TWI381782B - Method of making printed circuit board having element beyond boundary of the printed circuit board - Google Patents

Description

Circuit board with super-external accessories

The present invention relates to circuit board technology, and in particular to a method of fabricating a circuit board having an ultra-external accessory.

With the rapid development of the electronics industry, the production technology of circuit boards, which are the basic components of electronic products, is becoming more and more important. The circuit board is generally fabricated by a series of processes such as cutting, drilling, etching, exposing, developing, pressing, and molding a copper-clad substrate. For details, see "Dielectric characterization of printed circuit board substrates" by C. H. Steer et al., Proceedings of the IEEE, Vol. 39, No. 2 (August 2002).

At present, in the manufacture of a circuit board, a plurality of circuit board units having the same structure and function are generally arranged on a large circuit board mother board. After the circuit board is completed, the plurality of circuit board units are cut and separated from the circuit board mother board to obtain a single circuit board unit. Moreover, in order to meet the specific structure and assembly requirements of the board, various accessories are attached to the single board unit. For example, attaching a backing in a certain area of a single circuit board unit to facilitate assembly of the circuit board into an electronic product; or attaching a reinforcing sheet to an area of a single circuit board unit to reinforce the strength of the area; or in a single An area of the board unit is attached to the steel sheet to mask electromagnetic interference in the area. In order to facilitate the subsequent assembly and positioning requirements of the circuit board unit, the adhesive, the reinforcing sheet or the steel sheet and the like have a protruding structure beyond the boundary of the single circuit board unit, and the type of the accessory is called an ultra-external fitting. Such super-external fittings are usually laminated to a single circuit board unit after being cut and formed, resulting in a slower fitting speed of the fitting, and the production efficiency of the circuit board having the super-external fitting is low.

In view of the above, it is necessary to provide a method for manufacturing a circuit board which can speed up the bonding speed of the super-outlet type component and improve the production efficiency of the circuit board having the super-outlet type component.

A method of fabricating a circuit board having an ultra-external accessory will be described below with reference to specific embodiments.

A method for manufacturing a circuit board having an ultra-outlet accessory, comprising the following steps:

Providing a circuit board motherboard, and forming a plurality of circuit board units on the circuit board mother board;

Forming a plurality of slotted holes through the circuit board motherboard on the circuit board motherboard, wherein each circuit board unit is adjacent to the at least one slotted hole;

Providing a component motherboard for forming a super-outlet fitting, and attaching the accessory motherboard to at least a portion of the plurality of circuit board units and covering each of the slots;

Cutting the circuit board mother board and the accessory mother board simultaneously to obtain a plurality of mutually separated circuit boards, wherein each circuit board has a circuit board unit and one of the super-types attached to the circuit board unit An accessory that has a protruding structure that extends beyond the boundaries of the board unit.

Compared with the prior art, the manufacturing method of the circuit board with the super-outlet component of the present technical solution is to completely fit the accessory motherboard by forming a slotted hole adjacent to the circuit board unit on the circuit board mother board. At least a portion of the plurality of circuit board units, and in the subsequent process, the circuit board mother board and the accessory motherboard are simultaneously cut, thereby obtaining a plurality of mutually separated circuit boards, since the manufacturing method does not require the circuit board unit It is cut and separated separately from the super-external fittings, and the fitting speed is accelerated one by one, thereby accelerating the fitting speed of the super-external fittings, and greatly improving the production efficiency of the circuit board having the super-external fittings.

The method for fabricating the circuit board having the super-outlet fitting of the present technical solution will be further described in detail below with reference to the accompanying drawings and embodiments.

Referring to FIG. 1 , an embodiment of the present technical solution provides a method for manufacturing a circuit board having an ultra-outlet accessory, which includes the following steps:

In step 110, a circuit board motherboard is provided, and a plurality of circuit board units are formed on the circuit board mother board.

