JP4867276B2 - Manufacturing method of ceramic substrate - Google Patents

Description

  The present invention relates to a method for manufacturing a ceramic substrate, and more particularly, to a method for manufacturing a ceramic substrate for efficiently manufacturing a ceramic substrate having a cavity.

Some ceramic substrates have a structure having a cavity for accommodating a surface-mounted component to be mounted on the surface thereof.
As a manufacturing method thereof, a cavity forming layer, which is a non-sintered layer made of a material that does not sinter at the sintering temperature of the ceramic constituting the ceramic substrate, is disposed in the portion where the cavity is to be formed and fired. There is known a method of obtaining a ceramic substrate having a cavity by removing a cavity forming layer that is not sintered after firing (see Patent Document 1).

  Further, for example, as shown in FIG. 34, the ceramic structure also includes a ceramic sintered body 53 having a cavity 52 and a ceramic sintered body 54 having no cavity, which are connected via a connecting member 51. Further, there is known a structure in which the surface conductors 55 of the ceramic sintered bodies 53 and 54 are electrically connected through the connection member 51 and the electronic component 56 is mounted in the cavity 52. (See Patent Document 2).

And this ceramic structure is manufactured by the method demonstrated below.
(1) First, an unfired ceramic molded body with a conductor formed on the surface and provided with a through-hole serving as a cavity, and an unfired ceramic molded body with a conductor formed on the surface without a through-hole. And prepare.
(2) Also, a ceramic green sheet for forming a connection member in which via conductors are formed in the thickness direction without sintering at the sintering temperature of the ceramic molded body is prepared.
(3) Then, the ceramic molded body and the connecting member forming ceramic green sheet are laminated and pressure-bonded so that the connecting member forming ceramic green sheet is sandwiched between the ceramic molded bodies, thereby producing a composite laminated body.
(4) The composite laminate is then fired at a temperature at which the ceramic molded body is sintered and the connecting member forming ceramic green sheet is not sintered, and at a temperature not higher than the melting point of the metal constituting the via conductor. The ceramic green sheet for connecting member formation is removed from the subsequent composite laminate to obtain a ceramic structure having a cavity.
(5) After that, an electronic component is mounted in the cavity. Thereby, a ceramic structure as shown in FIG. 34 is obtained.

  However, as in the method for manufacturing a ceramic substrate of Patent Document 1, a cavity forming layer that is a non-sintered layer is disposed in a portion where a cavity is to be formed, and firing is performed. In the case of a method for obtaining a ceramic substrate having a cavity by removing the cavity forming layer, the surface of the portion where the cavity is formed has a different substrate thickness and is in contact with the non-sintered cavity forming layer, and the cavity formation There is a problem that a shrinkage difference occurs in a portion not in contact with the layer, and cracks are likely to occur at the interface.

In the case of the method of Patent Document 2, unfired ceramic molded bodies are stacked through the ceramic green sheets for connecting member formation, and in the step of crimping, stress is biased at the time of crimping, and a through-hole serving as a cavity is formed. There is a problem that it is difficult to obtain a ceramic structure having a cavity that is easily deformed and has high shape accuracy.
Japanese Patent No. 3511982 JP 2004-207495 A

  The present invention solves the above-mentioned problems, and can efficiently reduce a stress bias during pressure bonding when forming a laminate, and efficiently produce a ceramic substrate having a cavity with high shape accuracy. An object of the present invention is to provide a method of manufacturing a ceramic substrate capable of satisfying the requirements.

In order to solve the above problems, the present invention adopts the following configuration.
That is, the method for manufacturing a ceramic substrate according to claim 1 comprises:
(a) The unsintered or sintered first ceramic base layer and the unsintered second ceramic base layer are not substantially sintered at the temperature at which each ceramic base layer is sintered. It is stacked through a first shrinkage suppression layer, and the composite laminate to form a composite laminate which have a first columnar coupling body for coupling with the first ceramic base material layer and the second ceramic substrate layer Body formation process,
(b) The composite laminate so as to divide the second ceramic base layer into a first region connected to the first columnar connected body and a second region not connected to the first columnar connected body. A notch groove forming step of forming a first notch groove reaching the first shrinkage suppression layer from the second ceramic substrate layer side of
(c) In the composite laminate, when the first ceramic base layer is unsintered, the first and second ceramic base layers are sintered, and the first shrinkage suppression layer is substantially When the first ceramic base layer is sintered, the second ceramic base layer is sintered, and the first shrinkage suppression layer is substantially fired. A firing step of firing at a temperature at which no binding occurs;
(d) The second region of the second ceramic base layer and the first shrinkage suppression layer are removed, and the first region of the second ceramic base layer and the first ceramic base layer are And a shrinkage suppression layer removing step of taking out the ceramic substrate connected via the one-column-like connecting body.

  According to a second aspect of the present invention, there is provided a method for manufacturing a ceramic substrate according to the first aspect of the present invention, wherein the second region is formed to be surrounded by the first region, and the second region is removed. A cavity is formed in which the first region of the second ceramic base layer and the first columnar connector are bank portions.

  According to a third aspect of the present invention, there is provided a method for manufacturing a ceramic substrate according to the first or second aspect of the invention, wherein the first cut groove is a lattice-shaped cut groove.

  According to a fourth aspect of the present invention, there is provided a method for manufacturing a ceramic substrate according to any one of the first to third aspects, wherein the first ceramic base layer has a first conductor pattern on the surface and / or inside thereof. The second ceramic base layer has a second conductor pattern on the surface and / or inside thereof, and the first columnar connecting body electrically connects the first conductor pattern and the second conductor pattern. It is characterized by including the columnar coupling body which consists of an electroconductive material connected to this.

  According to a fifth aspect of the present invention, there is provided a method for manufacturing a ceramic substrate according to any one of the first to fourth aspects, wherein the first columnar connecting body electrically connects the first conductor pattern and the second conductor pattern. Includes a columnar connecting body for reinforcement that is not connected.

  According to a sixth aspect of the present invention, there is provided a method for producing a ceramic substrate according to any one of the first to fifth aspects, wherein a characteristic evaluation conductor pattern is formed in the second region of the second ceramic base layer. It is characterized by.

  According to a seventh aspect of the present invention, there is provided a method for manufacturing a ceramic substrate according to any one of the second to sixth aspects, wherein the first ceramic base layer, the second ceramic base layer, and the first columnar connection are provided. It is characterized by comprising a step of providing a resin layer so as to fill a space defined by the body.

  A method for manufacturing a ceramic substrate according to claim 8 is the structure of the invention according to claim 7, further comprising a step of mounting a surface mount component in the cavity, and the resin so as to cover at least a part of the surface mount component. It is characterized by providing a layer.

According to a ninth aspect of the present invention, there is provided a method for manufacturing a ceramic substrate according to any one of the first to eighth aspects, wherein the second ceramic base material of the first ceramic base material layer is formed in the composite laminate forming step. On the opposite side to the layer side, there is an unsintered third ceramic base layer laminated via a second shrinkage suppression layer that is not substantially sintered at the sintering temperature of each ceramic base layer. And the second shrinkage suppression layer is formed with a composite laminate in which a second columnar connecting body for connecting the first ceramic base layer and the third ceramic base layer is formed. ,
In the notch groove forming step, the third ceramic base layer is divided into a first region connected to the second columnar connected body and a second region not connected to the second columnar connected body, Forming a second cut groove reaching the second shrinkage suppression layer from the third ceramic base layer side;
In the firing step, when the first ceramic base layer is unsintered, the first, second and third ceramic base layers are sintered, and the first and second shrinkage suppression layers Is fired at a temperature that does not substantially sinter, and when the first ceramic base layer has been sintered, the second and third ceramic base layers are sintered, and the first and second ceramic base layers are sintered. 2 After firing at a temperature at which the shrinkage suppression layer does not substantially sinter,
In the shrinkage suppression layer removing step, by removing the second region of the third ceramic base layer and the second shrinkage suppression layer, the first ceramic base layer on the second ceramic base layer side A first cavity having the first region of the second ceramic base layer and the first columnar connecting body as a bank portion on the first main surface side, the third ceramic of the first ceramic base layer A second cavity is formed on the second main surface side, which is the base material layer side, with the first region of the third ceramic base material layer and the second columnar coupling body as a bank portion.

According to a tenth aspect of the present invention, there is provided a method for manufacturing a ceramic substrate according to any one of the first to eighth aspects, wherein the first ceramic base material of the second ceramic base material layer is formed in the composite laminate forming step. A non-sintered third ceramic base layer laminated via a second shrinkage suppression layer that is not substantially sintered at the sintering temperature of each ceramic base layer on the opposite side of the layer And the second shrinkage suppression layer is formed with a composite laminate in which a second columnar connecting body for connecting the second ceramic base layer and the third ceramic base layer is formed,
In the notch groove forming step, the third ceramic base layer is divided into a first region connected to the second columnar connected body and a second region not connected to the second columnar connected body, Forming a third cut groove reaching the first shrinkage suppression layer from the third ceramic base layer side;
In the firing step, when the first ceramic base layer is unsintered, the first, second and third ceramic base layers are sintered, and the first and second shrinkage suppression layers Is fired at a temperature that does not substantially sinter, and when the first ceramic base layer has been sintered, the second and third ceramic base layers are sintered, and the first and second ceramic base layers are sintered. 2 After firing at a temperature at which the shrinkage suppression layer does not substantially sinter,
In the shrinkage suppression layer removing step, the second region of the third ceramic base material layer and the second shrinkage suppression layer are removed to form a stepped cavity having a stepped portion on the side wall.

