JP2012039028A - Wiring board and coupling substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wiring board which is marked so that formation points, or the like, on a coupling substrate can be discriminated easily in each wiring board produced by dividing the coupling substrate, and to provide the coupling substrate for producing the wiring board.SOLUTION: The wiring board 1 has a mounting part 22 for mounting an electronic component in at least one principal surface 21 of an insulator 2 composed of an inorganic insulating material, and wiring conductors 5, 6, 7 to be connected electrically with the electronic component formed on the surface of the wiring board 1 and in the wiring board 1, as required. Near the outer periphery of at least any one of the principal surface of the insulator or an internal surface parallel with the principal surface, a mark 4 is formed on the lateral face of the insulator such that a part thereof is exposed.

Description

  The present invention relates to a wiring board and a connection board.

  2. Description of the Related Art Conventionally, a wiring board for mounting electronic components such as a semiconductor element and a piezoelectric vibrator is made of, for example, an insulator made of a rectangular plate-like ceramic having a mounting portion on which an electronic component is mounted at the center of the upper surface. A plurality of wiring conductors led out from the upper surface to the lower surface are arranged. An electronic component is fixed to such an insulator mounting portion, and each electrode of the electronic component is electrically connected to the wiring conductor via a metal bump or a bonding wire, and then the electronic component is covered on the upper surface. An electronic device product is obtained by sealing a resin or lid for sealing and sealing an electronic component in an airtight manner. Here, the insulator means an insulating substrate constituting a part of the wiring substrate.

  In addition, the wiring board is a so-called multi-cavity wiring board in which a large number of small wiring boards are obtained simultaneously from a single large-area mother board in order to facilitate handling and increase manufacturing efficiency. Production is common. Hereinafter, the multi-piece wiring board is simply referred to as a connection board.

  In such a connection board, manufacturing variations and defects may occur at a specific position of the mother board. For the purpose of specifying the position for quality control, etc., each wiring board is also a mother board after division. Different marks are given to all of the individual wiring boards arranged on one mother board so that the position on the board can be identified.

  This mark is conventionally formed on the electronic component mounting surface or back surface of the wiring board and can be visually confirmed from the outside. On the other hand, with the miniaturization of the wiring board, the wiring conductors such as the connection terminals connected to the electronic parts and the electrode pads connected to the wiring conductors of the external electric circuit board are mounted on the mounting surface of the electronic parts on the wiring board and It is formed over a wide area on the back surface. For this reason, the problem which cannot secure the area | region which forms a mark in these surfaces has arisen.

  Therefore, in Patent Document 1, a mark is formed inside the insulator so as not to overlap with the wiring conductor in a plan view, so that the wiring conductor formed on the front and back surfaces can be formed even on a small wiring board. A mark can be formed at a position close to each other in plan view. However, since the mark is formed inside, it takes time and effort to perform identification by the X-ray transmission method or the like.

JP 2005-19749 A

  The present invention has been made in order to solve the above-mentioned problems, and in each wiring board divided and manufactured from the connection board, the wiring board marked so as to be able to easily discriminate the formation location on the connection board. And it aims at provision of the connection board | substrate for manufacturing this wiring board.

  The wiring board of the present invention has a mounting portion on which an electronic component is mounted on at least one main surface of an insulator made of an inorganic insulating material, and is electrically connected to the electronic component on the surface and, if necessary, inside. A wiring board on which a part of the insulator is exposed on a side surface of the insulator in the vicinity of the outer periphery of at least one of the main surface of the insulator and an inner surface parallel to the main surface. It has a formed mark.

  In the wiring board of the present invention, the mark may be formed of the same material as the wiring conductor so as not to connect the wiring conductors serving as counter electrodes to at least one of the surfaces on which the wiring conductor is formed. preferable. Further, one or more marks are formed in the vicinity of the outer periphery of the inner surface parallel to the main surface of the insulator in substantially the same shape (meaning the same shape at the visual level, the same shall apply hereinafter), and the mark exposed on the side surface Preferably, the mark exposed on the side surface is in the range of 50 to 1000 μm in width, in the range of 5 to 50 μm in thickness, and has a plurality of marks on one side. In this case, the distance between adjacent mark ends is preferably at least 50 μm.

  In the wiring board according to the present invention, the main surface of the insulator has a substantially rectangular shape (meaning a rectangular shape on the visual level, the same applies hereinafter), and two opposing sides of the inner surface parallel to the main surface of the insulator. It is preferable to have a configuration in which two-sided wiring conductors facing inside are formed so that the mark reaches one of the two sides.

  In the wiring board of the present invention, it is preferable that a light emitting element is mounted as an electronic component, and the insulator is a substrate made of a sintered body of a glass ceramic composition containing glass powder and a ceramic filler (LTCC substrate). Is preferred.

  The present invention is also a connection board in which a plurality of wiring board regions are arranged vertically and horizontally on a mother board, and the wiring board region includes the wiring board of the present invention (provided that one of the wiring boards is There is provided a connecting board characterized in that the connecting board is configured by a wiring board region that may be a wiring board that does not have the mark.

  In the connection board of the present invention, the plurality of wiring board regions have a plurality of predetermined positions at which the marks having substantially the same shape can be formed, and the mark at the predetermined position is provided for each of the plurality of wiring board regions. It is preferable that the combination of presence / absence is different so that the position of each wiring board region on the connection board can be recognized.

  In the connection substrate of the present invention, the mark is formed in both regions having the boundary line as a boundary across the boundary line between the adjacent wiring substrate region or the mother substrate of the wiring substrate region. It is preferable.

  In the connection board according to the present invention, the plurality of wiring board regions include two-pole wiring conductors facing the inner sides of the two opposite sides, and electrodes indicating the positions of the two poles at a predetermined position visible from the outside. A mode in which the mark is formed across the boundary line between adjacent wiring board regions or both the wiring board region and the mother board with one of the two sides as a boundary line; It is preferable to do.

  According to the present invention, in each wiring board that is divided and manufactured from a connection board, a formation location or the like on the connection board can be easily determined by a visually observable mark that exists on the side surface. Moreover, if the connection board | substrate of this invention is used, the mark which can be visually discriminate | determined on a side surface can be reliably provided with a simple method in each wiring board divided and manufactured.

It is the top view which shows an example of embodiment of the wiring board of this invention, sectional drawing, and a left-right side view. It is the top view and sectional drawing which show an example of the light-emitting device manufactured using the wiring board shown in FIG. It is a top view which shows an example of embodiment of the connection board | substrate of this invention. It is a top view which shows each wiring board manufactured from the connection board | substrate shown in FIG. It is a top view which shows the board | substrate for main bodies in which the wiring conductor and mark which comprise the connection board | substrate shown in FIG. 3 were formed. It is a top view which shows the board | substrate for frame bodies in which the frame which comprises the connection board | substrate shown in FIG. 3 was formed.

  Embodiments of the present invention will be described below with reference to the drawings. In addition, this invention is limited to the following description and is not interpreted.

<Wiring board>
The wiring board of the present invention has a mounting portion on which an electronic component is mounted on at least one main surface of an insulator made of an inorganic insulating material, and is electrically connected to the electronic component on the surface and, if necessary, inside. A wiring board on which a part of the insulator is exposed on a side surface of the insulator in the vicinity of the outer periphery of at least one of the main surface of the insulator and an inner surface parallel to the main surface. It has a formed mark.

  Here, in the present specification, the “wiring conductor” of the wiring board is an electric wiring provided so as to be electrically connected from the electrode of the electronic component to be mounted to an external circuit through the electrode. All conductors related to, for example, element connection terminals connected to electrodes of electronic components, inner layer wiring provided in the substrate (including through conductors penetrating through the substrate), external connection terminals connected to external circuits, etc. Used as a generic term.

