TWI386126B - Method for cutting copper-clad laminate - Google Patents

Description

Copper clad substrate cutting method

The present invention relates to a circuit board manufacturing technology, and in particular, to a copper clad substrate cutting method.

With the rapid development of the electronics industry, the circuit board manufacturing technology, which is the basic component of electronic products, is becoming more and more important, and the requirements for the production of lines and holes are becoming more and more refined. The circuit board has single-panel, double-panel and multi-layer boards, which are all made by a series of processes such as cutting, drilling, etching, exposure and development of the copper-clad substrate. For details, see "Dielectric characterization of printed circuit board substrates" by C. H. Steer et al., Proceedings of the IEEE, Vol. 39, No. 2 (August 2002).

In the process of manufacturing a circuit board, it is usually necessary to cut a large-sized copper-clad substrate into a plurality of small-sized circuit board units. The main constituent materials of the copper-clad substrate include fiberglass cloth and copper foil. Among them, the glass fiber cloth is used as a carrier of the copper foil, and is made of glass fiber by a plain weave method.

However, since the fiber structure of the fiberglass cloth itself is different in the distribution in the warp and weft direction, the copper-clad substrate has different structures in the warp and weft directions, and the copper-clad substrate has different shrinkage rates in the warp and weft directions. Therefore, in order to ensure the quality of the panel, the previous copper-clad substrate adopts a single typesetting method during cutting, and the single typesetting method makes the copper-clad substrate have a large residual material and cannot be utilized, and has a low utilization ratio of the copper-clad substrate. Thereby increasing the manufacturing cost of the board.

In view of this, a copper-clad type capable of improving the utilization efficiency of a copper-clad substrate is provided. The board cutting method is really necessary.

Hereinafter, a copper clad substrate cutting method capable of improving the utilization efficiency of a copper-clad substrate will be described with reference to specific embodiments.

A copper-clad substrate cutting method, comprising the steps of: providing a copper-clad substrate having a warp direction and a weft direction; and patterning the copper-clad substrate, and causing the copper-clad substrate after the layout to include the length direction parallel to the copper-clad substrate a plurality of first circuit board units and a plurality of second circuit board units whose longitudinal direction is parallel to the latitudinal direction of the copper-clad substrate; a first warp and weft identification mark is formed in the first circuit board unit, and a second longitude and longitude is produced in the second circuit board unit Identifying a mark; cutting a copper clad substrate to obtain a plurality of first circuit board units having a first warp and weft identification mark; and a plurality of second circuit board units having a second warp and weft identification mark; and respectively dividing the plurality of first circuit board units Stacking with a plurality of second circuit board units.

Compared with the prior art, the copper-clad substrate cutting method of the present invention has the following advantages: first, the first circuit board unit whose longitudinal direction is parallel to the copper-clad substrate and the length direction is parallel to the copper-clad on the copper-clad substrate The hybrid layout of the second circuit board unit in the latitudinal direction of the substrate effectively utilizes the area of the copper-clad substrate to save the material and cost of the copper-clad substrate; secondly, the circuit board unit is marked by the identification symbol of the warp and weft direction to avoid the warp and weft direction of the circuit board unit Reversing; again, creating a first warp and weft identification mark on the first circuit board unit, and making a second warp and weft identification mark on the second circuit board unit, which can effectively distinguish the first circuit board unit from the second circuit board unit, thereby avoiding both Mixing causes inconsistency in the expansion and contraction, line misalignment, and hole position deviation in subsequent processes.

The copper-clad substrate cutting method of the present technical solution will be further described in detail below with reference to the embodiments and the accompanying drawings.

The copper-clad substrate cutting method provided by the embodiment of the present technical solution includes the following steps:

In the first step, a copper clad substrate 10 is provided having a warp direction and a weft direction.

The copper-clad substrate 10 may be a fiberglass-based copper-clad substrate, a paper-based copper-clad substrate, a composite copper-clad substrate, an alimentamide-based nonwoven fabric-based copper-clad substrate, or a synthetic fiber-based copper-clad substrate.

Referring to FIG. 1 , in the embodiment, the copper-clad substrate 10 has a rectangular shape. The rectangular copper-clad substrate 10 has a large original size and needs to be cut into a plurality of small-sized circuit board units for subsequent processing and manufacturing, thereby forming a circuit board. Finished product. The board unit is also typically rectangular.