Referring to FIGS. 2-3, the circuit board motherboard 10 has opposing first and second surfaces 101, 102. Specifically, a plurality of circuit board units 20 can be formed on the circuit board mother board 10 by a series of processes such as drilling, etching, exposure, development, pressing, molding, and the like. Each circuit board unit 20 has a first side 201 and a second side 202 opposite thereto. In this embodiment, the first surface 201 of the circuit board unit 20 is coplanar with the first surface 101 of the circuit board motherboard 10, and the second surface 202 of the circuit board unit 20 and the second surface 102 of the circuit board motherboard 10 Coplanar. The plurality of circuit board units 20 are sequentially arranged in parallel on the circuit board mother board 10. Of course, the plurality of circuit board units 20 may also be arranged in a matrix on the circuit board motherboard 10. In addition, the first surface 201 of the circuit board unit 20 can protrude from the first surface 101 of the circuit board motherboard 10; the second surface 202 of the circuit board unit 20 can also protrude from the second surface of the circuit board motherboard 10. Surface 102.

Step 120, forming a plurality of slotted holes through the circuit board motherboard on the circuit board motherboard, wherein each circuit board unit is adjacent to the at least one slotted hole.

Referring to FIG. 4, in the embodiment, a plurality of preset regions 12 are defined on the circuit board motherboard 10. Each of the preset areas 12 is adjacent to one end of one of the circuit board units 20, respectively. A slit hole 14 penetrating the circuit board mother board 10 is formed in each of the predetermined regions 12 by a method such as punching or laser cutting. The slotted hole 14 extends through the first surface 101 and the second surface 102 of the circuit board motherboard 10. Here, each of the circuit board units 20 is adjacent to a slotted hole 14 and the one of the slotted holes 14 is adjacent to one end of the corresponding one of the circuit board units 20. Of course, each of the slots 14 may be adjacent to any one of the corresponding ones of the circuit board units 20, for example, each of the slots 14 may be intermediate to a corresponding one of the circuit board units 20, depending on design requirements. The locations are adjacent.

In addition, each of the circuit board units 20 can also be adjacent to two or more slotted holes 14. For example, when each of the circuit board units 20 is adjacent to the two slotted holes 14, the two slotted holes 14 may be respectively adjacent to the two ends of the corresponding one of the circuit board units 20; or one slotted The hole 14 is adjacent to one end of a corresponding one of the circuit board units 20, and the other of the slot holes 14 is adjacent to an intermediate position of a corresponding one of the circuit board units 20.

Step 130, providing a component motherboard for forming a super-outlet fitting, and attaching the accessory motherboard to at least a portion of the plurality of circuit board units and covering each of the slots.

Referring to Figures 5-6, a fitting motherboard 30 for forming the super-profile fitting 32 is provided. The accessory motherboard 30 is attached to at least a portion of the plurality of circuit board units 20. The accessory motherboard 30 covers each of the slots 14. Specifically, the accessory motherboard 30 is in contact with the first surface 201 of the plurality of circuit board units 20. Of course, a fitting mother board 30 can also be attached to the second side 202 of the plurality of circuit board units 20 according to actual positioning and assembly requirements.

The accessory motherboard 30 can be of different materials for different applications. For example, the accessory motherboard 30 may be a backing for attaching the circuit board unit 20 to an electronic product; or a reinforcing sheet for reinforcing the strength of a specific region of the circuit board unit 20; or for shielding a steel plate or other electromagnetic shielding metal plate for avoiding external electromagnetic interference in a specific area of the cover circuit board unit 20; or for absorbing electromagnetic waves of a specific wavelength generated by the circuit board unit 20 during operation and having a heat conducting function Suction waveguide hot glue, and so on.

Step 140, cutting the circuit board mother board and the accessory motherboard simultaneously to obtain a plurality of mutually separated circuit boards, wherein each circuit board includes a circuit board unit and one of the circuit board units An ultra-outlet fitting having a protruding structure beyond the boundary of the board unit.

Referring to FIG. 6, the circuit board mother board 10 and the accessory motherboard 30 are simultaneously cut by a cutting device such as a punch die or a laser cutter to obtain a plurality of circuit boards 100 separated from each other. Each of the circuit boards 100 includes a circuit board unit 20 and an ultra-outer fitting 32 attached to the circuit board unit 20. The super-profile 32 has a protruding structure 324 that extends beyond the boundaries of the board unit 20.

