JP2005191090A - Manufacturing method for wiring board and wiring-board raw material - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a wiring board lightening a load applied to a cutting edge by the reduction of a metallic cut length and lengthening the lifetime of the cutting edge, suppressing the increase of a manufacturing cost, and improving oxidation/corrosion by decreasing the exposure of a metallic cut surface; and to provide a wiring-board material being difficult to conduct deformation regardless of the shortening of a metallic connecting section, and conducting cutting/separation works or the like to a plurality of the wiring boards with high accuracy. <P>SOLUTION: Cutting reference marks 11 as the places of cutting references are projected and formed on the external surface sides of resin insulating layers 5 on the upper side (the surface side) of reference holes 10 formed in a concentric shape with the reference holes 10 (center lines 50). That is, each cutting reference mark 11 is positioned just above each reference hole 10. One or a plurality of cutting marks 22 are projected and formed on the external surface sides of the resin insulating layers 5 on the upper side (the surface side) at every cutting projected line 3 while using either cutting reference mark 11 as references. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing a wiring board and a wiring board material.

  Conventionally, a wiring board provided with a metal plate as a core material has been used mainly for the purpose of improving heat dissipation, and it may be used as a wiring board for mounting components that generate large amounts of heat such as power transistors. A wiring board provided with a metal plate as a core material generally uses a cutting blade for a wiring board material (connected wiring board) as an intermediate product from the viewpoint of improving productivity and the like, as shown in Patent Document 1, for example. It is manufactured by cutting. And in the wiring board material shown in patent document 1, the whole part (entire circumference) corresponding to the cutting planned line of a metal plate is formed in the thin part thinner than the original thickness, and generation | occurrence | production of the burr | flash at the time of a cutting | disconnection is suppressed. At the same time, cutting is easy.

  In the method of manufacturing a wiring board as disclosed in Patent Document 1, the metal plate is cut over the entire circumference of the wiring board, so that the load applied to the cutting blade becomes larger compared to, for example, a resin or ceramic core material. There is a risk that the life of the cutting blade is shortened or breakage is likely to occur. Moreover, since the cut surface of the metal plate is exposed over the entire circumference by cutting, there is a possibility that oxidation, corrosion, and the like are likely to occur. When a plurality of wiring pattern layers or build-up layers are laminated on at least one outer surface side of the front and back direction of the wiring board material (metal plate thereof), the alignment deviation from the reference hole of each wiring pattern layer is If it occurs, the cutting blade may deviate from the thin portion and cut the metal plate body, which may increase the cutting load and increase the exposed area of the metal cut surface.

  Therefore, in Patent Document 2, the separation position of each wiring board is determined using alignment marks for vertical or horizontal alignment of a plurality of wiring pattern layers, and a metal is obtained using a laser processing apparatus or a cutting blade. The buildup layer and the like are deleted until the plate (metal core plate) is exposed, and the exposed metal plate is dissolved and removed with an etching solution.

JP 2000-133913 A JP 2003-152335 A

  According to the manufacturing method of Patent Document 2, since the final separation of the wiring board (metal plate) is performed by dissolving and removing (etching) without cutting, various problems associated with an increase in cutting load do not occur, and the separation is facilitated. Generation of burrs on the separation surface can be prevented. However, on the other hand, in order to divide into individual wiring boards (metal plates), each process of forming an etching resist → exposure of the metal plate → etching (dissolving and separating the metal plate) → removing the etching resist is required. In addition, the production cost may increase significantly due to an increase in cycle time and equipment costs. In addition, even with such a manufacturing method, it is difficult to reduce the exposed metal area when separating the wiring boards.

  The object of the present invention is to reduce the load on the cutting blade and extend the life of the cutting blade by reducing the metal cutting length while suppressing an increase in manufacturing cost, and reducing the exposure of the metal cutting surface to reduce oxidation and corrosion. Another object of the present invention is to provide a method of manufacturing a wiring board that can improve the above. Furthermore, an object of the present invention is to provide a wiring board material that is not easily deformed despite the shortening of the metal connecting portion, and that can perform cutting / separation work into a plurality of wiring boards with high accuracy.

Means for Solving the Problems and Effects of the Invention

In order to solve the above problems, a method for manufacturing a wiring board according to the present invention includes:
A wiring board manufacturing method for cutting and separating a wiring board material having a metal plate as a core material into a plurality of wiring boards by means of longitudinal and lateral cutting lines each having a plurality of intersecting positions. There,
A slot having a predetermined width along the planned cutting line in a form in which a part of the planned cutting line remains as a connecting portion, and a reference hole serving as a reference for moving the cutting blade along the planned cutting line, A penetrating part forming step of forming the metal plate penetrating in the front and back directions,
A cutting reference mark forming step for forming a cutting reference mark at a cutting reference position corresponding to the reference hole on the outer surface side of the resin insulating layer laminated along the front and back direction of the metal plate,
In order to separate the wiring board material into the individual wiring boards, a cutting step of cutting along the planned cutting line separated from the cutting reference mark by a predetermined distance on the basis of the cutting reference mark;
It is characterized by including.

  According to this manufacturing method, it is possible to easily match the cutting position with the planned cutting line by using the reference hole and the cutting reference mark. In addition, since slots are formed through the cutting lines for separation in the front and back direction (plate thickness direction), the cutting length of the metal plate is reduced and the load on the cutting blade is reduced. The life of the cutting blade can be extended. Moreover, the manufacturing cost for that purpose can be avoided. Moreover, since the exposed area accompanying cutting | disconnection of a metal plate becomes small, oxidation and corrosion can be suppressed. Furthermore, since the exposure of the metal cut surface is reduced, it is possible to improve the situation where moisture penetrates between the metal plate and the resin insulating layer and the resin insulating layer swells or peels off. Note that a method such as etching or laser processing is used for forming the slot and the reference hole in the metal plate, and a dicing saw, a diamond cutter, a laser processing apparatus or the like is used for cutting the wiring board material.

Therefore, in order to solve the above problems, the wiring board material of the present invention is
Using a metal plate as a core material, a wiring board material to be cut and separated into a plurality of wiring boards by cutting lines in the vertical direction and the horizontal direction in which a plurality of intersecting positions are formed,
In a form in which a part of the planned cutting line remains as a connecting portion, a slot is formed through the metal plate along the planned cutting line with a predetermined width in the front and back direction,
A reference hole formed so as to penetrate the metal plate in the front and back direction so as to be a reference for moving the cutting blade along the planned cutting line,
On the outer surface side of the resin insulating layer laminated along the front and back direction of the metal plate, a cutting reference mark formed at a cutting reference position corresponding to the reference hole,
Including
In order to separate the individual wiring boards, it is planned that the cutting blade is positioned at a position separated from the cutting reference mark by a predetermined distance with respect to the cutting reference mark.

