JP4581903B2 - Manufacturing method of ceramic electronic component - Google Patents

Manufacturing method of ceramic electronic component Download PDF

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JP4581903B2
JP4581903B2 JP2005234876A JP2005234876A JP4581903B2 JP 4581903 B2 JP4581903 B2 JP 4581903B2 JP 2005234876 A JP2005234876 A JP 2005234876A JP 2005234876 A JP2005234876 A JP 2005234876A JP 4581903 B2 JP4581903 B2 JP 4581903B2
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main surface
thick film
ceramic body
film electrode
electrode
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優輝 伊藤
修 近川
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Murata Manufacturing Co Ltd
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Description

本願発明は、セラミック電子部品の製造方法に関し、詳しくは、セラミック基板の一方側の主面に表面実装部品が搭載され、該表面実装部品がケースによりカバーされているとともに、他方側の主面にマザーボードヘの接続用の外部電極を備えた構造を有するセラミック電子部品の製造方法に関する。 The present invention relates to a method for manufacturing a ceramic electronic component , and more specifically, a surface mount component is mounted on one main surface of a ceramic substrate, the surface mount component is covered by a case, and the other main surface is mounted. The present invention relates to a method of manufacturing a ceramic electronic component having a structure including an external electrode for connection to a mother board.

従来の電子部品の一つに、図１３に示すように、積層構造体５１に形成したキャビティ５２内にチップ部品５３を搭載し、キャビティ５２が形成されていない方の主面（外表面）にチップ部品５４を実装し、積層構造体５１の上面側をケース５５で覆った構造を有する積層型電子部品がある（特許文献１）。   As shown in FIG. 13, a chip component 53 is mounted in a cavity 52 formed in a laminated structure 51 as one of the conventional electronic components, and the main surface (outer surface) on which the cavity 52 is not formed is mounted. There is a multilayer electronic component having a structure in which a chip component 54 is mounted and the upper surface side of the multilayer structure 51 is covered with a case 55 (Patent Document 1).

しかし、この積層型電子部品の場合、キャビティ５２は底面部分５２ａと、その周囲の側壁部分５２ｂから構成されているが、チップ部品が搭載される底面部分５２ａの面積は、周囲の側壁部分５２ｂによって制限され、実装領域が狭くなるため、大型のチップ部品を実装したり、多数個のチップ部品を高密度実装したりすることは困難であるのが実情である。   However, in the case of this multilayer electronic component, the cavity 52 is composed of the bottom surface portion 52a and the surrounding side wall portion 52b. The area of the bottom surface portion 52a on which the chip component is mounted depends on the surrounding side wall portion 52b. Since it is limited and the mounting area becomes narrow, it is actually difficult to mount a large chip component or to mount a large number of chip components at high density.

また、表面実装型のセラミック基板（セラミック電子部品）は、通常、下面側に形成された外部電極を、マザーボードに形成された接続用ランドに、はんだを介して接合固定することにより行われる。しかしながら、外部電極の厚みが薄い場合、実装後にマザーボードの変形を伴うような振動や、撓みが生じると、セラミック基板の下面とマザーボードとが当接し、セラミック基板に応力が加わって破損（クラックや割れなど）が生じたり、外部電極と接続用ランドの接合部に応力が加わって、マザーボードからセラミック基板が脱落したりするおそれがある。また、外部電極の厚みが薄い場合、実装時に用いるはんだが隙間に回り込んで電極間が短絡するおそれがある。   A surface-mounting type ceramic substrate (ceramic electronic component) is usually performed by bonding and fixing external electrodes formed on the lower surface side to connecting lands formed on a mother board via solder. However, if the thickness of the external electrode is small, if the vibration or deflection accompanying the deformation of the motherboard occurs after mounting, the lower surface of the ceramic substrate contacts the motherboard, and stress is applied to the ceramic substrate to cause damage (cracks or cracks). Etc.), or stress is applied to the joint between the external electrode and the connection land, and the ceramic substrate may fall off from the motherboard. In addition, when the thickness of the external electrode is thin, there is a possibility that the solder used at the time of mounting wraps around the gap and short-circuits between the electrodes.

そのため、セラミック基板（セラミック電子部品）の構造によっては、その下面とマザーボードとの間にある程度の隙間を確保することが望ましい場合がある。
その方法の１つにセラミック基板（セラミック電子部品）の下面に、セラミック基板の下面から突出した突起電極（スタッド電極）を形成して、セラミック基板（セラミック電子部品）の下面とマザーボードとの間にある程度の隙間を確保する方法が知られている。 Therefore, depending on the structure of the ceramic substrate (ceramic electronic component), it may be desirable to ensure a certain amount of clearance between the lower surface and the motherboard.
One method is to form a protruding electrode (stud electrode) projecting from the lower surface of the ceramic substrate on the lower surface of the ceramic substrate (ceramic electronic component), and between the lower surface of the ceramic substrate (ceramic electronic component) and the motherboard. A method for securing a certain gap is known.

そして、突起電極を形成する方法として、図１４に示すような方法が提案されている（特許文献２）。
図１４は、突起電極を備えたセラミック基板の製造工程を示す図である。 As a method for forming the protruding electrode, a method as shown in FIG. 14 has been proposed (Patent Document 2).
FIG. 14 is a diagram illustrating a manufacturing process of a ceramic substrate provided with protruding electrodes.

(１)この方法においては、まず、基板形成用グリーンシート６１にビアホール６１ａを形成した後、ビアホール６１ａに導電ペースト６３を充填するとともに、配線パターン７０の印刷を行う。
(２)また、基板形成用グリーンシート６１の焼結温度では焼結しない材料を用いて突起電極形成層用グリーンシート６２を形成する。
(３)そして、この突起電極形成層用グリーンシート６２に突起電極形成用の孔６２ａを形成し、孔６２ａに導電ペースト６３を充填する。
(４)それから、基板形成用グリーンシート６１および突起電極形成層用グリーンシート６２とを突起電極形成層用グリーンシート６２が最外層となるように、所定の枚数積み重ね、熱圧着してグリーンシート積層体６４を形成する。
(５)次に、得られたグリーンシート積層体６４を、基板形成用グリーンシート６１は焼結するが、突起電極形成層用グリーンシート６２は焼結しない温度で焼成する。
(６)その後、焼成後の積層体を溶剤中で超音波洗浄し、焼結していない突起電極形成層用グリーンシート６２を除去することにより、突起電極６５を備えたセラミック基板６６を得ることができる。 (1) In this method, first, a via hole 61a is formed in the substrate forming green sheet 61, and then the conductive paste 63 is filled in the via hole 61a and the wiring pattern 70 is printed.
(2) The protruding electrode forming layer green sheet 62 is formed using a material that does not sinter at the sintering temperature of the substrate forming green sheet 61.
(3) The protruding electrode forming hole 62a is formed in the protruding electrode forming layer green sheet 62, and the conductive paste 63 is filled in the hole 62a.
(4) Then, the substrate forming green sheet 61 and the projecting electrode forming layer green sheet 62 are stacked in a predetermined number so that the projecting electrode forming layer green sheet 62 is the outermost layer, and thermo-compression is performed to laminate the green sheets. A body 64 is formed.
(5) Next, the obtained green sheet laminate 64 is fired at a temperature at which the green sheet 61 for substrate formation is sintered but the green sheet 62 for protruding electrode formation layer is not sintered.
(6) Thereafter, the fired laminate is subjected to ultrasonic cleaning in a solvent, and the green sheet 62 for the projecting electrode forming layer that has not been sintered is removed, thereby obtaining the ceramic substrate 66 provided with the projecting electrodes 65. Can do.

そして、この方法によれば、突起電極を備えたセラミック基板を効率よく製造することができるとされている。   And according to this method, it is said that the ceramic substrate provided with the protruding electrode can be manufactured efficiently.

しかしながら、この方法の場合、突起電極形成層用グリーンシートに形成する突起電極形成用の孔の径が小さい場合、導電ペーストの充填は良好であるが、突起電極の径も小さくなって強度が低下し、場合によっては突起電極形成層用グリーンシートを除去する際に突起電極が破損するという問題点がある。   However, in the case of this method, when the diameter of the hole for forming the protruding electrode formed on the green sheet for the protruding electrode forming layer is small, the conductive paste is satisfactorily filled, but the diameter of the protruding electrode is also reduced and the strength is lowered. In some cases, however, the protruding electrode is damaged when the protruding electrode forming layer green sheet is removed.

また、突起電極形成用の孔の径が大きい場合や、孔の配設ピッチが狭い場合には導電ペーストの充填不良による高さや形状のばらつきが発生し、加工精度の高い基板を得ることが困難であるという問題点がある。
特開２００４−１０３６０８号公報 特許第３３８７１８９号公報 In addition, when the diameter of the hole for forming the protruding electrode is large or the hole arrangement pitch is narrow, variations in height and shape due to poor filling of the conductive paste occur, making it difficult to obtain a substrate with high processing accuracy. There is a problem that it is.
JP 2004-103608 A Japanese Patent No. 3387189

本願発明は、上記課題を解決するものであり、表面実装部品を覆うカバーを備えるとともに、セラミック基板のマザーボードへの実装面から突出した位置に外部電極を備え、実装面とマザーボードとの間に隙間を確保した状態で実装することが可能なセラミック電子部品の製造方法を提供することを目的とする。 The invention of the present application solves the above-described problem, and includes a cover that covers the surface-mounted component, and includes an external electrode at a position protruding from the mounting surface of the ceramic substrate to the motherboard, and a gap between the mounting surface and the motherboard. An object of the present invention is to provide a method of manufacturing a ceramic electronic component that can be mounted in a state in which the above is ensured.