The method for manufacturing a ceramic substrate according to claim 11 is the structure according to any one of claims 1 to 8, wherein, in the notch groove forming step, the first ceramic base layer is formed on the first columnar connector. A fourth cut groove reaching the first shrinkage suppression layer from the first ceramic base layer side is formed so as to be divided into a connected first region and a second region not connected to the first columnar coupling body. And
In the firing step, when the first ceramic base layer is unsintered, the first and second ceramic base layers are sintered, and the first shrinkage suppression layer is substantially sintered. When the first ceramic base layer is sintered, the second ceramic base layer is sintered, and the first shrinkage suppression layer is not substantially sintered. After firing
In the shrinkage suppression layer removing step, a cavity is formed on both surfaces by removing the second region of the first ceramic base layer.

  According to a twelfth aspect of the present invention, there is provided a method for manufacturing a ceramic substrate according to any one of the first to eleventh aspects, wherein the outermost ceramic substrate in which a cut groove is formed in each of the ceramic base layers. A shrinkage suppression layer is disposed outside the material layer, and the cut groove is formed in the ceramic base material layer where the cut groove is to be formed via the shrinkage suppression layer.

  According to a thirteenth aspect of the present invention, there is provided a method for producing a ceramic substrate according to any one of the first to twelfth aspects, wherein a shrinkage suppression layer is provided outside the outermost ceramic base layer of the ceramic base layers. And the composite laminate is fired in a state in which the shrinkage suppression layers are disposed on both main surfaces.

According to a fourteenth aspect of the present invention, there is provided a method for producing a ceramic substrate according to the thirteenth aspect of the present invention, wherein the composite laminate can be fired in a state in which a shrinkage suppression layer having no cut groove is provided on both main surfaces. As described above, when a cut groove is formed in the outermost shrinkage suppression layer, a shrinkage suppression layer having no cut groove is further provided on the outer side.

  According to a fifteenth aspect of the present invention, there is provided a method for manufacturing a ceramic substrate according to the thirteenth aspect of the present invention, wherein at least one of the shrinkage suppression layers of the outermost layer is a columnar part for forming protrusions made of a conductive material containing a metal as a conductive component. A ceramic substrate provided with a protruding electrode is obtained by providing a body and removing the outermost shrinkage suppression layer after firing the composite laminate.

  A method for manufacturing a ceramic substrate according to claim 16 is the structure according to any one of claims 1 to 15, wherein the respective steps are performed in a state of an aggregate substrate formed by assembling a plurality of ceramic substrates, and fired. Then, the method has a step of dividing the aggregate substrate into sub-substrates.

  According to a seventeenth aspect of the present invention, there is provided a method for manufacturing a ceramic substrate according to the sixteenth aspect of the present invention, wherein the dividing grooves for dividing the collective substrate into the sub-substrates are divided from the surface side on which the cut grooves are formed. It is characterized by being formed so as to reach the ceramic substrate layer.

In the method for manufacturing a ceramic substrate according to claim 1 of the present invention, an unsintered or sintered first ceramic base layer and an unsintered second ceramic base layer sinter each ceramic base layer. temperature are stacked via a first shrinkage suppression layer not substantially sintered and composite laminate to have a first columnar connecting member for connecting a first ceramic base layer and the second ceramic substrate layer Since a composite laminate can be formed without a through-hole serving as a cavity as in the prior art, a uniform pressure is applied to the entire surface of the composite laminate. And the through-hole serving as the cavity is not deformed in the pressure-bonding step when forming the composite laminate.

  Further, after forming the composite laminate, the second ceramic base layer is divided into a first region connected to the first columnar connected body and a second region not connected to the first columnar connected body, A first cut groove reaching the first shrinkage suppression layer from the second ceramic base layer side of the composite laminate is formed, and then the unsintered ceramic base layer is sintered and the shrinkage suppression layer is substantially fired. After firing at a temperature at which no sintering occurs, the second region of the second ceramic base material layer and the shrinkage suppression layer are removed, and unnecessary parts of the ceramic base material layer can be easily removed after firing, and In addition, since the firing is performed in a state where the shrinkage suppression layer is disposed, it is possible to prevent deformation of a portion that becomes a cavity after firing and its peripheral portion in the firing step, and an unnecessary portion of the ceramic base layer. That is, the cavity A portion, it is possible to easily remove the shrinkage suppression layers, including the shape accuracy and the periphery thereof of the cavity portion, it is possible to manufacture a highly ceramic substrate shape accuracy of the overall efficiency.

  That is, at the stage of the composite laminate, since it has a flat structure in which no through hole is formed, it is possible to reduce variations in stress generated during crimping and the like, and a cut groove is formed. In the firing process of the composite laminate, firing is performed in a state having a shrinkage suppression layer, so that unnecessary deformation in the firing process can be prevented, and a ceramic substrate with high shape accuracy can be efficiently manufactured. Is possible.

  Further, the depth of the notch groove can be formed because the notch groove penetrating the base material layer can be formed to a depth reaching the shrinkage suppression layer between the base material layers, and the shrinkage suppression layer can be formed thick. In addition, since a certain degree of variation is allowed, it is possible to form a ceramic substrate having a cavity with high shape accuracy stably.

  In addition, a ceramic base layer and a shrinkage suppression layer provided with a columnar connected body are laminated to form a composite laminate. However, since there are no portions having different thicknesses in the same ceramic base layer, the ceramic base is not fired during firing. It is possible to shrink the material layer while suppressing or preventing the stress from varying in the thickness direction of the material layer. That is, since the ceramic base material layer that forms the bank portion around the cavity portion and the ceramic base material layer that forms the bottom portion of the cavity are separated by the shrinkage suppression layer, the shrinkage of each ceramic base material layer affects each other. Without being able to form a flat ceramic base material layer, the ceramic base material layer constituting the bank portion and the ceramic base material layer constituting the cavity bottom are connected via the columnar connecting body, A ceramic substrate with high shape accuracy can be obtained.

  According to a second aspect of the present invention, there is provided a method for manufacturing a ceramic substrate according to the first aspect of the present invention, wherein the second region is surrounded by the first region, and the second ceramic is removed by removing the second region. Since the cavity is formed so that the first region of the base material layer and the first columnar coupling body are the bank portion, a ceramic substrate having a cavity having a structure in which the periphery of the recess is surrounded by the bank is provided. It becomes possible to manufacture efficiently.

  Further, as in the method for manufacturing a ceramic substrate according to claim 3, in the configuration of the invention according to claim 1 or 2, the first cut groove is formed into a grid-like cut groove, so that the inside of the region partitioned in the grid shape Thus, it is possible to efficiently manufacture a ceramic substrate having a cavity having a desired planar shape.

  Moreover, the manufacturing method of the ceramic substrate of Claim 4 WHEREIN: The structure of the invention in any one of Claims 1-3 WHEREIN: The 1st ceramic base material layer has the 1st conductor pattern in the surface and / or inside, The second ceramic base layer has a second conductor pattern on the surface and / or inside thereof, and the first columnar connected body electrically connects the first conductor pattern and the second conductor pattern. Since a columnar coupling body made of a conductive material is included, a ceramic substrate having a structure in which the first conductor pattern and the second conductor pattern are electrically connected without particularly providing an electrical connection member is efficiently manufactured. It becomes possible to do.

  Moreover, like the manufacturing method of the ceramic substrate of Claim 5, in the structure of any invention of Claims 1-4, a 1st columnar coupling body electrically connects a 1st conductor pattern and a 2nd conductor pattern. By including a reinforcing columnar coupling body that is not connected, it becomes possible to efficiently manufacture a ceramic substrate having a high coupling strength to the cavity bottom portion of the bank portion.

  Further, as in the method for manufacturing a ceramic substrate according to claim 6, in the configuration of any one of claims 1 to 5, the characteristic evaluation conductor pattern is formed in the second region of the second ceramic base layer. In this case, for example, by disposing a characteristic evaluation conductor pattern having an inductance L, a capacitance C, a resistance R, and the like, a process control monitor substrate capable of grasping the characteristics of the composite laminate can be obtained. By giving this process control monitor board position information about misalignment, etc., it becomes possible to grasp the in-plane variation of the conductor pattern, etc., without keeping the product and performing destructive inspection, etc. By grasping lots and in-plane variations, stable productivity can be secured.

  Moreover, like the manufacturing method of the ceramic substrate of Claim 7, in the structure of any one of Claims 2-6, a 1st ceramic base material layer, a 2nd ceramic base material layer, and a 1st columnar coupling body When the resin layer is provided so as to fill the space defined by the above, it is possible to efficiently manufacture a more reliable electronic component in which the space is sealed with the resin layer. .

  Further, as in the method for manufacturing a ceramic substrate according to claim 8, in the configuration of the invention according to claim 7, the method includes a step of mounting the surface mount component in the cavity, and the resin layer covers at least a part of the surface mount component. In this case, it is possible to efficiently manufacture a highly reliable electronic component in which the cavity portion and the surface mount component mounted in the cavity are sealed with the resin layer.