When the circuit board motherboard 10 and the accessory motherboard 30 are simultaneously cut, the orthographic projection of each protruding structure 324 to be cut on the circuit board motherboard 10 is located on the corresponding one of the slot holes 14 on the circuit board motherboard 10. The inside of the orthographic projection is such that the protruding structure 324 obtained by the cutting does not adhere to the board mother board 10. That is, the cross-sectional area of each of the protruding structures 324 parallel to the first surface 101 of the board mother board 10 is smaller than the cross-sectional area of the corresponding one of the slot holes 14 parallel to the first surface 101 of the board mother board 10.

Specifically, when cutting is performed by a punching die (not shown), a template corresponding to the slotted hole 14 may be disposed under the die (not shown), and the board mother board is not required at this time. 10 flipping, the accessory mother board 30 is attached to the upper mold (not shown) of the punching mold, and the protrusion of the lower mold is used to cut off the protruding structure 324 which needs to be cut. In addition, the circuit board mother board 10 can also be flipped by 180 degrees. At this time, the template below the punching mold does not need to be provided with a protrusion corresponding to the slotted hole 14, and the template of the accessory board 30 and the punching die (not shown) When the upper template (not shown) is pressed, the protruding structure 324 which needs to be cut can be effectively cut. Of course, when cutting with a laser cutter, the board mother board 10 can be flipped and not flipped.

The super-outlet fitting 32 formed after cutting includes a body 322 and a protruding structure 324 protruding from the body 322. The body 322 of the super-type fitting 32 is in contact with the first side 201 of the circuit board unit 20. The protruding structure 324 protrudes from the body 322 to the outside of the circuit board unit 20. The protruding structure 324 can be used for positioning, or it is convenient to tear off the protective film on the surface of the super-type fitting 32 during the assembly process to adhere the circuit board 100 to the electronic product.

The cross-sectional shape of the protruding structure 324 can be set according to specific positioning and assembly requirements. In this embodiment, the cross-sectional shape of the protruding structure 324 is a distance shape. Of course, the cross-sectional shape of the protruding structure 324 may also be a square, a triangle, a semicircle, a semi-ellipse or the like. Generally, the cross-sectional shape of the slit hole 14 parallel to the first surface 101 of the circuit board mother board 10 is the same as the cross-sectional shape of the protruding structure 324. Here, the cross-sectional shape of the slit hole 14 parallel to the first surface 101 of the circuit board mother board 10 is also a distance shape.

In addition, according to the actual use requirements of the circuit board 100, the body 322 of the super-outlet component 32 can also cover the entire first surface 201 of the corresponding circuit board unit 20.

Compared with the prior art, the manufacturing method of the circuit board with the super-outlet component of the present technical solution is to completely fit the accessory motherboard by forming a slotted hole adjacent to the circuit board unit on the circuit board mother board. At least a portion of the plurality of circuit board units, and in the subsequent process, the circuit board mother board and the accessory mother board are simultaneously cut, thereby obtaining a plurality of mutually separated circuit boards, since the manufacturing method does not need to replace the circuit board unit with The super-external fittings are separately cut and separated and then laminated one by one, thereby accelerating the fitting speed of the super-external fittings, and greatly improving the production efficiency of the circuit board having the super-external fittings.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. In the prior art, the above description is only a preferred embodiment of the present invention, and the scope of the patent application of the present invention cannot be limited thereby. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

100‧‧‧ boards

10‧‧‧Board Motherboard

101‧‧‧ first surface

102‧‧‧ second surface

12‧‧‧Preset area

14‧‧‧cut slots

20‧‧‧Circuit unit

201‧‧‧ first side

202‧‧‧ second side

30‧‧‧Parts motherboard

32‧‧‧Super-type accessories

322‧‧‧ Ontology

324‧‧‧Outstanding structure

FIG. 1 is a flow chart of a method for manufacturing a circuit board with an ultra-external accessory according to an embodiment of the present technical solution.

