JPWO2015182229A1 - Mother ceramic substrate, ceramic substrate, mother module component, module component, and method of manufacturing mother ceramic substrate - Google Patents

Abstract

When divided into individual substrates (ceramic substrates), it is possible to divide the substrate so that the divided end faces are perpendicular to the main surfaces of the individual substrates, thereby obtaining a ceramic substrate with high shape accuracy. A mother ceramic substrate, an individual ceramic substrate obtained from the mother ceramic substrate, a module component including the ceramic substrate, and a method for manufacturing the mother ceramic substrate are provided. In the mother ceramic substrate 1 configured to be divided at a predetermined position and divided into a plurality of individual substrates, a dividing groove 3 that defines a dividing position is formed on one side main surface 2a, and the other side When the mother ceramic substrate 1 is viewed from the thickness direction of the main surface 2b, the ridges 4 are formed at positions corresponding to the positions where the dividing grooves 3 of the one-side main surface 2a are formed. The internal conductors are arranged in such a manner that the individual substrates (ceramic substrates) 31 obtained after the division each have an internal conductor.

Description

  The present invention relates to a mother ceramic substrate configured to be divided at a predetermined position into a plurality of individual substrates, a ceramic substrate obtained by dividing the mother ceramic substrate, and the mother ceramic substrate. The present invention relates to a mother module component used, a module component obtained by dividing the mother module component, and a method of manufacturing a mother ceramic substrate.

  In manufacturing a ceramic substrate, a method of dividing a mother ceramic substrate after firing and dividing it into individual ceramic substrates is widely used.

  As a method for dividing the fired mother ceramic substrate into individual ceramic substrates having a predetermined size, for example, Patent Document 1 discloses that a press plate having protrusions that are continuous in a lattice shape at the dividing position is used. A method is described in which grooves are formed in a grid pattern at the dividing positions of the mother ceramic laminate by pressing, and after firing, the fired mother ceramic laminate is divided along the grooves to obtain a multilayer ceramic substrate. .

  In Patent Document 2, at least one continuous groove is provided on a sintered ferrite substrate having an adhesive layer on one surface, and a sintered ferrite substrate that can be divided starting from the continuous groove is formed. A method of dividing the ceramic substrate into individual ceramic substrates is disclosed.

  Further, in Patent Document 3, a shrinkage-suppressing green sheet is arranged on both surfaces of a laminate formed by laminating a plurality of substrate green sheets, and at least one of the shrinkage-suppressing green sheets has a dividing groove on the surface. Using a shrinkage-suppressing green sheet on which a split groove forming pattern serving as a reference for the formation position is formed, and using the split groove forming pattern of the shrinkage suppressing green sheet, a split groove for dividing the substrate is formed on the surface of the laminate. A method of manufacturing a multilayer ceramic substrate by forming, firing, and dividing along a dividing groove is disclosed.

  However, in the methods disclosed in the above Patent Documents 1 to 3, as shown in FIGS. 22A and 22B, the breaking groove 301 for breaking is formed on the surface 300 a on one side of the mother substrate 300. However, the mother substrate 300 is configured to break from the dividing groove as a starting point, and since there is a breaking starting point only on one surface of the mother substrate, the dividing end surface 302 is formed on the surface 300a of the mother substrate 300 as intended. It is difficult to divide the mother substrate 300 so as to be vertical, and as shown schematically in FIG. 23, there are cases where the divided end surface 302 is not perpendicular to the main surface but is inclined.

  As a result, when the appearance and dimensions of the individual ceramic substrates obtained by dividing are defective, or when the ceramic substrate is, for example, a multilayer ceramic substrate having internal electrodes, it is fatal such as exposure of internal electrodes. There is a problem that defects occur.

  In addition, the shallower the dividing groove that is the starting point of the break, the more likely it is to break diagonally, and conversely, if the dividing groove is too deep, the ceramic substrate may be unintentionally cracked during handling. There is.

Further, in recent years, a plate-like ferrite sintered body (ferrite sheet) in a state of a mother ceramic substrate is divided into a large number of pieces, and an electromagnetic wave blocking / absorbing material for blocking / absorbing electromagnetic waves, RFID, Used in NFC antenna devices. Such a ferrite sheet may be used with a holding sheet attached to one side or both sides as necessary. In addition to the case where one holding sheet is affixed for one piece, there is also a case where one holding sheet is affixed for a plurality of pieces.
In order to be able to divide the plate-like ferrite sintered body (ferrite sheet) into a large number of individual pieces, a dividing groove is formed on one surface thereof.

  However, in recent years, thinning of ferrite sintered bodies (ferrite sheets) used for such applications (for example, 200 μm thickness or less) has progressed, and it has become difficult to form divided grooves with an appropriate depth. If the dividing groove is too deep, the ferrite sheet will be divided before firing, and if it is too shallow, it will not be able to break correctly along the dividing groove, for example, it will break finely at the time of breaking and the characteristics will be reduced There are some problems.

JP 2001-338832 A JP 2005-15293 A JP 2007-165540 A

  The present invention solves the above problems, and when divided into individual substrates (ceramic substrates), it is possible to divide the substrate so that the divided end faces are perpendicular to the main surfaces of the individual substrates. Mother ceramic substrate capable of obtaining ceramic substrate with high shape accuracy, individual ceramic substrate obtained by dividing it, mother module component using the mother ceramic substrate, module obtained by dividing it An object of the present invention is to provide a component and a method for manufacturing a mother ceramic substrate.

In order to solve the above problems, the mother ceramic substrate of the present invention is
A mother ceramic substrate configured to be divided at a predetermined position and divided into a plurality of individual substrates,
A dividing groove for defining a dividing position is formed on one side main surface,
When the mother ceramic substrate of the other side main surface is viewed from the thickness direction, a protrusion is formed at a position corresponding to the position where the dividing groove is formed on the one side main surface.

  Moreover, in the mother ceramic substrate of the present invention, it is preferable that the individual substrates obtained after the division have internal conductors in such a manner that the individual substrates each have internal conductors.

  As described above, when the individual substrates obtained after the division are each configured to include an internal conductor, it is possible to efficiently manufacture a ceramic substrate including an internal conductor such as a circuit or an electrode.

  The ceramic substrate of the present invention is characterized in that it is the individual substrate obtained by dividing the mother ceramic substrate of the present invention along the dividing grooves.

Further, the mother module component of the present invention is characterized in that a surface mount component is mounted on each of the regions of the mother ceramic substrate of the present invention that will become individual substrates after division.

  The module component of the present invention is obtained by dividing the mother module component of the present invention along the dividing groove of the mother ceramic substrate.

In addition, the method for manufacturing the mother ceramic substrate of the present invention includes:
A method for producing the mother ceramic substrate of the present invention,
Using a first mold having a ridge formed on the surface and a second mold having a groove formed at a position facing the ridge of the first mold on the surface,
The surface of the first mold on which the protrusions are formed is brought into contact with one side main surface of the unfired mother ceramic substrate, and the groove portion of the second mold is formed on the other side main surface. The divided grooves are formed in the main surface on one side of the unfired mother ceramic substrate by bringing the formed surface into contact with each other and pressing the first die and the second die. And, the step of forming a ridge at a position corresponding to the position where the dividing groove of the one side main surface is formed when the mother ceramic substrate of the other side main surface is viewed from the thickness direction,
Firing the green mother ceramic substrate on which the dividing grooves and the protrusions are formed.

In addition, another method for manufacturing a mother ceramic substrate of the present invention includes:
A method for producing the mother ceramic substrate of the present invention,
A state in which the surface of the mold having the ridges formed thereon is in contact with one side main surface of the unfired mother ceramic substrate, and an elastic body is in contact with the other side main surface And then forming the dividing groove on one main surface of the unfired mother ceramic substrate, and the one main surface of the other main surface when the mother ceramic substrate is viewed from the thickness direction. Forming a ridge at a position corresponding to the position where the dividing groove is formed,
Firing the green mother ceramic substrate on which the dividing grooves and the protrusions are formed.

Further, another method for producing a mother ceramic substrate of the present invention includes:
A method for producing the mother ceramic substrate of the present invention,
The surface of the mold on which the ridges are formed is brought into contact with one side main surface of the unfired mother ceramic substrate, and a rigid body is arranged on the other side main surface via an elastic body. In the installed state, the one side main surface of the unfired mother ceramic substrate is formed with the dividing grooves, and the other side main surface of the mother ceramic substrate is viewed from the thickness direction when the mother ceramic substrate is viewed from the thickness direction. Forming a ridge at a position corresponding to the position where the dividing groove is formed on the main surface;
Firing the green mother ceramic substrate on which the dividing grooves and the protrusions are formed.

Further, another method for producing a mother ceramic substrate of the present invention includes:
A method for producing the mother ceramic substrate of the present invention,
The one side main surface of the unfired mother ceramic substrate is brought into contact with the surface on which the groove portion is formed, and the one side of the unfired mother ceramic substrate is pressed. Forming a ridge on the side main surface;
The dividing groove is formed at a position corresponding to a position on the other side main surface of the unfired mother ceramic substrate corresponding to the position where the protrusions are formed on the one side main surface when the mother ceramic substrate is viewed from the thickness direction. A process for performing the process,
Firing the green mother ceramic substrate on which the dividing grooves and the protrusions are formed.

In addition, the ceramic substrate of the present invention,
A ceramic substrate having a square planar shape and having one main surface and the other main surface,
Of the four sides of the other side main surface, at least one side has a ridge,
Of the four sides of the one side main surface, when the ceramic substrate is viewed from the thickness direction, the side of the side corresponding to the position where the convex line is formed on the other side main surface is chamfered. It is characterized by this.

