JP4285461B2 - Manufacturing method of multilayer wiring board - Google Patents

Description

  The present invention relates to a method for manufacturing a multilayer wiring board.

  Conventionally, a plurality of inner layer materials on which conductor circuits are formed are stacked via a prepreg, and a metal foil such as a copper foil is further stacked on the upper and lower sides via a prepreg, and this is heated and pressed to form a multilayer. Manufactures wiring boards. At this time, in order to prevent a plurality of inner layer materials from being displaced from each other and causing a shift between the conductor circuits of the inner layer materials, the lamination molding is performed in a state where the inner layer materials are aligned. Yes. As a method of preventing such misalignment between the inner layer materials, positioning holes are provided in a plurality of inner layer materials, and positioning pins are inserted into the positioning holes, and then the inner layer materials are aligned, and then temporarily fixed. Is known (see, for example, Patent Documents 1 and 2). One example will be described with reference to FIG. According to FIG. 3, a conductor circuit (not shown) is formed on the inner layer material 1, and marks (not shown) for forming a pair of positioning holes 5 are pattern-formed at opposing positions on both side ends of the inner layer material 1. A plurality of inner layer materials 1 are stacked and a pair of positioning holes 5 are collectively formed at the mark position of each inner layer material 1 by drilling. Next, these inner layer materials 1 are overlapped, and positioning pins 6 are inserted into the respective positioning holes 5 to align the inner layer materials 1.

By the way, in the manufacturing method of a multilayer wiring board, the conductor circuit inspection of the inner layer material is generally performed after drilling. This is because if a hole is drilled after the conductor circuit is inspected, the copper surface of the inner layer material may be scratched at the time of processing, resulting in a problem that a defective appearance product flows out. Further, the inner layer materials constituting the multilayer wiring board are usually used in combination with the same production lot.
Japanese Utility Model Publication No. 5-41185 JP-A-5-218648

  According to the above method, when a defect in the inner layer material is found during the inspection, a multilayer wiring board is manufactured by combining a normal inner layer material constituting the same multilayer wiring board as the inner layer material and an inner layer material having a different production lot. Since it was impossible to align even if it tried, all the normal inner-layer materials which comprise the same multilayer wiring board had to be discarded.

  Therefore, in the present invention, from the background as described above, only the inner layer material in which the defect has occurred is disposed of as disposal, and the normal inner layer material that has been conventionally disposed of as waste is reused to reduce costs and improve productivity. In addition, it is an object to provide a method for manufacturing a multilayer wiring board that does not lower the alignment accuracy between inner layer materials.

In order to solve the above-mentioned problems, the present invention provides a mark for forming a positioning hole at a position opposite to both end portions of the inner layer material, and then a pair of positioning holes at the mark position of the inner layer material. A method of manufacturing a multilayer wiring board that is formed by drilling and then aligning the inner layer materials to form a multilayer wiring board, wherein a mark for forming a positioning hole is formed on each inner layer material in a different production lot. to allow the drilling of more than once provided at least two or more pairs to both side end portions of the inner layer member, collectively a pair of positioning holes combine different inner layer material production lots to mark the position of the boring iNCOMPLETE The multilayer wiring board is formed by forming and aligning the inner layer materials .

According to the invention as described above, since at least two pairs of marks for forming the positioning holes are provided at both end portions of the inner layer material, a plurality of drilling processes can be performed. The normal inner layer material that has been disposed of can be reused. That is, using a normal inner layer material and an inner layer material having a different production lot, for example, an unperformed hole layer, a pair of positioning holes are formed again at the unperformed hole position, and each inner layer After alignment between the materials, lamination molding can be performed. As a result, it is possible to manufacture a multilayer wiring board without increasing costs and improving productivity while reducing the alignment accuracy between the inner layer materials.

  The present invention has the features as described above, and the best mode for carrying out the invention will be described below with reference to the drawings. FIG. 1 is a plan view for explaining an embodiment, and FIG. 2 is a cross-sectional view showing an example of a multilayer wiring board.

  As shown in FIG. 1, a mark 2 and a conductor circuit 3 for forming a positioning hole are provided in the inner layer material 1, and at least two pairs of marks 2 are provided at opposite positions on both side ends of the inner layer material 1. ing. The method for forming the mark 2 is not particularly limited, and for example, the mark 2 may be formed by etching.

  The mark 2 may be a mark for forming a positioning hole, and the shape thereof is not particularly limited. Then, the drilling process at the mark 2 position may be performed one by one or a predetermined number of inner layer materials 1 and may be appropriately set by a manufacturing facility or the like.

