JP2005340502A - Method for manufacturing composite substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a composite substrate for easily and precisely dividing the substrate. <P>SOLUTION: This method for manufacturing a composite substrate is provided with a lamination process 13 for laminating a ceramic wiring board 11 where a plurality of electronic circuits are formed, and a resin substrate 12 where a plurality of electronic circuits are formed at the lower part of the ceramic wiring board; an integration process 14 for bonding and integrating the ceramic wiring board 11 and the resin board 12 by heating/pressurizing them posterior to the lamination process 13; and a division auxiliary means formation process 16 for dividing the composite substrate into a plurality of electronic circuits posterior to the integration process 14. The division auxiliary means formation process 16 makes it easy to divide the composite substrate by a division auxiliary part 17 installed in the ceramic wiring board 11, and a division auxiliary part 18 installed on a resin substrate 12 at the lower part of the division auxiliary part 17, which is smaller than the division auxiliary part 17. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing a composite substrate, and more particularly to a technique for dividing a child substrate formed on the composite substrate.

  Hereinafter, a conventional method for manufacturing a composite substrate and an electronic component manufactured thereby will be described. In FIG. 9A, reference numeral 1 denotes a ceramic wiring board on which four electronic circuits are formed. FIG. 9B is a cross-sectional view of the composite substrate 3 in which the resin substrate 2 is laminated on the lower surface of the ceramic wiring substrate 1. Here, similarly to the ceramic wiring substrate 1, the resin substrate 2 is also provided with four electronic circuits at corresponding positions. The ceramic wiring substrate 1 and the resin substrate 2 laminated in this way are integrated by being heated and pressurized in the next step. Then, in order to divide the integrated composite substrate 3 into sub-substrates 4a and 4b for each electronic circuit, the sub-substrate is formed by cutting vertically and horizontally using a dicer. At this time, since a large burden is generated on the blade of the dicer, breakage may occur during cutting. This is more likely to occur as the thickness of the composite substrate 3 increases. Moreover, in order to prevent heat generated between the dicer blade and the composite substrate 3 during cutting and to remove cutting waste, it is necessary to provide pure water during cutting. Furthermore, after that, a washing process and a drying process were necessary. Since the process (or user) for incorporating the divided sub board into the electronic apparatus is a separate process, the divided sub board must be transported. Therefore, a dedicated box for supplying the sub board is required from the composite board supplying process (or supplier) to the sub board using process (or user). For this reason, the boxing work for the special box is added, which takes time and cost, and significantly impairs the production efficiency.

The following technique is known as a technique for accurately dividing a child board formed on a composite board without using a special device such as a dicer (for example, see Patent Document 1). That is, when creating a composite substrate by anodic bonding of a glass substrate and a silicon substrate, a guide groove is provided in a corresponding portion of the bonding surface of each substrate, and both are bonded to provide a guide hole in the bonding portion. Further, a cutting groove for division is formed on the bottom of the substrate. The composite substrate can be divided by applying a predetermined external force. Alternatively, a composite substrate is formed by anodic bonding of a glass substrate and a silicon substrate, a guide groove penetrating the silicon substrate is formed by dry etching or dicing, and a cutting groove for division is formed at the bottom of the glass substrate corresponding to the guide groove Form. The composite substrate can be divided by applying a predetermined external force.
JP 2002-270543 A

  However, the configuration in which the guide holes are provided in the bonding surface in the above-described prior art is effective for a composite substrate in which a silicon substrate and a glass substrate are bonded, but has the following problems when applied to a composite substrate using a resin substrate. . When the resin substrates are bonded to each other or the resin substrate and the ceramic wiring substrate are bonded, the bonding is performed by applying pressure and heating using the adhesiveness of the resin substrates. Since the resin substrate has thermosetting properties, the heat treatment causes deformation and crushing of the guide holes, and cannot serve as an original guide. For this reason, there is a problem that the direction of the crack cannot be induced at the time of division and the division strength is increased, so that the sub board cannot be divided or the sub board cannot be divided with high accuracy. Also, in the method of dividing using the guide groove and the dividing groove, the resin substrate is more sticky than the glass substrate or silicon substrate, so that cracks occur in an unexpected direction and the child substrate cannot be divided accurately. was there.

