CN103220889A - Method for manufacturing oversize printed circuit board (PCB) back plate inner layer - Google Patents
Method for manufacturing oversize printed circuit board (PCB) back plate inner layer Download PDFInfo
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- CN103220889A CN103220889A CN201310128788XA CN201310128788A CN103220889A CN 103220889 A CN103220889 A CN 103220889A CN 201310128788X A CN201310128788X A CN 201310128788XA CN 201310128788 A CN201310128788 A CN 201310128788A CN 103220889 A CN103220889 A CN 103220889A
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Abstract
The invention discloses a method for manufacturing an oversize printed circuit board back plate inner layer. Firstly, a PIN tack hole is drilled on an edge plate position of an inner layer cross-band veneer; secondly, a PIN tack film photographic plate is manufactured; thirdly, a PIN tack column is arranged in a corresponding position of the film photographic plate and the PIN tack hole; fourthly, the PIN tack column of the film photographic plate is correspondingly sleeved in the PIN tack hole of the inner layer cross-band veneer; fifthly, single-face exposure is conducted on the inner layer cross-band veneer; and finally, all steps are conducted on the other face of the inner layer cross-band veneer, and single-face exposure is conducted on the other face of the inner layer cross-band veneer. Compared with traditional book clamping mode exposure, according to the method, the PIN tack hole in the inner layer cross-band veneer and the PIN tack column of a film photographic plate are mutually matched so as to realize accurate counterpoints, avoid the problem of counterpoint deviation between two faces of the same cross-band veneer, and solve the problem of scrap of the inner cross-band veneers. The scrap of the inner cross-band veneer is caused by a short circuit due to A/B deviation when exposure treatment is conducted on a back plate of size larger than 660mm*810mm.
Description
Technical field:
The invention belongs to the printed wiring board manufacture technology field, what be specifically related to is layer manufacturing method thereof in a kind of oversize PCB backboard, is primarily aimed at the backboard of size greater than 660mm*810mm.
Background technology:
And the increase of I/O quantity, the progress of electronics packaging technology and high frequencyization and the high-speed digitization of signal transmission integrated along with the height of electronic component on the wiring board develop, and the upgrading of electronic equipment high speed development and replacement demand, PCB develops to directions such as bearing function daughter board, signal transmission and power delivery gradually, then in reduction gradually, such PCB is backboard to its signal processing function.Backboard (Backplane or Back panel) is meant to have circuit and numerous sockets hole, be mainly used in carrying other functional daughter board and chip, play a type printed circuit board of high speed transmission of signals, it is widely used in important events such as communication, space flight, supercomputer, Medical Devices, military base station as one of key element.
Owing to have circuit and numerous sockets hole on the backboard, thereby make the whole back plate size bigger, and the exposure machine that the making of present backboard inner plating is adopted only is suitable for the backboard that size is not more than 550mm*610mm, make usually and need employing book clamp mode expose greater than the backboard inner plating of 660mm*810mm for size, the core material two sides that is about to backboard is fixedly clamped as book clamp by film egative film respectively, carries out Manual exposure then.
This production method is because film egative film is big and easy deformation, and when carrying out Manual exposure, the bubble of film egative film between inner plating need be discharged, therefore be easy to cause inner plating serious away from book clamp two plate angle off normals on one side, be A/B deviation (the contraposition deviations between two faces of same central layer), thereby the situation that follow-up pressing layer causes the short circuit of backboard internal layer to be scrapped partially occurs.
Summary of the invention:
For this reason, the object of the present invention is to provide layer manufacturing method thereof in a kind of oversize PCB backboard, be mainly used in solve present size greater than the backboard of 660mm*810mm when carrying out exposure-processed, the A/B deviation appears easily, and the problem that causes the short circuit of backboard internal layer to be scrapped.
