JP4822921B2 - Ceramic substrate, electronic component storage package, electronic device, and manufacturing method thereof - Google Patents

Description

  The present invention relates to a ceramic green sheet laminate formed with a wiring board region serving as a wiring board for accommodating electronic components, a ceramic substrate, a laminate, an electronic component storage package formed from these, an electronic device, And a manufacturing method thereof.

  2. Description of the Related Art Conventionally, wiring boards (electronic component storage packages) for mounting electronic components such as semiconductor elements and crystal resonators are made of tungsten on the surface of an insulating base made of an electrically insulating material such as an aluminum oxide sintered body. It is formed by disposing a wiring conductor made of metal powder metallization such as molybdenum. The wiring board is formed as an electronic device by mounting electronic components on the top surface and sealing with a lid or potting resin.

  With the recent demand for downsizing of electronic devices, the size of such wiring substrates has become extremely small, about several millimeters square, and the efficiency of production of wiring substrates and electronic devices using the same has been increased. In order to improve, a large number of wiring board regions serving as wiring boards are arranged vertically and horizontally in the center of a large-area mother board, and dividing grooves for dividing each wiring board area are formed between the wiring board areas. Manufacturing in the form of a multi-piece wiring board is performed.

  For example, after preparing a ceramic green sheet for a mother board, printing a metallized paste for a wiring conductor on the ceramic green sheet, and laminating a plurality of ceramic green sheets as necessary The at least one main surface is made by making a cut for the dividing groove with a cutting blade such as a cutter blade or a mold and firing it at a high temperature.

  In recent years, there has been a demand for highly accurate dimensions of electronic devices. Therefore, in order to suppress the generation of burrs and chips on the wiring board when dividing the mother board along the dividing groove, a void is formed as an auxiliary region when dividing the mother board directly under the dividing groove. The method of keeping it is proposed.

Such a gap is formed by pressing a metal member against a predetermined position of the two ceramic green sheets to form a recess, and the two ceramic green sheets are laminated so that each recess faces each other. The ceramic green sheet laminate can be formed inside the mother substrate by firing the ceramic green sheet laminate at a high temperature (see Patent Document 1).
JP 2001-308528 A

  However, since the depression formed by pressing the ceramic green sheet is formed by partially deforming the ceramic green sheet, the peripheral edge of the depression is likely to be distorted due to the rise of the ceramic green sheet. When two ceramic green sheets with such distortions are stacked with the dents facing each other, the deformation of the ceramic green sheet located around the dents moves toward the dents due to the pressure when they are stacked. This causes a problem that the dent is closed and the void formed inside the mother substrate becomes narrower or disappears when the ceramic green sheet laminate is fired. For this reason, when the mother substrate is divided, the effect as the gap portion may be lowered.

  The present invention has been devised in view of the above-described problems of the prior art, and an object thereof is to satisfactorily form a void portion as an auxiliary region for favorably dividing along a dividing groove into a predetermined shape. It is an object to provide a method for producing a ceramic green sheet laminate, a method for producing a ceramic substrate, a ceramic green sheet laminate, a ceramic substrate, and a laminate. Another object of the present invention is to provide a highly reliable electronic component storage package and electronic device.

Method for producing a ceramic green sheet laminate of the present invention comprises a first ceramic green sheet is the top layer, the second ceramic green sheet comprising a lower layer of the first ceramic green sheets are laminated, and a plan view In the method for manufacturing a ceramic green sheet laminate having a wiring substrate region and a dividing groove forming region in which a dividing groove is formed along the outer edge of the wiring substrate region, the first through groove penetrating vertically When the first ceramic green sheet is provided on the second ceramic green sheet, the overlapping region of the divided groove forming region and the first through groove in a plan view is along the outer edge of the wiring substrate region. a first step of laminating to extend Te, and a second step of pressing the first and second ceramic green sheets the laminate, prior to The dividing groove forming region includes a first dividing groove forming region and a second dividing groove forming region intersecting with the first dividing groove forming region, and the first dividing groove forming region and the A region overlapping with the first through-groove extends along the outer edge of the wiring board region, and the third ceramic green sheet disposed below the first ceramic green sheet has a second penetration. A groove is provided, and an overlapping region of the second divided groove forming region and the second through groove extends in a plan view along an outer edge of the wiring board region.
Is.

  Preferably, in the method for producing a ceramic green sheet laminate of the present invention, after the second step, the dividing groove is formed on at least one of one main surface or the other main surface of the ceramic green sheet laminate. The third step is performed.

  The method for producing a ceramic substrate of the present invention is characterized by firing the ceramic green sheet laminate of the present invention.

The ceramic green sheet laminate of the present invention is made by laminating the first ceramic green sheet is the top layer, the second ceramic green sheet comprising a lower layer of the first ceramic green sheets, and the wiring in a plan view the substrate A ceramic green sheet laminate having a region and a divided groove forming region in which a divided groove is formed along an outer edge of the wiring substrate region, wherein the first ceramic green sheet includes the wiring substrate region extends is divided grooves along the outer edges forming, before Symbol second ceramic green sheet, in a region overlapping the dividing groove in a plan view, and with vertical through, along the dividing groove includes a first through-groove which is, the split groove, the first dividing grooves, together with and a second dividing groove intersecting the first dividing grooves, said first through Is provided in a region overlapping with the first dividing groove in plan view, extending along the first dividing groove, and disposed below the first ceramic green sheet. The ceramic green sheet 3 is provided with a second through groove extending along the second divided groove in a region overlapping with the second divided groove in a plan view. Is.

  Preferably, in the ceramic green sheet laminate of the present invention, the second ceramic green sheet includes the first ceramic green sheet connected to both sides of the side wall portion of the first through groove or the side wall portion. A pair of metal layers is deposited on the lower surface portion, and the pair of metal layers has a spaced-apart portion that is separated from each other.

  The ceramic substrate of the present invention is obtained by firing the ceramic green sheet laminate of the present invention.