  SUMMARY OF THE INVENTION Accordingly, the present invention has been made to solve such problems, and an object of the present invention is to provide a method of manufacturing a composite substrate that can divide a child substrate easily and accurately.

  In order to solve the above-described conventional problems, a composite substrate manufacturing method of the present invention includes a ceramic wiring substrate, a stacking step of stacking a resin substrate below the ceramic wiring substrate, and the ceramic wiring substrate and the resin substrate. An integration step of forming a bonded composite substrate, and a split auxiliary portion forming step of forming a split auxiliary portion for dividing the composite substrate into a plurality of substrates, the split auxiliary portion forming step comprising: Forming a first division auxiliary portion on the ceramic wiring substrate and forming a second division auxiliary portion smaller than the first division auxiliary portion on the resin substrate below the first division auxiliary portion. It is characterized by.

  Further, the first division assisting portion is formed by a groove whose depth reaches at least the surface of the resin substrate, and the second division assisting portion is formed by a continuous small hole. .

  Further, the first division assisting portion is formed by a groove whose depth reaches at least the surface of the resin substrate, and the second division assisting unit is formed by a V-shaped groove.

  Further, the distance from the center to the end of the groove of the first division assisting portion is longer than the thickness of the ceramic wiring board.

  Further, a laminating step of disposing a first ceramic wiring substrate and a resin substrate below the first ceramic wiring substrate, and further laminating a second ceramic wiring substrate below the resin substrate, and the first ceramic An integration step for forming a composite substrate in which the wiring substrate, the resin substrate, and the second ceramic wiring substrate are bonded and integrated, and a division for forming a dividing auxiliary portion for dividing the composite substrate into a plurality of substrates An auxiliary portion forming step, wherein the division auxiliary portion forming step forms the first division auxiliary portion on the first and second ceramic wiring boards and corresponds to the first division auxiliary portion. A second split auxiliary portion smaller than the first split auxiliary portion is formed on the resin substrate.

  Further, the first division assisting portion is formed by a groove whose depth reaches at least the surface of the resin substrate, and the second division assisting portion is formed by a continuous small hole. .

  Further, the first division assisting portion is formed by a groove whose depth reaches at least the surface of the resin substrate, and the second division assisting unit is formed by a V-shaped groove.

  Further, the distance from the center to the end of the groove of the first division assisting portion is longer than the thickness of the ceramic wiring board.

  As described above, according to the present invention, after the integration step of bonding and integrating the ceramic wiring substrate and the resin substrate, there is a division assisting means forming step for dividing each of the plurality of electronic circuits. The division auxiliary means forming step includes a first division auxiliary portion provided on the ceramic wiring substrate and a lower portion of the first division auxiliary portion, which is provided on the resin substrate and the first division. This is a method of manufacturing a composite substrate in which a second division auxiliary part smaller than the auxiliary part is formed, and since a division auxiliary means forming step is provided, it is easy to divide each sub board without using a large division device. can do.

  In addition, since the first division auxiliary part formed on the ceramic wiring board is larger than the second division auxiliary part formed on the resin substrate, even if the divided child board falls, the ceramic wiring board The impact is applied to the side surface of the resin substrate that protrudes compared to the side surface, and the ceramic wiring substrate is not cracked.

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 shows a method of manufacturing a composite substrate according to a first embodiment of the present invention. In FIG. 1, reference numeral 11 denotes a fired ceramic wiring substrate. The ceramic wiring substrate 11 includes a plurality of electronic circuits formed thereon. It is formed as an assembly of child boards. Details of this will be described in Example 6. Reference numeral 12 denotes a resin substrate made of a thermosetting resin. The resin substrate 12 is also formed on the resin substrate 12 as an assembly of child substrates including electronic circuits corresponding to the child substrates on the ceramic wiring substrate 11. These ceramic wiring substrate 11 and resin substrate 12 are laminated in a lamination step 13. Then, the ceramic wiring substrate 11 and the resin substrate 12 laminated in the lamination step 13 are integrated by heating and pressurizing in the integration step 14. At this time, the heating temperature is preferably 150 to 260 ° C., and the pressure is preferably 10 to 200 kg per square centimeter. More preferably, the heating temperature is 150 to 200 ° C., and the pressure is about 30 kg per square centimeter. This is because, within this range, even if there is an electronic component connected by soldering on the ceramic wiring substrate 11, the connected solder does not remelt.