上記課題を解決するために、本願発明（請求項１）のセラミック電子部品の製造方法は、
第１主面および第２主面を有するセラミック基板を素体とし、前記第１主面には、第１表面実装部品が搭載されているとともに、前記第１表面実装部品を覆うケースが設けられており、前記第２主面には、マザーボードヘの接続用の外部電極を有するセラミック電子部品の製造方法であって、
(ａ)焼成後に前記セラミック基板となる未焼成セラミック体の第２主面の所定の位置に、焼成後に前記外部電極となる厚膜電極を印刷して、厚膜電極付き未焼成セラミック体を形成する工程と、
(ｂ)前記厚膜電極付き未焼成セラミック体の、第１主面および第２主面の少なくとも一方側にプレス用型を配設し、プレスすることにより、前記厚膜電極付き未焼成セラミック体の前記第１主面に段部が形成されるとともに、前記厚膜電極付き未焼成セラミック体の前記第２主面には、前記段部に対向する位置に凸部が形成され、かつ、前記凸部上に前記厚膜電極が位置するように、前記厚膜電極付き未焼成セラミック体を変形させる工程と、
(ｃ)前記厚膜電極付き未焼成セラミック体を焼成して、前記厚膜電極付き未焼成セラミック体の前記第１主面に、前記ケースを前記セラミック基板に固定するための段部を備え、前記第２主面には、前記段部に対向する位置に凸部を備え、かつ、前記凸部上に前記外部電極を備えたセラミック基板を得る工程と、
(ｄ)前記素体である前記セラミック基板の前記第１主面に、第１表面実装部品を搭載する工程と、
(ｅ)前記セラミック基板の前記第１主面側に、前記第１表面実装部品を覆うケースを配設し、前記ケースを前記段部に固定する工程と
を具備することを特徴としている。 In order to solve the above-described problem, a method for manufacturing a ceramic electronic component of the present invention (Claim 1) includes:
A ceramic substrate having a first main surface and a second main surface is used as a base body, and a first surface mounting component is mounted on the first main surface, and a case for covering the first surface mounting component is provided. The second main surface is a method for manufacturing a ceramic electronic component having an external electrode for connection to a motherboard,
(a) A thick film electrode serving as the external electrode after firing is printed at a predetermined position on the second main surface of the unfired ceramic body serving as the ceramic substrate after firing to form an unfired ceramic body with thick film electrodes. And a process of
(b) An unsintered ceramic body with thick film electrodes is formed by disposing and pressing a pressing die on at least one side of the first main surface and the second main surface of the unfired ceramic body with thick film electrodes. A step portion is formed on the first main surface, and a convex portion is formed on the second main surface of the unfired ceramic body with the thick film electrode at a position facing the step portion, and Deforming the unfired ceramic body with the thick film electrode so that the thick film electrode is located on the convex portion; and
(c) firing the unfired ceramic body with the thick film electrode, and providing a step for fixing the case to the ceramic substrate on the first main surface of the unfired ceramic body with the thick film electrode; The second main surface is provided with a convex portion at a position facing the step portion, and obtaining a ceramic substrate having the external electrode on the convex portion;
(d) mounting a first surface mount component on the first main surface of the ceramic substrate as the element body;
(e) providing a case for covering the first surface-mounted component on the first main surface side of the ceramic substrate, and fixing the case to the stepped portion.

また、請求項２のセラミック電子部品の製造方法は、請求項１の発明の構成において、前記(ａ)の工程で、焼成後に前記セラミック基板となる未焼成セラミック体の第２主面の所定の位置に、焼成後に前記外部電極となる厚膜電極を印刷するとともに、未焼成セラミック体の第１主面の所定の位置に前記ケースを固定するためのケース固定用電極となる厚膜電極を印刷して、厚膜電極付き未焼成セラミック体を形成し、
前記(ｂ)の工程で、前記厚膜電極付き未焼成セラミック体の、第１主面および第２主面の少なくとも一方側にプレス用型を配設し、プレスすることにより、前記厚膜電極付き未焼成セラミック体の前記第１主面に前記段部が形成され、かつ、前記段部の前記底面部分および前記側壁部分の少なくとも一方に前記厚膜電極が位置するとともに、前記第２主面に前記凸部が形成され、かつ、前記凸部上に前記厚膜電極が位置するように、前記厚膜電極付き未焼成セラミック体を変形させること
を特徴としている。 According to a second aspect of the present invention, there is provided a method for manufacturing a ceramic electronic component according to the first aspect of the present invention, wherein the second main surface of the unfired ceramic body that becomes the ceramic substrate after firing in the step (a) is provided. A thick film electrode serving as the external electrode after firing is printed at a position, and a thick film electrode serving as a case fixing electrode for fixing the case to a predetermined position on the first main surface of the unfired ceramic body is printed. And forming an unfired ceramic body with thick film electrodes,
In the step (b), the thick film electrode is formed by disposing and pressing a pressing die on at least one side of the first main surface and the second main surface of the unfired ceramic body with the thick film electrode. The stepped portion is formed on the first main surface of the attached unfired ceramic body, and the thick film electrode is located on at least one of the bottom surface portion and the side wall portion of the stepped portion, and the second main surface The unfired ceramic body with the thick film electrode is deformed so that the convex portion is formed on the convex portion and the thick film electrode is positioned on the convex portion.

また、請求項３のセラミック電子部品の製造方法は、請求項１または２の発明の構成において、前記厚膜電極付き未焼成セラミック体の表面に、前記未焼成セラミック体が焼結する温度では実質的に焼結しない材料を用いて形成した補助層が配設された状態で、前記厚膜電極付き未焼成セラミック体を変形させる工程を実施することを特徴としている。 According to a third aspect of the present invention, there is provided a method for manufacturing a ceramic electronic component according to the first or second aspect of the invention, wherein the ceramic body is substantially at a temperature at which the green ceramic body is sintered on the surface of the green ceramic body with the thick film electrode. The step of deforming the unfired ceramic body with the thick film electrode is performed in a state in which an auxiliary layer formed using a material that is not sintered is disposed.

また、請求項４のセラミック電子部品の製造方法は、請求項１〜３のいずれかの発明の構成において、前記プレス用型が、前記未焼成セラミック体が焼結する温度では実質的に焼結しない材料を用いて形成したものであることを特徴としている。 A method for manufacturing a ceramic electronic component according to claim 4, in the configuration of the invention of any one of claims 1 to 3, the press mold is the substantially sintered at a temperature of unfired ceramic body is sintered It is characterized by being formed using a material that does not.

本願発明（請求項１）のセラミック電子部品の製造方法は、第１主面および第２主面を有するセラミック基板を素体とし、第１主面には、第１表面実装部品が搭載されているとともに、第１表面実装部品を覆うケースが設けられており、第２主面には、マザーボードヘの接続用の外部電極を有するセラミック電子部品の製造方法であって、(ａ)焼成後にセラミック基板となる未焼成セラミック体の第２主面の所定の位置に、焼成後に外部電極となる厚膜電極を印刷して、厚膜電極付き未焼成セラミック体を形成する工程と、(ｂ)厚膜電極付き未焼成セラミック体の、第１主面および第２主面の少なくとも一方側にプレス用型を配設し、プレスすることにより、厚膜電極付き未焼成セラミック体の第１主面に段部が形成されるとともに、厚膜電極付き未焼成セラミック体の第２主面には、段部に対向する位置に凸部が形成され、かつ、凸部上に厚膜電極が位置するように、厚膜電極付き未焼成セラミック体を変形させる工程と、(ｃ)厚膜電極付き未焼成セラミック体を焼成して、厚膜電極付き未焼成セラミック体の第１主面に、ケースをセラミック基板に固定するための段部を備え、第２主面には、段部に対向する位置に凸部を備え、かつ、凸部上に外部電極を備えたセラミック基板を得る工程と、(ｄ)素体であるセラミック基板の第１主面に、第１表面実装部品を搭載する工程と、(ｅ)セラミック基板の第１主面側に、第１表面実装部品を覆うケースを配設し、ケースを前記段部に固定する工程とを備えているので、第１主面には、ケースをセラミック基板に固定するための段部が形成され、第２主面には、第１主面の段部に対向する位置に凸部が形成され、かつ、凸部上に外部電極が形成されたセラミック電子部品（すなわち、セラミック基板の、マザーボードへの実装面から突出した位置に外部電極を備え、実装面とマザーボードとの間に隙間を確保することが可能なセラミック電子部品）を効率よく製造することが可能になる。 The method of manufacturing a ceramic electronic component according to the present invention (Claim 1) uses a ceramic substrate having a first main surface and a second main surface as a base body, and a first surface mount component is mounted on the first main surface. A method of manufacturing a ceramic electronic component having an external electrode for connection to a motherboard on the second main surface, wherein (a) the ceramic after firing A step of printing a thick film electrode to be an external electrode after firing at a predetermined position on the second main surface of the unfired ceramic body to be a substrate to form an unfired ceramic body with a thick film electrode; and (b) thickness By placing and pressing a pressing die on at least one side of the first main surface and the second main surface of the unfired ceramic body with the membrane electrode, the first ceramic surface with the thick film electrode is placed on the first main surface. Stepped part is formed and thick film electrode An unfired ceramic body with a thick film electrode is formed on the second main surface of the unfired ceramic body with a thick film electrode so that a convex portion is formed at a position facing the stepped portion and the thick film electrode is positioned on the convex portion. A step of deforming, and (c) firing an unfired ceramic body with a thick film electrode, and providing a step portion for fixing the case to the ceramic substrate on the first main surface of the unfired ceramic body with the thick film electrode, On the second main surface, a step of obtaining a ceramic substrate having a convex portion at a position facing the step portion and an external electrode on the convex portion; and (d) a first main surface of the ceramic substrate which is an element body. Mounting a first surface mount component on the surface, and (e) disposing a case covering the first surface mount component on the first main surface side of the ceramic substrate, and fixing the case to the stepped portion. The first main surface has a step for fixing the case to the ceramic substrate. On the second main surface, a ceramic electronic component (that is, a mother board of a ceramic substrate) in which a convex portion is formed at a position facing the step portion of the first main surface and an external electrode is formed on the convex portion. Thus, it is possible to efficiently manufacture a ceramic electronic component that includes an external electrode at a position protruding from the mounting surface of the mounting board and can secure a gap between the mounting surface and the motherboard.