The laminate of the present invention is formed by firing the first ceramic green sheet, firing the first insulating layer as the uppermost layer, and firing the second ceramic green sheet, and a lower layer of the first insulating layer. A laminated body having a wiring board region and a division groove forming region in which a division groove is formed along an outer edge of the wiring substrate region in a plan view. In the first insulating layer, a dividing groove is formed along an outer edge of the wiring board region. In the second insulating layer, a region overlapping the dividing groove in a plan view is vertically arranged. A first through groove extending along the dividing groove is provided, and the dividing groove includes a first dividing groove and a second dividing groove intersecting the first dividing groove. And the first through groove overlaps the first divided groove in plan view. Provided to extend along the dividing grooves of the first, the first arranged below the insulating layer, the third insulating layer formed by firing a third ceramic green sheet Is characterized in that a second through groove extending along the second divided groove is provided in a region overlapping with the second divided groove in a plan view.

  The electronic component storage package of the present invention is characterized in that the ceramic substrate of the present invention is divided along the dividing grooves.

  The electronic component storage package of the present invention is characterized in that the laminate of the present invention is divided along the dividing grooves.

  An electronic device of the present invention includes the electronic component storage package of the present invention and an electronic component mounted on the electronic component storage package.

  In the method for producing a ceramic green sheet laminate of the present invention, the first ceramic green sheet is formed on the second ceramic green sheet having the first through groove penetrating vertically, and the divided groove forming region and the first ceramic green sheet are viewed in plan view. A first step of stacking so that the overlapping region with one through groove extends along the outer edge of the wiring substrate region, and a second step of pressing the stacked first and second ceramic green sheets Therefore, the first through groove penetrates the second ceramic green sheet up and down, and a dent is formed in the peripheral portion of the first through groove of the second ceramic green sheet by pressing. The generation of distortion in the first ceramic green sheet and the second ceramic green sheet is laminated when the first ceramic green sheet and the second ceramic green sheet are laminated. By reducing the deformation of the second ceramic green sheets at the peripheral portion of the Tsumizo, it can be difficult to close the gap portion of a first through groove. Therefore, when the ceramic green sheet laminate is fired, the gap portion is suppressed from being fused and narrowed, and the ceramic substrate can be satisfactorily formed into a predetermined shape.

  Preferably, the division groove forming region includes a first division groove formation region and a second division groove formation region intersecting the first division groove formation region, and the first division groove formation in a plan view. The overlapping region of the region and the first through groove extends along the outer edge of the wiring board region, and the second ceramic green sheet disposed on the lower side of the first ceramic green sheet includes the second ceramic green sheet. Since the through groove is provided and the overlapping region of the second divided groove forming region and the second through groove extends in plan view along the outer edge of the wiring board region, the first and second through holes are provided. The groove penetrates the second and third ceramic green sheets up and down respectively, and the occurrence of distortion generated when a depression is formed by pressing at the peripheral edge of the first and second through grooves is suppressed, Alternatively, the generated distortion can be reduced and When the first, second, and third ceramic green sheets are stacked, deformation of the second and third ceramic green sheets at the peripheral edge portions of the first and second through grooves is reduced, and the first and second ceramic green sheets are reduced. It is possible to make it difficult to close the gap formed by the two through grooves. Therefore, when the ceramic green sheet laminate is fired, in the direction of the first divided groove region and the direction of the second divided groove region of the wiring board region, the gap portion is suppressed from being attached and narrowed, It can be satisfactorily formed in a predetermined shape on the ceramic substrate.

  Furthermore, since the first and second through grooves intersect with each other, even if the first and second through grooves are formed, the ceramics as in the case where these through grooves are arranged one above the other vertically. The strength of the green sheet laminate itself is not extremely weakened.

  Preferably, after the second step, the third step of forming the split groove on at least one of the one main surface or the other main surface of the ceramic green sheet laminate is performed, so that the split groove has a predetermined position and It can be formed well in the shape, so that the divided groove region and the through groove can be satisfactorily overlapped, and since the divided groove is formed after pressing, the divided groove can be prevented from being pressed and crushed.

  Since the method for producing a ceramic substrate of the present invention fires the ceramic green sheet laminate of the present invention, the through-groove is not lost even after firing, whereby it can be satisfactorily divided along the outer edge of the wiring board. This can reduce the occurrence of burrs and chips on the wiring board.

  In the first ceramic green sheet of the ceramic green sheet laminate of the present invention, a dividing groove along the outer edge of the wiring board region is formed, and a second ceramic green sheet that is a lower layer of the first ceramic green sheet Includes a first through groove extending vertically along the dividing groove in a region overlapping with the dividing groove in a plan view, so that the peripheral portion of the first through groove , The generation of distortion that occurs when the dent is formed by pressing can be suppressed, or the generated distortion can be reduced. Therefore, when the first ceramic green sheet and the second ceramic green sheet are laminated, It is possible to reduce the deformation of the second ceramic green sheet at the peripheral edge portion of the one through groove, and to make it difficult to close the gap portion that is the first through groove. Therefore, when the ceramic green sheet laminate is fired, the gap portion is suppressed from being fused and narrowed, and the ceramic substrate can be satisfactorily formed into a predetermined shape.

  Preferably, in the ceramic green sheet laminate of the present invention, the second ceramic green sheet is formed on both sides of the side wall portion of the first through groove or on the lower surface portion of the first ceramic green sheet connected to the side wall portion. Since the pair of metal layers are attached and the pair of metal layers have spaced apart portions, the metal layers are attached when the ceramic green sheet laminate is sintered. Since the mechanical strength is relatively low in the separated portion where the metal layer is not deposited, the mechanical strength is relatively low, so when the gap is divided, the gap portion is directed toward the separated portion that is not reinforced by the metal layer. The division can be progressed, whereby the division can be made better along the outer edge of the wiring board, and the occurrence of burrs and chips on the wiring board can be reduced.

