CN105792521A - PCB pad compensation design technology and application thereof - Google Patents
PCB pad compensation design technology and application thereof Download PDFInfo
- Publication number
- CN105792521A CN105792521A CN201610177167.4A CN201610177167A CN105792521A CN 105792521 A CN105792521 A CN 105792521A CN 201610177167 A CN201610177167 A CN 201610177167A CN 105792521 A CN105792521 A CN 105792521A
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- CN
- China
- Prior art keywords
- design
- circuit
- cam
- solder mask
- pad
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
Abstract
The invention relates to a PCB pad compensation design technology and application thereof, and belongs to the technical field of PCB manufacture. In PCB pad compensation design technology, the line width of a CAM design circuit is greater than that of an original design drawing, the diameter of a solder mask window of CAM design is greater than that of the original design drawing, and a solder mask negative image of CAM design compensates a line-solder mask overlap portion beyond the pad range. Patterns of solder mask windows in a solder mask negative are compensated in design, the shapes of pads formed finally are relatively unified, problems as incomplete soldering and short circuit during tinning can be avoided, and the yield rate of production is improved.
Description
Technical field
The present invention relates to printed circuit board (PCB) manufacturing technology field, particularly to one avoid pad rosin joint,
The pcb board pad Compensation Design technique of short circuit and application thereof.
Background technology
Along with the epoch develop rapidly, electric consumers popularity rate is more and more higher, the electronics that people pursue
Also there is change with rapid changepl. never-ending changes and improvements in product, has welcome opportunities and challenges also to pcb board factory.Present
Electronic product volume is little, lightweight, more and more thinner.The process capability of pcb board factory is brought test,
Anti-welding is one of processing procedure important in printed substrate.Anti-welding is the part by needing welding on wiring board
Hole and part pad expose, and the circuit after circuit board etching and copper face are all covered.At downstream processing procedure
During assembling, numerous parts to be installed, such as resistance, electric capacity, inductance, diode, triode, multitube
The chip etc. of pin, so the pad size management and control to these parts is particularly important.
Under normal circumstances, client is provided design drawing is as it is shown in fig. 7, circuit 41 width on drawing
Consistent with pad 42 diameter with solder mask window (mark) diameter.Yet with circuit 41 by layers of copper
Obtaining according to the etching of circuit egative film, solder mask window is obtained according to solder prevention bottom plate corrosion by welding resisting layer 5, institute
Error is there is with being difficult to avoid that with both figures；In addition after circuit etching, line pad can diminish, anti-
Weldering is windowed after corroding and also can be diminished, so traditional handicraft CAM is when making anti-welding, solder mask window 51 is straight
Footpath and circuit 41 width all can expand, and solder mask window 51 will be exaggerated with the overlapping dimension of circuit 41.
As shown in Figure 8, pad 42 actual present shape be inside line boundary 41a with solder mask window border
The shape of lap inside 51a, this results in result is that the finished form of pad 42 is irregular, chi
Very little not of uniform size, then ring pad 42 and eat tin amount, easily cause the problem such as rosin joint, pad short circuit.
Owing to always having substantial amounts of pad 42, the situation that pad 42 moulding is little and mutual on every piece of pcb board
All differing, it is extremely low that the artificial qualification rate recognizing each pad 42 is also performed to post-process obvious feasibility,
Seriously constrain the raising of product quality.
Therefore, it is necessary to provide a kind of new method to solve the problems referred to above.
Summary of the invention
Present invention is primarily targeted at and a kind of pcb board pad benefit avoiding pad rosin joint, short circuit is provided
Repay design technology and application thereof.
The present invention is achieved through the following technical solutions above-mentioned purpose: a kind of pcb board pad Compensation Design work
Skill, including negative film making step, i.e. carries out the CAM of circuit egative film and solder prevention bottom plate according to original design figure
Design, wherein the live width of CAM designed lines is wider than original design figure, the diameter of CAM design solder mask window
Bigger than original design figure, the solder prevention bottom plate image of CAM design simultaneously is to more than the circuit of pad scope-anti-
Weldering lap compensates design.
Concrete, the live width 10-20% bigger than the live width on original design figure of described CAM designed lines.
Concrete, the diameter of described CAM design solder mask window is bigger than the diameter of windowing on original design figure
20-30%.
A kind of application of pcb board pad Compensation Design technique, step includes successively:
1. negative film making: carry out the CAM design of circuit egative film and solder prevention bottom plate according to original design figure；
2. plating: plate copper film at circuit board surface；
3. circuit transfer: coat exposure ink on circuit boards, circuit film image is transferred to copper facing
Circuit board on, exposure, remove unhardened exposure ink；
4. circuit etching: etched by the copper film on circuit board and become circuit, then removes exposure ink；
5. solder mask window: plate last layer welding resisting layer again at circuit board outer surface, turns solder prevention bottom plate image
Print on circuit board, exposure, remove unhardened welding resisting layer, the circuit pack exposed of windowing from welding resisting layer
I.e. form pad.