  A method for manufacturing a ceramic substrate according to a ninth aspect relates to the invention according to any one of the first to eighth aspects, wherein the second ceramic base material of the first ceramic base material layer is formed in the composite laminate forming step. On the opposite side of the layer side, there is an unsintered third ceramic base layer laminated via a second shrinkage suppression layer that is not substantially sintered at the sintering temperature of each ceramic base layer, And in the 2nd shrinkage | contraction suppression layer, the composite laminated body in which the 2nd columnar coupling body for connecting a 1st ceramic base material layer and a 3rd ceramic base material layer was formed was formed, and in a notch groove formation process In order to divide the third ceramic base material layer into a first region connected to the second columnar connector and a second region not connected to the second columnar connector, the second ceramic base material layer is separated from the second ceramic base material layer side. A second cut groove reaching the shrinkage suppression layer is formed, and in the firing process After the unsintered ceramic base material layer is sintered and the shrinkage suppression layer is fired at a temperature that does not substantially sinter, in the shrinkage suppression layer removal step, the second region of the third ceramic base material layer and the second Since the shrinkage suppression layer is removed, the first region of the second ceramic base layer and the first columnar connection are formed on the first main surface side, which is the second ceramic base layer side, of the first ceramic base layer. The first cavity having the body as a bank portion is connected to the second main surface side of the first ceramic base layer, which is the third ceramic base layer side, and the first region of the third ceramic base layer and the second columnar connection. It becomes possible to efficiently and reliably manufacture a ceramic substrate having a structure including a second cavity whose body is a bank.

A method for manufacturing a ceramic substrate according to a tenth aspect is the invention according to any one of the first to eighth aspects, wherein the first ceramic base layer is related to the second ceramic base layer in the composite laminate forming step. On the opposite side, the ceramic base layer has an unsintered third ceramic base layer laminated via a second shrinkage suppression layer that is not substantially sintered at the sintering temperature of each ceramic base layer. And the 2nd shrinkage | contraction suppression layer forms the composite laminated body in which the 2nd columnar connection body for connecting a 2nd ceramic base material layer and a 3rd ceramic base material layer was formed, and in a notch groove formation process The third ceramic base material layer is divided into a first region connected to the second columnar connector and a second region not connected to the second columnar connector from the third ceramic base material layer side to the first region. Form a third cut groove reaching the shrinkage suppression layer and fire In the process, after sintering the unsintered ceramic base material layer and firing at a temperature at which the shrinkage suppression layer does not substantially sinter, in the shrinkage suppression layer removal step, the second region of the third ceramic base material layer and Since the second shrinkage suppression layer is removed, a ceramic substrate having a stepped cavity having a stepped portion on the side wall portion can be efficiently and reliably manufactured.
In addition, it is possible to obtain a ceramic substrate with a stepped cavity with a sharper and more precise shape than the method of directly crimping a composite laminate with a cavity-forming through hole for the shape of the inner wall of the cavity Become.

Moreover, the manufacturing method of the ceramic substrate of Claim 11 concerns on the invention in any one of Claims 1-8, Comprising: In a notch groove formation process, a 1st ceramic base material layer is made into a 1st columnar coupling body. A fourth cut groove that reaches the first shrinkage suppression layer from the first ceramic base material layer side is formed so as to be divided into a first region that is connected and a second region that is not connected to the first columnar coupling body, and is fired. In the process, after sintering the unsintered ceramic base material layer and firing at a temperature at which the shrinkage suppression layer does not substantially sinter, in the shrinkage suppression layer removal step, the second region of the first ceramic base material layer is formed. Since it is made to remove, a cavity can be formed in both surfaces. Therefore, it becomes possible to efficiently and reliably manufacture a ceramic substrate having a structure having cavities on both front and back surfaces.
In other words, when a thick surface-mounted component, especially an IC that requires wire bonding, must be placed on both sides, the overall height is reduced by placing the thick component inside the cavity. It becomes possible to provide a ceramic substrate that can be used.

  According to a twelfth aspect of the present invention, there is provided a method for manufacturing a ceramic substrate according to any one of the first to eleventh aspects, wherein an outermost ceramic base material in which a cut groove is formed among the ceramic base material layers. Since the shrinkage suppression layer is disposed outside the layer and the cut groove is formed in the ceramic base material layer where the cut groove is to be formed via the shrinkage suppression layer, it is combined in the formation process of the cut groove. It is possible to prevent the laminated body from being deformed and cause a decrease in shape accuracy, and in the firing step, by firing with a shrinkage suppression layer outside the outermost ceramic base material layer. It becomes possible to suppress and prevent deformation in the firing process.

  According to a thirteenth aspect of the present invention, there is provided a method for manufacturing a ceramic substrate according to any one of the first to twelfth aspects, wherein a shrinkage suppression layer is disposed outside the outermost ceramic base layer among the ceramic base layers. Since the composite laminate is fired in a state where the shrinkage suppression layers are disposed on both main surfaces, it is possible to suppress and prevent the composite laminate from shrinking in the direction parallel to the main surface in the firing process. Thus, it becomes possible to reliably manufacture a ceramic substrate with high shape accuracy.

  Further, as in the method for manufacturing a ceramic substrate according to claim 14, in the configuration of the invention according to claim 13, the composite laminate may be fired in a state in which a shrinkage suppression layer having no cut groove is provided on both main surfaces. As can be seen, when the outermost shrinkage suppression layer is formed with a cut groove, and further when the shrinkage suppression layer without the cut groove is formed on the outer side, the deformation in the firing step is reduced. It is possible to reliably manufacture a ceramic substrate with higher shape accuracy and dimensional accuracy, which is more reliably prevented.

  Further, as in the method for manufacturing a ceramic substrate according to claim 15, in the structure of the invention according to claim 13, at least one of the shrinkage suppression layers of the outermost layer is for forming a protrusion made of a conductive material containing a metal as a conductive component. By providing the columnar body and removing the outermost shrinkage suppression layer after firing the composite laminate, it is possible to efficiently manufacture a ceramic substrate having a protruding electrode on the surface.

  A method for manufacturing a ceramic substrate according to claim 16 is the method according to any one of claims 1 to 15, wherein each step is performed in a state of an aggregate substrate formed by assembling a plurality of ceramic substrates, and after firing. Since the process includes the step of dividing the collective substrate into the sub-substrates, it is possible to efficiently obtain a large number of sub-substrates by dividing the collective substrate, thereby reducing the cost.

  According to a seventeenth aspect of the present invention, there is provided a method for manufacturing a ceramic substrate according to the sixteenth aspect of the present invention. Since it is formed so as to reach the layer, it becomes possible to hold the aggregate substrate securely even in the state where unnecessary parts of the ceramic base layer for cavity formation are removed, and then split By dividing the collective substrate along the groove, the collective substrate can be divided to obtain a large number of child substrates efficiently, and the cost can be more reliably reduced.

  The features of the present invention will be described in more detail below with reference to examples of the present invention.

FIGS. 1-8 is a figure which shows the manufacturing method of the ceramic substrate concerning Example 1 of this invention.
FIGS. 9 to 19 are diagrams showing a method for manufacturing a ceramic substrate according to Example 1 of the present invention and a modification of the ceramic substrate manufactured by the manufacturing method.
Hereinafter, the manufacturing method of the ceramic substrate concerning Example 1 of this invention is demonstrated, referring FIGS.

(1) First, a plurality of ceramic green sheets for ceramic substrates (hereinafter referred to as “substrate green sheets”) containing a ceramic material are prepared. The procedure is as follows.
CaO: 10 to 55 wt%, SiO _2: 45 to 70 wt%, Al ₂ O _3: 0~30 wt%, 0-10 wt% impurities, and B ₂ O _3: 5 to 20% by weight outer percentage The mixture containing the mixture was melted at 1450 ° C. to be vitrified, then rapidly cooled in water, and pulverized to obtain CaO—SiO ₂ —Al ₂ O ₃ —B ₂ O ₃ having an average particle size of 3.0 to 3.5 μm. A system glass powder is prepared.
In Example 1, CaO—SiO ₂ —Al ₂ O ₃ —B ₂ O ₃ glass was used, but other glass sintered at 800 to 1000 ° C. may be used.

  Then, the glass powder: 50 to 65% by weight (preferably 60% by weight) and the alumina powder having impurities of 0 to 10% by weight: 50 to 35% by weight (preferably 40% by weight) are mixed to obtain a ceramic powder. Make it. Then, to this ceramic powder, a solvent such as toluene, xylene or water, a binder such as acrylic or butyral resin, and a plasticizer such as dioctyl phthalate (DOP) or dibutyl phthalate (DBP) are added sufficiently. A slurry having a viscosity of 2000 to 40000 cps is prepared by kneading and dispersing, and using a normal casting method (for example, a doctor blade method), for example, a green sheet having a thickness of 0.01 to 0.4 mm, that is, a main product of a ceramic substrate as a product. A green sheet for a substrate constituting the part is prepared.

  When manufacturing this green sheet for a substrate, the composition ratio and additives are adjusted, and by making the properties moderately softer than the following green sheet 2 for shrinkage suppression layer, It is possible to improve the followability to the mold and increase the processing accuracy, and it is possible to suppress and prevent the occurrence of cracks, chips, etc. in the green sheet for substrates.

  (2) Then, the substrate green sheet 1 (FIG. 1) produced in the above step (1) is cut into a predetermined size by using a punching die or a punching machine, and an interlayer connection via hole 33 (FIG. 1). Form.