  Preferably, the dividing groove includes a first dividing groove and a second dividing groove that intersects the first dividing groove, and the first through groove is formed into the first dividing groove in a plan view. A third ceramic green sheet disposed below the first ceramic green sheet is provided in the overlapping region so as to extend along the first dividing groove. Since the second through groove extending along the second divided groove is provided in the region overlapping with the divided groove, the peripheral edge portion of the first and second through grooves is pressed. Therefore, the generation of distortion that occurs when the dent is formed is suppressed, or the generated distortion can be reduced. Therefore, when the ceramic green sheets are laminated, the deformation of the second and third ceramic green sheets at the peripheral edge portions of the first and second through grooves is reduced, and the void portion including the first or second through grooves is formed. It can be hard to close. For this reason, when the ceramic green sheet laminate is fired, the gap portion is prevented from being fused and narrowed in the direction of the first divided groove region and the direction of the second divided groove region of the wiring board region. Thus, the gap can be satisfactorily formed on the ceramic substrate in a predetermined shape.

  Since the ceramic substrate of the present invention is formed by firing the ceramic green sheet laminate of the present invention, the voids are well formed in the ceramic green sheet laminate, and therefore the ceramic green sheet laminate is fired. In the ceramic substrate, the gap can be satisfactorily formed in a predetermined shape.

  The laminated body of the present invention includes a plurality of insulating layers, and a wiring board region and a dividing groove along an outer edge of the wiring board region are provided on the uppermost insulating layer among the laminated insulating layers. In the laminated body, a through groove that penetrates at least one insulating layer is provided along the divided groove immediately below the dividing groove inside the laminated body. Since the void portion is formed well, it can be divided well along the outer edge of the wiring board area through the gap portion when dividing, and burrs and chips are generated at the outer edge of the wiring board area. Can be reduced.

  The electronic component storage package according to the present invention is formed by dividing a ceramic substrate, in which a gap portion including a through groove is well formed at a predetermined position, along the dividing groove. It is possible to suppress the occurrence of burrs and chipping in the region serving as the outer edge of the package for the package, and the accuracy of the outer dimensions can be increased, and the reliability can be improved.

  Since the electronic device of the present invention includes the electronic component storage package of the present invention and the electronic component mounted on the electronic component storage package, the occurrence of burrs and chips on the outer edge of the electronic device is suppressed. Therefore, it is possible to obtain an electronic device with high accuracy of the external dimensions and to have excellent reliability.

  The manufacturing method of the ceramic green sheet laminated body of this invention is demonstrated. FIG. 1 is a cross-sectional view of each step showing an example of an embodiment of a method for producing a ceramic green sheet laminate of the present invention. In FIG. 1, 1 is a first ceramic green sheet, 2 is a second ceramic green sheet, 3 is a fourth ceramic green sheet, 4 is a first through groove, 5 is a ceramic green sheet laminate, and 6 is a gap. , 7 is a dividing groove, and 8 is a wiring pattern.

  First, as shown to Fig.1 (a), the 1st ceramic green sheet 1, the 2nd ceramic green sheet 2, and the 4th ceramic green sheet 3 are prepared.

  The first ceramic green sheet 1, the second ceramic green sheet 2, and the fourth ceramic green sheet 3 are obtained by adding an organic binder and a solvent to a ceramic powder, and a predetermined amount of a plasticizer and a dispersant as required. A slurry is obtained and applied to a resin or paper support such as PET (polyethylene terephthalate) by a molding method such as a doctor blade method, a lip coater method, or a die coater method to form a sheet. It is produced by drying by a drying method such as air drying, vacuum drying or far infrared drying.

Examples of the ceramic powder include aluminum oxide (Al ₂ O ₃ ) powder, aluminum nitride (AlN) powder, glass ceramic powder, and the like, which are appropriately selected according to the characteristics required for the electronic component mounting substrate.

In the case of aluminum oxide powder or aluminum nitride powder, a powder of a component serving as a sintering aid such as silicon oxide (SiO ₂ ) or magnesium oxide (MgO) is added, and manganese oxide (MnO) or the like is used as a colorant. Powder may be added.

  The glass ceramic powder is a mixture of glass powder and filler powder in a mass ratio of 10:90 to 99: 1, preferably 40:60 to 80:20.

Examples of the glass powder of the glass ceramic powder include SiO ₂ —B ₂ O ₃ system, SiO ₂ —B ₂ O ₃ —Al ₂ O ₃ system, SiO ₂ —B ₂ O ₃ —Al ₂ O ₃ —MO system (however, , M represents Ca, Sr, Mg, Ba or Zn), SiO ₂ —Al ₂ O ₃ —M ¹ O—M ² O system (where M ¹ and M ² are the same or different and Ca, Sr, Mg, Ba or Zn.), SiO ₂ —B ₂ O ₃ —Al ₂ O ₃ —M ¹ O—M ² O system (where M ¹ and M ² are the same as above), SiO ₂ -B ₂ O ₃ -M ³ ₂ O system (where M ³ represents Li, Na or K), SiO ₂ -B ₂ O ₃ -Al ₂ O ₃ -M ³ ₂ O system (where M ³ Is the same as above.), Pb-based, Bi-based glass powders, etc. It is.

Examples of the filler powder of the glass ceramic powder include a composite oxide of Al ₂ O ₃ , SiO ₂ , ZrO ₂ and an alkaline earth metal oxide, a composite oxide of TiO ₂ and an alkaline earth metal oxide, Examples thereof include ceramic powders such as composite oxides (eg, spinel, mullite, cordierite) containing at least one of Al ₂ O ₃ and SiO ₂ (cristobalite, quartz).

  As the organic binder, for example, acrylic (acrylic acid, methacrylic acid or a single aggregate or copolymer thereof, specifically, an acrylic ester copolymer, a methacrylic ester copolymer, an acrylic ester-methacrylic ester, Acid ester copolymer, etc.), polyvinyl butyral, polyvinyl alcohol, acrylic-styrene, polypropylene carbonate, cellulose, and other homopolymers or copolymers. In view of decomposability and volatility in the firing step, an acrylic binder is more preferable. The amount of the organic binder added varies depending on the ceramic powder, but it may be an amount that is easy to be decomposed and removed during firing, and the ceramic powder is dispersed, and the green sheet is easy to handle and process. About 10 to 20% by mass is desirable.

