JP2013182907A - Ceramic coupling substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a ceramic coupling substrate in which occurrence of problems due to a deformation suppression part is minimized when the substrate is divided.SOLUTION: A ceramic coupling substrate 1 includes a square aggregation part 3 where multiple unit substrates 2 are coupled, a frame 4 provided on the outer periphery of the aggregation part 3, and deformation suppression parts 8 provided along at least one side of the outer periphery of the aggregation part 3, and having slits 81 on the extension of scheduled cut line between the unit substrates 2.

Description

  The present invention relates to a ceramic connection substrate in which a plurality of unit substrates are connected, and more particularly to a ceramic connection substrate in which a deformation suppressing portion for suppressing deformation of a unit substrate during firing is formed.

  Conventionally, a ceramic substrate made of a ceramic sintered body or the like is used as a substrate on which electronic components such as semiconductor elements are mounted. In recent years, ceramic substrates have been downsized along with demands for downsizing electronic devices. As a manufacturing method of a small ceramic substrate, a so-called multi-cavity manufacturing method in which a large number of small ceramic substrates are simultaneously manufactured from a connected substrate is generally used.

  For example, the connection substrate has a rectangular aggregate portion in which a large number of small ceramic substrates as minimum units are connected vertically and horizontally, and a frame portion is provided so as to surround the outer peripheral portion of the aggregate portion. For example, the gathering portion is provided with a dividing groove for easily performing division on a planned dividing line where adjacent small ceramic substrates are divided. When the dividing groove is provided in the collecting portion, the dividing groove is also provided in the frame portion on the extension line. The connecting substrate may be divided by dicing. In this case, the dividing groove is not necessarily provided.

  A large number of small ceramic substrates can be efficiently obtained by dividing the small ceramic substrates in the connection substrate by dividing grooves or the like. In addition, a large number of semiconductor devices can be efficiently manufactured by mounting the semiconductor element on the element mounting surface of the small ceramic substrate in the connection substrate and then dividing the semiconductor element by dividing grooves. Here, as a semiconductor element, light emitting elements, such as an LED element, are mentioned, for example.

  However, in the production of a connection substrate made of a ceramic material, deformation occurs due to differences in the shrinkage rate of each part during firing. For example, when a connecting board having a frame portion on the outer peripheral portion of the collective portion is manufactured independently, the central portion of each side in the outer peripheral portion of the collective portion is deformed so as to swell toward the frame portion side. In addition, when a large number of connected substrates are manufactured simultaneously from a substrate sheet in which a large number of connected substrates are connected vertically and horizontally, among the sides on the outer periphery of the assembled portion, the sides adjacent to the other aggregated portions While the deformation is canceled by the deformation force of the collective part, the central part of the side swells toward the frame part side because no deformation force is applied to the side that is not adjacent to the other collective part. It deforms as follows. Examples of the side with such a large deformation include a side of the collective portion of the connection board disposed in a portion close to the outer peripheral portion of the substrate sheet and a side close to the outer peripheral portion of the substrate sheet.

  When such deformation occurs, the small ceramic substrate cannot be properly divided, and the accuracy of the mounting position when electronic parts such as semiconductor elements are mounted is lowered. In addition, there is a risk of malfunction when mounted on an electronic device or damage due to insufficient strength. As a method for suppressing the deformation at the time of firing of such a connection substrate, for example, it is known to provide a deformation suppressing portion made of a conductor layer or the like for suppressing the deformation in the vicinity of the portion where the deformation occurs (for example, , See Patent Documents 1 to 3.)

JP 57-43500 A JP 2001-308526 A JP 2011-3655 A

  However, when the deformation suppressing portion is simply provided along the outer peripheral portion of the collecting portion, a problem occurs when dividing into individual small ceramic substrates. For example, in the case of having a split groove, the split groove is formed including the portion where the deformation suppressing portion is formed by pressing a cutting blade of a ceramic green sheet cutting machine or the like before firing, but the deformation suppressing portion is provided. When the metal in the deformation suppressing portion is melted into the ceramic during firing, the dividing groove is fused to lower the melting point of the ceramic, making subsequent division difficult. In addition, in the case of dividing by dicing, the division is performed including the portion where the deformation suppressing portion is formed after firing. Generally, the metal provided in the deformation suppressing portion is less scraped in the chip pocket of the dicing blade than the ceramic substrate. Since it is easy to enter, clogging is likely to occur because the cutting waste cannot be removed. As a result, the cutting force is reduced, which causes a problem such as chipping of the substrate. In either case, the productivity is lowered, and it is not possible to sufficiently obtain the effect of simultaneously manufacturing a large number of small ceramic substrates from the connection substrate and reducing the cost.

  The present invention has been made in order to solve the above-described problems, and an object of the present invention is to provide a connection board having a deformation suppressing portion, which can suppress the occurrence of problems during division and has excellent unit board productivity. .

  The ceramic connecting substrate of the present invention is provided along a rectangular aggregate portion in which a plurality of unit substrates are connected, a frame portion provided on the outer periphery of the aggregate portion, and at least one side in the outer periphery of the aggregate portion, It has a deformation | transformation suppression part which has a slit on the extension line of the division | segmentation planned line between unit substrates, It is characterized by the above-mentioned.

  According to the ceramic connecting substrate of the present invention, by providing a slit in a portion of the deformation suppressing portion that is an extension of the planned dividing line, it is possible to suppress the occurrence of problems when dividing into unit substrates, and the productivity of the unit substrate Can be improved.

