WO2011049234A1

WO2011049234A1 - Substrate and method for manufacturing circuit device using same

Info

Publication number: WO2011049234A1
Application number: PCT/JP2010/068800
Authority: WO
Inventors: 雅彦水谷; 貞道高草木; 晴彦森; 隆也草部
Original assignee: 三洋電機株式会社; 三洋半導体株式会社
Priority date: 2009-10-21
Filing date: 2010-10-19
Publication date: 2011-04-28

Abstract

Provided are a substrate which is prevented from being bent during a transfer step, and a method for manufacturing a circuit device using the same. A substrate (10) is provided with a mounting substrate region (24) comprising a plurality of mounting substrates (12) disposed adjacent to each other, and a first support part (14) and a second support part (16) that are continuous with the plurality of mounting substrates (12). First separation grooves (30) are provided in boundary portions between the mounting substrates (12), and second separation grooves (32) are provided between the mounting substrates (12), and the first support part (14) and the second support part (16). By providing the first support part (14) and the second support part (16), the substrate (10) is prevented from being bent in the stage in which the substrate (10) is transferred.

Description

Substrate and method of manufacturing circuit device using the same

The present invention relates to a substrate and a method of manufacturing a circuit device using the substrate. In particular, the present invention relates to a substrate in which a plurality of mounting substrates are connected via a separation groove and a method of manufacturing a circuit device using the substrate.

When a circuit board is employed to form a circuit device, first, conductive patterns constituting a large number of units are formed on the upper surface of one large-sized substrate. Then, after connecting a circuit element to a conductive pattern, the method of isolate | separating each unit is conventionally employ | adopted (refer the following patent document 1).
A conventional circuit board and a method of manufacturing the same will be described with reference to FIG.
Referring to FIG. 8A, first, conductive patterns 104 forming a large number of units 106 are formed on the upper surface of large-sized substrate 100, and first grooves 108 and second grooves 110 are provided at the boundaries of each unit 106. .
The planar size of the large substrate 100 is such that a large number of units 106 are formed, and for example, a substrate made of aluminum having a thickness of about 1.5 mm is employed. The upper surface of such a large substrate 100 is covered with an insulating layer 102 made of a resin material.
A conductive pattern 104 patterned in a predetermined shape is formed on the upper surface of the insulating layer 102 by etching a conductive foil having a thickness of about several tens of μm. Here, the unit 106 is a unit element constituting one circuit device, and the conductive pattern 104 having the same shape is formed for each unit 106.
The first groove 108 is a groove formed from the upper surface of the large substrate 100 along the boundary of each unit 106, and has a V-shaped cross-sectional shape. Here, when the thickness of the substrate 100 is 1.5 mm, the depth of the first groove 108 is approximately 0.65 mm.
The second groove 110 is provided on the lower surface of the large substrate 100 in correspondence with the portion where the first groove 108 is formed. The width and depth of the second groove 110 are similar to those of the first groove 108.
Referring to FIG. 8B, next, circuit element 112 is electrically connected to conductive pattern 104 of each unit 106.
Referring to FIG. 8C, next, the large-sized substrate 100 is divided at a portion where the first groove 108 and the second groove 110 are provided, and is separated into each unit 106. In the region where the first groove 108 and the second groove 110 are provided, since the thickness of the substrate 100 is locally reduced, the large-sized substrate 100 can be easily separated in this region. A circuit device is manufactured by the method described above By doing this, it is possible to efficiently manufacture a large number of circuit devices.