For achieving the above object, the present invention is mainly by the following technical solutions:
Layer manufacturing method thereof in a kind of oversize PCB backboard comprises step:
S1, open material and make core material, and at four edges of core material PIN nail hole and the contraposition inspection opening that diameter is 3.175mm that to bore two diameters respectively be 2.1mm;
S2, above-mentioned core material is carried out nog plate, de-smear, oil removing, washing and microetch is handled;
S3, making PIN nail film egative film, PIN follows closely the punching target that the hole site is corresponding and diameter is identical on design on the film egative film and core material, and the contraposition pad that contraposition inspection opening position is corresponding and diameter is identical on design and the core material, paint the back at film egative film light then and get the PIN hole that diameter is 2.1mm in the punching target placement by film perforating press, by single face glue correspondence the PIN nail of making is fixed on place, PIN hole afterwards, and the diameter of described PIN nail is 2.1mm, height is 1.0mm, and base diameter is 3.175mm;
S4, core material is placed on the exposure machine table top, the PIN that PIN nail on the above-mentioned PIN nail film egative film directly is enclosed within on the core material follows closely in the hole, and it is vacuumized processing, and when vacuum degree reaches 650mmHg, adopt scraper in the middle of core material, to catch up with gas to both sides, and then catch up with gas from core material one side direction opposite side, air between core material and the PIN nail film egative film is drained, expose afterwards, and the another side to core material adopts the same manner to expose after exposure is finished;
S5, the core material after the exposure of above-mentioned two sides finished left standstill 15 minutes, developed then, etch processes;
S6, core material is checked by X ray.
Preferably, step S1 also comprises:
Bore the fool proof hole that diameter is 3.175mm in four edges of core material any one, on core material, overlap instead to prevent PIN nail film egative film.
Preferably, also comprise between step S2 and the S3:
Core material is placed on the rig table top according to the folded mode of 1PNL/, the row-coordinate adjustment of going forward side by side, and guarantee all PIN nail holes of core material and the edges of boards position that the contraposition inspection opening is positioned at core material.
The present invention is by boring PIN nail hole in the edges of boards position of core material, make PIN nail film egative film then, and PIN nail post is set at this film egative film and PIN nail corresponding position, hole site, then the PIN nail post correspondence with film egative film is enclosed within the PIN nail hole of core material, afterwards core material is carried out the single face exposure, repeat above-mentioned steps then the other one side of core material is carried out the single face exposure.Expose with traditional book clamp mode and to compare, the present invention cooperatively interacts by the PIN nail post of nail hole of the PIN on the core material and film egative film, the contraposition that has realized exposure is accurate, avoided the contraposition offset issue between two faces of same central layer, solved size greater than the backboard of 660mm*810mm when carrying out exposure-processed, because of the A/B deviation, and the problem that causes the core material short circuit to be scrapped.
Description of drawings:
Fig. 1 is oversize PCB backboard inner plating of the present invention and film egative film positioning states schematic diagram.
Identifier declaration among the figure: inner plating 1, PIN nail hole 101, contraposition inspection opening 102, fool proof hole 103, film egative film 2, PIN follow closely post 201.
Embodiment:
For setting forth thought of the present invention and purpose, the present invention is described further below in conjunction with the drawings and specific embodiments.
See also shown in Figure 1ly, Fig. 1 is oversize PCB backboard inner plating of the present invention and film egative film positioning states schematic diagram.The present invention is to provide layer manufacturing method thereof in a kind of oversize PCB backboard, comprise step:
S1, open material and make core material, and at four edges of core material PIN nail hole and the contraposition inspection opening that diameter is 3.175mm that to bore two diameters respectively be 2.1mm;
At first material is opened in copper-clad plate, according to normal mode, produce core material 1, then earlier to design the PIN drilling of a special use at the edges of boards of core material, because the size of core material is bigger, can't adopt traditional rig table top to hole, therefore need to adopt the mode of subsection hole-drilling to hole.
Correspondence gets out four groups of PIN holes 101 at the place, four angles of core material, and two every group, and the diameter in PIN hole 101 is 2.1mm.
The corresponding contraposition inspection opening 102 that to get out four diameters be 3.175mm at the place, four angles of core material, and described contraposition inspection opening 102 each at place, four angles.
The fool proof hole 103 that diameter is 3.175mm is bored at the wherein any place that locates at four angles of core material in addition, overlaps on core material instead to prevent PIN nail film egative film.