In the second step, the copper clad substrate 10 is typeset according to the size of the predetermined circuit board unit 20, and the copper clad substrate 10 after the layout is arranged to include the plurality of first circuit board units 22 and the length direction parallel to the copper clad substrate 10. The direction is parallel to the plurality of second circuit board units 24 in the weft direction of the copper clad substrate 10.

Referring to FIG. 2, a Cartesian coordinate system XOY is established, wherein the Y-axis direction represents the warp direction of the copper-clad substrate 10, and the X-axis direction represents the weft direction of the copper-clad substrate 10. In the present embodiment, the longitudinal direction of the copper clad substrate 10, that is, the long side is parallel to the Y-axis direction, and the width direction, that is, the short side is parallel to the X-axis direction.

When the copper clad substrate 10 is typeset, it is preferable that the copper clad substrate 10 can arrange the most circuit board units 20. In the present embodiment, nine first circuit board units 22 and two second circuit board units 24 are arranged on the copper clad substrate 10.

Specifically, first, three first circuit board units 22 of the first group are sequentially arranged on the copper clad substrate 10 in the X-axis direction according to the size of the circuit board unit 20, and the length direction of the first circuit board unit 22 is parallel to In the Y-axis direction, the width direction is parallel to the X-axis direction. Next, a second group of three first circuit board units 22 are sequentially arranged in the X-axis direction below the first group of three first circuit board units 22. Thirdly, three third circuit board units 22 of the third group are sequentially arranged in the X-axis direction below the second group of three circuit board units. Finally, since the copper clad substrate 10 has a large remaining material after the nine first circuit board units 22 are arranged, the length of the residual material in the Y-axis direction is smaller than the length of the circuit board unit 20, and larger than the circuit board unit 20 The width. Therefore, two second circuit board units 24 can be sequentially arranged in the X-axis direction on the remaining material of the copper clad substrate 10, the length direction of the second circuit board unit 24 is parallel to the X-axis direction, and the width direction is parallel to the Y-axis direction. . Therefore, when the layout is performed in the manner of FIG. 2, the area of the copper clad substrate 10 can be effectively utilized.

Of course, a certain gap should be reserved between adjacent circuit board units 20. In this embodiment, the gap is about 0.5 mm to 2 mm to avoid affecting adjacent circuit board units 20 during cutting.

In addition, the second circuit board unit 24 may be arranged first on the copper clad substrate 10, and the first circuit board unit 22 may be arranged, and only the area of the copper clad substrate 10 may be utilized to the maximum extent.

In the third step, the first warp and weft identification mark is formed on the first circuit board unit 22, and the second warp and weft identification mark is created on the second circuit board unit 24.

Referring to FIG. 3, a first warp and weft identification mark is formed on the first circuit board unit 22 by machining, laser processing, or chemical etching. A second warp and weft identification mark is formed on the second circuit board unit 24. The first warp and weft identification mark and the second warp and weft identification mark may be one or a plurality of through holes. When the first warp and weft direction identification mark and the second warp and weft direction identification mark are one through hole, the cross section of the through hole may be an isosceles triangle, and the long side of the isosceles triangle corresponds to the length of the first circuit board unit 22 In the direction, the short side corresponds to the width direction of the first circuit board unit 22; and the second circuit board unit 24 also forms a through hole, the cross section of the through hole is also an isosceles triangle, and the long side of the unequal waist triangle corresponds to The length direction of the second circuit board unit 24 corresponds to the width direction of the second circuit board unit 24. Alternatively, the unequal waist through hole is formed only in the first circuit board unit 22, and the second circuit board unit 24 does not make the unequal waist through hole to identify the first circuit board unit 22 and the second circuit board unit 24.

When the first warp and weft identification mark and the second warp and weft identification mark are plural through holes, the first warp and weft identification mark includes a first identification mark 2202 and a second identification mark 2222, and the second warp and weft identification mark includes the third The identification mark 2402, the fourth identification mark 2422, and the fifth identification mark 2424. The first identification mark 2202, the second identification mark 2222, the third identification mark 2402, the fourth identification mark 2422, and the fifth identification mark 2424 may be circular through holes, square through holes, or pentagonal through holes. In this embodiment, the first identification mark 2202, the second identification mark 2222, the third identification mark 2402, the fourth identification mark 2422, and the fifth identification mark 2424 are all circular through holes, each having a diameter of about 1 mm.

