TWI391051B - Method for manufacturing printed circuit board assembly - Google Patents

Description

Continuing circuit board manufacturing method

The invention relates to a circuit board manufacturing technology, and in particular to a method for manufacturing a contiguous circuit board.

The manufacture of printed circuit boards generally includes the preparation of copper clad laminates, the fabrication of conductive traces of copper clad laminates, and the mounting, plugging or soldering of circuit components. In order to facilitate downstream placement, plug-in or soldering operations, it has become a trend to make circuit boards into contiguous circuit boards. A contiguous circuit board, also known as a breakable circuit board, includes a plurality of small-area circuit board units arranged side by side or in an array arrangement. In the contiguous circuit board, the adjacent circuit board units are cut while retaining a certain connection strength, so that the splicing circuit board can be easily split after the process of the patch, the plug-in or the soldering is completed. A plurality of circuit boards are formed in a plurality of areas, thereby achieving the purpose of improving production efficiency and reducing production costs.

The previous method of fabricating a contiguous circuit board was to fabricate a plurality of contiguous circuit boards directly on a large area of copper-clad substrate, and then cut the plurality of slabs by molding. Each contiguous circuit board includes a plurality of circuit board units arranged in sequence and two connecting pieces respectively connected to the two ends of the plurality of circuit board units. Each of the connecting pieces has a positioning hole at the top corner. During the molding process, the copper-clad substrate is positioned on the machine table by the positioning hole and cut, and cut to the last circuit board unit of each of the continuous circuit boards, especially when the circuit board unit is away from the connecting piece The circuit board unit will be shaken due to the weak positioning effect, and thus the molding deviation of the circuit board unit is too large, which does not meet the molding precision requirement, and affects Overall performance of the board. When the shape of each of the circuit board units of the contiguous circuit board is long and narrow, for example, when the circuit board unit is an LED light strip circuit board, such a large deviation of the molding is more likely to occur.

In view of the above, it is necessary to provide a method for fabricating a contiguous circuit board to improve the forming precision of the contiguous circuit board.

The technical solution provides a method for manufacturing a contiguous circuit board. The contiguous circuit board includes a first connecting piece, a second connecting piece opposite to the first connecting piece, and a plurality of circuit board units arranged in sequence. Each circuit board unit is connected between the first connecting piece and the second connecting piece. The manufacturing method of the contiguous circuit board includes the steps of: providing a copper clad substrate, wherein the copper clad substrate comprises at least one processing area and a first scrap area surrounding the at least one processing area, the at least one processing area The method includes a plurality of product areas, a first connection area, a second connection area, a plurality of second waste areas, and an auxiliary positioning area, wherein the first connection area is used to form a first connecting piece, and the second connection area is used for forming a first connecting piece Forming a second connecting piece, the plurality of product areas are sequentially arranged for forming a plurality of circuit board units, and each product area is connected between the first connection area and the second connection area, and each second waste area Between the two adjacent product areas, the auxiliary positioning area is connected to one of the outermost product areas of the plurality of product areas; and the plurality of connections are respectively opened in the first connection area and the second connection area Locating a plurality of auxiliary positioning holes in the auxiliary positioning area; positioning the copper-clad substrate on a working table by the plurality of connecting positioning holes and the plurality of auxiliary positioning holes; along a boundary of the at least one processing area Cutting Said copper substrate, to remove the waste region of the first; in a second one of the secondary positioning region farthest from Cutting the scrap zone to the second scrap zone closest to one of the auxiliary positioning zones, sequentially cutting the copper clad substrate along the boundary of each second scrap zone, thereby removing the plurality of second scrap zones; and along the auxiliary positioning The copper-clad substrate is cut at a boundary between the region and the product region connected to the auxiliary positioning region, thereby removing the auxiliary positioning region.

