CN111885857B - Printed circuit board and manufacturing method thereof - Google Patents
Printed circuit board and manufacturing method thereof Download PDFInfo
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- CN111885857B CN111885857B CN202010863288.0A CN202010863288A CN111885857B CN 111885857 B CN111885857 B CN 111885857B CN 202010863288 A CN202010863288 A CN 202010863288A CN 111885857 B CN111885857 B CN 111885857B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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Abstract
The application is suitable for the field of circuit boards, and provides a manufacturing method of a printed circuit board, which comprises the following steps: manufacturing a first groove on a first surface of a substrate, wherein the depth of the first groove is smaller than the thickness of the substrate; manufacturing an outer layer circuit on the second surface of the substrate, wherein the outer layer circuit comprises a bonding pad and an auxiliary block, the bonding pad comprises a bonding part and an extension part arranged at one end of the bonding part, and the extension part and the auxiliary block are connected and correspond to the first groove in position; cutting the outer layer circuit by using laser, and removing the extension part, the auxiliary block and a part of the substrate below the extension part and the auxiliary block to form a second groove; the cross-sectional area of the second groove is smaller than that of the first groove, and the second groove is communicated with the first groove to form a stepped through groove. The manufacturing method can solve the problem that the bonding pad has sharp corners or the bonding pad and the stepped through groove have deviation. The application also provides a printed circuit board.
Description
Technical Field
The invention relates to the field of circuit boards, in particular to a manufacturing method of a printed circuit board and the printed circuit board.
Background
At present, a Printed Circuit Board (PCB) commonly used includes a bonding pad (bonding pad) and a stepped through groove, the stepped through groove is divided into an upper portion and a lower portion, the size of the lower portion is larger than that of the upper portion, the lower portion is a blind groove, and the upper portion is a hollow area and penetrates through the blind groove of the lower portion. The stepped through-slots are usually used for heat dissipation during chip packaging by crimping the T-shaped metal matrix. In order to obtain better component precision, the pad is usually arranged at one end of the stepped through groove and tangentially surrounds the groove edge.
The existing manufacturing scheme is that a step through groove is manufactured firstly, and then an outer layer pattern transfer and an outer layer etching process are adopted to manufacture a bonding pad, however, during etching, due to the fact that liquid medicine around the step through groove is exchanged too fast, the etching amount of the front end of the bonding pad is large, and an obvious sharp corner is formed easily due to over-etching. As shown in fig. 1, the edge of the pad near the stepped through slot has sharp corners, resulting in an undersized pad with a high risk of bond failure.
Another manufacturing scheme is to manufacture the bonding pad by using an outer layer pattern transfer and an outer layer etching process and then manufacture the step through groove, but the etching amount is still not easy to control, the bonding pad has a sharp corner, and the problem that the step through groove cannot be accurately aligned with the bonding pad may exist, as shown in fig. 2, the bonding pad is off-position and cannot be tangent to the groove edge.
Disclosure of Invention
The application provides a manufacturing method of a printed circuit board and the printed circuit board, which are used for solving the problems of sharp corners and offset of a bonding pad in the printed circuit board with a stepped through groove.
The embodiment of the application provides a manufacturing method of a printed circuit board, which comprises the following steps: manufacturing a first groove on a first surface of a substrate, wherein the depth of the first groove is smaller than the thickness of the substrate;
manufacturing an outer-layer circuit on a second surface of the substrate, wherein the second surface is arranged opposite to the first surface, the outer-layer circuit comprises a bonding pad and an auxiliary block, the bonding pad comprises a bonding part and an extension part arranged at one end of the bonding part, and the extension part and the auxiliary block are connected and correspond to the first groove in position;
cutting the outer layer circuit by using laser, and removing the extension part, the auxiliary block and a part of the substrate below the extension part and the auxiliary block to form a second groove; the cross-sectional area of the second groove is smaller than that of the first groove, and the second groove is communicated with the first groove to form a stepped through groove.
Further, the length of the extension part is 0.5 mm-1.5 mm.
Further, the width of the extension portion is equal to the width of the bonding portion.
Further, before the first groove is formed on the first surface of the substrate, the forming method further includes:
and manufacturing the substrate, wherein the substrate comprises two copper foil layers and a multilayer core plate positioned between the two copper foil layers.
