JP2009016466A - Wiring board complex, and manufacturing method of the wiring board complex, wiring board and semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To easily divide even a thin wiring board complex for taking many boards, and to easily form a wiring board in a desired shape. <P>SOLUTION: The wiring board complex has a release layer 107 on a base 106 (a). An insulation layer 105<SB>1</SB>is formed, an insulation layer of a divided region 113 is removed, and a conductive post 103 is formed on the removed part (b). A conductive pattern 104<SB>1</SB>is formed (c). An insulation layer 105<SB>2</SB>is formed, an insulation layer on a via forming location and the divided region 113 is removed, a copper film is embedded on the part, and thereafter a conductive pattern 104<SB>2</SB>is formed (d). An insulation layer 105<SB>3</SB>, a copper film embedded in its aperture and a conductive pattern 104<SB>3</SB>are formed through a similar process (e). The base 106 is peeled off (f). A metallic pattern 113a is drawn out from the wiring board complex 111 and divided into individual wiring boards 112 (g). <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a wiring board composite having a metal pattern for dividing a substrate, and a method of manufacturing a wiring board composite, a wiring board, and a semiconductor device, and more particularly to a wiring board composite capable of dividing a wiring board into arbitrary shapes. The present invention relates to a body, a wiring board using the same, and a method for manufacturing a semiconductor device.

In recent years, electronic devices have been rapidly downsized, thinned, and densified as seen in portable devices, and due to the increase in the number of terminals associated with higher speeds and higher functionality of semiconductor elements, the mounting of devices and semiconductors With respect to element mounting, characteristics such as thinning, lightening, and high density are required for a wiring board and a semiconductor device on which a semiconductor element is mounted. Furthermore, in order to cope with further downsizing, space management that effectively uses the area of the mother board of electronic equipment is actively performed. In such optimal use of space for the entire device, a semiconductor device to be mounted is also required to have a shape that matches the space.
On the other hand, due to the miniaturization of wiring boards and semiconductor devices, wiring boards are manufactured with multiple composite wiring boards for efficient manufacturing, and separated and divided into individual wiring boards after manufacturing. Has been generalized (see, for example, Patent Document 1). In the method described in Patent Document 1, a semiconductor element is mounted on a wiring board, resin-sealed, and then dicing or slicing is performed along cut lines that are orthogonal to each other to divide into individual packages. In addition, when dividing a composite wiring board, a break groove is provided in the substrate (for example, refer to Patent Document 2) or a slit is formed (for example, in order to perform division efficiently and easily) (for example, , See Patent Document 3).
JP 2001-338933 A JP 2006-86221 A Japanese Patent Application Laid-Open No. 2000-228566

The above-described conventional techniques are basically divided in two orthogonal directions, and are effective for square or rectangular wiring boards. However, in recent years, various shapes are required for high-density mounting. However, this requirement cannot be met. In this case, the substrate alone can be processed into an arbitrary shape by the router device. However, it is difficult to process a plurality of substrates with a substrate thinner than 200 μm, and the processing time increases.
In addition, the method of previously forming a break groove as described in Patent Document 2 for dividing the composite substrate is difficult to apply to a resin substrate, particularly a thin resin substrate. Further, the method of providing a slit in a composite substrate described in Patent Document 3 requires punching with a mold or processing with a router device in order to form the slit. Here, in order to perform punching with a metal mold, it is necessary to prepare a metal mold for each shape of the substrate in order to cope with various shapes of substrates, resulting in an increase in cost. Also, when performing router processing, processing of thin substrates is difficult and processing time increases as described above.
An object of the present invention is to solve the above-mentioned problems of the prior art, and an object thereof is to provide a wiring board or a semiconductor device having an arbitrary shape without using means such as punching by a mold or router processing. It is to make it easy to manufacture.

In order to achieve the above object, according to the present invention, there is provided a wiring board composite in which a plurality of wiring boards each having an insulating layer and a wiring layer are provided with a divided area interposed therebetween, wherein the divided area is the wiring. Provided is a wiring board composite having a metal pattern for dividing the board composite.
Preferably, the wiring board and the divided area are provided on a support. Preferably, the divided region has an insulating layer equivalent to the insulating layer of the wiring board, and the metal pattern is formed on one outer surface of the insulating layer, or the divided region is the wiring. It has an insulating layer equivalent to that obtained by removing a part of the outside of the insulating layer of the substrate, and the metal pattern is embedded in the removed portion of the insulating layer, or the entire divided region is the metal. It is formed by a pattern.
Preferably, a semiconductor element is mounted on the wiring board. More preferably, the semiconductor element is resin-sealed.

In order to achieve the above object, according to the present invention, a plurality of wiring boards each having an insulating layer and a wiring layer are provided with a dividing area therebetween, and the dividing area divides the wiring board. There is provided a method for manufacturing a wiring board, wherein the metal pattern is extracted from the wiring board composite having the metal pattern and separated into individual wiring boards.
In order to achieve the above object, according to the present invention, a plurality of wiring boards each having an insulating layer and a wiring layer are provided with a dividing area therebetween, and the dividing area divides the wiring board. A step of mounting a semiconductor element on the wiring board of the wiring board composite having the metal pattern, and a step of extracting the metal pattern from the wiring board composite and separating it into individual wiring boards. A method for manufacturing a semiconductor device is provided.

  In order to achieve the above object, according to the present invention, a plurality of wiring boards each having an insulating layer and a wiring layer are provided with a dividing area therebetween, and the dividing area divides the wiring board. A step of mounting a semiconductor element on the wiring board of the wiring board composite having the metal pattern, a step of resin-sealing the semiconductor element, and an individual wiring board by extracting the metal pattern from the wiring board composite And a step of separating the semiconductor device.

  According to the wiring board composite of the present invention, it has a metal pattern that can divide the wiring board in an arbitrary shape, and the wiring board composite can be separated into individual wiring boards by pulling out the metal pattern. become. The function of this metal pattern is similar to a cut tape used to open a packaging film for products such as tobacco. The packaging films for these products can be easily divided into two by picking one end of the cut tape and pulling it up along the periphery of the product. Similarly, in the present invention, the wiring board composite can be divided into individual wiring boards (or semiconductor devices) by pulling out the metal pattern provided for dividing the board from the wiring board composite. Here, the pattern on the plane of the metal pattern can be formed in an arbitrary shape in accordance with the planar shape of the required wiring board, so that an optimally shaped wiring board (or semiconductor device) can be easily formed. it can. In addition, when forming a metal pattern with a thickness equal to or greater than the total thickness of the wiring board, the side surface shape of the wiring board follows that of the metal pattern, so by appropriately designing the cross-sectional shape of the metal pattern Thus, it is possible to easily obtain a wiring board having a cross-sectional shape optimum for mounting. Since the shape of the wiring board can be appropriately controlled, the mounted semiconductor elements and electronic components can be mounted at a high density, and the mounting board on which the wiring board is mounted can also be reduced in size. Moreover, in the wiring board composite body using a support, since the rigidity can be increased by the support, the handling property in manufacturing and transport can be improved, and the yield can be improved.

