CN101778536A - Process for controlling diameter of integrated positioning hole of inner cord board for printed circuit board - Google Patents
Process for controlling diameter of integrated positioning hole of inner cord board for printed circuit board Download PDFInfo
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- CN101778536A CN101778536A CN200910104879A CN200910104879A CN101778536A CN 101778536 A CN101778536 A CN 101778536A CN 200910104879 A CN200910104879 A CN 200910104879A CN 200910104879 A CN200910104879 A CN 200910104879A CN 101778536 A CN101778536 A CN 101778536A
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Abstract
The invention relates to a process for controlling the diameter of an integrated positioning hole of an inner cord board for a printed circuit board, which belongs to the technical field of design of the diameter of the integrated positioning hole of the inner cord board for the printed circuit board. The process can solve the problems that when a thin core board is punched, the diameter of the hole is increased or the haloing of a hole ring is generated, resulting in higher deviation proportion between walkthrough riveting layers. The design method of the invention can effectively improve the impact of the PP problem of the hole edge generated when the inner thin core board is punched on the deviation between the riveting layers, thereby improving the process capability, and the production quality and productivity of the printed circuit board.
Description
[technical field]
The present invention is for improving the inclined to one side a kind of technology of inner central layer of printed circuit board walkthrough riveted layer, specific to a kind of technology of diameter of integrated positioning hole of inner cord board for printed circuit board design.
[background technology]
Printed substrate is towards high-rise, the direction fast development of fine rule road at present, and along with development and the monolateral ring of printed circuit board (PCB) high, multilayer circuit board encircle the more and more littler of design, the thing followed is more and more higher to the requirement of the inclined to one side management and control of layer printed circuit board.Known inner central layer of printed circuit board edges of boards diameter of integrated positioning hole film conventional design is 3.175mm, and the problem that this design is mainly deposited at present is:
1, core material edges of boards integrated positioning hole is if adopt CCD single hole locate mode to carry out punching: because internal layer generally all adopts the negative film technological process of production at present, therefore after exposure, development, etching, the aperture becomes big 0.05mm even bigger to I haven't seen you for ages.Particularly thin central layer is when chewing boring with the brill of diameter 3.175mm, the following brill impulsive force that brill is chewed can make the PP breakage of limit, hole, thereby cause institute's boring aperture irregular or become big, when the core material walkthrough is used closing-up, because institute's boring aperture is bigger than rivet diameter (3.175mm), the rivet stationarity is bad in the cover nail process, causes aligning accuracy not high, very easily produces the interlayer skew;
2, core material edges of boards integrated positioning hole is if adopt OPE porous one-time positioning mode to carry out punching: owing to be subjected to the influence of substrate size compensation and sheet material harmomegathus, the position in the actual institute punching aperture home position meeting center of circle, aperture, off-design hole, thus orifice ring white edge (PP) problem produced.When substrate size compensation and sheet material harmomegathus were big more, the orifice ring white edge will be big more.Because white edge is PP, and the more crisp easy jackknifing of PP, so core material is when walkthrough riveted cover nail, and circular hole is easily pulled open, and causes aligning accuracy not high, and the interlayer shift ratio is higher;
The aperture of above-mentioned conventional design 3.175mm core material edges of boards integrated positioning hole, in the long-term production process, find, particularly for the multi-layer sheet walkthrough of thin plate and many PP combining structures after the X-ray machine inspection, all there is the core material skew of different proportion, when particularly adopting first kind of punching mode, riveted interlayer shift ratio can reach 30%, has a strong impact on the multiple-plate production quality and the manufacturing schedule of thin plate and many PP combining structures, and has restricted the lifting of manufacturing process ability.
[summary of the invention]
The technical problem to be solved in the present invention is: the design of the core material edges of boards diameter of integrated positioning hole film is designed to diameter 3.175mm routinely, the aperture can become big or produce the orifice ring white edge when particularly approaching the central layer punching, thereby causes the inclined to one side ratio problem of higher of walkthrough riveted layer.
At this problem and in conjunction with practical condition, the present invention mainly when core material CAM data designs, the design of change edges of boards diameter of integrated positioning hole improve the aperture become big or the orifice ring white edge to the inclined to one side influence of walkthrough riveted layer.