The top view which shows 1st Embodiment of a connection board | substrate. XX sectional drawing of the connection board | substrate shown in FIG. The top view which shows the 1st modification of the connection board | substrate shown in FIG. The top view which shows the 2nd modification of the connection board | substrate shown in FIG. The top view which shows 2nd Embodiment of a connection board | substrate. XX sectional drawing of the connection board | substrate shown in FIG. The top view which shows an example of the manufacturing method of a connection board | substrate. The top view which shows the modification of the manufacturing method of a connection board | substrate. The top view which shows the other modification of the manufacturing method of a connection board | substrate. Diagram showing the relationship between the deformation amount of the length L ₁ and the connection substrate the slit.

Embodiments of the present invention will be described below.
FIG. 1 is a plan view showing a first embodiment of a connection board, and is a plan view seen from the element mounting surface side. Moreover, FIG. 2 is the figure which expanded the XX sectional view of the connection board | substrate shown in FIG. The connection substrate shown in FIGS. 1 and 2 is a connection substrate for simultaneously manufacturing a plurality of light emitting element substrates on which light emitting elements such as LED elements are mounted.

  The connection substrate 1 has a rectangular aggregate portion 3 configured by connecting a plurality of unit substrates 2 and has a frame portion 4 surrounding the outer periphery of the aggregate portion 3. Here, the unit substrate 2 corresponds to the light emitting element substrate. The collective unit 3 is, for example, arranged by connecting a total of 100 unit substrates 2 in 10 columns vertically and 10 rows horizontally. Usually, an intermediate position between two adjacent unit substrates 2 is a planned dividing line. A plurality of notch-shaped reference portions 5 serving as a reference for division are provided on an extension line of the planned division line at the outer end portion of the frame portion 4. For example, the division grooves 6 are provided in the element mounting surface 1a and the non-mounting surface 1b with the pair of opposing reference portions 5 as a reference. The size of the connection substrate 1 is not necessarily limited, but the size of the connection substrate 1 is preferably 30 mm square or more, more preferably 40 mm square or more, and generally 150 square mm or less. In addition, the connecting substrate 1 preferably has, for example, an assembly portion 3 in which nine or more unit substrates 2 are connected, and more preferably has an assembly portion 3 in which 100 or more unit substrates 2 are connected. The number of unit substrates 2 in the gathering unit 3 is generally 2500 or less.

  The division grooves 6 provided on the element mounting surface 1a side and the division grooves 6 provided on the non-mounting surface 1b side are provided so as to face each other, and adjacent units are formed by applying stress to these division grooves 6. A single unit substrate 2 is obtained by dividing the substrates 2. Further, in order to prevent the occurrence of problems such as chipping during the division, the division holes 7 are often provided at the four corners of the unit substrate 2. From the viewpoint of easy division and the strength of the connecting substrate 1, the width of the dividing groove 6 is preferably 5 to 50 μm, and the depth is the sum of the depths of the dividing grooves 6 provided on both main surfaces of the connecting substrate 1. 40% to 85% of the thickness of the substrate 1 is preferable. For example, when the thickness of the connecting substrate 1 is 1 mm, it is preferable to provide the dividing grooves 6 having a total depth from both main surfaces of 400 to 850 μm. The distribution of the depths of the respective dividing grooves 6 on both main surfaces can be arbitrarily changed depending on where the inner layer conductor of the connecting substrate 1 is located and the dividing surfaces.

  On the element mounting surface 1a side of the unit substrate 2, a frame body 21 is provided at the peripheral edge so as to form a cavity having a central portion as a bottom surface. The bottom surface of the cavity has a central portion as a mounting portion on which the light emitting element is mounted. In addition, a pair of bipolar element connection terminals 22 that are electrically connected to the light emitting elements are provided so as to sandwich the mounting portion.

  On the non-mounting surface 1b side of the unit substrate 2, a pair of external connection terminals 23 that are electrically connected to an external circuit are provided. These external connection terminals 23 are formed so that, for example, the peripheral side end is close to the dividing groove 6 and the electrode area is sufficiently large in order to ensure the bonding strength with the mounting substrate having the external circuit. .

  Inside the unit substrate 2, a through conductor 24 that electrically connects the element connection terminal 22 and the external connection terminal 23 is provided. Note that the position, shape, and size of the element connection terminal 22, the external connection terminal 23, and the through conductor 24 are not particularly limited as long as the light emitting element and the external circuit can be electrically connected, and can be adjusted as appropriate.

  Although not shown, a thermal via extending in the thickness direction and a heat dissipation layer parallel to the element mounting surface 1a can be embedded in the unit substrate 2 in order to reduce thermal resistance. For example, one or a plurality of thermal vias are provided immediately below the element mounting portion. Although not shown, in order to improve the light extraction efficiency, for example, a reflective film mainly composed of silver may be provided on the bottom surface of the cavity. The reflective film is preferably provided so as not to be electrically connected to the pair of element connection terminals 22, and an overcoat glass layer covering the entire reflective film including the edge is preferably provided thereon.

  The deformation suppression unit 8 is provided in the frame unit 4 so as to surround the entire outer periphery of the assembly unit 3, for example. Moreover, the deformation | transformation suppression part 8 is provided in the element mounting surface 1a, the non-mounting surface 1b, and an inside, for example. The element mounting surface 1a, the non-mounting surface 1b, and the internal deformation suppressing portions 8 are each provided with a slit 81 on an extension line of the planned dividing line. Here, the slit 81 means a discontinuous portion in the deformation suppressing unit 8. For those having the dividing groove 6, the dividing groove 6 is usually formed so that the center portion overlaps the planned dividing line and its extension line.

  By providing the slit 81 in the deformation suppressing portion 8, for example, for the connection substrate 1 having the dividing groove 6, a cutting blade such as a ceramic green sheet cutting machine is used at the time of manufacturing, particularly when the dividing groove 6 before firing is formed. The dividing groove 6 having a sufficient width and depth can be formed by pressing. Thereby, melt | fusion of the division | segmentation groove | channel 6 at the time of subsequent baking can be suppressed, and the division | segmentation property to each unit substrate 2 can be improved.