(3) The via hole conductor 34 is formed by filling the via hole 33 of the plurality of substrate green sheets processed in the step (2) with a conductive paste. Further, by printing a conductor paste on the substrate green sheet 1, a predetermined wiring pattern that becomes the surface conductor 31, the inner layer conductor 32, and the like is formed.
As the conductor paste used at this time, a conductor paste containing Ag, Ag-Pd, Ag-Pt, Cu powder or the like as a conductive component is used. If necessary, it is also possible to print a resistance paste or a glass paste together with the conductor paste or instead of the conductor paste.
The ceramic base material layer 11 (FIGS. 1 and 2) is formed by laminating a plurality of the substrate green sheets 1.

(4) Further, a plurality of shrinkage suppression layer green sheets 2 (FIG. 1) including ceramics that are not sintered at the firing temperature of the substrate green sheet 1 are produced.
The green sheet 2 for shrinkage suppression layer can be obtained, for example, by preparing a slurry by dispersing alumina powder in an organic vehicle and molding the slurry into a sheet by a casting method. Since the sintering temperature of the green sheet 2 for shrinkage suppression layer thus obtained is 1500 to 1600 ° C., it is sintered at the temperature at which the green sheet 1 for substrate is sintered (for example, 800 to 1000 ° C.). First, by firing the substrate green sheet 1 in a state where the shrinkage suppression layer green sheet 2 is bonded, the substrate green sheet 1 can be sintered while suppressing shrinkage in the planar direction.

In addition, this green sheet 2 for shrinkage | contraction suppression layers uses what adjusted the physical property so that it might become harder than the green sheet 1 for a board | substrate so that it can process without damaging an unbaking ceramic body at the time of a press.
And the 1st shrinkage | contraction suppression layer 12a (FIG. 1, FIG. 2) is formed by laminating | stacking this green sheet 2 for shrinkage | contraction suppression layers.

  (5) Of the green sheet 2 for shrinkage suppression layer, the green sheet 2 for a substrate is disposed so as to be sandwiched between first and second ceramic base layers 11a and 11b, which are a laminate in which a plurality of green sheets 1 for a substrate are laminated. For the shrinkage-suppressing layer green sheet for forming the first shrinkage-suppressing layer 12a, the connection via hole 3 is formed by using a punching die or a punching machine.

Then, the first and second ceramic base layers 11a and 11b are connected and fixed by laminating the shrinkage-suppressing layer green sheet 2 filled with the paste serving as the first columnar coupling body 4a in the connection via hole 3. The 1st shrinkage | contraction suppression layer 12a provided with the 1st columnar coupling body 4a is formed.
The material for the first columnar coupling body 4a is the same material as the via-hole conductor 34 filled in the interlayer connection via hole 33 of the substrate green sheet 1, and the interlayer connection via hole 33 of the substrate green sheet 1. When the glass paste is filled, it is possible to use various materials such as a glass paste made of the same material as that of the glass paste and a paste made of a different material.

  (6) Next, the substrate green sheet 1 and the shrinkage suppression layer green sheet 2 are laminated to form a rectangular parallelepiped shape having no through-hole for forming a cavity and flat front and back surfaces as shown in FIGS. The composite laminate A is formed.

  The composite laminate A includes a first ceramic base layer 11a in which a plurality of substrate green sheets 1 are stacked, which is a bottom plate of a cavity, and a plurality of substrate green sheets 1 in which a bank bank is stacked. 2 ceramic substrate layer 11b, and a first shrinkage suppression layer 12a provided with a first columnar connecting body 4a is interposed between the two ceramic base layer 11b. 2 Outer shrinkage suppression layers 12c in which a plurality of shrinkage suppression layer green sheets 2 are stacked are disposed on the front and back main surfaces of the ceramic base layers 11a and 11b.

In Example 1, a characteristic evaluation conductor pattern 25 having an inductance L, a capacitance C, a resistance R, and the like is disposed inside the second ceramic base layer 11b. By providing position information and the like in a process control monitor substrate capable of grasping the characteristics of the composite laminate can be obtained.
In addition, it is possible to grasp the in-plane variation of the conductor pattern, etc. by giving the process control monitor board position information regarding stacking deviation, etc., and keep the product and perform destructive inspection etc. Rather, it is configured so that stable productivity can be ensured by grasping variation in characteristics among lots and variation in characteristics among aggregate substrates.

  (7) In order to further form a cavity, the second ceramic base layer 11b is divided into a first region R1 connected to the first columnar connector 4a and a second region R2 not connected to the first columnar connector 4a. The first notch reaching the first shrinkage suppression layer 12a between the two ceramic substrate layers from the second ceramic substrate layer 11b side of the composite laminate A so as to be divided into two layers. Grooves 6a are formed in a lattice shape in two in each of the vertical and horizontal directions with respect to the composite laminate A (child substrate) (see FIGS. 3 and 4). As a result, the composite laminate A is divided into a total of nine regions, that is, the central portion 20 and the peripheral portion 20a when viewed in plan.

  Moreover, the formation aspect of the notch groove 6a to the composite laminated body A (child board | substrate) is not limited to the aspect divided | segmented into nine area | regions as mentioned above. Further, the cut line can be a curved line instead of a straight line.

  (8) Then, even in the state in which the first cut groove 6a is formed, the composite laminate A that maintains a rectangular parallelepiped shape without any through-holes or irregularities is hydrostatically pressed, or a uniaxial press using a mold is used. To obtain a composite laminate A that has been crimped (FIG. 5).

The pressing is performed at a pressure of 100 to 2000 kg / cm ² , preferably 1000 to 2000 kg / cm ² and a temperature of 30 to 100 ° C., preferably 50 to 80 ° C.

  In the first embodiment, the first cut groove 6a is formed and then crimped. However, the first cut groove 6a may be formed after the crimping.

  (9) Then, the bonded composite laminate A is fired at a temperature at which the first and second ceramic base layers 11a and 11b are sintered, for example, 1000 ° C. or less, preferably 800 to 1000 ° C. The sintered substrate 14 in which the sintered first ceramic base layer 11a and the second ceramic base layer 11b are connected to each other by the sintered first columnar connecting body 4a inside the composite laminate A (FIG. 6). Reference).

  Note that when a conductive paste using a base metal powder such as Cu powder as a conductive component is used as a material for forming the first columnar connector 4a, it is necessary to fire in a reducing atmosphere to prevent oxidation. When a conductive paste using a noble metal powder such as Ag-Pd or Ag-Pt as a conductive component is used, it can be fired in the air.

  (10) Next, in the second region R2 of the second ceramic substrate layer 11b separated from the first region R1 of the second ceramic substrate layer 11b by the cut groove 6a, that is, in the central portion 20 of FIG. The corresponding portion, the unsintered first shrinkage suppression layer 12a, and the outer shrinkage suppression layer 12c on both the front and back main surfaces were removed, and a cavity C was provided as shown in FIGS. A sintered substrate (ceramic substrate) 14 is obtained. The sintered substrate (ceramic substrate) 14 includes a first ceramic base layer 11a in which the first region R1 of the second ceramic base layer 11b and the first ceramic base layer 11a are connected via the first columnar connecting body 4a. Around the material layer 11a, there is provided a quadrangular annular bank portion B including a first columnar coupling body 4a and a first region R1 of the second ceramic base layer 11b held by the first columnar coupling body 4a. It has a structure provided with a cavity C in a part surrounded by part B.

  As a method for removing the first shrinkage suppression layer 12a and the outer shrinkage suppression layer 12c, either a physical treatment method such as ultrasonic cleaning or a method of spraying alumina abrasive grains, or a chemical treatment method such as etching is used. In addition, it is also possible to use a combination of a physical treatment method and a chemical treatment method.

(11) Then, in order to mount various electronic components on the sintered substrate (ceramic substrate) 14 in a highly reliable manner, a plating film is formed on the surface conductor 31 and via-hole conductor 34 exposed on the surface. To do.
At this time, it is desirable to use, for example, Ni—Au, Ni—Pd—Au, Ni—Sn or the like as the material of the plating film. In addition, as a formation method of a plating film, it is possible to use either electrolytic plating or electroless plating.

  (12) As shown in FIG. 9, a surface-mounted component such as a semiconductor element 17 is mounted in the cavity C of the ceramic substrate 14 and sealed with a resin 8 as shown in FIG. Thus, an advanced module substrate 114 having a cavity C in which surface mount components such as the semiconductor element 17 are mounted is obtained.

  Further, as shown in FIG. 11, after mounting a surface mounting component such as a semiconductor element 17 on the ceramic substrate 14, it is sealed with the resin 8 so that the semiconductor element 17 sealed with the resin 8 is on the lower surface side. By mounting on the mother board 9 or the like, it becomes possible to mount surface mount components such as the electronic component 16 on the upper surface side, and the surface mount components of the electronic component 16 and the semiconductor element 17 are efficiently mounted on both main surfaces. It is possible to efficiently manufacture the arranged advanced module substrate 114a.

  In addition, although the said Example 1 demonstrated the case where one ceramic substrate 14 was manufactured, this invention is implemented in the state of the collective substrate 35 which aggregates several ceramic substrates, and after baking, a collective substrate It is also possible to obtain individual ceramic substrates 14 by dividing 35 into individual ceramic substrates 14.

  In that case, for example, as shown in FIG. 12, the division grooves for dividing the ceramic substrate 14 that is the composite laminate A from the surface on the second ceramic base layer 11 b side that becomes the bank portion B of the cavity C. 5 is formed to a depth of about 20% of the thickness of the first ceramic base material layer 11a using a dicing blade or the like, and the aggregate substrate 35 can be divided after firing.

