the cost of the die. In addition, it is also possible to carry out the first punching type for the part with less precision requirement, the second punching type for the part with high precision requirement, and the cheaper punch for the first punching type, thereby also reducing the cost of the mold. .

It can be understood that the first punching type may not be performed, and only the second punching type may be performed, so that the first slit 120 and the second slit are formed on the entire circuit board 10 only by one punching type. 121, instead of forming a slit on the support film 14; it is also possible to perform two or more punching types, that is, the number of times of the first punching type can be increased, and the number of times of the second punching type can be increased as long as the supporting film is made 14 keep the whole piece. In addition, the number of the first slit 120 and the second slit 121 may be one or plural.

The contiguous circuit board 30 and the manufacturing method of the present technical solution have the advantages that the plurality of separated circuit board units 11 are bonded to a single sheet of the support film 14 so that the plurality of circuit board units 11 can function by the support film 14. Without separate phase separation, it is convenient to process, transport and store the plurality of circuit board units 11; and the plurality of separated circuit board units 11 are bonded to a whole sheet of support film 14 for processing the plurality of circuit board units 11 When it is necessary to separately operate the plurality of circuit board units 11 and the support film 14, the plurality of separate circuit board units 11 can be obtained without performing a separate process such as punching or the like on the plurality of circuit board units 11.

However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Anyone who is familiar with the skills of this case will follow the spirit of the present invention. Equivalent modifications or variations are intended to be included within the scope of the following claims.

11‧‧‧Circuit unit

12‧‧‧ scrap area

120‧‧‧ first incision

121‧‧‧Second incision

30‧‧‧Continuous board

Claims (10)

A manufacturing method of a contiguous circuit board, comprising the steps of: providing a whole circuit board, the whole circuit board comprising a plurality of circuit board units and connected to the plurality of circuit board units and surrounding the plurality of circuit board units a scraping zone; providing a support film, the support film being in a sheet shape and comprising a film layer and an adhesive layer, the support film being attached to the whole circuit board, and the adhesive layer and each a circuit board unit and a waste area are all fitted together; and a slit is formed on the entire circuit board by punching, the slit is wrapped around the circuit board unit to thereby divide the plurality of circuit board units and the waste The phase separation of the support film and the support film are still in a sheet shape and still bonded to the plurality of circuit board units and the waste area to form a continuous circuit board, wherein the plurality of circuit board units and the waste area can be supported from the support film Separated on. The method for fabricating a contiguous circuit board according to claim 1, wherein the adhesive layer directly adheres to the circuit board, and the adhesive layer has a viscosity value ranging from 0.2 g/mm to 1.5 g/mm. . The method of fabricating a contiguous circuit board according to claim 1, wherein the step of forming a plurality of slits on the entire circuit board by punching comprises: providing a punch type jig, the punch jig comprising a template, an upper template, and a plurality of foams; the upper template is disposed opposite to the lower template; the upper template is provided with a plurality of punches, and a boundary line is formed between the circuit board unit and the scrap area. The punch corresponds to the boundary line, the punch is used to form the slit; the plurality of punches are separated by a vacant area; the foam is disposed in the vacant area and is The upper template is attached to a surface opposite to the lower template, and the foam is used to limit the depth of the punch; The whole circuit board and the supporting film which are bonded together are punched by the punching tool, and a plurality of the slits are formed only at positions corresponding to the punch on the entire circuit board. The method of fabricating a contiguous circuit board according to claim 3, wherein a height of the punch extending from a surface of the upper template opposite to the lower template toward the lower template is defined as H ₂ , The thickness of the support film is L ₁ , the thickness of the circuit board unit is defined as L ₃ , the original thickness of the foam is defined as L ₂ , and the thickness of the foam after being pressed in the punching type is defined as the foam. The ratio of the original thickness L ₂ is the foam compression ratio A, and then L ₂ * A = H ₂ - _1/3 L _{1 -} L ₃ . The method of fabricating a contiguous circuit board according to claim 4, wherein the foam has a compression ratio ranging from 1% to 10%. The method for fabricating a contiguous circuit board according to claim 1, wherein each of the circuit board units forms a boundary line with the scrap area, and the step of forming a plurality of slits on the entire circuit board by punching comprises: borrowing Forming, by the first punching pattern, a first slit penetrating the entire circuit board and the support film; each of the first slits is from one or more of the boundary lines of the circuit board to the Extending the waste area; forming a plurality of second slits on the entire circuit board by a second punching pattern, the plurality of second slits extending toward the waste area along a boundary line of the remaining portion of each of the circuit board units, The first slit surrounding each of the circuit board units and the second slit communicate with each other to separate the plurality of circuit board units from each other. The method of fabricating a contiguous circuit board according to claim 6, wherein the step of forming a plurality of second slits on the entire circuit board by the second punching pattern comprises: providing a punch type jig, The punch fixture includes a template, an upper template, and a plurality of foams; the upper template is disposed opposite to the lower template; the upper template is provided with a plurality of punches, and between the circuit board unit and the waste area Forming a boundary line, the punch corresponding to the boundary line, the punch is used to form the second slit; the plurality of punches are separated by a vacant area; the foam is disposed at In the vacant area Adhering to a surface of the upper template opposite to the lower template, the foam is used to limit the depth of the punching type; and the entire circuit board to be bonded together using the punching jig and The support film is punched, and the second slit is formed only at a position corresponding to the punch on the entire circuit board. The method of fabricating a contiguous circuit board according to claim 7, wherein a height of the punch extending from a surface of the upper template opposite to the lower template to the lower template is defined as H ₂ , The thickness of the support film is L ₁ , the thickness of the circuit board unit is defined as L ₃ , the original thickness of the foam is defined as L ₂ , and the thickness of the foam after being pressed in the punching type is defined as the foam. The ratio of the original thickness L ₂ is the foam compression ratio A, and then L ₂ * A = H ₂ - _1/3 L _{1 -} L ₃ . A contiguous circuit board comprising a support film, a plurality of circuit board units and a waste area; the plurality of circuit board units and the waste area are bonded to the same surface of the support film; the plurality of circuit board units are arranged in an array Forming a slit around the circuit board unit between each of the circuit board unit and the waste area to separate each circuit board unit from the waste area, wherein the plurality of circuit board units and The waste area can be separated from the support film. The contiguous circuit board of claim 9, wherein one or more of the slits penetrate the support film.