Furthermore, a depth control gong mode is adopted to manufacture the first groove, and the first groove penetrates through the copper foil layer and the at least one layer of core plate on the first surface.
Further, the manufacturing of the outer layer circuit on the second surface of the substrate includes:
carrying out pattern transfer treatment on the copper foil layer positioned on the first surface and the copper foil layer positioned on the second surface;
and etching the two copper foil layers after the pattern transfer treatment to obtain the outer layer circuit, wherein the outer layer circuit further comprises normal circuits arranged on the first surface and the second surface.
Further, in the step of cutting the outer layer line with laser, the laser is used to perform equal-proportion cutting along the outline of the required stepped through groove.
Further, the manufacturing method further comprises the following steps:
when the outer layer circuit is manufactured, manufacturing an optical point on the substrate;
and in the step of cutting the outer layer circuit by using laser, grabbing the optical point, and adjusting the laser cutting range according to the optical point.
Further, after the step through groove is formed, the manufacturing method further comprises the following steps:
and chemically cleaning the groove wall of the stepped through groove.
The embodiment of the application also provides a printed circuit board which is manufactured by adopting the manufacturing method of the printed circuit board in any embodiment.
The manufacturing method of the printed circuit board can manufacture the printed circuit board with the stepped through groove and the bonding pad, the bonding pad is arranged on the groove edge of the stepped through groove and tangent to the stepped through groove, the bonding pad has complete morphology, sharp corners cannot be generated, and the risk of bonding failure is avoided. The manufacturing method solves the problem of sharp corners caused by over-etching of the front end of the bonding pad due to too fast exchange of the liquid medicine around the stepped through groove, also solves the problem of deviation of the bonding pad and the stepped through groove, improves the alignment precision of the bonding pad and the stepped through groove, and further improves the quality and yield of the printed circuit board.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
FIG. 1 is a schematic diagram of a stepped through slot and a pad in the prior art;
FIG. 2 is a schematic view of another stepped through slot and pad of the prior art;
FIG. 3 is a flow chart of a method for fabricating a printed circuit board according to an embodiment of the present invention;
fig. 4 is a schematic diagram illustrating a first groove formed in a method for manufacturing a printed circuit board according to an embodiment of the invention;
FIG. 5 is a schematic diagram illustrating a circuit pattern formed in a method for forming a printed circuit board according to an embodiment of the present invention;
FIG. 6 is a partial cross-sectional view of a printed circuit board provided in accordance with one embodiment of the present invention;
fig. 7 is a schematic plan view of the printed circuit board shown in fig. 6.
The designations in the figures mean:
100. a printed circuit board; 10. a substrate; 101. a first surface; 102. a second surface; 11. a copper foil layer; 12. a core board; 20. a stepped through groove; 21. a first groove; 22. a second groove; 30. an outer layer circuit; 31. a pad; 311. a bonding part; 312. an extension part; 32. and an auxiliary block.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail below with reference to the accompanying drawings, which are examples. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly or indirectly secured to the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "upper", "lower", "left", "right", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description, and do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed and operated in a specific orientation, and thus, are not to be construed as limiting the patent. The terms "first", "second" and "first" are used merely for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "plurality" is two or more unless specifically limited otherwise.
To illustrate the technical solution of the present invention, the following description is made with reference to the specific drawings and examples.
The embodiment of the application provides a manufacturing method of a printed circuit board, which is used for manufacturing the printed circuit board with a stepped through groove. Referring to fig. 3, the method for manufacturing the printed circuit board includes the following steps.
Step S101, a first groove is formed on a first surface of a substrate.
Specifically, referring to fig. 4, the substrate 10 includes a first surface 101 and a second surface 102 disposed opposite to each other. The substrate 10 may be a multi-layer structure, and in one embodiment, the substrate 10 includes two copper foil layers 11 and a multi-layer core 12 located between the two copper foil layers 11. Two copper foil layers 11 are located on the first surface 101 and the second surface 102, respectively. Semi-cured layers are arranged between the copper foil layers 11 and the core plates 12 and between the adjacent core plates 12. In this embodiment, the substrate 10 has 6 layers in total, the first layer L1 and the sixth layer L6 are copper layers, and the intermediate layers L2 to L5 are core boards 12.