また、請求項２のセラミック電子部品の製造方法は、請求項１の発明の構成において、(ａ)の工程で、焼成後にセラミック基板となる未焼成セラミック体の第２主面の所定の位置に、焼成後に外部電極となる厚膜電極を印刷するとともに、未焼成セラミック体の第１主面の所定の位置にケースを固定するためのケース固定用電極となる厚膜電極を印刷して、厚膜電極付き未焼成セラミック体を形成し、 (ｂ)の工程で、厚膜電極付き未焼成セラミック体の、第１主面および第２主面の少なくとも一方側にプレス用型を配設し、プレスすることにより、厚膜電極付き未焼成セラミック体の第１主面に段部が形成され、かつ、段部の底面部分および側壁部分の少なくとも一方に厚膜電極が位置するとともに、第２主面には、凸部が形成され、かつ、凸部上に厚膜電極が位置するように、厚膜電極付き未焼成セラミック体を変形させるようにした場合、例えば、第１主面の段部がセラミック基板の端縁部に形成され、かつ、第１主面の段部は底面部分と側壁部分とを備え、底面部分および側壁部分の少なくとも一方に、ケース固定用電極が設けられており、ケースの脚部が、ケース固定用電極に接合材を介して接合された構造を有し、かつ、段部の底面部分および側壁部分の少なくとも一方に設けられたケース固定用電極にケースの脚部を接続して、ケースをセラミック基板に確実に固定することが可能なケースの取り付け信頼性の高いセラミック電子部品を効率よく製造することが可能になる。 According to a second aspect of the present invention, there is provided a method for manufacturing a ceramic electronic component according to the first aspect of the present invention, wherein in the step (a), the ceramic electronic component is placed at a predetermined position on the second main surface of the unfired ceramic body that becomes a ceramic substrate after firing. Printing a thick film electrode to be an external electrode after firing and printing a thick film electrode to be a case fixing electrode for fixing the case to a predetermined position on the first main surface of the unfired ceramic body. Forming an unfired ceramic body with a membrane electrode, and in the step (b), disposing a pressing die on at least one side of the first main surface and the second main surface of the unfired ceramic body with a thick film electrode; By pressing, a step portion is formed on the first main surface of the unfired ceramic body with the thick film electrode, and the thick film electrode is located on at least one of the bottom surface portion and the side wall portion of the step portion. Convex is formed on the surface, and When the unfired ceramic body with the thick film electrode is deformed so that the thick film electrode is located on the part, for example, the step portion of the first main surface is formed on the edge portion of the ceramic substrate, and The step portion of the first main surface includes a bottom surface portion and a side wall portion, and a case fixing electrode is provided on at least one of the bottom surface portion and the side wall portion, and the leg portion of the case is bonded to the case fixing electrode. The case's legs are connected to the case fixing electrodes provided on at least one of the bottom and side walls of the step portion, and the case is securely fixed to the ceramic substrate. This makes it possible to efficiently manufacture a ceramic electronic component with high mounting reliability.

なお、第１主面の、ケースをセラミック基板に固定するための段部がセラミック基板の端縁部に形成されるようにすることにより、セラミック基板の第１主面の表面実装部品を搭載することが可能な領域を大きくとることが可能になり、高密度実装が可能になる。   In addition, the surface mounting component of the 1st main surface of a ceramic substrate is mounted by forming the step part for fixing a case to a ceramic substrate of the 1st main surface in the edge part of a ceramic substrate. Therefore, it is possible to make a large area that can be processed, and high-density mounting becomes possible.

また、請求項３のセラミック電子部品の製造方法のように、請求項１または２の発明の構成において、厚膜電極付き未焼成セラミック体の表面に、前記未焼成セラミック体が焼結する温度では実質的に焼結しない材料を用いて形成した補助層が配設された状態で、前記厚膜電極付き未焼成セラミック体を変形させる工程を実施するようにした場合、厚膜電極付き未焼成セラミック体が、補助層を備えた状態で所定の形状に成形（変形）されるため、厚膜電極付き未焼成セラミック体や、その内部に配設された内部電極パターンなどに折損や破断が発生することを抑制しつつ、第１主面に段部が形成され、第２主面の、段部に対向する位置に凸部が形成された構造を有するセラミック基板を確実に製造することが可能になる。 Further, as in the method for manufacturing a ceramic electronic component according to claim 3 , in the configuration of the invention according to claim 1 or 2 , at the temperature at which the green ceramic body is sintered on the surface of the green ceramic body with a thick film electrode, When the step of deforming the unfired ceramic body with a thick film electrode is performed in a state where an auxiliary layer formed using a material that does not substantially sinter is disposed, the unfired ceramic with a thick film electrode Since the body is formed (deformed) into a predetermined shape with an auxiliary layer, breakage or breakage occurs in the unfired ceramic body with a thick film electrode, the internal electrode pattern disposed therein, or the like While suppressing this, it is possible to reliably manufacture a ceramic substrate having a structure in which a step portion is formed on the first main surface and a convex portion is formed on the second main surface at a position facing the step portion. Become.

なお、補助層が配設された状態で、厚膜電極付き未焼成セラミック体を変形させる場合、補助層を介してプレス用型を厚膜電極付き未焼成セラミック体に押し付けるようにしてもよく、また、厚膜電極付き未焼成セラミック体に直接にプレス用型を押し当てるように構成することも可能である。   When the unfired ceramic body with the thick film electrode is deformed in the state where the auxiliary layer is disposed, the pressing die may be pressed against the unfired ceramic body with the thick film electrode through the auxiliary layer, It is also possible to configure so that the pressing mold is pressed directly against the unfired ceramic body with thick film electrodes.

また、補助層が配設された状態で厚膜電極付き未焼成セラミック体を変形させた後、補助層が配設されたまま補助層付きの未焼成セラミック体を、未焼成セラミック体が焼結し、補助層が実質的に焼結しない温度で焼成するようにしているので、補助層の、セラミック体の焼結時の収縮や変形を抑制する力（拘束力）により、焼成工程でセラミック体に収縮や変形が生じることを抑制、防止して、形状精度の高いセラミック基板を得ることが可能になる。
なお、未焼成セラミック体の表面に補助層が配設されているので、曲げ加工時に補助層付き未焼成セラミック体の補助層に表面割れが発生した場合にも、未焼成セラミック体には影響がなく、所望の特性を備えたセラミック基板を得ることが可能になる。 Also, after the unfired ceramic body with the thick film electrode is deformed with the auxiliary layer disposed, the unfired ceramic body with the auxiliary layer is sintered while the auxiliary layer is disposed. In addition, since the auxiliary layer is fired at a temperature at which the auxiliary layer is not substantially sintered, the ceramic body is used in the firing process by the force (restraint force) of the auxiliary layer that suppresses shrinkage and deformation during the sintering of the ceramic body. It is possible to obtain a ceramic substrate with high shape accuracy by suppressing or preventing the occurrence of shrinkage and deformation.
In addition, since the auxiliary layer is disposed on the surface of the unfired ceramic body, even if surface cracks occur in the auxiliary layer of the unfired ceramic body with the auxiliary layer during bending, the unfired ceramic body is affected. Therefore, it is possible to obtain a ceramic substrate having desired characteristics.

また、請求項４のセラミック電子部品の製造方法のように、請求項１〜３のいずれかの発明の構成において、プレス用型として、未焼成セラミック体が焼結する温度では実質的に焼結しない材料を用いて形成したものを用いることにより、プレス後に、プレス用型が付いた状態で厚膜電極付き未焼成セラミック体を焼成することが可能になり、プレス工程後においても形状安定性を向上させることが可能になる。なお、未焼成セラミック体が焼結する温度では実質的に焼結しない材料としては種々の材料を用いることが可能であり、上記補助層と同じ材料を用いることも可能である。なお、上記補助層と同じ材料を用いることにより、特にプレス用型を形成するための材料を別に用意することが不要になり、製造コストの低減を図ることが可能になる。
また、プレス用型は補助層用グリーンシートを打ち抜く方法などにより、容易に形成することが可能である。 Moreover, like the manufacturing method of the ceramic electronic component of Claim 4 , in the structure of any one of Claims 1-3 , it is substantially sintered at the temperature which a non-baking ceramic body sinters as a press type | mold. It is possible to fire the unfired ceramic body with a thick film electrode after pressing, with a pressing die attached, and shape stability even after the pressing process. It becomes possible to improve. Various materials can be used as the material that is not substantially sintered at the temperature at which the unsintered ceramic body is sintered, and the same material as the auxiliary layer can also be used. In addition, by using the same material as the auxiliary layer, it is not necessary to prepare a separate material for forming a pressing mold, and the manufacturing cost can be reduced.
Further, the pressing die can be easily formed by a method of punching the auxiliary layer green sheet.

以下に本願発明の実施例を示して、本願発明の特徴とするところをさらに詳しく説明する。   The features of the present invention will be described in more detail below with reference to examples of the present invention.

図１は本願発明の一実施例（実施例１）にかかるセラミック電子部品（モジュール基板）をマザーボードに搭載した状態を示す断面図、図２はセラミック電子部品の構成を模式的に示す分解斜視図である。   FIG. 1 is a cross-sectional view showing a state in which a ceramic electronic component (module substrate) according to one embodiment (first embodiment) of the present invention is mounted on a motherboard, and FIG. 2 is an exploded perspective view schematically showing the configuration of the ceramic electronic component. It is.

この実施例１のセラミック電子部品（モジュール基板）Ａは、第１主面Ｆ１および第２主面Ｆ２を有し、内部にインダクタやコンデンサなどを構成する内部電極や層間接続用のビアホール導体など（図示せず）が配設されたセラミック基板１を素体とし、第１主面Ｆ１には、第１表面実装部品１４（半導体素子１４ａ，チップ部品１４ｂ）が搭載されているとともに、第１表面実装部品１４（半導体素子１４ａ，チップ部品１４ｂ）を覆うケース１８が設けられており、第２主面Ｆ２の中央領域には第２表面実装部品１５（半導体素子１５ａ，チップ部品１５ｂ）が配設されている。   The ceramic electronic component (module substrate) A of Example 1 has a first main surface F1 and a second main surface F2, and includes internal electrodes that constitute inductors and capacitors, via-hole conductors for interlayer connection, and the like ( A ceramic substrate 1 provided with a not-shown substrate is used as a base body, and a first surface mounting component 14 (semiconductor element 14a, chip component 14b) is mounted on the first main surface F1, and a first surface is mounted. A case 18 is provided to cover the mounting component 14 (semiconductor element 14a, chip component 14b), and the second surface mounting component 15 (semiconductor element 15a, chip component 15b) is disposed in the central region of the second main surface F2. Has been.