JP 2003-318334 A

However, in the method of manufacturing the circuit device described above, there is a problem that the substrate 100 is bent in the middle of the manufacturing process.
Specifically, referring to each drawing of FIG. 8, there is a process of fixing the circuit element 112 to the large-sized substrate 100 to which a large number of units 106 are connected, and a process of electrically connecting the circuit element 112. It has been done. Furthermore, the transfer between each process is also performed on the large-sized substrate 100.
However, referring to FIG. 8A, since the first groove 108 and the second groove 110 are provided between the units 106, the units 106 are only connected by the remaining thickness portion. It is. For example, if the thickness of the substrate 100 is 1.5 mm and the depths of the first groove 108 and the second groove 100 are each 0.65 mm, the thickness of the substrate 100 is about 0.2 mm at the portion where the grooves are provided. It becomes. From this, the rigidity of the large-sized substrate 100 is weakened at the portion where the first groove 108 and the second groove 110 are provided, and there is a possibility that the substrate 100 may be bent from this portion in the transport process or the like.
If the large-sized substrate 100 is bent at the location where the

grooves

108 and 110 are provided, the circuit element 112 may not be properly mounted or connected, and a defect may occur.
The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a substrate in which bending of the substrate is suppressed in the middle of the transfer process and a method of manufacturing a circuit device using the substrate.

The present invention is a substrate in which a plurality of mounting substrates are connected via a separation groove, and the mounting substrate is configured by arranging a plurality of the mounting substrates of a predetermined shape provided with a conductive pattern on the main surface. A first separation groove provided by partially removing the substrate in the thickness direction along the boundary between the region and the adjacent mounting substrates, and the substrate along the side of the mounting substrate region A second separation groove partially removed in the thickness direction may be provided, and a support portion connected to a plurality of the mounting substrates via the second separation groove.
The method for manufacturing a circuit device of the present invention is a substrate in which a plurality of mounting substrates are connected via a separation groove, and a plurality of the mounting substrates having a predetermined shape provided with a conductive pattern on the main surface are provided adjacent to each other. And a first separation groove provided by partially removing the substrate in the thickness direction along the boundary between the adjacent mounting substrates, and the side edge of the mounting substrate region. Preparing a substrate including a second separation groove provided by partially removing the substrate in the thickness direction and a support portion continuous with the plurality of mounting substrates via the second separation groove A step of electrically connecting a circuit element to the conductive pattern of each mounting substrate, and separating the supporting portion from the side of the mounting substrate region at the location where the second separation groove is provided; The mounting boards are divided at the location where the first separation groove is provided. Characterized in that it comprises the steps of, a.

In the substrate of the present invention, the mounting substrate region is constituted of a plurality of mounting substrates connected by the separation groove, the first separation groove is provided between the mounting substrates, and the first separation groove is formed along the side of the mounting substrate region. 2 A separation groove is provided. And the support part continuous with a plurality of mounting boards is provided via the 2nd separation slot. By doing this, the plurality of mounting boards disposed inside the mounting board region is mechanically reinforced by the support portion. Therefore, in the middle of the manufacturing process, bending of the substrate at the portion where the first separation groove is provided is suppressed.

FIG. 1 is a view showing a method of manufacturing a substrate and a circuit device of the present invention, wherein (A) is a plan view and (B) is a perspective view.
FIG. 2 is a view showing a method of manufacturing a substrate and a circuit device of the present invention, (A) is a plan view, (B) and (C) are cross sectional views, and (D) is an enlarged plan view It is.
FIG. 3 is a view showing a method of manufacturing the circuit device of the present invention, in which (A) is a cross-sectional view and (B) is a plan view.
FIG. 4 is a view showing a method of manufacturing the circuit device of the present invention, (A) is a plan view, and (B) and (C) are cross-sectional views.
FIG. 5 is a view showing a method of manufacturing the circuit device of the present invention, and (A) and (B) are plan views.
FIG. 6 is a view showing a method of manufacturing the circuit device of the present invention, and (A) and (B) are cross-sectional views.
FIG. 7 is a plan view showing another configuration of the substrate of the present invention.
FIG. 8 is a view showing a method of manufacturing a circuit device in the background art, and (A)-(C) are cross-sectional views.

