TWI454196B - Routing method - Google Patents

Description

Molding method

The present invention relates to the field of circuit board manufacturing, and in particular to a method for forming a circuit board and its accessories.

With the rapid development of the electronics industry, the production technology of circuit boards, which are the basic components of electronic products, is becoming more and more important. The circuit board is generally fabricated by a series of processes such as cutting, drilling, etching, exposing, developing, pressing, and molding a copper-clad substrate. For details, see "Dielectric characterization of printed circuit board substrates" by C. H. Steer et al., Proceedings of the IEEE, Vol. 39, No. 2 (August 2002).

At present, in the manufacture of a circuit board, whether the accessory is also the circuit board itself, a plurality of units having the same structure and function are generally typeset on a larger substrate. After the board is fabricated, the plurality of cells are cut and separated from the substrate to obtain a single unit. When the unit is separated from the substrate from the single unit, the punching process is generally adopted. As the electronic product becomes more and more refined, there are mechanism holes or through holes in the edge portion of the single unit, and the mechanism holes and the through holes are present. The distance from the exterior is getting smaller and smaller. Even if it adopts the method of split molding, it will cause cracks, whitening or deformation of the hole edge forming area after the punching.

In view of this, a molding method is provided to effectively improve the circuit board or its accessories. It is necessary to crack, blush or deform the hole in the vicinity of the formed side after molding.

A molding method comprising the steps of: providing a substrate having a product zone and a non-product zone, wherein the boundary between the product zone and the non-product zone is a forming edge, the product zone having at least one product unit, a product hole having a plurality of product holes, wherein at least one of the plurality of product holes is adjacent to the molding edge; and the non-product region adjacent to the at least one product hole adjacent to the molding edge forms at least An auxiliary hole. The substrate is formed along the forming edge to form a product unit.

Compared with the prior art, the technical solution provides a molding method for drilling an auxiliary hole in a region of a non-product area adjacent to a product hole of a product area, the auxiliary hole diameter being larger than the product hole diameter. The auxiliary hole is used to transfer the force to the non-product area during molding to effectively improve the crack, whitening or deformation of the hole of the circuit board or its fitting in the vicinity of the molded side after molding.

10‧‧‧Circuit board

100‧‧‧non-product area

101‧‧‧Product Area

102‧‧‧ formed side

103,203‧‧‧Product hole

103a, 203a‧‧‧ first product hole

103b, 203b‧‧‧ second product hole

103c‧‧‧ third product hole

104,204‧‧‧Auxiliary hole

104a, 204a‧‧‧ first auxiliary hole

104b, 204b‧‧‧Second auxiliary hole

104c‧‧‧ third auxiliary hole

110‧‧‧Circuit unit

111,211‧‧‧First line

112,212‧‧‧Second line

113,213‧‧‧ third line

114,214‧‧‧The first prominent edge

115, 215‧‧‧ second prominent edge

116,216‧‧‧ third prominent edge

117,217‧‧‧ fourth sideline

20‧‧‧Accessory substrate

200‧‧‧Second non-product area

201‧‧‧Second product area

202‧‧‧Second forming side

210‧‧‧Accessory unit

218‧‧‧ curved edges

220‧‧‧second protruding structure

230‧‧‧ third protruding structure

FIG. 1 is a schematic plan view of a circuit board substrate according to Embodiment 1 of the present technical solution.

2 is a plan view showing the circuit board provided in FIG. 1 after being punched through the auxiliary hole.

FIG. 3 is a circuit board unit formed by molding a circuit board substrate according to Embodiment 1 of the present technical solution.

4 is a schematic plan view of a circuit board assembly provided in Embodiment 2 of the technical solution.

FIG. 5 is a schematic plan view of the accessory unit after the circuit board assembly provided by the second embodiment of the technical solution is formed.

The molding method of the present technical solution will be further described in detail below with reference to the accompanying drawings and embodiments.

Referring to FIG. 1 and FIG. 2 together, the molding method provided in Embodiment 1 of the technical solution includes the following steps:

First, a circuit board substrate 10 that has been drilled is provided.