  According to the present invention, when the mark is exposed on the side surface of the wiring board, for example, after the electronic component is mounted to make a product, the mark can be easily recognized visually, and the wiring board is divided and manufactured from the connection board. It is possible to easily identify the formation location on the connection substrate.

  Further, the inorganic insulating material constituting the insulator specifically includes an aluminum oxide sintered body (alumina ceramic), an aluminum nitride sintered body, a mullite sintered body, glass powder and a ceramic filler. Examples thereof include a sintered body of a glass ceramic composition (Low Temperature Co-fired Ceramics, hereinafter referred to as LTCC). Among these, in the present invention, LTCC is preferable from the viewpoint of ease of production, easy processability, economy, and the like.

  Specific examples of electronic components mounted on the wiring board of the present invention include various semiconductor elements and piezoelectric vibrators without any particular limitation. However, since the mark can be formed so as not to affect the light emission characteristics, In the invention, a light emitting element such as a light emitting diode is preferably mounted.

  As an example of an embodiment of the wiring board according to the present invention, a wiring board in which an insulator is constituted by a base body and a frame body made of LTCC and a light emitting element is mounted as an electronic component will be described below.

  FIG. 1 is a plan view (a) showing an example of an embodiment of a wiring board of the present invention, a cross-sectional view taken along line XX in the plan view (a), and a left side (L) side in the plan view (a). It is the side view (d) seen from the right side (R) side in the side view (c) and plan view (a).

  The wiring board 1 has a substantially flat base 2 as a main configuration. The base 2 is made of a sintered body of a glass ceramic composition containing glass powder and a ceramic filler, and one main surface is a mounting surface 21 on which a light emitting element is mounted. In this example, the mounting surface 21 has a substantially square shape (meaning square at the visual level, the same applies hereinafter), and this substantially central portion (meaning the central portion at the visual level, the same applies hereinafter) is mounted on which the light emitting element is actually mounted. Part 22 is provided. The other main surface is a non-mounting surface 23 on which no light emitting element is mounted. The base body 2 preferably has a bending strength of, for example, 250 MPa or more from the viewpoint of suppressing damage or the like when the light emitting element is mounted and thereafter used. The thickness, size, etc. of the substrate 2 are not particularly limited, and can be the same as that of a normal light emitting element wiring substrate. The raw material composition, sintering conditions, and the like of the sintered body of the glass ceramic composition including the glass powder and the ceramic filler constituting the substrate 2 are as described later.

  The wiring board 1 has a frame 3 on the peripheral portion of the mounting surface 21 so as to form a cavity having a circular portion at the center of the mounting surface 21 of the base 2 as a bottom surface (hereinafter referred to as “cavity bottom surface”). The material constituting the frame 3 is not particularly limited as long as it is an insulating material, but the same material as that constituting the base 2 is preferable.

  On the mounting surface 21, a pair of two-pole element connection terminals 5 electrically connected to the light emitting elements are provided at the two opposite sides of the mounting surface 21, the approximate center of the left side L and the right side R (meaning the center on the visual level, And so on) on the line connecting the same). The non-mounting surface 23 is provided with a pair of external electrode terminals 6 that are electrically connected to an external circuit. Further, a pair of through conductors 7 for electrically connecting the element connection terminals 5 and the external electrode terminals 6 are provided inside the base 2.

  Here, the external connection terminal 6 and the through conductor 7 are disposed as long as they are electrically connected to the light emitting element → the element connection terminal 5 → the through conductor 7 → the external connection terminal 6 → the external circuit. The position, shape, and size are not limited to those shown in FIG. 1, and can be adjusted as appropriate. Further, the element connection terminal 5 can also be appropriately adjusted in shape and size as long as it is disposed at the position on the mounting surface and the electrical connection is ensured.

  The constituent material of the element connection terminal 5, the external connection terminal 6, and the through conductor 7, that is, the wiring conductor is not particularly limited as long as it is the same constituent material as that of the wiring conductor used for the wiring board for the light emitting element. Specific examples of the constituent material of these wiring conductors include metal materials mainly composed of copper, silver, gold, and the like. Among such metal materials, a metal material composed of silver, silver and platinum, or silver and palladium is preferable.

  The element connection terminal 5 and the external connection terminal 6 are protected from oxidation or sulfuration on a conductor layer made of these metal materials, preferably 5 to 50 μm thick, more preferably 10 to 20 μm thick. And the structure in which the protective layer which has electroconductivity was formed is preferable. The protective layer is not particularly limited as long as it is made of a conductive material having a function of protecting the conductor layer. However, a gold plating layer is preferable, and a nickel / gold plating layer structure in which gold plating is performed on nickel plating is more preferable. preferable. The thickness of the protective layer is preferably 3 to 20 μm for the nickel plating layer and 0.1 to 1.0 μm for the gold plating layer.

  On the mounting surface 21 of the base 2, there are one mark (mark 41) on the left side L side and two places (marks 42 and 43) on the right side R side. , Provided. The mark 41 on the left side L side is formed so that one of its short sides overlaps with the left side L and is located approximately ¼ from the upper side. Further, the mark 42 and the mark 43 on the right side R side are formed so that one of the short sides thereof overlaps with the right side R and is located at approximately 1/4 and approximately 2/4 from the upper side, respectively.

  The constituent material constituting the mark is not particularly limited as long as it is a material that can recognize the presence or absence, preferably the shape on the side surface even after the wiring board manufacturing process, and can withstand exposure. Since the marks 41 to 43 are formed on the mounting surface 21 of the same base 2 as the pair of element connection terminals 5 are formed, the marks 41 to 43 and the material constituting the element connection terminals 5 are the same. It is preferable to use materials and to form them simultaneously by screen printing or the like because the manufacturing time and cost can be reduced. However, in this case, considering that the mark has a portion exposed on the side surface of the wiring board, a metal material made of silver and palladium that can suppress the occurrence of silver migration is preferable.

  The size of the marks 41 to 43 is not particularly limited as long as the portion exposed to the side surface can be visually confirmed and the size can be formed so as to be surely exposed to the side surface when the wiring board is manufactured. . In addition, the shape of the marks 41 to 43 is not limited to the substantially rectangular shape as long as the mark is reliably exposed on the side surface with a certain width and film thickness.

The preferable size of the marks 41 to 43 is that when the mark is substantially rectangular, it can be visually recognized, the ease of manufacturing, the number of marks that can be formed on one side, the economy, etc. The short side (width: indicated by “W” in FIG. 1) is preferably in the range of 50 to 1000 μm, and more preferably in the range of 200 to 400 μm.
In addition, the long side of the substantially rectangular shape (length: indicated by “Y” in FIG. 1) is in the range of 100 to 2000 μm in consideration of the ease of manufacturing, the influence on the economical wiring conductor, and the like. Is preferred,
More preferably, it is in the range of 400 to 800 μm. In addition, the width W of the marks 41 to 43 may exceed the length Y as necessary.

  The film thickness of the marks 41 to 43 (indicated by “T” in FIG. 1B) is preferably in the range of 5 to 50 μm, and more preferably in the range of 10 to 20 μm. As described above, when the marks 41 to 43 are simultaneously formed of the same material as the element connection terminals 5, the film thickness is preferably 5 to 50 μm, more preferably 10 to 20 μm, as described above. Further, when a plurality of marks are provided on one side surface, the distance between adjacent mark ends (indicated by “S” in FIG. 1) is preferably 50 μm or more, and 200 μm or more. It is more preferable.