  In this way, the laminated substrate 15 integrated in the integration step 14 is formed with a division auxiliary means in the next division auxiliary means forming step 16. This division assisting means forming step 16 is central to the present invention. First, in the division auxiliary means forming step 16, the division auxiliary portion 17 for dividing the sub board 20a and the other sub board 20b of the ceramic wiring board 11 is formed. Next, the division assisting part 18 that divides the child substrate 20a of the resin substrate 12 and the other child substrate 20b is formed. Specific examples of this division assisting process are described in detail in Examples 2 to 5. What is important here is that the division assisting portion 18 is smaller than the division assisting portion 17. As a result, the stress applied to the division assisting portion 18 of the resin substrate 12 when it is divided into the sub-substrates 20a and 20b in the next division step 19 can be relaxed, and unnecessary stress can be prevented from being applied to the ceramic wiring substrate 11. It is possible to prevent the daughter board from being damaged. In addition, the child substrate can be separated from the composite substrate by applying a force in any direction regardless of the ceramic wiring substrate side direction or the resin substrate side direction.

  As described above, in the first embodiment, since the division assisting means forming step 16 is provided, the sub-boards 20a and 20b can be divided easily and accurately by the user or the like without using a dedicated device such as a dicer. be able to.

  Further, since the dividing auxiliary portion 17 formed on the ceramic wiring substrate 11 is larger than the dividing auxiliary portion 18 formed on the resin substrate 12, even if the divided child substrates 20a and 20b fall, the ceramic wiring An impact is not applied to the side surface 12a of the resin substrate 12 protruding compared to the side surface 11a of the substrate 11, and the ceramic wiring substrate 11 is not broken.

  FIGS. 2A and 2B are a plan view and a cross-sectional view of the division assisting means forming step 16 in the second embodiment. The other steps are the same as those in the method for manufacturing the composite substrate in the first embodiment, and a description thereof will be omitted. 2A and 2B, reference numeral 21 denotes a groove having a concave cross section corresponding to the division assisting portion 17 of the first embodiment, and the depth reaches the surface of the resin substrate 12. In the present embodiment, the division assisting portion 17 was diced several times using a dicer blade width of 0.5 mm to form a desired division width. Alternatively, it may be formed using a general method such as a grinder. Moreover, 22 is a small hole corresponding to the division | segmentation auxiliary | assistant part 18 of Example 1, and is formed continuously. In this embodiment, a drill is used to form the division assisting portion 18. In addition, it can be formed using a general method such as punching with a mold. The distance between the centers of the small holes 22 is suitably about three times the radius of the child hole 22. If this interval is increased, it will be difficult to break, so that it will be difficult to divide the sub-board, and if it is reduced, it will be easy to break, so care must be taken when handling the composite substrate.

  Further, the width 21 a of the bottom surface of the groove 21 is preferably at least twice the thickness 11 b of the ceramic wiring substrate 11. In order to obtain the child substrate, it is necessary to apply stress to the composite substrate. However, if the width 21a of the groove 21 is narrow, it is necessary to apply stress to the resin substrate side. In this case, if stress is applied to the ceramic wiring board side, the corner of the side surface 11a of the ceramic wiring board 11 hits and breaks at the time of division. Furthermore, since the stress applied to the division assisting portion 18 of the resin substrate 12 when the child substrate is divided can be relaxed and unnecessary stress can be prevented from being applied to the ceramic wiring substrate 11, damage to the child substrate can be prevented. In the second embodiment, since the division assisting portions 17 and 18 are formed by the grooves 21 and the small holes 22, no division waste is produced when the composite substrate is divided.