When the present invention is implemented in the state of the aggregate substrate 35 formed by assembling a plurality of ceramic substrates 14, the aggregate substrate 35 can be divided and a large number of ceramic substrates 14 can be efficiently obtained, thereby reducing costs. Can be achieved.
In addition, since the process of dividing the aggregate substrate 35 into the composite laminate A and the process of forming the first cut groove 6a for forming the cavity C can be formed almost simultaneously in the same process, the shape accuracy and dimensions A highly accurate ceramic substrate can be efficiently manufactured.

That is, from the configuration of the first embodiment, the following specific effects can be obtained.
(1) Since the composite laminate A can be formed without a through-hole serving as the cavity C as in the prior art, the penetration serving as the cavity C in the press-bonding process when forming the composite laminate A is achieved. It is possible to efficiently manufacture the ceramic substrate 14 with high shape accuracy without causing deformation of the holes.

  (2) Further, the first cut groove 6a penetrating the second ceramic base layer 11b can be formed to a depth reaching the first shrinkage suppression layer 12a between the ceramic base layers, and the first Since the shrinkage suppression layer 12a can be formed thick, a certain amount of variation is allowed in the depth of the first cut groove 6a, so that the ceramic substrate 14 having the cavity C with high shape accuracy is stably formed. It becomes possible.

  (3) Further, the composite base material A is formed by laminating the ceramic base material layer and the first shrinkage suppression layer 12a provided with the first columnar connecting body 4a, but the thickness is different in the same ceramic base material layer. Since there is no portion, it is possible to cause shrinkage while suppressing or preventing the stress from varying in the thickness direction of the ceramic base material layer during firing. In other words, since the ceramic base material layer constituting the bank portion B around the cavity C and the ceramic base material layer constituting the bottom of the cavity are separated by the first shrinkage suppression layer 12a, each ceramic base material The shrinkage of the layers does not affect each other, and it becomes possible to form a flat ceramic base material layer, respectively, and the ceramic base material layer constituting the bank portion B and the ceramic base material layer constituting the cavity bottom are first columnar. It is possible to obtain the ceramic substrate 14 with high shape accuracy connected through the connecting body 4a.

  (4) In addition, in the conventional manufacturing method, the portion that becomes the cavity C of the ceramic base layer is a through hole and is discarded, but in the present invention, the composite is used until the firing step is completed. Since the characteristic evaluation conductor pattern 25 is arranged by utilizing the fact that it exists as a part of the laminate A, it is possible to efficiently grasp the characteristics and ensure stable productivity. It becomes possible to do.

  (5) The first cut groove 6a is formed so as to be orthogonal to the composite laminate A, and the corner portion of the bank portion B formed by removing the central portion 20 or the like is likely to start a crack. As shown in FIG. 7, the (corner portion) is separated from other regions by the first cut groove 6a (the edge is cut), so that cracks are unlikely to occur from the corner portion to the bank portion B. A ceramic substrate can be obtained.

  FIG. 13 is a perspective view showing a ceramic substrate according to a modification of the present invention, and FIG. 14 is a plan view. The ceramic substrate 14a has the same configuration as the ceramic substrate 14 shown in FIG. 7 except that the four corners of the bank portion B are cut out.

  By using a structure in which the four corners of the bank portion B are cut out like the ceramic substrate 14a, it is possible to prevent the chipping from occurring at the four corners of the bank portion B that is easily chipped, and the sides L1, L2, When the four sides of the side L3 and the side L4 are joined, the stress applied to the corner of the bank B is released, and a highly reliable ceramic substrate is obtained in which the bank B is not broken by the stress. Is possible.

  FIGS. 15, 16, 17, and 18 are plan views showing the configuration of a ceramic substrate according to still another modification of the present invention.

The ceramic substrate 14b having the bank portion B as shown in FIG. 15 is formed with the first cut grooves 6a so that the second ceramic base layer 11b is divided into 25 regions when seen in a plane. It can be produced by removing the central portion of the second ceramic base layer 11b and the central portions of the two opposing sides of the side L1 and the side L2.
In the case of this configuration, it is also possible to adopt a configuration in which a metal cap is sandwiched between the remaining sides L3 and L4.

  When the ceramic substrate 14b is manufactured, only the portion remaining as the bank portion B of the second ceramic base layer 11b is connected by the first columnar connecting body 4a, and the removed portion is the first columnar connecting body 4a. It is necessary to prevent them from being connected by each other.

  Further, the ceramic substrate 14c having the bank portion B as shown in FIG. 16 is formed with the first cut grooves 6a so that the second ceramic base material layer 11b is divided into 25 regions when seen in a plan view. And it can produce by removing the center part of the 2nd ceramic base material layer 11b, and the center part of all the 4 sides, side L1, side L2, side L3, side L4.

  In the case of this ceramic substrate 14c, for example, a semiconductor element (not shown) can be mounted in the center of the cavity C, and a wire bonding pad can be formed near the end of the substrate. Stable wire bonding can be performed even in a region that could not be formed because no capillary was inserted.

  When the ceramic substrate 14c is manufactured, only the portion remaining as the bank portion B of the second ceramic base layer 11b is connected by the first columnar connecting body 4a, and the removed portion is the first columnar connecting body 4a. It is necessary to prevent them from being connected by each other.

  Further, as shown in FIG. 17, the ceramic substrate 14d having the bank portion B at the four corners and the bank portion Ba inside the peripheral portion has 25 regions when the second ceramic base layer 11b is seen in a plan view. By forming the first cut groove 6a to be partitioned and removing the central portion of the second ceramic base layer 11b and the central portions of all four sides of the side L1, the side L2, the side L3, and the side L4 Can be produced.

  Also in this case, the same effect as that of the first embodiment can be obtained, and further, for example, it is possible to mount a semiconductor element in the cavity C and form a wire bonding pad on the bank portion Ba in the vicinity thereof. Thus, stable wire bonding can be performed.

  Further, in the ceramic substrate 14d of FIG. 17, the first columnar connecting body 4a includes a reinforcing columnar connecting body 4c that does not electrically connect the first conductor pattern and the second conductor pattern. In addition, as a constituent material of the reinforcing columnar coupling body 4c, for example, a ceramic columnar body or the like can be used.

  FIG. 18 is a diagram schematically showing the structure of the main part of the composite laminate for explaining an example of the method for producing the ceramic substrate provided with the reinforcing columnar coupling body 4c.

  As shown in FIG. 18, as the reinforcing columnar coupling body 4c, a material different from the via-hole conductor 34 disposed in the ceramic base material layers 11a and 11b (for example, the same as the ceramic material constituting the ceramic base material layers 11a and 11b). In the case of using a material made of a ceramic material, the reinforcing columnar coupling body 4c is disposed on the first shrinkage suppression layer 12a (that is, the first ceramic base layer 11a and the second ceramic base). By disposing the reinforcing columnar coupling body 4c only between the material layers 11b), the first ceramic substrate layer 11a and the second ceramic substrate layer 11b are produced in the same manner as in Example 1 above. However, it is possible to efficiently manufacture a highly reliable ceramic substrate connected by the first columnar connecting body 4a and the reinforcing columnar connecting body 4c.

  FIG. 19 is a diagram showing a ceramic substrate 14e according to another modification. The ceramic substrate 14e has a structure in which the bank portion B is formed in a substantially rectangular parallelepiped shape only on one side and is not disposed on the other side.

  That is, in the ceramic substrate of the present invention, the shape of the bank portion B is not limited, and the bank portion B may be formed only on one side as shown in FIG. Further, although not particularly illustrated, a bank portion B may be formed in a substantially L shape on two sides, and a bank portion B is formed on three sides, and there is no bank portion only on one side. It is also possible.

FIG. 20 is a diagram showing one process of a method for manufacturing a ceramic substrate according to still another embodiment (Example 2) of the present invention. FIG. 21 is a diagram of a ceramic substrate manufactured by the method for manufacturing a ceramic substrate according to Example 2. It is a figure which shows a structure.
20 and 21, the same reference numerals as those in FIGS. 1 to 9 indicate the same or corresponding parts.
In the second embodiment, configurations other than those described below are the same as those in the first embodiment.

  The method for manufacturing the ceramic substrate of Example 2 is a method for manufacturing a ceramic substrate having a double-sided cavity structure by forming three or more ceramic base layers and forming slits for forming cavities from both main surfaces. It depends on.

FIG. 20 shows a state in which cut grooves are formed in the composite laminate A. The composite laminate A of Example 2 includes a first ceramic base layer 11a and a second ceramic base layer 11b stacked on the first ceramic base layer 11a via a first shrinkage suppression layer 12a. A second shrinkage suppression layer 12b that does not substantially sinter at the temperature at which each ceramic base material layer is sintered is disposed on the side of the ceramic base material layer 11a opposite to the side on which the second ceramic base material layer 11b side is disposed. And the second shrinkage suppression layer 12b connects the first ceramic base layer 11a and the third ceramic base layer 11c to each other. For this purpose, a second columnar connecting body 4b is provided.
Further, an outer shrinkage suppression layer 12c is disposed outside the second ceramic base layer 11b and the third ceramic base layer 11c.

  And in this Example 2, the 2nd ceramic base material layer 11b is made into 1st area | region R1 connected to the 1st columnar coupling body 4a, and 2nd area | region R2 which is not connected to the 1st columnar coupling body 4a. The first cut groove 6a for dividing is formed, and the third ceramic base layer 11c is connected to the first region R1 connected to the second columnar coupling body 4b and the second columnar coupling body 4b. A second cut groove 6b for dividing the second region R2 is not formed.