  According to this wiring board material, even if the connecting portion of the metal plate is shortened (reduced) by the slot formed in the front and back direction (plate thickness direction) along the planned cutting line, a part of the planned cutting line is made of metal. Since the plates are connected to each other, a structure that is difficult to deform can be maintained. For this reason, warping and bending of the wiring board material can be suppressed during handling, and cutting / separation work into a plurality of wiring boards can be performed with high accuracy.

Next, in order to solve the above-described problem, the method of manufacturing a wiring board according to the present invention, when a single wiring pattern layer is laminated in the front and back direction of the metal plate,
A wiring board material in which a wiring pattern layer is laminated with a metal plate as a core material is cut into a plurality of wiring boards by cutting lines parallel to the vertical direction and the horizontal direction in which a plurality of orthogonal intersection positions are formed, A method of manufacturing a wiring board for separation,
A slot having a predetermined width along the planned cutting line and a reference hole serving as a reference for moving the cutting blade along the planned cutting line in such a manner that only the crossing position remains as a cross-shaped connecting portion. , Each through the metal plate in the front-and-back direction, through-part forming step of simultaneously forming by etching,
A cutting reference mark is provided at a cutting reference position corresponding to the reference hole on either outer surface side of the front and back surfaces of the resin insulating layer covering the front and back surfaces of the metal plate and filling the inside of the slot and the reference hole. A cutting reference mark forming step to be formed;
A cutting position mark forming step for forming a cutting position mark for each of the planned cutting lines with respect to the cutting reference mark on the outer surface side of either one of the front and back directions of the resin insulating layer;
In order to separate the wiring board material as the individual wiring boards, a cutting step of cutting the cutting position mark by positioning the width center of the cutting blade;
It is characterized by including.

Further, in order to solve the above-described problem, the method for manufacturing a wiring board according to the present invention, when a plurality of wiring pattern layers are laminated on at least one outer surface side of the front and back direction of the metal plate,
A wiring board material in which a metal plate is used as a core material and a plurality of wiring pattern layers are laminated on at least one outer surface side in the front and back directions is parallel to the vertical direction and the horizontal direction in which a plurality of orthogonal intersection positions are formed. A method of manufacturing a wiring board for cutting and separating into a plurality of wiring boards by a planned cutting line,
A slot having a predetermined width along the planned cutting line in a form in which only the intersection position remains as a cross-shaped connection portion, and serves as a reference for vertical or horizontal alignment of the plurality of wiring pattern layers, And a through hole forming step for simultaneously forming a reference hole for moving the cutting blade along the planned cutting line by etching through the metal plate in the front and back directions,
A cutting reference mark forming step of forming a cutting reference mark at a cutting reference position corresponding to the reference hole on the outer surface side of the resin insulating layer supporting the outermost wiring pattern layer;
On the outer surface side of the resin insulation layer, a cutting position mark forming step for forming a cutting position mark for each of the planned cutting lines with reference to the cutting reference mark,
In order to separate the wiring board material as the individual wiring boards, a cutting step of cutting the cutting position mark by positioning the width center of the cutting blade;
It is characterized by including.

  According to these manufacturing methods, by using the reference hole, the cutting reference mark, and the cutting position mark, the cutting position can be more easily matched with the planned cutting line. In addition, the cross cross-shaped connecting portion is left only at the crossing position of the orthogonal shape, and the slot is formed in the other direction along the planned cutting line in the front and back direction (plate thickness direction). The load applied to the cutting blade can be reduced and the life of the cutting blade can be extended. In addition, since the reference hole and the slot are simultaneously formed by etching, it is not necessary to greatly increase the manufacturing cost in the through-hole forming step. And since a cutting position mark is formed for every planned cutting line, it cuts in a cutting process and separation operation is performed with high efficiency. Moreover, since the exposed area accompanying cutting | disconnection of a metal plate becomes small, oxidation and corrosion can be suppressed. Furthermore, since the cutting position mark (scheduled cutting line) is aligned with the center of the width of the cutting blade, the cutting blade cuts the metal wall surface of the slot, thereby increasing the cutting load and increasing the exposed area of the metal cutting surface. Can be prevented. In addition, by reducing the exposure of the metal cut surface, it is possible to improve the situation in which moisture penetrates between the metal plate and the resin insulating layer and the resin insulating layer swells or peels off.

Next, in order to solve the above problems, the wiring board material of the present invention is
A wiring board that is cut and separated into a plurality of wiring boards by cutting lines parallel to the vertical direction and the horizontal direction in which wiring pattern layers are laminated using a metal plate as a core material, and a plurality of orthogonal crossing positions are formed. Material,
In a form in which only the crossing position remains as a cross-shaped connecting portion, a slot is formed through the metal plate along the planned cutting line with a predetermined width in the front and back direction by etching,
A reference hole formed through the metal plate in the front and back direction by etching so as to be a reference for moving the cutting blade along the planned cutting line,
A cutting formed at a cutting reference position corresponding to the reference hole on either outer surface side of the front and back surfaces of the resin insulating layer covering the front and back surfaces of the metal plate and filling the inside of the slot and the reference hole Fiducial marks and
On the outer surface side of either one of the front and back surfaces of the resin insulation layer, a cutting position mark formed for each of the planned cutting lines with reference to the cutting reference mark,
Including
In order to separate the individual wiring boards, the cutting position mark is scheduled to be cut with the width center of the cutting blade positioned.

In addition, in order to solve the above problems, the wiring board material of the present invention is
With a metal plate as a core material, a plurality of wiring pattern layers are laminated on at least one outer surface side of the front and back surfaces, and a plurality of orthogonal intersection positions are formed, respectively, by a planned cutting line parallel to the vertical direction and the horizontal direction, A wiring board material that is cut and separated into a plurality of wiring boards,
In a form in which only the crossing position remains as a cross-shaped connecting portion, a slot is formed through the metal plate along the planned cutting line with a predetermined width in the front and back direction by etching,
Front and back directions of the metal plate by etching so as to be a reference for alignment in the vertical direction or the horizontal direction of the plurality of wiring pattern layers and to be a reference for moving a cutting blade along the planned cutting line A reference hole formed therethrough,
On the outer surface side of the resin insulation layer that supports the outermost wiring pattern layer, a cutting reference mark formed at a cutting reference position corresponding to the reference hole,
On the outer surface side of the resin insulation layer, a cutting position mark formed for each of the planned cutting lines with reference to the cutting reference mark,
Including
In order to separate the individual wiring boards, the cutting position mark is scheduled to be cut with the width center of the cutting blade positioned.

  According to these wiring board materials, even if the connecting portion of the metal plate is limited to the orthogonal crossing position by the slots formed in the front and back direction (plate thickness direction) along the planned cutting line, the crossing position In this case, since the metal plates are connected to each other in a cross shape, it is possible to maintain a structure that is more difficult to deform. Therefore, warping and bending of the wiring board material can be suppressed during handling, and cutting into a plurality of wiring boards, separation work and the like can be performed with high accuracy. For example, even when the wiring board material is transported or moved for cutting, it is difficult to deform by the cross-shaped connecting part, and the cutting blade can be quickly aligned with the planned cutting line by the cutting position mark. Can be cut and separated with high accuracy and high efficiency.