Concrete, also include word step after described solder mask window step, for increasing outside welding resisting layer
Add letter symbol.
Using technique scheme, technical solution of the present invention provides the benefit that:
The present invention, by the solder mask window figure on solder prevention bottom plate is compensated design, makes to eventually form
Bond pad shapes more unified, it is to avoid the problem such as rosin joint, short circuit during upper tin, improve production yield.
Accompanying drawing explanation
Fig. 1 is the flow chart of this process example 1；
Fig. 2 is the circuit board localized variation schematic diagram boring pilot hole step；
Fig. 3 is the circuit board localized variation schematic diagram boring disconnected opening step；
Fig. 4 is the circuit board localized variation schematic diagram of the flat step of milling；
Fig. 5 is the flow chart of this process example 2；
Fig. 6 is the operation chart of processing procedure of holing in embodiment 3；
Fig. 7 is Customer design partial schematic diagram；
Fig. 8 is that prior art CAM egative film designs partial schematic diagram；
Fig. 9 is that this technique CAM egative film designs partial schematic diagram.
In figure, numeral represents:
1-circuit board, 11-removes region, and 12-retains region, 1a-border；
2a-plated-through-hole, 2b-half bore；
3a-pilot hole, 3b-disconnects hole；
4-copper film, 41-circuit, 41a-line boundary, 42-pad；
5-welding resisting layer, 51-windows, and 51a-windows border；
61,62-spur location；
71-plated-through-hole drill bit, 72-bullport drill bit.
Detailed description of the invention
Below in conjunction with specific embodiment, the present invention is described in further detail.
Embodiment 1
As it is shown in figure 1, a kind of pcb board pad Compensation Design technique, step includes successively:
1. negative film making: carry out the CAM design of circuit egative film and solder prevention bottom plate according to original design figure, its
The live width of middle CAM designed lines is wider by 10% than original design figure, and the diameter ratio of CAM design solder mask window is original
Design drawing big 20%, the solder prevention bottom plate image of CAM design simultaneously is to more than the circuit of pad 42 scope-anti-welding
Lap compensates design, such as Fig. 8；
2. plated-through-hole 2a is bored: remove at circuit board and get out on the 1a of border between region 11 and reservation region 12
Plated-through-hole 2a of a diameter of D；
3. bore pilot hole 3a: get out in region 12 removed by circuit board 1 with plated-through-hole 2a phase from pilot hole
3a, pilot hole 3a diameter D1=0.7D, such as Fig. 2；
4. plating: plate copper film 4 at circuit board surface；
5. circuit transfer: coat exposure ink on circuit boards, circuit film image is transferred to copper facing
Circuit board on, exposure, remove unhardened exposure ink；
6. bore disconnect hole 3b: be expanded on the basis of pilot hole 3a one intersect with plated-through-hole 2a break
Perforate 3b, disconnects hole 3b tangent with border 1a, disconnects hole 3b diameter D2=D+10mil, such as Fig. 3；
7. circuit etching 41: the copper film 4 on circuit board 1 is etched and becomes circuit 41, wherein plated-through-hole 2a
Edge is covered by copper film 4, then removes exposure ink；
8. solder mask window: plate last layer welding resisting layer 5 again at circuit board 1 outer surface, by solder prevention bottom plate image
It is transferred on circuit board, exposure, removes unhardened welding resisting layer 5, window 51 lines exposed from welding resisting layer 5
Road 41 part i.e. forms pad 42；
9. word: increase letter symbol outside welding resisting layer 5；
10. milling is put down: will remove region 11 mill off along border 1a, plated-through-hole 2a is shaped to half bore 2b,
Such as Fig. 4.
As it is shown in figure 9, in order to make the big circles such as pad 42 presents, due to windowing of actual welding resisting layer 5
51 edges have some gradients, so the figure of transfer needs slightly enlarged-area, but in order to prevent weldering
Dish 42 size aberration problems, windowing on welding resisting layer 5 51 will not all present circle, and can be according to circuit
The shape of 41 can generate some compensating basins (mark) and then carry out the shape of solder mask window border 51a
Compensate, solder mask window step when, so just can reduce the removal amount to welding resisting layer 5, formed and do not advise
Then window border 51a figure, but circuit 41 exposed portion can be made closer to same circle.The most last
Pad 42 shape formed is the most unified, the problem such as rosin joint, short circuit when being thus avoided that tin,
Improve production yield.
As shown in Figure 4, disconnect hole 3b and can eliminate the copper product of half bore 2b side in advance, disconnect hole 3b boring
Have the position easily producing burr at two during flat with milling, wherein spur location 61 is at one
Except in region 11, even if not having other steps also can be eliminated by the flat step of milling；And burr position at another
Even if putting 62 to occur in that burr, after circuit etching 41 step, the reagent that also can be corroded is bitten off.