  Although it is preferable to provide the slits 81 basically at all locations on the extension line of the planned dividing line, even if the slits 81 are not provided at locations where the ratio of the number of the entire locations is 10% or less. Good. Even if the slit 81 is not formed at such a position, the above-described splitting property and the like can be maintained. Such a portion where the slit 81 is not provided is preferably 5% or less, more preferably 3% or less, and even more preferably 1% or less in terms of the number of the whole portion.

  In addition, although it is preferable to provide the deformation | transformation suppression part 8 from the viewpoint of suppressing the deformation | transformation of the gathering part 3 so that it may surround the whole outer periphery of the gathering part 3, it is not necessarily provided so that the whole outer periphery of the gathering part 3 may be enclosed. There is no need, and it is only necessary to be provided along at least one side of the outer periphery of the collecting portion 3. For example, when the connection substrate 1 is manufactured from a substrate sheet in which a plurality of connection substrates 1 are connected, depending on the position of the connection substrate 1 in the substrate sheet, in particular, a portion where deformation becomes large, as shown in FIG. It may be provided along one side of the outer periphery, or may be provided along two adjacent sides of the outer periphery of the collective portion 3 as shown in FIG. In any case, basically, the deformation suppressing unit 8 is provided with slits 81 on the extended lines of all the division lines.

  Moreover, although the deformation | transformation suppression part 8 is preferable to provide in the element mounting surface 1a, the non-mounting surface 1b, and the inside from a viewpoint of suppressing the deformation | transformation of the gathering part 3 effectively, it is necessary to provide in all these parts. There is no need to be provided in at least a part selected from these parts. For example, when providing on the element mounting surface 1a and the non-mounting surface 1b, it is generally preferable to provide it symmetrically, and it becomes easy to receive design restrictions, but the warpage of the connecting substrate 1 during firing can be effectively suppressed. Further, when provided on one of the element mounting surface 1a and the non-mounting surface 1b, the connecting substrate 1 is more likely to warp during firing than when provided on both surfaces, but there are less design restrictions and the slit 81 is longer. By doing so, the warpage can be sufficiently reduced. Note that the element mounting surface 1a, the non-mounting surface 1b, and the internal deformation suppressing portion 8 are each provided with a slit 81 on the extension line of the planned dividing line.

The length L ₁ in the direction along the outer peripheral portion of the collecting portion 3 of the slit 81, but not necessarily limited to, the case of those with a split groove 6, 50 to 2000 m is preferable. In the following description, simply referred to as the length L ₁ of the slit 81 a length L ₁ in the direction along the outer peripheral portion of the collecting portion 3 of the slit 81.

In general, the width of the dividing groove 6 is preferably 5 to 50 μm from the viewpoint of easy division and maintenance of the strength of the connecting substrate 1. The length L ₁ of the slit 81 by the above 50 [mu] m, the formation of the division groove 6, the dividing groove 6 portion deformation suppressing portion 8 is formed, it can particularly prevent the overlapping portions other than the slit 81, the ceramic A dividing groove 6 having a sufficient width can be formed by pressing a cutting blade such as a green sheet cutting machine. Thereby, melt | fusion of the division | segmentation groove | channel 6 at the time of subsequent baking can be suppressed, and the division | segmentation property to each unit substrate 2 can be improved. Further, by setting the length L ₁ or more 50 [mu] m, it is easy to form the slit 81 by screen printing. The longer the length L ₁ of the slit 81 is, the easier it is to suppress the fusion of the dividing grooves 6 and also to suppress the warping of the connecting substrate 1 during firing, but the viewpoint of sufficiently obtaining the original function of the deformation suppressing portion 8. Therefore, 2000 μm or less is preferable. The length _{L 1} of the slit 81, more preferably at least 100 [mu] m. The length L ₁ of each slit 81 is not necessarily identical to each other, may be different from each other in the range above.

Width _{L 2} of the deformation suppression portion 8 shown in FIG. 2 is preferably at least 1 mm, also less preferred 10 mm. The width L ₂ of the deformation suppression portion 8 by the above 1 mm, it is possible to obtain the deformation suppressing effect of the deformation suppressing portion 8 effectively. In addition, by setting the width of the deformation suppressing portion 8 to 10 mm or less, an increase in manufacturing cost or the like can be suppressed while effectively obtaining the deformation suppressing effect by the deformation suppressing portion 8. Width _{L 2} of the deformation suppression portion 8, more preferably 1.5mm or more, more preferably 2mm or more, more preferably 7.5mm or less, more preferably 5mm or less. The width L ₂ of the deformation suppression portion 8 also need not be identical necessarily all parts may be different in each unit should fall within the above range.

The distance _{L 3} between the inner periphery of the outer peripheral and the deformation suppressing portion 8 of the collecting portion 3 is preferably at least 0.05 mm, also less preferred 15 mm. By the distance L ₃ and above 0.05 mm, the formation of the dividing groove 6, the portion dividing grooves 6 are formed can prevent the deformation suppressing portion 8 overlaps the cutting blade such as a ceramic green sheet cutting machine The dividing groove 6 having a sufficient width can be formed by pressing. Thereby, melt | fusion of the division | segmentation groove | channel 6 at the time of subsequent baking can be suppressed, and the division | segmentation property to each unit substrate 2 can be improved. Further, by setting the distance L ₃ and 15mm or less, it can be a deformation suppressing portion 8 provided at a position closer to the collecting portion 3, to obtain a deformation suppressing effect of the deformation suppressing portion 8 effectively. Spacing _{L 3} is more preferably 0.1mm or more, more preferably 0.15mm or more, more preferably 10mm or less, more preferably 7.5mm or less. For the interval L _3, they need not be identical necessarily all parts may be different in each unit should fall within the above range.