Specifically, the first circuit board unit 22 defines an opposite first end portion 220 and a second end portion 222. The first end portion 220 and the second end portion 222 are opposite to each other by the first circuit board unit 22 The two areas where the side or the two short sides are located. In this embodiment, the two regions where the two short sides of the first circuit board unit 22 are located serve as the first end portion 220 and the second end portion 222, respectively. The first identification mark 2202 is located at a top corner area of the first end portion 220, and the second identification mark 2222 is located at an intermediate portion of the second end portion 222.

Similarly, the second circuit board unit 24 has opposing third and second ends 240, 242. The third identification mark 2402 is located at a top corner area of the third end portion 240, and the fourth identification mark 2422 is located at a top corner area of the fourth end portion 242 opposite to the third identification mark 2402; the fifth identification mark 2424 is located The middle portion of the fourth end portion 242. Preferably, the third identification mark 2402 is the same as the Y-axis coordinate of the fourth identification mark 2422, and the fourth identification mark 2422 is the same as the X-axis coordinate of the fifth identification mark 2424, that is, the third identification mark 2402 and the fourth identification mark. 2422 is located at the same latitude, and fourth identification mark 2422 is at the same longitude as fifth identification mark 2424.

Therefore, the operator only needs to identify the circuit board unit 20 according to the relative position and quantity relationship of the first identification mark 2202, the second identification mark 2222, the third identification mark 2402, the fourth identification mark 2422, and the fifth identification mark 2424. In the warp and weft direction, the first circuit board unit 22 and the second circuit board unit 24 can be distinguished to avoid the reverse and chaos in the subsequent stacking.

Of course, the opening of the warp and weft identification mark is not limited to the manner described above, and only needs to help the operator to recognize the warp and weft direction of the circuit board unit 20 and distinguish the first circuit board unit 22 from the second circuit board unit 24. The warp and weft identification marks are all within the protection range of the method.

In the fourth step, the copper clad substrate 10 is cut to obtain the first circuit board unit 22 and the first Two circuit board units 24.

After the copper clad substrate 10 is cut by a cutting device (not shown), the first circuit board unit 22 and the second circuit board unit 24 may be further divided and fabricated. Before the classification is made, the first circuit board unit 22 and the second circuit board unit 24 can be distinguished by using the first warp and weft identification mark of the first circuit board unit 22 and the second warp and weft identification mark of the second circuit board unit 24. Stacking, as shown in Figure 4, to facilitate subsequent processing.

After the stacking operation is completed, the circuit board unit is subjected to a series of processes such as drilling, copper plating, etching, exposure, and development to manufacture a finished circuit board.

The copper-clad substrate cutting method of the present invention can effectively utilize the area of the copper-clad substrate 10. For example, when the size of the copper-clad substrate 10 provided is 72 mm×48 mm, and the size of the circuit board unit 20 of the predetermined design is 17.5 mm×15.6 mm, when the copper-clad substrate cutting method of the present technical solution is used for typesetting, The elliptical circuit board unit 20 is obtained by cutting, and has a higher utilization ratio of the copper-clad substrate 10.

Moreover, the present technical solution marks the circuit board unit 20 by using the warp and weft direction identification marks, thereby avoiding the reverse rotation direction of the circuit board unit 20, and effectively distinguishing the first circuit board unit 22 from the second circuit board unit 24 to avoid mixing of the two. This caused problems such as inconsistent expansion and contraction, line misalignment, and hole position deviation in subsequent processes.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Familiar with this Equivalent modifications or variations made by those skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

10‧‧‧Copper-clad substrate

20‧‧‧Circuit unit

22‧‧‧First board unit

24‧‧‧Second circuit board unit

2202‧‧‧First identification mark

2222‧‧‧Second identification mark

2402‧‧‧ Third identification mark

2422‧‧‧ Fourth identification mark

2424‧‧‧ fifth identification mark

220‧‧‧ first end

222‧‧‧ second end

240‧‧‧ third end

242‧‧‧ fourth end

FIG. 1 is a schematic diagram of a copper-clad substrate provided by an embodiment of the present technical solution.

