TWM286541U - Assembled composite circuit board - Google Patents

Assembled composite circuit board Download PDF

Info

Publication number
TWM286541U
TWM286541U TW94211825U TW94211825U TWM286541U TW M286541 U TWM286541 U TW M286541U TW 94211825 U TW94211825 U TW 94211825U TW 94211825 U TW94211825 U TW 94211825U TW M286541 U TWM286541 U TW M286541U
Authority
TW
Taiwan
Prior art keywords
board
circuit board
composite circuit
sub
combination
Prior art date
Application number
TW94211825U
Other languages
Chinese (zh)
Inventor
Hung Tian
Original Assignee
Hung Tian
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hung Tian filed Critical Hung Tian
Priority to TW94211825U priority Critical patent/TWM286541U/en
Publication of TWM286541U publication Critical patent/TWM286541U/en

Links

Landscapes

  • Structure Of Printed Boards (AREA)

Description

M286541 四、創作說明(l) 【新型所屬之技術領域】 本創作係有關一種複合式電路板,係指利用嵌接組合 的方式將兩片電路板組合為一體後,再加以黏合使用之複M286541 IV. Creation Description (l) [New Technology Area] This creation is about a composite circuit board, which refers to the combination of two circuit boards by means of inlay combination, and then bonded and used.

合結構,尤指可以提昇組裝效率且具有理想之組合平整度 的嵌合構造。 X 先前技術 為 部損壞 _ 一複 於 成一片 設有一 入礙槽 縮小子 槽準確 由 角呈尖 使得 脅此、组 板與嵌 然 緩慢, 彰的情 因應電路板的模組化設計,或是基於電路板因其局 而需要加以修補的理由,利用兩片電路板拼接組合 合電路板早已普遍被採用且為人所周知。 σ 「第1圖」中顯示有兩片可以利用嵌合方式而組合 完整電路板的構造示意圖;如圖所示,於母板丨〇上 嵌槽100,藉此以讓具有配合尺寸之子板2〇可以嵌 中,與母板保持平整度的相互組合;然而為了達 板與母板之間組合間隙,子板的外型尺寸必須與嵌 匹配,才能提高良率。 ===與母板配合之嵌合尺寸相當精密,加上其邊 二且子母板套合過程中常因用力過度或不當 # :當中又一不小心地出脫離開母板槽口, 槽準確嵌合,:ί:Γ 精準度’才能讓子 、飲口 以獲仔良好的組合平整度。 為求、、且裝之精雄、,相對地其組 以致於當有大量生吝少恭> 士 Λ ^ 妒。 之需求時’就會顯現出效率不A composite structure, especially a fitting structure that can improve assembly efficiency and has an ideal combination flatness. X The prior art is part of the damage _ a complex one in a piece with an obstacle slot to narrow the sub-slot accurately from the corner to make the threat, the board and the embedded slow, the situation of the modular design of the circuit board, or Based on the reasons why boards need to be repaired due to their problems, the use of two-chip board splicing combined circuit boards has long been widely adopted and well known. σ "Figure 1" shows two schematic diagrams of a complete circuit board that can be assembled by means of a fitting method; as shown in the figure, a groove 100 is embedded in the mother board to allow the daughter board 2 having a matching size 〇 can be embedded, and the flatness of the motherboard is combined with each other; however, in order to achieve the gap between the board and the motherboard, the size of the sub-board must match the embedding to improve the yield. ===The fitting size of the mating plate is quite precise, and the side of the sub-board is often over-extended or improper due to excessive force. #: In addition, it accidentally leaves the slot of the motherboard, and the slot is accurate. Chimeric,: ί: 精准 Accuracy can make the child and the mouth get a good combination of flatness. In order to seek, and to pretend to be the best, the group is relatively large, so that when there are a large number of oysters and less gt; 士 Λ ^ 妒. When it is demanded, it will show that efficiency is not