The manufacturing method of the contiguous circuit board provided by the technical solution reserves an auxiliary positioning area connected to the product area at the edge of the processing area on the copper-clad substrate, so that even in the cutting and molding process, even if the last product area is cut At the junction of the second waste area, the product area will not be shaken due to weak positioning, thereby ensuring the molding precision of the product area, and achieving the purpose of improving the forming precision of the integrated continuous circuit board.

The method for fabricating the contiguous circuit board provided by the technical solution will be further described in detail below with reference to the accompanying drawings and embodiments.

The embodiment of the present invention provides a method for fabricating a contiguous circuit board, which includes the following steps: First, please refer to FIG. 1 and FIG. 2 together to provide a copper clad substrate 10, the copper clad substrate 10 including at least one processing The zone 11 is surrounded by a first waste zone 12 that is connected around the at least one processing zone 11. The copper clad substrate 10 can be a rectangular double-sided copper clad laminate comprising a first conductive layer, an insulating layer and a second conductive layer stacked in sequence. In the embodiment, the processing region 11 is also rectangular, and the length direction thereof is the width direction of the copper clad substrate 10. The number of the processing zones 11 is two, and the two processing zones 11 are arranged up and down along the length direction of the copper clad substrate 10. The first scrap area 12 is correspondingly a "back" shape.

The at least one processing zone 11 includes a plurality of product areas 13, a first connection area 14, a second connection area 15, a plurality of second waste areas 16, and an auxiliary positioning area 17. The first connection zone 14 is for forming a first connecting piece. The second connection zone 15 is for forming a second connecting piece. The plurality of product areas 13 are sequentially arranged for forming a plurality of circuit board units. In this embodiment, the number of the plurality of product areas 13 is four. Each of the product areas 13 is rectangular, and the four product areas 13 are parallel to each other and are arranged along the width direction of the copper clad substrate 10. The first connection region 14 and the second connection region 15 are also rectangular, and are arranged along the length direction of the copper-clad substrate 10, that is, each product region 13 is connected to the first connection region. 14 is between the second connection zone 15. In this embodiment, the first connection region 14 and the second connection region 15 are parallel to each other. Each product area 13 is vertically connected between the first connection area 14 and the second connection area 15. The first connection zone 14 is located on the left side of the processing zone 11, and the second connection zone 15 is located to the right of the processing zone 11. Each second waste zone 16 is located between two adjacent product zones 13. In this embodiment, the number of the second scrap areas 16 is three, corresponding to the four product areas 13. The second waste zone 16 is also rectangular in shape. The auxiliary positioning zone 17 is connected to one of the outermost product zones 13 of the plurality of product zones 13. The auxiliary positioning area 17 is also rectangular, and is arranged along the width direction of the copper clad substrate 10. The auxiliary positioning zone 17 is parallel to the plurality of product zones 13. The length of the auxiliary positioning zone 17 is equal to the length of each product zone 13 in a direction parallel to the first connection zone 14.

In the second step, referring to FIG. 2, a plurality of connection positioning holes are respectively opened in the first connection area 14 and the second connection area 15, and the auxiliary positioning area 17 is A plurality of auxiliary positioning holes 170 are opened. The plurality of connection positioning holes include a first connection positioning hole 140 at the first connection area 14 and a second connection positioning hole 150 at the second connection area 15. The number of the first connection positioning holes 140 is two, and each of the first connection positioning holes 140 is adjacent to one end of the first connection area 14 , that is, a first connection positioning hole 140 is adjacent to the left side of the processing area 11 . One of the top corners, a first connecting positioning hole 140 is adjacent to the other top corner of the left side of the processing zone 11. The number of the second connection positioning holes 150 is two, and each of the second connection positioning holes 150 is adjacent to one end of the second connection area 15, that is, a second connection positioning hole 150 is adjacent to the right side of the processing area 11. One of the top corners, a second connecting positioning hole 150 is adjacent to the other top corner of the right side of the processing zone 11. The center of the plurality of auxiliary positioning holes 170 opened by the auxiliary positioning area 17 is located on the same straight line. Preferably, the plurality of auxiliary positioning holes 170 are equally spaced at the auxiliary positioning area 17. In this embodiment, the number of the auxiliary positioning holes 170 is four.