  In the mother ceramic substrate of the present invention, a dividing groove for defining a dividing position is formed on one main surface, and a dividing groove on one main surface is formed on the other main surface when the mother ceramic substrate is viewed from the thickness direction. Since the protrusions are formed at positions corresponding to the positions, the following operational effects are obtained.

When dividing along the dividing groove, it can be divided substantially perpendicular to the main surface of the mother ceramic substrate.
When the mother ceramic substrate is divided, a force is applied to curve the mother ceramic substrate so that the dividing groove formed on the one side main surface becomes the starting point of the break.
At this time, stress can be concentrated on the bottom of the ridge (mountain) formed on the other main surface. As a result, when the mother ceramic substrate is divided, cracks that develop from the dividing grooves on the one side main surface are guided to the skirts of the ridges (mountains) at the opposing positions on the other side main surface.
And since the width | variety of a protruding item | line is small compared with the thickness of a mother ceramic substrate, as shown to Fig.5 (a), as shown in Fig.5 (a), the division | segmentation end surface (ceramic after division | segmentation) of the mother ceramic substrate 1 divided | segmented by the crack C extending | stretching 31a (which is also the end face of the substrate) is substantially perpendicular to the main surface of the mother ceramic substrate.

  In the mother ceramic substrate of the present invention, the dividing grooves are formed on the one side main surface and the ridges are provided on the other side main surface. Therefore, the depth of the dividing grooves and the height of the ridges are about several μm. Even in this case (that is, without depending on the depth of the dividing groove), it can be surely divided (broken) substantially perpendicular to the main surface of the mother ceramic substrate.

  Moreover, since the dividing groove can be made shallow, it is possible to prevent the mother ceramic substrate from being unintentionally divided during handling before firing.

The mother ceramic substrate is used for, for example, an electromagnetic wave blocking / absorbing material for blocking / absorbing electromagnetic waves, or a ceramic substrate (ferrite individual substrate) as a ferrite sheet used in an RFID or NFC antenna device. Even in some cases, the split end faces are vertical, so when handling in the assembled state after splitting, the end faces of the ferrite substrate are rubbed and lead to generation of dust due to the generation of ferrite powder (dusting). There is nothing.
In addition, for example, when the other main surface on which the ridges are formed is attached to a holding film (adhesive tape), the ridges bite into the holding film as anchors. It is possible to improve the reliability by suppressing falling off during bending.

  Further, the ceramic substrate of the present invention is an individual substrate (ceramic substrate) obtained by dividing the mother ceramic substrate of the present invention along the dividing groove, and the divided end surface is the main surface (= individual surface) of the mother ceramic substrate. It is perpendicular to the main surface of the ceramic substrate), has high shape accuracy, and can be widely used in various applications.

  In addition, since the mother module component of the present invention has surface-mounted components mounted on each of the regions of the mother ceramic substrate of the present invention that become individual substrates after the division, it is easy to divide along the dividing groove. And reliable module parts can be obtained reliably.

Further, in the method for manufacturing a mother ceramic substrate according to the present invention, the groove is formed at a position where the first mold having the protrusions formed on the surface and the protrusions of the first mold on the surface are opposed to each other. Using the second mold, the surface on which the protruding portion of the first mold is formed is brought into contact with one side main surface of the unfired mother ceramic substrate, and the second mold is formed on the other side main surface. Since the surface where the groove portion of the mold is formed is brought into contact and pressing is performed by the first mold and the second mold, a split groove is formed on one side main surface, and the other side main surface is formed. An unfired mother ceramic substrate in which ridges are formed at positions on the surface corresponding to the positions at which the dividing grooves are formed can be reliably produced.
And by firing this unfired mother ceramic substrate, it is sintered, and the mother ceramic substrate having a split groove on one side main surface and a ridge on the other side main surface is efficiently and reliably obtained. Can be manufactured.

In addition, as in the other method of manufacturing a mother ceramic substrate of the present invention, the surface on which the convex portion of the mold is formed is brought into contact with one side main surface of the unfired mother ceramic substrate, and the other side main surface is contacted. Even when the hydrostatic pressing is performed in a state where the elastic body is in contact, a position corresponding to the position where the dividing groove is formed on the one side main surface and the dividing groove is formed on the other side main surface. It is possible to reliably produce an unfired mother ceramic substrate with ridges formed on it, and by firing this, it has been sintered and has a split groove on one side main surface, and the other side main surface A mother ceramic substrate provided with ridges can be manufactured efficiently and reliably.
The ridges are formed on the other side main surface at positions corresponding to the positions where the dividing grooves are formed on the one side main surface by the pressure applied to the mother ceramic substrate from the ridges of the mold. This is because the split groove is formed, the force is transmitted to the other main surface, and the ridge is formed.

  Further, as in still another method of manufacturing a mother ceramic substrate according to the present invention, a surface on which a convex strip portion of a mold in which a convex strip portion is formed is formed on one side main surface of an unfired mother ceramic substrate. Even when pressing is performed in a state where a rigid body is disposed on the other side main surface via an elastic body, a split groove is formed on the one side main surface, and the other side main surface is It becomes possible to reliably produce an unfired mother ceramic substrate in which protrusions are formed at positions corresponding to the positions where the dividing grooves are formed. A mother ceramic substrate having a split groove on the surface and a ridge on the other main surface can be produced efficiently and reliably.

  Further, as in still another method of manufacturing a mother ceramic substrate according to the present invention, the surface of the mold on which the groove is formed is brought into contact with the main surface on one side of the unfired mother ceramic substrate. After pressing and forming a ridge on one main surface of the mother ceramic substrate, processing (groove forming processing) (for example, cutting processing) for forming split grooves on the other main surface is performed. In this case, the unfired mother ceramic substrate in which the dividing grooves are formed on the one side main surface and the protrusions are formed at the positions corresponding to the positions where the dividing grooves are formed on the other side main surface is ensured. It becomes possible to produce, and by firing this, a mother ceramic substrate that has been sintered, has a split groove on one side main surface, and has a ridge on the other side main surface can be efficiently and reliably obtained. Can be manufactured.

  In the present invention, the dividing grooves and the ridges are preferably V-shaped (inverted V-shaped), but may be other shapes such as U-shaped (inverted U-shaped).

In one Embodiment (Embodiment 1) of this invention, it is a figure which shows the state which located the mother ceramic green sheet (unbaked mother ceramic substrate) between the 1st metal mold | die and the 2nd metal mold | die. In Embodiment 1 of this invention, it is a figure which shows the state which is pressing the unbaked mother ceramic substrate with the 1st metal mold | die and the 2nd metal mold | die. (A) In Embodiment 1 of this invention, the figure which shows the state which isolate | separated the 1st metal mold | die and the 2nd metal mold | die from the mother ceramic substrate after a press, (b) is a plane of the mother ceramic substrate after a press FIG. It is a figure which shows the 1st metal mold | die used in Embodiment 1 of this invention. It is a figure which shows the 2nd metal mold | die used in Embodiment 1 of this invention. (A) is a figure explaining the mechanism by which the mother ceramic substrate is divided in the embodiment 1 of the present invention in such a manner that the divided end face is perpendicular to the main surface along the dividing groove, and (b) is It is a figure which shows the state by which the mother ceramic substrate was divided | segmented into each ceramic substrate. (A) is the figure which shows the state which affixed the holding | maintenance film on the other side main surface in which the protruding item | line of the mother ceramic substrate was formed, (b) is divided | segmented the mother ceramic substrate of the state of (a) along a division | segmentation groove | channel. The figure which showed the state which carried out, (c) is a figure which shows the state which curved the ceramic substrate as an aggregate | assembly hold | maintained on the holding film with the holding film. It is sectional drawing which shows the mother ceramic substrate provided with the internal electrode produced in Embodiment 3 of this invention. In other embodiment (Embodiment 2) of this invention, it is a figure which shows the state which isolate | separated the 1st metal mold | die and the 2nd metal mold | die from the mother ceramic substrate after a press. In Embodiment 2, it is a figure which shows the state by which the mother ceramic substrate was divided | segmented into each ceramic substrate. It is a perspective view which shows the structure of the module component manufactured with the manufacturing method of the module component concerning Embodiment 3 of this invention. In Embodiment 3 of this invention, it is a perspective view which shows the pattern formation sheet which has arrange | positioned the conductor pattern to the ceramic green sheet. It is a perspective view which shows the state which laminated | stacked the pattern formation sheet of FIG. 11 in the predetermined order. It is a perspective view which shows the laminated body (unbaked mother ceramic substrate) obtained by crimping | bonding the laminated body which laminated | stacked the pattern formation sheet of FIG. It is a perspective view which shows the state which pressed the unbaked mother ceramic substrate of FIG. 13 with the 1st metal mold | die and the 2nd metal mold | die, and formed the division groove | channel on the one side main surface, and the protruding item | line on the other side main surface. . It is a perspective view which shows the state which mounted the surface mounting component in the mother ceramic substrate of FIG. 14 which formed the division groove | channel on the one side main surface, and formed the protruding item | line on the other side main surface. It is a perspective view which shows typically the state which broke the mother ceramic board | substrate after baking and was divided | segmented into each module component. In this invention, it is a figure which shows the other 1st method for forming a groove | channel and a protruding item | line. In this invention, it is a figure which shows the other 2nd method for forming a groove | channel and a protruding item | line. In this invention, it is a figure which shows 1 process of the other 3rd method for forming a groove | channel and a protruding item | line. In this invention, in the other 3rd method for forming a groove | channel and a protruding item | line, it is a figure which shows the state which formed the protruding item | line on one main surface of the mother ceramic substrate. In this invention, in the other 3rd method for forming a groove | channel and a protruding item | line, it is a figure which shows the state which formed the division | segmentation groove | channel in the other main surface of the mother ceramic substrate. (A) is a front view which shows the division | segmentation method of the conventional mother board | substrate, (b) is a top view. It is a figure which shows the problem of the division | segmentation method of the conventional mother board | substrate.