M286541 四、創作說明(2) =外如第2圖」所示,由於配合尺寸的_京_ 求相當高,於實際邊γ ,人μ τ从丄也丁的精播度要 平整地組合於母柘沾也城 增& ^^生子板無法 子板之上、下承ί 槽内,導子板產生翹曲情形,讓 平面22,2 4與母板之上、下平面12 141 持理想的平整度。 田U,14無决保 【新型内容】 有鑑於上述存在於複合電路板上的問題,創作人遂竭 其心智悉心研究克服,憑其從事該項產業多年之累積經驗 ’提出一種改善之道。 # 本創作之主要目的即在於設計一種可以讓子板與母板 組裝速度快且能確保組合後,使子板與母板保持良好平整 面之嵌接組合設計。為達上述目的,本創作提出一種在子 板與母板接合邊改採斜面配合,並且在邊角上改以圓導角 來做為匹配組合之接合面,不僅讓組裝更為簡便快速,也 能夠讓子板與母板在組合完成後,兩塊板子的上、下平面 保持最佳的平整度。 【實施方式】 有關本創作之詳細說明及技術内容,現即配合圖式說 明如下,然而所附圖式僅提供參考與說明用,並非用來對 •創作加以限制。 「第3圖」顯示一種複合電路板結構,「第4圖」、及「 第5圖」則是分別顯示複合電路板中之母板與子板的平面 圖;如圖所示,該複合電路板主要係由可以相互搬接組合 之一母板3 0與一子板4 0 ,基於組合之需求,母板3 〇係為一M286541 IV. Creation Description (2) = As shown in Figure 2, because the size of the _ _ _ is quite high, the actual edge γ, the human μ τ from the 精 的 精 精 精 要 要The mother-in-law is also added to the city. ^^ The raw plate cannot be above the sub-board and the bottom of the sub-plate. The guide plate is warped, so that the plane 22, 2 4 and the upper and lower planes of the motherboard are ideal. Flatness. Tian U, 14 No Warranty [New Content] In view of the above problems existing on the composite circuit board, the creator exhausted his mind to study and overcome it, and based on his accumulated experience in the industry for many years, proposed a way to improve. # The main purpose of this creation is to design an inlay combination design that allows the daughter board to be assembled quickly with the motherboard and that ensures a good flatness of the daughter board and the motherboard after assembly. In order to achieve the above purpose, the present invention proposes a matching face matching between the daughter board and the mother board, and changing the corner angle to the joint surface of the matching combination, which not only makes the assembly easier and faster, but also After the combination of the daughter board and the motherboard, the upper and lower planes of the two boards are optimally flat. [Embodiment] The detailed description and technical contents of the present invention are as follows with reference to the drawings, but the drawings are only for reference and explanation, and are not intended to limit the creation. "Picture 3" shows a composite circuit board structure, and "4th" and "5th" are plan views showing the mother board and the sub board in the composite circuit board respectively; as shown in the figure, the composite circuit board Mainly by the combination of one of the motherboards 30 and one of the daughter boards 40, which can be combined with each other, the motherboard 3 is a

第6頁 M286541 四、創作說明(3) 片至少設有一透空之斜面嵌槽30 0的電路板,嵌槽3〇〇的每 一邊緣都呈現外擴之斜面32,且於嵌槽3〇〇相鄰接兩邊之 接合處皆呈圓導角34。 至於子板4 0則是一片可以嵌入組合在嵌槽3 〇 〇的另一 片電路板’子板4 0具有適配於嵌入欲槽30 0内之外型尺寸 ,其邊緣亦設計呈斜面42,且相鄰接兩邊之接合處亦呈圓 導角44者。 於實際應用時,母板3 0與子板4 0之配合形狀包含但不 限於矩形,舉凡多邊形或非幾何形狀也都適用本創作之設 W ° 相對於習知構造’藉著上述母板欲槽3 0 〇之斜面3 2與 子板4 0邊緣之斜面4 2相對稱之設計,使得組合時子板4 〇得 以利用斜面4 2很順利地滑入母板嵌槽3 0 〇邊緣之斜面3 2而 進入母板嵌槽30 0中,不會出脫離開母板嵌槽3〇〇。 相較於習知構造,藉由母板3 〇與子板4 0在鄰邊接合處 改以呈圓導角34, 44的設計之後;如「第6圖」所示,當子 板4 0欲嵌接組合於嵌槽3 0 〇内時,組合的過程中就不會發 生如習知邊角為尖角設計時容易發生定位不正而導致翹曲 =情形。此外,利用圓導角3 4,4 4的設計也可以讓子板4 〇 餐母板30減少嵌合定位時所耗費的時間,讓組合動作相較 於習知更為快速且簡便。 由上可知’本創作所揭之複合電路板主要在於子板4 〇 及母板30接合邊邊角設計呈圓導角34, 44,藉以達到組合 簡便且嵌合定位快速的效果,此外,也能夠讓子板4〇與母Page 6 M286541 IV. Creation Instructions (3) The board is provided with at least one circuit board with a slanted groove 30 0. Each edge of the slot 3 has an outwardly inclined slope 32 and is embedded in the slot 3 The joints of the two adjacent sides are rounded at an angle of 34. The sub-board 40 is a piece of another circuit board that can be embedded in the slot 3'. The sub-board 40 has a size suitable for embedding in the slot 30, and the edge is also designed as a bevel 42. And the joint between the two adjacent sides also has a rounded corner 44. In practical applications, the mating shape of the motherboard 30 and the sub-board 40 includes, but is not limited to, a rectangle, and any polygonal or non-geometric shape is also applicable to the design of the W° relative to the conventional structure 'by the above-mentioned mother board desire The bevel 3 2 of the groove 3 相对 is symmetrical with the bevel 4 2 of the edge of the sub-plate 40, so that the combined sub-plate 4 can smoothly slide into the bevel of the edge of the mother plate slot 30 by the inclined surface 4 2 . 3 2 and enter the mother board slot 30 0, will not leave the mother board slot 3 〇〇. Compared with the conventional structure, the mother board 3 〇 and the daughter board 40 are changed at the adjacent side joints to be in the shape of the circular lead angles 34, 44; as shown in "Fig. 6", when the sub-board 40 When the combination is to be embedded in the recessed groove 30, the combination does not occur when the conventional corner is a sharp corner design, and the positioning is not correct and the warpage is caused. In addition, the design of the rounded corners 3 4, 4 4 also allows the daughter board 4 to reduce the time it takes to position the mating, making the combined action faster and easier than conventional. It can be seen from the above that the composite circuit board disclosed in the present invention mainly consists of the rounded corners 34, 44 of the joint edges of the sub-board 4 〇 and the mother board 30, so as to achieve a simple combination and a fast fitting and positioning effect, in addition, Can make the daughter board 4 and mother