そして、セラミック基板１の第１主面Ｆ１の端縁部には、ケース１８をセラミック基板１に固定するための複数の段部３０が形成されており、段部３０の底面部分３１と側壁部分３２には、ケース１８を固定するためのケース固定用電極３３が設けられており、ケース１８の脚部１９が、ケース固定用電極３３に接合材（この実施例でははんだ）３４を介して接合されている。   A plurality of step portions 30 for fixing the case 18 to the ceramic substrate 1 are formed at the edge portion of the first main surface F1 of the ceramic substrate 1, and a bottom surface portion 31 and a side wall portion of the step portion 30 are formed. 32 is provided with a case fixing electrode 33 for fixing the case 18, and the leg portion 19 of the case 18 is bonded to the case fixing electrode 33 via a bonding material (solder in this embodiment) 34. Has been.

また、セラミック基板１の第２主面Ｆ２には、段部３０に対向する位置に凸部４０が形成され、かつ、凸部４０には実装対象であるマザーボード２１上の接続用ランド２２との接続のための外部電極５が配設されている。なお、凸部４０がある程度の高さを有しているため、セラミック基板１の実装面（この実施例では第２主面Ｆ２）とマザーボードなどの実装対象との間には必要な隙間が確保されており、実装面（この実施例では第２主面Ｆ２）にも第２表面実装部品（半導体素子１５ａ，チップ部品１５ｂ）が搭載されている。外部電極５は、凸部４０の少なくとも一部にあればよい。   Further, the second main surface F2 of the ceramic substrate 1 is formed with a convex portion 40 at a position facing the step portion 30, and the convex portion 40 is connected to the connection land 22 on the mother board 21 to be mounted. An external electrode 5 for connection is provided. In addition, since the convex part 40 has a certain amount of height, a required clearance is ensured between the mounting surface (the second main surface F2 in this embodiment) of the ceramic substrate 1 and the mounting target such as a mother board. The second surface mounting components (semiconductor element 15a and chip component 15b) are also mounted on the mounting surface (second main surface F2 in this embodiment). The external electrode 5 may be on at least a part of the convex portion 40.

次に、この実施例のセラミック電子部品の製造方法について説明する。
(１)まず、セラミック材料を含む複数のセラミック基板用のセラミックグリーンシート（以下「基板用グリーンシート」という）を作製する。手順は以下の通りである。
ＣａＯ：１０〜５５重量％、ＳｉＯ2：４５〜７０重量％、Ａｌ2Ｏ3：０〜３０重量％、不純物０〜１０重量％、およびＢ2Ｏ3：外掛けで５〜２０重量％を含む混合物を１４５０℃で溶融してガラス化した後、水中で急冷し、これを粉砕して平均粒径が３．０〜３．５μmのＣａＯ−ＳｉＯ2−Ａｌ2Ｏ3−Ｂ2Ｏ3系ガラス粉末を作製する。
なお、この実施例１では、ＣａＯ−ＳｉＯ2−Ａｌ2Ｏ3−Ｂ2Ｏ3系ガラスを用いたが、８００〜１０００℃で焼結する他のガラスを用いてもよい。 Next, a method for manufacturing the ceramic electronic component of this embodiment will be described.
(1) First, a plurality of ceramic green sheets for ceramic substrates (hereinafter referred to as “substrate green sheets”) containing a ceramic material are prepared. The procedure is as follows.
CaO: 10 to 55 wt%, SiO 2: 45 to 70 wt%, Al 2 O 3: 0~30 wt%, 0-10 wt% impurities, and B 2 O 3: 5 to 20% by weight outer percentage The mixture containing the mixture was melted at 1450 ° C. to be vitrified, then rapidly cooled in water, and pulverized to obtain CaO—SiO 2 —Al 2 O 3 —B 2 O 3 having an average particle size of 3.0 to 3.5 μm. A system glass powder is prepared.
In Example 1, CaO—SiO 2 —Al 2 O 3 —B 2 O 3 glass was used, but other glass sintered at 800 to 1000 ° C. may be used.

それから、このガラス粉末：５０〜６５重量％（好ましくは６０重量％）と不純物が０〜１０重量％のアルミナ粉末：５０〜３５重量％（好ましくは４０重量％）とを混合してセラミック粉末を作製する。そして、このセラミック粉末に溶剤（例えばトルエン、キシレン、水系など）、バインダ（例えばアクリル、ブチラール系の樹脂など）および可塑剤（例えばジオクチルフタレート（ＤＯＰ）、ジブチルフタレート（ＤＢＰ）など）を加え、十分に混練・分散させて粘度２０００〜４００００ｃｐｓのスラリーを作製し、通常のキャスティング法（例えばドクターブレード法）を用いて、例えば厚み０．０１〜０．４mmのグリーンシート（製品であるセラミック基板の主要部を構成する基板用グリーンシート）を作製する。   Then, the glass powder: 50 to 65% by weight (preferably 60% by weight) and the alumina powder having impurities of 0 to 10% by weight: 50 to 35% by weight (preferably 40% by weight) are mixed to obtain a ceramic powder. Make it. Then, a solvent (for example, toluene, xylene, water-based), a binder (for example, acrylic, butyral-based resin) and a plasticizer (for example, dioctyl phthalate (DOP), dibutyl phthalate (DBP), etc.) A slurry having a viscosity of 2000 to 40000 cps is prepared by kneading and dispersing into a green sheet having a thickness of 0.01 to 0.4 mm, for example, using a normal casting method (for example, a doctor blade method). A green sheet for a substrate constituting the portion).

なお、この基板用グリーンシートを製造する際に、組成比や添加剤を調整し、下記の補助層用（拘束層用）グリーンシート２０ａよりも、適度に柔らかい性状としておくことにより、後工程の成形加工時に、プレス用型２５への追随性を向上させ、加工精度を高めることが可能になるとともに、基板用グリーンシート１０ａに亀裂、欠けなどが発生することを抑制、防止することが可能になる。   In manufacturing the green sheet for a substrate, the composition ratio and additives are adjusted, and the properties are moderately softer than the following auxiliary layer (constraint layer) green sheet 20a. At the time of forming, it is possible to improve the followability to the pressing mold 25 and increase the processing accuracy, and it is possible to suppress and prevent the occurrence of cracks, chips, etc. in the substrate green sheet 10a. Become.

(２)それから、上記(１)の工程で作製した基板用グリーンシート１０ａ（図３）を打ち抜き型やパンチングマシンなどを用いて所定の寸法にカットし、必要に応じ、層間接続用のビアホール（図示せず）を形成する。   (2) Then, the substrate green sheet 10a (FIG. 3) produced in the above step (1) is cut into a predetermined size by using a punching die or a punching machine, and if necessary, via holes for interlayer connection ( (Not shown).

(３)上記(２)の工程で加工した複数枚の基板用グリーンシート１０ａのビアホールに導体ペーストを充填することによりビアホール導体を形成する。さらに、基板用グリーンシート１０ａに導体ペーストを印刷することにより表面導体や内層導体などとなる所定の配線パターン（図示せず）を形成する。
また、基板用グリーンシート１０ａを積層したときに最下層となる基板用グリーンシートの下面側（セラミック基板１の第１主面Ｆ１となる側）にケース固定用電極３３となる厚膜電極３３ａを印刷する。 (3) A via-hole conductor is formed by filling the via hole of the plurality of substrate green sheets 10a processed in the step (2) with a conductive paste. Furthermore, a predetermined wiring pattern (not shown) to be a surface conductor or an inner layer conductor is formed by printing a conductor paste on the substrate green sheet 10a.
Further, a thick film electrode 33a to be a case fixing electrode 33 is provided on the lower surface side (the side to be the first main surface F1 of the ceramic substrate 1) of the substrate green sheet that is the lowest layer when the substrate green sheets 10a are laminated. Print.

(４)また、基板用グリーンシート１０ａの焼成温度では焼結しないセラミックを含む、複数の補助層用（拘束層用）グリーンシート２０ａ（図３）を作製する。
補助層用（拘束層用）グリーンシート２０ａは、たとえば、有機ビヒクル中にアルミナ粉末を分散させてスラリーを調製し、これをキャスティング法によってシート状に成形することにより得ることができる。このようにして得られた補助層用（拘束層用）グリーンシート２０ａの焼結温度は、１５００〜１６００℃であるため、基板用グリーンシート１０ａが焼結する温度（例えば、８００〜１０００℃）では焼結せず、この補助層用（拘束層用）グリーンシート２０ａを接合させた状態で基板用グリーンシート１０ａを焼成することにより、基板用グリーンシート１０ａの平面方向に関する収縮を抑制しつつ焼結させることが可能になる。
なお、この補助層用（拘束層用）グリーンシート２０ａは、プレス時に未焼成セラミック体１０（図４）を傷めることなく加工することができるように、基板用グリーンシート１０ａよりも、硬くなるように物性を調整したものを用いる。 (4) Also, a plurality of auxiliary layer (constraint layer) green sheets 20a (FIG. 3) including ceramics that are not sintered at the firing temperature of the substrate green sheet 10a are prepared.
The auxiliary layer (constraint layer) green sheet 20a can be obtained, for example, by preparing a slurry by dispersing alumina powder in an organic vehicle and molding the slurry into a sheet by a casting method. The sintering temperature of the auxiliary layer (constraint layer) green sheet 20a thus obtained is 1500 to 1600 ° C., and therefore the temperature at which the substrate green sheet 10a is sintered (for example, 800 to 1000 ° C.). Then, the green sheet for substrate 10a is fired in a state in which the green sheet for auxiliary layer (for constraining layer) 20a is bonded without being sintered, thereby suppressing the shrinkage in the plane direction of the green sheet for substrate 10a. It becomes possible to tie.
This auxiliary layer (constraint layer) green sheet 20a is harder than the substrate green sheet 10a so that it can be processed without damaging the unfired ceramic body 10 (FIG. 4) during pressing. The material with adjusted physical properties is used.