The substrate of the present embodiment and a method of manufacturing a circuit device using the substrate will be described with reference to FIGS. 1 to 6.
Referring to FIG. 1, first, with respect to a substrate (large-sized substrate is hereinafter referred to as a substrate) 10, separation grooves are formed at the boundaries between mounting substrates (substrates corresponding to respective units separated in a later step) 12 Carry out dicing processing for installation. FIG. 1A is a plan view showing the substrate 10 before this step, and FIG. 1B is a perspective view showing this step.
Referring to FIG. 1A, the substrate 10 is a metal substrate whose main component is aluminum or copper having a thickness of 1.0 mm or more and 2.0 mm or less (e.g., 1.5 mm). When aluminum is employed as the material of the substrate 10, both main surfaces are covered with a non-organic insulating film mainly made of an oxide film of Al. Furthermore, the upper surface of the substrate 10 is entirely covered with an insulating layer made of a resin filled with a filler, and a conductive pattern 18 is formed on the upper surface of the insulating layer. The non-organic insulating film may be omitted.
The substrate 10 is provided with a plurality of mounting substrates 12 elongated in the lateral direction on the paper surface. That is, each mounting substrate 12 is provided with two side sides opposed in the longitudinal direction and two side sides opposed in the lateral direction. Further, as an example of the size of the mounting substrate 12, the length in the lateral direction which is the longitudinal direction is about 20 cm, and the length in the longitudinal direction which is the short direction is about 0.6 cm. The mounting substrate 12 of this embodiment is, for example, one in which a plurality of LEDs are arranged in a row on the upper surface and used as a lighting device (for example, a backlight of a liquid crystal display).
The shape of the substrate is merely an example, and may be a quadrangular shape, and may not be a rectangular shape elongated in one direction. This is because LEDs can be applied in various parts such as backlights, home lighting, signals, car lights and the like. The rectangular shaped mounting substrate 12 is employed when it is disposed as a lighting device on the side of the LCD monitor. On the other hand, in the case of the entire backlight extending over the entire area of the monitor, the mounting substrate 12 having the same size as the monitor is employed.
The conductive pattern 18 has the same pattern shape for each mounting substrate 12 and is for electrically connecting the LEDs in a later step.
There are three main types of LEDs. The first is a package type sealed with a case, a mold or the like, and two terminals are extended to the outside. Therefore, it is comprised from the pad connected with this terminal, the wiring part which connects these pads, and the connection pad which functions as an external connection electrode in an edge part.
Then, another LED is a bare chip, and there is a first type with an anode and a cathode on the front surface, and a second type with an anode on the front surface (or back surface) and a cathode on the back surface (or front surface). Therefore, in the first type, both are connected by wires as shown in FIG. 4C, and in the latter, the LED back surface is connected to the island, and the wiring is extended from a part of this island. Then, the surface is connected through the bonding pad as shown in FIG. 4C, and extends from the bonding pad to the other wiring. In addition, when some circuits are formed in consideration of a drive system and protection, a pattern on which semiconductor elements other than passive elements and LEDs are mounted is formed.
Here, the mounting substrate area 24 is configured by arranging the five mounting substrates 12 elongated in the lateral direction on the paper surface. Although five mounting substrates 12 are shown here as an example, the number is not limited. Furthermore, they may be arranged in a matrix in the vertical and horizontal directions.
The first support portion 14 and the second support portion 16 are support portions that are continuous with the left and right sides (the short sides of the plurality of mounting boards 12) of the mounting board region 24, and the third support 34 and the fourth support The portion 36 is a support portion that is continuous with the upper and lower sides of the mounting substrate area 24 on the paper surface. These components have a function to prevent bending of the mounting substrate area 24 in the middle of the manufacturing process. Further, in the present embodiment, the first support portion 14, the second support portion 16, the third support portion 34, and the fourth support portion 36 constitute a frame-shaped support portion for mechanically supporting the mounting substrate region 24. There is.
The dicing line 20A is provided at the boundary between the first support portion 14 and the mounting substrate region 24, and the dicing line 20B is provided between the second supporting portion 16 and the mounting substrate region 24.
The dicing lines 22 are provided along the boundaries of the sides in the longitudinal direction of the mounting boards 12 with each other. Here, the dicing line 22 is provided continuously from the left end to the right end of the substrate 10, but the grooves formed along this line are the ones of the first support 14 and the second support 16. End on the way. This matter will be described later with reference to FIG. 2 (D).
In order to secure the bending strength over the entire surface, all of the