The first groove 21 is a blind groove, and the depth H2 of the first groove 21 is smaller than the thickness H1 of the substrate 10. Specifically, the first groove 21 penetrates the copper foil layer 11 and the at least one core 12 of the first surface 101. In the present embodiment, the first grooves 21 penetrate through the copper foil layer 11 and the 3-layer core board 12 of the first surface 101, i.e., through the layers L6, L5, L4, and L3. The cross section of the first groove 21 may be circular, rectangular, etc., without limitation.
In this embodiment, the first groove 21 is made by a depth control gong, but the invention is not limited thereto, and the first groove 21 may also be made by a laser machine or other mechanical drilling methods. Since the first surface 101 of the substrate 10 is the copper foil layer 11, it is advantageous to control the depth tolerance of the first groove 21.
In step S102, an outer layer circuit is formed on the second surface 102 of the substrate 10.
Referring to fig. 4 to 7, the outer layer circuit 30 includes a pad 31 and an auxiliary block 32, the pad 31 includes a bonding portion 311 and an extension portion 312 disposed at one end of the bonding portion 311, and the extension portion 312 and the auxiliary block 32 are connected and correspond to the position of the first slot 21.
Specifically, bonding portion 311 has the same size as pad 31, and extension 312 has a width equal to that of bonding portion 311. Preferably, the length of the extension 312 is 0.5mm to 1.5mm, for example, 0.5mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, etc.
The number of the pads 31 may be plural, and in the present embodiment, the plural pads 31 are respectively provided on the peripheral side of the first groove 21.
The auxiliary block 32 is a copper block, and the auxiliary block 32 and the extension 312 correspond to a waste region (i.e., a hollow region) in the stepped through slot to facilitate the subsequent formation of the second slot 22 of the stepped through slot 20.
The size of the auxiliary block 32 and the size of the extension 312 are different according to the size of the second groove 22. Preferably, along the length direction of the preset second groove 22, the sum of the lengths of the extension part 312 and the auxiliary block 32 is equal to the length of the hollowed-out area; along the width direction of the preset second groove 22, the sum of the length of the extension 312 and the width of the auxiliary block 32 is equal to the width of the hollowed-out area. As shown in fig. 5, in one embodiment, the extension parts 312 are connected to the periphery of the auxiliary block 32, and the length of the extension parts 312 is a 1; the auxiliary block 32 has a length of B1 and a width of B2; the length of the second slot 22 to be made is C1 and the width is C2; the dimensions of the extension 312 and the auxiliary block 32 satisfy the following relation:
2a1+ B1 ═ C1; and
2A1+B2＝C2。
preferably, the auxiliary block 32 is single-side retracted by 0.5mm to 1.5mm compared with the size of the second groove 22, that is, the length of the extending portion 312 is 0.5mm to 1.5mm, so that the extending portion 312 and the bonding portion 311 can be smoothly separated during the subsequent laser cutting, and the etching uniformity of the bonding portion 311 can also be ensured.
In an embodiment, step S102 specifically includes: performing a pattern transfer process on the copper foil layer 11 on the first surface 101 of the substrate 10 and the copper foil layer 11 on the second surface 102 of the substrate 10; and etching the copper foil layer 11 after the pattern transfer treatment to obtain an outer layer circuit 30, wherein the outer layer circuit 30 further comprises normal circuits arranged on the first surface 101 and the second surface 102.
In the step of performing the pattern transfer process on the second surface 102, a photoresist is firstly pasted on the second surface 102; the photoresist is exposed, the line pattern of the film is printed on the first photoresist, and developed, and the unexposed first photoresist film is removed.
In the etching step, the copper foil layer 11 not covered with the first photoresist film is etched, and the undeveloped first photoresist film is removed to obtain the pad 31 and the auxiliary block 32. The auxiliary block 32 and the extension 312 can prevent the front end of the bonding portion 311 from being in a hollow region, so as to improve the uniformity of etching and prevent the pad 31 from generating a sharp corner.
In step S103, the outer layer wire 30 is cut by laser to form the second groove 22.