Hereinafter, embodiments of the present invention will be specifically described with reference to the drawings. 1 to 29 showing the embodiment of the present invention, portions having the same function are denoted by the same reference numerals, and redundant description is omitted as appropriate.
(Wiring board composite)
FIG. 1 is a top view showing an example of the first embodiment of the wiring board composite of the present invention. 4 and 5 are partial top views showing other examples of the first embodiment. 2 and 3 are cross-sectional views showing some examples of the first embodiment. As shown in FIG. 1, the wiring board composite 11 according to the present embodiment includes a plurality of wiring boards 12 each including an insulating layer and a wiring layer (not shown), and divided regions 13 interposed between the wiring boards 12. Consists of In the divided region 13, a metal pattern 13 a for dividing the wiring board 12 is provided.
The wiring board 12 is composed of one or more wiring layers and insulating layers. When the wiring board 12 has a plurality of wiring layers, vias (not shown) for connecting the wiring layers are provided and electrically connected. Furthermore, connection terminals suitable for semiconductor elements and electronic components to be mounted are formed. In addition to the metal pattern 13a, the divided region 13 may be provided with the same insulating layer as some of the insulating layers of the wiring board 12.

  The main material of the wiring layer is composed of one or a plurality of materials of copper, gold, nickel, aluminum, silver, palladium, and copper is most desirable in terms of resistance value and cost. Nickel can also prevent interfacial reactions with other materials such as insulating materials. It can also be used as a resistance wiring. As described above, the wiring layer is preferably formed of copper, for example, and has a thickness of 10 μm, for example. The wiring layer is formed by a method such as a subtractive method, a semi-additive method, or a full additive method. The subtractive method is a method in which a resist having a desired pattern is formed on a copper foil provided on a substrate, an unnecessary copper foil is etched using the resist as a mask, and then the resist is peeled to obtain a desired pattern. . In the semi-additive method, a power supply layer is formed by an electroless plating method, a sputtering method, a CVD (Chemical Vapor Deposition) method, etc., a resist having an opening in a desired pattern is formed, and a metal by an electrolytic plating method is formed in the resist opening. Is deposited, and after removing the resist, the power feeding layer is etched to obtain a desired wiring pattern. In the full additive method, after an electroless plating catalyst is adsorbed on a substrate, a pattern is formed with a resist, and the catalyst is activated while leaving the resist as an insulating film. In this method, a desired wiring pattern is obtained by depositing metal. In addition, a recess serving as a wiring pattern is provided in an insulating layer (not shown) on which a wiring layer is provided, and a power supply layer is formed by an electroless plating method, a sputtering method, a CVD method, etc. An embedded wiring method in which the concave portion is embedded by plating and the surface is flattened by polishing may be used.

  The insulating layer is formed of, for example, a photosensitive or non-photosensitive organic material, and examples of the organic material include an epoxy resin, an epoxy acrylate resin, a urethane acrylate resin, a polyester resin, a phenol resin, a polyimide resin, and a BCB (benzocyclobutene). ), PBO (polybenzoxazole), polynorbornene resin, etc., woven fabrics and nonwoven fabrics made of glass cloth, aramid fibers, etc., epoxy resin, epoxy acrylate resin, urethane acrylate resin, polyester resin, phenol resin, polyimide resin, BCB ( A material impregnated with benzocyclobutylene), PBO (polybenzoxole), polynorbornene resin, or the like is used. In particular, a material using polyimide resin, PBO, and woven or non-woven fabric has excellent mechanical properties such as film strength, tensile elastic modulus, and elongation at break, and thus high reliability can be obtained.

  The via is provided in the insulating layer and connects the upper and lower wiring layers. When the upper wiring layer is formed after providing the via hole in the insulating layer, the via hole may be filled with a conductor at the same time. Alternatively, the via hole may be filled with a conductive material or the via hole wall surface may be filled with a conductive material. You may make it apply | coat. When using a photosensitive material, the via hole provided in the insulating layer is formed by photolithography in accordance with the cross-sectional shape of the via. When a non-photosensitive material or a photosensitive material having a low pattern resolution is used, the via hole is formed by a laser processing method, a dry etching method, or a blast method. Alternatively, an insulating film may be formed after a plating post is previously formed at the via position, and the via may be formed by grinding the surface of the insulating film by polishing to expose the plating post. According to this method, there is no need to provide a via hole in the insulating layer in advance. Furthermore, vias are not necessarily required when signals are transmitted between the semiconductor element and the wiring layer and between the wiring layers by inductor coupling, capacitor coupling, and radio. Furthermore, the insulating layer on which the wiring layer is provided may have an opening with an inclined shape, and the upper and lower wiring layers may be directly connected. Furthermore, a part of the signal may be transmitted by optical coupling. In this case, the wiring layer may be an optical wiring.

  The metal pattern 13a is provided so that a part of the metal pattern 13a is exposed at least on the outermost layer on one side of the wiring board composite body 11, as in the example of the cross-sectional views shown in FIGS. FIG. 2A shows a structure in which a metal pattern 13 a is provided on one side of the wiring board composite 11. In this case, the insulating layer of the divided region 13 coincides with the insulating layer of the wiring board 12. Further, in this structure, the metal pattern 13a for division can be provided later, and the pattern adjustment according to the finish of the wiring board 12 becomes easy. FIG. 2B shows a structure in which a part of the metal pattern 13 a is embedded on one side of the wiring board composite 11. In this case, the insulating layer of the divided region 13 has a structure in which a part of the insulating layer of the wiring board 12 is removed. Moreover, in this structure, since the pattern accuracy with the insulating layer or wiring layer provided with the metal pattern 13a can be improved, it is possible to achieve a good position accuracy between the outer shape and the internal pattern. FIGS. 2C and 2D show a structure in which a metal pattern 13 a is provided so as to penetrate the wiring board composite 11. In these structures, an insulating layer is not formed in the divided region 13, and the wiring substrate 12 is reliably separated by the metal pattern 13a. Therefore, stable division can be achieved. In addition, since the metal pattern 13a is provided during the production of the wiring board composite body 11, it is possible to maintain a high pattern accuracy with each layer. Furthermore, the metal pattern 13a having these structures protrudes from both surfaces of the wiring board composite 11 in FIG. 2D, and has exposed surfaces on the same plane as both surfaces of the wiring board composite 11 in FIG. 2C. However, the present invention is not limited to these, and a combination of a structure that is flat, protruded, and recessed with respect to the surface of the wiring board composite 11 may be used. When the surface of the metal pattern 13a and the surface of the wiring board composite 11 are flat, avoid interference between the metal pattern 13a and the mounting tool when a semiconductor element or electronic component is mounted on the surface of the wiring board composite 11 can do. Further, when the surface of the metal pattern 13a protrudes, it is possible to easily pull out the metal pattern 13a. Further, when the surface of the metal pattern 13a is recessed, it is possible to prevent interference with the mounting tool as in the case of flatness, and furthermore, the occurrence of burrs and cracks at the end of the wiring board 12 can be suppressed. .

  Furthermore, in the structure in which the metal pattern 13a penetrates the wiring board composite body 11, the width of the metal pattern 13a is arbitrarily set according to the number of times of the layer structure constituting the wiring board composite body 11, as in the example shown in FIG. The end shape of the wiring board 12 can be controlled. As shown in FIGS. 3A to 3F, the cross-sectional shape of the metal pattern 13a is stepped or uneven, so that the stepped portion or the uneven portion of the wiring board can be used for component mounting. Also, as shown in Fig. 3 (f), by providing concave and convex parts on the end face of the wiring board, it is possible to mount components using concave parts and stepped parts, and to connect and connect the wiring boards using concave and convex parts. It becomes possible to do. Further, in the example of FIG. 3, similarly to the example of FIG. 2, the cross-sectional shape of the metal pattern 13 a may be a combination of a structure that is flat, protruding, and recessed with respect to the surface of the wiring board composite 11. Furthermore, not only the step-like cross-sectional shape as shown in FIG. 3 but also a smoothly inclined metal pattern may be used.