At the same time, a plurality of peripheral positioning holes 120 may be opened in the first scrap area 12, and a plurality of through holes 130 may be opened in the plurality of product areas 13. In this embodiment, the number of the peripheral positioning holes 120 is four, and each of the peripheral positioning holes 120 is adjacent to a top corner of the copper clad substrate 10. Of course, the number of the peripheral positioning holes 120 may also be two, three, five or more. The number of through holes 130 in each product zone 13 is two.

The peripheral positioning hole 120, the through hole 130, the first connection positioning hole 140, the second connection positioning hole 150 and the auxiliary positioning hole 170 can be formed at one time by a drilling machine.

In the third step, referring to FIG. 3, the conductive metal layer 131 is formed by electroplating on the hole walls of the plurality of via holes 130 to obtain the via holes 132. Specifically, it can be A chemical copper layer is formed on the pore walls of the plurality of via holes 130 by chemical deposition, and an electroplated copper layer is formed on the chemical copper layer.

In the fourth step, the first conductive layer 14 and the second conductive region 15 of the copper-clad substrate 10 are removed from the first conductive layer and the second conductive layer corresponding to the auxiliary positioning region 17, and the structure shown in FIG. 4 is obtained. Specifically, the photoresist layer having a predetermined pattern is formed on the first conductive layer and the second conductive layer of the copper-clad substrate 10 by the image transfer method, and the first connection region 14 and the second connection region 15 are formed. A region corresponding to the auxiliary positioning region 17 is exposed to the photoresist layer. And etching the portion of the first conductive layer and the second conductive layer that is not protected by the photoresist layer by laser etching or chemical etching, thereby separating the first conductive layer and the second conductive layer A connection region 14, a second connection region 15 and a region corresponding to the auxiliary positioning region 17 are removed, and finally, the photoresist layer is removed. Of course, the photoresist layer may have a conductive pattern corresponding to the plurality of product regions 13 so as to correspond to the plurality of product regions 13 in the first conductive layer and the second conductive layer in this step. A conductive pattern is formed at the place.

In the fifth step, referring to FIG. 5, the copper clad substrate 10 is positioned on a worktable 20 by the plurality of connection positioning holes and the plurality of auxiliary positioning holes 170. Providing a worktable 20 having a plurality of positioning posts 21, the copper-clad substrate being interposed by the peripheral positioning holes 120, the plurality of connection positioning holes, and the plurality of auxiliary positioning holes 170 and the plurality of positioning posts 21 10 is positioned on the workbench 20. The table 20 can be a machine of a cutting machine.

In the sixth step, the copper clad substrate 10 is cut along the boundary of the at least one processing zone 11, thereby removing the first scrap area 12, and a plurality of processing regions 11 as shown in FIG. 6 are obtained. Specifically, the copper clad substrate 10 can be used using a milling cutter Line cutting processing. In this embodiment, the cutting of this step is performed using a milling cutter having a diameter of 1.8 mm. In this step and the subsequent steps, the manufacturing method of the contiguous circuit board is described by a processing area 11 as shown in FIG.

In a seventh step, referring to FIG. 7, in order from the second scrap zone 16 which is farthest from the auxiliary positioning zone 17 to the second scrap zone 16 which is closest to the auxiliary positioning zone 17, sequentially along each second scrap zone 16 The copper clad substrate 10 is cut at the boundary to remove the plurality of second scrap regions 16. After the plurality of second waste areas 16 are removed, the plurality of product areas 13 are joined together by the first connection area 14 and the second connection area 15. When cutting to the product zone 13 closest to the auxiliary positioning zone 17, since the auxiliary positioning zone 17 is closely positioned on the table 20 by its auxiliary positioning hole 170, the product zone 13 does not sway during cutting, thereby ensuring that each The cutting accuracy of a product area 13 is within a predetermined range. In this embodiment, the cutting of this step is performed using a milling cutter having a diameter of 2.0 mm.