(５)それから、上述のようにして作製した補助層用グリーンシート２０ａを所定の形状で打ち抜き加工し、その主面を固定面(平板)４に高圧力で圧着させることによりプレス用型２５を形成する（図３）。なお、補助層用グリーンシート２０ａの、打ち抜かれずに残った部分が凸部構成部材となり、この凸部構成部材が、固定面（平板）４に圧着されて、プレス用型２５の凸部（型）２５ａとなる。また、補助層用グリーンシートの、打ち抜かれた部分が、プレス用型２５の凹部（型）２５ｂとなる。このプレス用型２５の凸部２５ａは補助層用グリーンシートの一部であって、ある程度の弾力性を有しているため、プレス加工時に積層体（厚膜電極付き未焼成セラミック体１０）１１の損傷を抑制しつつ、所望の形状に加工することができる。   (5) Then, the auxiliary layer green sheet 20a produced as described above is punched into a predetermined shape, and its main surface is pressure-bonded to the fixed surface (flat plate) 4 with a high pressure, whereby the press die 25 is formed. Form (FIG. 3). The portion of the auxiliary layer green sheet 20a that remains without being punched becomes a convex component, and this convex component is pressure-bonded to the fixed surface (flat plate) 4 so that the convex ( ) 25a. Further, the punched portion of the auxiliary layer green sheet becomes a concave portion (die) 25 b of the press die 25. Since the convex portion 25a of the pressing mold 25 is a part of the auxiliary layer green sheet and has a certain degree of elasticity, the laminate (the unfired ceramic body 10 with the thick film electrode) 11 is formed during the pressing process. It can be processed into a desired shape while suppressing damage.

(６)次に、複数枚の基板用グリーンシート１０ａを積層して、下面側（（セラミック基板の第１主面Ｆ１となる側）にケース固定用電極３３となる厚膜電極３３ａが配設された厚膜電極付き未焼成セラミック体１１を形成する。
そして、その厚膜電極付き未焼成セラミック体１１の第１主面Ｆ１側に、補助層用グリーンシート２０ａを複数枚積層して補助層２０を形成するとともに、上面側（第２主面Ｆ２となる側）にも補助層用グリーンシート２０ａを複数枚積層して補助層２０を形成する。このとき、上面側の補助層２０の下面側となる補助層用グリーンシート２０ａの下面側に、外部電極５用の厚膜電極５ａを印刷しておく。なお、外部電極５用の厚膜電極５ａはプレス成形工程で、未焼成セラミック体１０側に転写されることになる。
なお、この実施例１では、下側の補助層２０の厚みを上側の補助層２０の厚みよりも薄くしている。補助層の厚みは、補助層用グリーンシートの枚数や厚みで調整でき、少なくとも１枚あればよい。 (6) Next, a plurality of substrate green sheets 10a are stacked, and a thick film electrode 33a to be a case fixing electrode 33 is disposed on the lower surface side (the side to be the first main surface F1 of the ceramic substrate). The fired ceramic body 11 with the thick film electrode is formed.
The auxiliary layer 20 is formed by laminating a plurality of auxiliary layer green sheets 20a on the first main surface F1 side of the unfired ceramic body 11 with the thick film electrode, and the upper surface side (the second main surface F2 and The auxiliary layer 20 is formed by laminating a plurality of auxiliary layer green sheets 20a on the other side as well. At this time, the thick film electrode 5a for the external electrode 5 is printed on the lower surface side of the auxiliary layer green sheet 20a which is the lower surface side of the auxiliary layer 20 on the upper surface side. The thick film electrode 5a for the external electrode 5 is transferred to the unfired ceramic body 10 side in the press molding process.
In Example 1, the thickness of the lower auxiliary layer 20 is made thinner than the thickness of the upper auxiliary layer 20. The thickness of the auxiliary layer can be adjusted by the number and thickness of the green sheets for the auxiliary layer, and at least one auxiliary layer is sufficient.

(７)次に、上記(６)の工程で形成された、未焼成セラミック体１０の両主面側に補助層２０が配設された積層体（補助層付き未焼成セラミック体１２）１１（図３，図４）の下面側にプレス用型２５を配設し、上面側から弾性体７（例えばシリコンラバー）を介して平板状の圧着用金型８によりプレスして、補助層付き未焼成セラミック体１２を変形させ、厚膜電極付き未焼成セラミック体１１に、ケース固定用の段部３０、外部電極５が形成される凸部４０を形成する。   (7) Next, a laminated body (unfired ceramic body 12 with an auxiliary layer) 11 in which auxiliary layers 20 are disposed on both principal surface sides of the unfired ceramic body 10 formed in the step (6) ( 3 and 4), a pressing die 25 is disposed on the lower surface side, and pressed from the upper surface side by a flat plate-shaped pressing die 8 via an elastic body 7 (for example, silicon rubber). The fired ceramic body 12 is deformed to form the case fixing step 30 and the convex part 40 on which the external electrode 5 is formed on the unfired ceramic body 11 with thick film electrodes.

なお、補助層付き未焼成セラミック体１２のプレス加工は、１００〜２０００ｋｇ／cm2、好ましくは１０００〜２０００ｋｇ／cm2のプレス圧力で、３０〜１００℃、好ましくは５０〜８０℃の温度で実施する。
また、プレス加工は水を媒体としてプレスを行う、いわゆる静水圧プレスの方法により行うことも可能である。 The pressing of the unfired ceramic body 12 with the auxiliary layer is performed at a pressure of 100 to 2000 kg / cm 2 , preferably 1000 to 2000 kg / cm 2 , and a temperature of 30 to 100 ° C., preferably 50 to 80 ° C. To do.
The press working can also be performed by a so-called isostatic pressing method in which water is used as a medium.

(８)次に、変形させた圧着体（プレス用型２５を含む補助層付き未焼成セラミック体１２）１３から固定面として使用した平板４を剥がし、補助層２０ならびに凸部２５ａを付けたまま、未焼成セラミック体１０が焼結し、補助層２０が実質的に焼結しない温度、例えば１０００℃以下、好ましくは８００〜１０００℃の温度で焼成する。   (8) Next, the flat plate 4 used as the fixing surface is peeled off from the deformed pressure-bonded body (unfired ceramic body 12 with an auxiliary layer including the pressing die 25) 13, and the auxiliary layer 20 and the convex portions 25a are left attached. The unfired ceramic body 10 is sintered and the auxiliary layer 20 is fired at a temperature at which the auxiliary layer 20 is not substantially sintered, for example, 1000 ° C. or less, preferably 800 to 1000 ° C.

なお、導体ペーストにＣｕ粉末などの卑金属粉末を導電成分とするものを用いた場合には、酸化防止のため還元雰囲気で焼成することが必要になるが、Ａｇ、Ａｇ−Ｐｄ、Ａｇ−Ｐｔなどの貴金属粉末を導電成分とする導電ペーストを用いた場合には大気中で焼成することも可能である。   Note that when a conductive paste using a base metal powder such as Cu powder as the conductive component is used, it is necessary to fire in a reducing atmosphere to prevent oxidation, but Ag, Ag-Pd, Ag-Pt, etc. When a conductive paste containing noble metal powder as a conductive component is used, it can be fired in the air.

(９)それから、焼結していない補助層２０およびプレス用型２５を焼結基板（セラミック基板）１の表面から除去することにより、図５に示すように、第１主面Ｆ１には、ケース１８（図１および２）をセラミック基板１に固定するための段部３０が形成されているとともに、段部３０の底面部分３１と側壁部分３２には、ケース１８を固定するためのケース固定用電極３３が形成されており、第２主面Ｆ２には、段部３０に対向する位置に凸部４０が形成され、かつ、凸部４０には実装対象であるマザーボード２１上の接続用ランド２２との接続のための外部電極５を備えたセラミック基板１を得る。   (9) Then, by removing the unsintered auxiliary layer 20 and the pressing die 25 from the surface of the sintered substrate (ceramic substrate) 1, as shown in FIG. A step 30 for fixing the case 18 (FIGS. 1 and 2) to the ceramic substrate 1 is formed, and a case fixing for fixing the case 18 to the bottom surface portion 31 and the side wall portion 32 of the step 30. The second main surface F2 is formed with a convex portion 40 at a position facing the step portion 30, and the convex portion 40 has a connection land on the mother board 21 to be mounted. The ceramic substrate 1 provided with the external electrode 5 for connection with 22 is obtained.

(10)そして、部品や半導体素子を高い信頼性で実装するため、表面に露出した表面導体やビアホール導体にめっきを施す。
なお、好ましいめっき種類としては、Ｎｉ／Ａｕ、Ｎｉ／Ｐｄ／Ａｕ、Ｎｉ／Ｓｎなどが例示される。なお、めっき方法に特別の制約はなく、電解めっき、無電解めっきを問わない。 (10) In order to mount components and semiconductor elements with high reliability, the surface conductors and via hole conductors exposed on the surface are plated.
Preferred plating types include Ni / Au, Ni / Pd / Au, Ni / Sn, and the like. In addition, there is no special restriction | limiting in the plating method, Electrolytic plating and electroless plating are not ask | required.

(11)そして、このセラミック基板１の第１主面Ｆ１に、第１表面実装部品１４（半導体素子１４ａ，チップ部品１４ｂ）を搭載し、第２主面Ｆ２に第２表面実装部品１５（半導体素子１５ａ，チップ部品１５ｂ）を搭載した後、はんだや導電性接着剤等の接合材を介して、あるいは係止によって、ケース１８を取り付けることにより、図６に示すようなセラミック電子部品集合体（マザーセラミック基板）が得られる。   (11) The first surface mounting component 14 (semiconductor element 14a and chip component 14b) is mounted on the first main surface F1 of the ceramic substrate 1, and the second surface mounting component 15 (semiconductor) is mounted on the second main surface F2. After mounting the element 15a and the chip component 15b), by attaching the case 18 via a bonding material such as solder or conductive adhesive or by locking, a ceramic electronic component assembly ( A mother ceramic substrate) is obtained.