  The metal pattern 13a can have an arbitrary shape in accordance with the structure and characteristics of the semiconductor element and electronic component to be mounted, and further, the structure and characteristics of the mounting board on which the wiring board 12 is mounted. Although FIG. 1 shows an example in which the wiring board is rectangular, the example shown in FIG. 4 or 5 may be used. In FIG. 4A, an L-shaped wiring board 12 is formed, and in FIG. 4B, two types of wiring boards, L-shaped and rectangular, are formed. In FIG. 4C, the divided region 13 stops midway, and a shape having a slit can be obtained after the wiring substrate 12 is divided. Further, a shape having a curve as shown in FIG. Furthermore, as shown in FIG. 4D, when the wiring board composite 11 is circular like a wafer, it can be formed in a polygon such as a hexagon that can reduce dead space. . As described above, the metal pattern 13a can effectively increase the number of wiring boards 12 to be obtained, and can further obtain a shape suitable for the entire system.

  The main material of the metal pattern 13a is composed of one or a plurality of materials of copper, gold, nickel, aluminum, silver, palladium, and copper is optimal in terms of cost. Moreover, since nickel becomes a metal material with high hardness, the intensity | strength of the metal pattern 13a can be increased. The thickness of the metal pattern 13a is, for example, 10 μm. The metal pattern 13a is formed by a method such as the above-described subtractive method, semi-additive method, or full-additive method, similarly to the wiring layer of the wiring board. Alternatively, a recess in which a metal pattern is formed is provided in the insulating layer on which the metal pattern 13a is provided, and the insulating layer may be formed using a technique similar to the above-described embedded wiring method. Moreover, you may make it form simultaneously at the same process as the formation process of the wiring layer of a wiring board.

  According to the present embodiment, the wiring board composite 11 for obtaining the wiring board 12 having a desired outer shape and end shape can be realized. Since the shape of the wiring board 12 can be controlled, the semiconductor elements and electronic components to be mounted can be mounted at a high density, and the mounting board on which the wiring board 12 is mounted can be reduced in size.

6 and 7 are cross-sectional views showing some examples of the second embodiment of the wiring board composite of the present invention. The wiring board composite of the second embodiment has a structure in which a support 14 is provided on the wiring board composite of the first embodiment. The other parts are the same as in the first embodiment. Further, as described in the first embodiment, the combinations shown in FIGS. 1 to 5 may be performed.
Since the support 14 preferably has an appropriate rigidity, a semiconductor wafer material such as silicon or GaAs, sapphire, metal, quartz, glass, ceramic, copper-clad, or a resin substrate that does not have copper foil is used. Can do. Further, when the support 14 and the wiring substrate 12 are separated, the support 14 may be performed by any one of wet etching, dry etching, and grinding, or a combination thereof. Separation can also be performed by peeling or cutting. When the peeling method is used, a low adhesion layer is formed on the surface of the support 14, or a material that is in contact with the support using a transparent substrate is altered by laser light or ultraviolet rays to reduce adhesion. Separation is performed, and when the cutting method is used, the sheet is divided at a desired position by a water cutter or a slicer. The support 14 may be separated after the metal pattern is pulled out from the wiring board composite, or before that.
In the example shown in FIG. 6A, a metal pattern 13 a is embedded in the insulating layer of the divided region 13 on the support 14. In this structure, the metal pattern 13a can be formed in the same layer as the wiring layer of the wiring board, and the pattern accuracy can be improved. Therefore, the positional accuracy between the outer shape and the internal pattern can be improved. FIGS. 6B and 6C show a structure in which a metal pattern 13 a is provided so as to penetrate the wiring board composite 11. In these structures, since the wiring substrate 12 is reliably separated by the metal pattern 13a, stable division can be realized. Moreover, since the metal pattern 13a is provided during manufacture of the wiring board composite body 11, the pattern accuracy of each layer of the wiring board can be maintained at a high level. Furthermore, the metal pattern 13a of these structures protruded from the surface of the wiring board composite body 11 in FIG. 6C, and the exposed surface on the same plane as both surfaces of the wiring board composite body 11 in FIG. 6B. Although the structure is shown, the present invention is not limited thereto, and a combination of a structure that is flat, protruded, and recessed with respect to the surface of the wiring board composite 11 may be used. When the surface of the metal pattern 13a and the surface of the wiring board composite 11 are flat, avoid interference between the metal pattern 13a and the mounting tool when a semiconductor element or electronic component is mounted on the surface of the wiring board composite 11 can do. Further, when the surface of the metal pattern 13a protrudes, the metal pattern 13a can be easily pulled out. Further, when the surface of the metal pattern 13a is recessed, it is possible to prevent interference with the mounting tool as in the case of being flat, and furthermore, it is possible to suppress burrs and cracks at the end of the wiring board 12.

Furthermore, in the structure in which the metal pattern 13a penetrates the wiring board composite body 11, the width of the metal pattern 13a is arbitrarily set according to the number of stacking of the layer structure constituting the wiring board composite body 11, as in the example shown in FIG. As in the case of the first embodiment shown in FIG. 3, the end shape of the wiring board 12 can be controlled. And according to the structure of Fig.7 (a)-(f) of this Embodiment, the effect similar to the case of 1st Embodiment shown in FIG. 3 can be enjoyed. Also in the second embodiment, the cross-sectional shape of the metal pattern may be a smoothly inclined shape instead of the step shape shown in FIG.
6 and 7 show an example of the structure of the wiring board composite 11 in which a plurality of wiring boards 12 are provided on one side of the support 14. A wiring board composite may be provided.

  According to the present embodiment, the wiring board composite 11 for obtaining the wiring board 12 having a desired outer shape and end shape can be realized. In addition to the effects described in the first embodiment of the wiring board composite, the support 14 can increase the rigidity, so that the handling property in manufacturing and transport can be improved, and the yield can be improved. .

(Wiring board)
8 to 11 are cross-sectional views showing structural examples of the wiring board formed from the first and second embodiments of the wiring board composite of the present invention.
FIG. 8 shows an example of the wiring board 12 having concave and convex portions on the side surfaces of both ends of the wiring board 12. In addition to being able to attach components using the concave / convex portions, as shown in FIG. 9, a plurality of wiring boards 12 can be connected by engaging the end irregularities. In addition, by providing an electrical junction at a portion where the wiring boards contact each other, signals can be transmitted and received between the two wirings. For this reason, since the several wiring board 12 is connected by a short distance rather than the state attached to a mounting board separately, the performance improvement as the whole system is achieved. In FIG. 9, the convex and concave side shapes are combined, but a stepped shape or an inclined shape may be combined.

FIG. 10 shows an example of the wiring substrate 12 having one end side surface vertical and a stepped step on the other end side surface. By providing an electrical connection portion or an adhesive portion at the step portion of the wiring substrate 12, as shown in FIG. 11, connection components such as electronic components, electric wires / cables, and optical fibers can be attached.
With the wiring board composite according to the first and second embodiments, it is possible to manufacture the wiring board 12 that can be connected and mounted using the side shape, and it is possible to integrate the components at high density. Therefore, high accuracy and high functionality of the system can be realized.