It can be understood that the auxiliary positioning area 17 is not necessarily located below the plurality of product areas 13 and may be located above the plurality of product areas 13, such that each product area 13 is cut adjacent to the product area 13. At the junction of the second waste zone 16, it should start from the product zone 13 located at the bottom.

In the eighth step, the copper-clad substrate 10 is cut along the boundary between the auxiliary positioning area 17 and the product area 13 connected to the auxiliary positioning area 17, thereby removing the auxiliary positioning area 17, and as shown in FIG. The circuit board unit 33 and the contiguous circuit board 30 of the first connection area 14 and the second connection area 15 respectively located on both sides of the plurality of circuit board units 33 are included. In this embodiment, the cutting of this step is performed using a milling cutter having a diameter of 1.8 mm. In the ninth step, please refer to FIG. 8 and FIG. 9 together, and cut the connection between each product area 13 and the first connection area 14 and the second connection area 15 along the broken line in FIG. 8 for each product area. The first connecting structure 133 and the second connecting structure 134 are respectively formed on the two sides of the first connecting portion 14 and the second connecting portion 15 respectively, and the first connecting piece 34 and the second connecting piece 35 are respectively formed, as shown in FIG. The contiguous circuit board 30 is shown. The first connecting structure 133 is adjacent to the first connecting piece 34. The second connecting structure 134 is adjacent to the second connecting piece 35. The obtained first connecting structure 133 and second connecting structure 134 may be rectangular, and the length and width thereof are far smaller than the length and width of the product area 13 so as to facilitate the circuit board unit 33 and the first operation in the subsequent operation. The connecting piece 34 and the second connecting piece 35 are broken. In this embodiment, the cutting of this step is performed using a milling cutter having a diameter of 0.8 mm.

The manufacturing method of the contiguous circuit board provided by the technical solution reserves an auxiliary positioning area connected to the product area at the edge of the processing area on the copper-clad substrate, so that even in the cutting and molding process, even if the last product area is cut At the junction of the second waste area, the product area will not be shaken due to weak positioning, thereby ensuring the molding precision of the product area, and achieving the purpose of improving the forming precision of the integrated continuous circuit board.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

10‧‧‧Copper-clad substrate

11‧‧‧Processing area

12‧‧‧First Waste Area

120‧‧‧ Peripheral positioning holes

13‧‧‧Product Area

130‧‧‧through hole

131‧‧‧conductive metal layer

132‧‧‧through holes

133‧‧‧First connection structure

134‧‧‧Second connection structure

14‧‧‧First connection area

140‧‧‧First connection positioning hole

15‧‧‧Second connection area

150‧‧‧Second connection positioning hole

16‧‧‧Second waste area

17‧‧‧Auxiliary location area

170‧‧‧Auxiliary positioning holes

20‧‧‧Workbench

21‧‧‧Positioning column

30‧‧‧Continuous board

33‧‧‧Circuit unit

34‧‧‧First connecting piece

35‧‧‧Second connection piece

1 is a top plan view of a copper clad substrate provided by the present technical solution.

Fig. 2 is a plan view showing the opening of the copper-clad substrate.

3 is a plan view showing a conductive metal layer formed on a hole wall of a plurality of through holes of the copper-clad substrate.

4 is a plan view showing the first connection region, the second connection region, and the conductive layer corresponding to the auxiliary positioning region of the copper-clad substrate.

Fig. 5 is a plan view showing the copper-clad substrate positioned on the stage.

Figure 6 is a plan view of a processing zone obtained by cutting the edges of the plurality of processing zones.

Figure 7 is a plan view showing the cutting of the plurality of second scrap areas after the processing zone is removed.

Figure 8 is a plan view showing the cutting of the processing zone to remove the auxiliary positioning zone.

Figure 9 is a schematic view showing the structure of the resulting contiguous circuit board.