  Here, in the present invention, “scheduled cutting line” means “scheduled center line”. “Resin insulation layer” means a metal plate resin insulation layer covering the front and back surfaces of a metal plate, and for forming a plurality of wiring pattern layers on at least one outer surface side in the front and back direction of the metal plate. It may mean a resin insulation buildup layer (insulation resin buildup layer). One of the “cutting reference mark” and the “cutting position mark” may be formed on the front side and the back side of the metal plate, respectively.

  In consideration of conductivity, workability, etc., for example, copper, a copper alloy, or an iron / nickel alloy (for example, Invar) can be used for the metal plate. Of these, Invar has a low coefficient of thermal expansion. It is suitable for a wiring board provided with a plate as a core material. The resin insulation layer is impregnated with a thermosetting resin such as epoxy resin in fluorine resin such as epoxy resin, polyimide resin or continuous porous polytetrafluoroethylene (PTFE) in consideration of insulation and heat resistance. The composite material etc. which were made to adopt are employable. As a cutting blade for cutting the wiring board material, a blade of a dicing saw, a cutter blade of a diamond cutter, or the like is used.

  In the cutting reference mark forming step of such a method of manufacturing a wiring board, the outer surface temperature of the resin insulating layer is increased by thermocompression to the softening temperature of the resin insulating layer or more to smooth the outer surface, and the smoothed resin insulating layer It is desirable to form a cutting reference mark on the outer surface of the projection. Alternatively, in the cutting position mark forming step, the outer surface temperature of the resin insulating layer is raised to a temperature equal to or higher than the softening temperature of the resin insulating layer by thermocompression bonding, and the outer surface is smoothed, and the cutting position mark is formed on the outer surface of the smoothed resin insulating layer. It is desirable to form the protrusion. By forming cutting reference marks and cutting position marks on the outer surface of the smoothed resin insulating layer, detection of these marks in the next process can be facilitated, and detection errors can be made relatively small.

  In the cutting position mark forming step, if the cutting position mark is provided at least at the end position in the cutting direction on the planned cutting line, the cutting position mark is marked until the cutting blade completes the moving / cutting process. Therefore, the cutting position can be held with higher accuracy.

  In the through-hole forming step, one or more reference holes may be formed in the metal plate in the outer region of the planned cutting line that includes all the wiring boards scheduled to be cut and separated. is there. When the cutting blade is moved and / or when the cutting reference mark or cutting position mark is formed, a reference hole serving as a reference is formed in the outer region other than the cutting / separating region, so that it can also be used as a reference hole for the alignment mark. Can be achieved.

By the way, in the cutting process of such a method of manufacturing a wiring board, when the width of the cutting blade that sandwiches the planned cutting line is WB and the width of the slot that sandwiches the planned cutting line is WS,
WB ≦ WS
It is desirable to satisfy. This prevents a cutting blade such as a dicing blade from cutting the metal wall surface of the slot, prevents an increase in cutting load and an increase in the exposed area of the metal cutting surface, and further extends the life of the cutting blade.

Also, in the cutting process of the method of manufacturing a wiring board, the width of the cutting blade that sandwiches the planned cutting line is WB, the width of the slot that sandwiches the planned cutting line is WS, and the width of the connecting part that sandwiches the planned cutting line is When W
WB ≤ WS ≤ W
It is desirable to satisfy. This prevents the cutting blade from cutting the metal wall surface of the slot, and the cross-shaped connecting portion formed at the orthogonal crossing position suppresses deformation (bending, bending, etc.) of the wiring board material. The accuracy at the time of cutting can be increased.

  Furthermore, in such a cutting process, the difference WS-WB between the width of the slot and the width of the cutting blade includes an alignment error WA which is the maximum deviation amount from the reference hole of each wiring pattern layer in the vertical direction or the horizontal direction. It is desirable to include at least. Thus, even in the case of a multilayer wiring board material (build-up wiring board material) in which a plurality of wiring pattern layers or build-up layers are laminated on at least one outer surface side in the front and back direction of the metal plate, the cutting blade is The situation where the metal wall surface of the slot is cut can be prevented.

(Example 1)
Hereinafter, embodiments of the present invention will be described with reference to examples shown in the drawings.

  FIG. 1 is a schematic plan view showing an embodiment of a wiring board material according to the present invention, and a C1-C2-C3-C4 sectional view thereof is shown in FIG. 6 (an explanatory diagram of a manufacturing process). As shown in FIG. 6, in this embodiment, a wiring pattern layer to be described later is composed of only core wiring pattern layers 12 and 42.

  As shown in FIG. 1, a wiring board material 1 is a rectangular section 2 ′ (a part to be a wiring board 2 described later by cutting) having a rectangular shape (including a rectangle and a square in this embodiment; a square in FIG. 1). Are connected to each other (in the embodiment, a total of 9 in 3 rows × 3 columns) and are formed in a panel shape. The wiring board material 1 is divided (cut / separated) along a planned cutting line 3 (meaning a planned cutting center line in this embodiment) in a cutting process described later. A plurality (16 in total in the embodiment) of intersecting positions (orthogonal intersection positions) orthogonal to each other are formed by a plurality of cutting lines 3 (four in the embodiment) parallel to the vertical and horizontal directions. ing. The wiring board 2 (see FIG. 7A) is manufactured by cutting along the planned cutting lines 3 individually.

  As shown in FIG. 6, the wiring board material 1 has a metal plate 4 as a core, and both front and back surfaces of the metal plate 4 are a metal plate resin insulation layer (hereinafter simply referred to as a resin insulation layer) 5 and its outer surface side. Of copper foil (not shown). The metal plate 4 is made of Invar made of iron / nickel alloy in consideration of thermal expansion coefficient, conductivity, workability and the like. The resin insulation layer 5 is formed by applying a prepreg (semi-cured sheet) made of a composite material obtained by impregnating an epoxy resin to continuous porous PTFE selected in consideration of insulation, heat resistance, etc. The metal plate 4 is laminated (coated) on both the front and back surfaces by stacking in layers and hot pressing (thermocompression bonding) to cure the prepreg.