  As described above, the present invention enables two or more drilling processes by providing two or more pairs of marks 2 for forming positioning holes. That is, it is possible to form a new pair of positioning holes at the mark 2 position different from the mark 2 position where the hole was drilled first. The “pair of positioning holes” in the present invention means a plurality of positioning holes necessary for alignment between the inner layer materials 1 and 1 ′ in the manufacturing process of the multilayer wiring board. It is determined appropriately depending on the type of wiring board and manufacturing equipment. For example, one positioning hole is provided in each of the opposing positions on both side ends of the inner layer materials 1 and 1 '(a total of two positioning holes in one inner layer material), and a total of two positioning pins are positioned for each. When positioning between the inner layer materials 1 and 1 ′ through the holes, or by providing two positioning holes at opposite positions on both side ends of the inner layer materials 1 and 1 ′ (one inner layer In any case, for example, when positioning the inner layer materials 1 and 1 'by inserting a total of four positioning pins through the positioning holes, the inner layer materials 1 and 1' The positioning holes provided in are a pair of positioning holes. Therefore, when providing the mark 2 for forming two pairs of positioning holes in the inner layer material 1, 1 ′, in the above example, the former is located at the opposite position of the both end portions of the inner layer material 1, 1 ′. Two marks 2 are provided (a total of four marks on one inner layer material), and the latter is provided with four marks 2 at opposite positions on both side ends of the inner layer materials 1 and 1 '. (8 marks in total for one inner layer material). The same applies when three or more pairs of marks are provided.

By providing two or more pairs of marks 2, for example, a normal inner layer material 1 that has been conventionally disposed of after the conductor circuit inspection of the inner layer materials 1 and 1 ′ and the same multilayer wiring board as the inner layer material 1 are configured. For example, a multilayer wiring board can be manufactured by combining the inner layer material 1 ′ that has not been subjected to drilling processing in different manufacturing lots. Specifically, the normal inner layer material 1 that has been disposed of in the past and the inner layer material 1 ′ that has not been drilled are stacked and a new pair of positioning is performed at the position of the mark 2 that has not been drilled by drilling. Holes are formed in a lump . Next, a conductor circuit inspection is carried out, and if it is normal, the inner layer materials 1 and 1 'are aligned to manufacture a multilayer wiring board. For example, if the inner layer material 1 ′ is a defective product, the inner layer material 1 ′ is disposed of and disposed of, and a pair of positioning is performed again using the normal inner layer material 1 and the new inner layer material 1 ′ that has not been drilled. Holes are formed, and alignment is performed between the inner layer materials 1 and 1 'to manufacture a multilayer wiring board. At this time, the step of forming the pair of positioning holes can be repeatedly performed until there is no mark 2 provided in advance.

  As the inner layer material 1 in this invention, what formed the conductor circuit 3 in the copper clad glass base-material epoxy resin laminated board, the copper clad glass base polyimide resin laminated board, etc. can be used, for example. Then, the inner layer material 1 may be overlapped via the prepreg 4 and, for example, a multilayer wiring board may be manufactured by overlapping a metal foil such as a copper foil on the outer layer.

  Hereinafter, examples will be shown and described in more detail. Of course, the present invention is not limited by the following examples.

  After laminating a dry film on the inner layer material (512 × 423 × 0.2 mm), the conductor circuit pattern was exposed using the film, and then developed, etched, and peeled to form a conductor circuit pattern and two pairs of marks. Next, the positioning holes were drilled. The multilayer wiring board was a six-layer shield board having the structure shown in FIG. 100 sheets of L2-L3 layer inner layer material and 100 layers of L4-L5 layer inner layer material are taken as 1 lot, and for each of 5 lots, conductor circuit, 2 pairs of marks are formed and drilled, and conductor circuit inspection is performed. After the implementation, the number of non-defective products and defects was examined.

  Table 1 shows the results of the conductor circuit inspection.

Table 2 shows the number of sets of multilayer wiring boards manufactured after the conductor circuit inspection.

From the results in Table 2, by providing two pairs of marks, the normal inner layer material and the inner layer material of different lots can be combined and reused without disposing of the normal inner layer material and discarded. It has been found that more plates can be produced.

It is a top view explaining embodiment of this invention. It is sectional drawing which showed an example of the multilayer wiring board in this invention. It is a perspective view for demonstrating the manufacturing method of the conventional multilayer wiring board.

Explanation of symbols

1, 1 'inner layer material 2 mark 3 conductor circuit 4 prepreg 5 positioning hole 6 positioning pin

Claims (1)

After providing marks for forming positioning holes at opposite positions on both side edges of the inner layer material, a pair of positioning holes are formed at the mark position of the inner layer material by drilling, and then the position between the inner layer materials A method for manufacturing a multilayer wiring board that forms a multilayer wiring board by combining,
To allow the drilling of more than once provided at least two or more pairs of marks for positioning hole formed in each of the different inner layer member production lots at the respective side end portions of the inner layer member, a combination of different inner layer material production lots A method for manufacturing a multilayer wiring board, comprising: forming a multilayer wiring board by forming a pair of positioning holes collectively at a mark position where punching has not been performed , and performing alignment between each inner layer material .