(Semiconductor device)
12 and 13 are a top view and a cross-sectional view, respectively, showing an example of the first embodiment of the semiconductor device of the present invention.
A semiconductor device 19 shown in FIGS. 12 and 13 includes a wiring board 12 having an insulating layer and a wiring layer (not shown), and a semiconductor element 15 mounted on the wiring board. The wiring board 12 is included in the wiring board composite body 11 that is formed between the wiring board 12 and the divided region 13 having the metal pattern 13 a for dividing the wiring board 12 disposed between the wiring board 12 and the wiring board 12. Here, as the wiring board composite body 11, the thing of 1st Embodiment illustrated by FIG. 1, FIG. 2 (a) is used, However, It is not limited to this, FIG. Appropriate ones of the first to second embodiments shown can be used.

  Regarding the semiconductor element 15, an electrode (not shown) on the surface of the semiconductor element 15 and an electrode (not shown) of the wiring board 12 are electrically connected. The connection is performed by flip chip connection using solder balls or metal bumps, or wire bonding using a wire mainly made of gold. In flip chip connection, an anisotropic conductive material containing metal particles may be used instead of metal bumps, and connection using a conductive resin may be performed if there is no problem in terms of characteristics. Moreover, you may give an underfill as needed.

Although FIG. 13 shows an example in which the semiconductor element 15 is mounted on the surface of the wiring board composite body 11 where the metal pattern 13a is not provided, the metal pattern 13a is provided without being limited thereto. The semiconductor element 15 may be mounted on the surface. Further, the semiconductor elements 15 may be mounted on both sides, and a plurality of semiconductor elements 15 may be mounted on one side of one wiring board 12. Moreover, the combination of these states may be sufficient. A frame such as a stiffener may be attached to increase the rigidity of the semiconductor device.
According to this embodiment, a semiconductor device having a desired outer shape and end shape can be obtained.

  FIG. 14 is a sectional view showing an example of the second embodiment of the semiconductor device of the present invention. The semiconductor device 19 of the present embodiment has a structure in which the semiconductor element 15 is sealed with a mold resin 16 as compared with the first embodiment shown in FIG. The other parts are the same as those in the first embodiment. Further, as in the case of the first embodiment, any of the wiring board composite bodies 11 shown in FIGS. 1 to 7 can be used.

The mold resin 16 is made of a material obtained by mixing a silica filler with an epoxy-based material. The resin sealing is performed by a transfer molding method using a mold, a compression molding method, a printing method, or the like, and a mold resin 16 is provided so as to cover the mounted semiconductor element 15 and the wiring at the connection portion. When the wire bonding method is used, the mold resin 16 covers the semiconductor element 15 including the bonding wires. However, even if the entire wiring substrate 12 is covered, a part of the wiring substrate is exposed. Also good.
Also in the embodiment shown in FIG. 14, the semiconductor element 15 may be mounted on the surface on which the metal pattern 13 a is provided, or the semiconductor element 15 may be mounted on both surfaces. A plurality of semiconductor elements 15 may be mounted on one side of one wiring board 12. Moreover, the combination of these states may be sufficient. A frame such as a stiffener may be attached to increase the rigidity of the semiconductor device.
According to the present embodiment, in addition to the effects of the first embodiment of the semiconductor device, since the semiconductor element 15 is covered with the mold resin 16, the semiconductor element 15 can be protected. Further, by providing the mold resin 16, the rigidity of the entire semiconductor device can be increased, and the reliability of the entire package can be improved.

(Method for manufacturing wiring board composite)
15A and 15B are cross-sectional views showing an example of the first embodiment of the method for manufacturing a wiring board composite according to the present invention in the order of steps. The manufacturing method of this embodiment is for manufacturing the first embodiment (FIG. 2A) of the wiring board composite of the present invention. Note that cleaning and heat treatment are appropriately performed between the respective steps. This cleaning and heat treatment are also appropriately performed between processes in the following embodiments.
First, as shown in FIG. 15 (a), a desired number of insulating layers and wiring layers are stacked to create a substrate having a wiring substrate 12 and a divided region 13 made of only an insulating layer, and one side thereof is formed. The metal layer 18 is formed to produce the wiring board composite precursor 11a. When a plurality of wiring layers are formed, the layers are connected by vias formed in the insulating layer.
The wiring board 12 and the divided region 13 of the wiring board composite precursor 11a are formed using the materials and methods described above. The via is also formed using the method described above.

The metal layer 18 is formed on one side of the wiring board composite 11. The forming method is performed by a sputtering method, an electroless plating method, a plating method, a vapor deposition method, and a method of attaching a metal foil. When the metal foil is attached, a vacuum press, a laminating method, or a vacuum laminating method can be used, and an adhesive layer may be formed on one or both of the metal foil side and the wiring board composite 11 side. .
Next, as shown in FIG. 15B, the metal layer 18 is patterned to form a metal pattern 13a. Patterning of the metal layer 18 is performed by a semi-additive method or a subtractive method.
With the above manufacturing method, the first embodiment of the wiring board composite body 11 shown in FIG. 2A can be efficiently manufactured.

16 (a) and 16 (b) are cross-sectional views showing an example of the second embodiment of the method for manufacturing a wiring board composite according to the present invention in the order of steps. The manufacturing method according to the present embodiment is for manufacturing the wiring board composite body (FIG. 2B) according to the first embodiment of the present invention.
First, as shown in FIG. 16A, a wiring board composite intermediate body 11b having a metal pattern 13a penetrating the entire insulating layer is formed. The wiring board composite intermediate 11 b is formed of the insulating layer of the wiring board 12 of the wiring board composite 11, a part of the wiring layer, and the metal pattern 13 a of the separation region 13. These insulating layers, wiring layers, and metal patterns are formed using any of the materials and methods described above.
Next, as shown in FIG. 16B, the insulating layer and the wiring layer of the wiring board composite 11 are formed to have a desired number of layers using any of the materials and methods described above, and the wiring board composite is obtained. 11 is formed.
Instead of the manufacturing method described above, after forming the wiring board composite body shown in FIG. 15B, an insulating layer is formed on the back surface of the board and polished to form the wiring board composite body 11 having the structure shown in FIG. Can also be obtained.
By the above manufacturing method, the first embodiment of the wiring board composite shown in FIG. 2B can be efficiently manufactured.

FIGS. 17A to 17C and FIGS. 18A to 18C are cross-sectional views showing an example of the third embodiment of the method for manufacturing a wiring board composite according to the present invention in the order of steps. The manufacturing method of this embodiment is for manufacturing the first embodiment of the wiring board composite of the present invention [FIG. 2 (c), FIG. 2 (d), FIG. 3 (a)]. .
First, as shown in FIGS. 17A and 18A, a wiring board composite intermediate 11b having a metal pattern 13a penetrating the entire insulating layer is formed. The wiring board composite intermediate body 11 b is formed from the insulating layer of the wiring board 12 of the wiring board composite body 11, a part of the wiring layer, and a part of the metal pattern 13 a in the separation region 13. These insulating layers, wiring layers, and metal patterns are formed using any of the materials and methods described above. When a plurality of wiring layers are formed, the layers are connected by vias formed in the insulating layer.