  Next, FIG. 2 is a plan view of the metal plate 4 and an enlarged explanatory view thereof. 3A is a cross-sectional view taken along the line AA in FIG. 2A, and FIG. 3B is a cross-sectional view taken along the line BB. In FIG. 2, a rectangular (square in the embodiment) -shaped metal plate 4 has elongated slot 6 that penetrates in the front and back direction (plate thickness direction) along the planned cutting line 3, and is divided metal plate 7 ′ ( Corresponding to the rectangular partition part 2 ′, it is formed in a form that surrounds the four circumferences of a part to be an individual metal plate 7 to be described later by cutting. That is, in the partition metal plate 7 ′ partitioned by the planned cutting line 3, slots 6, 6, 6, 6 are formed on the four surrounding sides except for the four corners (corners). Specifically, the slot 6 is formed so that the position where the planned cutting line 3 intersects orthogonally and its periphery (cross-cross portion) remain as the connecting portion 8. The slot 6 is formed by etching as will be described later.

  In a plan view (FIG. 2), the outer region of the planned cutting line 3 located on the outermost side of the metal plate 4 (the region excluding all partitioning metal plates 7 ′), that is, the four corners of the outer periphery are scheduled to be cut. Reference holes 10 serving as a reference for moving the dicing blade 23 (cutting blade) along the line 3 are formed one by one (four in total) penetrating in the front and back direction of the metal plate 4. The reference hole 10 is simultaneously formed by etching when the slot 6 is formed.

  Further, as shown in FIG. 2B, the metal plate 4 has a plurality of metal plate through holes (hereinafter also simply referred to as through holes) 9 penetrating the front and back surfaces (for example, four for each partition metal plate 7 ′). ) Is formed. The through-hole 9 is formed in a separate process from the slot 6 and the reference hole 10 by etching or in the same process. The slot 6, the reference hole 10, and the through hole 9 are filled and filled with the resin insulating layer 5 when the front and back surfaces of the metal plate 4 are covered with the resin insulating layer 5 (FIG. 5F). )reference).

  In FIG. 6, a cutting reference mark 11 serving as a cutting reference position is applied to, for example, resin or the like on the outer surface side of the resin insulating layer 5 concentrically with the reference hole 10 (center line 50) and above (surface side). The protrusion is formed. That is, each cutting reference mark 11 is located immediately above each reference hole 10 (overlapping in plan view). In addition, on the outer surface side of the upper (surface side) resin insulation layer 5, one or a plurality of cutting marks 22 (cutting position marks) for each planned cutting line 3 with reference to any cutting reference mark 11, For example, the protrusion is formed by applying resin or the like. In this embodiment, as shown in FIG. 1, the cut mark 22 is provided at an orthogonal crossing position of the planned cutting line 3 (that is, the center of the connecting portion 8 of the metal plate 4; see FIG. 2) and is located on the outermost side. A total of 12 points are formed at all crossing positions (4 places) in the planned cutting line 3 and at other crossing positions (2 places) on the start point side and end point side in the other planned cutting lines 3. Thus, the cutting mark 22 includes the starting point position and the ending point position in the cutting direction on each cutting planned line 3.

  Returning to FIG. 6, core wiring pattern layers 12 and 42 each having a predetermined conductive wire pattern are formed on the front surface side and the back surface side (each outer surface side in the front and back direction) of the resin insulating layer 5 of the wiring board material 1. The core wiring pattern layers 12 and 42 are formed so as to partially cover the front surface side and the back surface side of the resin insulating layer 5. On the other hand, the resin insulating layer 5 filled in the through-hole 9 is formed with a through-hole body 13 which is drilled concentrically with the through-hole 9 (axis O) by a drill or the like, and a part of the inner wall surface is formed on the inner wall surface. A through-hole main body plating layer 30 (through-hole conductor layer) is formed to connect the core wiring pattern layers 12 and 42 to each other. The through-hole body 13 (through-hole body plating layer 30) is filled with a resin hole filling material 31 such as an epoxy resin.

  Next, an embodiment of a method for manufacturing a wiring board according to the present invention will be described with reference to the process diagram of FIG. 4 and the explanatory diagrams of FIGS.

<First etching resist layer forming step: S1> (FIG. 5A)
In step S <b> 1, a photosensitive resist is applied to the front and back surfaces of the metal plate 4. Next, this is exposed and developed to form an etching resist layer 21 </ b> R in which a portion corresponding to the slot 6 to be formed and a portion corresponding to the reference hole 10 are opened.

<Penetration part forming step: S2> (FIG. 5B)
In step S2, the metal plate 4 on which the etching resist layer 21R is formed is etched by a dipping method to form the slot 6 and the reference hole 10. Thereafter, when the etching resist layer 21R is peeled off, the metal plate 4 having the slot 6 and the reference hole 10 is formed. The basic design (number, size, etc.) of the wiring board 2 (final product; see FIG. 7) manufactured from one wiring board material 1 (intermediate product; see FIG. 1) is determined by the steps S1 and S2. Is done.

<Second etching resist layer forming step: S3> (FIG. 5C)
In step S3, a photosensitive resist is again applied to the front and back surfaces of the metal plate 4. Next, this is exposed and developed to form an etching resist layer 21R ′ having an opening corresponding to the through hole 9 to be formed.

<Through hole forming step: S4> (FIGS. 5C and 5D)
In step S4, an etching process using a spray method is performed. Specifically, the metal plate 4 on which the etching resist layer 21R ′ is formed is conveyed continuously or intermittently in the horizontal direction, and an etching solution is supplied from the spray nozzles 70 installed on the front surface side and the back surface side of the metal plate 4. It is sprayed and dissolved and removed (FIG. 5C). Thereafter, when the etching resist layer 21R ′ is peeled off, a through hole 9 is formed in the metal plate 4 in addition to the slot 6 and the reference hole 10 formed in the step S2 (FIG. 5D). The basic arrangement of the through hole 9 (through hole body 13), the core wiring pattern layers 12, 42, etc. in the wiring board material 1 (see FIG. 1) and the wiring board 2 (see FIG. 7) is determined by the processes S3 and S4. (See FIG. 6).

<Insulating layer forming step: S5> (FIGS. 5E and 5F)
In step S5, a prepreg 71 having a predetermined thickness made of a composite material in which continuous porous PTFE is impregnated with an epoxy resin is overlaid on the front and back surfaces of the metal plate 4 (FIG. 5E). Then, in a state where the prepreg 71 is laminated on the metal plate 4, the resin is heated and cured to form the resin insulating layer 5. At this time, the epoxy resin that has oozed from the prepreg 71 is filled in the slots 6, the reference holes 10, and the through holes 9 of the metal plate 4 (FIG. 5F).

<Cutting reference mark forming step: S6> (FIG. 6)
In step S6, the temperature (outer surface temperature) on the surface side of the resin insulating layer 5 is raised above the softening temperature of the resin insulating layer 5 by hot pressing (thermocompression bonding) to smooth the surface (outer surface), so that a flat surface is obtained. Form. Further, a resin is applied to a position corresponding to the reference hole 10 on the flat surface of the resin insulating layer 5, and the cutting reference mark 11 having the center line 50 is formed to protrude. However, in practice, it is efficient to perform step S6 simultaneously with step S5. In this case, as shown in FIG. 5 (e), the prepreg 71 is laminated on the metal plate 4, and the resin is heated and pressurized (hot press; thermocompression bonding) with the press plate 72 to soften or melt the prepreg 71. As a result, the resin insulating layer 5 having a smooth surface (outer surface) can be immediately formed. On the flat surface of the resin insulating layer 5 formed in this way, the cutting reference mark 11 is formed so as to protrude in the same manner as described above.