  In addition, even if the shape of the marks 41 to 43 is any case other than the substantially rectangular shape described above, the size exposed on the side surface, that is, the size that is exposed to the side surface, in view of ease of manufacturing, etc. The width indicated by “W” in FIG. 1 and the film thickness indicated by “T” in FIG. 1B are preferably the same as described above.

  In general, in the case where an electronic component such as a light-emitting diode that requires distinction between an anode and a cathode is mounted on a wiring conductor, an electrode that can distinguish the position of the anode and the cathode at a visible position on the wiring board. Has a mark. The wiring board 1 of this example has an electrode mark 8 on the upper left of the frame 3 in the plan view of FIG.

  The mounting direction of the light emitting diode mounted on the wiring board is determined by the position of the electrode mark 8, and the right and left sides of the side surface when the mark is applied are distinguished.

  FIG. 1 (a) shows a side view seen from the left side L side of the wiring board, and FIG. 1 (d) shows a side view seen from the right side R side. On the left side L side, the mark 41 is exposed at a position of approximately ¼ (meaning ¼ on the visual level, the same applies hereinafter) from the upper side. On the right side R side, the mark 42 is exposed at a position that is approximately 1/4 from the upper side, and the mark 43 is exposed at a position that is approximately 2/4 (meaning 2/4 on the visual level, the same applies hereinafter). Thus, the wiring board is identified by the positions of the marks appearing on the left and right side surfaces.

As described above, for each purpose of identifying the position of each wiring board in the connection board after being divided into the individual wiring boards from the connection board in which the areas of the plurality of wiring boards are arranged on the mother board. Different marks are required on the wiring board. In this case, if the wiring board as shown in FIG. 1 is used and the mark 4 is provided at three predetermined positions on the left side L side and the right side R side, the presence or absence of the mark at that position is determined. in, eight on the left side L side is 2 ^3, with eight of the right side R side is 2 ^3, considered is Tsukekata mark 64 kinds of 8 × 8, it is identified in 64 of the wiring board.

The 64 include a wiring board having no mark on either the left side L side or the right side R side or a wiring board having no mark on both sides, but the left side L side and the right side R side. In order to confirm that the mark is securely formed, the mark appears at least at one place on both sides within the range allowed by the number of wiring boards to be identified, and the left side L side has seven ways (2 ³ -1). It is preferable that the right side R side has seven ways of (2 ³ -1) and marks are attached so that 49 wiring boards can be identified.

Depending on the size of the individual wiring board, for example, if the number of positions on the left side and the right side in the above example can be increased within an identifiable range, the number of positions where the mark on one side can be formed is increased. Even if the number of n is 2 ⁿ × 2 ⁿ at the maximum and there is no mark on one side, (2 ⁿ −1) × (2 ⁿ −1) wiring boards Can be identified.

  In the wiring board of the present invention, for example, when the wiring conductor pattern is divided into right and left on the insulator by the wiring conductor on the anode side and the wiring conductor on the cathode side and reaches at least one of the left side and the right side. Alternatively, a plurality of marks may be connected to the anode-side wiring conductor and formed on the left side surface, or a plurality of marks may be connected to the cathode side wiring conductor and formed on the right side surface. Even when a plurality of marks are arranged without leaving a distance between the marks, short-circuiting of the wiring conductor can be easily avoided as long as they are arranged so as to be connected to the same polarity.

  Further, although it depends on the pattern of the wiring conductor to be formed on the same surface as the mark, the side other than the two left and right sides is used without short-circuiting the wiring conductor, that is, the mark is exposed to the side surface at three sides and four sides. If it can form in this way, the number of the wiring boards which can be identified will increase more.

  Furthermore, if a mark is formed on the same surface as the wiring conductor, if there is a risk of short-circuiting or delamination between insulators due to the wiring conductor pattern, the mark is formed on a layer without the wiring conductor. May be. In this case, the four sides can be used freely as mark application positions, and the number of identifiable wiring boards can be increased as necessary. In this case, if the number of marks that can be applied to one wiring board increases and the number of wiring boards to be identified is small, the number of marks can be identified only by the total number of marks. Further, if each side can be identified by a mark such as the electrode mark 8, a plurality of wiring boards can be identified by a combination of the side where the mark is provided and the number of marks on the side.

  In the wiring board shown in FIG. 1, for example, if the frame 3 is not included, the marks 41 to 43 can be sufficiently confirmed not only from the side but also from above. When the electronic component to be mounted is a light emitting element as shown in this example, it is not preferable in terms of optical characteristics that such a mark is displayed on the light emitting element mounting surface. However, depending on the electronic component to be mounted and the application, the above frame may be used. As a configuration without the body 3, in addition to the side surface, a method of identifying the mark by visual observation on a plane from above may be used. In this case, if necessary, if the shape of the mark is the same on the side surface and the planar shape is different, a plurality of wiring boards can be identified by a combination of the position and number on the side surface and the planar shape.

  Here, as a sintered body of the glass ceramic composition containing the glass powder and the ceramic filler constituting the substrate 2 and the frame 3, for example, a binder is necessary for the glass ceramic composition containing the glass powder and the ceramic filler. According to the above, a slurry is prepared by adding a plasticizer, a dispersant, a solvent, etc., and this is formed into a sheet of a predetermined shape by a doctor blade method or the like, dried, and degreased as necessary, at 800 ° C. A sintered body obtained by firing at 930 ° C. or lower is used.

  The glass powder is not necessarily limited, but a glass transition point (Tg) of 550 ° C. or higher and 700 ° C. or lower is preferable. When the glass transition point (Tg) is less than 550 ° C., degreasing may be difficult. When the glass transition point (Tg) exceeds 700 ° C., the shrinkage start temperature becomes high and the dimensional accuracy may be lowered.

  Moreover, it is preferable that a crystal | crystallization precipitates when it bakes at 800 degreeC or more and 930 degrees C or less. If crystals do not precipitate, sufficient mechanical strength may not be obtained. Furthermore, the thing whose crystallization peak temperature (Tc) measured by DTA (differential thermal analysis) is 880 degrees C or less is preferable. When the crystallization peak temperature (Tc) exceeds 880 ° C., the dimensional accuracy may be lowered.

As such glass powder, for example, SiO ₂ is 57 mol% or more and 65 mol% or less, B ₂ O ₃ is 13 mol% or more and 18 mol% or less, CaO is 9 mol% or more and 23 mol% or less, and Al ₂ O ₃ is 3 mol% or more and 8 mol% or less. hereinafter, those containing less 0.5 mol% or more 6 mol% of at least one in total selected from _{K 2} O and Na ₂ O are preferred. By using such a thing, it becomes easy to improve the flatness of the main body substrate surface.

Here, SiO ₂ becomes a glass network former. When the content of SiO ₂ is less than 57 mol%, it is difficult to obtain a stable glass and the chemical durability may be lowered. On the other hand, when the content of SiO ₂ exceeds 65 mol%, the glass melting temperature and the glass transition point (Tg) may be excessively high. The content of SiO ₂ is preferably 58 mol% or more, more preferably 59 mol% or more, and particularly preferably 60 mol% or more. The content of SiO ₂ is preferably 64 mol% or less, more preferably 63 mol% or less.

B ₂ O ₃ is a glass network former. If the content of B ₂ O ₃ is less than 13 mol%, there is a possibility that the glass melting temperature or the glass transition point (Tg) becomes too high. On the other hand, when the content of B ₂ O ₃ exceeds 18 mol%, it is difficult to obtain a stable glass and the chemical durability may be lowered. The content of B ₂ O ₃ is preferably 14 mol% or more, more preferably 15 mol% or more. Further, the content of B ₂ O ₃ is preferably 17 mol% or less, more preferably 16 mol% or less.