  The solvent contained in the slurry is made of organic materials such as hydrocarbons, ethers, esters, ketones, alcohols, etc. so that a slurry having a viscosity suitable for green sheet molding can be obtained by dispersing ceramic powder and organic binder. A solvent and water are mentioned. Among these, solvents having a high evaporation coefficient such as toluene, methyl ethyl ketone, and isopropyl alcohol are preferable because the drying process after slurry application can be completed in a short time. The amount of the solvent should be 30 to 100% by mass with respect to the ceramic powder, so that the viscosity can be applied to the support satisfactorily, specifically about 3 cps to 100 cps. Is desirable.

  Next, as shown in FIG. 1B, the first through groove 4 is formed at a predetermined position of the second ceramic green sheet 2. FIG. 2 is a plan view of the second ceramic green sheet 2 in FIG. The first through groove 4 is a hole having a groove shape penetrating the second ceramic green sheet 2 from one main surface to the other main surface, and is formed by a step of forming a ceramic green sheet laminate 5 described later. It is formed along the outer edge of the wiring board region of the sheet laminate 5. And since the 1st penetration groove 4 has penetrated the 2nd ceramic green sheet 2 up and down, generation | occurrence | production of the distortion which arises when a dent is formed in the peripheral part of the 1st penetration groove 4 by press. Is formed as a small one.

  Such a first through groove 4 is formed in the second ceramic green sheet 2 by a die or punching method by punching or a processing method such as laser processing.

  If the opening width of the first through groove 4 (width in a direction orthogonal to the extending direction of the groove in a plan view) is too large, when the first through groove 4 is divided along the divided groove 4, Variations in external dimensions tend to increase. If the opening width of the first through groove 4 is too narrow, it is difficult to form a sufficient opening width. As an example, the opening width of the first through groove 4 is preferably formed to a width of about 0.05 to 0.5 mm.

  Further, when the wiring board has a shape having a recess on one main surface, the first, second, and fourth ceramic green sheets 1, 2, 3 are made in the same manner as the first through groove 4 manufacturing method. Among the plurality of ceramic green sheets according to the depth of the recesses, the through holes for the recesses are formed at predetermined positions in the wiring substrate region of the ceramic green sheet laminate 5 in the subsequent laminating step. A recess is formed. For example, by forming a through hole for a recess in the first ceramic green sheet 1, in the step of forming the ceramic green sheet laminate 5 described later, the wiring substrate region of the ceramic green sheet laminate 5 includes A recess is formed on the first ceramic green sheet 1 side.

  3 and 4, the third ceramic green in which the second through-groove 10 is formed on either the one main surface side or the other main surface side of the second ceramic green sheet 2. A sheet 9 may be provided. The third ceramic green sheet 9 may be made of the same material as the first, second, and fourth ceramic green sheets 1, 2, and 3, and having a thickness corresponding to the wiring board to be manufactured. The second through-groove 10 is a hole having a groove shape penetrating the third ceramic green sheet 9 from one main surface to the other main surface. It is formed along the outer edge of the wiring board region of the sheet laminate 5 and is disposed so as to intersect the first through groove 4. And since the 2nd penetration groove 10 has penetrated the 3rd ceramic green sheet 9 up and down, generation | occurrence | production of the distortion which arises when a dent is formed in the peripheral part of the 2nd penetration groove 10 by press. Formed as a small one.

  Thereby, when the ceramic green sheets are laminated, the deformation of the second and third ceramic green sheets 2 and 9 at the peripheral edge portions of the first and second through grooves 4 and 10 is reduced, and the first or second ceramic green sheets are reduced. It is possible to make it difficult to close the gap formed by the through grooves 4 and 10. Therefore, when the ceramic green sheet laminate is fired, the gap portion is prevented from being fused and narrowed in the direction of the first divided groove region and the direction of the second divided groove region of the wiring board region. It can be satisfactorily formed into a predetermined shape on the ceramic substrate.

  The second through-groove 10 is formed in the same manner as the first through-groove 4 and is formed in the third ceramic green sheet 9 by a processing method such as punching or laser processing using a die or punching.

  Further, the second through groove 10 is formed in the same manner as the first through groove 4, and if the opening width of the second through groove 10 is too large, when the second through groove 10 is divided along the second divided groove 10, Variations in the external dimensions of the divided wiring board are likely to increase. In addition, if the opening width of the second through groove 10 is too narrow, it is difficult to form a through groove having a sufficient opening width. As an example, the opening width of the second through groove 10 is preferably formed to a width of about 0.05 to 0.5 mm.

  Then, as shown in FIG. 1C, a wiring pattern 8 serving as a wiring conductor or the like is formed in a predetermined pattern on the first ceramic green sheet 1, the second ceramic green sheet 2, and the fourth ceramic green sheet 3. To do. In this wiring conductor, each electrode of the electronic component mounted on the wiring board is connected via an electrical connection means such as a solder bump, a connection pad to the external circuit board, a wiring for connecting them, etc. Is included.

  For example, if the wiring pattern 8 is an electrode pad or a connection pad to which a through conductor is connected, the first, second, and fourth ceramic green are formed in the same manner as the first through groove 4 is formed. Through holes for through conductors are formed in the sheets 1, 2, 3 and embedded in the through holes with a conductive paste for through conductors by screen printing or press filling. A conductive paste for electrode pads and connection pads is printed in a predetermined pattern shape by a printing method such as a screen printing method or a gravure printing method.

  Conductive paste for electrode pads, connection pads, or through conductors is made by mixing a metal powder with a suitable organic binder and solvent, and if necessary, adding a dispersing agent, such as ball mill, triple roll mill, planetary mixer, etc. It is prepared by adjusting the viscosity by adding a necessary amount of a solvent after homogeneously dispersing by kneading means and kneading.

  The metal powder is a powder made of a metal material that can be sintered by co-firing with the first, second, and fourth ceramic green sheets 1, 2, and 3 in a later firing step, (W), molybdenum (Mo), manganese (Mn), gold (Au), silver (Ag), copper (Cu), palladium (Pd), platinum (Pt), etc. In the case of two or more kinds, any form such as mixing, alloy, coating, etc. may be used.