dicing lines

20A, 20B, and 22 may be terminated before the periphery of the substrate 10. That is, each separation groove provided along these dicing lines may terminate in front of the periphery of the substrate 10.
Referring to FIG. 1 (B), in this process, the substrate 10 is diced using the high-

speed cuttings

26 and 28 rotating. The cutting 26 forms a separation groove by grinding the substrate 10 from the upper surface of the substrate 10 along each dicing line. The cutting 28 grinds along the dicing lines from the lower surface of the substrate 10 to form separation grooves. Grinding by double cutting is simultaneously performed on the upper and lower surfaces of the substrate 10.
The dicing performed in this step is not to completely cut the substrate 10, but to form V-shaped separation grooves from both upper and lower main surfaces of the substrate 10 along the

dicing lines

20A, 20B and 22. is there. Therefore, even after the dicing in this step is performed, the substrate 10 is integrally held in the form of a sheet.
Here, in the above description, the separation grooves are formed from the upper and lower main surfaces along the dicing lines, but the separation grooves may be provided by dicing in only one of them. Further, the cutting may be a dicing apparatus employed to separate the wafers. Furthermore, the grooves may be provided separately in one grinding device, not simultaneously on both sides.
The configuration of the substrate 10 that has undergone the above steps will be described with reference to FIG. 2 (A) is a plan view showing the substrate 10 provided with the separation groove, FIG. 2 (B) and FIG. 2 (C) are cross-sectional views of the substrate 10, and FIG. It is a top view which expands and shows the area | region enclosed with the dotted line circle by A).
Referring to FIG. 2, separation grooves are formed along the dicing lines shown in FIG. 1 (A). Specifically, referring to FIG. 2A, first separation grooves 30 are provided along the boundaries in the lateral direction of each mounting substrate 12, and along the left and right sides of mounting substrate region 24. The second separation groove 32 is formed.
The first support portion 14 and the second support portion 16 are continuous with the left and right sides of the mounting substrate region 24 (sides in the lateral direction of the plurality of mounting substrates 12) via the second separation groove 32. . Further, the third support portion 34 and the fourth support portion 36 are provided with the upper and lower sides (sides in the longitudinal direction of the mounting substrate 12 disposed at the upper and lower ends) of the mounting substrate region 24 via the first separation groove 30. It is continuous.
Further, referring to FIG. 2C, the depth obtained by adding the depth of the second separation groove 32 formed from the upper surface and the depth of the second separation groove 32 formed from the lower surface is the thickness of the substrate 10 It is set shorter than. By doing this, the substrate 10 is not divided into the respective mounting substrates 12 from the location where the second separation groove 32 is provided, and the sheet-like state as a whole is maintained. The same applies to the first separation groove 30 as well.
Further, the first separation groove 30 formed in the first support portion 14 and the second support portion 16 has a shape which becomes gradually shallower toward the outer side (left side in the drawing). The reason for this is that the first separation groove 30 formed in the first support portion 14 is the end of the groove to be ground by a circular dicing blade. Therefore, the depth of the first separation groove 30 provided in the first support portion 14 and the second support portion 16 is provided between the mounting substrates 12 (inside the mounting substrate region 24 shown in FIG. 2A). It becomes shallower than the first separation groove 30.
In another expression, as shown in FIG. 2D, the end of the side of the substrate 10 is terminated. This structure improves the strength of the first support 14 and the second support 16. As a result, it is possible to prevent the upper side and the lower side from being bent with the first separation groove 30 as the center.
On the other hand, the second separation grooves 32 provided in the vertical direction on the paper surface may also be terminated before the side of the substrate. However, here, the upper end of the third support portion 34 is formed. By doing so, the formation of the separation groove is facilitated, and the separation of the first support portion 14 is facilitated.
The cross-sectional structure of the substrate 10 will be described in detail with reference to FIG. An insulating layer 38 having a thickness of about 50 μm is formed on the top surface of the metal substrate 10 made of aluminum or the like. The insulating layer 38 is made of a resin material such as an epoxy resin to which a filler made of granular alumina or the like is added to improve heat conduction. A conductive pattern 18 is formed on the top surface of the insulating layer 38 in a predetermined shape. The conductive pattern 18 is formed by selectively etching a conductive foil made of copper or the like attached to the upper surface of the insulating layer 38.