<Cutting mark forming step: S7> (FIG. 6)
Next, in step S7, the temperature (outer surface temperature) on the surface side of the resin insulating layer 5 is raised to the softening temperature or higher of the resin insulating layer 5 by hot pressing (thermocompression bonding), and the surface (outer surface) is smoothed to be flat. Form on the surface. Further, a resin is applied to a position corresponding to the planned cutting line 3 on the flat surface of the resin insulating layer 5 with the cutting reference mark 11 as a reference, and the cutting mark 22 is formed to project. However, in practice, it is efficient to perform step S7 while performing step S5 simultaneously with step S6. In this case, the cutting reference mark 11 is formed on the flat surface of the resin insulating layer 5 formed as shown in FIG. 5 (e) as described above, and subsequently cut with the cutting reference mark 11 as a reference. The mark 22 can be formed to protrude.

<Through hole body forming step: S8> (FIG. 6)
In step S8, a through-hole body 13 having an axis O concentric with the through-hole 9 is drilled with a drill or the like through the resin insulating layer 5 filled in the through-hole 9.

<Through hole body plating layer / core wiring pattern layer forming step: S9> (FIG. 6)
In step S9, core wiring pattern layers 12 and 42 having a predetermined conductor pattern are formed on the front surface side and the back surface side (each outer surface side in the front and back direction) of the resin insulating layer 5 by electrolytic copper plating or the like. At this time, a through-hole main body plating layer 30 is also formed on the inner wall surface of the through-hole main body 13 by electrolytic copper plating or the like, and part of the core wiring pattern layers 12 and 42 on the front and back sides are made conductive.

<Through hole body filling process: S10> (FIG. 6)
In step S10, a resin filling material 31 such as an epoxy resin is melted and filled inside the through-hole body 13 (through-hole body plating layer 30).

<Cutting step: S11> (FIGS. 7A and 7B)
Finally, in step S <b> 11, the wiring board material 1 is cut along the planned cutting line 3 at the resin insulating layer 5 filled inside the slot 6 and the cross-shaped connecting portion 8 of the metal plate 4. Specifically, the dicing blade 23 (cutting blade) is moved so that the center of the width thereof coincides with the cut mark 22, and the wiring board material 1 is cut into a plurality (here, nine) of wiring boards 2 and separated. Since the cut end face of the connecting portion 8 of the metal plate 4 is exposed by cutting, it may be recoated with the resin insulating layer 5.

  Thus, in this embodiment, the cutting reference mark 11 located immediately above the reference hole 10 is formed in the resin insulating layer 5 that is filled with the reference hole 10 and formed on a flat surface by hot pressing. The formation accuracy of the cutting reference mark 11 for cutting position alignment can be increased. Moreover, since the cutting mark 22 is formed based on the cutting reference mark 11 and the cutting mark 22 is used for cutting, the cutting can be performed with high accuracy. In particular, since the reference hole 10 and the cutting reference mark 11 share the center line 50 and the cutting reference mark 11 is located immediately above the reference hole 10, the cutting reference position can be held with high accuracy and dicing is performed. The center of the width of the blade 23 can be precisely aligned with the planned cutting line 3. Further, at this time, if there is a relationship of WB ≦ WS between the width WB of the dicing blade 23 sandwiching the planned cutting line 3 and the width WS of the slot 6 sandwiching the planned cutting line 3, the width of the slot 6 is obtained. Even if WS is reduced, the metal wall surface of the slot 6 is hardly damaged (cut), and the effective area of the wiring board 2 can be increased.

  The ratio of the length LS of the slot 6 to the length L of any one side of the rectangular section 2 ′ (partition metal plate 7 ′) is set to LS / L = 0.6 (FIG. 2B). )reference). As a result, the metal cutting length is reduced to (40%) of the entire length, and the load applied to the dicing blade 23 is reduced, so that the life is extended. Further, since the exposure of the metal cut surface of the connecting portion 8 is reduced due to the reduction of the metal cutting length, it is difficult to oxidize and corrode.

  The ratio of the width WS of the slot 6 sandwiching the planned cutting line 3 to the width W of the cross-shaped connecting section sandwiching the planned cutting line 3 is set to W / WS = 2.0 (FIG. 2B). )reference). Thereby, even if the connection part 8 of the metal plate 4 is formed only in the orthogonal crossing position, the strength of the wiring board material 1 is maintained and the deformation becomes difficult.

  The ratio of the width WS of the slot 6 to the thickness T of the metal plate 4 is set to WS / T = 2.0 (see FIG. 3A). Thereby, the resin filling property into the slot 6 is improved, and the resin insulating layer 5 is easily laminated (filled) on the wall surface of the slot 6.

  Further, the ratio of the thickness TR of the resin insulating layer 5 to the thickness T of the metal plate 4 is set to TR / T = 0.16 (see FIG. 5 (f)). As a result, heat dissipation from the metal plate is further improved in the wiring board, and resin chips generated when the resin insulating layer is cut by the cutting blade in the cutting process are further reduced. Therefore, the occurrence of poor conduction due to such resin chips adhering to a through-hole conductor layer (plating layer) formed in a later process is further reduced.

  The width WB of the dicing blade 23, the width WS of the slot 6, and the width W of the connecting portion 8 are set to WB: WS: W = 3: 5: 10.5 across the planned cutting line 3 (see FIG. 2 (b)). Accordingly, the dicing blade 23 is prevented from cutting the metal wall surface of the slot 6, and the connecting board 8 makes it difficult for the wiring board material 1 to be deformed (bent, bent, etc.), so that the accuracy during cutting can be increased.

  Incidentally, in the wiring board 2 (individual metal plate 7) shown in FIG. 7B, the blade width WB of the dicing blade 23, the width WS of the slot 6, and the width W of the connecting portion 8 are in a relationship of WB ≦ WS ≦ W. (See FIG. 2B). Therefore, a part of the cut connecting portion 8 remains as a cutting residual portion at the corner portion of the wiring board 2 to form a protruding portion 7b (reinforcing portion).