  In addition, the thickness of the deformation suppressing portion 8 is preferably 5 μm or more, and preferably 30 μm or less. By setting the thickness of the deformation suppressing portion 8 to 5 μm or more, a deformation suppressing effect can be effectively obtained. Moreover, by setting it as 30 micrometers or less, the curvature of the connection board | substrate 1 at the time of baking by the deformation | transformation suppression part 8 can be suppressed, and the frequency | count of screen printing can be decreased and manufacturing cost and material cost can be suppressed. The thickness of the deformation suppressing portion 8 is more preferably 7 μm or more, and more preferably 25 μm or less.

  FIG. 5 is a plan view showing a second embodiment of the connection board 1. FIG. 6 is an enlarged view of a cross section taken along line XX of the connection substrate shown in FIG. This connection board | substrate 1 is divided | segmented by dicing, and has the structure fundamentally the same as the connection board | substrate 1 of 1st Embodiment except the division groove | channel 6 not being provided.

  In general, the connection substrate 1 is diced on the basis of a pair of opposing reference portions 5 provided in the frame portion 4. When the division is performed by dicing, if the deformation suppressing portion 8 is continuously formed on the extension line of the planned dividing line, the deformation suppressing portion 8 is harder than the other portions, so that the dicing blade is severely damaged. , Life is shortened accordingly. By providing the slit 81 on the extension line of the planned dividing line in the deformation suppressing unit 8, it is possible to suppress the dicing blade from coming into contact with the deformation suppressing unit 8 excluding the slit 81. Thereby, damage to the dicing blade can be suppressed, and an increase in manufacturing cost can be suppressed.

  Basically, it is preferable to provide the slits 81 in the connection substrate 1 at all the locations on the extension line of the planned division line. However, the slits 81 are provided at the locations of 10% or less of the total number of the locations. It may not be provided. Even if the slit 81 is not formed at such a position, the above-described damage to the dicing blade can be suppressed. Such a portion where the slit 81 is not provided is preferably 5% or less, more preferably 3% or less, and even more preferably 1% or less in terms of the number of the whole portion.

The length _{L 1} of the slit 81 in the connection substrate 1 is also not necessarily limited, particularly preferably at least 100 [mu] m, also 2000μm or less. In general, since the thickness of the dicing blade is about 100 μm, the length L ₁ of the slit 81 is set to 100 μm or more, so that the contact of the dicing blade to the deformation suppressing portion 8 excluding the slit 81 can be substantially suppressed. The life of the blade can be extended. From the viewpoint of sufficiently obtaining the original function of the deformation suppressing portion 8, the length L ₁ of the slit 81 is likely to suppress the contact of the dicing blade as the length L ₁ increases, and also to suppress the warpage of the connecting substrate 1 during firing. 2000 micrometers or less are preferable. The length L ₁ of the slit 81, consider the dicing blade thickness differences and during dicing the deviation or the like, more preferably more than 130 .mu.m, more preferably 150μm or more.

The width L ₂ of the deformation suppressing portion 8 is preferably the same as that having the dividing groove 6, preferably 1 mm or more, and more preferably 10 mm or less. The width L ₂ of the deformation suppression portion 8 by the above 1 mm, it is possible to obtain the deformation suppressing effect of the deformation suppressing portion 8 effectively. In addition, by setting the width of the deformation suppressing portion 8 to 10 mm or less, an increase in manufacturing cost or the like can be suppressed while effectively obtaining the deformation suppressing effect by the deformation suppressing portion 8. Width _{L 2} of the deformation suppression portion 8, more preferably 1.5mm or more, more preferably 2mm or more, more preferably 7.5mm or less, more preferably 5mm or less.

The distance _{L 3} between the inner periphery of the outer peripheral and the deformation suppressing portion 8 of the collecting portion 3, 0.05 mm is preferably also less preferred 15 mm. By the distance L ₃ and above 0.05 mm, can reduce the contact of the dicing blade into the deformation suppressing portion 8, it is possible to extend the life of the dicing blade. Further, by setting the distance L ₃ and 15mm or less, it can be a deformation suppressing portion 8 provided at a position closer to the collecting portion 3, to obtain a deformation suppressing effect of the deformation suppressing portion 8 effectively. Spacing _{L 3} is more preferably 0.1mm or more, more preferably 0.15mm or more, more preferably 10mm or less, more preferably 7.5mm or less.

  Further, the thickness of the deformation suppressing portion 8 is preferably 5 μm or more, and preferably 30 μm or less. By setting the thickness of the deformation suppressing portion 8 to 5 μm or more, a deformation suppressing effect can be effectively obtained. Moreover, by setting it as 30 micrometers or less, the curvature of the connection board | substrate 1 at the time of baking by the deformation | transformation suppression part 8 can be suppressed, and the frequency | count of screen printing can be decreased and manufacturing cost and material cost can be suppressed. The thickness of the deformation suppressing portion 8 is more preferably 7 μm or more, and more preferably 25 μm or less.

  The connection substrate 1 of each embodiment is mainly made of ceramics such as aluminum oxide, aluminum nitride, mullite, or glass ceramics, for example. Among these, glass ceramics that are excellent in durability and can be fired at a relatively low temperature are preferable. Glass ceramics are comprised from the sintered compact of the glass ceramic composition containing glass powder and ceramic powder. The raw material composition, sintering conditions, etc. of the glass ceramic composition are as described later.

Examples of the constituent material of the element connection terminals 22, the external connection terminals 23, the through conductors 24, and the like, and the deformation suppressing portion 8 include metal materials mainly composed of copper, silver, gold, and the like. A metal material made of platinum or silver and palladium is preferable. The conductor layer and the deformation suppressing portion 8 are formed by baking a paste containing a metal powder made of such a metal material. As the paste, a paste obtained by adding a vehicle such as ethyl cellulose to the metal powder and, if necessary, other additives, a solvent and the like can be used. The particle size (50% particle size (D ₅₀ )) of the metal powder is preferably 0.5 to 10 μm. In the present specification, the particle diameter means a value obtained by a particle diameter measuring apparatus using a laser diffraction / scattering method.

