CN102378492B - Each-layer rivet hole positioning structure of multilayer circuit board - Google Patents
Each-layer rivet hole positioning structure of multilayer circuit board Download PDFInfo
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- CN102378492B CN102378492B CN 201010258058 CN201010258058A CN102378492B CN 102378492 B CN102378492 B CN 102378492B CN 201010258058 CN201010258058 CN 201010258058 CN 201010258058 A CN201010258058 A CN 201010258058A CN 102378492 B CN102378492 B CN 102378492B
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- copper foil
- rivet hole
- circuit board
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Abstract
The invention discloses an each-layer rivet hole positioning structure of a multilayer circuit board. The structure is formed on the board edge on one surface of each layer of circuit board. The structure comprises a copper foil area which is covered on the board edge on one surface of a substrate of the each layer of circuit board and has the area greater than that of a rivet hole; concentric circular space and annular space are formed in the copper foil area by opening, wherein the annular space is positioned on the periphery of the circular space; the copper foil area between the circular area and the annular space forms an annular copper foil layer; the outside diameter of the annular copper foil layer is the same as the hole diameter of the rivet hole; and in actual manufacturing, the rivet hole positioning structure is molded on a copper foil layer on the surface of the substrate with a circuit layer integrally by etching, namely a conventional etching process in the industry. The copper foil area before molded by etching is one part in the copper foil layer, to be etched, on the surface of the substrate; the substrate, below the annular space and the circular space, after molding by etching is exposed; and the material of the substrate is commonly prepreg (called PP for short).
Description
Technical field
The present invention relates to each interlayer positioning field of multilayer circuit board, especially a kind of each layer rivet hole location structure of multilayer circuit board.
Background technology
Multi-layer sheet is 6 on each laminate limit or 8 rivet holes (according to the plate size) contraposition riveted successively to be formed by rivet in the PCB technology; This rivet hole is that diameter is the circle center hole of 3.175mm, come outbreak out with diameter 3.175mm drill point again, existing rivet hole location structure as shown in Figure 1, after the boring intuitively the identification rivet hole whether bore partially, if bore inclined to one side, can't see at that time, and had only and know just that according to X-ARY heavy industry is just pretty troublesome more at that time after riveted is finished by the time; As heavy industry not or be disinclined to heavy industry, layer inclined to one side risk then arranged and cause scrapping.
Summary of the invention
In order to overcome above-mentioned defective, the invention provides a kind of each layer rivet hole location structure of multilayer circuit board, whether the identification rivet hole bores partially intuitively, prevents that layer is partially.
The present invention for the technical scheme that solves its technical problem and adopt is:
Each of a kind of multilayer circuit board layer rivet hole location structure, be formed on the edges of boards of each layer wiring board one side, comprise that the area of substrate one panel edges that is covered in each layer wiring board is greater than the Copper Foil zone of rivet hole, the annular space that this Copper Foil zone inner opening is formed with the circular space of concentric and is positioned at the circular space periphery, Copper Foil zone between this circular space and the annular space forms annular copper foil layer, wherein, distance between the inner and outer rings limit of described annular space is 5mil, the overall diameter of this annular copper foil layer is identical with the aperture of rivet hole, is 3.175mm.Being molded in the actual fabrication of rivet hole location structure is and the etching moulding on the copper foil layer of substrate surface of line layer one, i.e. conventional said etch process in the industry, Copper Foil zone before the etching moulding is the part in the substrate surface copper foil layer to be etched, above-mentioned annular space after the etching moulding and the substrate under the circular space expose, substrate material is generally mylar (prepreg is called for short PP).
As a further improvement on the present invention, be formed with six described rivet hole location structures on the edges of boards of described each layer wiring board one side.
As a further improvement on the present invention, be formed with eight described rivet hole location structures on the edges of boards of described each layer wiring board one side.
The invention has the beneficial effects as follows: after adopting rivet hole location structure of the present invention, during boring, still use the drill point of 3.175mm, bore the annular space of a remaining circle 5mil, whether the identification rivet hole bores partially intuitively, inclined to one side feelings row occurs boring and can proofread and correct the brill target drone immediately, prevents that layer partially.
Description of drawings
The prior art structural representation that Fig. 1 contrasts for the present invention;
Fig. 2 is structural representation of the present invention.