The circuit board substrate 10 is a circuit board substrate that has been punched. The circuit board substrate 10 is divided into a product area 101 and a non-product area 100. The boundary between the product zone 101 and the non-product zone 100 is the profiled edge 102. The molding side 102 is sequentially connected by the first side line 111, the second side line 112, the third side line 113, and the fourth side line 117 in order, and the molding side 102 has a substantially rectangular appearance. The first side line 111 is parallel to the third side line 113 and is perpendicular to the second side line 112 and the fourth side line 117, respectively. In this embodiment, a rectangular protruding structure 120 is formed on the third side line 113 to the non-product area 100. The protruding structure 120 has a first protruding edge line 114, a second protruding edge line 115, and a third protruding edge line 116. The second protruding edge line 115 is parallel to the first edge line 111 and perpendicular to the first protruding edge line 114 and the third protruding edge line 116, respectively. The product area 101 of the circuit board substrate 10 includes a plurality of mutually independent circuit board units 110.

Each circuit board unit 110 has a plurality of product apertures 103. In this embodiment, the product hole 103 includes a first product hole 103a, a second product hole 103b, and a third product hole 103c. In the present embodiment, the protruding structure 120 has a first product hole 103a and the distance from the center of the first product hole 103a to at least one of the forming edges 102 is smaller than the diameter of the first product hole 103a. In this embodiment, the first product hole 103a is adjacent to the first protruding edge 114, the second protruding edge 115, and the third protruding edge 116, and the center of the first product hole 103a to the first protruding edge 114, the second protrusion The distance between the edge 115 and the third protruding edge 116 is smaller than the diameter of the first product hole 103a. The second product hole 103b is adjacent to the product area 101 of the first edge 111 and the second edge 112. At least one distance from the center of the second product hole 103b to the forming edge 102 is smaller than the distance of the second product hole 103b path. In this embodiment, the distance between the center of the second product hole 103b and the first edge 111 and the second edge 112 is smaller than the diameter of the second product hole 103b. The third product hole 103c is adjacent to the fourth side line 117, and the distance from the center of the third product hole 103c to the fourth side line 117 is smaller than the diameter of the third product hole 103c. The number and shape of the protruding structures 120 of each of the circuit board units 110 are not fixed. Depending on the shape of the particular board, the protruding structures 120 can be one, two or more. The protruding structure 120 may also have a semicircular shape, a square shape or an irregular shape.

Next, an auxiliary hole 104 is formed in the non-product area 100 of the circuit board substrate 10.

The circuit board substrate 10 is placed on the punching machine table surface through the product hole 103 having the positioning function, and the auxiliary hole 104 is formed at a position corresponding to the corresponding product hole 103 at the non-product area 100 adjacent to the molding side 102. The minimum distance from the point on the circumference of the hole of the auxiliary hole 104 to the forming edge 102 is the offset machining tolerance during molding. In order to avoid the defects in the shape of the product caused by the punching offset during the molding process. The diameter of the auxiliary hole 104 is greater than or equal to twice the diameter of the first product hole 103a, the second product hole 103b or the third product hole 103c adjacent thereto.

Specifically, the non-product regions 100 adjacent to the first protruding edge line 114, the second protruding edge line 115, and the third protruding edge line 116 form three first auxiliary holes 104a corresponding to the first product holes 103a. The line connecting the center of each of the first auxiliary holes 104a and the center of the first product hole 103a is perpendicular to its adjacent protruding edge. Forming two second auxiliary holes 104b of the second product hole 103b in the non-product area 100 adjacent to the first side line 111 and the second side line 112, the center of each of the second auxiliary holes 104b and the center of the second product hole 103b The line is perpendicular to its adjacent edge. A third auxiliary hole 104c of the third product hole 103c is formed in the non-product area 100 adjacent to the fourth side line 117. Preferably, the line connecting the center of the third auxiliary hole 104c and the center of the third product hole 103c is perpendicular to the fourth side line 117. That is each The line of the center of the auxiliary hole and the first product hole 103a, the second product hole 103b, and the third product hole 103c adjacent thereto are perpendicular to the forming edge 102 between the corresponding product hole 103 and the auxiliary hole.