Al ₂ O ₃ is added to increase the stability, chemical durability, and strength of the glass. When the content of Al ₂ O ₃ is less than 3 mol%, the glass may become unstable. On the other hand, when the content of Al ₂ O ₃ exceeds 8 mol%, the glass melting temperature and the glass transition point (Tg) may be excessively high. The content of Al ₂ O ₃ is preferably 4 mol% or more, more preferably 5 mol% or more. The content of Al ₂ O ₃ is preferably 7 mol% or less, more preferably 6 mol% or less.

  CaO is added to increase glass stability and crystal precipitation, and to lower the glass melting temperature and the glass transition point (Tg). When the content of CaO is less than 9 mol%, the glass melting temperature may be excessively high. On the other hand, when the content of CaO exceeds 23 mol%, the glass may become unstable. The content of CaO is preferably 12 mol% or more, more preferably 13 mol% or more, and particularly preferably 14 mol% or more. The CaO content is preferably 22 mol% or less, more preferably 21 mol% or less, and particularly preferably 20 mol% or less.

K ₂ O and Na ₂ O are added to lower the glass transition point (Tg). When the total content of K ₂ O and Na ₂ O is less than 0.5 mol%, the glass melting temperature and the glass transition point (Tg) may be excessively high. On the other hand, when the total content of K ₂ O and Na ₂ O exceeds 6 mol%, chemical durability, particularly acid resistance may be lowered, and electrical insulation may be lowered. The total content of K ₂ O and Na ₂ O is preferably 0.8 mol% or more and 5 mol% or less.

  In addition, glass powder is not necessarily limited to what consists only of the said component, Other components can be contained in the range with which various characteristics, such as a glass transition point (Tg), are satisfy | filled. When other components are contained, the total content is preferably 10 mol% or less.

  The glass powder is obtained by producing glass from the glass composition as described above by a melting method and pulverizing by a dry pulverization method or a wet pulverization method. In the case of the wet pulverization method, it is preferable to use water as a solvent. The pulverization is performed using a pulverizer such as a roll mill, a ball mill, or a jet mill.

The 50% particle size (D ₅₀ ) of the glass powder is preferably from 0.5 μm to 2 μm. When the 50% particle size of the glass powder is less than 0.5 μm, the glass powder is likely to aggregate, making it difficult to handle and uniformly dispersing. On the other hand, when the 50% particle size of the glass powder exceeds 2 μm, the glass softening temperature may increase or the sintering may be insufficient. The particle size is adjusted by, for example, classification as necessary after pulverization. In addition, in this specification, a particle size means the value obtained with the particle diameter measuring apparatus by a laser diffraction scattering method.

On the other hand, as the ceramic filler, those conventionally used for the production of LTCC substrates can be used without particular limitation. For example, alumina powder, zirconia powder, or a mixture of alumina powder and zirconia powder is suitably used. The 50% particle size (D ₅₀ ) of the ceramic filler is preferably 0.5 μm or more and 4 μm or less, for example.

  A glass ceramic composition is prepared by blending and mixing such glass powder and ceramic filler such that the glass powder is 30 mass% to 50 mass% and the ceramic filler is 50 mass% to 70 mass%, for example. obtain. Moreover, a slurry is obtained by adding a binder and, if necessary, a plasticizer, a dispersant, a solvent, and the like to the glass ceramic composition.

  As the binder, for example, polyvinyl butyral or acrylic resin is preferably used. As the plasticizer, for example, dibutyl phthalate, dioctyl phthalate, butyl benzyl phthalate, or the like is used. Moreover, organic solvents, such as toluene, xylene, 2-propanol, 2-butanol, are used suitably as a solvent.

  Although not shown in FIG. 1, when the wiring board 1 of this example is used for mounting a light emitting element, a thermal via is embedded in the substrate 2 or parallel to the mounting surface 21 in order to reduce thermal resistance. A heat dissipation layer may be provided. The thermal via is, for example, a columnar one smaller than the mounting portion 22, and a plurality of thermal vias are provided immediately below the mounting portion 22. When providing the thermal via, it is preferable to provide the thermal via from the non-mounting surface 23 to the vicinity of the mounting surface 21 so as not to reach the mounting surface 21. By adopting such an arrangement, the flatness of the mounting surface 21, particularly the mounting portion 22, can be improved, the thermal resistance can be reduced, and the inclination when the light emitting element is mounted can be suppressed.

  Although not shown in FIG. 1, in order to increase the light extraction efficiency of light from the mounted light emitting element, silver, for example, is used as a main component in the widest possible area of the cavity bottom surface of the mounting surface 21. The reflective film to be formed may be formed so as not to be electrically connected to the pair of element connection terminals 5, and an overcoat glass layer covering the whole including the edge of the reflective film may be formed thereon.

  In this case, it is preferable to provide an overcoat glass layer having a surface roughness Ra of 0.4 μm or less. Since the surface roughness Ra of a general LTCC substrate is about 1.0 μm, the flatness can be further improved by providing such an overcoat glass layer on the mounting portion 22. The surface roughness Ra is the arithmetic average roughness Ra, and the value of the arithmetic average roughness Ra is represented by 3 “Definition and display of defined arithmetic average roughness” of JIS: B0601 (1994). Is done.

  As mentioned above, about embodiment of the wiring board of this invention, it is an example of the board | substrate for light emitting element mounting, As a ceramic sintered compact which comprises the said base | substrate 2 and the frame 3, As for the glass ceramic composition containing glass powder and a ceramic filler, The case where the sintered compact (LTCC) was used was demonstrated.

  Here, as the ceramic sintered body constituting the substrate 2 and the frame 3, as described above, an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, or the like may be used. When using these ceramic sintered bodies containing aluminum as a main component, add binder, plasticizer, dispersant, solvent, etc. as necessary to the raw material composition of the ceramic sintered body to be used, as with LTCC. To prepare a slurry, which is formed into a sheet of a predetermined shape by a doctor blade method or the like, dried, degreased as necessary, and a firing temperature suitable for the ceramic sintered body to be used, for example, aluminum oxide A sintered body obtained by firing at 1400 to 1700 ° C. in the sintered body and 1700 to 1950 ° C. in the aluminum nitride sintered body is used.

In addition, as a raw material of the ceramic sintered body containing the above aluminum as a main component, for example, a compound such as aluminum oxide, aluminum hydroxide, aluminum halide, aluminum sulfate, aluminum nitrate, aluminum sulfide, aluminum nitride, feldspar ( NaAlSi ₃ O ₈ ), alum (KAl ₃ (OH) ₆ (SO ₄ ) ₂ ), boehmite (AlO (OH)), corundum (Al ₂ O ₃ ), kaolinite (Al ₂ Si ₂ O ₅ (OH) ₄ ), Mullite (Al ₆ Si ₂ O ₁₃ ), sericite (KAl ₂ (AlSi ₃ O ₁₀ ) (OH) ₂ ), and other minerals containing the compound, or a synthetic material using the compound as a raw material.

  The binder, optional component plasticizer, dispersant, solvent and the like for preparing the slurry can be the same as those of the LTCC. In addition, also in the manufacturing process of a ceramic sintered compact, it can carry out similarly to the said LTCC except the said baking conditions.

  As mentioned above, although the embodiment of the wiring board of the present invention has been described by taking an example of the light emitting element mounting board, the wiring board of the present invention is not limited to this. As long as it is not contrary to the gist of the present invention, the configuration can be changed as needed.