FIG. 2 is a schematic diagram of the copper clad substrate after the layout of the embodiment of the present technical solution.

FIG. 3 is a schematic diagram showing the first latitude and longitude identification mark on the first circuit board unit and the second latitude and longitude identification mark on the second circuit board unit according to the embodiment of the present technical solution.

4 is a schematic diagram of stacking a first circuit board unit and a second circuit board unit after cutting a copper clad substrate according to an embodiment of the present technical solution.

10‧‧‧Copper-clad substrate

20‧‧‧Circuit unit

22‧‧‧First board unit

24‧‧‧Second circuit board unit

2202‧‧‧First identification mark

2222‧‧‧Second identification mark

2402‧‧‧ Third identification mark

2422‧‧‧ Fourth identification mark

2424‧‧‧ fifth identification mark

220‧‧‧ first end

222‧‧‧ second end

240‧‧‧ third end

242‧‧‧ fourth end

Claims (13)

A copper-clad substrate cutting method, comprising the steps of: providing a copper-clad substrate having a warp direction and a weft direction; and patterning the copper-clad substrate, and causing the copper-clad substrate after the layout to include the length direction parallel to the copper-clad substrate a plurality of first circuit board units and a plurality of second circuit board units whose longitudinal direction is parallel to the latitudinal direction of the copper-clad substrate; a first warp and weft identification mark is formed in the first circuit board unit, and a second longitude and longitude is produced in the second circuit board unit Identifying a mark; cutting a copper clad substrate to obtain a plurality of first circuit board units having a first warp and weft identification mark; and a plurality of second circuit board units having a second warp and weft identification mark; and respectively dividing the plurality of first circuit board units Stacking with a plurality of second circuit board units. The copper clad substrate cutting method according to the first aspect of the invention, wherein the copper clad substrate, the first circuit board unit, and the second circuit board unit are rectangular. The method for cutting a copper-clad substrate according to the first aspect of the invention, wherein the copper-clad substrate is a glass fiber-based copper-clad substrate, a paper-based copper-clad substrate, a composite copper-clad substrate, and a linalominic fiber non-woven fabric. A copper-clad substrate or a synthetic fiber-based copper-clad substrate. The copper-clad substrate cutting method according to the first aspect of the invention, wherein the first warp and weft direction identification mark and the second warp and weft direction identification mark are produced by a machining, a laser processing or a chemical etching method. The method for cutting a copper-clad substrate according to the first aspect of the invention, wherein the first warp and weft direction identification mark and the second warp and weft direction identification mark are one through hole. The cross-sectional shape of the through hole is an isosceles triangle. The method of cutting a copper-clad substrate according to claim 5, wherein the anisometric triangle is located at a top corner region of the first circuit board unit or the second circuit board unit. The copper-clad substrate cutting method according to the first aspect of the invention, wherein the first warp and weft direction identification mark and the second warp and weft direction identification mark are plural through holes. The method for cutting a copper-clad substrate according to claim 7, wherein the first warp and weft identification mark comprises a first identification mark and a second identification mark, wherein the first identification mark is located at one end of the first circuit board unit. In the apex area, the second identification mark is located in an intermediate portion of the other end of the first circuit board unit. The method for cutting a copper-clad substrate according to claim 7, wherein the second warp and weft identification mark comprises a third identification mark, a fourth identification mark and a fifth identification mark, wherein the third identification mark is located in the second a vertices region at one end of the circuit board unit, the fourth identification mark being opposite to the third identification mark, located at a top corner region of the other end of the second circuit board unit, the fifth identification mark and the fourth identification mark being at the same end, Located in the middle of the end. The method for cutting a copper-clad substrate according to claim 9, wherein the third identification mark and the fourth identification mark are located at the same latitude, and the fourth identification mark and the fifth identification mark are at the same longitude. The method for cutting a copper-clad substrate according to claim 1, wherein the first warp and weft identification mark is a through hole, and the cross-sectional shape of the through hole is an isosceles triangle. The method for cutting a copper-clad substrate according to claim 11, wherein the long side of the unequal waist triangle corresponds to the length direction of the first circuit board unit, and the short side of the unequal waist triangle corresponds to the first The width of the board unit to. The method for cutting a copper-clad substrate according to claim 11, wherein the second warp and weft identification mark is a through hole having a cross-sectional shape that is not an isosceles triangle.