  As for content of the metal powder with respect to the whole solid content except a solvent, 80-90 mass% is preferable. Furthermore, examples of the additive include palladium and dirhodium trioxide. Both palladium and dirhodium trioxide act as silver sintering inhibitors. Dirhodium trioxide has the effect of delaying the firing shrinkage in a small amount, but if the amount added is increased, the adhesion strength with the substrate is reduced or the printability is inhibited, so the amount added must be suppressed. .

  Next, the manufacturing method of the connection board | substrate 1 is described. In the following description, members used for manufacturing will be described with the same reference numerals as those of the finished product.

(A) Green sheet manufacturing process First, a substantially flat substrate green sheet and frame green sheet are manufactured. In addition, substantially flat form means flat form on a visual level. Each green sheet is prepared by adding a binder and, if necessary, a plasticizer, a solvent, etc. to a glass ceramic composition containing glass powder and ceramic powder, and forming a slurry by a doctor blade method or the like. , Dried to produce.

  The glass powder is not necessarily limited, but preferably has a glass transition point represented by Tg of 550 to 700 ° C. When the glass transition point is lower than 550 ° C., degreasing described later may be difficult. On the other hand, when the glass transition point exceeds 700 ° C., the shrinkage start temperature becomes too high, and the dimensional accuracy may be lowered.

As the glass powder, for example, SiO ₂ is 57 to 65 mol%, B ₂ O ₃ is 13 to 18 mol%, CaO is 9 to 23 mol%, Al ₂ O ₃ is ₃ to 8 mol%, and K ₂ O and Na ₂ O are selected. What contains 0.5 to 6 mol% in total of at least one of these is preferable. By using a material having such a composition, it becomes easy to improve the flatness of the substrate surface.

Here, SiO ₂ becomes a glass network former. When the content of SiO ₂ is less than 57 mol%, it is difficult to obtain a stable glass and the chemical durability may be lowered. On the other hand, when the content of SiO ₂ exceeds 65 mol%, the glass melting temperature and the glass transition point may be excessively high. The content of SiO ₂ is preferably 58 mol% or more, more preferably 59 mol% or more, and particularly preferably 60 mol% or more. The content of SiO ₂ is preferably 64 mol% or less, more preferably 63 mol% or less.

B ₂ O ₃ is a glass network former. If the content of B ₂ O ₃ is less than 13 mol%, there is a possibility that the glass melting point or the glass transition point becomes excessively high. On the other hand, when the content of B ₂ O ₃ exceeds 18 mol%, it is difficult to obtain a stable glass and the chemical durability may be lowered. The content of B ₂ O ₃ is preferably 14 mol% or more, more preferably 15 mol% or more. Further, the content of B ₂ O ₃ is preferably 17 mol% or less, more preferably 16 mol% or less.

Al ₂ O ₃ is added to increase the stability, chemical durability, and strength of the glass. When the content of Al ₂ O ₃ is less than 3 mol%, the glass may become unstable. On the other hand, when the content of Al ₂ O ₃ exceeds 8 mol%, the glass melting temperature and the glass transition point may be excessively high. The content of Al ₂ O ₃ is preferably 4 mol% or more, more preferably 5 mol% or more. The content of Al ₂ O ₃ is preferably 7 mol% or less, more preferably 6 mol% or less.

  CaO is added to increase glass stability and crystal precipitation, and to lower the glass melting temperature and glass transition point. When the content of CaO is less than 9 mol%, the glass melting temperature may be excessively high. On the other hand, when the content of CaO exceeds 23 mol%, the glass may become unstable. The content of CaO is preferably 12 mol% or more, more preferably 13 mol% or more, and particularly preferably 14 mol% or more. The CaO content is preferably 22 mol% or less, more preferably 21 mol% or less, and particularly preferably 20 mol% or less.

K ₂ O and Na ₂ O are added to lower the glass transition point. When the total content of K ₂ O and Na ₂ O is less than 0.5 mol%, the glass melting temperature and the glass transition point may be excessively high. On the other hand, when the total content of K ₂ O and Na ₂ O exceeds 6 mol%, chemical durability, particularly acid resistance may be lowered, and electrical insulation may be lowered. The total content of K ₂ O and Na ₂ O is preferably 0.8 mol% or more and 5 mol% or less.

  Glass powder is not necessarily limited to what consists only of the said component, Other components can be contained in the range with which various characteristics, such as a glass transition point, are satisfy | filled. When other components are contained, the total content is preferably 10 mol% or less.

  The glass powder can be obtained by producing a glass having the above glass composition by a melting method and pulverizing it by a dry pulverization method or a wet pulverization method. In the case of the wet pulverization method, it is preferable to use water as a solvent. The pulverization is performed using a pulverizer such as a roll mill, a ball mill, or a jet mill.

The 50% particle size (D ₅₀ ) of the glass powder is preferably 0.5 to 2 μm. When the 50% particle size of the glass powder is less than 0.5 μm, the glass powder is likely to aggregate and not only becomes difficult to handle, but also difficult to disperse uniformly. On the other hand, when the 50% particle size of the glass powder exceeds 2 μm, the glass softening temperature may increase or the sintering may be insufficient. The particle size is adjusted by, for example, classification as necessary after pulverization.

As the ceramic powder, those conventionally used for the production of LTCC substrates can be used without particular limitation. For example, alumina powder, zirconia powder, or a mixture of alumina powder and zirconia powder is suitably used. The 50% particle size (D ₅₀ ) of the ceramic powder is preferably 0.5 to 4 μm.