  Embodiments of the present invention will be described below to describe the features of the present invention in more detail.

[Embodiment 1]
In the first embodiment, a method for manufacturing a ceramic substrate (ferrite substrate) using a magnetic ceramic as a ceramic material will be described.

  (1) First, a ceramic raw material slurry was prepared by mixing, dissolving and dispersing a magnetic ceramic powder (ferrite powder in this embodiment 1), a binder resin, and an organic solvent, followed by defoaming.

Then, this ceramic raw material slurry was formed into a sheet shape by a known method such as a doctor blade method and dried to prepare a mother ceramic green sheet having a thickness of 200 μm.
The mother ceramic green sheet may be a laminate in which a plurality of ceramic green sheets are laminated.

  Then, the obtained mother ceramic green sheet was cut into a predetermined size to obtain a cut mother ceramic green sheet which is an unfired mother ceramic substrate in the present invention.

  (2) Next, as shown in FIG. 1, a mother ceramic green sheet (unfired mother ceramic substrate) 1 cut to a predetermined size is formed on the surface 10a of the first protrusion 11 formed on the surface. It was positioned between the mold 10 and the second mold 20 having the groove portion 21 formed on the surface 20a, and was pressed by the first mold 10 and the second mold 20 as shown in FIG. Thereby, the mother ceramic substrate 1 (1A) (FIG. 3) after pressing in which the dividing grooves 3 were formed on the one side main surface 2a and the protrusions 4 were formed on the other side main surface 2b was obtained.

  In this embodiment, as shown in FIG. 4A, the first mold 10 is formed with a chevron-shaped protrusion 11 having a height of about 5 μm and a width of about 20 μm in a lattice shape on the surface 10a. The structure with the same structure was used.

  As shown in FIG. 4B, the second mold 20 has a structure in which a V-shaped groove portion 21 having a depth of about 5 μm and a width of about 20 μm is formed in a lattice shape on the surface 20a. Was used.

  When pressing using the first mold 10 and the second mold 20, when the mother ceramic substrate 1 is viewed from the thickness direction, the protrusions formed on the surface 10 a of the first mold 10. The first mold 10 and the second mold 20 so that the V-shaped groove portion 21 formed on the surface 20a of the second mold 20 is located at a position corresponding to the position where 11 is formed. The press was performed by adjusting the positional relationship (see FIG. 2).

  (3) Then, the mother ceramic substrate 1 (1A) after pressing was fired at 950 ° C. to obtain a sintered mother ceramic substrate (ferrite sintered substrate) 1 (1B).

  (4) Next, the mother ceramic substrate 1 (1B) that had been sintered was subjected to a dividing process by a method such as roller break, and divided along the dividing grooves 3. At this time, as shown to Fig.5 (a), the crack C which generate | occur | produced in the division | segmentation groove | channel 3 of the one side main surface 2a extends toward the skirt of the protruding item | line 4 of the other side main surface 2b.

  Since the width of the ridges 4 is smaller than the thickness of the mother ceramic substrate 1 (1B), the split end surface 31a of the ceramic substrate 31 obtained after the crack C is split to extend is the main surface of the ceramic substrate 31. It is almost perpendicular to the surface (= the main surface 2a of the mother ceramic green sheet and the main surface 2b of the other side).

  As a result, by dividing the mother ceramic substrate 1 (1B) along the dividing groove 3, the divided end surface 31a becomes the main surface of the ceramic substrate 31 (= the one main surface 2a and the other main surface 2b of the mother ceramic green sheet). ) Is obtained (see FIG. 5B).

At this time, in the ceramic substrate 31 shown in FIG. 5B, the left and right ridge portions of the one-side main surface (upper surface) are divided by the above-described dividing groove 3a (FIG. 5A) at the deepest portion. The formed chamfered shape is formed, and the above-mentioned protrusion 4 is present at one end (the left end in FIG. 5B) of the other main surface (lower surface). In addition, as described above, the above-described protrusion 4 is present only in one end portion (left end portion in FIG. 5B), as described above, in the split groove 3 on the one-side main surface 2a. This is because the crack C extends toward the skirt of the ridge 4 on the other side main surface 2b.
However, when the crack C extends in such a manner that the ridge 4 is divided into a main part and the remaining part, one end of the other main surface (lower surface) and the other side A part of the divided ridges 4 may be present at each end.

  In the mother ceramic substrate 1 (1B) of the present invention, the dividing groove 3 is formed on the one side main surface 2a, and the protrusion 4 is provided on the other side main surface 2b. Even if the height of the ridge 4 is about several μm, it is surely divided (broken) substantially perpendicular to the main surface (one main surface 2a, the other main surface 2b) of the mother ceramic substrate 1 (1B). can do.

  Thus, the ceramic substrate 31 obtained by dividing the mother ceramic substrate 1 (1B) has a divided end surface 31a perpendicular to the main surface of each ceramic substrate 31, has high shape accuracy, and is widely used for various applications. It is something that can be done.

Moreover, as shown to Fig.6 (a), the adhesive tape which functions as a holding film, for example on the other side main surface 2b which is the surface in which the protruding item | line 4 of the sintered mother ceramic substrate 1 (1B) was formed. In the state where 5 is pasted, for example, a dividing process is performed by a method such as a roller break, and it is divided along the dividing groove 3 (FIG. 6 (b)). A ceramic substrate 31 perpendicular to the main surface can also be obtained. Each of these ceramic substrates 31 (individual substrates) can be suitably used as a magnetic ceramic substrate for an RFID or NFC antenna device.
In addition, it is also possible to use the adhesive tape 5 functioning as a holding film as it is stuck without being peeled off. In that case, a ceramic substrate 31 that can be used as a ferrite sheet that is held in a collective state on the holding film 5 and has flexibility as a whole can be obtained. The ceramic substrate 31 as such a ferrite sheet can be suitably used as an electromagnetic wave blocking / absorbing material for blocking / absorbing electromagnetic waves.
In any of the above cases, the ceramic substrate 31 as an aggregate in which a plurality is held on the holding film 5 in an aggregated state, for example, as shown in FIG. It is conceivable that the whole is curved or deformed into a spherical shape, either intentionally or unintentionally. Even in this case, when the holding film 5 is bent, the end faces (divided end faces) of the individual ceramic substrates (ferrite substrates) 31 are rubbed, and ferrite powder is generated (powdered), which may cause dust generation. Absent. Accordingly, it can be suitably used for an electromagnetic wave shielding / absorbing material, an RFID or NFC antenna device, and the like.

[Embodiment 2]
In the second embodiment, a method for manufacturing a ceramic substrate (multilayer ceramic substrate) using a low-temperature sintered ceramic as a ceramic material will be described.

  (1) First, glass ceramic powder (low-temperature sintered ceramic powder), a binder resin, and an organic solvent were mixed, dissolved and dispersed, and then defoamed to prepare a ceramic raw material slurry.

  Then, the ceramic raw material slurry was formed into a sheet by a known method such as a doctor blade method and dried to produce a plurality of mother ceramic green sheets having a thickness of 50 μm.

  Next, the ceramic raw material slurry was formed into a sheet shape by a known method such as a doctor blade method and dried to prepare a plurality of single mother ceramic green sheets having a thickness of 50 μm.

  Then, the obtained mother ceramic green sheet was cut into a predetermined size, and an internal electrode forming conductive paste (Ag paste) was screen printed on each to form an internal electrode pattern. Note that a mother ceramic green sheet provided with via conductors (one type of internal electrodes) can be formed by forming through holes in the mother ceramic green sheet as required and filling with a conductive paste.

  Subsequently, the mother ceramic green sheets provided with the internal electrode patterns are laminated in a predetermined order, whereby a non-fired mother ceramic substrate provided with the internal electrodes 6 (lamination of the mother ceramic green sheets) as shown in FIG. Body) 1 was obtained.

  (2) Then, the mother ceramic substrate 1 is pressed by the same method using the same mold as in the first embodiment, and the divided grooves 3 are formed on the one-side main surface 2a as shown in FIG. As a result, a mother ceramic substrate 1 (1A) after pressing having the ridges 4 formed on the other main surface 2b was obtained. FIG. 8 shows a state where the first mold 10 and the second mold 20 are separated from the mother ceramic substrate 1 (1A) after pressing.

  (3) Then, the mother ceramic substrate 1 (1A) after pressing was fired at 900 ° C. to obtain a sintered mother ceramic substrate 1 (1B).

(4) Next, by dividing the sintered mother ceramic substrate 1 (1B) by a method such as roller break and dividing along the dividing grooves 3, for example, as shown in FIG. Individual ceramic substrates (multilayer ceramic substrates) 31 were obtained.
In addition, as shown in FIG. 9, the ceramic substrate (multilayer ceramic substrate) 31 obtained by dividing the mother ceramic substrate 1 (1B) described above has divided end surfaces (end surfaces of the ceramic substrate 31) 31a as individual ceramic substrates. It is perpendicular to the main surface 31 and has high shape accuracy and can be widely used in various applications.

[Embodiment 3]
In the third embodiment, as shown in FIG. 10, a method of manufacturing a module component 150 in which a surface mount component 151 is mounted on a ceramic substrate (multilayer ceramic substrate) 1 having a surface conductor, an internal conductor, a via conductor, and the like. explain.