Although not shown, the upper surfaces of the conductive pattern 18 and the insulating layer 38 may be coated with a resist made of resin. The color of the resist may be white in order to efficiently reflect the light reflected from the light emitting element, or black in order not to reflect the color of the substrate on the light emitted.
On the other hand, in consideration of the deterioration of the white resist, the entire width may be occupied by the conductive pattern by providing a minimum separation width. Also, it may be filled with a dummy conductive pattern. In this case, the conductive pattern can be plated with Au, Ag, Ni or the like to make the substantially entire reflection region.
At the boundary of each mounting substrate 12, separation grooves are formed from the upper and lower surfaces of the substrate 10.
As described above, dicing in this step is performed at a depth that does not cause the substrate 10 to be divided. That is, the length obtained by adding the depth L21 of the first separation groove 30A and the depth L23 of the first separation groove 30B is shorter than the thickness of the entire substrate 10. For example, assuming that the thickness of the entire substrate 10 is 1.5 mm, the depth L21 of the first separation groove 30A is 0.6 mm to 0.7 mm, and the depth L23 of the first separation groove 30B is also 0.6 mm to 0 The thickness L22 of the portion not provided with both separation grooves is 0.3 mm to 0.1 mm. Further, in order to separate the mounting substrates 12 from each other easily in a later step, it is preferable that the thickness L22 be thin. For example, when L22 is 200 μm or less (particularly preferably 60 μm or less), this separation is favorably performed. I can do it.
Here, the depths of the first separation groove 30A and the first separation groove 30B may be the same, or one of them may be formed deeper than the other. Although each separation groove has a V-shaped shape on the drawing, the sectional shape of the separation groove may be other than that, for example, a square shape or a U-shape may be used. Furthermore, only one of the first separation groove 30A and the first separation groove 30B may be provided in the substrate 10.
Moreover, the above-mentioned matter is the same also regarding the 2nd separation groove 32 shown to FIG. 2 (A).
Referring to FIG. 3B, a plurality of substrates 10 having the above-described structure may be provided on a large substrate 40. Here, four substrates 10 are provided on a large substrate 40. Further, dividing lines shown by dotted lines are provided at the boundaries of the respective substrates 10, and separation grooves having the above-described configuration are provided in this part.
By doing this, by carrying out the process of forming the separation groove by dicing in the state where the plurality of substrates 10 are arranged, the entire large substrate can be diced collectively, and therefore the manufacturing cost can be reduced.
This device may be handed over to the user in the state of FIG. 3B or FIG. 2A by the board maker, and the user side may prepare the supplied board and mount the light emitting element thereafter. .
In the subsequent steps of mounting the light emitting element, etc., the large substrate 40 may be divided into the respective substrates 10 in accordance with the specifications of the manufacturing apparatus such as a bonder to be used. The subsequent steps may be performed with the state of the substrate 40.
The point of the present embodiment is to provide the first support portion 14 and the second support portion 16 which are continuous with the plurality of mounting substrates 12 via the second separation groove 32 with reference to FIG. 2 (A).
Specifically, first, the thickness of the remaining thickness portion L22 is, for example, about 200 μm to 60 μm at the boundary between the mounting substrates 12 as described above. Therefore, the rigidity of the boundary portion of each mounting substrate 12 is very weak, and the substrate 10 is easily bent at this boundary portion in the middle of the manufacturing process (in particular, the step of transporting the substrate 10). In particular, since the mounting substrate 12 has a rectangular shape elongated in the lateral direction on the paper surface, there is a high possibility that the substrate 10 may be bent by the first separation groove 30 provided at the boundary in the longitudinal direction. . In this case, circuit element mounting in the next process becomes difficult.
As a countermeasure, in the present embodiment, the first support portion 14 and the second support portion 16 are provided. Specifically, the first support portion 14 is continuous with the plurality of mounting boards 12 via the second separation grooves 32 at the left end of the mounting board region 24.
Furthermore, the second support portion 16 is continuous with the plurality of mounting boards 12 via the second separation grooves 32 at the right end of the mounting board region 24. By doing this, even if a bending stress that causes bending at the location of the first separation groove 30 acts on the substrate 10, the mounting substrate region 24 can be formed by the first support portion 14 and the second support portion 16. Being supported, bending due to this stress is suppressed. Also, even if the entire substrate 10 is temporarily bent, if the degree of this bending is within the range of the elastic deformation of the first support portion 14 and the second support portion 16, the substrate is released when the bending stress is released. 10 is flat.
Here, in the above description, the first support portion 14 and the second support portion 16 are provided at the places sandwiching the mounting substrate region 24 in the left-right direction, but only one of them may be provided. Even in this case, it is possible to support each mounting substrate 12 integrally.
Furthermore, as shown in FIG. 2D, although the first separation groove is formed in the first support portion 14, the first separation groove 30 is formed up to the end of the first support portion. It ends in the middle. Therefore, since the mechanical strength of the first support portion 14 is secured at the portion where the first separation groove 30 is not provided, each mounting substrate 12 is supported by the first support portion 14.
Furthermore, the depth of the first separation groove 30 provided in the first support portion 14 is shallower than the first separation groove 30 provided between the mounting substrates 12. In particular, the end portion of the first separation groove 30 has a shape that gradually becomes shallow toward the outside. From this, the mechanical strength of the first support portion 14 is secured.
Referring to FIG. 4, next, light emitting devices are mounted on each mounting substrate 12 as circuit elements. FIG. 4A is a plan view showing the substrate 10 which has undergone this step, FIG. 4B is a cross sectional view showing a mounting structure, and FIG. 4C is a cross sectional view showing another mounting structure. is there.
Referring to FIG. 4A, on each mounting substrate 12, pads formed of conductive patterns 18 are provided at equal intervals in the longitudinal direction, and the light emitting device 50 is connected to the pads. By performing the connection in this step, the plurality of light emitting devices 50 are connected in series on the upper surface of each mounting substrate 12.
A structure in which a light emitting device which is an LED is disposed on the substrate 10 will be described with reference to FIG. 4B. Here, the light emitting element is fixed to the upper surface of the substrate 10 in the state of the light emitting device 50 which is a package sealed with a resin.
The light emitting device 50 includes a mounting substrate 52, a light emitting element 62 mounted on the top surface of the mounting substrate 52, a reflection frame 56 fixed on the top surface of the mounting substrate 52 so as to surround the light emitting element 62, and a light emitting element 62. The configuration includes a sealing resin 58 for stopping and a conductive path 54 electrically connected to the light emitting element 62.
The mounting substrate 52 is made of a resin material such as glass epoxy resin or an inorganic material such as ceramic, and has a function of mechanically supporting the light emitting element 62. The light emitting element 62 and the reflection frame 56 are disposed on the top surface of the mounting substrate 52.
The reflection frame 56 is formed of a metal such as aluminum in a frame shape, and the inner side surface is an inclined surface located at the lower side than the upper side. Accordingly, light emitted laterally from the side surface of the light emitting element 62 is reflected upward at the inner side surface of the reflection frame 56.
The conductive paths 54 are routed from the upper surface to the lower surface of the mounting substrate 52. The conductive path 54 is electrically connected to the light emitting element 62 through the metal thin wire 60 on the upper surface of the mounting substrate 52. The conductive path 54 formed on the lower surface of the mounting substrate 52 is connected to the conductive pattern 18 formed on the substrate 10 via a bonding material 64 such as solder.
Referring to FIG. 4C, here, the light emitting element 62 is directly fixed to the upper surface of the substrate 10 in a bare chip state without being packaged. In this figure, the light emitting element 62 is disposed in the recess 70 in which the upper surface of the substrate 10 is recessed, but other configurations are also possible. For example, the light emitting element 62 may be fixed to the upper surface of the substrate 10 which is a flat surface, or the light emitting element 62 may be fixed to the upper surface of the island-shaped conductive pattern 18. The upper and lower surfaces of the substrate 10 are covered with