  In forming the cut grooves 6a and 6b, the first cut groove 6a is formed so as to reach the first shrinkage suppression layer 12a from the second ceramic base layer 11b side, and the third ceramic base layer 11c side is formed. The second notch 6b is formed so as to reach the second shrinkage suppression layer 12b from the second region R2 which is an unnecessary part of the second and third ceramic base layers 11b and 11c after firing, The shrinkage suppression layers 12a, 12b, and 12c can be reliably removed.

  And after baking the composite laminated body A in which the notch groove 6a, 6b was formed as mentioned above, 2nd area | region R2 of the 2nd and 3rd ceramic base material layers 11b, 11c, and each shrinkage | contraction suppression layer 12a, 12b , 12c, and the second ceramic substrate layer 11b on the first main surface F1 side, which is the second ceramic substrate layer 11b side, of the first ceramic substrate layer 11a, as shown in FIG. The first cavity C1 having the first column R4 and the first columnar connecting body 4a as the bank portion B, the first ceramic base layer 11a on the second main surface F2 side which is the third ceramic base layer 11c side, The ceramic substrate 14f provided with the 2nd cavity C2 which used the 1st area | region R1 of the 3rd ceramic base material layer 11c and the 2nd columnar coupling body 4b as a bank part is obtained.

  In the ceramic substrate 14f obtained by the method of manufacturing the ceramic substrate of Example 2, as described above, the second and third ceramic base layers formed on both the front and back surfaces of the first ceramic base layer are front and back. Since the cut grooves 6a and 6b are formed from both sides to form cavities, a ceramic substrate having cavities with high positional accuracy and shape accuracy on both sides can be efficiently manufactured.

FIG. 22 is a diagram showing one process of a method for manufacturing a ceramic substrate according to still another embodiment (Example 3) of the present invention, and FIG. 23 shows a ceramic substrate manufactured by the method for manufacturing a ceramic substrate according to Example 3. It is a figure which shows a structure.
22 and 23, the same reference numerals as those in FIGS. 1 to 9 denote the same or corresponding parts.
In the third embodiment, the configuration other than the configuration described below is the same as that in the first embodiment.

  The method of manufacturing the ceramic substrate of Example 3 is related to a method of manufacturing a ceramic substrate 14g having a stepped cavity C3 having a stepped portion on the side wall as shown in FIG.

  FIG. 22 shows a state in which cut grooves are formed in the composite laminate A in the manufacturing process of the ceramic substrate of the third embodiment. The composite laminate A of Example 3 includes a first ceramic base layer 11a, a first shrinkage suppression layer 12a, and a second ceramic base layer 11b, and further includes a second ceramic base layer. An unsintered third ceramic base layer 11c laminated via a second shrinkage suppression layer 12b that does not substantially sinter at the sintering temperature of each ceramic base layer is provided on the upper surface side of 11b. And the 2nd shrinkage | contraction suppression layer 12b is provided with the 2nd columnar coupling body 4b for connecting the 2nd ceramic base material layer 11b and the 3rd ceramic base material layer 11c. Further, an outer shrinkage suppression layer 12c is disposed outside the first ceramic base layer 11a and the third ceramic base layer 11c.

  The third ceramic base layer 11c is divided into a first region R1 connected to the second columnar connector 4b and a second region R2 not connected to the second columnar connector 4b. A first region R1 in which the first cut groove 6a is formed so as to reach the second shrinkage suppression layer 12b from the material layer 11c side, and the second ceramic base layer 11b is connected to the first columnar coupling body 4a. A third cut groove 6c that reaches the first shrinkage suppression layer 12a from the third ceramic base material layer 11c side is formed so as to be divided into the second region R2 that is not connected to the columnar connector 4a.

  And after baking the composite laminated body A in which notch groove 6a, 6c was formed as mentioned above, 2nd area | region R2 of 2nd and 3rd ceramic base material layer 11b, 11c, and each shrinkage | contraction suppression layer 12a, 12b , 12c, as shown in FIG. 23, the first region R1 of the second ceramic base layer 11b and the third ceramic base layer 11c, and the first and second columnar coupling bodies 4a, 4b The ceramic substrate 14g having the stepped cavity C3 having the stepped portion on the side wall portion, which is the bank portion B, can be manufactured efficiently and reliably.

  In addition, according to the method of Example 3, the bank portion B serving as the intermediate layer of the cavity C3, that is, the second portion, compared to the conventional method of directly pressing the composite laminate including the through holes for forming the cavity, The shape of the side wall of the second region R2 of the ceramic base layer 11b is sharp, and a ceramic substrate having a stepped cavity with high shape accuracy can be efficiently manufactured.

FIG. 24 is a diagram showing one step of a method for manufacturing a ceramic substrate according to still another embodiment (Example 4) of the present invention, and FIG. 25 is a diagram of the ceramic substrate manufactured by the method for manufacturing a ceramic substrate according to Example 4. FIG. 26 is a diagram showing a structure, and FIG. 26 is a diagram showing a module substrate in which surface-mounted components are mounted on the ceramic substrate shown in FIG.
24, 25, and 26, the same reference numerals as those in FIGS. 1 to 9 denote the same or corresponding parts.
In the fourth embodiment, configurations other than those described below are the same as those in the first embodiment.

  In addition, as shown in FIG. 25, the manufacturing method of the ceramic substrate of this Example 4 is provided with cavities C on the front surface side and the back surface side, and the shapes of the cavities formed on the front and back surfaces are different from each other. 14h is a method for manufacturing 14h.

  FIG. 24 shows a state in which cut grooves are formed in the composite laminate A in the manufacturing process of the ceramic substrate of the fourth embodiment. The composite laminate A of Example 4 includes a first ceramic substrate layer 11a and a second ceramic substrate layer 11b laminated on the lower side via a first shrinkage suppression layer 12a. Regions where cavities C (see FIG. 25) are to be formed are provided on each of the ceramic base material layer 11a side and the second ceramic base material layer 11b side. Moreover, the outer side shrinkage | contraction suppression layer 12c is arrange | positioned on the outer side of the 1st ceramic base material layer 11a and the 2nd ceramic base material layer 11b.

  And in this Example 4, the 1st ceramic base material layer 11a and the 2nd ceramic base material layer 11b are made into 1st field R1 connected to the 1st columnar coupling body 4a, and the 1st columnar coupling body 4a. As a cut groove for dividing the second region R2 that is not connected, the fourth cut groove 6d is formed from the first ceramic base layer 11a side, and the first cut groove 6a is formed from the second ceramic base layer 11b side. The first cut groove 6a and the fourth cut groove 6d are formed at positions that are asymmetric so that cavities having different shapes are formed on both the front and back main surfaces.

  And after baking the composite laminated body A in which the notch grooves 6a and 6d were formed as described above, the second region R2 of the first and second ceramic base layers 11a and 11b and the respective shrinkage suppression layers 12a and 12c. 25, as shown in FIG. 25, it is possible to obtain a ceramic substrate 14h having cavities C on both the front and back main surfaces and having different cavities.

  Further, as shown in FIG. 26, the semiconductor element 17 is mounted in each cavity C on both sides of the ceramic substrate 14h, and the electronic component 16 is mounted on the ceramic base layers 11a and 11b. The components can be efficiently arranged, and the height of the components is low, so that the advanced module substrate 114 can be efficiently manufactured.

FIG. 27 is a diagram showing one process of a method for manufacturing a ceramic substrate according to still another embodiment (Example 5) of the present invention, and FIG. 28 shows a ceramic substrate manufactured by the method for manufacturing a ceramic substrate according to Example 5. It is a figure which shows a structure.
27 and 28, the same reference numerals as those in FIGS. 1 to 9 denote the same or corresponding parts.
In the fifth embodiment, configurations other than those described below are the same as those in the first embodiment.

  In addition, as shown in FIG. 28, the manufacturing method of the ceramic substrate of Example 5 is a ceramic having a structure in which a cavity is provided and part of a columnar coupling body protrudes as a protruding electrode on the front surface side and the back surface side. This relates to a method of manufacturing the substrate 14i.

  FIG. 27 shows a state in which cut grooves are formed in the composite laminate A in the ceramic substrate manufacturing process of the fifth embodiment. The composite laminate A of Example 5 includes a first ceramic substrate layer 11a, a second ceramic substrate layer 11b laminated via a first shrinkage suppression layer 12a, and a lower surface of the first ceramic substrate layer 11a. And an outer shrinkage suppression layer 12c disposed on the upper surface side of the second ceramic base material layer 11b.

  The upper and lower outer shrinkage suppression layers 12c are each provided with a protrusion-forming columnar body 4d for forming a protrusion, that is, a portion to be a protrusion electrode in the fifth embodiment. The protrusion-forming columnar body 4d is made of a conductive material containing a metal as a conductive component, and has a composition such that the protrusion electrode 24 that is a protrusion is formed by firing. Yes.

  The second ceramic base layer 11b is divided into a first region R1 connected to the first columnar connector 4a and a second region R2 not connected to the first columnar connector 4a. The first cut groove 6a is formed from the upper outer shrinkage suppression layer 12c side so as to reach the first shrinkage suppression layer 12a.