  (1) First, a ceramic green sheet (low-temperature sintered ceramic green sheet) 1 is prepared by the same method as in the second embodiment, and the obtained ceramic green sheet 1 becomes, for example, a surface conductor or an internal conductor. Conductive pattern formation, via hole formation, filling of the via hole with a conductive material serving as a via conductor, and the like are performed to produce a pattern forming sheet 101a having a necessary conductive pattern 140 as shown in FIG.

  (2) Then, the pattern forming sheet 101a provided with the conductor pattern 140 is laminated in a predetermined order (FIG. 12), the obtained laminated body is put in a bag, deaerated, sealed, and kept at a predetermined temperature. After heating, the laminate (unfired mother ceramic substrate) 1 to which each pattern forming sheet 101a was pressure-bonded was obtained by performing an isostatic pressing, as shown in FIG.

  (3) Then, as shown in FIG. 14, the unfired mother ceramic substrate 1 is pressed by the same method using the same mold as in the first and second embodiments, and divided into the one-side main surface 2a. The mother ceramic substrate 1 (1A) after pressing in which the grooves 3 were formed and the protrusions 4 were formed on the other main surface 2b was obtained.

  (4) Next, the mother ceramic substrate 1 (1A) after pressing was fired at 900 ° C. to obtain a sintered mother ceramic substrate 1 (1B).

(5) Then, each surface-mounted component 151 was mounted on each area of the sintered mother ceramic substrate 1 (1B) (FIG. 15) to be the individual ceramic substrate 31 after firing.
As the surface mount component 151, for example, an IC chip, a multilayer ceramic capacitor, a chip inductor, a chip resistor, or the like is mounted.

  (6) Then, the mother ceramic substrate 1 (1B) on which the surface mount component 151 was mounted on each ceramic substrate was divided along the dividing grooves 3 (FIG. 16). As a result, individual module components 150 in which the surface-mounted components 151 are mounted on each ceramic substrate (multilayer ceramic substrate) 31 with the divided end surface 31a perpendicular to the main surface and high in dimensional accuracy and shape accuracy are obtained.

  In the case of the ceramic substrate (multilayer ceramic substrate) 31 shown in FIG. 16 as well, the left and right ridges on one main surface (upper surface) are divided at the deepest portion of the above-described dividing groove 3a (see FIG. 5A). As a result, a chamfered shape is formed (see FIG. 5 (b)), and one end of the other main surface (lower surface) (the left end in FIG. 5 (b)) Although the above-mentioned ridge 4 exists, in FIG. 16, the chamfered shape of the ridge and the ridge on the other side main surface (lower surface) are omitted.

  In the third embodiment, the module component in which the surface mount type electronic component is mounted on the multilayer ceramic substrate has been described as an example. However, in the present invention, the surface mount type electronic component is mounted on the single layer ceramic substrate. The present invention can also be applied when manufacturing module parts.

  According to the method of the third embodiment, it is possible to efficiently manufacture a module component in which a surface mount component is mounted on a ceramic substrate having high dimensional accuracy and shape accuracy.

[Embodiment 4]
In the first, second, and third embodiments described above, the first mold in which the ridges are formed and the second mold in which the grooves are formed are used to divide the main surface on one side of the mother ceramic substrate. Grooves are formed on the main surface of the other side, but also by the method described below, split grooves are formed on the main surface of one side of the mother ceramic substrate, and protrusions are formed on the main surface of the other side. It is possible.

(1) Another first method for forming grooves and ridges As shown schematically in FIG. 17, the ridges 51 are formed on one main surface 2 a of the unfired mother ceramic substrate 1. The entire mold 50 is accommodated in the bag-like member 53 in a state where the surface on which the ridges 51 are formed is brought into contact, and the hydrostatic press elastic body 52 is brought into contact with the other main surface 2b. Then, hydrostatic pressure pressurizing in water is performed. Thereby, the dividing groove 3 is formed at a position corresponding to the convex portion 51 of the one-side main surface 2a of the unfired mother ceramic substrate 1 by the pressing pressure by the convex portion 51, and the unfired mother ceramic substrate. 1 is formed on the other main surface 2b.
It is also possible to cause the bag-like member 53 to function as the hydrostatic press elastic body 52 and perform the hydrostatic press without using the hydrostatic press elastic body 52. There are no particular restrictions on the method.

  Also in this method, the dividing groove 3 that defines the dividing position is formed on the one-side main surface 2a of the unfired mother ceramic substrate 1, and the unfired mother ceramic substrate 1 on the other-side main surface 2b is formed. When viewed from the thickness direction, it is possible to form the mother ceramic substrate 1 having the ridges 4 at positions corresponding to the positions where the dividing grooves 3 of the one-side main surface 2a are formed.

(2) Another Second Method for Forming Grooves and Convex Lines As schematically shown in FIG. 18, a convex line part 51 is formed on one side main surface 2 a of the unfired mother ceramic substrate 1. Further, pressing is performed in a state in which the surface of the metal mold 50 on which the ridges 51 are formed is brought into contact, and the rigid body 63 is disposed on the other main surface 2b via the elastic body 62.

  Also in this method, the dividing groove 3 that defines the dividing position is formed on the one-side main surface 2a of the unfired mother ceramic substrate 1, and the unfired mother ceramic substrate 1 on the other-side main surface 2b is formed. When viewed from the thickness direction, it is possible to form the mother ceramic substrate 1 having the ridges 4 at positions corresponding to the positions where the dividing grooves 3 of the one-side main surface 2a are formed.

(3) Another third method for forming grooves and ridges As shown in FIG. 19, on the other main surface 2b of the unfired mother ceramic substrate 1 placed on a flat rigid body 63, As shown in FIG. 20, the other main surface of the unfired mother ceramic substrate 1 is brought into contact with the surface on which the groove 61 is formed by pressing the mold 60 on which the groove 61 is formed. The ridge 4 is formed on 2b.

Then, as shown in FIG. 21, a groove forming process is performed on the one-side main surface 2a of the unfired mother ceramic substrate 1, and the unfired mother ceramic on the one-side main surface 2a of the unfired mother ceramic substrate 1 is formed. When the substrate 1 is viewed from the thickness direction, the dividing groove 3 is formed at a position corresponding to the position where the protrusion 4 of the other side main surface 2b is formed.
A method such as cutting or laser processing can be applied to the groove forming process.

  Also in this method, the dividing groove 3 that defines the dividing position is formed on the one-side main surface 2a of the unfired mother ceramic substrate 1, and the unfired mother ceramic substrate 1 on the other-side main surface 2b is formed. When viewed from the thickness direction, it is possible to form the mother ceramic substrate 1 having the ridges 4 at positions corresponding to the positions where the dividing grooves 3 of the one-side main surface 2a are formed.

  Moreover, although the said embodiment demonstrated as an example the case where a division | segmentation groove | channel and a protruding item | line are V-shaped (inverted V-shaped), a division | segmentation groove | channel and a protruding item | line are U-shaped (reverse U-shaped) etc. Other shapes are possible.

  The present invention is not limited to the above embodiment, but the size and shape of the ceramic substrate to be manufactured, the method of forming grooves and ridges on the unfired mother ceramic substrate in the manufacturing process, and the type of apparatus used therefor, With respect to a method for breaking a sintered mother ceramic substrate, various applications and modifications can be made within the scope of the invention.

DESCRIPTION OF SYMBOLS 1 Mother ceramic substrate 1 (1A) Mother ceramic substrate 1 provided with dividing grooves and ridges 1 (1B) Sintered mother ceramic substrate 2a One side main surface of mother ceramic substrate 2b The other side main surface 3 Dividing grooves 4 ridges 5 Adhesive tape (holding film)
6 internal electrode 10 first mold 10a surface of first mold 11 ridge 20 second mold 20a surface of second mold 21 groove 31 ceramic substrate 31a split end surface (end surface of ceramic substrate)
DESCRIPTION OF SYMBOLS 50 Metal mold | die 51 Convex section 52 Elastic body for isostatic pressing 53 Bag-shaped member 60 Mold 61 Groove part 62 Elastic body 63 Rigid body 101a Pattern formation sheet 140 Conductive pattern 150 Module component 151 Surface mount component C Crack

  The present invention relates to a mother ceramic substrate configured to be divided at a predetermined position into a plurality of individual substrates, a ceramic substrate obtained by dividing the mother ceramic substrate, and the mother ceramic substrate. The present invention relates to a mother module component used, a module component obtained by dividing the mother module component, and a method of manufacturing a mother ceramic substrate.

  In manufacturing a ceramic substrate, a method of dividing a mother ceramic substrate after firing and dividing it into individual ceramic substrates is widely used.

  As a method for dividing the fired mother ceramic substrate into individual ceramic substrates having a predetermined size, for example, Patent Document 1 discloses that a press plate having protrusions that are continuous in a lattice shape at the dividing position is used. A method is described in which grooves are formed in a grid pattern at the dividing positions of the mother ceramic laminate by pressing, and after firing, the fired mother ceramic laminate is divided along the grooves to obtain a multilayer ceramic substrate. .

  In Patent Document 2, at least one continuous groove is provided on a sintered ferrite substrate having an adhesive layer on one surface, and a sintered ferrite substrate that can be divided starting from the continuous groove is formed. A method of dividing the ceramic substrate into individual ceramic substrates is disclosed.

  Further, in Patent Document 3, a shrinkage-suppressing green sheet is arranged on both surfaces of a laminate formed by laminating a plurality of substrate green sheets, and at least one of the shrinkage-suppressing green sheets has a dividing groove on the surface. Using a shrinkage-suppressing green sheet on which a split groove forming pattern serving as a reference for the formation position is formed, and using the split groove forming pattern of the shrinkage suppressing green sheet, a split groove for dividing the substrate is formed on the surface of the laminate. A method of manufacturing a multilayer ceramic substrate by forming, firing, and dividing along a dividing groove is disclosed.