  Examples of the organic binder for the conductive paste include acrylics (acrylic acid, methacrylic acid or their homopolymers or copolymers, specifically acrylic ester copolymers, methacrylic ester copolymers, acrylic acid Ester-methacrylic acid ester copolymer, etc.), polyvinyl butyral, acrylic-styrene, polypropylene carbonate, cellulose, and other homopolymers or copolymers. In view of decomposability and volatility in the firing step, acrylic and alkyd organic binders are more preferable. The amount of the organic binder added varies depending on the metal powder, but may be any amount that can be easily decomposed and removed during firing and can disperse the metal powder particles. Degree is desirable.

  The solvent used for the conductor paste is not particularly limited as long as the metal powder and the organic binder can be well dispersed and mixed, and examples thereof include terpineol and butyl carbitol acetate. In view of formability after printing and drying properties, it is preferable to use a low boiling point solvent. Specifically, the solvent is added in an amount of 4 to 15% by mass with respect to the metal powder, and specifically, the conductive paste for electrode pads and connection pads has a viscosity of 3000 to 3 so that the wiring pattern 8 can be formed satisfactorily. It is adjusted to be about 40000 cps and about 15000 to 40000 cps for through conductors.

  In order to match the firing shrinkage behavior and shrinkage rate of the first ceramic green sheet 1 during firing, or to ensure the bonding strength of the wiring conductor after firing, the conductor paste is added with a glass or ceramic powder. Also good.

  And as shown in FIG.1 (d), the 1st ceramic green sheet 1, the 2nd ceramic green sheet 2, and the 4th ceramic green sheet 3 are laminated | stacked, and each layer is closely_contact | adhered by press. A ceramic green sheet laminate 5 is formed. The ceramic green sheet laminate 5 may be pressed each time the first, second, and fourth ceramic green sheets 1, 2, and 3 are laminated, or after all the green sheets are laminated. It doesn't matter.

  And since the distortion by the swelling of the 2nd ceramic green sheet 2 which generate | occur | produces by pressing is small in the peripheral part of the 1st penetration groove | channel 4, the 1st ceramic green sheet 1 and the 2nd ceramic green sheet 2 are attached. When laminated, the deformation of the second ceramic green sheet 2 at the peripheral edge of the first through groove 4 can be reduced, and the gap 6 can be made difficult to close.

  The first through groove 4 is formed as a gap 6 along the outer edge of the wiring board region of the ceramic green sheet laminate 5. In addition, the space | gap part 6 is used as an area | region which assists at the time of a division | segmentation in the division | segmentation process mentioned later. Further, when the fourth ceramic green sheet 3 is laminated on the lower surface of the second ceramic green sheet 2, the gap 6 is formed inside the ceramic green sheet laminate 5, and the ceramic green sheet laminate is formed in the dividing step described later. Even if the thickness of 5 is thick, it can be satisfactorily divided along the outer edge of the wiring board region.

  In addition, it is preferable that the 1st penetration groove | channel 4 is laminated | stacked on the side in which the division groove | channel 4 mentioned later is formed in the side where the opening width of a penetration groove | channel is wide. Thereby, in the division process described later, the division start surface in the gap 6 can be narrowed, and variations in the divided wiring boards can be reduced. For example, when the first through groove 4 is formed by a punching die, the surface on the punching end side (the surface opposite to the surface on which the punching pin of the punching die is inserted) is set as the split groove side. In the case where the first through groove 4 is formed by laser, the surface on the laser incident side may be set to the split groove side.

  In the example shown in FIG. 1, it is formed by laminating one each of the second ceramic green sheet 2 and the fourth ceramic green sheet 3 below the first ceramic green sheet. The ceramic green sheet laminate 5 may be formed by laminating a plurality of layers. Alternatively, the second ceramic green sheets 2 and the fourth ceramic green sheets 3 may be alternately laminated to form a plurality of gaps 6 in the thickness direction of the ceramic green sheet laminate 5. By dividing through the plurality of gaps 6, it can be easily divided well along the outer edge of the wiring board region.

  Furthermore, when the ceramic green sheet laminated body 5 is formed by laminating the third ceramic green sheet 9 together with the first and second ceramic green sheets 1 and 2, the second through groove 10 is shown in FIG. Thus, it is formed as the second gap portion 11. FIG. 4A is a plan view showing an example of the ceramic green sheet laminate 5 formed by laminating the first to fourth ceramic green sheets 1, 2, 3 and 9, and FIG. ) Is a cross-sectional view taken along the line AA ′ in FIG. 4A, and FIG. 4C is a cross-sectional view taken along the line BB ′ in FIG.

  When the first through groove 4 and the second through groove 10 intersect with each other in plan view in the ceramic green sheet laminate 5, and the wiring board is formed as a square or rectangle in plan view, the first through groove 4 and the second through groove 10 are formed to be orthogonal to each other. In this case, as shown in the internal plan view of the ceramic green sheet laminate 5 in FIG. 4 in FIG. 5, the second ceramic green sheet 2 and the third ceramic green sheet 9 are formed respectively.

  When the first to third ceramic green sheets 1, 2, 9 are stacked, the peripheral portion of the second through-groove 10 is reduced in distortion due to the rise of the third ceramic green sheet 9 generated by pressing. The deformation of the first to third ceramic green sheets 1, 2, 9 can be suppressed and the second gap 11 can be prevented from closing.

  In the third ceramic green sheet 9 as well, like the second ceramic green sheet 2, the third ceramic green sheet may be composed of a plurality of ceramic green sheets. Further, a ceramic green sheet in which the first through groove 4 and the second through groove 10 are not formed may be interposed between the second ceramic green sheet 2 and the third ceramic green sheet 9. Absent.

  And as shown in FIG.1 (e), the division | segmentation groove | channel 7 along the division | segmentation groove | channel 7 formation area used as the outer edge of a wiring board area | region in at least one side among the one main surface or the other main surface of the ceramic green sheet laminated body 5 is shown. Form. The step of forming the dividing groove 4 in the ceramic green sheet laminate 5 presses a cutting blade such as a cutter blade having a V-shaped cutting edge or a die along the outer edge of the wiring board region against the ceramic green sheet laminate 5. Can be formed. That is, the division groove 7 formation region and the through groove formation region overlap each other, and the ceramic green sheet laminate 5 has the second gap formed by the gap 6 formed by the first through groove 4 and the second through groove 10. When the portion 11 is formed, as shown in FIG. 6, the dividing groove 7 includes the first dividing groove 7 a and the second dividing groove 7 in regions overlapping with the first through groove 4 and the second through groove 10, respectively. The through groove 7b is formed.