  For example, as shown in FIG. 2, the wiring board 1 obtained as described above has the light emitting device 11 mounted on the mounting portion 22 of the wiring board 1 in a predetermined direction indicated by the electrode mark 8. Used as The light emitting element 11 is fixed to the mounting portion 22 by a die bond agent (not shown) such as a silicone die bond agent, and a pair of electrodes (anode, cathode) not shown is connected to a pair of element connection terminals via bonding wires 12. 5 is electrically connected to each. The light emitting device 10 is provided with a sealing layer 13 so as to cover the light emitting element 11 and the bonding wire 12 and fill the cavity.

  In such a wiring board 1 of the present invention, even after the light emitting element is mounted as an electronic component and various members are combined to form the light emitting device 10, the marks 41 to 43 exposed on the side surfaces can be easily visually observed. For example, when this wiring board is divided from the connection board, the formation location on the connection board can be easily identified.

<Connecting board>
The wiring board of the present invention can be obtained, for example, by dividing the connection board of the present invention described below by a normal method.

  The connection board of the present invention is a connection board in which a plurality of wiring board regions are arranged vertically and horizontally on a mother board, and the wiring board region includes the wiring board of the present invention (however, one of the wiring boards). The wiring board may be a wiring board that does not have the mark). In the connection board of the present invention, by utilizing the feature of the mark of the wiring board of the present invention, the connection board can be obtained by changing the combination of the shape, position, number, etc. of the marks of each wiring board region. The position of the area of each wiring board can be identified. The connection board of the present invention may have only one area of the wiring board that can be identified by having no mark, if necessary.

  In the connection board of the present invention, the plurality of wiring board regions have a plurality of predetermined positions at which the marks having substantially the same shape can be formed, and the mark at the predetermined position is provided for each of the plurality of wiring board regions. It is preferable that the position of each wiring board region in the connection board can be recognized by the combination of presence / absence being different.

  As an example of the embodiment of the connection board of the present invention, a connection board for manufacturing a wiring board 1 on which an LTCC substrate is used as the insulator shown in FIG. 1 and a light emitting element is mounted as an electronic component will be described below.

  FIG. 3 is a plan view showing an example of the embodiment of the connection board of the present invention. FIG. 4 is a plan view showing individual wiring boards manufactured from the connection board shown in FIG.

  As shown in FIG. 3, in the connection substrate 50, three columns (a column, b column, c column) are vertically arranged in the center portion of the mother substrate 51, and three rows (A row, B row, C row) are arranged horizontally. Wiring board regions 52 are arranged adjacent to each other to be a total of nine wiring boards 1. A mother board surplus portion 53 exists so as to surround the outside of the area 52 of the nine wiring boards. Dividing grooves 54 are formed on the boundary line between the nine adjacent wiring board regions 52 and the boundary line between the mother board surplus portion 53 and the wiring board region 52 from above (front) side and below (back) of the connection substrate 50. ) Side is provided from two directions, and is divided by finally applying stress to the dividing grooves 54 to form nine wiring boards. Further, in order to prevent the occurrence of defects such as chipping in this division, the division that penetrates from the upper (front) side to the lower (back) side of the connection board 50 so as to cut out the four corners of the region 52 of each wiring board. A total of 16 holes 55 are formed.

  FIG. 4 is a plan view individually showing nine wiring boards manufactured from the connection board 50 shown in FIG. In FIG. 4, each of the nine wiring boards is distinguished by combining the rows and columns in which the areas of the wiring boards of the connection board shown in FIG. 3 are located, with abbreviations Aa to Cc. Yes. Similarly, for the area of the wiring board shown in FIG. 3, for example, the area of the wiring board located in the A row and the a column is shown as an area Aa of the wiring board.

  The wiring board 1 shown in FIG. 1 is a wiring board indicated by Ab in FIG. 4 obtained from the region of the wiring board located in row A and column b of the connection board shown in FIG.

  Of the nine wiring board areas Aa to Cc of the connecting board 50, the configuration of the wiring board 1 obtained from the wiring board area Ab is as described above, but the remaining eight wiring board areas are as described above. This is the same configuration except that the combination of the presence or absence of marks at a plurality of predetermined positions in the area of the wiring board described below is different from the area Ab of the wiring board.

  In the connection board 50, as a plurality of predetermined positions for forming the mark 4, a combination of three places on the left side L side and three places on the right side R side described in the wiring board 1 is used.

  In FIG. 3, the nine wiring board regions are arranged adjacent to each other in three vertical and horizontal directions, so the right side of the wiring board region constituting the a row and the wiring board region constituting the b row. The left side is shared by the boundary line 54 to form a dividing groove. Similarly, the right side of the area of the wiring board constituting the b row and the left side of the area of the wiring board constituting the c row are shared to form a boundary line 54 and a dividing groove is formed.

  Here, the boundary line 54 between the wiring board region 52 constituting the a row and the wiring board region 52 constituting the b row, and the wiring substrate region 52 and c row constituting the b row are defined as follows. In the boundary line 54 between the region 52 of the wiring board to be formed, the mark 4 is formed so as to be shared by the region 52 of the left and right wiring substrates. Further, the left side of the wiring board region 52 constituting the a row and the right side of the wiring board region 52 constituting the c row have a boundary line 54 between the mother board surplus portion 53 and the mark 4 These are formed across the boundary line (dividing groove) 54 between the wiring board region 52 and the mother board surplus portion 53.

  In this way, by forming the mark 4 across the boundary line 54 in the region 52 of each wiring board, even when a slight shift occurs in the dividing position when the connecting board 50 is divided, each wiring board The mark can be reliably exposed from the side and visually identified.

  It should be noted that the predetermined positions where the three marks 4 are formed on the left side L side and the right side R side of the area of the wiring board are the 1/4 position from the top in the plan view of the left side and the right side, the 2/4 position, 3 The positions of / 4 are indicated by 1, 2, and 3, respectively, and the left side is indicated by L and the right side is indicated by R. The positions of the marks included in the regions Aa to Cc of each wiring board on the connection board 50 are shown in Table 1. As shown.

  Here, the mark 4 formed in the vicinity of the left side so as to reach the left side of the wiring board region 52 constituting the a row straddles the boundary line 54 between the wiring board region 52 and the mother board surplus portion 53. Although formed on the mother board surplus part 53, the mark formed on the mother board surplus part 53 has a width (W) and a film thickness (T) that are formed in the region 52 of the wiring board. The distance from the boundary line 54 to the end of the mark on the mother board surplus portion 53 is preferably 200 to 1000 μm, and more preferably 300 to 400 μm. Also, the mark formed near the right side so as to reach the right side of the wiring board region 52 constituting the column c is the same size as described above, and the boundary line between the wiring board region 52 and the mother board surplus portion 53 54 is formed also on the mother board surplus part 53 across 54.

  The shape of the mark formed on the mother board surplus part 53 across the boundary line 54 from the region 52 of the wiring board is particularly preferable if the width, film thickness, distance, etc. are ensured. Not limited. Note that the shape, size, and the like of the mark on the region 52 of each wiring board are the same as those described for the wiring board 1 even if they are formed across the boundary line 54.

  In this way, the connection board in which the areas of the wiring board are arranged adjacent to each other forms a mark across the side shared by the area of the wiring board, so that in the connection board 50, the wiring constituting the a row The presence or absence of a mark at a predetermined position on the right side R side of the substrate region 52 and the left side L side of the wiring substrate region 52 constituting the b row is the same combination, and the right side of the wiring substrate region 52 constituting the b row The presence / absence of a mark at a predetermined position on the R side and on the left side L side of the region 52 of the wiring board constituting the c row is the same combination.

Therefore, a limitation is imposed on the 64 combinations of 2 ³ × 2 ³ described as combinations that can be individually identified. In the connection board 50, there is no particular problem because it is the identification of the areas of the nine wiring boards. However, depending on the number of wiring boards included in the connection board, the number of predetermined positions where the mark is formed is considered in consideration of this. Adjust.