第7頁 M286541 四、創作說明(4) 3 0在 組 合 % 成 後 J 子 板 4 0之 上、下平 面 4 6,4 8與母板 30 ψΛ> C 下 爭 面 36, 3 8保持最佳的平整度 〇 之 上 所 述 , 誠 可 見 本 創 作 之設計確 係 出 於前 所 未 有 之 劍 應 用 , 其 構 成 誠 屬 精 簡 實 用,且已 符 合 於實 用 及 進 步 A7 v 9 亦 屬 為 合 y 理 之 新 型 創 作 ;惟,以 上 所 揭僅 為 本 創 作 實 施 例 I rn7 士 , 依 孑F 本 合ί 限 定 本 創 作之實施 例 9 舉凡 熟 悉 該 項 技 藝 八 皆 應 為 本 剑 ft 作 之 特 徵 範疇所做 之 任 何等 效 變 化 或 修 飾 9 1 r 之 中 請 專 利範圍所 涵 蓋 〇Page 7 M286541 IV. Creation Description (4) 3 0 After the combination of %, the J sub-board 40, the lower plane 4, 4 8 and the mother board 30 ψΛ> C under the surface 36, 3 8 keep the best The flatness of the above is described above. It is true that the design of this creation is based on the unprecedented application of the sword. Its composition is simple and practical, and it has been in line with practical and progressive A7 v 9 is also a new creation of y. However, the above disclosure is only for the creation example I rn7 士, 依孑F本合ί 限定 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施Scope of effect change or modification 9 1 r

M286541 圖式簡單說明 【圖式簡單說明】 第1圖,係為習知兩片可以利用嵌接組合之複合電路板立 體分解圖; 第2圖’顯示習知複合電路板於嵌接組合後發生表面不平 整現象之側視圖; ,3圖’係為本創作嵌接組合之複合電路板立體分解圖’ ,4圖’係為本創作複合電路板之母板上視平面圖; =5圖’係為本創作複合電路板之母板底視平面圖;及 6圖,顯示本創作複合電路板之子板與母板嵌接組合後 ’保持平整狀態之側視圖。 【圖式符號說明】 ,板3〇 子板40 肷槽3〇〇 斜面42 斜面32圓 導角44 圓導角34 上平面46 上平面36 下平面48 下平面38M286541 Simple description of the drawing [Simple description of the drawing] Figure 1 is a three-dimensional exploded view of a composite circuit board that can be used with two inlays; Figure 2 shows that the conventional composite circuit board occurs after the in-line combination Side view of the surface irregularity; , 3 ' is a three-dimensional exploded view of the composite circuit board of the creative inlay combination, '4' is the view of the mother board of the creative composite circuit board; =5 figure ' The bottom plan view of the mother board of the composite circuit board of the present invention; and the figure 6 shows a side view of the flat state of the daughter board of the composite circuit board after being combined with the mother board. [Description of Symbols], Plate 3 〇 Subplate 40 肷 3 〇〇 Bevel 42 Bevel 32 Circles Leading Angle 44 Rounded Angle 34 Upper Plane 46 Upper Plane 36 Lower Plane 48 Lower Plane 38