  Specifically, the cross-shaped connecting portion 8 formed at the orthogonal crossing position of the metal plate 4 is cut by the dicing blade 23. At this time, the protruding portion 7b (reinforcing portion) as a cutting residual portion formed by the left and right cutting edges 23 ′ and 23 ′ of the dicing blade 23 is formed on each side of the individual metal plate 7 (hereinafter also simply referred to as a metal plate). It is formed integrally with the main body portion 7a as a central rectangular portion formed by extending the inner edge 7d of the outline. The projecting portion 7b is formed so as to protrude outward in parallel from two sides sandwiching the corner of the main body portion 7a of the metal plate 7. Thus, since the protruding portion 7b is formed so as to extend over two sides sandwiching the corner so as to cover the corner portion of the metal plate 7, the strength of the corner portion is improved, and damage (chip, crack, etc.) is caused during handling. And deformation (breaking, bending, bending, etc.) are less likely to occur. Furthermore, since the protruding portion 7b is formed in the process of cutting the connecting portion 8, the function of the wiring board 2 (metal plate 7) can be improved without increasing the manufacturing cost.

(Example 2)
Next, another embodiment of the wiring board material according to the present invention will be described. FIG. 9 is a cross-sectional view of an essential part (an explanatory diagram of a manufacturing process) instead of FIG. 6 (Example 1). In this embodiment, a case where a plurality of wiring pattern layers to be described later are laminated on the front surface side and the back surface side is shown.

  In the wiring board material 101 shown in FIG. 9, the metal plate resin insulation layers 5 are formed on both the front and back surfaces of the metal plate 4, and the core wiring pattern layers 12 and 42 (wiring pattern layers) are formed outside the metal plate resin insulation layer 5. Is formed. The core wiring pattern layers 12 and 42 are connected to each other by a through-hole body plating layer 30 (through-hole conductor layer). First resin insulation build-up layers 14 and 44 are formed of photosensitive epoxy resin or the like on the outer surface side (front surface side and back surface side) of the core wiring pattern layers 12 and 42, respectively. Further, first wiring pattern layers 15 and 45 (wiring pattern layers) are formed by copper plating on the outer surface side (front surface side and back surface side), respectively. The core wiring pattern layers 12 and 42 and the first wiring pattern layers 15 and 45 are connected to each other by via conductors 32 and 62, respectively.

  Similarly, on the outer surface side (front surface side and back surface side) of the first wiring pattern layers 15 and 45, a second resin insulation build-up layer (hereinafter referred to simply as a resin insulation layer in this embodiment) is formed with a photosensitive epoxy resin or the like. 16, 46 are formed. Further, second wiring pattern layers 17 and 47 (wiring pattern layers) are formed by copper plating on the outer surface side (front surface side and back surface side), respectively. The first wiring pattern layers 15 and 45 and the second wiring pattern layers 17 and 47 are interconnected by via conductors 33 and 63, respectively.

  In FIG. 9, the reference hole 110 is formed in the horizontal direction (vertical direction or horizontal direction) of the core wiring pattern layers 12 and 42, the first wiring pattern layers 15 and 45, and the second wiring pattern layers 17 and 47 constituting a plurality of wiring pattern layers. Alignment marks 111a, 111b, and 111c for alignment in the direction) are used as references for forming the metal plate resin insulation layer 5, the first resin insulation buildup layer 14, and the resin insulation layer 16, respectively. Among these, the alignment mark 111c formed to protrude on the outer surface side of the resin insulating layer 16 that supports the outermost (most surface side) second wiring pattern layer 17 is the dicing blade 23 along the planned cutting line 3 (FIG. 7). This also serves as a reference (cutting reference mark) for moving the reference). That is, both the reference hole 110 and the alignment mark 111c have a function as a wiring pattern reference position and a function as a cutting reference position. Therefore, the cut mark 22 (cut position mark) is formed to protrude on the outer surface side (front surface side) of the resin insulating layer 16 with the alignment mark 111c as a reference. The planar arrangement relationship of the reference hole 110, the alignment mark 111c, and the cut mark 22 in this embodiment is the same as the arrangement relationship of the reference hole 10, the cut reference mark 11, and the cut mark 22 in the first embodiment (FIGS. 1 and 2). It is the same.

  The alignment marks 111a, 111b, and 111c of each layer are provided on the outer surface side (surface side) of the metal plate resin insulation layer 5, the first resin insulation build-up layer 14, and the resin insulation layer 16 formed of transparent or translucent resin. Each is formed to protrude. In addition, on the outer surface side (front surface side) of the resin insulating layer 16, a number of base conductive pads 18 that are electrically connected to the second wiring pattern layer 17 are provided. These base conductive pads 18 form chip mounting portions together with solder bumps 19 formed on the outer surface side (front surface side).

  Next, a method for manufacturing a wiring board of Example 2 will be described based on the process diagram of FIG. However, in FIG. 8, the first etching resist layer formation step (S1: FIG. 5A) to the through hole formation step (S4: FIG. 5D) are the same as those in FIG. 4 (Example 1). The description is omitted.

<Metal plate insulating layer forming step: S5 '> (FIGS. 5E and 5F)
The operation content in step S5 ′ is the same as in step S5 of FIG. 4 and FIGS. 5E and 5F, and the formed insulating layer becomes the metal plate resin insulating layer 5.

<Through hole body forming step: S8 '> (FIG. 9)
In step S8 ′, a through-hole body 13 having an axis O concentric with the through-hole 9 is drilled with a drill or the like through the metal plate resin insulation layer 5 filled in the through-hole 9.

<Through hole body plating layer / core wiring pattern layer forming step: S9 '> (FIG. 9)
In step S9 ′, core wiring pattern layers 12 and 42 having a predetermined conductive pattern are formed on the front surface side and the back surface side (each outer surface side in the front and back direction) of the metal plate resin insulation layer 5 by electrolytic copper plating or the like. At this time, a through-hole main body plating layer 30 is also formed on the inner wall surface of the through-hole main body 13 by electrolytic copper plating or the like, and part of the core wiring pattern layers 12 and 42 on the front and back sides are made conductive.

<Through hole body filling process: S10 '> (FIG. 9)
In step S10 ′, a resin filling material 31 such as an epoxy resin is melted and filled inside the through-hole body 13 (through-hole body plating layer 30).

<Lamination process: S15> (FIG. 9)
In step S15, the first resin insulation build-up layers 14 and 44 are formed on the outer surface side (front and back surfaces) of the metal plate resin insulation layer 5 by attaching a film of a photosensitive epoxy resin or the like. Then, via holes 34 and 64 are formed at positions where the via conductors 32 and 62 are formed by an exposure / development process. Next, an electroless copper plating layer is formed on the first resin insulation build-up layers 14 and 44 and on the inner wall surfaces of the via holes 34 and 64. And the plating resist which exposes only a desired part among this electroless copper plating layer is formed, and electroplating is performed on the electroless plating layer exposed from the plating resist. Thereafter, the plating resist is peeled off, and unnecessary electroless plating layers are removed by etching, whereby the first wiring pattern layers 15 and 45 and the via conductors 32 and 62 are formed. Similarly, resin insulating layers 16 and 46, second wiring pattern layers 17 and 47, and via conductors 33 and 63 are sequentially formed.