  The connection board of the present invention can be manufactured, for example, by a manufacturing method including the following steps (A1) to (D1). In the following, the manufacturing method will be described with reference to FIGS. 5 and 6 by taking the connecting board 50 shown in FIG. 3 as an example, but the members used for manufacturing are denoted by the same reference numerals as those of the finished product. explain. FIG. 5 is a plan view showing a main body substrate on which wiring conductors and marks constituting the connection substrate shown in FIG. 3 are formed. FIG. 6 is a plan view showing a frame substrate on which a frame constituting the connection substrate shown in FIG. 3 is formed.

  3 basically has a structure in which a frame substrate 503 shown in FIG. 6 is laminated on a main substrate 502 shown in FIG.

  The main board 502 has nine wiring board regions 522 arranged in three columns and three horizontal rows in the center, and a main board surplus portion 532 so as to surround the outside of these wiring board regions 522. . The wiring conductors (each pair of element connection terminals 5 (mounting surface), external connection terminals 6 (non-mounting surface), and through conductors 7 (inside)) are formed in the region 522 of each wiring board. Further, a mark 4 is formed at a predetermined position on the mounting surface 21 of each wiring board region 522 across the boundary line 542 between the wiring board regions 522 or across the boundary line 542 between the wiring board region 522 and the main body substrate surplus portion 532. Is formed. Further, a total of 16 divided holes 552 that penetrate from the mounting surface side of the main board 502 to the non-mounting surface side are formed so as to cut out the four corners of the region 522 of each wiring board.

  The frame substrate 503 has nine wiring board regions 523 arranged in the same manner as described above and separated by the boundary line 543, and surrounds the outside of the nine wiring substrate regions 523. The surplus part 533 exists. The area 523 of each wiring board is formed so that a cavity and a frame are formed with the central circular portion as the bottom of the cavity, and an electrode mark 8 is provided on the frame of the area 523 of each wiring board. Further, a total of 16 divided holes 553 are formed so as to penetrate from the upper (front) side to the lower (back) side of the frame substrate 503 so as to cut out four corners of the region 523 of each wiring board.

(A1) Green sheet manufacturing process First, for a main body of a substantially flat plate shape (meaning flat plate on the visual level, the same applies hereinafter) that constitutes the main body substrate 502 using a glass ceramic composition containing glass powder and a ceramic filler. The substrate green sheet 502 and the frame substrate green sheet 503 constituting the frame substrate 503 are manufactured. The details of the glass ceramic composition are as described above.

  Each of these green sheets is prepared by adding a binder to a glass ceramic composition containing glass powder and a ceramic filler, and if necessary, adding a plasticizer, a dispersant, a solvent, etc., to prepare a slurry. It can be manufactured by forming into a sheet shape having a predetermined shape and film thickness after baking and drying.

  With respect to the frame substrate green sheet 503 formed to have the predetermined shape and film thickness, the center portion of the nine wiring substrate regions 523 is cut into a circular shape, and the upper left portion of the portion of each wiring substrate region 523 that becomes the frame body is cut out. The electrode mark 8 is formed by a screen printing method or the like. Although not shown, alignment marks for stacking are formed on the frame substrate green sheet 503.

(B1) Wiring conductor paste layer and mark paste layer forming step In the main body substrate green sheet 502 obtained in the step (A1), predetermined wiring is provided at predetermined positions in each of the nine wiring substrate regions 522. A conductor paste layer and a mark paste layer are formed.

  First, for each of the wiring board regions 522 of the substrate green sheet 502 for the main body, the through conductor paste layer 7 penetrating from the mounting surface 21 to the non-mounting surface 23 with a predetermined size at two predetermined positions, and the non-mounting surface A conductor paste layer 6 for external connection terminals that is electrically connected to the through conductor paste layer 7 in a predetermined size is formed at two predetermined locations 23. In addition, for each of the wiring board regions 522 of the main body substrate green sheet 502, the element connection terminal paste layer 5 that is electrically connected to the through conductor paste layer 7 in a predetermined size at two predetermined positions on the mounting surface 21. The mark paste layer 4 is simultaneously formed in a predetermined size at the mark formation positions shown in Table 1 above. The mark paste layer 4 is formed so as to straddle the boundary line 542 between the wiring board regions 522 or the boundary line 542 of the wiring board region 522 and the main body substrate surplus portion 532. As a result, a main body substrate green sheet 502 with a conductive paste layer is obtained. Although not shown, alignment marks for stacking are formed on the main body substrate green sheet 502.

  Examples of a method of forming the mark paste layer 4, the element connection terminal paste layer 5, the external connection terminal conductor paste layer 6, and the through conductor paste layer 7 include a method of applying and filling a conductor paste by a screen printing method. The film thicknesses of the mark paste layer 4, the element connection terminal paste layer 5 and the external connection terminal conductor paste layer 6 to be formed are films in which the film thicknesses of the finally obtained element connection terminals, marks and external connection terminals are predetermined. It is adjusted to be thick.

  The same material can be used as the wiring conductor paste and the mark paste. For example, a paste obtained by adding a vehicle such as ethyl cellulose to a metal powder mainly composed of copper, silver, gold or the like, and a solvent as necessary. Use the shape. As the metal powder, a metal powder made of silver, a metal powder made of silver and platinum or palladium is preferable, and a metal powder made of silver and palladium is more preferable from the viewpoint of suppressing silver migration at the side exposed portion of the mark. .

(C1) Lamination and Divided Groove and Divided Hole Forming Step On the mounting surface 21 of the main body substrate green sheet 502 with the conductive paste layer obtained in the step (B1), the frame obtained in the step (A1). The body substrate green sheet 503 is laminated with the surface having the electrode mark 8 facing upward while being aligned by the alignment mark, and is integrated by heating and pressing to form a green sheet molded body. Next, on the front and back surfaces of the green sheet molded body, using a ceramic green sheet laminate cutting machine or the like, four vertical and four horizontal lines are arranged on the boundary line of the wiring board region arranged in three columns and three rows. A dividing groove 54 is formed. Further, circular through holes centering on the intersections at the 16 intersections of the dividing grooves 54 are formed as the dividing holes 55 using a punch or the like to obtain the unsintered connection substrate 50.
If necessary, before the main body substrate green sheet 502 and the frame substrate green sheet 503 are laminated, the divided holes 55 may be formed for each green sheet.

(D1) Firing Step After the step (C1), the obtained unsintered connection substrate 50 is degreased to remove a binder or the like as necessary, and fired to sinter the glass ceramic composition or the like ( Baking temperature: 800-930 ° C.).

  Degreasing is preferably performed, for example, under the condition of holding at a temperature of 500 ° C. to 600 ° C. for 1 hour to 10 hours. When the degreasing temperature is less than 500 ° C. or the degreasing time is less than 1 hour, the binder or the like may not be sufficiently removed. On the other hand, if the degreasing temperature is about 600 ° C. and the degreasing time is about 10 hours, the binder and the like can be sufficiently removed.

  In addition, in the firing, the time is appropriately adjusted in a temperature range of 800 ° C. to 930 ° C. in consideration of obtaining a dense structure of the insulator body and productivity. Specifically, it is preferably held at a temperature of 850 ° C. or higher and 900 ° C. or lower for 20 minutes or longer and 60 minutes or shorter, particularly preferably at a temperature of 860 ° C. or higher and 880 ° C. or lower for 20 minutes or longer and 60 minutes or shorter. If the firing temperature is less than 800 ° C., the insulator body may not be obtained as a dense structure. On the other hand, when the firing temperature exceeds 930 ° C., productivity and the like may be lowered due to deformation of the insulator body. In addition, when a metal paste containing a metal powder containing silver as a main component is used as the wiring conductor paste or mark paste, when the firing temperature exceeds 880 ° C., the predetermined shape can be maintained due to excessive softening. There is a risk of disappearing.