S2, above-mentioned core material is carried out nog plate, de-smear, oil removing, washing and microetch is handled;
When after core material boring, need carry out nog plate to it, de-smear is handled, and with the removals such as burr burr that produce because of boring on the plate face, carries out oil removal treatment afterwards, when will hole, the greasy dirt and the grease that remain in the hole or on the Copper Foil remove; Wash off by washing and then the degreaser that remains in plate face or the hole with oil removing the time, follow-up micro-corrosion liquid and activated solution are polluted preventing; Microetch is then mainly to the roughening treatment of wiring board copper face, for follow-up electro-coppering deposition provides a scabrid movable copper face structure, to improve chemical copper and the direct adhesion of base material copper.
After above-mentioned steps is finished, then core material is placed on the rig table top according to the folded mode of 1PNL/, the row-coordinate adjustment of going forward side by side, and guarantee all PIN nail holes of core material and the edges of boards position that the contraposition inspection opening is positioned at core material.
S3, making PIN nail film egative film, PIN follows closely the punching target that the hole site is corresponding and diameter is identical on design on the film egative film and core material, and the contraposition pad that contraposition inspection opening position is corresponding and diameter is identical on design and the core material, paint the back at film egative film light then and get the PIN hole that diameter is 2.1mm in the punching target placement, by single face glue correspondence the PIN nail of making is fixed on place, PIN hole afterwards by film perforating press;
Wherein need the thickness respective production PIN nail 201 according to core material here, the diameter of described PIN nail 201 is 2.1mm, and height is 1.0mm, and base diameter is 3.175mm.
S4, core material is placed on the exposure machine table top, the PIN that PIN nail on the above-mentioned PIN nail film egative film directly is enclosed within on the core material follows closely in the hole, and it is vacuumized processing, and when vacuum degree reaches 650mmHg, adopt scraper in the middle of core material, to catch up with gas to both sides, and then catch up with gas from core material one side direction opposite side, air between core material and the PIN nail film egative film is drained, expose afterwards, and the another side to core material adopts the same manner to expose after exposure is finished;
To size greater than the backboard core material of 660mm*810mm when exposing, need to adopt manual exposure machine to make, earlier core material is placed on the table top of exposure machine, to make then on the PIN nail film egative film PIN hole that directly cover is corresponding onboard, and adopt the alignment situation of four jiaos of ten times of spectroscopy, air-breathing then vacuumizing, when vacuum degree reaches 650mmHg, wipe gas with scraper again, wiping gas is meant by scraper scrapes film egative film, air between core material and the film egative film is discharged, be noted that when wiping gas gas is caught up with to two in the centre of first slave plate, and then wipe to another side on one side of slave plate, and pilot process can not stop, and does not more wipe gas back and forth, to prevent ill-exposed problem, can adopt the single face exposure mode during exposure, after treating that the one side exposure is finished, core material is repeated that conversely PIN is followed closely film egative film be enclosed within the core material another side, adopting uses the same method exposes.
S5, the core material after the exposure of above-mentioned two sides finished left standstill 15 minutes, developed then, etch processes;
S6, core material is checked, checking the situation that whether has the A/B deviation, and detected internal layer and have or not the inclined to one side situation of layer, guarantee that product quality meets the requirements by X ray.
More than be that layer manufacturing method thereof in a kind of oversize PCB backboard provided by the present invention is described in detail, used specific case herein structural principle of the present invention and execution mode are set forth, above embodiment just is used for helping to understand method of the present invention and core concept thereof; Simultaneously, for one of ordinary skill in the art, according to thought of the present invention, the part that all can change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention.