oxide films

66 and 68, respectively. The oxide film 66 and the insulating layer 38 are removed in the recess 70 and the periphery thereof.
Two electrodes (anode electrode and cathode electrode) are provided on the top surface of the light emitting element 62, and these electrodes are connected to the conductive pattern 18 via the metal thin wires 60. In addition, the light emitting element 62 is fixed to the bottom surface 74 of the recess 70 via the bonding material 76.
Next, referring to FIG. 5A, each support is separated from the substrate 10. Specifically, the substrate 10 is separated by the dicing line 20, and the first support portion 14 and the second support portion 16 are separated from the left and right sides (the end portions of the plurality of mounting substrates 12) of the mounting substrate region 24. Do.
When the mounting boards 12 are separated by bending at the dicing line 22 in the next step, the first supporting portion 14 and the second supporting portion 16 having high mechanical strength are kept continuous with the mounting board region 24 as follows: This turn becomes difficult. Therefore, both support portions are removed from the substrate 10 prior to the step of separating the mounting substrates 12 from each other. Further, since separation grooves are formed in the substrate 10 along the dicing lines 20 in the previous step, separation at this location can be easily performed. Also, the third support 34 and the fourth support 36 may be separated in this process as well. A specific separation method may be the same as the separation method described later with reference to FIGS. 6 (A) and 6 (B).
FIG. 5B shows the substrate 10 after the separation is completed. Here, the first support portion 14, the second support portion 16, the third support portion 34, and the fourth support portion 36 are separated from the mounting substrate area 24 and removed.
Next, referring to FIG. 6, the substrate 10 is separated into the mounting substrates 12. A method of separating each mounting substrate 12 can be considered by bending the substrate 10 at the boundary between the mounting substrates 12 or a cutting method using a sharp cutter.
A method of dividing each mounting substrate 12 by bending the substrate 10 will be described with reference to FIG. 6 (A). In this method, the substrate 10 is partially bent so that the portion where the left first separation groove 30A and the first separation groove 30B are formed on the paper surface becomes a fulcrum. The portions where the first separation grooves 30A and the first separation grooves 30B are formed are connected only by the thickness portion in which both grooves are not formed. The substrate 10 can be separated. Further, the side surface of the substrate 10 is held at the time of bending so that the electric circuit formed on the upper surface of the substrate 10 is not broken.
A method of dividing the substrate 10 by the circular cutter 84 will be described with reference to FIG. 6 (B). A disk-shaped round cutter 84 whose tip is sharpened is rotatably provided on the support 86. Then, by moving the support portion 86 while pressing the round cutter 84 against the first separation groove 30A, the remaining thickness portion of the substrate 10 between the first separation groove 30A and the first separation groove 30B is removed. There is.
Through the above steps, a circuit device having a configuration in which the light emitting device 50 is mounted on the mounting substrate 12 is manufactured. In the above process, only the light emitting element is mounted on the top surface of the mounting substrate 12, but a hybrid integrated circuit device may be configured in which other circuit elements such as transistors and ICs are incorporated on the top surface of the mounting substrate 12. good. Furthermore, the upper surface, the side surface, and the lower surface of the mounting substrate including the light emitting device 50 may be covered with a sealing resin by transfer molding or potting.
With reference to FIG. 7, the structure of the board | substrate 10A of the other form applicable to this form is demonstrated. The basic configuration of the substrate 10A is the same as that of the substrate 10A described with reference to FIG. 2, and the difference is that the shape of each mounting substrate 12 is different.
Specifically, the mounting substrate 12 included in the substrate 10A has a circular shape, and a portion where the mounting substrate 12 is not provided is formed as an opening 80 inside the mounting substrate region 24. The opening 80 is a region obtained by partially cutting the substrate 10A by pressing or router processing. In the drawings, this opening 80 is indicated by sparse hatching. The upper and lower end portions and the left and right end portions of each mounting substrate 12 form a continuous portion continuous with the adjacent mounting substrate 12 or supporting portion, and dicing

lines

22 and 20 correspond to the continuous portions. ing. The separation grooves as described above are provided in the portions of the dicing lines 20 and 22 (shown by dotted lines).