  In this way, the unsintered connection substrate 50 is fired to obtain the connection substrate 50. After firing, the element connection terminal 5 and the external connection terminal 6 are usually covered with gold or the like so as to cover the entire element connection terminal 5 and the external connection terminal 6 as necessary. A conductive protective film used for conductor protection in the wiring board can also be provided.

  As described above, the manufacturing method of the connection board of the present invention has been described. However, the main body substrate green sheet 502 and the frame body substrate green sheet 503 are not necessarily formed of a single green sheet, and a plurality of green sheets are laminated. It may be what you did. Further, the order of forming each part can be appropriately changed as long as the connection substrate can be manufactured.

  As mentioned above, although the connection board | substrate of this invention which used the LTCC board | substrate as an insulator, and its manufacturing method were demonstrated, the case where the said LTCC board | substrate was used about structures other than the constituent material of a member in the case of using an alumina board | substrate. This can be done in the same manner as The process will be briefly described below.

(A2) Green sheet manufacturing process The same process as the above (A1) green sheet manufacturing process, using a ceramic material mainly composed of alumina instead of the glass ceramic composition (LTCC) containing glass powder and ceramic filler. Go through. In addition, as a ceramic material which has an alumina as a main component, the said normal alumina ceramic material can be especially used without a restriction | limiting.

(B2) Wiring conductor paste layer and mark paste layer forming step The firing temperature of the alumina substrate is 1400 to 1700 ° C., which is higher than that of the LTCC substrate as described below. When a metal layer such as a metal layer is formed at the same time, a refractory metal such as tungsten or molybdenum is used as a metal serving as a conductor. That is, the same process as the (B1) wiring conductor paste layer and mark paste layer forming process is performed as a high heat-resistant wiring conductor paste and mark paste mainly composed of a refractory metal such as tungsten or molybdenum.

(C2) Lamination and Divided Groove and Divided Hole Forming Step The same process as the (C1) laminated and divided groove / divided hole forming step is performed.

(D2) Firing step After the step (C2), the obtained unsintered connection substrate 50 is degreased to remove the binder and the like as necessary, and fired to sinter the glass ceramic composition and the like. (Baking temperature: 1400-1700 ° C.). For example, the degreasing is preferably performed under a condition of holding at a temperature of 200 ° C. to 500 ° C. for about 1 hour to 10 hours. For example, the firing is preferably performed at a temperature of 1400 ° C. or higher and 1700 ° C. or lower for several hours. However, in order not to oxidize the conductor during heating, particularly during firing, heating must be performed while maintaining a non-oxidizing atmosphere in a reducing atmosphere (hydrogen), an inert gas atmosphere, or a vacuum.

  In this way, the unsintered connection substrate 50 is fired to obtain the connection substrate 50. After firing, the element connection terminal 5 and the external connection terminal 6 are covered as necessary, such as gold plating, as necessary. Usually, a conductive protective film used for conductor protection in the wiring board can also be provided.

  Here, when manufacturing a connection substrate using an alumina substrate as an insulator, not a high melting point metal such as tungsten or molybdenum, but a low melting point metal such as silver or copper having good thermal conductivity or reflectivity is used. After forming a green sheet as an alumina substrate by firing, a metal layer such as a wiring conductor or mark is formed by combining a screen printing method, a sputter deposition method, an ink jet coating method, or the like at a desired position on the substrate. Can be formed. For these members, a preferable metal is selected for each member, and it is appropriately selected whether it is formed during firing or after firing. Depending on the member, a metal layer may be formed by laminating a high melting point metal as the first layer and a low melting point metal as the second layer.

Examples of the present invention will be described below. The present invention is not limited to these examples.
[Example 1]

  In the method described below, a connection substrate having the same structure as shown in FIG. 3 was manufactured using LTCC as a material constituting the base and the frame. In addition, the same code | symbol used for a member before and behind baking was used similarly to the above.

First, a main body substrate green sheet 502 and a frame substrate green sheet 503 for manufacturing the connection substrate 50 were manufactured. These green sheets, SiO ₂ is _60.4mol%, B 2 _{O 3} is 15.6mol%, _Al 2 _{O 3} is 6 mol%, CaO is 15mol%, _{K 2} O is 1mol%, Na ₂ O and a 2 mol% The raw materials were blended and mixed so that the raw material mixture was put in a platinum crucible and melted at 1600 ° C. for 60 minutes, and then the molten glass was poured out and cooled. This glass was pulverized with an alumina ball mill for 40 hours to produce a glass powder. In addition, ethyl alcohol was used as a solvent for pulverization.

  A glass ceramic composition was produced by blending and mixing the glass powder at 40% by mass and alumina filler (made by Showa Denko KK, trade name: AL-45H) at 60% by mass. 50 g of this glass ceramic composition, 15 g of an organic solvent (toluene, xylene, 2-propanol, 2-butanol mixed at a mass ratio of 4: 2: 2: 1), plasticizer (di-2-ethylhexyl phthalate) 2.5 g of polyvinyl butyral (trade name: PVK # 3000K, manufactured by Denka) as a binder and 5 g of a dispersant (trade name: BYK180, manufactured by Big Chemie) were further blended and mixed to prepare a slurry.

  The slurry is applied on a PET film by a doctor blade method, and dried green sheets are laminated, and is a substantially flat plate having a size after baking of 15 mm × 15 mm and a thickness of 0.5 mm. A substrate green sheet 502 was manufactured. Similarly, a frame substrate green sheet 503 having a substantially flat plate shape with a size after firing of 15 mm × 15 mm and a thickness of 0.5 mm was manufactured.

  In the frame substrate green sheet 503, the center of nine wiring substrate regions 523 (each region is 4 × 4 mm) is cut out into a circle having a diameter of 3 mm using a green sheet punching machine. An electrode mark 8 was formed by screen printing on the upper left of the part of the region 523 that would be a frame, and an alignment mark for stacking was formed. In addition, a circular through-hole having a diameter of 800 μm centered on the intersection is formed at 16 intersections of the boundary line 543 between the wiring board regions 523 and the boundary line 543 of the wiring board region 523 and the frame board surplus portion 533. These holes were formed using a punching machine to form divided holes 553.

  On the other hand, conductive powder (manufactured by Daiken Chemical Industry Co., Ltd., trade name: S550) and ethyl cellulose as a vehicle are blended at a mass ratio of 85:15, and α-terpineol as a solvent so that the solid content is 85 mass%. Then, the mixture was kneaded for 1 hour in a porcelain mortar and further dispersed three times with a three roll to produce a metal paste.

  A through hole having a diameter of 0.3 mm is formed in a portion corresponding to the unfired through conductor 7 in each region 522 (each region is 4 × 4 mm) of the wiring board of the main body substrate green sheet 502 by using a perforator. Then, the metal paste is filled by a screen printing method to form the unfired through conductor paste layer 7 and is electrically connected to the through conductor paste layer 7 in a predetermined size at two predetermined locations on the non-mounting surface 23. A connection terminal conductor paste layer 6 was formed. In addition, for each of the wiring board regions 522 of the main body substrate green sheet 502, the element connection terminal paste layer 5 that is electrically connected to the through conductor paste layer 7 in a predetermined size at two predetermined positions on the mounting surface 21. The mark paste layer 4 having the following shape and size was simultaneously formed at the mark formation positions shown in Table 1 so that the film thickness after firing was 10 μm. A registration mark for lamination is formed on this, and further, using a punch, a boundary line 542 between the wiring board regions 522 and a boundary line 542 between the wiring board region 522 and the main board surplus portion 532 are formed. Through holes (divided holes 552) were formed in a circle having a diameter of 800 μm centering on the intersection at the 16 intersections, to obtain a substrate green sheet 502 for a body with a conductive paste layer.