(12)その後、図６の分割ライン（一点鎖線）に沿って個々の製品単位に分割することにより、図１および図２に示すような構造を有するセラミック電子部品（モジュール基板）Ａを得ることができる。   (12) After that, by dividing into individual product units along the dividing line (dashed line) in FIG. 6, a ceramic electronic component (module substrate) A having the structure shown in FIGS. 1 and 2 is obtained. Can do.

この実施例のセラミック電子部品およびその製造方法によれば、以下のような作用効果が得られる。   According to the ceramic electronic component of this embodiment and the manufacturing method thereof, the following effects can be obtained.

(ａ)第１主面Ｆ１の段部３０が形成されていない領域、および第２主面Ｆ２の凸部４０が形成されていない領域の面積を大きく確保できるため、実装可能面積が飛躍的に増加し、実装密度が高いモジュール基板を得ることが可能になる。
また、両面実装が可能で高密度実装性に優れたセラミック基板（モジュール基板）を得ることが可能になる。 (a) Since a large area can be secured in a region where the step portion 30 of the first main surface F1 is not formed and a region where the convex portion 40 of the second main surface F2 is not formed, the mountable area is dramatically increased. As a result, it is possible to obtain a module substrate having a high mounting density.
In addition, it is possible to obtain a ceramic substrate (module substrate) that can be mounted on both sides and is excellent in high-density mounting.

(ｂ)ケース固定用の段部３０および段部３０に配設されるケース固定用電極３３を効率よく確実に形成することが可能になるとともに、凸部４０および凸部４０の先端部およびその近傍に形成されるべき外部電極５を容易かつ確実に形成することが可能になり、製造工程の簡略化、製造コストの低減を図ることが可能になる。   (b) It is possible to efficiently and surely form the case fixing step 30 and the case fixing electrode 33 disposed on the step 30, and the protrusion 40 and the tip of the protrusion 40 and The external electrode 5 to be formed in the vicinity can be easily and reliably formed, and the manufacturing process can be simplified and the manufacturing cost can be reduced.

(ｃ)上述のようなプレス用型２５を用いてプレス成形を行っているため、セラミック基板１の厚みが全体的に均一で、ケース固定用の段部３０および外部電極５を形成すべき凸部４０の形状精度が高く、しかも、ケース固定用の段部３０および外部電極５を形成すべき凸部４０がセラミック基板１の他の部分と同等の強度を有する信頼性の高いセラミック基板を得ることが可能になる。   (c) Since press molding is performed using the press mold 25 as described above, the thickness of the ceramic substrate 1 is generally uniform, and the protrusion 30 on which the case fixing step 30 and the external electrode 5 are to be formed. A highly reliable ceramic substrate is obtained in which the shape accuracy of the portion 40 is high, and the step portion 30 for fixing the case and the convex portion 40 on which the external electrode 5 is to be formed have the same strength as the other portions of the ceramic substrate 1. It becomes possible.

なお、上記実施例１では、プレス用型を補助層用グリーンシートと同じ材料で形成した（すなわち、補助層用グリーンシートを打ち抜き加工してプレス用型を形成した）が、異なる種類の難焼結性材料から形成することも可能である。また、厚膜電極付き未焼成セラミック体（未焼成セラミック体）と同時に焼成することはできないが、金属や樹脂などからなるプレス用型を用いることも可能である。   In Example 1 above, the press mold was formed of the same material as the auxiliary layer green sheet (that is, the press mold was formed by punching the auxiliary layer green sheet), but different types of flame retardants were used. It is also possible to form from a binding material. Moreover, although it cannot fire simultaneously with the unfired ceramic body with a thick film electrode (unfired ceramic body), it is also possible to use a pressing die made of metal, resin, or the like.

［変形例１］
図７は本願発明のセラミック電子部品の製造方法の変形例を示す図である。
なお、図７において、図１〜６と同一符号を付した部分は、同一または相当する部分を示している。 [Modification 1]
FIG. 7 is a view showing a modification of the method for manufacturing a ceramic electronic component of the present invention.
In FIG. 7, the parts denoted by the same reference numerals as those in FIGS. 1 to 6 indicate the same or corresponding parts.

上記実施例１では、補助層を介してプレス用型を厚膜電極付き未焼成セラミック体に押し当てるようにしているが、図７に示すように、プレス用型が直接に厚膜電極付き未焼成セラミック体に接するようにして、プレス加工を行うことも可能である。この方法の場合、補助層２０を付けた状態で焼成するためには、プレス用型２５としては、補助層用グリーンシートと同じ材料からなるものを用いることが望ましい。   In Example 1 described above, the pressing die is pressed against the unfired ceramic body with the thick film electrode through the auxiliary layer. However, as shown in FIG. 7, the pressing die is not directly attached with the thick film electrode. It is also possible to perform press working so as to contact the fired ceramic body. In the case of this method, in order to bake with the auxiliary layer 20 attached, it is desirable to use the press mold 25 made of the same material as the auxiliary layer green sheet.

［変形例２］
図８は本願発明の方法により製造されるセラミック電子部品の変形例を示す図である。
なお、図８において、図１〜６と同一符号を付した部分は、同一または相当する部分を示している。 [Modification 2]
FIG. 8 is a view showing a modification of the ceramic electronic component manufactured by the method of the present invention.
In FIG. 8, the parts denoted by the same reference numerals as those in FIGS. 1 to 6 indicate the same or corresponding parts.

上記実施例１では、ケース固定用の段部がセラミック基板１の端部の一部に形成された部分穴状の形状を有するものである場合を例にとって説明したが、図８に示すように、セラミック基板１の互いに対向する一対の辺側に、その辺全体にわたるような段部３０ａを形成し、かつ、互いに対向する辺の下端部全体が固定用の脚部１９であるようなケース１８を用いるような構成とすることも可能である。   In the first embodiment, the case fixing step has been described as an example in which the stepped portion for fixing the case has a shape of a partial hole formed in a part of the end portion of the ceramic substrate 1, but as shown in FIG. A case 18 in which a stepped portion 30a is formed on a pair of opposite sides of the ceramic substrate 1 so as to cover the entire side, and the entire lower end of the opposite sides is a fixing leg 19. It is also possible to adopt a configuration using this.

［変形例３］
図９(ａ)，(ｂ)は本願発明の方法により製造されるラミック電子部品の他の変形例を示す図である。なお、図９(ａ)，(ｂ)において、図１〜６と同一符号を付した部分は、同一または相当する部分を示している。 [Modification 3]
9 (a) and 9 (b) are diagrams showing another modification example of the ceramic electronic component manufactured by the method of the present invention. In FIGS. 9A and 9B, the same reference numerals as those in FIGS. 1 to 6 denote the same or corresponding parts.

上記実施例１では、ケース固定用の段部３０がセラミック基板１の端縁部に位置している場合を例にとって説明したが、図９(ａ)，(ｂ)に示すように、ケース固定用の段部（凹部）３０ｂを、セラミック基板１の中央部にも位置するようにして、セラミック基板１の第１主面Ｆ１の一部のみがケース１８により覆われたセラミック電子部品を形成することも可能である。   In the first embodiment, the case where the case fixing step 30 is located at the edge of the ceramic substrate 1 has been described as an example. However, as shown in FIGS. A ceramic electronic component in which only a part of the first main surface F1 of the ceramic substrate 1 is covered with the case 18 is formed so that the step (concave portion) 30b for use is located also in the central portion of the ceramic substrate 1. It is also possible.

なお、ケース固定用の段部をセラミック基板の端縁部以外の場所にのみ設けて、セラミック基板の端縁部を含まない領域のみをケース１８で覆うように構成することも可能である。   It is also possible to provide a case fixing step part only at a place other than the edge part of the ceramic substrate so that only the region not including the edge part of the ceramic substrate is covered with the case 18.

［変形例４（ケース固定用の段部およびケースの脚部の構造の変形例）］
図１０(ａ)，(ｂ)、図１１(ａ)，(ｂ)、図１２(ａ)，(ｂ)は、本願発明の方法により製造されるセラミック電子部品のケース固定用の段部およびケースの脚部の構造の変形例を示す図である。
本願発明において、ケース固定用の段部の形状、構造は、上記実施例１の形状、構造に限られるものではなく、図１０(ａ)，(ｂ)、図１１(ａ)，(ｂ)、図１２(ａ)，(ｂ)に示されているような種々の構造とすることができる。 [Modification 4 (Modification of the structure of the case fixing step and the case leg)]
10 (a), (b), FIG. 11 (a), (b), FIG. 12 (a), and (b) are steps for fixing a case of a ceramic electronic component manufactured by the method of the present invention and It is a figure which shows the modification of the structure of the leg part of a case.
In the present invention, the shape and structure of the case fixing step are not limited to the shape and structure of the first embodiment, but are shown in FIGS. 10 (a), 10 (b), 11 (a), 11 (b). Various structures as shown in FIGS. 12A and 12B can be adopted.

すなわち、図１０(ａ)に示すように、段部３０の底面部分３１と側壁部分３２のなす角度が９０゜で、側壁部分３２が第１主面Ｆ１に略直角に形成されており、かつ、側壁部分３２にケース固定用電極３３が形成された構造とするとともに、ケース１８をその脚部１９が下方に真っ直ぐに延びた構造とすることができる。このような構成とした場合にも、ケース１８の脚部１９をはんだ３４により段部３０のケース固定用電極３３に確実に固定することができる。   That is, as shown in FIG. 10A, the angle formed by the bottom surface portion 31 and the side wall portion 32 of the step portion 30 is 90 °, and the side wall portion 32 is formed substantially perpendicular to the first main surface F1, and In addition to the structure in which the case fixing electrode 33 is formed on the side wall portion 32, the case 18 can have a structure in which the leg portion 19 extends straight downward. Even in such a configuration, the leg portion 19 of the case 18 can be reliably fixed to the case fixing electrode 33 of the stepped portion 30 by the solder 34.