  A glass ceramic composition is obtained by blending and mixing such ceramic powder and glass powder such that the glass powder is 30 to 50% by mass and the ceramic powder is 50 to 70% by mass, for example. Moreover, a slurry is obtained by adding a binder and, if necessary, a plasticizer, a dispersant, a solvent, and the like to the glass ceramic composition.

  As the binder, for example, polyvinyl butyral, acrylic resin and the like can be suitably used. As the plasticizer, for example, dibutyl phthalate, dioctyl phthalate, butyl benzyl phthalate and the like can be used. As the solvent, for example, aromatic organic solvents such as toluene and xylene, and alcohol organic solvents such as butanol can be used. Furthermore, a dispersing agent and a leveling agent can also be used.

  This slurry is formed into a sheet by a doctor blade method or the like and dried to produce a sheet material. A via hole or the like for interlayer connection is formed in a portion of the sheet material to be each unit substrate 2 by using a punching die or a punching machine to manufacture a substrate green sheet. Further, the center part of the part of each other sheet material that becomes the unit substrate 2 is cut out into a predetermined shape such as an ellipse, thereby producing a frame green sheet.

(B) Paste layer formation process The paste layer used as the conductor layer and the deformation | transformation suppression part 8 is formed in the part used as each unit board | substrate 2 of the green sheet | seat for substrates obtained at the (A) process. For example, a paste is applied to the element mounting surface 1 a side of the substrate green sheet to form a paste layer to be the element connection terminals 22. In addition, a paste is applied to the non-mounting surface 1b side to form a paste layer to be the external connection terminal 23. Further, a paste is filled in the via hole for interlayer connection to form the through conductor 24.

  The paste layer can be formed by applying and filling a paste by a screen printing method. The film thicknesses of the paste layers to be the element connection terminals 22 and the external connection terminals 23 are adjusted so that the film thicknesses of the element connection terminals 22 and the external connection terminals 23 to be finally obtained become the desired film thicknesses.

At this time, if necessary, a paste is applied to a predetermined position of the frame portion 4 on the element mounting surface 1a side and the non-mounting surface 1b side to form a paste layer that becomes the deformation suppressing portion 8. The paste layer that becomes the deformation suppressing unit 8 can also be formed by applying paste by a screen printing method. At this time, the slit 81 can be formed by providing a portion where the paste is not applied. The length L ₁ of the slit 81 can be adjusted by adjusting the length of the portion not coated with the paste. The application thickness of the paste is not necessarily limited, but it is preferable that the thickness of the deformation suppressing portion 8 after firing is 5 to 30 μm.

  As the paste, a paste made by adding a vehicle such as ethyl cellulose to a metal powder mainly composed of copper, silver, gold, or the like, and a solvent, an additive or the like as necessary is used. As the metal powder, a metal powder composed of silver, a metal powder composed of silver and platinum, or silver and palladium is preferable.

(C) Lamination process The green sheet for frames obtained in the (A) process is laminated on the element mounting surface 1a side of the green sheet for substrates having the paste layer obtained in the (B) process, and heated and pressurized. Integrate to form a laminate. In addition, a paste layer that becomes the deformation suppressing portion 8 is formed in advance on a predetermined position of the portion that becomes the frame portion 4 on the green body sheet as necessary. Further, the laminated body is provided with a notch-shaped reference portion 5 serving as a reference for division on an extension line of the planned division line.

  Next, if necessary, the division grooves 6 are formed by using a green sheet laminated body cutting machine or the like so as to overlap the planned division lines and the extension lines on the element mounting surface 1a and the non-mounting surface 1b of the multilayer body. At this time, by forming the dividing groove 6 using the reference portion 5 as a reference, it is possible to form the dividing groove 6 that overlaps the planned dividing line and its extension line. Further, the divided holes 7 are formed using a punching machine or the like. Thereby, the unfired connection board 1 is obtained. In addition, when manufacturing the connection board | substrate 1 divided | segmented by dicing, it is not necessary to form the division groove | channel 6, and only the reference | standard part 5 is formed.

(D) Firing step (C) After the step, the obtained unfired connecting substrate 1 is subjected to degreasing for decomposing and removing a binder such as a resin contained in the laminate as necessary, and then glass. In order to sinter the ceramic composition or the like, for example, the connection substrate 1 is obtained by firing at a temperature of 800 to 930 ° C.

  For example, the degreasing is preferably performed at a temperature of 400 to 600 ° C. or lower for 1 to 10 hours. When the degreasing temperature is less than 400 ° C. or the degreasing time is less than 1 hour, the binder or the like may not be sufficiently removed. On the other hand, if the degreasing temperature is about 600 ° C. and the degreasing time is about 10 hours, the binder and the like can be sufficiently removed.

  In the firing, the time is appropriately adjusted in a temperature range of 800 to 930 ° C. in consideration of obtaining a dense structure of the substrate and productivity. Specifically, holding for 20 to 90 minutes at a temperature of 850 to 900 ° C. is preferable, and holding for 20 to 90 minutes at a temperature of 860 to 880 ° C. or less is particularly preferable. If the firing temperature is less than 800 ° C., a substrate having a dense structure may not be obtained. On the other hand, if the firing temperature exceeds 930 ° C., the substrate may be deformed and productivity may be reduced. Moreover, when the metal paste containing the metal powder which has silver as a main component is used and a calcination temperature exceeds 880 degreeC, there exists a possibility that a metal paste may soften too much and it may become impossible to maintain a predetermined shape.

  After firing, if necessary, a conductive protective film such as gold plating can be formed so as to cover the entire element connection terminal 22 and external connection terminal 23. Moreover, a light emitting element such as an LED element may be mounted on the mounting portion of the unit substrate 2 in the state of the connection substrate 1. The connection board 1 obtained in this way can be divided by using the dividing groove 6 when the dividing substrate 6 is provided, and can be divided by dicing when the dividing substrate 6 is not provided. A plurality of unit substrates 2 can be obtained efficiently.