  However, in the methods disclosed in the above Patent Documents 1 to 3, as shown in FIGS. 22A and 22B, the breaking groove 301 for breaking is formed on the surface 300 a on one side of the mother substrate 300. However, the mother substrate 300 is configured to break from the dividing groove as a starting point, and since there is a breaking starting point only on one surface of the mother substrate, the dividing end surface 302 is formed on the surface 300a of the mother substrate 300 as intended. It is difficult to divide the mother substrate 300 so as to be vertical, and as shown schematically in FIG. 23, there are cases where the divided end surface 302 is not perpendicular to the main surface but is inclined.

  As a result, when the appearance and dimensions of the individual ceramic substrates obtained by dividing are defective, or when the ceramic substrate is, for example, a multilayer ceramic substrate having internal electrodes, it is fatal such as exposure of internal electrodes. There is a problem that defects occur.

  In addition, the shallower the dividing groove that is the starting point of the break, the more likely it is to break diagonally, and conversely, if the dividing groove is too deep, the ceramic substrate may be unintentionally cracked during handling. There is.

Further, in recent years, a plate-like ferrite sintered body (ferrite sheet) in a state of a mother ceramic substrate is divided into a large number of pieces, and an electromagnetic wave blocking / absorbing material for blocking / absorbing electromagnetic waves, RFID, Used in NFC antenna devices. Such a ferrite sheet may be used with a holding sheet attached to one side or both sides as necessary. In addition to the case where one holding sheet is affixed for one piece, there is also a case where one holding sheet is affixed for a plurality of pieces.
In order to be able to divide the plate-like ferrite sintered body (ferrite sheet) into a large number of individual pieces, a dividing groove is formed on one surface thereof.

  However, in recent years, thinning of ferrite sintered bodies (ferrite sheets) used for such applications (for example, 200 μm thickness or less) has progressed, and it has become difficult to form divided grooves with an appropriate depth. If the dividing groove is too deep, the ferrite sheet will be divided before firing, and if it is too shallow, it will not be able to break correctly along the dividing groove, for example, it will break finely at the time of breaking and the characteristics will be reduced There are some problems.

JP 2001-338832 A JP 2005-15293 A JP 2007-165540 A

  The present invention solves the above problems, and when divided into individual substrates (ceramic substrates), it is possible to divide the substrate so that the divided end faces are perpendicular to the main surfaces of the individual substrates. Mother ceramic substrate capable of obtaining ceramic substrate with high shape accuracy, individual ceramic substrate obtained by dividing it, mother module component using the mother ceramic substrate, module obtained by dividing it An object of the present invention is to provide a component and a method for manufacturing a mother ceramic substrate.

In order to solve the above problems, the mother ceramic substrate of the present invention is
A mother ceramic substrate configured to be divided at a predetermined position and divided into a plurality of individual substrates,
A dividing groove for defining a dividing position is formed on one side main surface,
On the other side main surface, when the mother ceramic substrate is viewed from the thickness direction , a ridge that projects the mother ceramic substrate itself is formed at a position corresponding to the position where the dividing groove is formed on the one side main surface. It is characterized by being.

  Moreover, in the mother ceramic substrate of the present invention, it is preferable that the individual substrates obtained after the division have internal conductors in such a manner that the individual substrates each have internal conductors.

  As described above, when the individual substrates obtained after the division are each configured to include an internal conductor, it is possible to efficiently manufacture a ceramic substrate including an internal conductor such as a circuit or an electrode.

  The ceramic substrate of the present invention is characterized in that it is the individual substrate obtained by dividing the mother ceramic substrate of the present invention along the dividing grooves.

Further, the mother module component of the present invention is characterized in that a surface mount component is mounted on each of the regions of the mother ceramic substrate of the present invention that will become individual substrates after division.

  The module component of the present invention is obtained by dividing the mother module component of the present invention along the dividing groove of the mother ceramic substrate.

In addition, the method for manufacturing the mother ceramic substrate of the present invention includes:
A method for producing the mother ceramic substrate of the present invention,
Using a first mold having a ridge formed on the surface and a second mold having a groove formed at a position facing the ridge of the first mold on the surface,
The surface of the first mold on which the protrusions are formed is brought into contact with one side main surface of the unfired mother ceramic substrate, and the groove portion of the second mold is formed on the other side main surface. The divided grooves are formed in the main surface on one side of the unfired mother ceramic substrate by bringing the formed surface into contact with each other and pressing the first die and the second die. And, when the mother ceramic substrate on the other side main surface is viewed from the thickness direction, a ridge from which the mother ceramic substrate itself protrudes at a position corresponding to the position where the dividing groove is formed on the one side main surface. Forming, and
Firing the green mother ceramic substrate on which the dividing grooves and the protrusions are formed.

In addition, another method for manufacturing a mother ceramic substrate of the present invention includes:
A method for producing the mother ceramic substrate of the present invention,
A state in which the surface of the mold having the ridges formed thereon is in contact with one side main surface of the unfired mother ceramic substrate, and an elastic body is in contact with the other side main surface And then forming the dividing groove on one main surface of the unfired mother ceramic substrate, and the one main surface of the other main surface when the mother ceramic substrate is viewed from the thickness direction. Forming a protrusion on which the mother ceramic substrate itself protrudes at a position corresponding to the position where the dividing groove is formed,
Firing the green mother ceramic substrate on which the dividing grooves and the protrusions are formed.

Further, another method for producing a mother ceramic substrate of the present invention includes:
A method for producing the mother ceramic substrate of the present invention,
The surface of the mold on which the ridges are formed is brought into contact with one side main surface of the unfired mother ceramic substrate, and a rigid body is arranged on the other side main surface via an elastic body. In the installed state, the one side main surface of the unfired mother ceramic substrate is formed with the dividing grooves, and the other side main surface of the mother ceramic substrate is viewed from the thickness direction when the mother ceramic substrate is viewed from the thickness direction. Forming a ridge from which the mother ceramic substrate itself protrudes at a position corresponding to the position where the dividing groove is formed on the main surface;
Firing the green mother ceramic substrate on which the dividing grooves and the protrusions are formed.

Further, another method for producing a mother ceramic substrate of the present invention includes:
A method for producing the mother ceramic substrate of the present invention,
The one side main surface of the unfired mother ceramic substrate is brought into contact with the surface on which the groove portion is formed, and the one side of the unfired mother ceramic substrate is pressed. On the side main surface, forming a protrusion from which the mother ceramic substrate itself protrudes ;
The dividing groove is formed at a position corresponding to a position on the other side main surface of the unfired mother ceramic substrate corresponding to the position where the protrusions are formed on the one side main surface when the mother ceramic substrate is viewed from the thickness direction. A process for performing the process,
Firing the green mother ceramic substrate on which the dividing grooves and the protrusions are formed.

In addition, the ceramic substrate of the present invention,
A ceramic substrate having a square planar shape and having one main surface and the other main surface,
Of the four sides of the other side main surface, at least one side has a ridge from which the ceramic substrate itself protrudes ,
Of the four sides of the one side main surface, when the ceramic substrate is viewed from the thickness direction, the side of the side corresponding to the position where the convex line is formed on the other side main surface is chamfered. It is characterized by this.

In the mother ceramic substrate of the present invention, a dividing groove for defining a dividing position is formed on one main surface, and a dividing groove on one main surface is formed on the other main surface when the mother ceramic substrate is viewed from the thickness direction. Since the protrusions from which the mother ceramic substrate itself protrudes are formed at positions corresponding to the above positions, the following operational effects can be obtained.

When dividing along the dividing groove, it can be divided substantially perpendicular to the main surface of the mother ceramic substrate.
When the mother ceramic substrate is divided, a force is applied to curve the mother ceramic substrate so that the dividing groove formed on the one side main surface becomes the starting point of the break.
At this time, stress can be concentrated on the bottom of the ridge (mountain) formed on the other main surface. As a result, when the mother ceramic substrate is divided, cracks that develop from the dividing grooves on the one side main surface are guided to the skirts of the ridges (mountains) at the opposing positions on the other side main surface.
And since the width | variety of a protruding item | line is small compared with the thickness of a mother ceramic substrate, as shown to Fig.5 (a), as shown in Fig.5 (a), the division | segmentation end surface (ceramic after division | segmentation) of the mother ceramic substrate 1 divided | segmented by the crack C extending | stretching 31a (which is also the end face of the substrate) is substantially perpendicular to the main surface of the mother ceramic substrate.

  In the mother ceramic substrate of the present invention, the dividing grooves are formed on the one side main surface and the ridges are provided on the other side main surface. Therefore, the depth of the dividing grooves and the height of the ridges are about several μm. Even in this case (that is, without depending on the depth of the dividing groove), it can be surely divided (broken) substantially perpendicular to the main surface of the mother ceramic substrate.

  Moreover, since the dividing groove can be made shallow, it is possible to prevent the mother ceramic substrate from being unintentionally divided during handling before firing.

The mother ceramic substrate is used for, for example, an electromagnetic wave blocking / absorbing material for blocking / absorbing electromagnetic waves, or a ceramic substrate (ferrite individual substrate) as a ferrite sheet used in an RFID or NFC antenna device. Even in some cases, the split end faces are vertical, so when handling in the assembled state after splitting, the end faces of the ferrite substrate are rubbed and lead to generation of dust due to the generation of ferrite powder (dusting). There is nothing.
In addition, for example, when the other main surface on which the ridges are formed is attached to a holding film (adhesive tape), the ridges bite into the holding film as anchors. It is possible to improve the reliability by suppressing falling off during bending.