また、図１０(ｂ)に示すように、段部３０の底面部分３１と側壁部分３２のなす角度が鈍角で、側壁部分３２が傾斜しており、底面部分３１と側壁部分３２にケース固定用電極３３が形成された構造とするとともに、ケース１８をその脚部１９が下方に真っ直ぐに延びた構造とすることができる。このような構成とした場合にも、ケース１８の脚部１９をはんだ３４により、段部３０のケース固定用電極３３に確実に固定することができる。   Further, as shown in FIG. 10B, the angle formed between the bottom surface portion 31 and the side wall portion 32 of the step portion 30 is an obtuse angle, and the side wall portion 32 is inclined, so that the case is fixed to the bottom surface portion 31 and the side wall portion 32. In addition to the structure in which the electrode 33 is formed, the case 18 can have a structure in which the leg portion 19 extends straight downward. Even in such a configuration, the leg portion 19 of the case 18 can be reliably fixed to the case fixing electrode 33 of the stepped portion 30 by the solder 34.

また、図１１(ａ)に示すように、段部３０の底面部分３１と側壁部分３２のなす角度が９０゜で、側壁部分３２が第１主面Ｆ１に略直角に形成されており、かつ、底面部分３１にケース固定用電極３３が形成された構造とするとともに、ケース１８をその脚部１９が下方に真っ直ぐに延びた構造とすることができる。このような構成とした場合にも、ケース１８の脚部１９をはんだ３４により、段部３０のケース固定用電極３３に確実に固定することができる。   Further, as shown in FIG. 11A, the angle formed by the bottom surface portion 31 and the side wall portion 32 of the step portion 30 is 90 °, and the side wall portion 32 is formed substantially perpendicular to the first main surface F1, and In addition to the structure in which the case fixing electrode 33 is formed on the bottom surface portion 31, the case 18 can have a structure in which the leg portion 19 extends straight downward. Even in such a configuration, the leg portion 19 of the case 18 can be reliably fixed to the case fixing electrode 33 of the stepped portion 30 by the solder 34.

また、図１１(ｂ)に示すように、段部３０の底面部分３１と側壁部分３２のなす角度が鈍角で、側壁部分３２が傾斜しており、底面部分３１と側壁部分３２にケース固定用電極３３が形成された構造とするとともに、ケース１８をその脚部１９が、段部３０の側壁部分３２に沿うとともに、底面部分３１にも沿うように、２箇所で曲折した構造とすることができる。このような構成とした場合、ケース１８の脚部１９が、段部３０の側壁部分３２および底面部分３１に沿うように曲折した構造を有しているので、はんだ３４により、ケース１８の脚部１９を段部３０のケース固定用電極３３により確実に固定することが可能になる。なお、底面部分３１が存在せず、全面がテーパー状の段部になっていてもよい。   11B, the angle formed between the bottom surface portion 31 and the side wall portion 32 of the step portion 30 is an obtuse angle, and the side wall portion 32 is inclined, and the bottom surface portion 31 and the side wall portion 32 are used for fixing the case. In addition to the structure in which the electrode 33 is formed, the case 18 may have a structure in which the leg portion 19 is bent at two locations so that the leg portion 19 extends along the side wall portion 32 of the stepped portion 30 and the bottom surface portion 31. it can. In such a configuration, the leg portion 19 of the case 18 has a structure that is bent along the side wall portion 32 and the bottom surface portion 31 of the step portion 30, so that the leg portion of the case 18 is soldered by the solder 34. 19 can be reliably fixed by the case fixing electrode 33 of the step portion 30. The bottom surface portion 31 may not exist, and the entire surface may be a tapered step.

また、図１２(ａ)に示すように、段部３０の底面部分３１と側壁部分３２のなす角度が９０゜で、側壁部分３２が第１主面Ｆ１に略直角に形成されており、かつ、ケース固定用電極３３が底面部分３１、側面部分３２およびセラミック基板１の上面（第１主面）Ｆ１にまで形成された構造とするとともに、ケース１８をその脚部１９が下方に真っ直ぐに延びた構造とすることができる。このような構成とした場合、はんだ３４を底面部分３１から側面部分３２を経てセラミック基板１の上面（第１主面）Ｆ１にまで回り込ませることが可能になり、ケース１８の脚部１９をはんだ３４により、段部３０のケース固定用電極３３により確実に固定することができる。   Further, as shown in FIG. 12A, the angle formed by the bottom surface portion 31 and the side wall portion 32 of the step portion 30 is 90 °, and the side wall portion 32 is formed substantially perpendicular to the first main surface F1, and The case fixing electrode 33 has a structure in which the bottom surface portion 31, the side surface portion 32, and the upper surface (first main surface) F1 of the ceramic substrate 1 are formed, and the case 18 has a leg portion 19 that extends straight downward. Structure. In such a configuration, the solder 34 can be passed from the bottom surface portion 31 through the side surface portion 32 to the upper surface (first main surface) F1 of the ceramic substrate 1, and the leg portion 19 of the case 18 is soldered. 34, the case fixing electrode 33 of the step portion 30 can be securely fixed.

また、図１２(ｂ)に示すように、段部３０の底面部分３１と側壁部分３２のなす角度が９０゜で、側壁部分３２が第１主面Ｆ１に略直角に形成されており、かつ、ケース固定用電極３３が底面部分３１および側面部分３２にまで形成された構造とするとともに、ケース１８を、その脚部１９が下方に真っ直ぐに延びた部分１９ａと、真っ直ぐに延びた部分１９ａの途中から垂直に突出して、セラミック基板１の上面（第１主面）Ｆ１に沿う位置まで延びた係止突起１９ｂを備えた構造とすることができる。このような構成とした場合、係止突起１９ｂがセラミック基板の上面（第１主面）Ｆ１と当接して、ケース１８とセラミック基板１の位置決めが確実に行われ、その状態で、脚部１９の下方に真っ直ぐに延びた部分１９ａがはんだ３４を介して、段部３０のケース固定用電極３３に固定されるため、信頼性の高いケースの取り付けを行うことが可能になる。   Further, as shown in FIG. 12B, the angle formed by the bottom surface portion 31 and the side wall portion 32 of the step portion 30 is 90 °, and the side wall portion 32 is formed substantially perpendicular to the first main surface F1, and The case fixing electrode 33 has a structure in which the bottom surface portion 31 and the side surface portion 32 are formed, and the case 18 includes a portion 19a in which the leg portion 19 extends downward and a portion 19a in which the leg portion 19 extends straight. It can be set as the structure provided with the latching protrusion 19b which protruded perpendicularly from the middle and extended to the position which followed the upper surface (1st main surface) F1 of the ceramic substrate 1. FIG. In such a configuration, the locking projection 19b contacts the upper surface (first main surface) F1 of the ceramic substrate, and the positioning of the case 18 and the ceramic substrate 1 is performed reliably. Since the portion 19a that extends straight downward is fixed to the case fixing electrode 33 of the step portion 30 via the solder 34, it is possible to attach the case with high reliability.

なお、本願発明は、上記実施例に限定されるものではなく、セラミック基板の一方主面に形成される、ケースをセラミック基板に固定するための段部の形状や配設位置、配設数、セラミック基板の他方主面に形成される、外部電極がその表面に形成される凸部の具体的な形状や配設位置、配設数などに関し、発明の範囲内において、種々の応用、変形を加えることが可能である。   The invention of the present application is not limited to the above-described embodiment, and the shape and arrangement position of the step portion for fixing the case to the ceramic substrate, the number of arrangements, With respect to the specific shape, arrangement position, number of arrangements, etc. of the protrusions formed on the surface of the ceramic substrate on which the external electrode is formed, various applications and modifications are possible within the scope of the invention. It is possible to add.

上述のように、本願発明によれば、セラミック基板の、マザーボードへの実装面から突出した位置に外部電極を備え、実装面とマザーボードとの間に隙間を確保することが可能で、かつ、セラミック基板に実装された表面実装部品を覆うケースを備えた、信頼性の高いセラミック電子部品を得ることが可能になる。また、実装密度の高いセラミック電子部品を得ることが可能になる。
したがって、本願発明は、例えば、シールドケースを備えたモジュール基板などの、種々のセラミック電子部品に広く適用することが可能である。 As described above, according to the present invention, an external electrode is provided at a position protruding from the mounting surface of the ceramic substrate on the motherboard, a gap can be secured between the mounting surface and the motherboard, and the ceramic It is possible to obtain a highly reliable ceramic electronic component having a case that covers a surface-mounted component mounted on a substrate. In addition, a ceramic electronic component having a high mounting density can be obtained.
Therefore, the present invention can be widely applied to various ceramic electronic components such as a module substrate having a shield case.

本願発明の実施例（実施例１）にかかるセラミック電子部品をマザーボードに搭載した状態を示す図である。It is a figure which shows the state which mounted the ceramic electronic component concerning Example (Example 1) of this invention on a motherboard. 本願発明の実施例にかかるセラミック電子部品の構成を模式的に示す分解斜視図である。It is a disassembled perspective view which shows typically the structure of the ceramic electronic component concerning the Example of this invention. 本願発明の実施例にかかるセラミック電子部品の製造方法を示す図である。It is a figure which shows the manufacturing method of the ceramic electronic component concerning the Example of this invention. 本願発明の実施例にかかるセラミック電子部品の製造方法のプレス成形工程を示す図である。It is a figure which shows the press molding process of the manufacturing method of the ceramic electronic component concerning the Example of this invention. 本願発明の実施例にかかるセラミック電子部品の製造方法の一工程で得た、本願発明のセラミック体を構成するセラミック基板を示す図である。It is a figure which shows the ceramic substrate which comprises the ceramic body of this invention obtained by 1 process of the manufacturing method of the ceramic electronic component concerning the Example of this invention. 本願発明の実施例にかかるセラミック電子部品の製造方法の一工程でセラミック基板に表面実装部品を実装し、ケースを取り付けた状態を示す図である。It is a figure which shows the state which mounted the surface mounting component on the ceramic substrate in 1 process of the manufacturing method of the ceramic electronic component concerning the Example of this invention, and attached the case. 本願発明のセラミック電子部品の製造方法の変形例を示す図である。It is a figure which shows the modification of the manufacturing method of the ceramic electronic component of this invention. 本願発明の方法により製造されるセラミック電子部品の変形例を示す図である。It is a figure which shows the modification of the ceramic electronic component manufactured by the method of this invention. (ａ)，(ｂ)は本願発明の方法により製造されるセラミック電子部品の他の変形例を示す図である。(a), (b) is a figure which shows the other modification of the ceramic electronic component manufactured by the method of this invention. (ａ)，(ｂ)は本願発明にかかるセラミック電子部品のケース固定用の段部およびケースの脚部の構造の変形例を示す図である。(a), (b) is a figure which shows the modification of the structure of the step part for case fixing of the ceramic electronic component concerning this invention , and the leg part of a case. (ａ)，(ｂ)は本願発明にかかるセラミック電子部品のケース固定用の段部およびケースの脚部の構造の他の変形例を示す図である。(a), (b) is a figure which shows the other modification of the structure of the step part for case fixing of the ceramic electronic component concerning this invention , and the leg part of a case. (ａ)，(ｂ)は本願発明にかかるセラミック電子部品のケース固定用の段部およびケースの脚部の構造のさらに他の変形例を示す図である。(a), (b) is a figure which shows the other modification of the structure of the step part for case fixing of the ceramic electronic component concerning this invention , and the leg part of a case. 従来の積層型電子部品の構成を示す図である。It is a figure which shows the structure of the conventional multilayer electronic component. 従来の突起電極を備えたセラミック基板の製造方法を示す図である。It is a figure which shows the manufacturing method of the ceramic substrate provided with the conventional protruding electrode.