  Although the manufacturing method of the connection substrate 1 has been described above, the green sheet for the substrate and the green sheet for the frame body do not necessarily need to be made of one green sheet, and may be made of a laminate of a plurality of green sheets. . Further, the order of formation of the respective parts can be changed as appropriate within the limit that can be formed.

  Moreover, the connection board | substrate 1 does not necessarily need to manufacture the one connection board | substrate 1 independently, and may manufacture from the viewpoint of manufacturing the connection board | substrate 1 efficiently from the board | substrate sheet | seat with which the connection board | substrate 1 was connected two or more. . 7 to 9 show an embodiment of a substrate sheet. Here, the slit 81 in the deformation suppressing unit 8 is not shown. For example, the substrate sheet 10 is arranged by connecting a total of nine connecting substrates 1 in three columns vertically and three rows horizontally.

  In this case, as shown in FIG. 7, it is preferable to form the deformation suppressing portion 8 so as to surround the entire outer periphery of the collecting portion 3 from the viewpoint of effectively suppressing the deformation of the collecting portion 3 in the connection substrate 1. In addition, the deformation | transformation of the gathering part 3 in the connection board | substrate 1 becomes large at the edge | side where the gathering part 3 in the other connection board | substrate 1 is not adjacent, ie, the edge along the outer periphery of the board | substrate sheet | seat 10. For this reason, as shown in FIGS. 8 and 9, the deformation suppressing portion 8 may be formed only on the side along the outer periphery of the substrate sheet 10, which is likely to be deformed, among the sides of the assembly portion 3. In this case, as shown in FIG. 8, the deformation suppressing part 8 may be formed only in the part of the collective part 3, or as shown in FIG. The deformation suppression unit 8 may be formed. According to such a thing, the connection board | substrate 1 as each shown by FIG. 3, 4 is obtained.

Examples of the present invention will be described below.
The present invention is not limited to these examples.

First, an example of the connecting substrate 1 having the dividing grooves 6 will be described.
Here, Examples 1 to 7 are examples of the present invention, and Example 8 is a comparative example of the present invention.

[Example 1]
(Production of green sheets)
The raw materials were adjusted so that SiO ₂ was 60.4 mol%, B ₂ O ₃ was 15.6 mol%, Al ₂ O ₃ was 6 mol%, CaO was 15 mol%, K ₂ O was 1 mol%, and Na ₂ O was 2 mol%. After mixing and mixing, this raw material mixture was put in a platinum crucible and melted at 1600 ° C. for 60 minutes, and then the molten glass was poured out and cooled. This glass was pulverized with an alumina ball mill for 40 hours to produce a glass powder. Note that ethyl alcohol was used as a solvent for grinding.

  35% by mass of this glass powder, 40% by mass of alumina filler (manufactured by Showa Denko KK, trade name: AL-45H), and zirconia filler (manufactured by Daiichi Rare Element Chemical Industries, trade name: HSY-3F-J) A glass ceramic composition was prepared by blending and mixing at 25% by mass.

  50 g of this glass ceramic composition, 15 g of an organic solvent (toluene, xylene, 2-propanol, 2-butanol mixed at a mass ratio of 4: 2: 2: 1), plasticizer (di-2-ethylhexyl phthalate) 2.5 g of polyvinyl butyral (trade name: PVK # 3000K, manufactured by Denka) as a binder and 5 g of a dispersant (trade name: BYK180, manufactured by Big Chemie) were further blended and mixed to prepare a slurry. This slurry was applied onto a PET film by a doctor blade method and dried to obtain a green sheet for a substrate and a green sheet for a frame.

  On the other hand, conductive powder (manufactured by Daiken Chemical Industry Co., Ltd., trade name: S550) and ethyl cellulose as a vehicle are mixed at a mass ratio of 85:15 to α-terpineol as a solvent so that the solid content is 85% by mass. After the dispersion, the paste was kneaded in a porcelain mortar for 1 hour, and further dispersed three times with a three roll to produce a paste.

  Then, paste is applied or filled by screen printing to the portions of the aggregated portion 3 of the substrate green sheet that are to be the unit substrates 2 and that are to be the element connection terminals 22, the external connection terminals 23, and the through conductors 24. And a paste layer was formed.

  On the other hand, cavities that are openings were formed in portions of the aggregate 3 in the frame green sheet that would become the unit substrates 2. Further, a paste was applied to a portion to be the frame portion 4 on the element mounting surface 1a side and a portion to be the deformation suppressing portion 8 by a screen printing method, and a paste layer to be the deformation suppressing portion 8 was formed.

  Then, the green sheet for the substrate and the green sheet for the frame body were overlaid so that the portions to be the unit substrates 2 were coincident to form a laminate. Split grooves 6 were formed by a green sheet laminate cutting machine (G-cut 6 manufactured by UHT) so as to overlap the planned split lines and the extension lines on the element mounting surface 1a side and non-mounting surface 1b side of this laminate. After performing degreasing to hold | maintain at 550 degreeC with respect to this laminated body for 5 hours, the baking hold | maintained at 870 degreeC for 30 minutes was performed, and the connection board | substrate 1 was manufactured.

  Here, the connecting substrate 1 has a length of 60 mm × width of 60 mm × thickness of 1 mm, and has one aggregate portion 3 as shown in FIG. 1, and the frame portion 4 is enclosed so as to surround the entire outer periphery of the aggregate portion 3. It was supposed to have. Assume that the collective portion 3 is arranged by connecting 100 unit substrates 2 (10 rows and 10 columns) having a size of 5 mm × 5 mm. The unit substrate 2 has an overall thickness of 1 mm and a cavity depth of 0.5 mm. Moreover, the frame part 4 was made into width 5mm, the division | segmentation groove | channel 6 was made into 25 micrometers in width, and the sum total of the vertical depth was 600 micrometers.