第9頁Page 9

Claims (1)

M286541 五、申請專利範圍 1. 一種嵌接組合之複合電路板,包括有: 一母板,設有一透空之斜面嵌槽,且該斜面嵌槽上 相鄰接兩邊之接合處呈圓導角;及 一子板,具有適配於嵌入該斜面嵌槽内之外型尺 寸,其邊緣設計呈斜面以配合該斜面嵌槽,且該子板相 鄰接兩邊之接合處呈圓導角。 2 .如申請專利範圍第1項所述嵌接組合之複合電路板,其 中該斜面嵌槽為多邊形。 3.如申請專利範圍第1項所述嵌接組合之複合電路板,其 丨•中該子板邊緣斜面為多邊形。M286541 V. Patent application scope 1. A composite circuit board with an embedded combination, comprising: a mother board, which is provided with a slanted surface recessed groove, and a joint of two adjacent sides of the inclined surface of the inclined surface is rounded. And a sub-board having a size adapted to be embedded in the beveled recess, the edge of which is designed to be inclined to fit the beveled recess, and the joint between the adjacent sides of the sub-board has a rounded corner. 2. The composite circuit board of the inlaid combination according to claim 1, wherein the beveled groove is polygonal. 3. The composite circuit board of the inlaid combination according to claim 1, wherein the edge of the sub-board is polygonal. 第10頁Page 10
TW94211825U 2005-07-12 2005-07-12 Assembled composite circuit board TWM286541U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94211825U TWM286541U (en) 2005-07-12 2005-07-12 Assembled composite circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94211825U TWM286541U (en) 2005-07-12 2005-07-12 Assembled composite circuit board

Publications (1)

Publication Number Publication Date
TWM286541U true TWM286541U (en) 2006-01-21

Family

ID=37400535

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94211825U TWM286541U (en) 2005-07-12 2005-07-12 Assembled composite circuit board

Country Status (1)

Country Link
TW (1) TWM286541U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI381782B (en) * 2010-03-18 2013-01-01 Zhen Ding Technology Co Ltd Method of making printed circuit board having element beyond boundary of the printed circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI381782B (en) * 2010-03-18 2013-01-01 Zhen Ding Technology Co Ltd Method of making printed circuit board having element beyond boundary of the printed circuit board

Similar Documents

Publication Publication Date Title
EP2042668A1 (en) A corner joint element for bevel-edge tiles
TWI289467B (en) Toy track and method of assembling and disassembling the same
TWM286541U (en) Assembled composite circuit board
JP5010273B2 (en) Building board
CN103255844B (en) Anti-cracking belt groove arranged on wallboard, die frame for manufacturing anti-cracking belt groove and method for installing wallboard with anti-cracking belt groove
KR102481298B1 (en) Glass bending mold, glass bending apparatus including the same, and method of bending glass
JPWO2015182229A1 (en) Mother ceramic substrate, ceramic substrate, mother module component, module component, and method of manufacturing mother ceramic substrate
TWI537483B (en) Fixing method and position assembly for cementing plates
JP4832557B2 (en) Contact structure of electrical connector
KR102084319B1 (en) A method for bending a frame
JP2009062804A (en) Floor member with adhesive part
CN206828886U (en) A kind of anti-tripping iron construction of heel of switch rail
KR101721808B1 (en) Brick
CN205875596U (en) Wood aluminum alloy floor is imitated to joint formula
KR102402982B1 (en) split sputtering target
CN105672635B (en) A kind of tile work device, facing assembly and tile work method
CN206895027U (en) General magnetic support plate
CN205044167U (en) 3D prints thin wall component splicing apparatus
TW201421989A (en) Holder and image capturing module
WO2016116060A1 (en) Cross-shaped solid shape
JP5797852B2 (en) Fabrication of 3D printed circuit board structure
TWM444400U (en) Structure of rain staining prevention board
JP2018053633A (en) Building board and construction structure of building board
WO2019061125A1 (en) Lock-catch-type board and assembly and disassembly method therefor
CN208487231U (en) A kind of plate connecting piece

Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees