JP2008016587A - Method of manufacturing ceramic laminated layer substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a ceramic laminated layer substrate by laminating a plurality of layers as ceramic green sheets, providing break grooves in the uppermost layer to form a laminate, and then baking the laminate to separate the laminate into pieces from the breaking grooves, which can make small and uniformize the degree of positional displacement due to the shrinkage of the laminate during the baking operation. <P>SOLUTION: The deeper the depth of breaking grooves is, the larger the positional displacement, caused by the shrinkage of a laminate during baking operation, is since it goes to the periphery of the laminate. Thus, breaking grooves B are formed so that ones of the breaking grooves B located at the periphery of the laminate 10 are shallower in depth than ones of the breaking grooves B located at the center of the laminate 10. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a ceramic laminated substrate in which a plurality of layers made of ceramic green sheets are laminated, break grooves are formed, then fired and divided through the break grooves.

  Conventionally, the general manufacturing method of this kind of ceramic laminated substrate is as follows. A plurality of layers made of ceramic green sheets such as alumina formed with a wiring pattern are laminated, and a cutting tool is applied to the outermost layer of the laminated body at a position to be divided to form a so-called break groove. Form.

  And after baking this laminated body, a bending force is applied to the said laminated body, a laminated body is parted along a break groove | channel, and the separated ceramic laminated substrate is manufactured (for example, patent documents 1-1). 4). Conventionally, the depth of the break groove for obtaining good splitting properties varies depending on the thickness of the substrate. For example, when the thickness of the substrate is 0.8 mm, it is about 0.15 to 0.35 mm.

  The green sheet is made by the doctor blade method. For example, an alumina sheet is obtained by mixing alumina powder, silica powder, a resin component, a solvent, and the like into a paste and processing it into a sheet by a doctor blade method. For this reason, in general, the volume of the green sheet shrinks due to the burning of the resin component and sintering of the ceramic powder during firing.

Here, it is known that the shrinkage at the time of firing of the green sheet is different between a coating direction when the green sheet is processed into a sheet shape and a width direction perpendicular thereto. Specifically, shrinkage is larger in the coating direction than in the width direction. As a countermeasure against this, a method of laminating green sheets is conventionally performed so that the coating direction of the green sheets is orthogonal between the sheets.
JP-A-5-75262 JP 2003-17851 A JP 2004-207592 A JP 2004-214540 A

  As described above, in the past, lamination was performed in consideration of the coating direction of the green sheet, and the shrinkage during firing was suppressed. It turns out that the problem by.

  FIG. 9 is a schematic cross-sectional view of a ceramic multilayer substrate that the inventor has made experimentally based on the above-described prior art, and shows a state before the multilayer substrate is divided. That is, the laminated substrate shown in FIG. 9 is obtained by firing a laminated body in which green sheets are laminated and break grooves B are formed.

  Here, the laminated body is formed by laminating ceramic layers 11 to 13 formed by firing an alumina green sheet, and the outermost layer 11 has a break groove B formed therein. A plurality of break grooves B are provided from the central part to the peripheral part in the laminate. The laminate is provided with a wiring pattern (not shown).

  And in the laminated body as such a prototype, the degree of positional deviation of the wiring pattern due to the shrinkage during firing was investigated. Specifically, as shown in FIG. 9, the positional deviation amount from the target value of the wiring pattern located at the distance x from the central portion was examined with the central portion of the laminate as a reference. Here, the target value of the wiring pattern is a position after the shrinkage when it is predicted that the shrinkage during firing is uniform in the entire laminate.

  The result is shown in FIG. In FIG. 10, the marks shown in the figure indicate the amount of positional deviation of the wiring pattern due to the difference in the depth of the break groove B. The groove depth is the depth of the break groove B in the fired laminate.

  As shown in FIG. 10, when the groove depth is 0, that is, when the break groove B is not formed, the entire stacked body contracts uniformly regardless of the distance x from the center of the stacked body. There is no problem because the deviation is almost zero. However, it has been found that as the depth of the break groove B increases, the displacement due to shrinkage during firing increases as the distance x from the center of the laminate increases.

  That is, the degree of shrinkage during firing changes depending on the depth of the break groove B, and the positional deviation of the wiring pattern becomes partially non-uniform. If the misalignment due to shrinkage during firing is uniform in the entire laminated substrate, that is, the entire laminate, it can be dealt with by predicting the misalignment in advance, but the degree of misalignment is partially uneven. Then, the effect of misalignment comes out.

  If the positional deviation is large, for example, when the conductive adhesive is supplied by printing, the printed conductive adhesive and the wiring pattern are misaligned, so that good electrical connection cannot be obtained. Further, depending on the degree of positional deviation, the distance between the conductive adhesive and the adjacent wiring pattern becomes narrow, and there arises a problem that insulation is impaired.

  In particular, according to the study by the present inventor, it has been found that the above-described problem of positional deviation becomes significant when the distance between adjacent break grooves B, that is, the pitch of the break grooves B is 30 mm or less.

  The present invention has been made in view of the above problems, and a plurality of layers made of ceramic green sheets are laminated, and after forming a laminate having a break groove on the outermost layer, the laminate is fired to break the break. In the manufacturing method of the ceramic laminated substrate divided | segmented through a groove | channel, it aims at making small and uniform the degree of the position shift by the shrinkage | contraction at the time of baking in the whole laminated body.

  In order to achieve the above object, according to the present invention, the depth of the break groove (B) located in the peripheral part of the laminated body (10) is larger than that located in the central part of the laminated body (10). The break groove (B) is formed so that the depth of the groove becomes shallower.

  As shown in FIG. 10 described above, the displacement due to shrinkage during firing increases as the depth of the break groove increases toward the periphery of the laminate. Therefore, if the depth of the break groove (B) is shallower in the peripheral portion than in the central portion of the laminated body (10), the entire laminated body (10) is formed. The degree of misalignment due to shrinkage during firing can be made small and uniform.

  In this case, if the break groove (B) is formed so that the depth of the break groove (B) becomes continuously shallower from the central part to the peripheral part of the laminate (10), the above-described FIG. It is more suitable for this tendency and is preferable.

  Furthermore, a split groove (20) in which a crack from the break groove (B) is induced when the laminate (10) is divided is formed in at least one of the inner layers (12) in the laminate (10). May be.

  According to this, by providing the split groove (20) inside the laminated body (10) corresponding to the break groove (B), the strength of the part to be divided is weakened. Since the laminated body (10) breaks while the cracks of (2) progress toward the dividing groove (20), it is possible to ensure stable splitting properties.

  Further, in this case, it is preferable to provide the dividing grooves (20) corresponding to the break grooves (B) located in the peripheral portion of the laminate (10). Since the break groove (10) located in the peripheral part of the laminated body (10) is shallower, it is difficult to break, but if the dividing groove (20) is provided, it becomes easy to break.

  In addition, the code | symbol in the bracket | parenthesis of each means described in the claim and this column is an example which shows a corresponding relationship with the specific means as described in embodiment mentioned later.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, parts that are the same or equivalent to each other are given the same reference numerals in the drawings in order to simplify the description.

(First embodiment)
FIG. 1 is a view showing a laminated body 10 after firing in the method for producing a ceramic laminated substrate 100 according to the first embodiment of the present invention, and FIG. 1A is a schematic view of the uppermost layer 11 side of the laminated body 10. A top view, (b) is a schematic sectional drawing along the AA dashed-dotted line in (a), (c) is a schematic diagram of the cross section cut along the break groove | channel B11 in (a).

  The manufacturing method of this embodiment forms the laminated body 10 shown in FIG. 1, and then divides the laminated body 10 along the breaking grooves B (B11 to B15, B21 to B25) for separation. The singulated ceramic laminated substrate 100 is manufactured.