It mainly acts on this technology and being: after the design of change edges of boards diameter of integrated positioning hole, when core material is finished behind the internal layer punching, no matter be that employing CCD single hole locate mode is carried out punching or adopted OPE porous one-time positioning mode to carry out punching, the aperture does not have irregular and becomes big phenomenon and orifice ring white edge (PP) phenomenon during the OPE punching, thereby improve this type of problem to the inclined to one side influence of walkthrough riveted layer, can effectively reduce 30～50% of the inclined to one side ratio of the overall layer of riveted.
[embodiment]
Multi-layer sheet internal layer machining process route is as follows:
Material → pre-treatment → internal layer D/F or sensitization oil → development/etching/move back film → AOI → black/brown oxidation → walkthrough (fusion, rivet) → row's plate → pressing plate → brill location hole → pressing plate moulding → outer layer process left by substrate.
The present invention relates generally to the design to core material edges of boards diameter of integrated positioning hole, the punching of core material edges of boards integrated positioning hole and core material walkthrough riveted.Carry out the thin central layer of internal layer of punching one by one at adopting CCD single hole locate mode, we are when design core material edges of boards integrated positioning aperture, according to the processing procedure ability corresponding film edges of boards diameter of integrated positioning hole is dwindled 0.05mm or 0.075mm design, the 3.175mm that is about to conventional design does not have the no copper aperture that the change of copper aperture is designed to 3.125mm or 3.10mm.Target identification when design both can guarantee the CCD punching like this, can not cause the aperture irregular big in the time of can guaranteeing to hole again because of limit, hole PP with the aperture change, this be because: have and become big though core material is finished behind the internal layer aperture, but according to the actual aperture that becomes after big of processing procedure ability can not surpass bore chew directly through 3.175mm, can not cause the irregular and big phenomenon of change in aperture when therefore holing because of unnecessary limit, hole PP, thereby it is irregular and become big phenomenon to the inclined to one side influence of walkthrough riveted layer to improve the aperture, reduce the overall layer of walkthrough riveted partially ratio about 50%; Carry out the thin central layer of multilayer internal layer of punching at adopting OPE porous one-time positioning mode, we are when design core material edges of boards integrated positioning aperture, corresponding film edges of boards diameter of integrated positioning hole can be carried out the design of full copper or dwindle design, the rivet hole figure that is about to the OPE punching out does not have the copper aperture by the 3.175mm of conventional design, and all to be designed to diameter be staying copper coin shape copper billet or the aperture being dwindled design (dwindle value necessary 〉=substrate size offset) of 8MM.After the core material internal layer completes like this, even be subjected to the influence of substrate size compensation and substrate harmomegathus, overall offset can take place in institute punching aperture center position, since the aperture center deviant generally can≤the substrate size offset, so institute's punching can not produce orifice ring white edge (PP), thereby can improve punching orifice ring white edge to the inclined to one side influence of walkthrough riveted layer, can effectively reduce 30～50% of the inclined to one side ratio of the overall layer of walkthrough riveted.
Can effectively improve limit, the hole PP problem that produces because of the thin central layer punching of internal layer to the inclined to one side influence of walkthrough riveted layer with method for designing of the present invention, thereby promote the manufacturing process ability, improved the production quality and the production efficiency of printed circuit board (PCB).
Claims (2)
1. a kind of diameter of integrated positioning hole of inner cord board for printed circuit board control of the present invention technology is characterized in that: after the design of change edges of boards diameter of integrated positioning hole, when core material is finished behind the internal layer punching, no matter be to adopt CCD single hole locate mode to carry out punching or adopt OPE porous one-time positioning mode to carry out punching, the aperture does not have irregular and orifice ring white edge (PP) phenomenon when becoming big phenomenon and OPE punching.