So while do not increase number of process steps, but Burr Problem have also been obtained well solution, improves
The qualification rate of circuit boring；About half is reduced again in machining path simultaneously, serves saving technique step
Suddenly the effect of production efficiency, is improved.
Form, because pilot hole 3a makes disconnection as it is shown on figure 3, disconnect hole 3b by pilot hole 3a expansion
3b region, hole material has bored disconnected, thus again reaming when, drill bit is mainly by side turning
Non-top pierces, and the most existing plated-through-hole 2a structure would not cause material shifts to deform, more preferable
Achieve deburring effect, improve the qualification rate of circuit boring.
Embodiment 2
1. negative film making: carry out the CAM design of circuit egative film and solder prevention bottom plate according to original design figure, its
The live width of middle CAM designed lines is wider by 20% than original design figure, and the diameter ratio of CAM design solder mask window is original
Design drawing big 30%, the solder prevention bottom plate image of CAM design simultaneously is to more than the circuit of pad 42 scope-anti-welding
Lap compensates design, such as Fig. 6；
2. boring: remove at circuit board and get out a diameter of D on the 1a of border between region 11 and reservation region 12
Plated-through-hole 2a, get out in region 12 removed by circuit board 1 simultaneously with plated-through-hole 2a phase from pilot hole
3a, pilot hole 3a diameter D1=0.7D, such as Fig. 2；
3. plating: plate copper film 4 at circuit board surface；
4. circuit transfer: coat exposure ink on circuit boards, circuit film image is transferred to copper facing
Circuit board on, exposure, remove unhardened exposure ink；
5. bore disconnect hole 3b: be expanded on the basis of pilot hole 3a one intersect with plated-through-hole 2a break
Perforate 3b, disconnects hole 3b tangent with border 1a, disconnects hole 3b diameter D2=D+10mil, such as Fig. 3；
6. circuit etching 41: the copper film 4 on circuit board 1 is etched and becomes circuit 41, wherein plated-through-hole 2a
Edge is covered by copper film 4, then removes exposure ink；
7. solder mask window: plate last layer welding resisting layer 5 again at circuit board 1 outer surface, by solder prevention bottom plate image
It is transferred on circuit board, exposure, removes unhardened welding resisting layer 5, window 51 lines exposed from welding resisting layer 5
Road 41 part i.e. forms pad 42；
8. word: increase letter symbol outside welding resisting layer 5；
9. milling is put down: will remove region 11 mill off along border 1a, plated-through-hole 2a is shaped to half bore 2b,
Such as Fig. 4.
As it is shown in figure 5, be with the difference of embodiment 1: bore plated-through-hole 2a step and brill pilot hole
3a step merges into drill process.So pcb board procedure of processing is reduced again, and operating efficiency carries further
High.
Embodiment 3
As shown in Figure 6, the difference with embodiment 2 is: the drill bit 71 boring plated-through-hole drills through circuit
The drill bit 72 boring pilot hole after plate 1 drills through circuit board 1 again.Because plated-through-hole 2a is actually needed reservation
Hole, and pilot hole 3a is the hole that can eliminate, so plated-through-hole 2a position accuracy demand is higher, needs elder generation
One step gets out.After plated-through-hole drill bit 71 drills through circuit board 1 one step ahead, circuit board 1 can carry out stress to be released
Put and reply smooth, the when of so boring pilot hole 3a circuit board 1 will not because of while stress too much collapse
Disconnected.
Above-described is only some embodiments of the present invention.For those of ordinary skill in the art
For, without departing from the concept of the premise of the invention, it is also possible to make some deformation and improvement,
These broadly fall into protection scope of the present invention.
Claims (5)
1. a pcb board pad Compensation Design technique, it is characterised in that: include negative film making step,
The CAM design of circuit egative film and solder prevention bottom plate, wherein CAM designed lines is i.e. carried out according to original design figure
Live width wider than original design figure, the diameter of CAM design solder mask window is bigger than original design figure, CAM simultaneously
The solder prevention bottom plate image of design compensates design to more than the circuit of pad scope-anti-welding lap.
Pcb board pad Compensation Design technique the most according to claim 1, it is characterised in that: described
The live width of CAM designed lines 10-20% bigger than the live width on original design figure.
Pcb board pad Compensation Design technique the most according to claim 2, it is characterised in that: described
The diameter of CAM design solder mask window is than the big 20-30% of diameter of windowing on original design figure.