Finally, referring to FIG. 3, the circuit board substrate 10 is molded along the molding side 102 to form the circuit board unit 110.

During the process, the force generated by the first product hole 103a, the second product hole 103b, and the third product hole 103c during molding is transferred to the corresponding auxiliary hole, so that the first product hole 103a and the second product hole 103b The force received by the third product hole 103c is greatly reduced compared to when the auxiliary hole 104 is not provided, so that defects such as hole cracking, whitishness or deformation after molding of each product hole can be avoided.

Referring to FIG. 4 and FIG. 5 , the molding method provided by the technical solution is further described in conjunction with the second embodiment.

First, the accessory substrate 20 of the standby type is provided. In this embodiment, the accessory substrate 20 is a circuit board accessory substrate that has been punched. The accessory substrate 20 is divided into a second product area 201 and a second non-product area 200, and the second product area 201 and the second non-product area 200 The boundary is the second contoured edge 202. The second molding edge 202 is sequentially connected to the second molding edge 202 by the first side line 211, the second side line 212, the third side line 213, and the fourth side line 217, and has a rectangular shape. The first edge 211 is parallel to the third edge 213 and is perpendicular to the second edge 212 and the fourth edge 217, respectively. In the embodiment, a second protruding structure 220 is protruded from the second non-product area 200 on the second side line 212. The second protruding structure 220 has a first protruding edge 214, a second protruding edge 215 and a third protruding edge 216. The second protruding edge 215 is parallel to the second edge 212 and perpendicular to the first protruding edge 214 and the third protruding edge 216, respectively. On the fourth edge 217, there is a curved edge 218 extending toward the second non-product region 200 and forming a third protruding junction. Structure 230. The second product area 201 of the accessory substrate 20 includes a plurality of accessory units 210 that are independent of one another.

A product hole 203 is formed in the second product area 201, and an auxiliary hole 204 is formed in the second non-product area 200 adjacent to the second forming side 202. The product hole 203 includes a first product hole 203a and a second product hole 203b.

The second protruding structure 220 has a first product hole 203a thereon. The center of the first product hole 203a has at least one distance from the second forming edge 202 that is smaller than the diameter of the first product hole 203a. In this embodiment, the distance from the first product hole 203a to the first protruding edge 214, the second protruding edge 215, and the third protruding edge 216 are both smaller than the diameter of the first product hole 203a. Three first auxiliary holes 204a are formed in the second non-product area 200 adjacent to the first product hole 203a. The line connecting the center of each of the first auxiliary holes 204a and the center of the first product hole 203a is perpendicular to the adjacent protruding line. The third protruding structure 230 has a semicircular shape, and the third protruding structure 230 has a second product hole 203b thereon. The center of the second product hole 203b is spaced apart from the curved edge 218 by a distance smaller than the diameter of the second product hole 203b. A second auxiliary hole 204b is formed in the second non-product area 200 adjacent to the second product hole 203b. The line connecting the center of the second auxiliary hole 204b and the center of the second product hole 203b is perpendicular to its adjacent curved side line 218. The diameter of the auxiliary hole 204 is greater than or equal to twice the first product hole 203a and the second product hole 203b adjacent thereto, and the center of the first product hole 203a and the second product hole 203b is perpendicular to the line of the center of the auxiliary hole 204. A molding edge between the product hole 203 and the second auxiliary hole 204. The minimum distance from the point on the circumference of the hole of the auxiliary hole 204 from the second forming edge 202 is the offset machining tolerance during molding. In order to avoid the defects in the shape of the product caused by the punching offset during the molding process.