  Further, the ceramic substrate of the present invention is an individual substrate (ceramic substrate) obtained by dividing the mother ceramic substrate of the present invention along the dividing groove, and the divided end surface is the main surface (= individual surface) of the mother ceramic substrate. It is perpendicular to the main surface of the ceramic substrate), has high shape accuracy, and can be widely used in various applications.

  In addition, since the mother module component of the present invention has surface-mounted components mounted on each of the regions of the mother ceramic substrate of the present invention that become individual substrates after the division, it is easy to divide along the dividing groove. And reliable module parts can be obtained reliably.

Further, in the method for manufacturing a mother ceramic substrate according to the present invention, the groove is formed at a position where the first mold having the protrusions formed on the surface and the protrusions of the first mold on the surface are opposed to each other. Using the second mold, the surface on which the protruding portion of the first mold is formed is brought into contact with one side main surface of the unfired mother ceramic substrate, and the second mold is formed on the other side main surface. Since the surface where the groove portion of the mold is formed is brought into contact and pressing is performed by the first mold and the second mold, a split groove is formed on one side main surface, and the other side main surface is formed. An unfired mother ceramic substrate can be reliably produced in which protrusions that project the mother ceramic substrate itself are formed at positions on the surface corresponding to the positions where the dividing grooves are formed.
And by firing this unfired mother ceramic substrate, it is sintered, and the mother ceramic substrate having a split groove on one side main surface and a ridge on the other side main surface is efficiently and reliably obtained. Can be manufactured.

In addition, as in the other method of manufacturing a mother ceramic substrate of the present invention, the surface on which the convex portion of the mold is formed is brought into contact with one side main surface of the unfired mother ceramic substrate, and the other side main surface is contacted. Even when the hydrostatic pressing is performed in a state where the elastic body is in contact, a position corresponding to the position where the dividing groove is formed on the one side main surface and the dividing groove is formed on the other side main surface. In addition, it is possible to reliably produce an unfired mother ceramic substrate on which protrusions projecting from the mother ceramic substrate itself are formed. A mother ceramic substrate having a dividing groove on the other side and a protrusion on the other main surface can be produced efficiently and reliably.
The ridges are formed on the other side main surface at positions corresponding to the positions where the dividing grooves are formed on the one side main surface by the pressure applied to the mother ceramic substrate from the ridges of the mold. This is because the split groove is formed, the force is transmitted to the other main surface, and the ridge is formed.

Further, as in still another method of manufacturing a mother ceramic substrate according to the present invention, a surface on which a convex strip portion of a mold in which a convex strip portion is formed is formed on one side main surface of an unfired mother ceramic substrate. Even when pressing is performed in a state where a rigid body is disposed on the other side main surface via an elastic body, a split groove is formed on the one side main surface, and the other side main surface is It becomes possible to reliably produce an unfired mother ceramic substrate in which protrusions that project the mother ceramic substrate itself are formed at positions corresponding to the positions where the division grooves are formed, and firing this Thus, it is possible to efficiently and surely manufacture a mother ceramic substrate that has been sintered and has a dividing groove on one side main surface and a protrusion on the other side main surface.

Further, as in still another method of manufacturing a mother ceramic substrate according to the present invention, the surface of the mold on which the groove is formed is brought into contact with the main surface on one side of the unfired mother ceramic substrate. After pressing and forming a ridge on one main surface of the mother ceramic substrate, processing (groove forming processing) (for example, cutting processing) for forming split grooves on the other main surface is performed. In this case, a dividing groove is formed on the one side main surface, and a protrusion that projects the mother ceramic substrate itself is formed on the other side main surface at a position corresponding to the position where the dividing groove is formed. It was possible to reliably produce an unfired mother ceramic substrate, and by firing this, it was sintered and provided with a dividing groove on one side main surface and provided with a ridge on the other side main surface. Efficient and reliable mother ceramic substrate It can be produced in.

  In the present invention, the dividing grooves and the ridges are preferably V-shaped (inverted V-shaped), but may be other shapes such as U-shaped (inverted U-shaped).

In one Embodiment (Embodiment 1) of this invention, it is a figure which shows the state which located the mother ceramic green sheet (unbaked mother ceramic substrate) between the 1st metal mold | die and the 2nd metal mold | die. In Embodiment 1 of this invention, it is a figure which shows the state which is pressing the unbaked mother ceramic substrate with the 1st metal mold | die and the 2nd metal mold | die. (A) In Embodiment 1 of this invention, the figure which shows the state which isolate | separated the 1st metal mold | die and the 2nd metal mold | die from the mother ceramic substrate after a press, (b) is a plane of the mother ceramic substrate after a press FIG. It is a figure which shows the 1st metal mold | die used in Embodiment 1 of this invention. It is a figure which shows the 2nd metal mold | die used in Embodiment 1 of this invention. (A) is a figure explaining the mechanism by which the mother ceramic substrate is divided in the embodiment 1 of the present invention in such a manner that the divided end face is perpendicular to the main surface along the dividing groove, and (b) is It is a figure which shows the state by which the mother ceramic substrate was divided | segmented into each ceramic substrate. (A) is the figure which shows the state which affixed the holding | maintenance film on the other side main surface in which the protruding item | line of the mother ceramic substrate was formed, (b) is divided | segmented the mother ceramic substrate of the state of (a) along a division | segmentation groove | channel. The figure which showed the state which carried out, (c) is a figure which shows the state which curved the ceramic substrate as an aggregate | assembly hold | maintained on the holding film with the holding film. It is sectional drawing which shows the mother ceramic substrate provided with the internal electrode produced in Embodiment 3 of this invention. In other embodiment (Embodiment 2) of this invention, it is a figure which shows the state which isolate | separated the 1st metal mold | die and the 2nd metal mold | die from the mother ceramic substrate after a press. In Embodiment 2, it is a figure which shows the state by which the mother ceramic substrate was divided | segmented into each ceramic substrate. It is a perspective view which shows the structure of the module component manufactured with the manufacturing method of the module component concerning Embodiment 3 of this invention. In Embodiment 3 of this invention, it is a perspective view which shows the pattern formation sheet which has arrange | positioned the conductor pattern to the ceramic green sheet. It is a perspective view which shows the state which laminated | stacked the pattern formation sheet of FIG. 11 in the predetermined order. It is a perspective view which shows the laminated body (unbaked mother ceramic substrate) obtained by crimping | bonding the laminated body which laminated | stacked the pattern formation sheet of FIG. It is a perspective view which shows the state which pressed the unbaked mother ceramic substrate of FIG. 13 with the 1st metal mold | die and the 2nd metal mold | die, and formed the division groove | channel on the one side main surface, and the protruding item | line on the other side main surface. . It is a perspective view which shows the state which mounted the surface mounting component in the mother ceramic substrate of FIG. 14 which formed the division groove | channel on the one side main surface, and formed the protruding item | line on the other side main surface. It is a perspective view which shows typically the state which broke the mother ceramic board | substrate after baking and was divided | segmented into each module component. In this invention, it is a figure which shows the other 1st method for forming a groove | channel and a protruding item | line. In this invention, it is a figure which shows the other 2nd method for forming a groove | channel and a protruding item | line. In this invention, it is a figure which shows 1 process of the other 3rd method for forming a groove | channel and a protruding item | line. In this invention, in the other 3rd method for forming a groove | channel and a protruding item | line, it is a figure which shows the state which formed the protruding item | line on one main surface of the mother ceramic substrate. In this invention, in the other 3rd method for forming a groove | channel and a protruding item | line, it is a figure which shows the state which formed the division | segmentation groove | channel in the other main surface of the mother ceramic substrate. (A) is a front view which shows the division | segmentation method of the conventional mother board | substrate, (b) is a top view. It is a figure which shows the problem of the division | segmentation method of the conventional mother board | substrate.

  Embodiments of the present invention will be described below to describe the features of the present invention in more detail.

[Embodiment 1]
In the first embodiment, a method for manufacturing a ceramic substrate (ferrite substrate) using a magnetic ceramic as a ceramic material will be described.

  (1) First, a ceramic raw material slurry was prepared by mixing, dissolving and dispersing a magnetic ceramic powder (ferrite powder in this embodiment 1), a binder resin, and an organic solvent, followed by defoaming.

Then, this ceramic raw material slurry was formed into a sheet shape by a known method such as a doctor blade method and dried to prepare a mother ceramic green sheet having a thickness of 200 μm.
The mother ceramic green sheet may be a laminate in which a plurality of ceramic green sheets are laminated.

  Then, the obtained mother ceramic green sheet was cut into a predetermined size to obtain a cut mother ceramic green sheet which is an unfired mother ceramic substrate in the present invention.

  (2) Next, as shown in FIG. 1, a mother ceramic green sheet (unfired mother ceramic substrate) 1 cut to a predetermined size is formed on the surface 10a of the first protrusion 11 formed on the surface. It was positioned between the mold 10 and the second mold 20 having the groove portion 21 formed on the surface 20a, and was pressed by the first mold 10 and the second mold 20 as shown in FIG. Thereby, the mother ceramic substrate 1 (1A) (FIG. 3) after pressing in which the dividing grooves 3 were formed on the one side main surface 2a and the protrusions 4 were formed on the other side main surface 2b was obtained.

  In this embodiment, as shown in FIG. 4A, the first mold 10 is formed with a chevron-shaped protrusion 11 having a height of about 5 μm and a width of about 20 μm in a lattice shape on the surface 10a. The structure with the same structure was used.

  As shown in FIG. 4B, the second mold 20 has a structure in which a V-shaped groove portion 21 having a depth of about 5 μm and a width of about 20 μm is formed in a lattice shape on the surface 20a. Was used.