Claims (3)
1. layer manufacturing method thereof in the oversize PCB backboard is characterized in that comprising step:
S1, open material and make core material, and at four edges of core material PIN nail hole and the contraposition inspection opening that diameter is 3.175mm that to bore two diameters respectively be 2.1mm;
S2, above-mentioned core material is carried out nog plate, de-smear, oil removing, washing and microetch is handled;
S3, making PIN nail film egative film, PIN follows closely the punching target that the hole site is corresponding and diameter is identical on design on the film egative film and core material, and the contraposition pad that contraposition inspection opening position is corresponding and diameter is identical on design and the core material, paint the back at film egative film light then and get the PIN hole that diameter is 2.1mm in the punching target placement by film perforating press, by single face glue correspondence the PIN nail of making is fixed on place, PIN hole afterwards, and the diameter of described PIN nail is 2.1mm, height is 1.0mm, and base diameter is 3.175mm;
S4, core material is placed on the exposure machine table top, the PIN that PIN nail on the above-mentioned PIN nail film egative film directly is enclosed within on the core material follows closely in the hole, and it is vacuumized processing, and when vacuum degree reaches 650mmHg, adopt scraper in the middle of core material, to catch up with gas to both sides, and then catch up with gas from core material one side direction opposite side, air between core material and the PIN nail film egative film is drained, expose afterwards, and the another side to core material adopts the same manner to expose after exposure is finished;
S5, the core material after the exposure of above-mentioned two sides finished left standstill 15 minutes, developed then, etch processes;
S6, core material is checked by X ray.
2. layer manufacturing method thereof in the oversize PCB backboard according to claim 1 is characterized in that step S1 also comprises:
Bore the fool proof hole that diameter is 3.175mm in four edges of core material any one, on core material, overlap instead to prevent PIN nail film egative film.
3. layer manufacturing method thereof in the oversize PCB backboard according to claim 1 is characterized in that also comprising between step S2 and the S3:
Core material is placed on the rig table top according to the folded mode of 1PNL/, the row-coordinate adjustment of going forward side by side, and guarantee all PIN nail holes of core material and the edges of boards position that the contraposition inspection opening is positioned at core material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310128788.XA CN103220889B (en) | 2013-04-15 | 2013-04-15 | Layer manufacturing method thereof in a kind of oversize PCB backboard |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310128788.XA CN103220889B (en) | 2013-04-15 | 2013-04-15 | Layer manufacturing method thereof in a kind of oversize PCB backboard |
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| CN103220889A true CN103220889A (en) | 2013-07-24 |
| CN103220889B CN103220889B (en) | 2016-01-20 |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103752882A (en) * | 2013-12-27 | 2014-04-30 | 广州兴森快捷电路科技有限公司 | Drilling method for circuit board |
| CN104460251A (en) * | 2014-11-25 | 2015-03-25 | 镇江华印电路板有限公司 | Alignment device for exposure of circuit board and alignment method for exposure of circuit board |
| CN105307388A (en) * | 2015-10-14 | 2016-02-03 | 苏州福莱盈电子有限公司 | Operation method of FPC (flexible circuit board) line PIN alignment |
| CN106102331A (en) * | 2016-06-27 | 2016-11-09 | 深圳崇达多层线路板有限公司 | A kind of method of large scale wiring board inner cord exposure aligning |
| CN106112045A (en) * | 2016-07-13 | 2016-11-16 | 广德新三联电子有限公司 | A kind of drilling method of large scale circuit board |
| CN107278020A (en) * | 2017-06-30 | 2017-10-20 | 上达电子（深圳）股份有限公司 | Circuit board and locating tool |
| CN108112195A (en) * | 2018-01-23 | 2018-06-01 | 江西景旺精密电路有限公司 | A kind of manufacturing method of multi-layer circuit board |