  FIGS. 3A and 3B are a plan view and a cross-sectional view of the division assisting means forming step 16 in the third embodiment. Other steps are the same as those in the method of manufacturing the composite substrate in the first embodiment, and thus the description thereof is omitted. In FIGS. 3A and 3B, reference numeral 25 denotes a groove having a concave cross section indicating the division assisting portion 17 in the first embodiment, and the depth reaches the surface of the resin substrate 12. is there. Reference numeral 26 denotes a V-groove used as the auxiliary dividing portion 18 in the first embodiment, which is continuously formed. In this embodiment, a general V-grooving machine is used to form the division assisting portion 18. Further, the width 25a of the bottom surface of the groove 25 is larger than twice the thickness 11b of the ceramic wiring substrate 11. Thus, when the composite substrate is divided into the sub-substrates 20a and 20b, the corners of the side surface 11a of the ceramic wiring substrate 11 do not hit and break. Furthermore, when the sub board is divided, the stress applied to the division assisting portion 26 of the resin board 12 can be relaxed and unnecessary stress can be prevented from being applied to the ceramic wiring board 11, so that the sub board can be prevented from being damaged. Moreover, since the division | segmentation auxiliary | assistant parts 17 and 18 are formed of the groove | channel 25 and the V-groove 26, when a composite substrate is divided | segmented, a division | segmentation waste does not come out.

  FIG. 4 shows an example in which a ceramic wiring substrate 11 is further laminated below the resin substrate 12. This division auxiliary part of the ceramic wiring board is the same as the division auxiliary part of the ceramic wiring board 11 laminated above the resin substrate 12. By stacking in multiple layers in this way, the electronic circuit packaging density per unit area can be improved. Also in this case, the width of the upper and lower ceramic wiring board 11 auxiliary parts of the resin substrate 12 is wider than the width of the resin substrate 12 auxiliary auxiliary part 12 and more than twice the thickness of the ceramic wiring board. When dividing into the sub-boards, the ceramic wiring boards 11 are not in direct contact with each other no matter which direction the force is applied. Therefore, there is no substrate crack at the time of division.

5 and 6 are cross-sectional views of the division assisting means forming step 16 in the fourth embodiment. The other steps are the same as those in the method for manufacturing the composite substrate in the first embodiment, and thus description thereof is omitted. In FIG. 5, reference numeral 27 denotes a groove corresponding to the groove 21 in the first embodiment. The depth of the groove 27 penetrates the ceramic wiring substrate 11 and reaches the inside from the surface of the resin substrate 12. Reference numeral 28 corresponds to the small hole 22 in the first embodiment.
By making the groove 27 deeper than the thickness 11b of the ceramic wiring board 11 in this way, the ceramic wiring board 11 can be cut reliably. Therefore, when the groove 27 is divided into small boards 20a and 20b, cracks are formed on the side surface 11a side of the ceramic wiring board 11. Will not enter.
FIG. 6 shows an example in which the ceramic wiring substrate 11 is further laminated below the resin substrate 12 in which the grooves 27 are formed. By stacking in multiple layers in this way, the electronic circuit packaging density per unit area is improved.

  FIG. 7 is a plan view of the composite substrate 30. In the first to fourth embodiments, for convenience of explanation, the sub-board 20 has been described as an example of four pieces. In practice, however, more sub-boards are created. For example, FIG. 7 shows an example in which eight (8) vertical and five (5) horizontal auxiliary means are formed to form 28 (7 × 4 = 28) child boards 20. Reference numeral 31 denotes an alignment hole provided on a diagonal line of the composite substrate 30. Thus, the composite substrate 30 has a sheet shape. The composite substrate 30 is also integrated by laminating the ceramic wiring substrate 11 and the resin substrate 12.

  FIG. 8 is a perspective view of an electronic component (corresponding to the sub board 20) 35 formed by using the manufacturing method of the second embodiment. In this electronic component 35, 11 is a ceramic wiring board, and 12 is a resin board. The side surface 12 a of the resin substrate 12 that forms the electronic component 35 protrudes from the side surface 11 a of the ceramic wiring substrate 11. Further, the side surface 11a of the ceramic wiring substrate 11 is formed by dividing the groove 21 shown in the second embodiment, and the side surface 12a of the resin substrate 12 is formed by dividing the small hole 22. . Accordingly, in the sixth embodiment, the electronic component 35 can be easily formed without using a dicer since the holes are divided by the small holes 22.