10‧‧‧Copper-clad substrate

12‧‧‧First Waste Area

120‧‧‧ Peripheral positioning holes

13‧‧‧Product Area

130‧‧‧through hole

14‧‧‧First connection area

140‧‧‧First connection positioning hole

15‧‧‧Second connection area

150‧‧‧Second connection positioning hole

170‧‧‧Auxiliary positioning holes

Claims (8)

A manufacturing method of a contiguous circuit board, comprising: a first connecting piece, a second connecting piece opposite to the first connecting piece, and a plurality of circuit board units arranged in sequence, each circuit board unit being connected to the first Between a connecting piece and a second connecting piece, the manufacturing method of the connecting circuit board comprises the steps of: providing a copper clad substrate, wherein the copper clad substrate comprises at least one processing area and a surrounding around the at least one processing area a first scrap area, the at least one processing area includes a plurality of product areas, a first connection area, a second connection area, a plurality of second waste areas, and an auxiliary positioning area, wherein the first connection area is used to form the first a connecting piece, the second connecting area is for forming a second connecting piece, the plurality of product areas are sequentially arranged for forming a plurality of circuit board units, and each product area is connected to the first connecting area and the second Between the connection areas, each of the second waste areas is located between two adjacent product areas, and the auxiliary positioning area is connected to one of the outermost product areas of the plurality of product areas, and the copper-clad substrate comprises Stack in order a first conductive layer, an insulating layer and a second conductive layer; a plurality of connection positioning holes are respectively defined in the first connection area and the second connection area, and a plurality of auxiliary positioning holes are opened in the auxiliary positioning area, and a plurality of through-holes penetrating through the first conductive layer, the insulating layer and the second conductive layer; forming a conductive metal layer on the hole wall of the plurality of through holes to turn on the first conductive layer and the second conductive Forming a conductive pattern on a plurality of product regions of the first conductive layer and the second conductive layer; and the copper-clad base is connected by the plurality of connection positioning holes and the plurality of auxiliary positioning holes Positioning the board on a workbench; cutting the copper clad substrate along a boundary of the at least one processing area to remove the first scrap area; according to the second scrap area farthest from the auxiliary positioning area to the closest assisted positioning a sequence of one of the second scrap regions, sequentially cutting the copper clad substrate along the boundary of each second scrap region, thereby removing the plurality of second scrap regions; and along the auxiliary positioning region and the auxiliary positioning region The copper-clad substrate is cut at the junction of the connected product regions to remove the auxiliary positioning region. The method for manufacturing a contiguous circuit board according to claim 1, wherein the first connection area and the second connection area are parallel to each other, and each product area is vertically connected to the first connection area and Between the two connection zones, the auxiliary positioning zone is parallel to the plurality of product zones. The method of fabricating a contiguous circuit board according to claim 2, wherein the length of the auxiliary positioning area is equal to the length of each product area in a direction parallel to the first connection area. The method for manufacturing a contiguous circuit board according to the first aspect of the invention, wherein the center of the plurality of auxiliary positioning holes is located on a straight line. The method for fabricating a contiguous circuit board according to claim 1, wherein the plurality of auxiliary positioning holes are arranged at equal intervals in the auxiliary positioning area. The method for manufacturing a contiguous circuit board according to claim 1, wherein a plurality of connection positioning holes are respectively opened in the first connection area and the second connection area, and the first waste area is opened. The plurality of peripheral positioning holes are used to assist in positioning the copper clad substrate. The method for fabricating a contiguous circuit board according to the first aspect of the invention, wherein the plurality of product regions of the first conductive layer and the second conductive layer form a guide And removing the first conductive region and the second conductive layer corresponding to the first connection region, the second connection region and the auxiliary positioning region of the copper-clad substrate. The method for fabricating a contiguous circuit board according to claim 1, wherein each of the circuit board units has a first connection structure for connecting with the first connection piece and for a second connecting structure connected to the connecting piece, after removing the auxiliary positioning area, cutting a connection between each product area and the first connecting area and the second connecting area, so as to be two in each product area The sides form a first connection structure and a second connection structure, respectively.