Next, as shown in FIG. 17 (b) or FIG. 18 (b), a desired insulating layer, wiring layer, and metal pattern are formed on both sides or one side of the wiring board composite intermediate 11b with the materials described above. The wiring board composite 11 is formed by stacking using any of the methods. In FIG. 18B, the width of the metal pattern 13a is changed as necessary. In this step, the wiring board composite shown in FIG. 2C can be obtained.
Furthermore, as shown in FIG. 17C or FIG. 18C, the metal pattern 13 a is formed so as to protrude from the wiring board surface of the wiring board composite 11. The metal pattern 13a is formed by, for example, a subtractive method, a semi-additive method, a full additive method, or the like. By this step, the structures shown in FIGS. 2D and 3A can be obtained. Further, this step may be performed as necessary.
With the above manufacturing method, the first embodiment of the wiring board composite shown in FIGS. 2C, 2D, and 3A can be efficiently manufactured. Note that the wiring board composite shown in FIGS. 3B to 3F can also be manufactured using the same method.

19A to 19C are cross-sectional views showing an example of the fourth embodiment of the method for manufacturing a wiring board composite according to the present invention in the order of steps. The manufacturing method of this embodiment is for manufacturing the second embodiment (FIG. 6A) of the wiring board composite of the present invention.
First, as shown in FIG. 19A, a support 14 made of any one of the materials described above is prepared, and if necessary, the surface is subjected to treatment such as wet cleaning, dry cleaning, flattening, and roughening. .
Next, as shown in FIG. 19B, the metal pattern 13a is formed by a method such as a subtractive method, a semi-additive method, or a full additive method. The metal pattern 13 a may be formed simultaneously with the wiring layer of the wiring board of the wiring board composite 11.
Next, as shown in FIG. 19C, a desired wiring layer and an insulating layer are laminated using any of the materials and methods described above to form a wiring board composite body 11.

In the present embodiment, the example in which the wiring board composite body 11 is formed on one side of the support body 14 is shown, but the present invention is not limited to this, and the wiring board composite body 11 may be provided on both surfaces of the support body 14.
With the above manufacturing method, the second embodiment of the wiring board composite shown in FIG. 6A can be efficiently manufactured.

FIGS. 20A to 20D and FIGS. 21A to 21E are cross-sectional views showing an example of the fifth embodiment of the method for manufacturing a wiring board composite according to the present invention in the order of steps. The manufacturing method according to the present embodiment is for manufacturing the wiring board composite body according to the second embodiment of the present invention [FIG. 6 (b), FIG. 6 (c), FIG. 7 (a)]. is there.
First, as shown in FIGS. 20 (a) and 21 (a), a support 14 made of any of the materials described above is prepared, and if necessary wet cleaning, dry cleaning, planarization, and roughening of the surface. And so on.
Next, as shown in FIGS. 20B and 21B, an insulating layer, a wiring layer, and a metal pattern 13a are formed using the materials and methods described above, and the wiring board composite intermediate is formed on the support 14. Form body 11b.

  Next, as shown in FIGS. 20 (c), 21 (c), and 21 (d), a desired wiring layer, insulating layer, and metal pattern are laminated using any of the materials and methods described above. Then, the wiring board composite 11 is formed. In the steps of FIGS. 21C and 21D, the metal pattern 13a is formed with a desired width so that the metal pattern has a stepped shape. The formation of the metal pattern 13a may be performed simultaneously with the formation of the wiring layer or may be performed separately. In this step, the wiring board composite having the structure shown in FIG. 6B can be obtained.

Next, as shown in FIGS. 20D and 21E, the metal pattern 13 a is formed so as to protrude from the surface of the wiring board 12 of the wiring board composite 11. The metal pattern 13a is formed by, for example, a subtractive method, a semi-additive method, a full additive method, or the like. In this step, the structure shown in FIGS. 6C and 7A can be obtained. Further, this step may be performed as necessary. The structures shown in FIGS. 7B to 7F can also be formed by a similar method.
In the present embodiment, the example in which the wiring board composite body 11 is formed on one side of the support body 14 is shown, but the present invention is not limited to this, and the wiring board composite body 11 may be provided on both surfaces of the support body 14.
By the above manufacturing method, the wiring board composite body of the second embodiment shown in FIGS. 6B, 6C, and 7 can be efficiently manufactured.

22A and 22B are cross-sectional views showing an example of the sixth embodiment of the method for manufacturing a wiring board composite according to the present invention in the order of steps. The manufacturing method of the present embodiment is for manufacturing the first embodiment of the composite body of the wiring board of the present invention (FIG. 2B).
By executing the steps shown in FIGS. 19A to 19C, the wiring board composite 11 having the metal pattern 13a, the wiring layer, and the insulating layer on the support 14 shown in FIG. Form. FIG. 22A shows an example in which the process shown in FIG. 19 is executed. However, another example in which a wiring board composite is formed on a support is executed, and FIG. 20C and FIG. The structure shown in (d), FIG. 21 (d), and FIG. 21 (e) may be used.
Next, as shown in FIG. 22B, the support 14 and the wiring board 12 are separated using any of the methods described above.
By the above manufacturing method, the first embodiment of the wiring board composite shown in FIG. 2B can be efficiently manufactured.

(Method for manufacturing a wiring board)
23A to 23C are cross-sectional views illustrating an example of the first embodiment of the method for manufacturing a wiring board according to the present invention in the order of steps.
The wiring board composite body 11 shown in FIG. 23A is obtained using the method for manufacturing a wiring board composite body described with reference to FIG. FIG. 23A shows the example of FIG. 15B, but the structure shown in FIGS. 16B and 22B may be used.
Next, as shown in FIG. 23B, the metal pattern 13a is pulled up to the side covered with the insulating layer in the direction of the arrow. Thereby, the insulating layer on the metal pattern 13a is pulled up together with the metal pattern. When the metal pattern 13a is pulled up, a part serving as a starting point is provided in a part of the wiring board composite 11, and one end of the metal pattern 13a is picked by physically cutting off the insulating layer on the metal pattern in that region. In this way, the metal pattern of the portion may be pulled up as a starting point. Further, the metal pattern 13a of the starting point is made to penetrate the wiring board composite body 11 (see FIG. 30 (f)) so that it can be picked up on the surface of the wiring board composite body 11, and this part is set as the starting point. You may make it raise as.
When the metal pattern is pulled out as shown in FIG. 23 (b), the wiring board composite 11 is divided, and as shown in FIG. 23 (c), individually divided wiring boards 12 are obtained.

24A to 24C are cross-sectional views showing an example of the second embodiment of the method for manufacturing a wiring board according to the present invention in the order of steps.
The process up to FIG. 17B is performed using the method for manufacturing the wiring board composite described with reference to FIG. 17 to obtain the wiring board composite 11 shown in FIG. FIG. 24A shows the example of FIG. 17B, but the structures of FIGS. 17C, 18B, and 18C may be used.
Next, as shown in FIG. 24B, the wiring board composite 11 is divided by pulling up the metal pattern 13a in the direction of the arrow to the side where the insulating layer covers. When the metal pattern 13a is pulled up, a part to be a starting point is provided in a part of the metal pattern and the metal pattern of the part is picked up (see FIG. 31 (f)), and the metal pattern 13a is started from this part. May be raised.
When the metal pattern is pulled out as shown in FIG. 24 (b), the wiring board composite 11 is divided, and as shown in FIG. 24 (c), individually divided wiring boards 12 are obtained. When the wiring board composite body shown in FIG. 3 is manufactured and the metal pattern is pulled out according to the present embodiment, the wiring board shown in FIGS. 8 to 11 can be obtained.