  Moreover, after forming the ceramic green sheet laminated body 5, it is preferable to form the division | segmentation groove | channel 4 along the outer edge of a wiring board area | region. As a result, the dividing grooves 7 are formed after the stacking step, so that the deformation of the dividing grooves 7 due to pressing or the like at the time of stacking is suppressed as in the case where the dividing grooves are formed before the stacking step. 7 can be easily formed in a predetermined shape at a predetermined position, and the divided groove 7 formation region can be satisfactorily overlapped with the first through groove 4 and the second through groove 10 in a plan view. become.

  The dividing groove 7 formed in the ceramic green sheet laminate is divided into regions having a size corresponding to a desired shape of the wiring board, and when the ceramic board described later is bent to form a wiring board, the bending is performed. For example, the width of the opening that appears on the surface of the ceramic green sheet laminate 5 is about 0.05 to 1 mm, and the depth is about 0.05 to 2 mm.

  In FIG. 6, the ceramic green sheet laminate 5 has two rows of wiring board regions arranged vertically and horizontally. The number of wiring board regions arranged depends on the shape of the wiring board and the ceramic green sheet laminate 5. What is necessary is just to select suitably according to the shape of. For example, it may be in a so-called multi-chip substrate state in which a large number of small wiring board regions are arranged, which makes it possible to efficiently form a large number of wiring boards.

  Further, a dummy region may be formed in the peripheral region of the wiring board region as necessary. The dummy area formed in the outer peripheral part is an area for facilitating the manufacture and transportation of the ceramic substrate described later, and positioning, fixing, etc. during processing or transportation of the ceramic substrate is performed using this dummy area. be able to. The dummy region formed between the wiring substrate regions is a region for forming a wiring for attaching a plating layer to the wiring conductor in the wiring substrate region of the ceramic substrate, which will be described later. It is possible to efficiently deposit the plating layer. When the dummy region is formed, the dividing groove 7 and the first and second through grooves 4 and 10 may be extended to the dummy region along the outer edge of the wiring board region.

  Further, when a recess for mounting an electronic component or the like is formed on at least one main surface of the wiring board region, as shown in FIG. 7, the dividing groove 7 is formed on the surface where the recess is formed. It is preferable. This makes it easy to determine the direction of progress of cracks, so that when the ceramic substrate is divided, it is possible to reduce the occurrence of chips and cracks in the wall portions of the recesses. More preferably, the distance d1 from the dividing groove 7 to the gap 6 is made smaller than the distance from the dividing groove 7 to the inner wall d2 of the recess or the distance d3 from the gap 6 to the inner wall of the recess. preferable. Thereby, since the mechanical strength between the dividing groove 7 and the gap portion 6 becomes relatively small, in the step of dividing to be described later, it is easy to advance the crack from the dividing groove 7 toward the gap portion 6, It becomes possible to divide well along the outer edge of the wiring board region.

  The ceramic substrate is formed by sintering the ceramic green sheet laminate 5. Thereby, since the space | gap part 6 of the ceramic green sheet laminated body 5 is favorably formed in the predetermined shape, it can suppress that the space | gap part 6 melt | fuses at the time of baking, and a ceramic substrate is divided | segmented. It is possible to satisfactorily form the gap 6 formed of the first through groove 4 in the region overlapping the groove 4 formation region. The step of firing consists of removing organic components and sintering the ceramic powder. For removing the organic component, the ceramic green sheet laminate 5 is heated in a temperature range of about 100 to 1200 ° C. to decompose and volatilize the organic component, and sintering is performed at about 800 to 1800 ° C. For example, when the ceramic powder of the first to fourth ceramic green sheets 1, 2, 3, and 9 is composed of an aluminum oxide powder and a sintering aid, and the powder of the conductor paste is mainly composed of W, nitrogen and Organic components are removed at about 100 to 1200 ° C. in a reducing atmosphere composed of hydrogen, and sintering is performed at about 1500 to 1600 ° C. When the ceramic powders of the first to fourth ceramic green sheets 1, 2, 3, and 9 are made of glass ceramic powder, the organic components are removed at about 100 to 800 ° C., and the temperature is about 800 to 1100 ° C. Sintering is performed, but the atmosphere varies depending on the metal powder of the conductor paste. In the case of a material that is easily oxidized such as Cu, it is performed in a non-oxidizing atmosphere such as nitrogen, and an Ag-based material that is difficult to oxidize. If done in the atmosphere. In the case of a reducing atmosphere or a non-oxidizing atmosphere, it is preferable to include water vapor or the like in the atmosphere in order to effectively remove organic components.

When the ceramic powders of the first, second, and fourth ceramic green sheets 1, 2, and 3 are made of glass ceramic powder, the constrained green sheets are stacked on the upper and lower surfaces of the ceramic green sheet laminate 5 and fired. Thus, it is possible to obtain a glass ceramic electronic component mounting substrate with higher dimensional accuracy. The constrained green sheet is a green sheet mainly composed of a hardly sinterable inorganic material (for example, Al ₂ O ₃ or SiO ₂ ) that is sintered only at a temperature higher than the temperature at which the glass ceramic is sintered and contracted. The ceramic green sheet laminate 5 does not shrink at the firing temperature. In the ceramic green sheet laminate 5 in which the constraining green sheets are laminated, the constraining green sheet that is hard to shrink is prevented from shrinking in the laminating plane direction (so-called xy plane direction) and contracts only in the laminating direction (so-called z direction). Therefore, dimensional variations accompanying firing shrinkage are suppressed.