Specifically, the outer layer circuit 30 is cut by laser, and the extension 312, the auxiliary block 32, and a portion of the substrate 10 under the extension 312 and the auxiliary block 32 are removed to form the second groove 22. The cross-sectional area of the second groove 22 is smaller than that of the first groove 21, the second groove 22 is communicated with the first groove 21 to form a stepped through groove 20, and the pad 31 is arranged at the groove edge of the stepped through groove 20 and is tangent to the groove edge, so that the printed circuit board 100 comprising the stepped through groove 20 is obtained. Among them, the pad 31 is a bonding portion 311 remaining on the substrate 10 after dicing.
The substrate 10 has N layers, the pad 31 is located on the L1 layer, the second trench 22 penetrates through the L1-LM layer, and the first trench 21 penetrates through the LM-LN layer, so that the step through trench 20 formed by the first trench 21 and the second trench 22 penetrates through two opposite sides of the substrate 10. In the present embodiment, the first grooves 21 penetrate through the copper foil layer 11 and the 3-layer core board 12, i.e., through the L6, L5, L4, L3 layers; the second grooves 22 penetrate through one of the core plates 12 and the other copper foil layer 11, i.e., through the layers L2, L1. In the present embodiment, the depth H2 of the first groove 21 is greater than the depth H3 of the second groove 22, but is not limited thereto.
Preferably, the laser is used to make an equal ratio cut along the desired contour of the stepped through slot 20, i.e., along the desired contour of the second slot 22. In one embodiment, the laser cutting data is formed by stacking blind holes of 0.1mm, and the cutting parameters are as follows: UV laser is adopted, the laser energy is 3.6W, the frequency is 40KHZ, the speed is 300mm/s, and the spot size is 0.02 mm. It is understood that the cutting parameters can be set according to actual requirements. After laser cutting, the second groove 22 is obtained, and the second groove 22 is communicated with the first groove 21 to form the complete stepped through groove 20.
In one embodiment, the method for manufacturing a printed circuit board further includes:
when the outer layer circuit 30 is manufactured, an optical point is manufactured on the substrate 10;
in the step of cutting the outer layer wire 30 by using laser, the optical point is grasped, and the laser cutting position is adjusted by performing automatic expansion and contraction alignment according to the optical point.
Thus, the alignment accuracy of the bonding pad 31 and the stepped through groove 20 can be further improved when the circuit pattern is cut.
In an embodiment, before the first groove 21 is formed on the first surface 101 of the substrate 10, the forming method further includes: a substrate 10 is produced.
Specifically, the substrate 10 is fabricated using pre-processes, which may include: cutting, manufacturing an inner layer circuit, performing AOI optical inspection, pressing, drilling a target, milling edges, drilling holes, electroplating and the like.
In one embodiment, after S102, AOI optical inspection may also be performed on the substrate 10 on which the line etching is completed.
In an embodiment, after forming the stepped through trench 20, the manufacturing method further includes: the walls of the stepped through slots 20 are chemically cleaned. For example, the PCB is passed through a chemical stripper at a speed of 2m/min to remove the residual carbide on the walls of the slot.
In one embodiment, after the chemical cleaning, the manufacturing method further comprises post-processes, wherein the post-processes comprise solder prevention, nickel palladium gold, molding, testing and the like.
In the above embodiment, the substrate 10 includes two copper foil layers 11 and a plurality of core plates 12, it is understood that in other embodiments, the structure of the substrate 10 is not limited thereto, for example, only one side of the substrate 10 is provided with the copper foil layer 11.
The manufacturing method can manufacture the printed circuit board 100 comprising the stepped through groove 20 and the bonding pad 31, the bonding pad 31 is arranged at the groove edge of the stepped through groove 20 and is tangent to the stepped through groove 20, the bonding pad 31 has complete appearance, sharp corners cannot be generated, and the risk of bonding failure is avoided. The manufacturing method solves the problem of sharp corners caused by over-etching of the front end of the bonding pad 31 due to too fast exchange of the liquid medicine around the stepped through groove 20, also solves the problem of deviation of the bonding pad 31 and the stepped through groove 20, improves the alignment precision of the bonding pad 31 and the stepped through groove 20, and further improves the quality and the yield of the printed circuit board 100.