25A to 25D are cross-sectional views showing an example of the third embodiment of the method for manufacturing a wiring board of the present invention in the order of steps.
Using the method for manufacturing a wiring board composite described with reference to FIG. 19, a wiring board composite 11 shown in FIG. 24A is obtained. In the present embodiment, the example of FIG. 19C is used, but the structures of FIGS. 20C, 20D, 21D, and 21E may be used.
Next, as shown in FIG. 25B, the metal pattern 13a is pulled up to the side covered with the insulating layer in the direction of the arrow. Thereby, the insulating layer on the metal pattern 13a is pulled up together with the metal pattern. When the metal pattern 13a is pulled up, a part serving as a starting point is provided in a part of the wiring board composite 11, and one end of the metal pattern 13a is picked by physically cutting off the insulating layer on the metal pattern in that region. In this manner, the metal pattern of the portion may be pulled up as a starting point. Alternatively, the metal pattern 13a of the starting point may be picked up on the surface of the wiring board composite 11 by penetrating the wiring board composite 11, and may be pulled up starting from this part. In any case, it is desirable that the adhesiveness at the interface between the metal pattern 13a and the support 14 is low.
When the metal pattern is pulled out as shown in FIG. 25B, as shown in FIG. 25C, it is divided into the individual wiring boards 12 while being connected to the support 14. Next, as shown in FIG. 25D, the support 14 and the wiring board 12 are separated. Any of the methods described above is used as the separation method.
When the wiring board composite shown in FIGS. 7A to 7F is manufactured according to the present embodiment, the metal pattern is pulled out and the support is removed, the wiring board shown in FIGS. 8 to 11 can be obtained. .

(Method for manufacturing semiconductor device)
26A to 26D are cross-sectional views showing an example of the first embodiment of the semiconductor device manufacturing method of the present invention in the order of steps.
The wiring board composite body 11 shown in FIG. 26A is obtained by using the method for manufacturing a wiring board composite body described with reference to FIG. In this embodiment, the example of FIG. 15B is used, but FIGS. 16B, 17B, 17C, 18B, 18C, and 22 are used. You may use the thing of the structure of (b).
Next, as shown in FIG. 26B, the semiconductor element 15 is mounted on the wiring board composite body 11. In the semiconductor element 15, an electrode (not shown) on the surface of the semiconductor element 15 and an electrode (not shown) on the wiring board 12 are electrically connected using any of the methods described above. Moreover, you may give an underfill as needed.

Next, as shown in FIG. 26C, the wiring board composite 11 is divided by pulling up the metal pattern 13a to the side covered with the insulating layer in the direction of the arrow. The method of pulling up the metal pattern 13a is the same as the process described with reference to FIG.
When the metal pattern is pulled out as shown in FIG. 26C, the wiring board composite is divided as shown in FIG. 26D, and the semiconductor device 19 in which the semiconductor element 15 is mounted on the wiring board 12 is individually formed. To be separated.
In the example of FIG. 26, the example in which the semiconductor element 15 is mounted on the surface of the wiring board composite body 11 on which the metal pattern is not formed is shown, but the metal pattern 13a is provided without being limited thereto. The semiconductor element 15 may be mounted on the surface. Further, the semiconductor elements 15 may be mounted on both surfaces, and a plurality of semiconductor elements 15 may be mounted on one surface of one wiring board 12. Moreover, the combination of these states may be sufficient. A frame such as a stiffener may be attached to increase the rigidity of the semiconductor device.

27A to 27E are cross-sectional views showing an example of the second embodiment of the semiconductor device manufacturing method of the present invention in the order of steps.
The wiring board composite body 11 shown in FIG. 27A is obtained by using the method for manufacturing a wiring board composite body described with reference to FIG. In this embodiment, the example of FIG. 15B is used, but FIGS. 16B, 17B, 17C, 18B, 18C, and 22 are used. You may use the thing of the structure of (b).
Next, as shown in FIG. 27B, the semiconductor element 15 is mounted on the wiring board composite body 11. In the semiconductor element 15, an electrode (not shown) on the surface of the semiconductor element 15 and an electrode (not shown) on the wiring board 12 are electrically connected using any of the methods described above. Moreover, you may give an underfill as needed.
Next, as shown in FIG. 27C, a mold resin 16 is formed so as to cover the semiconductor element 15 using the materials and methods described above. The mold resin 16 may cover the entire wiring board 12 or may have a structure in which a part of the wiring board is exposed.

Next, as shown in FIG. 27D, the wiring board composite 11 is divided by pulling up the metal pattern 13a to the side covered with the insulating layer in the direction of the arrow. The method of pulling up the metal pattern 13a is the same as the process described with reference to FIG.
When the metal pattern is pulled out as shown in FIG. 27D, the wiring board composite is divided as shown in FIG. 27E, and the semiconductor device 19 in which the semiconductor element 15 is mounted on the wiring board 12 is individually formed. To be separated.
In the example of FIG. 27, the example in which the semiconductor element 15 is mounted on the surface on which the metal pattern of the wiring board composite body 11 is not formed is shown, but the present invention is not limited to this, and the metal pattern 13a is provided. The semiconductor element 15 may be mounted on the surface. Further, the semiconductor elements 15 may be mounted on both surfaces, and a plurality of semiconductor elements 15 may be mounted on one surface of one wiring board 12. Moreover, the combination of these states may be sufficient. A frame such as a stiffener may be attached to increase the rigidity of the semiconductor device.

28A to 28E are cross-sectional views showing an example of the third embodiment of the semiconductor device manufacturing method of the present invention in the order of steps.
The wiring board composite body 11 shown in FIG. 28A is obtained using the method for manufacturing a wiring board composite body described with reference to FIG. In this embodiment, the example shown in FIG. 19C is used, but the structure shown in FIGS. 20C, 20D, 21D, and 21E is used. Also good.
Next, as shown in FIG. 28B, the semiconductor element 15 is mounted on the wiring board composite 11. In the semiconductor element 15, an electrode (not shown) on the surface of the semiconductor element 15 and an electrode (not shown) on the wiring board 12 are electrically connected using any of the methods described above. Moreover, you may give an underfill as needed.
Next, as shown in FIG. 28C, the wiring board composite 11 is divided by pulling up the metal pattern 13a to the side covered with the insulating layer in the direction of the arrow. The method of pulling up the metal pattern 13a is the same as the process described with reference to FIG.
When the metal pattern is pulled out as shown in FIG. 28C, the semiconductor device 19 in which the semiconductor element 15 is mounted on the wiring board 12 while being connected to the support 14 as shown in FIG. Divided. Next, as shown in FIG. 28E, the support 14 and the wiring substrate 12 (semiconductor device 19) are separated. Any of the methods described above is used as the separation method. In order to protect the semiconductor element 15 during the process, a resist cover made of an organic material may be formed.