  In addition to the hardly sinterable inorganic component, the constrained green sheet has a glass component having a softening point equal to or lower than the firing temperature, such as the glass in the first, second, and fourth ceramic green sheets 1, 2, and 3. It is good to contain the same glass. This glass is softened during firing and bonded to the first and second ceramic green sheets 1 and 2, thereby strengthening the bonding between the first and fourth ceramic green sheets 1 and 3 and the restraining green sheet, A more reliable binding force can be obtained. The amount of glass at this time is preferably externally added to the inorganic component combining the hardly sinterable inorganic component and the glass component, and is preferably 0.5 to 15% by mass, thereby improving the constraint force by the constraint green sheet, In addition, the firing shrinkage of the constrained green sheet is suppressed to 0.5% or less.

  In the case of removing the constrained green sheet after firing, examples of the method include polishing, water jet, chemical blasting, sand blasting, wet blasting (a method of spraying abrasive grains and water by air pressure) and the like.

  In addition, the surface of the wiring conductor exposed on the surface of the electronic component mounting board after firing is used to prevent corrosion of the wiring conductor, to connect the electronic component and the wiring conductor, or between the wiring board and the external circuit board. In order to strengthen the bonding, it is preferable to perform plating such as Ni or Au.

  Further, as shown in FIGS. 8A and 8B, a pair of metal layers 12 are formed on both sides of the side wall portion of the first through groove 4 or on the lower surface portion of the first ceramic green sheet connected to the side wall portion. It is preferable that the pair of metal layers 12 have separation portions 12a that are separated from each other. In addition, a side wall part here shows the side wall in the extending direction of the 1st penetration groove 4 in planar view.

  In this case, in the ceramic substrate formed by firing the ceramic green sheet laminate 5, the portion to which the metal layer is applied is reinforced, and the separation portion 12a to which the metal layer 12 is not attached is relative to the ceramic substrate. Since the mechanical strength is lowered, the division can proceed toward the separation portion 12a that is not reinforced by the metal layer 12 in the gap. Thereby, it can divide | segment more favorably along the outer edge of a wiring board, and it can reduce that a burr | flash or a chip | tip generate | occur | produces in a wiring board.

  Note that such a separation portion 12a is preferably formed in a region located directly below the bottom of the dividing groove 7, so that when dividing, the separating portion 12a can be more favorably divided along the outer edge of the wiring board. become.

  Such a metal layer 12 can be made of the same material as the wiring pattern 8. Then, the conductive paste for the metal layer 12 is applied to a predetermined position on the side wall portion of the first through groove 4 of the second ceramic green sheet 2 and the lower surface portion of the first ceramic green sheet 1 by a screen printing method or the like. After printing by the printing method, the metal layer 12 is formed at a predetermined position by stacking.

  As shown in FIG. 8, when the fourth ceramic green sheet 3 is laminated on the lower surface of the second ceramic green sheet 2, the upper surface of the fourth ceramic green sheet connected to the side wall portion of the first through groove 4. A pair of metal layers 12 having spaced apart portions 12a that are spaced apart from each other may also be formed. As a result, the separation portion 12a not reinforced by the metal layer 12 has a relatively low mechanical strength. Therefore, when dividing, the gap 6 starts from the separation portion 12a not reinforced by the metal layer 12. The division can be progressed along the extended line of the groove 7, and the division can be made better along the outer edge of the wiring board, and the occurrence of burrs and chips on the wiring board can be reduced.

  Further, when the second gap 11 is formed in the ceramic green sheet laminate 5 by the third ceramic green sheet 9, the metal layer 12 is deposited on the second gap 11 as well as the gap 6. It is preferable to keep it. That is, a pair of metals is formed on both sides of the side wall portion of the second through groove 10 of the third ceramic green sheet 9 or on the lower surface portion of the first ceramic green sheet 1 or the second ceramic green sheet 2 connected to the side wall portion. The layer 12 may be applied, and the pair of metal layers 12 may have a separating portion that is separated from each other. In addition, when the second ceramic green sheet 2 or the fourth ceramic green sheet 3 is laminated on the lower surface of the third ceramic green sheet 9, the second ceramic green sheet 2 connected to the side wall portion of the second through groove 10. Alternatively, a pair of metal layers 12 having a separation portion 12a spaced from each other may be formed on the upper surface side of the fourth ceramic green sheet 3.

  The electronic component storage package of the present invention is divided into pieces by dividing the above-described ceramic substrate along the dividing grooves 4. With this configuration, since the gap 6 and the second gap 11 serving as auxiliary regions when dividing the ceramic substrate are formed in a predetermined shape at predetermined positions, burrs or It is possible to obtain a good electronic component storage package without occurrence of chipping or the like.

  An electronic device according to the present invention includes the electronic component storage package described above and an electronic component mounted on the electronic component storage package. With this configuration, an electronic device in which electronic components are well accommodated can be obtained.

  Electronic components include semiconductor elements such as IC chips and LSI chips, piezoelectric elements such as crystal vibrators and piezoelectric vibrators, various sensors, etc., and an electronic component storage package in which a multi-piece wiring board is divided along a dividing groove. It may be mounted on a plurality of electronic components mounted on a multi-piece wiring board.

  When the electronic component is a flip-chip type semiconductor element, the electrode of the semiconductor element and the wiring conductor are connected via a solder bump, a gold bump, or a conductive resin (anisotropic conductive resin, etc.). If the electronic component is a wire-bonding type semiconductor element, it is fixed with a bonding material such as glass, resin, brazing material, etc., and then the semiconductor is connected via a bonding wire. This is performed by electrically connecting the electrode of the element and the wiring conductor. When the electronic component is a piezoelectric element such as a crystal resonator, the piezoelectric element is fixed by a conductive resin, and the electrodes of the piezoelectric element and the wiring conductor are electrically connected.

  And an electronic component is sealed as needed. Sealing is performed by covering the electronic component with a sealing resin such as epoxy resin, or a lid made of resin, metal, ceramics, etc. placed so as to cover the electronic component is bonded to glass, resin, brazing material, etc. What is necessary is just to carry out by attaching to an electronic component storage package with an agent.

  The present invention can be variously modified within a range not departing from the gist of the present invention. For example, as shown in FIG. 9, the ceramic green sheet laminate 5 and the ceramic green sheet laminate 5 having recesses on one main surface and the other main surface may be used. In such a case, it is preferable to form dividing grooves 7 on one main surface side and the other main surface side. Thereby, since the directionality of the progress of cracks can be easily determined, it is possible to reduce the occurrence of cracks and cracks in the wall portion of the recess when the ceramic substrate is divided.