In this embodiment, the auxiliary hole 204 of the second non-product area 200 is formed adjacent to the first product hole 203a, and the second product hole 203b is formed. Of course, the hole margin of the product hole 203 is small. At the diameter of the product aperture 203, a method of forming the auxiliary aperture 204 in the second non-product region 200 adjacent the product aperture 203 can be employed. The number and shape of the second protruding structure 220 of each of the accessory units 210 are indefinite. It needs to be one, two or more depending on the shape of the specific situation. It can also be a semicircular shape, a square shape or an irregular shape.

Next, the accessory substrate 20 formed in the above step is formed along the second molding side 202. A single accessory unit 210 is available.

Further, in the above two embodiments, the product hole 103 and the auxiliary hole 104 of the circuit board substrate 10 are formed in different punching processes, and the product hole 103 is formed earlier than the auxiliary hole 104. The product hole 203 of the board accessory substrate 20 and the auxiliary hole 204 are formed in the same process. In the actual production process, the formation of product holes and auxiliary holes is not limited. The product holes may be formed first or the auxiliary holes may be formed first, or may be formed in the same production process. Of course, the premise is to satisfy the actual process production. need. Especially when the substrate is a reinforcing material for the circuit board, forming the holes and the auxiliary holes 104 in the same process can reduce the production process. The shape of the auxiliary hole is not limited to the shape of a circular hole, but may be a hole shape, a square hole shape, or the like, and it is sufficient to transfer the force of the product hole to the auxiliary hole during molding.

Compared with the prior art, the present technical solution provides a molding method for drilling an auxiliary hole in a region of a product hole adjacent to a product area in a non-product area, the auxiliary hole having a diameter larger than a diameter of the product hole adjacent to the auxiliary hole. The auxiliary hole is used to transfer the force to the non-product area during molding to effectively improve the crack, whitening or deformation of the hole of the circuit board or its fitting in the vicinity of the molded side after molding.

In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above is only a preferred embodiment of the present invention, and those skilled in the art will be familiar with the present invention. Equivalent modifications or variations of the present invention in accordance with the spirit of the present invention are intended to be included in the scope of the following claims.

104‧‧‧Auxiliary hole

104a‧‧‧First auxiliary hole

104b‧‧‧Second auxiliary hole

104c‧‧‧ third auxiliary hole

Claims (7)

A molding method, the method comprising: providing a substrate having a product zone and a non-product zone, the intersection of the product zone and the non-product zone being defined as a forming edge, the product zone comprising at least one product unit, Each of the product units has a plurality of product apertures, at least one of the plurality of product apertures being adjacent to the profiled edge; adjacent to the at least one product aperture adjacent the profiled edge The non-product area forms at least one auxiliary hole having a diameter larger than a diameter of the product hole corresponding to the auxiliary hole; and performing a molding operation on the substrate along the molding edge to form a product unit. The molding method of claim 1, wherein a line connecting the center of the product hole and the center of the auxiliary hole corresponding to the product hole is perpendicular to a molding edge between the product hole and the auxiliary hole. The molding method of claim 1, wherein a distance between a center of the at least one product hole adjacent to the molding edge and the molding edge is smaller than a diameter of the corresponding product hole. The molding method of claim 3, wherein the molding edge comprises a plurality of edge lines, and at least one center of the product hole adjacent to the molding edge and one of the plurality of edge lines The distance is smaller than the diameter of the corresponding product hole, and the auxiliary hole is formed in a non-product area adjacent to the edge of the product hole by a distance smaller than the diameter of the corresponding product hole. The molding method of claim 3, wherein the molding edge comprises a plurality of edge lines, at least one of a center of the product hole adjacent to the molding edge and at least two of the plurality of edge lines The distance between the holes is smaller than the diameter of the corresponding product hole, and the auxiliary hole is formed in the non-product area adjacent to at least two edges of the diameter of the corresponding product hole. area. The molding method of claim 3, wherein the molding edge comprises a curved edge, the distance between the center of the at least one product hole adjacent to the molding edge and a segment of the curved edge Less than the diameter of the corresponding product aperture, the auxiliary aperture is formed in a non-product area adjacent to one of the arcuate edges. The molding method of claim 1, wherein the auxiliary hole has a diameter larger than twice the diameter of the product hole corresponding thereto.