  When pressing using the first mold 10 and the second mold 20, when the mother ceramic substrate 1 is viewed from the thickness direction, the protrusions formed on the surface 10 a of the first mold 10. The first mold 10 and the second mold 20 so that the V-shaped groove portion 21 formed on the surface 20a of the second mold 20 is located at a position corresponding to the position where 11 is formed. The press was performed by adjusting the positional relationship (see FIG. 2).

  (3) Then, the mother ceramic substrate 1 (1A) after pressing was fired at 950 ° C. to obtain a sintered mother ceramic substrate (ferrite sintered substrate) 1 (1B).

  (4) Next, the mother ceramic substrate 1 (1B) that had been sintered was subjected to a dividing process by a method such as roller break, and divided along the dividing grooves 3. At this time, as shown to Fig.5 (a), the crack C which generate | occur | produced in the division | segmentation groove | channel 3 of the one side main surface 2a extends toward the skirt of the protruding item | line 4 of the other side main surface 2b.

  Since the width of the ridges 4 is smaller than the thickness of the mother ceramic substrate 1 (1B), the split end surface 31a of the ceramic substrate 31 obtained after the crack C is split to extend is the main surface of the ceramic substrate 31. It is almost perpendicular to the surface (= the main surface 2a of the mother ceramic green sheet and the main surface 2b of the other side).

  As a result, by dividing the mother ceramic substrate 1 (1B) along the dividing groove 3, the divided end surface 31a becomes the main surface of the ceramic substrate 31 (= the one main surface 2a and the other main surface 2b of the mother ceramic green sheet). ) Is obtained (see FIG. 5B).

At this time, in the ceramic substrate 31 shown in FIG. 5B, the left and right ridge portions of the one-side main surface (upper surface) are divided by the above-described dividing groove 3a (FIG. 5A) at the deepest portion. The formed chamfered shape is formed, and the above-mentioned protrusion 4 is present at one end (the left end in FIG. 5B) of the other main surface (lower surface). In addition, as described above, the above-described protrusion 4 is present only in one end portion (left end portion in FIG. 5B), as described above, in the split groove 3 on the one-side main surface 2a. This is because the crack C extends toward the skirt of the ridge 4 on the other side main surface 2b.
However, when the crack C extends in such a manner that the ridge 4 is divided into a main part and the remaining part, one end of the other main surface (lower surface) and the other side A part of the divided ridges 4 may be present at each end.

  In the mother ceramic substrate 1 (1B) of the present invention, the dividing groove 3 is formed on the one side main surface 2a, and the protrusion 4 is provided on the other side main surface 2b. Even if the height of the ridge 4 is about several μm, it is surely divided (broken) substantially perpendicular to the main surface (one main surface 2a, the other main surface 2b) of the mother ceramic substrate 1 (1B). can do.

  Thus, the ceramic substrate 31 obtained by dividing the mother ceramic substrate 1 (1B) has a divided end surface 31a perpendicular to the main surface of each ceramic substrate 31, has high shape accuracy, and is widely used for various applications. It is something that can be done.

Moreover, as shown to Fig.6 (a), the adhesive tape which functions as a holding film, for example on the other side main surface 2b which is the surface in which the protruding item | line 4 of the sintered mother ceramic substrate 1 (1B) was formed. In the state where 5 is pasted, for example, a dividing process is performed by a method such as a roller break, and it is divided along the dividing groove 3 (FIG. 6 (b)). A ceramic substrate 31 perpendicular to the main surface can also be obtained. Each of these ceramic substrates 31 (individual substrates) can be suitably used as a magnetic ceramic substrate for an RFID or NFC antenna device.
In addition, it is also possible to use the adhesive tape 5 functioning as a holding film as it is stuck without being peeled off. In that case, a ceramic substrate 31 that can be used as a ferrite sheet that is held in a collective state on the holding film 5 and has flexibility as a whole can be obtained. The ceramic substrate 31 as such a ferrite sheet can be suitably used as an electromagnetic wave blocking / absorbing material for blocking / absorbing electromagnetic waves.
In any of the above cases, the ceramic substrate 31 as an aggregate in which a plurality is held on the holding film 5 in an aggregated state, for example, as shown in FIG. It is conceivable that the whole is curved or deformed into a spherical shape, either intentionally or unintentionally. Even in this case, when the holding film 5 is bent, the end faces (divided end faces) of the individual ceramic substrates (ferrite substrates) 31 are rubbed, and ferrite powder is generated (powdered), which may cause dust generation. Absent. Accordingly, it can be suitably used for an electromagnetic wave shielding / absorbing material, an RFID or NFC antenna device, and the like.

[Embodiment 2]
In the second embodiment, a method for manufacturing a ceramic substrate (multilayer ceramic substrate) using a low-temperature sintered ceramic as a ceramic material will be described.

  (1) First, glass ceramic powder (low-temperature sintered ceramic powder), a binder resin, and an organic solvent were mixed, dissolved and dispersed, and then defoamed to prepare a ceramic raw material slurry.

  Then, the ceramic raw material slurry was formed into a sheet by a known method such as a doctor blade method and dried to produce a plurality of mother ceramic green sheets having a thickness of 50 μm.

  Next, the ceramic raw material slurry was formed into a sheet shape by a known method such as a doctor blade method and dried to prepare a plurality of single mother ceramic green sheets having a thickness of 50 μm.

  Then, the obtained mother ceramic green sheet was cut into a predetermined size, and an internal electrode forming conductive paste (Ag paste) was screen printed on each to form an internal electrode pattern. Note that a mother ceramic green sheet provided with via conductors (one type of internal electrodes) can be formed by forming through holes in the mother ceramic green sheet as required and filling with a conductive paste.

  Subsequently, the mother ceramic green sheets provided with the internal electrode patterns are laminated in a predetermined order, whereby a non-fired mother ceramic substrate provided with the internal electrodes 6 (lamination of the mother ceramic green sheets) as shown in FIG. Body) 1 was obtained.

  (2) Then, the mother ceramic substrate 1 is pressed by the same method using the same mold as in the first embodiment, and the divided grooves 3 are formed on the one-side main surface 2a as shown in FIG. As a result, a mother ceramic substrate 1 (1A) after pressing having the ridges 4 formed on the other main surface 2b was obtained. FIG. 8 shows a state where the first mold 10 and the second mold 20 are separated from the mother ceramic substrate 1 (1A) after pressing.

  (3) Then, the mother ceramic substrate 1 (1A) after pressing was fired at 900 ° C. to obtain a sintered mother ceramic substrate 1 (1B).

(4) Next, by dividing the sintered mother ceramic substrate 1 (1B) by a method such as roller break and dividing along the dividing grooves 3, for example, as shown in FIG. Individual ceramic substrates (multilayer ceramic substrates) 31 were obtained.
In addition, as shown in FIG. 9, the ceramic substrate (multilayer ceramic substrate) 31 obtained by dividing the mother ceramic substrate 1 (1B) described above has divided end surfaces (end surfaces of the ceramic substrate 31) 31a as individual ceramic substrates. It is perpendicular to the main surface 31 and has high shape accuracy and can be widely used in various applications.

[Embodiment 3]
In the third embodiment, as shown in FIG. 10, a method of manufacturing a module component 150 in which a surface mount component 151 is mounted on a ceramic substrate (multilayer ceramic substrate) 1 having a surface conductor, an internal conductor, a via conductor, and the like. explain.

  (1) First, a ceramic green sheet (low-temperature sintered ceramic green sheet) 1 is prepared by the same method as in the second embodiment, and the obtained ceramic green sheet 1 becomes, for example, a surface conductor or an internal conductor. Conductive pattern formation, via hole formation, filling of the via hole with a conductive material serving as a via conductor, and the like are performed to produce a pattern forming sheet 101a having a necessary conductive pattern 140 as shown in FIG.

  (2) Then, the pattern forming sheet 101a provided with the conductor pattern 140 is laminated in a predetermined order (FIG. 12), the obtained laminated body is put in a bag, deaerated, sealed, and kept at a predetermined temperature. After heating, the laminate (unfired mother ceramic substrate) 1 to which each pattern forming sheet 101a was pressure-bonded was obtained by performing an isostatic pressing, as shown in FIG.

  (3) Then, as shown in FIG. 14, the unfired mother ceramic substrate 1 is pressed by the same method using the same mold as in the first and second embodiments, and divided into the one-side main surface 2a. The mother ceramic substrate 1 (1A) after pressing in which the grooves 3 were formed and the protrusions 4 were formed on the other main surface 2b was obtained.

  (4) Next, the mother ceramic substrate 1 (1A) after pressing was fired at 900 ° C. to obtain a sintered mother ceramic substrate 1 (1B).

(5) Then, each surface-mounted component 151 was mounted on each area of the sintered mother ceramic substrate 1 (1B) (FIG. 15) to be the individual ceramic substrate 31 after firing.
As the surface mount component 151, for example, an IC chip, a multilayer ceramic capacitor, a chip inductor, a chip resistor, or the like is mounted.

  (6) Then, the mother ceramic substrate 1 (1B) on which the surface mount component 151 was mounted on each ceramic substrate was divided along the dividing grooves 3 (FIG. 16). As a result, individual module components 150 in which the surface-mounted components 151 are mounted on each ceramic substrate (multilayer ceramic substrate) 31 with the divided end surface 31a perpendicular to the main surface and high in dimensional accuracy and shape accuracy are obtained.

  In the case of the ceramic substrate (multilayer ceramic substrate) 31 shown in FIG. 16 as well, the left and right ridges on one main surface (upper surface) are divided at the deepest portion of the above-described dividing groove 3a (see FIG. 5A). As a result, a chamfered shape is formed (see FIG. 5 (b)), and one end of the other main surface (lower surface) (the left end in FIG. 5 (b)) Although the above-mentioned ridge 4 exists, in FIG. 16, the chamfered shape of the ridge and the ridge on the other side main surface (lower surface) are omitted.