  Further, since the side surface 12a of the resin substrate 12 protrudes from the side surface 11a formed on the ceramic wiring substrate 11, even if the electronic component 35 falls, it protrudes compared to the side surface 11a of the ceramic wiring substrate 11. The impact is not applied to the side surface 12a of the resin substrate 12 that is placed, and the ceramic wiring substrate 11 is not cracked.

  Furthermore, since the side surface 12a of the resin substrate 12 has a semicircular shape 36, when the resin substrate 12 is incorporated into an electronic device, the semicircular shape 36 can be used for locking. Further, the semicircle 36 may be plated and used as a side electrode.

  According to the composite substrate manufacturing method of the present invention, it can be easily divided into sub-substrates, so that it can be used for electronic devices and the like.

Process drawing of the manufacturing method of the composite substrate in Embodiment 1 of the present invention (A) is the top view of the division | segmentation auxiliary | assistant means formation process in Embodiment 2, (b) is the same sectional drawing. (A) is the top view of the division | segmentation auxiliary | assistant means formation process in Embodiment 3, (b) is sectional drawing same as the above. Sectional view in other examples Sectional drawing of the division | segmentation assistance means formation process in Embodiment 4 same as the above Sectional view in other examples The top view of the composite substrate in Embodiment 5 The perspective view of the electronic component in Embodiment 6 same as the above (A) is a plan view of a conventional dividing auxiliary means forming step (b) is a sectional view of the same.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Ceramic wiring board 12 Resin board 13 Lamination | stacking process 14 Integration process 16 Division | segmentation auxiliary | assistant formation process 17 Division | segmentation auxiliary | assistant part 18 Division | segmentation auxiliary | assistant part

Claims (8)

A laminating step of laminating a ceramic wiring substrate and a resin substrate below the ceramic wiring substrate;
An integration step of forming a composite substrate by bonding and integrating the ceramic wiring substrate and the resin substrate;
A division auxiliary part forming step of forming a division auxiliary part for dividing the composite substrate into a plurality of substrates;
In the division auxiliary portion forming step, a first division auxiliary portion is formed on the ceramic wiring board, and a second division auxiliary portion smaller than the first division auxiliary portion is provided below the first division auxiliary portion. A method of manufacturing a composite substrate, comprising forming the resin substrate. The said 1st division | segmentation auxiliary | assistant part is formed in the groove | channel where the depth reaches at least the surface of the said resin substrate, and the said 2nd division | segmentation auxiliary | assistant part is formed with a continuous small hole. A method for manufacturing a composite substrate. The said 1st division | segmentation auxiliary | assistant part is formed in the groove | channel where the depth reaches at least the surface of the said resin substrate, and the said 2nd division | segmentation auxiliary | assistant means is formed in a V-shaped groove | channel. A method of manufacturing a composite substrate. 2. The method of manufacturing a composite substrate according to claim 1, wherein the distance from the center to the end of the groove of the first division assisting portion is longer than the thickness of the ceramic wiring substrate. A laminating step of disposing a first ceramic wiring substrate and a resin substrate below the first ceramic wiring substrate, and further laminating a second ceramic wiring substrate below the resin substrate;
An integration step of forming a composite substrate in which the first ceramic wiring substrate, the resin substrate, and the second ceramic wiring substrate are bonded and integrated;
A division auxiliary part forming step of forming a division auxiliary part for dividing the composite substrate into a plurality of substrates;
In the division auxiliary part forming step, the first division auxiliary part is formed on the first and second ceramic wiring boards, and the first division is formed on the resin substrate corresponding to the first division auxiliary part. A method of manufacturing a composite substrate, comprising forming a second divisional auxiliary part smaller than the auxiliary part. The said 1st division | segmentation auxiliary | assistant part is formed in the groove | channel where the depth reaches at least the surface of the said resin substrate, and the said 2nd division | segmentation auxiliary | assistant part is formed with a continuous small hole. A method for manufacturing a composite substrate. The said 1st division | segmentation auxiliary | assistant part is formed in the groove | channel where the depth reaches at least the surface of the said resin substrate, and the said 2nd division | segmentation auxiliary | assistant means is formed in a V-shaped groove | channel. A method of manufacturing a composite substrate. 6. The method of manufacturing a composite substrate according to claim 5, wherein the distance from the center to the end of the groove of the first division assisting portion is longer than the thickness of the ceramic wiring substrate.

Images