The embodiment of the present application also provides a printed circuit board 100, which is manufactured by the method for manufacturing a printed circuit board according to any of the above embodiments. The printed circuit board 100 includes a substrate 10, a stepped through groove 20 and a land 31, the stepped through groove 20 includes a first groove 21 and a second groove 22 communicated with each other, and a cross-sectional area of the second groove 22 is smaller than a cross-sectional area of the first groove 21, so that the stepped through groove 20 has a stepped shape; the pad 31 is tangent to the slot edge of the second slot 22. In the present embodiment, a plurality of pads 31 are wound around the peripheral side of the stepped through groove 20.
The above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present application and are intended to be included within the scope of the present application.
Claims (10)
1. A method of fabricating a printed circuit board, comprising:
manufacturing a first groove on a first surface of a substrate, wherein the depth of the first groove is smaller than the thickness of the substrate;
manufacturing an outer-layer circuit on a second surface of the substrate, wherein the second surface is arranged opposite to the first surface, the outer-layer circuit comprises a bonding pad and an auxiliary block, the bonding pad comprises a bonding part and an extension part arranged at one end of the bonding part, and the extension part and the auxiliary block are connected and correspond to the first groove in position;
cutting the outer layer circuit by using laser, and removing the extension part, the auxiliary block and a part of the substrate below the extension part and the auxiliary block to form a second groove; the cross-sectional area of the second groove is smaller than that of the first groove, and the second groove is communicated with the first groove to form a stepped through groove.
2. The method of manufacturing a printed circuit board according to claim 1, wherein the length of the extension portion is 0.5mm to 1.5 mm.
3. The method of manufacturing a printed circuit board according to claim 1, wherein the extension portion has a width equal to a width of the bonding portion.
4. The method of manufacturing a printed circuit board according to claim 1, wherein before the first groove is formed on the first surface of the substrate, the method further comprises:
and manufacturing the substrate, wherein the substrate comprises two copper foil layers and a multilayer core plate positioned between the two copper foil layers.
5. The method of manufacturing a printed circuit board according to claim 4,
the first groove is manufactured in a depth control gong mode and penetrates through the copper foil layer and the at least one layer of core board on the first surface.
6. The method of claim 4, wherein forming an outer layer of circuitry on the second surface of the substrate comprises:
carrying out pattern transfer treatment on the copper foil layer positioned on the first surface and the copper foil layer positioned on the second surface;
and etching the two copper foil layers after the pattern transfer treatment to obtain the outer layer circuit, wherein the outer layer circuit further comprises normal circuits arranged on the first surface and the second surface.
7. The method of manufacturing a printed circuit board according to claim 1, wherein in the step of cutting the outer layer wiring using a laser, the laser is used to perform an equal-ratio cutting along a contour line of a desired stepped through-groove.
8. The method of manufacturing a printed circuit board according to claim 5, further comprising:
when the outer layer circuit is manufactured, manufacturing an optical point on the substrate;
and in the step of cutting the outer layer circuit by using laser, grabbing the optical point, and carrying out automatic expansion and contraction alignment according to the optical point to adjust the laser cutting position.
9. The method of manufacturing a printed circuit board according to claim 1, wherein after the step through groove is formed, the method further comprises:
and chemically cleaning the groove wall of the stepped through groove.
10. A printed circuit board manufactured by the method for manufacturing a printed circuit board according to any one of claims 1 to 9.
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| CN202010863288.0A CN111885857B (en) | 2020-08-25 | 2020-08-25 | Printed circuit board and manufacturing method thereof |
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| JPH0499292A (en) * | 1990-08-10 | 1992-03-31 | Matsushita Electric Works Ltd | Treatment of electric joint surface |
| JP2002280416A (en) * | 2001-03-19 | 2002-09-27 | Fuji Xerox Co Ltd | Matrix-bonding method between flexible wiring board and ic chip |
| JP2004253554A (en) * | 2003-02-19 | 2004-09-09 | Shinko Electric Ind Co Ltd | Manufacturing method of wiring board |
| CN101697660B (en) * | 2009-10-28 | 2011-08-10 | 深南电路有限公司 | Method for processing stepped groove bottom patterned circuit board |
| CN204217201U (en) * | 2014-10-13 | 2015-03-18 | 东莞森玛仕格里菲电路有限公司 | Bury copper billet heat radiation PCB structure |
| CN109413894B (en) * | 2018-10-30 | 2022-02-08 | 生益电子股份有限公司 | Manufacturing method of bottom graph of stepped groove |
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