  In this embodiment, the alignment marks 111a, 111b, and 111c of each layer are formed as follows. That is, the metal plate resin insulation layer 5, the first resin insulation build-up layer 14, and the resin insulation layer 16 are formed of a transparent or translucent resin, and one of the alignment marks 111a, 111b, 111c of each layer and the reference hole 110 (center line). 50) is aligned (aligned) by fluoroscopy from the upper side (front side) or the lower side (back side). The alignment marks 111a and 111b are embedded when the first resin insulation buildup layer 14 and the resin insulation layer 16 are formed (laminated), respectively.

<Cutting reference mark forming step: S16> (FIG. 9)
In step S16, the temperature (outer surface temperature) on the surface side of the resin insulating layer 16 is raised above the softening temperature of the resin insulating layer 16 by hot pressing (thermocompression bonding) so that the surface (outer surface) is smoothed to a flat surface. Form. Further, a resin is applied to a position corresponding to the reference hole 110 on the flat surface of the resin insulating layer 16 to form a cutting reference mark 111c (alignment mark) having a center line 50 in a protruding manner. However, in practice, it is efficient to perform step S16 simultaneously with part of step S15. In this case, a photosensitive epoxy resin is laminated on the first resin insulation build-up layer 14, and the resin is heated and pressed (hot press; thermocompression bonding) with a press plate (see FIG. 5E) to be photosensitive. By softening or melting the epoxy resin, the resin insulating layer 16 having a smooth surface (outer surface) can be immediately formed. On the flat surface of the resin insulating layer 16 formed in this way, the cutting reference mark 111c is formed so as to protrude in the same manner as described above.

<Cutting mark forming step: S17> (FIG. 9)
Next, in step S17, the temperature (outer surface temperature) on the surface side of the resin insulating layer 16 is raised above the softening temperature of the resin insulating layer 16 by hot pressing (thermocompression bonding) so that the surface (outer surface) is smoothed and flattened. Form on the surface. Further, a resin is applied to a position corresponding to the planned cutting line 3 on the flat surface of the resin insulating layer 16 with the cutting reference mark 111c as a reference, and the cutting mark 22 is formed to project. However, in practice, it is efficient to perform step S17 while performing step S15 simultaneously with step S16. In this case, the cutting reference mark 111c can be projected and formed on the flat surface of the resin insulating layer 16 formed in step S15 as described above, and the cutting mark 22 can be projected and formed with reference to the cutting reference mark 111c.

<Cutting step: S11 ′> (FIG. 9)
Finally, in step S11 ′, the wiring board material 101 is cut along the planned cutting line 3. Specifically, the dicing blade 23 (see FIG. 7) is moved so that the center of the width coincides with the cutting mark 22, and the wiring board material 101 is cut and separated.

  In the present embodiment (FIGS. 8 and 9), portions having the same functions as those in the first embodiment (FIGS. 1 to 7) are denoted by the same reference numerals and description thereof is omitted. In FIG. 9, the resin solder resist layers 20 and 50, the underlying conductive pad 18 and the like may be formed before the cutting step (S11 '), but the description is omitted.

  In FIG. 9, the difference WS−WB between the width WS of the slot 6 and the blade width WB of the dicing blade 23 is the maximum deviation amount from the reference hole 110 of each wiring pattern layer in the horizontal direction (vertical direction or horizontal direction). It is set to include a certain alignment error WA. This prevents the dicing blade 23 from cutting the metal wall surface of the slot 6 even in the case of a multilayer wiring board material (build-up wiring board material).

  As described above, in this embodiment, since the alignment mark 111c is used as the cutting reference mark, even in the wiring board material 101 in which a plurality of wiring pattern layers are stacked, the alignment of each wiring pattern layer and the planned cutting line are aligned. Both cutting and cutting can be performed with high accuracy.

  In particular, in this embodiment, the alignment marks 111a, 111b, and 111c of each wiring pattern layer share the reference hole 110 (center line 50) and are located immediately above the reference hole 110. Among them, the uppermost (outermost) alignment mark 111c also serves as a cutting reference mark that defines a cutting reference position. As a result, the alignment of the wiring pattern layer and the alignment of the cutting position (dicing blade 23) can both be performed precisely, and the wiring substrate 2 having a higher degree of integration can be obtained.

  In the description of the stacking step (S15), the alignment marks 111a, 111b, and 111c of each wiring pattern layer are formed so as to protrude so as to coincide with the center line 50 of the reference hole 110. It may be configured to be modified. First, as shown in FIG. 9, in the metal plate resin insulation layer 5, the first resin insulation build-up layer 14, and the resin insulation layer 16, a hole alignment mark 111a ′ having a common reference line 110 and a center line 50, 111b ′ and 111c ′ are formed through each other. Then, each wiring pattern layer is aligned (positioned) by looking through the hole-shaped alignment marks 111a ′, 111b ′, and 111c ′ from the upper side (front surface side) or the lower side (back surface side) through the reference hole 110. The When forming the cut mark 22 on the outer surface side (front surface side) of the resin insulating layer 16 using the uppermost layer (outermost) hole alignment mark 111c ′ as a cutting reference mark, all the hole alignment marks 111a ′, 111 b ′ and 111 c ′ are filled with the resin of the resin insulating layer 16.

In addition, the embodiment described above can be modified as follows, for example.
(1) The reference holes 10 and 110 or the cutting reference marks 11 and 111c may be composed of one piece (one place).
(2) The reference holes 10 and 110 and / or the cutting reference marks 11 and 111c may be provided in the inner region of the planned cutting line 3 located on the outermost side of the metal plate 4 in plan view.
(3) The installation positions of the cutting reference marks 11 and 111c may not be concentric with the center line 50 of the reference holes 10 and 110.
(4) The cutting reference marks 11 and 111c and the cutting mark 22 may be positioned on opposite sides of the front and back directions with the reference holes 10 and 110 interposed therebetween. That is, one can be provided on the front side and the other on the back side.

Furthermore, in the present invention,
(1) The case where the cutting position is determined based on the cutting reference marks 11 and 111c is included. Therefore, the dicing blade 23 (cutting blade) may be positioned by the cutting reference marks 11 and 111c without providing the cutting mark 22 (cutting position mark).
(2) The case where a plurality of wiring pattern layers are provided only on one outer surface side in the front and back direction of the metal plate 4 is included. Therefore, the first wiring pattern layers 15 and 45 and the second wiring pattern layers 17 and 47 may be formed only on one side (front side or back side).

The plane schematic diagram which shows one Example of the wiring board material which concerns on this invention. The top view of a metal plate. AA sectional drawing and BB sectional drawing of the metal plate of Fig.2 (a). Process drawing which shows one Example of the manufacturing method of the wiring board which concerns on this invention. Explanatory drawing of each manufacturing process of FIG. Explanatory drawing which shows the manufacturing process following FIG. 5 as C1-C2-C3-C4 sectional drawing of FIG. Explanatory drawing of the manufacturing process following FIG. Process drawing which shows the other Example of the manufacturing method of the wiring board which concerns on this invention. Explanatory drawing which shows the manufacturing process replaced with FIG. 6 with principal part sectional drawing.