  In FIG. 1, the laminated body 10 before division is shown, but the ceramic laminated substrate 100 corresponds to a portion divided with the break groove 20 as a boundary, as shown in FIG. 1. Specifically, in FIG. 1, 25 rectangular plate-shaped ceramic laminated substrates 100 partitioned by 5 × 5 break grooves 20 can be cut out.

  This manufacturing method is based on manufacturing the laminated body 10 as shown in FIG. First, the structure of the laminated body 10 will be described. In this example, the laminate 10 is obtained by laminating four layers 11 to 13 of ceramic layers 11, 12, 12, and 13 formed by firing ceramic green sheets.

  The ceramic layers 11 to 13 are produced by a general doctor blade method using alumina or the like, and are alumina sheets in this example. The thickness (refer FIG. 1A) of each ceramic layer 11-13 in this laminated body 10 is 0.1 mm-0.3 mm, Preferably, it is about 0.15 mm-0.25 mm.

  In the example shown in FIG. 1, the ceramic layers 11 to 13 are four layers, but the ceramic layers can be arbitrarily laminated in a range of, for example, about 3 to 8 layers. As in this example, when there are four layers, the thickness of each ceramic layer 11 to 13 in the laminate 10 can be set to 0.2 mm, for example.

  In addition, although it is preferable that the thickness of each ceramic layer 11-13 in the laminated body 10 is mutually the same, you may laminate | stack combining the ceramic layer of a different thickness. For example, in the case of five layers, the thickness may be 0.15 mm-0.15 mm-0.2 mm-0.15 mm-0.15 mm sequentially from one outermost layer side.

  Each ceramic layer 11 to 13 is formed with through holes (not shown) filled with a conductor material mainly composed of molybdenum or the like, and tungsten or the like as a main component, as in a general laminate. A wiring pattern (not shown) is formed by the conductive material. Note that an example of the wiring pattern in the laminate 100 is shown in FIGS. 3 and 4 showing a manufacturing method described later.

  Here, FIG. 2 is a figure which shows the lamination | stacking form which considered the coating direction Y of the ceramic layers 11-13 in the laminated body 10 of this embodiment. As described above, since the ceramic layers 11 to 13 are formed by firing a green sheet formed by the doctor blade method, the ceramic layers 11 to 13 are formed so as to have directivity in the coating direction Y.

  Therefore, the ceramic layers 11 to 13 have a difference in the degree of shrinkage between the direction along the coating direction Y and the width direction perpendicular thereto in the shrinkage during drying or firing. Therefore, also in this embodiment, when laminating green sheets as the ceramic layers 11 to 13 before firing, the green sheets are laminated so that the coating direction Y of the green sheets is orthogonal between the sheets.

  Here, as shown in FIG. 2, the ceramic layers 11 to 13 are laminated while changing the coating direction Y by 90 ° for each layer. By adopting such an alternately laminated structure with respect to the coating direction Y, it is possible to make the degree of shrinkage during firing uniform throughout the laminate 10 and to suppress the occurrence of warpage in the laminate 10 after firing as much as possible.

  A plurality of break grooves B (B11 to B15, B21 to B25) for dividing are formed in the uppermost outer layer 11 and the lower outermost layer 13 of the laminate 10. As will be described later, the break groove B is formed using a cutting tool or the like.

  As shown in FIG. 1B, in this example, the break groove B has a V-shaped groove shape, and the depth of the break groove B in the laminated body 10 is, for example, 0.05 mm to 0.00 mm. 1 mm, and the tip angle of the V-shaped is about 10 ° to 15 °.

  Moreover, the laminated body 10 of this example forms a rectangular plate shape of 80 mm □ (a square plate having a side of 80 mm) in which four layers of ceramic layers 11 to 13 each having a thickness of 0.2 mm are laminated, and as described above. Here, 5 × 5 break grooves B are provided. Thereby, the distance between the adjacent break grooves B, that is, the pitch of the break grooves B is set to 30 mm or less.

  Specifically, as shown in FIG. 1 (a), five break grooves B11 to B15 in the lateral direction from the central part to the peripheral part in the laminate 10 and five break grooves in the vertical direction. B21 to B25 are provided. In the laminate 10, the break groove B of the uppermost outermost layer 11 and the break groove B of the lowermost outermost layer 13 are at the same position as viewed in plan.

  In the present embodiment, the break groove B is formed so that the depth of the break groove B located in the peripheral part of the laminated body 10 is shallower than that located in the central part of the laminated body 10. B is formed.

  Specifically, in the cross section shown in FIG. 1B, when the five break grooves B11 to B15 arranged in the lateral direction are viewed, the break groove B11 located at the center of the stacked body 10 is deepest, The break grooves B12 and B14 located adjacent to the peripheral part from the central break groove B11 are the second deepest, and the break grooves B13 and B15 closest to the peripheral part are the shallowest.

  Here, as shown in FIG. 1 (b), the depth of the break groove B located in the peripheral portion of the laminated body 10 is shallower than the break groove B located in the central portion of the laminated body 10. For example, one break groove B may have the same depth as a whole.

  However, in the present embodiment, the configuration in which the groove depth of the break groove B located in the peripheral part of the laminated body 10 is shallower than that located in the central part of the laminated body 10 is the break groove B. This means that even one break groove B may have such a partial change in groove depth.

  Therefore, in the present embodiment, as a more preferable form, as shown in the cross section of FIG. 1C, even when one break groove B <b> 11 is viewed, the portion located in the central portion of the stacked body 10 is changed to the peripheral portion. As you go, it is continuously shallow. The other break grooves B are also made shallower continuously from the central part to the peripheral part of the laminate 10 as in FIG. 1C.

  That is, in the present embodiment, as shown in FIG. 1A, the depth of each break groove B from the center point C0 of the laminated body 10 to the periphery as shown by the broken circles C1 and C2 in the figure is As it goes to the club, it becomes shallower concentrically and continuously. Specifically, as the distance from the center point C0 increases, the groove depth is reduced in proportion to the distance.

  For example, the groove depth is 0.25 mm at the center point C0 in FIG. 1A, the groove depth is 0.15 mm at the portion of the break groove B that overlaps the line of the broken circle C1 on the outside, The groove depth is 0.1 mm at the portion of the break groove B that overlaps the outer broken line circle C2.

  Then, in the region between the center point C0 and the broken circle C1, and the region between the broken circle C1 and the broken circle C2, the distance from 0.25 mm to 0.15 mm and 0.15 mm, respectively, toward the periphery. From 0.1 mm to 0.1 mm, the groove depth is decreased in proportion to the distance, and the groove depth is set to 0.1 mm in the region outside the broken line circle C2. In the peripheral part of the laminated body 10, a minimum groove depth is ensured in order to ensure separation.

  Next, the manufacturing method of this embodiment will be described. Note that this manufacturing method is based on an alumina laminated wiring board using a general green sheet made of alumina, and pressurizing / firing conditions are based on this. 3 and 4 are process diagrams showing the present manufacturing method, and FIG. 5 is a process diagram showing a method of forming the break groove B with the blade 200 in the present manufacturing method.

  First, the ceramic layers 11-13 as each green sheet produced by the doctor blade method are prepared (refer Fig.3 (a)). Next, the through holes 14 are formed in the ceramic layers 11 to 13 using a mold or the like (see FIG. 3B). Next, the conductive material 15 is filled in the through holes 14 by a printing method or the like with respect to the ceramic layers 11 to 13 in which the through holes 14 are thus formed (see FIG. 3C).

  And after filling the through hole 14 with the conductor material 15, the conductor material 16 is provided to the surface of each ceramic layer 11-13 by a printing method etc. (refer FIG.3 (d)). These conductor materials 15 and 16 are provided on the surface and inside of the laminated body 10 to form the wiring pattern described above. As described above, the conductor materials 15 and 16 are made of materials mainly composed of molybdenum, tungsten, or the like.

  Subsequently, the ceramic layers 11 to 13 are laminated as shown in FIG. 1 and pressed to form the laminated body 10 (see FIG. 3E). Here, the pressurizing condition can be a load of about 30 kg to 70 kg, for example. In addition, the laminated body 10 formed at this process is a thing before forming the break groove | channel B and before baking.

  Thereafter, a break groove B is formed in the outermost layers 11 and 13 in the laminate 10 composed of the laminated ceramic layers 11 to 13. A method of forming the break groove B using the cutting tool 200 will be described with reference to FIG.

  As shown in FIGS. 5A and 5B, the cutting tool 200 is bitten while pressing the cutting tool 200 whose tip is set at an arbitrary angle to spread the uppermost layer 11 on the upper side of the laminate 10. Go. Thereafter, when the cutting tool 200 is removed from the outermost layer 11, a break groove B is formed in the outermost layer 11.

  At this time, in the present embodiment, the break groove B located in the peripheral part of the laminated body 10 is smaller in depth than the one located in the central part of the laminated body 10, and the break groove B The break groove B is formed so that the depth of the groove B becomes continuously shallower from the central part to the peripheral part of the laminate 10.

  Specifically, at this time, in the laminated body 10 after firing shown in FIG. 1, the break grooves B are formed with a certain degree of contraction so that the depth of each break groove B becomes the dimension of the above-described example. To do.

  Further, in the break groove B, the configuration in which the groove depth is partially changed as described above can be easily formed by using the cutting tool 200 whose shape is adjusted so that the amount of biting is partially changed. In the present embodiment, the break groove B is similarly formed on the outermost layer 13 on the lower side of the laminate 10 by using the blade 200 in the same manner.

  By firing the laminated body 10 in which the break grooves B are formed in this way, as shown in FIG. 4A, the fired laminated body 10 in the present embodiment is completed. This firing is performed at a temperature of about 1600 ° C. in a reducing atmosphere such as hydrogen.

  And the following processes are performed with respect to the baked laminated body 10 as needed. For example, as shown in FIG. 4B, a plating film 17 is formed on the wiring pattern located on the surface of the outermost layers 11 and 13 of the fired laminate 10. This plating film 17 is performed for the purpose of, for example, securing wire bondability and solderability.

  For example, this plating film 17 is electroless Cu plating, and a film thickness is 2.0-8.0 micrometers. Furthermore, electroless Au plating may be formed on the Cu plating. The film thickness of the electroless Au plating is preferably 0.01 to 0.1 μm.

  Although not shown, a functional thick film body such as a resistor is provided on the fired laminated body 10, mounting components such as an IC chip and a capacitor are mounted, and wire bonding is performed. Do as needed. Thereafter, the fired laminated body 10 is divided along the break grooves B, whereby the ceramic laminated substrate 100 that is separated into individual pieces is obtained.

  As a method of dividing the laminated body 10 along the break groove 20, a method using a pin (not shown) can be adopted as in the conventional case. Briefly, the pin is pressed against the end of the break groove B, and the laminate 10 is bent and deformed with the pin as a base point, thereby concentrating tensile strain on the break groove B, and mechanically laminating the laminate 10. It breaks and divides.

  By the way, as shown in FIG. 10 above, according to the study of the present inventor, the displacement due to the shrinkage of the laminated body during firing increases as the depth of the break groove B increases toward the periphery of the laminated body. growing.

  Therefore, when the depth of the break groove B is shallower in the peripheral portion than in the central portion of the multilayer body 10 as in the manufacturing method of the present embodiment, the multilayer body 10 is reduced. The degree of positional deviation due to shrinkage during firing can be made small and uniform throughout.

  In particular, in the present embodiment, the break groove B is formed so that the depth of the break groove B continuously decreases from the central part to the peripheral part of the laminated body 10, and the tendency shown in FIG. It is more effective because it is more relevant.

  For example, in the example in which the groove depths at the center point C0 and the broken line circles C1 and C2 in FIG. 1A are 0.25 mm, 0.15 mm, and 0.1 mm, respectively, the displacement due to shrinkage during firing is The overall thickness of the laminate 10 was 0.1 mm or less, and it was possible to achieve a level that has no problem in practice.

  Moreover, in the manufacturing method of this embodiment, the green sheet coating direction Y is laminated between sheets, and the shrinkage direction during firing is made as uniform as possible. Here, since the shrinkage during firing is greater in the coating direction Y than in the width direction, the depth of the break groove B formed in parallel with the coating direction Y of the outermost layers 11 and 13 is relatively shallow. The shrinkage difference of the laminate 10 may be adjusted by increasing the depth of the break groove B perpendicular to the coating direction Y.

  For example, in the laminate 10 shown in FIG. 1, when the coating direction Y of the outermost layer 11 is a direction parallel to the break groove B11, the depth of the break grooves B11 to B15 parallel to the coating direction Y The depth is made shallower than the break grooves B21 to B25 orthogonal to these. As a ratio of the depth, for example, the deeper one is about 1.3 to 1.5 times the shallower one.

(Second Embodiment)
FIG. 6 is a view showing the laminated body 10 after firing in the method for manufacturing the ceramic laminated substrate 100 according to the second embodiment of the present invention, and FIG. 6A is a schematic view of the uppermost layer 11 side of the laminated body 10. A top view and (b) are schematic sectional drawings in alignment with the DD dashed-dotted line in (a).

  In the first embodiment, when the depth of the break groove B is shallow (for example, 0.15 mm or less), in some cases, the laminate does not break along the break groove B when dividing the substrate. It may not be obtained.

  In the present embodiment, in consideration of such points, the split groove 20 in which a crack from the break groove B is induced when the laminate 10 is divided is formed in at least one of the inner layers 12 in the laminate 10. This is different from the manufacturing method of the above embodiment.

  Therefore, in the manufacturing method of this embodiment, in addition to the operational effects of the manufacturing method of the above-described embodiment, the operational effects of this dividing groove 20 are also exhibited. Hereinafter, the portion related to the dividing groove 20 will be mainly described.

  In the laminated body 10 shown in FIG. 6, the split groove 20 is formed at a position located immediately below the break groove B in one layer of the inner ceramic layer 12, here, the ceramic layer 12 immediately below the uppermost outermost layer 11. Is formed. That is, the break groove B and the dividing groove 20 are provided so as to overlap each other in the stacking direction of the stacked body 10.

  In this example, the division grooves 20 are provided corresponding to the break grooves B located in the peripheral portion of the stacked body 10. Moreover, as the division | segmentation groove | channel 20, the through-hole which penetrates the internal ceramic layer 12 may be sufficient, and the recessed part which does not penetrate may be sufficient, and the opening shape is not specifically limited. In the example of illustration, the division | segmentation groove | channel 20 is a through-hole whose opening shape makes a round hole shape.

  In the manufacturing method described with reference to FIGS. 3 and 4, such a dividing groove 20 is punched using a mold in the same manner as the through hole 14 in the step of forming the through hole 14 in the ceramic layer 12. It can be formed by doing. In addition, the shape of the division | segmentation groove | channel 20 can be easily changed by changing the shape of the said metal mold | die.

  Here, with regard to the position of the dividing groove 20, the distance m (see FIG. 6B) between the distal end portion of the break groove B where the crack should be induced and the dividing groove 20 is about 0.1 mm to 0.2 mm, for example. It is.

  Moreover, it is preferable that the width W (refer FIG. 6A) of the division | segmentation groove | channel 20 shall be about 0.05 mm-0.2 mm. This is determined by the variation in the distance between the break groove B and the split groove 20, and is a preferable dimension for guiding the crack generated from the tip of the break groove B to the split groove 20.