Moreover, the deformation | transformation suppression part 8 was provided in the element mounting surface 1a so that the outer periphery of the gathering part 3 might be surrounded, and it formed so that the center part of the length direction of each slit 81 might be located on the extension line of a division | segmentation planned line. The length L ₁ of each slit 81 is 50 μm, the width L ₂ of the deformation suppressing portion 8 is 4.6 mm, the distance L ₃ between the outer periphery of the gathering portion 3 and the inner periphery of the deformation suppressing portion 8 is 0.3 mm, and the deformation suppressing portion. The thickness of 8 was 20 μm.

[Examples 2 to 7]
The length L ₁ of the slit 81 was changed as shown in Table 1 were prepared coupling the substrate 1 in the same manner as in Example 1.

[Example 8]
A connecting substrate 1 was manufactured in the same manner as in Example 1 except that the slit 81 was not formed.

  Next, the splitting property of the connection substrate 1 of Examples 1 to 8 was evaluated. The results are shown in Table 1. The evaluation was performed by examining whether or not the undivided dividing grooves 6 were generated when the connecting substrate 1 was all divided into unit substrates 2 at the position of the dividing grooves 6 by an automatic dividing machine. In the table, “◯” indicates that the undivided dividing groove 6 was not generated when dividing all the connecting substrates 1 into the unit substrates 2, and “×” indicates that the undivided dividing groove 6 was generated. Show.

  In general, when an undivided dividing groove 6 is generated, it cannot be flowed to the next process as it is, so that additional dividing work is required, and extra work time is required. In addition, because it is not a fixed form, it may not be possible to divide with an automatic divider. In this case, it may be folded by hand or divided using a dividing jig, but the quality will be degraded or unstable. The production costs are excessive.

Further, in FIG. 10, showing the relationship between the deformation amount of the length _{L 1} and the connection substrate 1 of the slit 81 ([mu] m) in the connection substrate 1 of Examples 1-8. The amount of deformation of the connection board 1 is such that the midpoints of the four sides of the connection board 1 after firing are outside of the straight lines connecting the corners of the four corners of the connection board 1 in the direction perpendicular to the straight lines. It was measured whether it was deformed. In addition, the deformation amount of the connection board | substrate 1 was made into the average value of the deformation amount of the midpoint of four sides mentioned above. Further, in FIG. 10, the amount of deformation of the connecting board 1 when the connection substrate 1 is not provided for any deformation suppressing portion 8, the length L ₁ of the slit 81 is shown in conjunction as a 5000 .mu.m.

As is evident from Table 1, the length L ₁ of the slit 81 by a 50 [mu] m, it can be better divided properties. Further, as apparent from FIG. 10, the effect of suppressing deformation of the connecting substrate 1 can be ensured by setting the length L ₁ of the slit 81 to 2000 μm or less.

  Next, an example of the connecting substrate 1 that is divided by dicing without the dividing groove 6 will be described. Here, Examples 10 to 13 are examples of the present invention, and Example 14 is a comparative example of the present invention.

[Examples 10 to 13]
Without forming the dividing grooves 6, and except that the length L ₁ of the slit 81 was changed as shown in Table 2 were prepared coupling the substrate 1 in the same manner as in Example 1.

[Example 14]
The connection substrate 1 was manufactured in the same manner as in Examples 10 to 13 except that the slit 81 was not formed.

  The splitting property of the connection substrate 1 of Examples 10 to 13 was evaluated. The results are shown in Table 2. The evaluation was performed by observing the degree of damage of the dicing blade when the connecting substrate 1 was all divided into unit substrates 2 with a dicing blade having a thickness of 100 μm. In the table, “◯” indicates the connection substrate 1 or the unit substrate 2 when the connection substrate 1 is cut under the same conditions as when a ceramic substrate having the same thickness without the deformation suppressing portion 8 provided as a reference is cut. This indicates that there were no problems such as breakage, burning, or damage to the dicing blade. “X” indicates that the above-mentioned problem occurred during cutting.

DESCRIPTION OF SYMBOLS 1 ... Connection board | substrate, 2 ... Unit board | substrate, 3 ... Collecting part, 4 ... Frame part, 5 ... Reference | standard part, 6 ... Dividing groove, 7 ... Dividing hole, 8 ... Deformation suppression part, 10 ... Substrate sheet | seat, 21 ... Frame 22 ... element connection terminal, 23 ... external connection terminal, 24 ... through conductor, L ₁ ... length of slit, L ₂ ... width of deformation suppressing part, L ₃ ... outer periphery of assembly part and inner periphery of deformation suppressing part Interval

Claims (7)

A rectangular assembly in which a plurality of unit substrates are connected;
A frame portion provided on the outer periphery of the assembly portion;
A ceramic connecting substrate, comprising: a deformation suppressing portion that is provided along at least one side of the outer periphery of the collective portion and has a slit on an extension line of the division line between the unit substrates.   The ceramic connecting substrate according to claim 1, wherein the slit has a length in a direction along the outer periphery of the aggregate portion of 50 to 2000 μm.   The ceramic connecting substrate according to claim 1, wherein the slit has a length in a direction along the outer peripheral portion of the aggregate portion of 100 to 2000 μm.   4. The ceramic connection substrate according to claim 1, wherein the aggregate portion includes 100 or more unit substrates. 5.   The ceramic connection substrate according to claim 1, wherein the deformation suppressing portion has a thickness of 5 to 30 μm.   The ceramic connection substrate according to claim 1, wherein the unit substrate is a light emitting element substrate.   The ceramic connection substrate according to claim 1, wherein the unit substrate is a glass ceramic substrate.

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