  In the third embodiment, the module component in which the surface mount type electronic component is mounted on the multilayer ceramic substrate has been described as an example. However, in the present invention, the surface mount type electronic component is mounted on the single layer ceramic substrate. The present invention can also be applied when manufacturing module parts.

  According to the method of the third embodiment, it is possible to efficiently manufacture a module component in which a surface mount component is mounted on a ceramic substrate having high dimensional accuracy and shape accuracy.

[Embodiment 4]
In the first, second, and third embodiments described above, the first mold in which the ridges are formed and the second mold in which the grooves are formed are used to divide the main surface on one side of the mother ceramic substrate. Grooves are formed on the main surface of the other side, but also by the method described below, split grooves are formed on the main surface of one side of the mother ceramic substrate, and protrusions are formed on the main surface of the other side. It is possible.

(1) Another first method for forming grooves and ridges As shown schematically in FIG. 17, the ridges 51 are formed on one main surface 2 a of the unfired mother ceramic substrate 1. The entire mold 50 is accommodated in the bag-like member 53 in a state where the surface on which the ridges 51 are formed is brought into contact, and the hydrostatic press elastic body 52 is brought into contact with the other main surface 2b. Then, hydrostatic pressure pressurizing in water is performed. Thereby, the dividing groove 3 is formed at a position corresponding to the convex portion 51 of the one-side main surface 2a of the unfired mother ceramic substrate 1 by the pressing pressure by the convex portion 51, and the unfired mother ceramic substrate. 1 is formed on the other main surface 2b.
It is also possible to cause the bag-like member 53 to function as the hydrostatic press elastic body 52 and perform the hydrostatic press without using the hydrostatic press elastic body 52. There are no particular restrictions on the method.

  Also in this method, the dividing groove 3 that defines the dividing position is formed on the one-side main surface 2a of the unfired mother ceramic substrate 1, and the unfired mother ceramic substrate 1 on the other-side main surface 2b is formed. When viewed from the thickness direction, it is possible to form the mother ceramic substrate 1 having the ridges 4 at positions corresponding to the positions where the dividing grooves 3 of the one-side main surface 2a are formed.

(2) Another Second Method for Forming Grooves and Convex Lines As schematically shown in FIG. 18, a convex line part 51 is formed on one side main surface 2 a of the unfired mother ceramic substrate 1. Further, pressing is performed in a state in which the surface of the metal mold 50 on which the ridges 51 are formed is brought into contact, and the rigid body 63 is disposed on the other main surface 2b via the elastic body 62.

  Also in this method, the dividing groove 3 that defines the dividing position is formed on the one-side main surface 2a of the unfired mother ceramic substrate 1, and the unfired mother ceramic substrate 1 on the other-side main surface 2b is formed. When viewed from the thickness direction, it is possible to form the mother ceramic substrate 1 having the ridges 4 at positions corresponding to the positions where the dividing grooves 3 of the one-side main surface 2a are formed.

(3) Another third method for forming grooves and ridges As shown in FIG. 19, on the other main surface 2b of the unfired mother ceramic substrate 1 placed on a flat rigid body 63, As shown in FIG. 20, the other main surface of the unfired mother ceramic substrate 1 is brought into contact with the surface on which the groove 61 is formed by pressing the mold 60 on which the groove 61 is formed. The ridge 4 is formed on 2b.

Then, as shown in FIG. 21, a groove forming process is performed on the one-side main surface 2a of the unfired mother ceramic substrate 1, and the unfired mother ceramic on the one-side main surface 2a of the unfired mother ceramic substrate 1 is formed. When the substrate 1 is viewed from the thickness direction, the dividing groove 3 is formed at a position corresponding to the position where the protrusion 4 of the other side main surface 2b is formed.
A method such as cutting or laser processing can be applied to the groove forming process.

  Also in this method, the dividing groove 3 that defines the dividing position is formed on the one-side main surface 2a of the unfired mother ceramic substrate 1, and the unfired mother ceramic substrate 1 on the other-side main surface 2b is formed. When viewed from the thickness direction, it is possible to form the mother ceramic substrate 1 having the ridges 4 at positions corresponding to the positions where the dividing grooves 3 of the one-side main surface 2a are formed.

  Moreover, although the said embodiment demonstrated as an example the case where a division | segmentation groove | channel and a protruding item | line are V-shaped (inverted V-shaped), a division | segmentation groove | channel and a protruding item | line are U-shaped (reverse U-shaped) etc. Other shapes are possible.

  The present invention is not limited to the above embodiment, but the size and shape of the ceramic substrate to be manufactured, the method of forming grooves and ridges on the unfired mother ceramic substrate in the manufacturing process, and the type of apparatus used therefor, With respect to a method for breaking a sintered mother ceramic substrate, various applications and modifications can be made within the scope of the invention.

DESCRIPTION OF SYMBOLS 1 Mother ceramic substrate 1 (1A) Mother ceramic substrate 1 provided with dividing grooves and ridges 1 (1B) Sintered mother ceramic substrate 2a One side main surface of mother ceramic substrate 2b The other side main surface 3 Dividing grooves 4 ridges 5 Adhesive tape (holding film)
6 internal electrode 10 first mold 10a surface of first mold 11 ridge 20 second mold 20a surface of second mold 21 groove 31 ceramic substrate 31a split end surface (end surface of ceramic substrate)
DESCRIPTION OF SYMBOLS 50 Metal mold | die 51 Convex section 52 Elastic body for isostatic pressing 53 Bag-shaped member 60 Mold 61 Groove part 62 Elastic body 63 Rigid body 101a Pattern formation sheet 140 Conductive pattern 150 Module component 151 Surface mount component C Crack

Claims (10)

A mother ceramic substrate configured to be divided at a predetermined position and divided into a plurality of individual substrates,
A dividing groove for defining a dividing position is formed on one side main surface,
A ridge is formed at a position corresponding to the position where the dividing groove is formed on the one main surface when the mother ceramic substrate on the other main surface is viewed from the thickness direction. substrate.   2. The mother ceramic substrate according to claim 1, wherein the individual substrates obtained after the division are provided with internal conductors in such a manner that the individual substrates are provided with internal conductors.   A ceramic substrate, which is the individual substrate obtained by dividing the mother ceramic substrate according to claim 1 or 2 along the dividing groove. A mother module component, wherein a surface mount component is mounted on each of the regions of the mother ceramic substrate according to claim 1 that become individual substrates after division.   5. A module component obtained by dividing the mother module component according to claim 4 along the dividing groove of the mother ceramic substrate. A method for producing a mother ceramic substrate according to claim 1 or 2, comprising:
Using a first mold having a ridge formed on the surface and a second mold having a groove formed at a position facing the ridge of the first mold on the surface,
The surface of the first mold on which the protrusions are formed is brought into contact with one side main surface of the unfired mother ceramic substrate, and the groove portion of the second mold is formed on the other side main surface. The divided grooves are formed in the main surface on one side of the unfired mother ceramic substrate by bringing the formed surface into contact with each other and pressing the first die and the second die. And, the step of forming a ridge at a position corresponding to the position where the dividing groove of the one side main surface is formed when the mother ceramic substrate of the other side main surface is viewed from the thickness direction,
Firing the unfired mother ceramic substrate on which the dividing grooves and the ridges are formed. A method for manufacturing a mother ceramic substrate, comprising: A method for producing a mother ceramic substrate according to claim 1 or 2, comprising:
A state in which the surface of the mold having the ridges formed thereon is in contact with one side main surface of the unfired mother ceramic substrate, and an elastic body is in contact with the other side main surface And then forming the dividing groove on one main surface of the unfired mother ceramic substrate, and the one main surface of the other main surface when the mother ceramic substrate is viewed from the thickness direction. Forming a ridge at a position corresponding to the position where the dividing groove is formed,
Firing the unfired mother ceramic substrate on which the dividing grooves and the ridges are formed. A method for manufacturing a mother ceramic substrate, comprising: A method for producing a mother ceramic substrate according to claim 1 or 2, comprising:
The surface of the mold on which the ridges are formed is brought into contact with one side main surface of the unfired mother ceramic substrate, and a rigid body is arranged on the other side main surface via an elastic body. In the installed state, the one side main surface of the unfired mother ceramic substrate is formed with the dividing grooves, and the other side main surface of the mother ceramic substrate is viewed from the thickness direction when the mother ceramic substrate is viewed from the thickness direction. Forming a ridge at a position corresponding to the position where the dividing groove is formed on the main surface;
Firing the unfired mother ceramic substrate on which the dividing grooves and the ridges are formed. A method for manufacturing a mother ceramic substrate, comprising: A method for producing a mother ceramic substrate according to claim 1 or 2, comprising:
The one side main surface of the unfired mother ceramic substrate is brought into contact with the surface on which the groove portion is formed, and the one side of the unfired mother ceramic substrate is pressed. Forming a ridge on the side main surface;
The dividing groove is formed at a position corresponding to a position on the other side main surface of the unfired mother ceramic substrate corresponding to the position where the protrusions are formed on the one side main surface when the mother ceramic substrate is viewed from the thickness direction. A process for performing the process,
Firing the unfired mother ceramic substrate on which the dividing grooves and the ridges are formed. A method for manufacturing a mother ceramic substrate, comprising: A ceramic substrate having a square planar shape and having one main surface and the other main surface,
Of the four sides of the other side main surface, at least one side has a ridge,
Of the four sides of the one side main surface, when the ceramic substrate is viewed from the thickness direction, the side of the side corresponding to the position where the convex line is formed on the other side main surface is chamfered. A ceramic substrate characterized by the above.

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