Thereafter, after firing the composite laminate A in which the first cut grooves 6a are formed as described above, the second region R2 of the second ceramic base layer 11b and the respective shrinkage suppression layers 12a and 12c are removed. Thus, as shown in FIG. 28, it is possible to efficiently and surely manufacture the ceramic substrate 14i having the cavity C and having the structure in which the protruding electrodes 24 as the protruding portions are formed on the front surface side and the back surface side. it can.
[Modification]

FIG. 29 is a diagram showing a step of the method of manufacturing the ceramic substrate according to the modified example of Example 5, and FIG. 30 shows the structure of the ceramic substrate manufactured by the method of manufacturing the ceramic substrate according to the modified example. FIG. 31 and FIG. 31 are views showing a state where a surface mounting component is mounted on the ceramic substrate.
29, 30, and 31, the parts denoted by the same reference numerals as those in FIGS. 1 to 9 indicate the same or corresponding parts.

  As shown in FIG. 29, in addition to the above-described protrusion-forming columnar body 4d, another protrusion-forming columnar body 4f is formed in the lower outer shrinkage suppression layer 12c, and the first cut groove 6a is formed. After forming and firing, the second region R2 of the second ceramic base layer 11b and the respective shrinkage suppression layers 12a and 12c are removed, thereby providing a cavity C as shown in FIG. The ceramic substrate has a structure in which the protruding electrodes 24 as the protruding portions are formed on the front surface side and the back surface side, and the protruding electrodes 24a as the protruding portions are formed on the upper and lower main surfaces of the first ceramic base layer 11a. 14j can be manufactured efficiently and reliably.

  Then, as shown in FIG. 31, by mounting the surface mounting components such as the semiconductor element 17 on the upper surface side of the first ceramic base layer 11a constituting the ceramic substrate 14j, the surface mounting components are efficiently arranged. The advanced module substrate 114 can be efficiently manufactured.

  In addition, by adopting a configuration as shown in FIG. 31, a small, low-profile, high-density structure having a structure in which surface-mounted components are placed in the cavity C and mounted by low-loop wire bonding using short wires. It is possible to obtain a module substrate.

FIG. 32 is a diagram showing one process of a method for manufacturing a ceramic substrate according to still another embodiment (Example 6) of the present invention, and FIG. 33 shows a ceramic substrate manufactured by the method for manufacturing a ceramic substrate according to Example 6. It is a figure which shows a structure.
32 and 33, the same reference numerals as those in FIGS. 1 to 9 denote the same or corresponding parts.
Further, in the sixth embodiment, configurations other than those described below are the same as those in the first embodiment.

  In Example 6, when forming the first cut groove 6a in the composite laminate A having the same configuration as the composite laminate A of Example 1, as shown in FIG. 32, the first cut groove 6a is formed into the composite laminate. The first cut groove 6a is formed in such a manner that it does not reach the end of the body A, that is, in the form of a square shape, and after firing, the first portion which is an unnecessary portion of the second ceramic base layer 11b. By removing the two regions R2 and the respective shrinkage suppression layers 12a and 12c, as shown in FIG. 33, a ceramic substrate 14k having a structure without cut grooves at the four corners of the bank portion B is obtained.

  When the first cut groove 6a is formed in a square shape as described above, the first cut groove is formed only in the portion that becomes the outer peripheral portion of the cavity by using a pin or a cutting blade that is partially slit. 6a can be formed.

  In addition, this invention is not limited to the said Example, The specific structure of a composite laminated body, the specific shape of a cavity, the formation method of a composite laminated body, and connecting a ceramic base material layer to a columnar coupling body The shape of each region when dividing the first region and the second region not connected to the columnar connected body, the formation method and specific arrangement mode of the cut groove, the firing condition of the composite laminate, the firing method, etc. However, various applications and modifications can be made within the scope of the invention.

  The method for producing a ceramic substrate of the present invention comprises a first ceramic base layer, an unsintered second ceramic base layer, and a first columnar connecting body for connecting the two, and each ceramic base layer Since the composite laminate is formed by laminating through the first shrinkage suppression layer that is not substantially sintered at the temperature of sintering, there is no through-hole serving as a cavity as in the prior art. Thus, since it becomes possible to form a composite laminate, it is possible to prevent deformation of the through-holes that become cavities in the press-bonding step when forming the composite laminate, and the second A first cut groove that reaches the first shrinkage suppression layer from the second ceramic base layer side of the composite laminate is formed in the ceramic base layer, and after firing, an unnecessary portion of the ceramic base layer and the shrinkage suppression layer are formed. By removing Since so as to produce a ceramic substrate with Ti, without the need for complicated manufacturing processes and production equipment, it is possible to efficiently produce a ceramic substrate having a high cavity structure form accuracy.

  Therefore, the present invention can be widely used in fields such as a ceramic substrate used for various applications and a module substrate on which various electronic components are mounted on the ceramic substrate.

It is a figure which shows 1 process of the manufacturing method of the ceramic substrate concerning Example 1 of this invention, Comprising: It is an exploded view which shows the structure of a composite laminated body. It is a figure which shows 1 process of the manufacturing method of the ceramic substrate concerning Example 1 of this invention, Comprising: It is a figure which shows the structure of the formed composite laminated body. It is a figure which shows 1 process of the manufacturing method of the ceramic substrate concerning Example 1 of this invention, Comprising: It is sectional drawing which shows the state which formed the 1st notch groove in the composite laminated body. It is a figure which shows 1 process of the manufacturing method of the ceramic substrate concerning Example 1 of this invention, Comprising: It is a perspective view which shows the state which formed the 1st notch groove in the composite laminated body. It is a figure which shows 1 process of the manufacturing method of the ceramic substrate concerning Example 1 of this invention, Comprising: It is a figure which shows the composite laminated body after baking. It is a figure which shows 1 process of the manufacturing method of the ceramic substrate concerning Example 1 of this invention, Comprising: The state after removing the unnecessary part and shrinkage | contraction suppression layer of a ceramic base material layer from the composite laminated body after baking is shown. FIG. It is a perspective view which shows the ceramic substrate manufactured by the manufacturing method of the ceramic substrate of Example 1 of this invention. It is a top view which shows the ceramic substrate manufactured by the manufacturing method of the ceramic substrate of Example 1 of this invention. It is a figure which shows the state which mounted the surface mounting components on the ceramic substrate of FIG. It is a figure which shows the state which sealed the cavity with resin after mounting a surface mounting component in the ceramic substrate of FIG. It is a figure which shows the state which mounted the ceramic substrate of FIG. 10 on the motherboard. It is a figure explaining the method to manufacture a ceramic substrate by the method of dividing | segmenting a sub-substrate from an aggregate substrate. It is a perspective view which shows the modification of the ceramic substrate manufactured by the manufacturing method of the ceramic substrate of Example 1 of this invention. It is a top view of the ceramic substrate of FIG. It is a top view which shows the other modification of the ceramic substrate manufactured by the manufacturing method of the ceramic substrate of Example 1 of this invention. It is a top view which shows the further another modification of the ceramic substrate manufactured by the manufacturing method of the ceramic substrate of Example 1 of this invention. It is a top view which shows the further another modification of the ceramic substrate manufactured by the manufacturing method of the ceramic substrate of Example 1 of this invention. It is a figure which shows the modification of the manufacturing method of the ceramic substrate of Example 1 of this invention, Comprising: The principal part of the composite laminated body for demonstrating an example of the manufacturing method of the ceramic substrate provided with the columnar connection body for reinforcement It is sectional drawing which shows a structure typically. It is a perspective view which shows the further another modification of the ceramic substrate manufactured by the manufacturing method of the ceramic substrate of Example 1 of this invention. It is a figure which shows 1 process of the manufacturing method of the ceramic substrate concerning Example 2 of this invention, Comprising: It is a figure which shows the structure of a composite laminated body. It is a figure which shows the ceramic substrate manufactured by the manufacturing method of the ceramic substrate concerning Example 2 of this invention. It is a figure which shows 1 process of the manufacturing method of the ceramic substrate concerning Example 3 of this invention, Comprising: It is a figure which shows the structure of a composite laminated body. It is a figure which shows the ceramic substrate manufactured by the manufacturing method of the ceramic substrate concerning Example 3 of this invention. It is a figure which shows 1 process of the manufacturing method of the ceramic substrate concerning Example 4 of this invention, Comprising: It is a figure which shows the structure of a composite laminated body. It is a figure which shows the ceramic substrate manufactured by the manufacturing method of the ceramic substrate concerning Example 4 of this invention. It is a figure which shows the module board which mounted the surface mounting component on the ceramic substrate of FIG. It is a figure which shows 1 process of the manufacturing method of the ceramic substrate concerning Example 5 of this invention, Comprising: It is a figure which shows the structure of a composite laminated body. It is a figure which shows the ceramic substrate manufactured by the manufacturing method of the ceramic substrate concerning Example 5 of this invention. It is a figure which shows the modification of the manufacturing method of the ceramic substrate concerning Example 5 of this invention, Comprising: It is a figure which shows the structure of the composite laminated body formed at the manufacturing process. It is a figure which shows the ceramic substrate manufactured by the method concerning the modification of the manufacturing method of the ceramic substrate concerning Example 5 of this invention. It is a figure which shows the module board which mounted the surface mounting component on the ceramic substrate of FIG. It is a figure which shows 1 process of the manufacturing method of the ceramic substrate concerning Example 6 of this invention, Comprising: It is a figure which shows the state which formed the 1st notch groove in the composite laminated body. It is a perspective view which shows the ceramic substrate manufactured by the manufacturing method of the ceramic substrate concerning Example 6 of this invention. It is a figure which shows the conventional ceramic structure.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Green sheet for board | substrates 2 Green sheet for shrinkage | contraction suppression layers 3 Via hole for connection of green sheet | seats for shrinkage | contraction suppression layers 4a 1st columnar coupling body 4b 2nd columnar coupling body 4c Reinforcing columnar coupling body 4d, 4f Projection forming columnar body 5 Sub board split groove 6a First cut groove 6b Second cut groove 6c Third cut groove 6d Fourth cut groove 8 Resin 9 Motherboard 11 Ceramic base layer 11a First ceramic base layer 11b Second ceramic base layer 11c Third Ceramic substrate layer 12a First shrinkage suppression layer 12b Second shrinkage suppression layer 12c Outer shrinkage suppression layer 14 Sintered substrate 14a, 14b, 14c, 14d, 14e, 14f, 14g, 14h, 14i, 14j, 14k Ceramic substrate 16 Electron Component 17 Semiconductor element 20 Central part 20a Peripheral part 24, 24a of central part Projecting electrode 25 Conductor pattern for characteristic evaluation 31 Surface conductor 32 Inner layer conductor 33 Via hole for interlayer connection 34 Via hole conductor 35 Collective substrate 114, 114a Module substrate A Composite laminate B Bank portion Ba Bank portion on the inner side from the peripheral portion C Cavity C1 First cavity C2 Second cavity C3 Stepped cavity F1 First main surface F2 Second main surface L1, L2, L3, L4 Side R1 First region R2 Second region