  Further, the length L of the dividing groove 20, that is, the length L along the break groove B in the dividing groove 20 (see FIG. 6A) is preferably about 0.05 to 2.0 mm. The reason why the length L of the dividing groove 20 is set to 0.05 mm or more is that the minimum dimension for preventing the dividing groove 20 from being crushed when the ceramic layers 11 to 13 are stacked, pressurized, and the laminated body 10 is fired. This is because it is about 0.05 mm.

  In addition, when the length L of the dividing groove 20 is larger than 2.0 mm, the ceramic layer in contact with the dividing groove 20 enters the dividing groove 20 in the above-described laminating process, and thereby the dent is easily generated in the ceramic layer. is there. For example, when the split groove 20 having a length L of 2.0 mm is used, the width W of the split groove 20 is preferably 0.1 mm or less.

  According to the manufacturing method of the present embodiment, the split groove 20 is provided in the laminated body 10 corresponding to the break groove B, so that the break groove B provided with the split groove 20 is laminated from the break groove B. The remaining thickness of the laminated body 10 in the portion toward the direction can be further reduced as compared with the case of the break groove B alone, and the strength of the portion can be reduced.

  And in the laminated body 10 after firing, which is generally hard and brittle, at the time of division, a crack from the break groove B located immediately above the division groove 20 progresses in the lamination direction toward the division groove 20. Be guided. Thus, since the laminated body 10 fractures | ruptures, in this embodiment, the stable parting property is securable.

  In particular, in the present embodiment, the dividing grooves 20 are provided corresponding to the break grooves B located in the peripheral portion of the stacked body 10. The break groove B located in the peripheral part of the laminated body 10 is shallower than the central part, and is harder to break. However, providing the dividing groove 20 makes it easier to break.

  In addition, if there exists the said effect, as a layer which provides the division | segmentation groove | channel 20, if it is the ceramic layer 12 inside the laminated body 10, you may provide in any layer not only in the example of illustration. Furthermore, you may provide in the some of the said ceramic layer 12 of the inside. Moreover, you may provide the division | segmentation groove | channel 20 about not only the break groove | channel B located in the peripheral part of the laminated body 10 like the example of illustration but the break groove | channel B located in the center part.

  Also in this embodiment, when the green sheets as the ceramic layers 11 to 13 before firing are laminated, the lamination can be performed so that the coating direction Y is orthogonal between the sheets. At this time, although not shown, the dividing groove 20 may be provided in the layer 12 having the same coating direction Y as the outermost layer 11 in which the break groove B is formed in the internal ceramic layer 12.

  According to this, since the outermost layer 11 in which the break grooves B are formed and the layer 12 in which the divided grooves 20 are formed, the degree of shrinkage at the time of firing and drying is substantially the same, the grooves B and 20 after firing. It can be expected to suppress the positional deviation.

(Other embodiments)
In each of the above embodiments, the shrinkage at the time of firing by the break groove B is measured in the same manner as that shown in FIG. The dimensions of the laminated body 10 before firing, the interval between the break grooves B, and the like may be determined so that the dimensions are as follows. Thereby, the displacement of the wiring pattern can be reduced.

  Further, if the width of the break groove B is wide, shrinkage during firing increases, and the positional deviation of the wiring pattern increases. Therefore, the width of the break groove B is preferably about 0.05 mm or less. In this case, the break groove B is narrowed during firing, and in some cases, the inner surfaces of the facing grooves may partially stick to each other.

  For this purpose, the cross-sectional shape of the break groove B is preferably U-shaped as shown in FIG. In this case, as compared with the break groove B having a V-shaped cross section shown in the above embodiment, the distance between the inner surfaces of the opposed grooves can be increased in the entire depth direction including the portion near the bottom.

  Further, in the case where the cross-sectional shape of the break groove B is the above-described V shape or U shape, if the groove depth is deep, the wiring pattern is likely to be displaced. In consideration of the above, as the break groove B, one as shown in FIG. 8 may be adopted.