FIG. 28 shows an example in which one semiconductor element 15 is mounted on one side of the wiring board 12, but the present invention is not limited to this, and a plurality of semiconductor elements 15 may be mounted on one side. Alternatively, the semiconductor element 15 may be mounted on the other side after the state shown in FIG. Moreover, the combination of these states may be sufficient.
In the example shown in FIG. 28, after mounting the semiconductor element 15, the metal pattern 13 a is pulled up to divide the wiring board composite 11. However, the metal pattern 13 a is first lifted to divide the wiring board composite 11. After that, the semiconductor element 15 may be mounted.
A frame such as a stiffener may be attached to increase the rigidity of the semiconductor device.

29A to 29F are cross-sectional views showing an example of the fourth embodiment of the method for manufacturing a semiconductor device of the present invention in the order of steps.
The state shown in FIG. 29B is obtained by using the same steps as those of the semiconductor device manufacturing method according to the third embodiment described with reference to FIG. Next, as shown in FIG. 29C, a mold resin 16 is formed so as to cover the semiconductor element 15 using the materials and methods described above. The mold resin 16 may cover the entire wiring board 12 or may have a structure in which a part of the wiring board is exposed.
Next, as shown in FIG. 29D, the wiring board composite 11 is divided by pulling up the metal pattern 13a to the side covered with the insulating layer in the direction of the arrow. The method of pulling up the metal pattern 13a is the same as the process described with reference to FIG.
When the metal pattern is pulled out as shown in FIG. 29D, the semiconductor device 19 in which the semiconductor element 15 is mounted on the wiring board 12 in a state of being connected to the support 14 as shown in FIG. Divided. Next, as shown in FIG. 29F, the support 14 and the wiring board 12 (semiconductor device 19) are separated. Any of the methods described above is used as the separation method. In order to protect the semiconductor element 15 during the process, a resist cover made of an organic material may be formed.
FIG. 29 shows an example in which one semiconductor element 15 is mounted on one side of the wiring board 12, but the present invention is not limited to this, and a plurality of semiconductor elements 15 may be mounted on one side. Further, the semiconductor element 15 may be mounted on the other side after the state of FIG. Moreover, the combination of these states may be sufficient.
In FIG. 29, the semiconductor element 15 is mounted and the mold resin 16 is sealed, and then the metal pattern 13a is pulled up to divide the wiring board composite 11. However, the metal pattern 13a is lifted first. The semiconductor element 15 may be mounted after dividing the wiring board composite 11, or after mounting the semiconductor element 15, the metal pattern 13 a is pulled up to divide the wiring board composite 11 and sealed with the mold resin 16. You can stop.
A frame such as a stiffener may be attached to increase the rigidity of the semiconductor device.

30 (a) to 30 (g) are partial cross-sectional views in the order of steps in the first embodiment of the present invention. As an initial substrate, a copper-clad resin plate in which a 30 μm thick copper foil 101 was bonded to a 30 μm thick polyimide film 102 was prepared [FIG. 30 (a)]. Of the region to be divided region 113 of polyimide film 102, the starting portion was removed by laser light, and copper was grown by electrolytic plating on the removed portion to form conductive post 103 [FIG. 30 (b). ]. Next, the semi-additive method using sputtered film to the feed layer to form a conductive pattern 104 ₁ becomes 10μm thick copper film [Fig. 30 (c)]. Next, to form a 20μm thick polyimide film serving as the insulating layer 105 ₁ by spin coating. Then, the via formation portion and the insulating layer of the divided region that is the starting point are removed by laser light, a copper film is formed by electrolytic plating using a sputtered film for the power feeding layer, and CMP (Chemical Mechanical Polishing) is performed. The opening was filled with a copper film. Thereafter, by a semi-additive method using sputtered film to the feed layer to form a copper film of 10μm thickness as a conductive pattern 104 ₂ [FIG. 30 (d)]. Perform the same steps, to form an insulating layer 105 ₂ and the opening in the buried copper film (portion of the metal pattern for dividing the via) and 15μm conductive pattern 104 ₃ of thickness. At this time, a 2 mm square pattern was formed in the part which becomes the starting point of the separation region 113 [FIG. 30 (e)]. Next, the copper foil was patterned by photolithography so as to remain only in the divided regions to complete the formation of the metal pattern 113a, thereby forming the wiring board composite 111 [FIG. 30 (f)]. Finally, the metal pattern 113a was extracted from the wiring board composite body 111 starting from the metal pattern portion penetrating the board, and separated into individual wiring boards 112 [FIG. 30 (g)].

31 (a) to 31 (g) are partial cross-sectional views in the order of processes according to the second embodiment of the present invention. A copper thin film 107 serving as a low adhesion layer was formed to a thickness of 100 nm by sputtering on a 0.2 mm thick stainless steel substrate 106 serving as a support [FIG. 30 (a)]. Next, a polyimide film of 30μm thickness as the insulating layer 105 ₁ by a spin coating method, the insulating layer 105 the _first divided area 113 is removed by the laser beam, and copper is grown by an electrolytic plating method on the removed portion A conductive post 103 was formed [FIG. 30 (b)]. Next, the semi-additive method using sputtered film to the feed layer to form a conductive pattern 104 ₁ becomes 10μm thick copper film [Fig. 30 (c)]. Next, to form a 20μm thick polyimide film serving as the insulating layer 105 ₂ by spin coating. Then, the copper film and the via formation positions, an insulating layer 105 _{and second} divided region 113 is removed by a laser beam, to form a more copper film to the electrolytic plating method using the sputtered film to the feed layer, the inside of the opening by performing CMP Embedded in. Thereafter, by a semi-additive method using sputtered film to the feed layer to form a copper film of 10μm thickness as a conductive pattern 104 ₂ [FIG. 30 (d)]. Perform the same steps, to form an insulating layer 105 ₃ and buried copper film to the opening (portion of the metal pattern for dividing the via) and 15μm conductive pattern 104 ₃ of thickness. At this time, a 2 mm square pattern was formed in the part which becomes the starting point of the separation region 113 [FIG. 30 (e)]. Next, the wiring board composite 111 was peeled from the stainless steel substrate 106, and the copper thin film 107 remaining on the wiring board composite 111 side was removed by etching [FIG. 30 (f)]. Finally, the metal pattern 113a from the wiring board composite body 111, pull out the formed part of the conductive pattern 104 ₃ of 2mm square as a starting point to separate the individual wiring board 112 [FIG. 30 (g)].

  30A to 30F were performed to form a wiring board composite 111, and a semiconductor element having solder balls made of a lead-free solder material was flip-chip connected to each wiring board. And after giving the underfill by an epoxy resin, the metal pattern was extracted and the semiconductor device was produced.

  31A to 31E, a wiring board composite is formed on the stainless steel substrate 106, and then a semiconductor element having a solder ball of a lead-free solder material is flip-chiped on each wiring board. Connected. Then, underfilling with an epoxy resin was performed, and the semiconductor element was sealed with an epoxy resin using a compression molding method, and then the wiring board composite was peeled from the stainless steel substrate. Then, the copper thin film 107 remaining on the wiring board composite 111 side was removed by etching, and then the metal pattern was extracted from the wiring board composite to produce individually separated semiconductor devices.