Claims (17)

(a) The unsintered or sintered first ceramic base layer and the unsintered second ceramic base layer are not substantially sintered at the temperature at which each ceramic base layer is sintered. It is stacked through a first shrinkage suppression layer, and the composite laminate to form a composite laminate which have a first columnar coupling body for coupling with the first ceramic base material layer and the second ceramic substrate layer Body formation process,
(b) The composite laminate so as to divide the second ceramic base layer into a first region connected to the first columnar connected body and a second region not connected to the first columnar connected body. A notch groove forming step of forming a first notch groove reaching the first shrinkage suppression layer from the second ceramic substrate layer side of
(c) In the composite laminate, when the first ceramic base layer is unsintered, the first and second ceramic base layers are sintered, and the first shrinkage suppression layer is substantially When the first ceramic base layer is sintered, the second ceramic base layer is sintered, and the first shrinkage suppression layer is substantially fired. A firing step of firing at a temperature at which no binding occurs;
(d) The second region of the second ceramic base layer and the first shrinkage suppression layer are removed, and the first region of the second ceramic base layer and the first ceramic base layer are And a shrinkage suppression layer removing step of taking out the ceramic substrate connected via the one-column-shaped connecting body.   The second region is formed so as to be surrounded by the first region, and by removing the second region, the first region of the second ceramic base layer and the first columnar coupling body are bank portions. The method for manufacturing a ceramic substrate according to claim 1, wherein the cavity is formed.   3. The method for manufacturing a ceramic substrate according to claim 1, wherein the first cut groove is a lattice-shaped cut groove.   The first ceramic base layer has a first conductor pattern on the surface and / or inside thereof, and the second ceramic base layer has a second conductor pattern on the surface and / or inside thereof, The said 1st columnar coupling body contains the columnar coupling body which consists of an electroconductive material which electrically connects the said 1st conductor pattern and the said 2nd conductor pattern, Any one of Claims 1-3 characterized by the above-mentioned. A method for producing a ceramic substrate according to claim 1.   The said 1st columnar coupling body contains the columnar coupling body for a reinforcement which has not electrically connected the said 1st conductor pattern and the said 2nd conductor pattern, The any one of Claims 1-4 characterized by the above-mentioned. A method for producing a ceramic substrate as described in 1.   The method for producing a ceramic substrate according to claim 1, wherein a characteristic evaluation conductor pattern is formed in the second region of the second ceramic base layer.   3. The method according to claim 2, further comprising a step of providing a resin layer so as to fill a space defined by the first ceramic base layer, the second ceramic base layer, and the first columnar connector. The manufacturing method of the ceramic substrate in any one of -6.   The method for manufacturing a ceramic substrate according to claim 7, further comprising a step of mounting a surface mount component in the cavity, wherein the resin layer is provided so as to cover at least a part of the surface mount component. In the composite laminate forming step, the first ceramic base layer is opposite to the second ceramic base layer side and is not substantially sintered at the temperature at which each ceramic base layer is sintered. 2 having an unsintered third ceramic substrate layer laminated via a shrinkage suppression layer, and the second shrinkage suppression layer includes the first ceramic substrate layer and the third ceramic substrate. Forming a composite laminate in which a second columnar connector for connecting the material layers is formed;
In the notch groove forming step, the third ceramic base layer is divided into a first region connected to the second columnar connected body and a second region not connected to the second columnar connected body, Forming a second cut groove reaching the second shrinkage suppression layer from the third ceramic base layer side;
In the firing step, when the first ceramic base layer is unsintered, the first, second and third ceramic base layers are sintered, and the first and second shrinkage suppression layers Is fired at a temperature that does not substantially sinter, and when the first ceramic base layer has been sintered, the second and third ceramic base layers are sintered, and the first and second ceramic base layers are sintered. 2 After firing at a temperature at which the shrinkage suppression layer does not substantially sinter,
In the shrinkage suppression layer removing step, by removing the second region of the third ceramic base layer and the second shrinkage suppression layer, the first ceramic base layer on the second ceramic base layer side A first cavity having the first region of the second ceramic base layer and the first columnar connecting body as a bank portion on the first main surface side, the third ceramic of the first ceramic base layer The second cavity having the bank portion as the first region of the third ceramic base material layer and the second columnar connecting body is formed on the second main surface side which is the base material layer side. Item 9. A method for producing a ceramic substrate according to any one of Items 1 to 8. In the composite laminate forming step, the second ceramic base layer is opposite to the first ceramic base layer at the temperature at which each ceramic base layer is sintered. It has an unsintered third ceramic base layer laminated via a shrinkage suppression layer, and the second shrinkage suppression layer includes the second ceramic base layer and the third ceramic base layer. Forming a composite laminate in which a second columnar connector for connecting the layers is formed;
In the notch groove forming step, the third ceramic base layer is divided into a first region connected to the second columnar connected body and a second region not connected to the second columnar connected body, Forming a third cut groove reaching the first shrinkage suppression layer from the third ceramic base layer side;
In the firing step, when the first ceramic base layer is unsintered, the first, second and third ceramic base layers are sintered, and the first and second shrinkage suppression layers Is fired at a temperature that does not substantially sinter, and when the first ceramic base layer has been sintered, the second and third ceramic base layers are sintered, and the first and second ceramic base layers are sintered. 2 After firing at a temperature at which the shrinkage suppression layer does not substantially sinter,
In the shrinkage suppression layer removing step, by removing the second region of the third ceramic base layer and the second shrinkage suppression layer, a stepped cavity having a stepped portion on a side wall is formed. The manufacturing method of the ceramic substrate in any one of Claims 1-8. In the notch groove forming step, the first ceramic base layer is divided into a first region connected to the first columnar coupling body and a second region not connected to the first columnar coupling body, Forming a fourth cut groove reaching the first shrinkage suppression layer from the first ceramic base layer side;
In the firing step, when the first ceramic base layer is unsintered, the first and second ceramic base layers are sintered, and the first shrinkage suppression layer is substantially sintered. When the first ceramic base layer is sintered, the second ceramic base layer is sintered, and the first shrinkage suppression layer is not substantially sintered. After firing
The ceramic substrate according to claim 1, wherein in the shrinkage suppression layer removing step, cavities are formed on both surfaces by removing the second region of the first ceramic base layer. Manufacturing method.   Among the ceramic base layers, a shrinkage suppression layer is disposed outside the outermost ceramic base layer where a cut groove is to be formed, and the cut groove is formed through the shrinkage suppression layer. The method for manufacturing a ceramic substrate according to claim 1, wherein a notch groove is formed in the ceramic base layer to be formed.   Of the ceramic substrate layers, firing the composite laminate in a state in which a shrinkage suppression layer is disposed outside the outermost ceramic substrate layer and the shrinkage suppression layers are disposed on both main surfaces. The method for producing a ceramic substrate according to claim 1, wherein:   When the outermost shrinkage suppression layer is formed with a cut groove so that the composite laminate can be fired in a state where the shrinkage suppression layer without the cut groove is provided on both main surfaces, the further 14. The method for manufacturing a ceramic substrate according to claim 13, wherein a shrinkage suppression layer having no cut groove is disposed outside.   At least one of the outermost shrinkage suppression layers is provided with a protrusion-forming columnar body made of a conductive material containing a metal as a conductive component. After firing the composite laminate, the outermost shrinkage suppression layer is 14. The method of manufacturing a ceramic substrate according to claim 13, wherein the ceramic substrate provided with a protruding electrode is obtained by removing the ceramic substrate.   16. The method according to claim 1, further comprising a step of performing each of the steps in a state of an aggregate substrate formed by assembling a plurality of ceramic substrates, and dividing the aggregate substrate into sub-substrates after firing. A method for producing a ceramic substrate according to claim 1.   17. The ceramic according to claim 16, wherein a division groove for dividing the aggregate substrate into the sub-substrates is formed so as to reach the first ceramic base layer from a surface side on which each cut groove is formed. A method for manufacturing a substrate.

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