2. a kind of diameter of integrated positioning hole of inner cord board for printed circuit board control technology according to claim 1 is characterized in that: to the design of core material edges of boards diameter of integrated positioning hole, and the punching of core material edges of boards integrated positioning hole and core material walkthrough riveted.Carry out the thin central layer of internal layer of punching one by one at adopting CCD single hole locate mode, we are when design core material edges of boards integrated positioning aperture, according to the processing procedure ability corresponding film edges of boards diameter of integrated positioning hole is dwindled 0.05mm or 0.075mm design, the 3.175mm that is about to conventional design does not have the no copper aperture that the change of copper aperture is designed to 3.125mm or 3.10mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910104879A CN101778536A (en) | 2009-01-09 | 2009-01-09 | Process for controlling diameter of integrated positioning hole of inner cord board for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910104879A CN101778536A (en) | 2009-01-09 | 2009-01-09 | Process for controlling diameter of integrated positioning hole of inner cord board for printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101778536A true CN101778536A (en) | 2010-07-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910104879A Pending CN101778536A (en) | 2009-01-09 | 2009-01-09 | Process for controlling diameter of integrated positioning hole of inner cord board for printed circuit board |
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| CN (1) | CN101778536A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102378492A (en) * | 2010-08-19 | 2012-03-14 | 竞陆电子(昆山)有限公司 | Each-layer rivet hole positioning structure of multilayer circuit board |
| CN102497738A (en) * | 2011-12-19 | 2012-06-13 | 景旺电子（深圳）有限公司 | Method for manufacturing inner core plate by using outer semi-automatic exposure machine |
| CN103096645A (en) * | 2011-10-27 | 2013-05-08 | 深南电路有限公司 | Lamination positioning method of multilayer circuit board |
| CN103220889A (en) * | 2013-04-15 | 2013-07-24 | 深圳崇达多层线路板有限公司 | Method for manufacturing oversize printed circuit board (PCB) back plate inner layer |
| CN104493889A (en) * | 2014-12-22 | 2015-04-08 | 广州兴森快捷电路科技有限公司 | Processing method for thin encapsulation substrate positioning hole |
| CN109141275A (en) * | 2017-06-15 | 2019-01-04 | 欣兴电子股份有限公司 | Processing method and its machine table and system of application |
| CN109757028A (en) * | 2019-02-26 | 2019-05-14 | 苏州维信电子有限公司 | A kind of Multilayer Structure and preparation method thereof convenient for contraposition |
| CN112533356A (en) * | 2020-11-12 | 2021-03-19 | 苏州浪潮智能科技有限公司 | Circuit board with multipurpose fixing hole and preparation method thereof |
-
2009
- 2009-01-09 CN CN200910104879A patent/CN101778536A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102378492A (en) * | 2010-08-19 | 2012-03-14 | 竞陆电子(昆山)有限公司 | Each-layer rivet hole positioning structure of multilayer circuit board |
| CN102378492B (en) * | 2010-08-19 | 2013-07-10 | 竞陆电子(昆山)有限公司 | Each-layer rivet hole positioning structure of multilayer circuit board |
| CN103096645A (en) * | 2011-10-27 | 2013-05-08 | 深南电路有限公司 | Lamination positioning method of multilayer circuit board |
| CN102497738A (en) * | 2011-12-19 | 2012-06-13 | 景旺电子（深圳）有限公司 | Method for manufacturing inner core plate by using outer semi-automatic exposure machine |
| CN102497738B (en) * | 2011-12-19 | 2016-03-30 | 深圳市景旺电子股份有限公司 | A kind of method applying outer semi-automatic exposure machine making core material |
| CN103220889A (en) * | 2013-04-15 | 2013-07-24 | 深圳崇达多层线路板有限公司 | Method for manufacturing oversize printed circuit board (PCB) back plate inner layer |
| CN103220889B (en) * | 2013-04-15 | 2016-01-20 | 深圳崇达多层线路板有限公司 | Layer manufacturing method thereof in a kind of oversize PCB backboard |
| CN104493889A (en) * | 2014-12-22 | 2015-04-08 | 广州兴森快捷电路科技有限公司 | Processing method for thin encapsulation substrate positioning hole |
| CN109141275A (en) * | 2017-06-15 | 2019-01-04 | 欣兴电子股份有限公司 | Processing method and its machine table and system of application |
| CN109757028A (en) * | 2019-02-26 | 2019-05-14 | 苏州维信电子有限公司 | A kind of Multilayer Structure and preparation method thereof convenient for contraposition |
| CN112533356A (en) * | 2020-11-12 | 2021-03-19 | 苏州浪潮智能科技有限公司 | Circuit board with multipurpose fixing hole and preparation method thereof |
| CN112533356B (en) * | 2020-11-12 | 2022-05-06 | 苏州浪潮智能科技有限公司 | Circuit board with multipurpose fixing hole and preparation method thereof |
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Open date: 20100714 |