The top view which shows the example of 1st Embodiment of the wiring board composite_body | complex of this invention. Sectional drawing which shows the example of 1st Embodiment of the wiring board composite_body | complex of this invention. Sectional drawing which shows the example of 1st Embodiment of the wiring board composite_body | complex of this invention. The top view which shows the example of 1st Embodiment of the wiring board composite_body | complex of this invention. The top view which shows the example of 1st Embodiment of the wiring board composite_body | complex of this invention. Sectional drawing which shows the example of 2nd Embodiment of the wiring board composite_body | complex of this invention. Sectional drawing which shows the example of 2nd Embodiment of the wiring board composite_body | complex of this invention. Sectional drawing which shows the example of the wiring board formed by the 1st or 2nd embodiment of the wiring board composite body of this invention. Sectional drawing which shows the example of the wiring board formed by the 1st or 2nd embodiment of the wiring board composite body of this invention. Sectional drawing which shows the example of the wiring board formed by the 1st or 2nd embodiment of the wiring board composite body of this invention. Sectional drawing which shows the example of the wiring board formed by the 1st or 2nd embodiment of the wiring board composite body of this invention. The top view which shows the example of the semiconductor device formed by 1st Embodiment of the wiring board composite body of this invention. Sectional drawing which shows the example of the semiconductor device formed by 1st Embodiment of the wiring board composite_body | complex of this invention. Sectional drawing which shows the example of the semiconductor device formed by 1st Embodiment of the wiring board composite_body | complex of this invention. It is sectional drawing which shows the example of 1st Embodiment of the manufacturing method of the wiring board composite_body | complex of this invention to process order. Sectional drawing which shows the example of the manufacturing method of the wiring board composite of 2nd Embodiment of the manufacturing method of the wiring board composite of this invention in process order. Sectional drawing which shows the example of 3rd Embodiment of the manufacturing method of the wiring board composite body of this invention in order of a process. Sectional drawing which shows the example of 3rd Embodiment of the manufacturing method of the wiring board composite_body | complex of this invention to process order. Sectional drawing which shows the example of 4th Embodiment of the manufacturing method of the wiring board composite_body | complex of this invention to process order. Sectional drawing which shows the example of 5th Embodiment of the manufacturing method of the wiring board composite_body | complex of this invention to process order. Sectional drawing which shows the example of 5th Embodiment of the manufacturing method of the wiring board composite_body | complex of this invention to process order. Sectional drawing which shows the example of 6th Embodiment of the manufacturing method of the wiring board composite_body | complex of this invention to process order. Sectional drawing which shows the example of 1st Embodiment of the manufacturing method of the wiring board of this invention to process order. Sectional drawing which shows the example of 2nd Embodiment of the manufacturing method of the wiring board of this invention in order of a process. Sectional drawing which shows the example of 3rd Embodiment of the manufacturing method of the wiring board of this invention to process order. Sectional drawing which shows the example of 1st Embodiment of the manufacturing method of the semiconductor device of this invention to process order. Sectional drawing which shows the example of 2nd Embodiment of the manufacturing method of the semiconductor device of this invention to process order. Sectional drawing which shows the example of 3rd Embodiment of the manufacturing method of the semiconductor device of this invention to process order. Sectional drawing which shows the example of 4th Embodiment of the manufacturing method of the semiconductor device of this invention to process order. Sectional drawing which shows Example 1 of this invention in order of a process. Sectional drawing which shows Example 2 of this invention in order of a process.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11, 111 Wiring board composite body 11a Wiring board composite precursor 11b Wiring board composite intermediate body 11 Wiring board composite bodies 12, 112 Wiring boards 13, 113 Divided regions 13a, 113a Metal pattern 14 Support body 15 Semiconductor element 16 Mold resin 17 Component 18 Metal layer 19 Semiconductor device 101 Copper foil 102 Polyimide film 103 Conductive post 104 ₁ , 104 ₂ , 104 ₃ Conductive pattern 105 ₁ , 105 ₂ , 105 ₃ Insulating layer 106 Stainless steel substrate 107 Copper thin film

Claims (23)

A wiring board composite having a plurality of wiring boards each having an insulating layer and a wiring layer, with a divided area interposed therebetween, wherein the divided area has a metal pattern for dividing the wiring board composite. A wiring board composite. The wiring board composite according to claim 1, wherein the wiring board and the divided region are provided on a support. The wiring composite according to claim 2, wherein a low adhesion layer having a low adhesion is formed at an interface between the support and the wiring board. 2. The wiring board composite according to claim 1, wherein the divided region has an insulating layer equivalent to the insulating layer of the wiring board, and the metal pattern is formed on one outer surface of the insulating layer. . The divided region has an insulating layer equivalent to that obtained by removing a part of the insulating layer outside the wiring board, and the metal pattern is embedded in the removed portion of the insulating layer. The wiring board composite according to any one of claims 1 to 3. 4. The wiring board composite according to claim 1, wherein the entire divided region is formed of the metal pattern. 5. The wiring board composite according to claim 6, wherein a part of the metal pattern protrudes higher than an outer surface of the wiring board. 8. The wiring board composite according to claim 6, wherein the cross-sectional pattern of the metal pattern has a displacement in pattern width. The wiring board composite according to claim 6, wherein the cross-sectional pattern of the metal pattern has a recess, a protrusion, or a step. The wiring board composite according to claim 1, wherein a semiconductor element is mounted on the wiring board. The wiring board composite according to claim 10, wherein the semiconductor element is resin-sealed. A method of manufacturing a wiring board composite having a plurality of wiring boards and divided regions connecting them, the process comprising forming a plurality of wiring boards comprising a step of forming a wiring layer and a step of forming an insulating layer And forming a dividing metal pattern so as to be in contact with at least one outermost surface of the wiring substrate in the divided region. A method of manufacturing a wiring board composite having a plurality of wiring boards and a divided region connecting them on a support, comprising a step of forming a wiring layer and a step of forming an insulating layer on the support A method of manufacturing a wiring board composite comprising a step of forming a plurality of wiring boards, and forming a metal pattern for division in at least one of the outermost surfaces of the wiring board in the divided region. Prior to forming the wiring board and the divided region on the support, the method includes a step of forming a low adhesion layer having a low adhesion force between the support or the wiring substrate and the divided region. The manufacturing method of the wiring board composite_body | complex of Claim 13. The method of manufacturing a wiring board composite according to claim 13, further comprising a step of removing the support. 16. The method of manufacturing a wiring board composite according to claim 12, wherein the metal pattern is formed in the same process as the process of forming at least one wiring layer of the wiring board. A method for manufacturing a wiring board, comprising: extracting the metal pattern from the wiring board composite body according to claim 1 and separating the metal pattern into individual wiring boards. 18. The method of manufacturing a wiring board according to claim 17, wherein a step of removing the support substrate is added prior to the metal pattern drawing step or after the metal pattern drawing step. 19. The method of manufacturing a wiring board according to claim 18, wherein the support substrate is removed by etching, grinding, or a combination thereof, or peeling or cutting. A step of mounting a semiconductor element on the wiring board of the wiring board composite according to claim 1, and a step of extracting the metal pattern from the wiring board composite and separating it into individual wiring boards. A method for manufacturing a semiconductor device, comprising: A step of mounting a semiconductor element on the wiring board of the wiring board complex according to claim 1, a step of resin-sealing the semiconductor element, and the metal pattern from the wiring board complex. And a step of pulling out and separating into individual wiring boards. 22. The method of manufacturing a semiconductor device according to claim 20, wherein a step of removing the support substrate is added prior to the step of extracting the metal pattern. 23. The method of manufacturing a semiconductor device according to claim 22, wherein the support substrate is removed by etching, grinding, or a combination thereof, or peeling or cutting.

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