DESCRIPTION OF SYMBOLS 10 10A substrate 12 mounting substrate 14 first support portion 16 second support portion 18

conductive pattern

20, 20A, 20B dicing line 22 dicing line 24 mounting substrate region 26 cut 28 cut 28 cut 30, 30A, 30B first separation groove 32 second Separation groove 34 Third support portion 36 Fourth support portion 38 Insulating layer 40 Substrate 50 Light emitting device 52 Mounting substrate 54 Conductive path 56 Reflective frame 58 Seal resin 60 Metal fine line 62 Light emitting element 64 Bonding material 66 Oxide film 68 Oxide film 70 Recess 74 Bottom surface 76 Bonding material 80 Opening 84 Round cutter 86 Support

Claims

A plurality of mounting substrates connected via separation grooves,
A mounting substrate region configured by arranging a plurality of the mounting substrates of a predetermined shape provided with a conductive pattern on the main surface, and
A first separation groove provided by partially removing the substrate in the thickness direction along the boundary between the mounting substrates provided adjacent to each other;
A second separation groove provided by partially removing the substrate in the thickness direction along the side of the mounting substrate region;
And a supporting portion that is continuous with the plurality of mounting substrates via the second separation groove.
The first separation groove is provided continuously to the support portion,
The substrate according to claim 1, wherein the first separation groove provided in the support portion is shallower than the first separation groove provided between the mounting substrates.
3. The substrate according to claim 2, wherein the first separation groove provided in the support portion is shaped to be gradually shallow toward the outside.
4. The substrate according to claim 3, wherein the first separation groove provided in the support portion terminates midway in the support portion.
5. The substrate according to claim 4, wherein the first separation groove and the second separation groove are provided on both the first main surface and the second main surface of the substrate.
The substrate according to claim 5, wherein the first separation groove and the second separation groove have a V-shaped cross section.
The support portion may be a first support portion and a second support portion that are continuous with the lateral sides of the plurality of mounting boards, and the longitudinal side of the mounting board disposed at an end of the mounting board region. The substrate according to claim 6, comprising a third support and a fourth support which are continuous with the side.
8. The substrate according to claim 7, wherein a plurality of pads to which circuit elements are connected are provided on the mounting substrate along the longitudinal direction of the mounting substrate.
The substrate according to claim 8, wherein the mounting substrate has a rectangular shape.
9. The substrate according to claim 8, wherein an outer periphery of the mounting substrate has a curved shape, and an opening from which the substrate is partially removed is provided between the mounting substrates.
It is a substrate in which a plurality of mounting substrates are connected via a separation groove, and a mounting substrate region constituted by arranging a plurality of the mounting substrates of a predetermined shape provided with a conductive pattern on the main surface is adjacent The first separation groove formed by partially removing the substrate in the thickness direction along the boundary between the mounting substrates to be provided and the substrate in the thickness direction along the side of the mounting substrate region Preparing a substrate provided with a second separation groove which is provided by being removed and a support portion which is continuous with the plurality of mounting substrates via the second separation groove;
Electrically connecting a circuit element to the conductive pattern of each mounting substrate;
Separating the support portion from the side of the mounting substrate region at the location where the second separation groove is provided, and separating the mounting substrates at the location where the first separation groove is provided; A method of manufacturing a circuit device, comprising:
The method for manufacturing a circuit device according to claim 11, wherein, in the connecting step, the circuit element is fixed to the substrate in a state where the curvature is reduced by the support portion.
In the step of preparing the substrate, a plurality of substrate regions including the mounting substrate region and the support portion are provided on the substrate.
13. The method of manufacturing a circuit device according to claim 12, wherein the steps after the step of connecting are performed on the substrates divided into the substrate regions.
The method for manufacturing a circuit device according to claim 13, wherein in the connecting step, the plurality of circuit elements are arranged in a row along the longitudinal direction of the mounting substrate region.