  The effect of the present invention is that a plurality of insulating layers are stacked, and a wiring board region and a division groove along the outer edge of the wiring board region are provided on the upper surface of the uppermost insulating layer among the stacked insulating layers. If the laminated body is provided with a through-groove extending through at least one insulating layer along the dividing groove immediately below the dividing groove within the laminated body, the insulating layer is made of ceramic. Needless to say, the raw material is not limited.

It is sectional drawing of each process which shows an example of embodiment of the manufacturing method of the ceramic green sheet laminated body of this invention. It is a top view of the 2nd ceramic green sheet in FIG.1 (b). It is sectional drawing of a process which shows an example of embodiment of the manufacturing method of the ceramic green sheet laminated body of this invention. (A) is a top view which shows an example of embodiment of the ceramic green sheet laminated body after the lamination process in this invention, (b) is sectional drawing in the AA 'line of (a). (C) is sectional drawing in the BB 'line of (a). (A) is an internal top view which shows an example of the 2nd ceramic green sheet in the ceramic green sheet laminated body in FIG. 4, (b) is a 3rd ceramic green sheet in the ceramic green sheet laminated body in FIG. It is an internal top view which shows an example. (A) is a top view which shows an example of embodiment of the ceramic green sheet laminated body of this invention, (b) is sectional drawing in CC 'line of (a), (c) is It is sectional drawing in the DD 'line of (a). It is sectional drawing which shows an example of embodiment of the ceramic green sheet laminated body of this invention. It is sectional drawing which shows the ceramic green sheet laminated body for manufacturing the ceramic substrate of this invention. It is sectional drawing which shows an example of embodiment of the ceramic green sheet laminated body of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... 1st ceramic green sheet 2 ... 2nd ceramic green sheet 3 ... 4th ceramic green sheet 4 ... 1st penetration groove 5 ... Ceramic green sheet laminated body 6 .. Gaps 7... Dividing grooves 8... Wiring pattern 9... Third ceramic green sheet 10... Second through groove 11. 12a: separation part

Claims (10)

A first ceramic green sheet serving as the uppermost layer and a second ceramic green sheet serving as a lower layer of the first ceramic green sheet are laminated, and in a plan view, a wiring board region and an outer edge of the wiring board region In the method of manufacturing a ceramic green sheet laminate having a split groove forming region in which split grooves are formed along the first ceramic groove on the second ceramic green sheet provided with the first through grooves penetrating vertically. A first step of laminating a first ceramic green sheet so that an overlapping region of the division groove forming region and the first through groove extends along an outer edge of the wiring substrate region in plan view; A second step of pressing the laminated first and second ceramic green sheets, and the divided groove forming region includes the first divided groove forming region and the first divided groove forming region. A second divided groove forming region intersecting the dividing groove forming region, and an overlapping region of the first divided groove forming region and the first through groove in plan view is along an outer edge of the wiring board region. The third ceramic green sheet that extends and is disposed on the lower side of the first ceramic green sheet is provided with a second through groove, and the second divided groove forming region and the above-described region in plan view A method for manufacturing a ceramic green sheet laminate, wherein a region overlapping with a second through groove extends along an outer edge of the wiring board region. 2. The ceramic according to claim 1, wherein after the second step, the ceramic green sheet laminate is subjected to a third step of forming the dividing groove on at least one of the one main surface or the other main surface of the ceramic green sheet laminate. A method for producing a green sheet laminate. A method for producing a ceramic substrate, comprising firing the ceramic green sheet laminate according to claim 1. A first ceramic green sheet that is the uppermost layer and a second ceramic green sheet that is the lower layer of the first ceramic green sheet are laminated, and the wiring board region and the outer edge of the wiring substrate region in a plan view A ceramic green sheet laminate having a split groove forming region along which a split groove is formed, wherein the first ceramic green sheet has a split groove formed along an outer edge of the wiring board region. The second ceramic green sheet includes a first through groove extending vertically along the division groove in a region overlapping with the division groove in a plan view. The dividing groove includes a first dividing groove and a second dividing groove that intersects the first dividing groove, and the first through groove is formed into the first dividing groove in a plan view. Superimposed area The third ceramic green sheet provided along the first dividing groove and disposed below the first ceramic green sheet includes the second ceramic green sheet in a plan view. A ceramic green sheet laminate, wherein a second through groove extending along the second divided groove is provided in a region overlapping with the divided groove. A pair of metal layers are deposited on both sides of the side wall portion of the first through-groove of the second ceramic green sheet or on the lower surface portion of the first ceramic green sheet connected to the side wall portion, 5. The ceramic green sheet laminate according to claim 4, wherein the pair of metal layers have a spacing portion that is spaced apart from each other. A ceramic substrate obtained by firing the ceramic green sheet laminate according to any one of claims 4 and 5. The first ceramic green sheet is fired, the first insulating layer as the uppermost layer, the second ceramic green sheet is fired , and the second insulating layer as the lower layer of the first insulating layer is formed. A laminated body having a wiring board region and a division groove forming region in which a division groove is formed along an outer edge of the wiring board region in plan view, the first insulating layer being laminated Are formed with a dividing groove along an outer edge of the wiring board region, and the second insulating layer penetrates the region overlapping with the dividing groove in a plan view, and the dividing groove is formed. A first through groove extending along the first split groove, and the split groove includes a first split groove and a second split groove intersecting the first split groove, and the first split groove. One through groove is formed in a region overlapping the first divided groove in a plan view. Along provided extending, the first arranged below the insulating layer, the third third insulating layer formed by firing a ceramic green sheet, said in plan view a second A laminated body, wherein a second through groove extending along the second divided groove is provided in a region overlapping with the divided groove. An electronic component storage package, wherein the ceramic substrate according to claim 6 is divided along the dividing grooves. 8. A package for storing electronic parts, wherein the laminate according to claim 7 is divided along the dividing grooves. An electronic device comprising: the electronic component storage package according to claim 8; and an electronic component mounted on the electronic component storage package.

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