Explanation of symbols

1,101 Wiring board material 2 Wiring board 3 Cutting planned line 4 Metal plate 5 Metal plate Resin insulation layer (resin insulation layer)
6 slot 8 connecting part 10,110 reference hole 11 cutting reference mark 111c alignment mark (cutting reference mark)
12, 42 Core wiring pattern layer (wiring pattern layer)
16 Second resin insulation build-up layer (resin insulation layer)
22 Cutting mark (cutting position mark)
23 Dicing blade (cutting blade)

Claims (6)

A wiring board manufacturing method for cutting and separating a wiring board material having a metal plate as a core material into a plurality of wiring boards by means of longitudinal and lateral cutting lines each having a plurality of intersecting positions. There,
A slot having a predetermined width along the planned cutting line in a form in which a part of the planned cutting line remains as a connecting portion, and a reference hole serving as a reference for moving the cutting blade along the planned cutting line, A penetrating part forming step of forming the metal plate penetrating in the front and back directions,
A cutting reference mark forming step for forming a cutting reference mark at a cutting reference position corresponding to the reference hole on the outer surface side of the resin insulating layer laminated along the front and back direction of the metal plate,
In order to separate the wiring board material into the individual wiring boards, a cutting step of cutting along the planned cutting line separated from the cutting reference mark by a predetermined distance on the basis of the cutting reference mark;
A method for manufacturing a wiring board, comprising: A wiring board material in which a wiring pattern layer is laminated with a metal plate as a core material is cut into a plurality of wiring boards by cutting lines parallel to the vertical direction and the horizontal direction in which a plurality of orthogonal intersection positions are formed, A method of manufacturing a wiring board for separation,
A slot having a predetermined width along the planned cutting line and a reference hole serving as a reference for moving the cutting blade along the planned cutting line in such a manner that only the crossing position remains as a cross-shaped connecting portion. , Each through the metal plate in the front-and-back direction, through-part forming step of simultaneously forming by etching,
A cutting reference mark is provided at a cutting reference position corresponding to the reference hole on either outer surface side of the front and back surfaces of the resin insulating layer covering the front and back surfaces of the metal plate and filling the inside of the slot and the reference hole. A cutting reference mark forming step to be formed;
A cutting position mark forming step for forming a cutting position mark for each of the planned cutting lines with respect to the cutting reference mark on the outer surface side of either one of the front and back directions of the resin insulating layer;
In order to separate the wiring board material as the individual wiring boards, a cutting step of cutting the cutting position mark by positioning the width center of the cutting blade;
A method for manufacturing a wiring board, comprising: A wiring board material in which a metal plate is used as a core material and a plurality of wiring pattern layers are laminated on at least one outer surface side in the front and back directions is parallel to the vertical direction and the horizontal direction in which a plurality of orthogonal intersection positions are formed. A method of manufacturing a wiring board for cutting and separating into a plurality of wiring boards by a planned cutting line,
A slot having a predetermined width along the planned cutting line in a form in which only the intersection position remains as a cross-shaped connection portion, and serves as a reference for vertical or horizontal alignment of the plurality of wiring pattern layers, And a through hole forming step for simultaneously forming a reference hole for moving the cutting blade along the planned cutting line by etching through the metal plate in the front and back directions,
A cutting reference mark forming step of forming a cutting reference mark at a cutting reference position corresponding to the reference hole on the outer surface side of the resin insulating layer supporting the outermost wiring pattern layer;
On the outer surface side of the resin insulation layer, a cutting position mark forming step for forming a cutting position mark for each of the planned cutting lines with reference to the cutting reference mark,
In order to separate the wiring board material as the individual wiring boards, a cutting step of cutting the cutting position mark by positioning the width center of the cutting blade;
A method for manufacturing a wiring board, comprising: Using a metal plate as a core material, a wiring board material to be cut and separated into a plurality of wiring boards by cutting lines in the vertical direction and the horizontal direction in which a plurality of intersecting positions are formed,
In a form in which a part of the planned cutting line remains as a connecting portion, a slot is formed through the metal plate along the planned cutting line with a predetermined width in the front and back direction,
A reference hole formed so as to penetrate the metal plate in the front and back direction so as to be a reference for moving the cutting blade along the planned cutting line,
On the outer surface side of the resin insulating layer laminated along the front and back direction of the metal plate, a cutting reference mark formed at a cutting reference position corresponding to the reference hole,
Including
In order to separate the individual wiring boards, the cutting blade is scheduled to be cut at a predetermined distance from the cutting reference mark with respect to the cutting reference mark. Board material. A wiring board that is cut and separated into a plurality of wiring boards by cutting lines parallel to the vertical direction and the horizontal direction in which wiring pattern layers are laminated using a metal plate as a core material, and a plurality of orthogonal crossing positions are formed. Material,
In a form in which only the crossing position remains as a cross-shaped connecting portion, a slot is formed through the metal plate along the planned cutting line with a predetermined width in the front and back direction by etching,
A reference hole formed through the metal plate in the front and back direction by etching so as to be a reference for moving the cutting blade along the planned cutting line,
A cutting formed at a cutting reference position corresponding to the reference hole on either outer surface side of the front and back surfaces of the resin insulating layer covering the front and back surfaces of the metal plate and filling the inside of the slot and the reference hole Fiducial marks and
On the outer surface side of either one of the front and back surfaces of the resin insulation layer, a cutting position mark formed for each of the planned cutting lines with reference to the cutting reference mark,
Including
In order to separate the individual wiring boards, the wiring board material is scheduled to be cut with the width center of the cutting blade positioned at the cutting position mark. With a metal plate as a core material, a plurality of wiring pattern layers are laminated on at least one outer surface side of the front and back surfaces, and a plurality of orthogonal intersection positions are formed, respectively, by a planned cutting line parallel to the vertical direction and the horizontal direction, A wiring board material that is cut and separated into a plurality of wiring boards,
In a form in which only the crossing position remains as a cross-shaped connecting portion, a slot is formed through the metal plate along the planned cutting line with a predetermined width in the front and back direction by etching,
Front and back directions of the metal plate by etching so as to be a reference for alignment in the vertical direction or the horizontal direction of the plurality of wiring pattern layers and to be a reference for moving a cutting blade along the planned cutting line A reference hole formed therethrough,
On the outer surface side of the resin insulating layer that supports the outermost wiring pattern layer, a cutting reference mark formed at a cutting reference position corresponding to the reference hole,
On the outer surface side of the resin insulation layer, a cutting position mark formed for each of the planned cutting lines with reference to the cutting reference mark,
Including
In order to separate the individual wiring boards, the wiring board material is scheduled to be cut with the width center of the cutting blade positioned at the cutting position mark.

Images