2 is a schematic structural view of a circuit board mother board used in the method of FIG. 1 and a plurality of circuit board units formed on the circuit board mother board.

Figure 3 is a cross-sectional view of Figure 2 taken along the line III-III.

4 is a schematic structural view showing the formation of a slotted hole in the motherboard of the circuit board in the method of FIG. 1.

FIG. 5 is a schematic structural view of the method of FIG. 1 in which a component motherboard is bonded to a partial region of a plurality of circuit board units.

Figure 6 is a schematic view showing the cutting of a circuit board in the method of Figure 1.

Claims (10)

A method for manufacturing a circuit board having an ultra-outlet accessory, comprising the following steps:
Providing a circuit board motherboard, and forming a plurality of circuit board units on the circuit board mother board;
Forming a plurality of slotted holes through the circuit board motherboard on the circuit board motherboard, wherein each circuit board unit is adjacent to the at least one slotted hole;
Providing a component motherboard for forming a super-outlet fitting, and attaching the accessory motherboard to at least a portion of the plurality of circuit board units and covering each of the slots;
Cutting the circuit board mother board and the accessory mother board simultaneously to obtain a plurality of mutually separated circuit boards, wherein each circuit board has a circuit board unit and one of the super-types attached to the circuit board unit An accessory that has a protruding structure that extends beyond the boundaries of the board unit. The method for manufacturing a circuit board having a super-outlet component according to claim 1, wherein the circuit board mother board has a first surface and a second surface, and each circuit board unit has a first surface The first side of the circuit board unit is coplanar with the first surface of the circuit board motherboard, and the second side of the circuit board unit is coplanar with the second surface of the circuit board motherboard. The method for manufacturing a circuit board having a super-outlet component according to claim 1, wherein each circuit board unit has a first side and a second side opposite to each other, the super-outlet type component comprises a body and The protruding structure is formed by the protruding body, and the body of the super-outlet fitting is attached to the first surface of the circuit board unit. The method for manufacturing a circuit board having an ultra-external component according to claim 1, wherein when the plurality of slotted holes penetrating the motherboard of the circuit board are formed on the circuit board, the circuit board is first Defining a plurality of preset areas on the motherboard, wherein each of the preset areas is adjacent to one end of one of the circuit board units; and forming one of the mother boards of the circuit board on each of the preset areas by using a punching or laser cutting method Cut the slot. The method for manufacturing a circuit board having a super-outlet component according to claim 1, wherein when the circuit board mother board and the accessory mother board are simultaneously cut, each protruding structure that needs to be cut is in the circuit The orthographic projection on the board is located inside the corresponding orthographic projection of the slotted hole on the board mother board so that the protruding structure obtained by the cutting does not stick to the board mother board. The method for manufacturing a circuit board having an ultra-external component according to claim 1, wherein when the circuit board mother board and the accessory mother board are simultaneously cut, a punching die or a laser cutting machine is used corresponding to Each circuit board unit cuts the board mother board simultaneously with the accessory board. The method for manufacturing a circuit board having an ultra-external accessory according to claim 6, wherein when the cutting is performed by using a punching die, the template is disposed under the punching die corresponding to the protrusion of the slotted hole, The accessory mother board is attached to the template above the punching mold, and the protruding structure is formed by cutting the protrusion of the lower mold. The method for manufacturing a circuit board having an ultra-external accessory according to claim 6, wherein when the cutting is performed by using a punching die, the accessory motherboard is attached to the template under the punching die, and the upper plate is used. The template is stamped down to cut to form the protruding structure. The method for manufacturing a circuit board having a super-outlet component according to the first aspect of the invention, wherein the circuit board mother board has a first surface and a second surface opposite to each other, the slot hole is parallel to the circuit board motherboard The cross-sectional shape of the first surface is the same as the cross-sectional shape of the protruding structure. The method for manufacturing a circuit board having an ultra-external accessory according to the first aspect of the invention, wherein the accessory motherboard is a backing, a reinforcing sheet, a suction waveguide thermal glue or an electromagnetic shielding metal plate.