  Here, the shape of the mark paste layer was substantially rectangular, and the size of each mark was 200 μm in width and 700 μm in length as the size after firing. It should be noted that the size of the mark formed across the boundary line 542 of the adjacent wiring board region 522 is a size obtained by connecting two of the marks. Further, the size of the mark formed across the boundary line 542 of the wiring board region 522 and the main body substrate surplus portion 532 on the main body substrate surplus portion 532 was 200 μm wide and 400 μm long.

  The frame substrate green sheet 503 and the main body substrate green sheet 502 with the conductive paste layer are laminated while being aligned by alignment marks, and are integrated by heating and pressing to form a green sheet molded body did. Next, on each of the front and back surfaces of the green sheet molded body, a dividing groove 54 having a depth of 200 μm is vertically and horizontally divided by the dividing grooves 54 using a ceramic green sheet laminate cutting machine (G-cut 6 manufactured by UHT). An area 52 of the wiring board to be formed was formed so as to be 4 × 4 mm in each area, and an unsintered connection board 50 was obtained.

  The unsintered connection substrate 50 obtained above was degreased by holding at 550 ° C. for 5 hours, and further sintered at 870 ° C. for 30 minutes to manufacture the connection substrate 50.

  The obtained connecting board 50 was divided to obtain nine wiring boards Aa to Cc similar to those shown in FIG. When the marks appearing on the side surfaces of the obtained nine wiring boards were visually confirmed, all the marks were confirmed as shown in Table 1.

[Example 2]
In the method described below, a connection substrate having the same structure as shown in FIG. 3 was manufactured using an aluminum oxide sintered body as a material constituting the base and the frame. In addition, the same code | symbol used for a member before and behind baking was used similarly to the above.

First, a main body substrate green sheet 502 and a frame substrate green sheet 503 for manufacturing the connection substrate 50 were manufactured. These green sheets were produced by the following method.
100 parts by mass of ceramic powder of 96% by mass of alumina made of alumina, calcia, magnesia, silica, 25 parts by mass of methanol, 25 parts by mass of toluene, 10 parts by mass of polyvinyl butyral (Sekisui Chemical Co., Ltd .: ESREC BM-S), dibutyl 8 parts by mass of phthalate was added to a ball mill and mixed for 30 hours to obtain a ceramic slurry.

  The ceramic slurry was coated on a PET film with a comma coater, and a green sheet dried at 80 ° C. for 30 minutes in a hot air dryer was laminated, and the main body substrate green sheet 502 having the same size as in Example 1 and A frame substrate green sheet 503 was manufactured.

In the same manner as in Example 1, the frame substrate green sheet 503 was formed with cavity holes, electrode marks 8, stacking alignment marks, and divided holes 553.
A metal paste was produced in the same manner as in Example 1 except that tungsten having a high melting point was used instead of conductive powder (trade name: S550, manufactured by Daiken Chemical Industry Co., Ltd.) as the conductive powder. A wiring conductor paste layer (5, 6, 7) and a mark paste layer 4 are formed on the green sheet 502 in the same manner as in Example 1. Further, alignment marks for lamination and division holes 552 are formed, A main substrate green sheet 502 with a conductive paste layer was obtained.

  After laminating the frame substrate green sheet 503 and the main body substrate green sheet 502 with the conductive paste layer in the same manner as in Example 1, the dividing grooves 54 were formed, and the unsintered connection substrate 50 was obtained. This unsintered connection substrate 50 was degreased by holding at 400 ° C. for 8 hours, and was further fired by holding at 1600 ° C. for 3 hours to produce a connection substrate 50. However, the atmosphere was maintained in an inert gas atmosphere of nitrogen during firing.

  The obtained connecting board 50 was divided to obtain nine wiring boards Aa to Cc similar to those shown in FIG. When the marks appearing on the side surfaces of the obtained nine wiring boards were visually confirmed, all the marks were confirmed as shown in Table 1.

  According to the present invention, in each wiring board divided and manufactured from the connection board, the formation location etc. on the connection board can be easily discriminated by a visually observable mark on the side surface, and an electronic component is mounted on such a wiring board. It is useful for quality control of various devices.

DESCRIPTION OF SYMBOLS 1 ... Wiring board, 2 ... Base | substrate, 3 ... Frame, 4 ... Mark, 5 ... Element connection terminal, 6 ... External connection terminal, 7 ... Through-conductor, 8 ... Electrode mark 11 ... Light emitting element, 12 ... Bonding wire, 13 ... sealing layer 21 ... mounting surface, 22 ... mounting portion, 23 ... non-mounting surface 50 ... connecting substrate, 51 ... mother substrate, 52 ... area of wiring substrate, 53 ... surplus portion of mother substrate, 54 ... dividing groove, 55 ... Divided holes 502 ... Substrate for main body, 503 ... Substrate for frame

Claims (11)

  There is a mounting portion on which an electronic component is mounted on at least one main surface of an insulator made of an inorganic insulating material, and a wiring conductor electrically connected to the electronic component is formed on the surface and, if necessary, inside A wiring board having a mark formed so that a part of the main surface of the insulator and an inner surface parallel to the main surface are exposed on the side surface of the insulator near the outer periphery. A wiring board characterized by.   The wiring board according to claim 1, wherein the mark is formed of the same material as the wiring conductor so as not to connect the wiring conductors serving as counter electrodes to at least one of the surfaces on which the wiring conductor is formed.   2. The mark is formed in the vicinity of the outer periphery of the inner surface parallel to the main surface of the insulator, at least one of the same shape, and is identified by at least one of the position and the number of marks exposed on the side surface. Or the wiring board of 2.   When the mark exposed on the side surface has a width of 50 to 1000 μm and a film thickness of 5 to 50 μm, and there are a plurality of marks on one side surface, the distance between the marks is at least 50 μm as the distance between adjacent mark ends. The wiring board according to any one of claims 1 to 3.   The main surface of the insulator has a substantially rectangular shape, and has a two-pole wiring conductor facing the inside of two opposite sides of the inner surface parallel to the main surface of the insulator, and the mark is the two sides The wiring board according to claim 1, wherein the wiring board is formed to reach any one of the above.   The wiring board according to claim 1, wherein the electronic component is a light emitting element.   The wiring board according to any one of claims 1 to 6, wherein the insulator is made of a sintered body of a glass ceramic composition containing glass powder and a ceramic filler.   A wiring board according to any one of claims 1 to 7, wherein a plurality of wiring board areas are arranged in a matrix on a mother board, wherein the wiring board area is the wiring board according to any one of claims 1 to 7. 1 may be a wiring board that does not have the mark).   The regions of the plurality of wiring boards have a plurality of predetermined positions at which the marks having substantially the same shape can be formed, and combinations of presence / absence of marks at the predetermined positions are different for each of the regions of the plurality of wiring boards. Item 9. A connecting board according to Item 8.   10. The connection according to claim 8, wherein the mark is formed in both regions having the boundary line as a boundary across a boundary line between adjacent wiring substrate regions or a mother substrate of the wiring substrate region. substrate.   The areas of the plurality of wiring boards have two-pole wiring conductors facing the inner sides of two opposite sides, and electrode marks indicating the positions of the two poles at a predetermined position visible from the outside. The connection board according to claim 9, wherein the connection board is formed so as to straddle the boundary line between adjacent wiring board regions or both of the wiring board region and the mother board with either one of the two sides as a boundary line.

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