| CN108337825A (en) * | 2018-02-08 | 2018-07-27 | 江西景旺精密电路有限公司 | PCB internal layer circuits making apparatus and production method |
| WO2019090859A1 (en) * | 2017-11-09 | 2019-05-16 | 建业科技电子（惠州）有限公司 | Manufacturing method for controlling independent pore size and independent wire thickness |
| CN112947017A (en) * | 2021-01-29 | 2021-06-11 | 珠海杰赛科技有限公司 | Circuit alignment method suitable for manual exposure machine |
| CN114770446A (en) * | 2022-05-30 | 2022-07-22 | 湖北源合达科技有限公司 | A workstation for cell-phone glass exposure processing |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03236450A (en) * | 1990-02-09 | 1991-10-22 | Nippon Metal Ind Co Ltd | Carrier plate material for use in press forming of printed circuit board and its production |
| CN101772268A (en) * | 2009-12-22 | 2010-07-07 | 深圳市集锦线路板科技有限公司 | Technology for aligning circuit board by PIN nail |
| CN101778536A (en) * | 2009-01-09 | 2010-07-14 | 深圳玛斯兰电路科技实业发展有限公司 | Process for controlling diameter of integrated positioning hole of inner cord board for printed circuit board |
| CN101969747A (en) * | 2010-10-15 | 2011-02-09 | 安徽四创电子股份有限公司 | Hinge clamp positioning method for printed board processing |
| CN202262101U (en) * | 2012-01-16 | 2012-05-30 | 茂成电子科技（东莞）有限公司 | Movable separated type rivet table top for multilayer printed circuit board |
| KR20120067958A (en) * | 2010-12-16 | 2012-06-26 | 세미크론 엘렉트로니크 지엠비에치 앤드 코. 케이지 | Printed circuit board with a screen |
-
2013
- 2013-04-15 CN CN201310128788.XA patent/CN103220889B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03236450A (en) * | 1990-02-09 | 1991-10-22 | Nippon Metal Ind Co Ltd | Carrier plate material for use in press forming of printed circuit board and its production |
| CN101778536A (en) * | 2009-01-09 | 2010-07-14 | 深圳玛斯兰电路科技实业发展有限公司 | Process for controlling diameter of integrated positioning hole of inner cord board for printed circuit board |
| CN101772268A (en) * | 2009-12-22 | 2010-07-07 | 深圳市集锦线路板科技有限公司 | Technology for aligning circuit board by PIN nail |
| CN101969747A (en) * | 2010-10-15 | 2011-02-09 | 安徽四创电子股份有限公司 | Hinge clamp positioning method for printed board processing |
| KR20120067958A (en) * | 2010-12-16 | 2012-06-26 | 세미크론 엘렉트로니크 지엠비에치 앤드 코. 케이지 | Printed circuit board with a screen |
| CN202262101U (en) * | 2012-01-16 | 2012-05-30 | 茂成电子科技（东莞）有限公司 | Movable separated type rivet table top for multilayer printed circuit board |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103752882B (en) * | 2013-12-27 | 2016-09-21 | 广州兴森快捷电路科技有限公司 | The boring method of wiring board |
| CN103752882A (en) * | 2013-12-27 | 2014-04-30 | 广州兴森快捷电路科技有限公司 | Drilling method for circuit board |
| CN104460251A (en) * | 2014-11-25 | 2015-03-25 | 镇江华印电路板有限公司 | Alignment device for exposure of circuit board and alignment method for exposure of circuit board |
| CN105307388B (en) * | 2015-10-14 | 2018-06-26 | 苏州福莱盈电子有限公司 | The operating method of FPC flexible circuit board circuits PIN contrapositions |
| CN105307388A (en) * | 2015-10-14 | 2016-02-03 | 苏州福莱盈电子有限公司 | Operation method of FPC (flexible circuit board) line PIN alignment |
| CN106102331A (en) * | 2016-06-27 | 2016-11-09 | 深圳崇达多层线路板有限公司 | A kind of method of large scale wiring board inner cord exposure aligning |
| CN106112045A (en) * | 2016-07-13 | 2016-11-16 | 广德新三联电子有限公司 | A kind of drilling method of large scale circuit board |
| CN107278020A (en) * | 2017-06-30 | 2017-10-20 | 上达电子（深圳）股份有限公司 | Circuit board and locating tool |
| WO2019090859A1 (en) * | 2017-11-09 | 2019-05-16 | 建业科技电子（惠州）有限公司 | Manufacturing method for controlling independent pore size and independent wire thickness |
| CN108112195A (en) * | 2018-01-23 | 2018-06-01 | 江西景旺精密电路有限公司 | A kind of manufacturing method of multi-layer circuit board |
| CN108337825A (en) * | 2018-02-08 | 2018-07-27 | 江西景旺精密电路有限公司 | PCB internal layer circuits making apparatus and production method |
| CN112947017A (en) * | 2021-01-29 | 2021-06-11 | 珠海杰赛科技有限公司 | Circuit alignment method suitable for manual exposure machine |
| CN114770446A (en) * | 2022-05-30 | 2022-07-22 | 湖北源合达科技有限公司 | A workstation for cell-phone glass exposure processing |
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