  In the break groove B shown in FIG. 8, since the breakability is determined by the remaining thickness of the laminate, the width W is 1 and the depth P is 0.5 or less at the opening side. A narrow groove serving as a stress base point at the time of division is formed in the center of the bottom of the recess, and the total depth of the recess and the groove is the depth of the break groove B.

  Specifically, the recess having a depth P of 0.1 mm is formed with respect to a width W of 0.2 mm, and the groove having a depth Q of 0.05 mm is formed. By using such a break groove B, the displacement of the wiring pattern due to the break groove B is suppressed.

  Moreover, the break groove | channel B does not need to be formed in both the outermost layers 11 and 13 of the laminated body 10, and may be formed only in any one outermost layer. In this case, it is preferable to form the break groove B on the surface side to which a tensile bending force is applied when the laminated body 10 is divided among the outermost layers 11 and 13.

  In addition, if the break groove | channel B is provided in both the outermost surface layers 11 and 13 of the laminated body 10, ie, both front and back surfaces like the said embodiment, the shape of the front and back both surfaces of the laminated body 10 will become a symmetrical shape, and it becomes by baking shrinkage. This is preferable in terms of preventing warpage of the laminate 10.

  Further, the arrangement pattern of the break grooves B formed on the surface of the multilayer body 10 is not limited to the illustrated example, and various patterns are possible depending on the shape of the ceramic laminated substrate 100 after the division.

It is a figure which shows the laminated body after baking which concerns on 1st Embodiment of this invention, (a) is a schematic plan view of the uppermost layer side of the upper side in a laminated body, (b) is AA outline in (a). Sectional drawing (c) is a schematic sectional view along break groove B11 in (a). It is a figure which shows the lamination | stacking form which considered the coating direction of the ceramic layer in the laminated body of the said 1st Embodiment. It is process drawing which shows the manufacturing method of the said 1st Embodiment. It is process drawing which shows the manufacturing method following the said FIG. It is process drawing which shows the formation method by the cutter of a break groove | channel in the manufacturing method of the said 1st Embodiment. It is a figure which shows the laminated body after baking which concerns on 2nd Embodiment of this invention, (a) is a schematic top view of the uppermost surface layer side of this laminated body, (b) is DD in (a). It is a schematic sectional drawing. It is a schematic sectional drawing which shows the break groove | channel of U-shaped cross section as other embodiment of this invention. It is a schematic sectional drawing which shows another break groove | channel as other embodiment of this invention. It is a schematic sectional drawing which shows the laminated body after baking as a prototype which this inventor made as a prototype. It is a figure which shows the result of having investigated the relationship between the distance from the center part of a laminated body when the depth of a break groove was changed about the prototype of FIG. 9, and the position shift of a wiring pattern.

Explanation of symbols

10 ... Laminated body, 11, 12, 13 ... Ceramic layer, 20 ... Dividing groove,
B, B11 to B15, B21 to B25 ... break grooves.

Claims (4)

After forming a break groove (B) for cutting in the outermost layer (11, 13) in a laminate (10) formed by laminating a plurality of layers (11 to 13) made of ceramic green sheets, the laminate (10 In the method for manufacturing a ceramic multilayer substrate, the ceramic laminate substrate is manufactured by dividing the laminate (10) along the break groove (B).
The break groove (B) is formed so that the depth of the one located in the peripheral part of the laminate (10) is shallower than that located in the central part of the laminate (10). A method for manufacturing a ceramic laminated substrate, wherein the groove (B) is formed. The break groove (B) is formed so that the depth of the break groove (B) continuously becomes shallower from the center to the periphery of the laminate (10). The manufacturing method of the ceramic laminated substrate as described in any one of. A split groove (20) in which a crack from the break groove (B) is induced when the laminate (10) is divided is formed in at least one of the inner layers (12) in the laminate (10). The method for producing a ceramic laminated substrate according to claim 1 or 2. The said division groove (20) is provided corresponding to what is located in the peripheral part of the said laminated body (10) among the said break grooves (B), The manufacturing of the ceramic laminated substrate of Claim 3 characterized by the above-mentioned. Method.

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