１ セラミック基板（焼結基板）
４ 固定面（平板）
５ 外部電極
５ａ 外部電極用の厚膜電極
７ 弾性体
８ 平板状の圧着用金型
１０ 未焼成セラミック体
１０ａ 基板用グリーンシート
１１ 積層体（厚膜電極付き未焼成セラミック体）
１２ 補助層付き未焼成セラミック体
１３ 圧着体
１４ 第１表面実装部品
１４ａ 半導体素子
１４ｂ チップ部品
１５ 第２表面実装部品
１５ａ 半導体素子
１５ｂ チップ部品
１８ ケース
１９ 脚部
１９ａ 脚部の真っ直ぐに延びた部分
１９ｂ 係止突起
２０ 補助層
２０ａ 補助層用（拘束層用）グリーンシート
２１ マザーボード
２２ 接続用ランド
２５ プレス用型
２５ａ プレス用型の凸部
２５ｂ プレス用型の凹部
３０，３０ａ，３０ｂ 段部
３１ 段部の底面部分
３２ 段部の側壁部分
３３ ケース固定用電極
３３ａ 厚膜電極
３４ 接合材（はんだ）
４０ 凸部
Ａ セラミック電子部品（モジュール基板）
Ｆ１ 第１主面
Ｆ２ 第２主面 1 Ceramic substrate (sintered substrate)
4 Fixed surface (flat plate)
DESCRIPTION OF SYMBOLS 5 External electrode 5a Thick film electrode for external electrodes 7 Elastic body 8 Flat die for crimping 10 Unfired ceramic body 10a Green sheet for substrate 11 Laminated body (Unfired ceramic body with thick film electrode)
DESCRIPTION OF SYMBOLS 12 Unbaked ceramic body with auxiliary layer 13 Pressure bonding body 14 1st surface mounting component 14a Semiconductor element 14b Chip component 15 2nd surface mounting component 15a Semiconductor element 15b Chip component 18 Case 19 Leg part 19a The part 19b which extended straight of the leg part 19b Locking projection 20 Auxiliary layer 20a Green sheet for auxiliary layer (for constraining layer) 21 Mother board 22 Connection land 25 Press mold 25a Press mold convex part 25b Press mold concave part 30, 30a, 30b Step part 31 Step part Bottom surface portion 32 Stepped side wall portion 33 Case fixing electrode 33a Thick film electrode 34 Bonding material (solder)
40 Convex A Ceramic electronic component (module substrate)
F1 first main surface F2 second main surface

Claims (4)

第１主面および第２主面を有するセラミック基板を素体とし、前記第１主面には、第１表面実装部品が搭載されているとともに、前記第１表面実装部品を覆うケースが設けられており、前記第２主面には、マザーボードヘの接続用の外部電極を有するセラミック電子部品の製造方法であって、
(ａ)焼成後に前記セラミック基板となる未焼成セラミック体の第２主面の所定の位置に、焼成後に前記外部電極となる厚膜電極を印刷して、厚膜電極付き未焼成セラミック体を形成する工程と、
(ｂ)前記厚膜電極付き未焼成セラミック体の、第１主面および第２主面の少なくとも一方側にプレス用型を配設し、プレスすることにより、前記厚膜電極付き未焼成セラミック体の前記第１主面に段部が形成されるとともに、前記厚膜電極付き未焼成セラミック体の前記第２主面には、前記段部に対向する位置に凸部が形成され、かつ、前記凸部上に前記厚膜電極が位置するように、前記厚膜電極付き未焼成セラミック体を変形させる工程と、
(ｃ)前記厚膜電極付き未焼成セラミック体を焼成して、前記厚膜電極付き未焼成セラミック体の前記第１主面に、前記ケースを前記セラミック基板に固定するための段部を備え、前記第２主面には、前記段部に対向する位置に凸部を備え、かつ、前記凸部上に前記外部電極を備えたセラミック基板を得る工程と、
(ｄ)前記素体である前記セラミック基板の前記第１主面に、第１表面実装部品を搭載する工程と、
(ｅ)前記セラミック基板の前記第１主面側に、前記第１表面実装部品を覆うケースを配設し、前記ケースを前記段部に固定する工程と
を具備することを特徴とするセラミック電子部品の製造方法。 A ceramic substrate having a first main surface and a second main surface is used as a base body, and a first surface mounting component is mounted on the first main surface, and a case for covering the first surface mounting component is provided. The second main surface is a method for manufacturing a ceramic electronic component having an external electrode for connection to a motherboard,
(a) A thick film electrode serving as the external electrode after firing is printed at a predetermined position on the second main surface of the unfired ceramic body serving as the ceramic substrate after firing to form an unfired ceramic body with thick film electrodes. And a process of
(b) An unsintered ceramic body with thick film electrodes is formed by disposing and pressing a pressing die on at least one side of the first main surface and the second main surface of the unfired ceramic body with thick film electrodes. A step portion is formed on the first main surface, and a convex portion is formed on the second main surface of the unfired ceramic body with the thick film electrode at a position facing the step portion, and Deforming the unfired ceramic body with the thick film electrode so that the thick film electrode is located on the convex portion; and
(c) firing the unfired ceramic body with the thick film electrode, and providing a step for fixing the case to the ceramic substrate on the first main surface of the unfired ceramic body with the thick film electrode; The second main surface is provided with a convex portion at a position facing the step portion, and obtaining a ceramic substrate having the external electrode on the convex portion;
(d) mounting a first surface mount component on the first main surface of the ceramic substrate as the element body;
(e) disposing a case that covers the first surface-mounted component on the first main surface side of the ceramic substrate, and fixing the case to the step portion. A manufacturing method for parts. 前記(ａ)の工程で、焼成後に前記セラミック基板となる未焼成セラミック体の第２主面の所定の位置に、焼成後に前記外部電極となる厚膜電極を印刷するとともに、未焼成セラミック体の第１主面の所定の位置に前記ケースを固定するためのケース固定用電極となる厚膜電極を印刷して、厚膜電極付き未焼成セラミック体を形成し、
前記(ｂ)の工程で、前記厚膜電極付き未焼成セラミック体の、第１主面および第２主面の少なくとも一方側にプレス用型を配設し、プレスすることにより、前記厚膜電極付き未焼成セラミック体の前記第１主面に前記段部が形成され、かつ、前記段部の前記底面部分および前記側壁部分の少なくとも一方に前記厚膜電極が位置するとともに、前記第２主面に前記凸部が形成され、かつ、前記凸部上に前記厚膜電極が位置するように、前記厚膜電極付き未焼成セラミック体を変形させること
を特徴とする請求項１記載のセラミック電子部品の製造方法。 In the step (a), a thick film electrode that becomes the external electrode after firing is printed at a predetermined position on the second main surface of the unfired ceramic body that becomes the ceramic substrate after firing, and the unfired ceramic body Printing a thick film electrode serving as a case fixing electrode for fixing the case at a predetermined position on the first main surface, forming an unfired ceramic body with a thick film electrode;
In the step (b), the thick film electrode is formed by disposing and pressing a pressing die on at least one side of the first main surface and the second main surface of the unfired ceramic body with the thick film electrode. The stepped portion is formed on the first main surface of the attached unfired ceramic body, and the thick film electrode is located on at least one of the bottom surface portion and the side wall portion of the stepped portion, and the second main surface the convex portion is formed on, and, as the thick-film electrode on the convex portion is positioned, a ceramic electronic component according to claim 1, wherein the deforming the thick film electrode with unfired ceramic body Manufacturing method. 前記厚膜電極付き未焼成セラミック体の表面に、前記未焼成セラミック体が焼結する温度では実質的に焼結しない材料を用いて形成した補助層が配設された状態で、前記厚膜電極付き未焼成セラミック体を変形させる工程を実施することを特徴とする請求項１または２記載のセラミック電子部品の製造方法。 In the state where an auxiliary layer formed using a material that is not substantially sintered at a temperature at which the green ceramic body is sintered is disposed on the surface of the green ceramic body with the thick film electrode, the thick film electrode 3. The method for manufacturing a ceramic electronic component according to claim 1, wherein a step of deforming the attached unfired ceramic body is performed. 前記プレス用型が、前記未焼成セラミック体が焼結する温度では実質的に焼結しない材料を用いて形成したものであることを特徴とする請求項１〜３のいずれかに記載のセラミック電子部品の製造方法。 The press mold is ceramic electronic according to claim 1, wherein the unfired ceramic body is characterized in that the temperature of sintering is obtained by forming using a material which does not substantially sintered A manufacturing method for parts.
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US9240526B2 (en) 2010-04-23 2016-01-19 Cree, Inc. Solid state light emitting diode packages with leadframes and ceramic material
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