Embodiment
Embodiment: each of a kind of multilayer circuit board layer rivet hole location structure, be formed on the edges of boards of each layer wiring board one side, comprise that the area of substrate one panel edges that is covered in each layer wiring board is greater than the Copper Foil zone 1 of rivet hole, the annular space 12 that this Copper Foil zone 1 inner opening is formed with the circular space 11 of concentric and is positioned at the circular space periphery, Copper Foil zone 1 between this circular space 11 and the annular space 12 forms annular copper foil layer 10, wherein, in the described annular space 12, distance between the outer annular edge is 5mil, the overall diameter of this annular copper foil layer 10 is identical with the aperture of rivet hole, is 3.175mm.Being molded in the actual fabrication of rivet hole location structure is and the etching moulding on the copper foil layer of substrate surface of line layer one, i.e. conventional said etch process in the industry, Copper Foil zone 1 before the etching moulding is the part in the substrate surface copper foil layer to be etched, above-mentioned annular space after the etching moulding and the substrate under the circular space expose, substrate material is generally mylar (prepreg is called for short PP).
Be formed with six described rivet hole location structures on the edges of boards of described each layer wiring board one side.
Be formed with eight described rivet hole location structures on the edges of boards of described each layer wiring board one side.
Claims (3)
1. each layer rivet hole location structure of a multilayer circuit board, be formed on the edges of boards of each layer wiring board one side, it is characterized in that: comprise that the area of substrate one panel edges that is covered in each layer wiring board is greater than the Copper Foil zone (1) of rivet hole, this Copper Foil zone (1) inner opening is formed with the circular space (11) of concentric and is positioned at the annular space (12) of circular space periphery, and the Copper Foil zone (1) between this circular space (11) and the annular space (12) forms annular copper foil layer (10); Wherein, the distance between the inner and outer rings limit of described annular space (12) is 5mil, and the overall diameter of this annular copper foil layer (10) is identical with the aperture of rivet hole, is 3.175mm.
2. each of multilayer circuit board according to claim 1 layer rivet hole location structure is characterized in that: be formed with six described rivet hole location structures on the edges of boards of described each layer wiring board one side.
3. each of multilayer circuit board according to claim 1 layer rivet hole location structure is characterized in that: be formed with eight described rivet hole location structures on the edges of boards of described each layer wiring board one side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010258058 CN102378492B (en) | 2010-08-19 | 2010-08-19 | Each-layer rivet hole positioning structure of multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010258058 CN102378492B (en) | 2010-08-19 | 2010-08-19 | Each-layer rivet hole positioning structure of multilayer circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102378492A CN102378492A (en) | 2012-03-14 |
| CN102378492B true CN102378492B (en) | 2013-07-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010258058 Active CN102378492B (en) | 2010-08-19 | 2010-08-19 | Each-layer rivet hole positioning structure of multilayer circuit board |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110708874B (en) * | 2019-09-24 | 2021-06-04 | 珠海崇达电路技术有限公司 | Method for rapidly judging hole deviation of OPE (optical connection edge) of HDI (high Density interconnect) plate |
| CN111698847B (en) * | 2020-06-29 | 2022-07-29 | 四川海英电子科技有限公司 | Method for accurately positioning layers of high-frequency circuit board |
| CN112867232A (en) * | 2020-12-31 | 2021-05-28 | 鹤山市世安电子科技有限公司 | High-density integrated circuit board composite target and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101203099A (en) * | 2006-12-13 | 2008-06-18 | 英业达股份有限公司 | Locating component of heat conduction plate |
| CN101521688A (en) * | 2009-03-24 | 2009-09-02 | 深圳新中桥通信有限公司 | Novel sliding mechanism for slide phone |
| CN101778536A (en) * | 2009-01-09 | 2010-07-14 | 深圳玛斯兰电路科技实业发展有限公司 | Process for controlling diameter of integrated positioning hole of inner cord board for printed circuit board |
-
2010
- 2010-08-19 CN CN 201010258058 patent/CN102378492B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101203099A (en) * | 2006-12-13 | 2008-06-18 | 英业达股份有限公司 | Locating component of heat conduction plate |
| CN101778536A (en) * | 2009-01-09 | 2010-07-14 | 深圳玛斯兰电路科技实业发展有限公司 | Process for controlling diameter of integrated positioning hole of inner cord board for printed circuit board |
| CN101521688A (en) * | 2009-03-24 | 2009-09-02 | 深圳新中桥通信有限公司 | Novel sliding mechanism for slide phone |
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| Publication number | Publication date |
|---|---|
| CN102378492A (en) | 2012-03-14 |
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