4. about an application for pcb board pad Compensation Design technique, its feature described in claim 1-3
It is that step includes successively:
1. negative film making: carry out the CAM design of circuit egative film and solder prevention bottom plate according to original design figure；
2. plating: plate copper film at circuit board surface；
3. circuit transfer: coat exposure ink on circuit boards, circuit film image is transferred to copper facing
Circuit board on, exposure, remove unhardened exposure ink；
4. circuit etching: etched by the copper film on circuit board and become circuit, then removes exposure ink；
5. solder mask window: plate last layer welding resisting layer again at circuit board outer surface, turns solder prevention bottom plate image
Print on circuit board, exposure, remove unhardened welding resisting layer, the circuit pack exposed of windowing from welding resisting layer
I.e. form pad.
The application of pcb board pad Compensation Design technique the most according to claim 4, its feature exists
In: also include word step after described solder mask window step, for increasing Chinese character outside welding resisting layer
Number.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610177167.4A CN105792521B (en) | 2016-03-25 | 2016-03-25 | Pcb board pad Compensation Design technique and its application |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610177167.4A CN105792521B (en) | 2016-03-25 | 2016-03-25 | Pcb board pad Compensation Design technique and its application |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105792521A true CN105792521A (en) | 2016-07-20 |
| CN105792521B CN105792521B (en) | 2018-12-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610177167.4A Active CN105792521B (en) | 2016-03-25 | 2016-03-25 | Pcb board pad Compensation Design technique and its application |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106255325A (en) * | 2016-08-24 | 2016-12-21 | 山东蓝色电子科技有限公司 | A kind of special-shaped compensation method of the circuit pads considering etching factor |
| CN106455325A (en) * | 2016-09-27 | 2017-02-22 | 惠州市金百泽电路科技有限公司 | Manufacturing method of 77Ghz high-precision radio radar printed circuit board |
| CN106658978A (en) * | 2016-10-28 | 2017-05-10 | 奥士康精密电路（惠州）有限公司 | Pad dimension consistency improvement process |
| CN106973514A (en) * | 2017-03-10 | 2017-07-21 | 江门崇达电路技术有限公司 | PAD preparation method in a kind of PCB |
| CN107660068A (en) * | 2016-07-25 | 2018-02-02 | 北大方正集团有限公司 | Pad design structure and design method |
| CN114245575A (en) * | 2021-11-16 | 2022-03-25 | 龙南骏亚电子科技有限公司 | Design method of PCB resistance welding zigzag circuit board |
| CN114786344A (en) * | 2022-05-26 | 2022-07-22 | 江苏博敏电子有限公司 | Design method for MiniLED packaging bonding pad |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104317998B (en) * | 2014-10-17 | 2018-11-09 | 深圳市百能信息技术有限公司 | A kind of method and apparatus of the manufacture compensation of the parameter of Gerber files |
| CN105430933A (en) * | 2015-12-22 | 2016-03-23 | 江苏博敏电子有限公司 | Method for treating defects of half solder mask bridge in solder mask production process |
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- 2016-03-25 CN CN201610177167.4A patent/CN105792521B/en active Active
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107660068A (en) * | 2016-07-25 | 2018-02-02 | 北大方正集团有限公司 | Pad design structure and design method |
| CN107660068B (en) * | 2016-07-25 | 2020-07-14 | 北大方正集团有限公司 | Pad design structure and design method |
| CN106255325A (en) * | 2016-08-24 | 2016-12-21 | 山东蓝色电子科技有限公司 | A kind of special-shaped compensation method of the circuit pads considering etching factor |
| CN106455325A (en) * | 2016-09-27 | 2017-02-22 | 惠州市金百泽电路科技有限公司 | Manufacturing method of 77Ghz high-precision radio radar printed circuit board |
| CN106455325B (en) * | 2016-09-27 | 2019-02-01 | 惠州市金百泽电路科技有限公司 | A kind of production method of 77Ghz high-precision radio frequency radar printed wiring board |
| CN106658978A (en) * | 2016-10-28 | 2017-05-10 | 奥士康精密电路（惠州）有限公司 | Pad dimension consistency improvement process |
| CN106658978B (en) * | 2016-10-28 | 2019-03-29 | 奥士康精密电路（惠州）有限公司 | A kind of process improving pad size consistency |
| CN106973514A (en) * | 2017-03-10 | 2017-07-21 | 江门崇达电路技术有限公司 | PAD preparation method in a kind of PCB |
| CN114245575A (en) * | 2021-11-16 | 2022-03-25 | 龙南骏亚电子科技有限公司 | Design method of PCB resistance welding zigzag circuit board |
| CN114786344A (en) * | 2022-05-26 | 2022-07-22 | 江苏博敏电子有限公司 | Design method for MiniLED packaging bonding pad |
| CN114786344B (en) * | 2022-05-26 | 2023-03-10 | 江苏博敏电子有限公司 | Design method for MiniLED packaging bonding pad |
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| Publication number | Publication date |
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| CN105792521B (en) | 2018-12-04 |
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