JP6450096B2 - Optical device, semiconductor device, mounting structure of optical device, and manufacturing method of optical device - Google Patents

Description

  The present invention relates to an optical device, a mounting structure of the optical device, and a method for manufacturing the optical device.

  FIG. 1 shows a bottom view of a conventional optical device. An optical element (not shown) is arranged on the surface of the substrate 911 in the optical device 9A shown in the figure, and a back electrode 922 is formed on the bottom surface of the substrate 911. Among such optical devices 9A, there is a type of product in which a reflector case (not shown in FIG. 1) is bonded to the surface of the substrate 911 with an adhesive. When manufacturing an optical device of a type in which a case is bonded to a substrate, the case may be displaced in the direction Y with respect to the substrate. In such a case, if the case and the substrate 911 are diced on the basis of the case, the back electrode 912 is shifted from the desired position in the direction Y in the separated optical device 9A. The positional deviation of the back electrode 912 may cause a mounting deviation of the optical device 9A when the optical device 9A is mounted on the circuit board. A technique related to the optical device is disclosed in Patent Document 1, for example.

JP 2003-31854 A

  The present invention has been conceived under the circumstances described above, and it is a main object of the present invention to provide an optical device capable of avoiding the problem of mounting displacement.

  According to the first aspect of the present invention, a substrate having a main surface and a back surface facing away from each other, a wiring portion formed on the substrate, an optical element disposed on the main surface, and the optical element are accommodated And a frame portion disposed on the substrate, the back surface extending along a first direction, and the first direction and the thickness direction of the substrate. A first edge and a second edge spaced apart from each other in a second direction orthogonal to the first back pad, wherein the wiring portion includes a first back pad and a second back pad formed on the back surface. And the second back surface pad is spaced from each other in the first direction, and the first back surface pad and the second back surface pad are each formed from the first edge to the second edge. Is provided.

  Preferably, the first back surface pad has a first belt portion, the second back surface pad has a second belt portion, and both the first belt portion and the second belt portion are the first belt portion. It is a shape extending along two directions.

  Preferably, the first belt-like portion and the second belt-like portion are separated from each other in the first direction.

  Preferably, each of the first belt-like portion and the second belt-like portion is formed from the first edge to the second edge.

  Preferably, each of the back surfaces has a first side and a second side that extend along the second direction and are spaced apart from each other in the first direction, and the first belt-like portion is the first side. Located between a side and the second strip, the first strip is spaced from the first side, and the second strip is spaced from the second side.

  Preferably, a region sandwiched between the first belt-like portion and the first side in the back surface, and a region sandwiched between the second belt-like portion and the second side in the back surface are formed from the wiring portion. Exposed.

  Preferably, a first notch that is recessed from the first side and a second notch that is recessed from the second side are formed on the back surface, and the first back pad is formed of the first notch. The second back surface pad has a portion along the edge of the second notch.

  Preferably, the first back surface pad has a pair of first extending portions extending from the first belt-shaped portion along an edge of the first notch, and the pair of first extending portions is respectively The second back surface pad has a pair of second extending portions extending from the second belt-shaped portion along an edge of the second notch, and the pair of second extending pads. Each of the two extending portions reaches the second side.

  Preferably, the edge of the first notch and the edge of the second notch are both arcuate.

  Preferably, the imaginary straight line extending along the first direction is located at a position shifted from the center of the back surface in the second direction, and the imaginary straight line is the second most back surface pad in the first cutout. A straight line connecting a portion located on the side and a portion located closest to the first back surface pad in the second cutout.

  Preferably, the substrate has a first side surface facing one side in the second direction and a second side surface facing the opposite side to the first side surface, and the first side surface and the second side surface are either Is also flat.

  Preferably, the entire first side surface and the entire second side surface are both exposed from the wiring portion.

  Preferably, the substrate has a first end surface facing one of the first directions and a second end surface facing the opposite side of the first end surface, and the first end surface and the second end surface are either Is also flat.

  Preferably, the entire first end surface and the entire second end surface are both exposed from the wiring portion.

  Preferably, the substrate is formed with a first recess recessed from the first end surface and a second recess recessed from the second end surface.

  Preferably, the wiring portion includes a main surface electrode, a first connection electrode, and a second connection electrode, and the main surface electrode is formed on the main surface, and the main surface electrode includes the optical surface. An element is disposed, the first connection electrode electrically connects the main surface electrode and the first back surface pad, and the second communication electrode electrically connects the main surface electrode and the second back surface pad. ing.

  Preferably, the first connecting electrode is formed on the inner surface of the first recess, and the second connecting electrode is formed on the inner surface of the second recess.

  Preferably, a wire bonded to the optical element is further provided, and the main surface electrode includes a die bonding part to which the optical element is bonded and a wire bonding part to which the wire is bonded.

  Preferably, an element bonding layer interposed between the optical element and the wiring portion is further provided.

  Preferably, the element bonding layer is made of a conductive material.

  Preferably, the frame portion has an inner peripheral surface surrounding the optical element.

  Preferably, the inner peripheral surface is inclined with respect to the thickness direction of the substrate so as to be farther from the optical element in the thickness direction view as the distance from the substrate increases in the thickness direction of the substrate.

  Preferably, the frame portion has a top surface facing a direction from the back surface to the main surface in a thickness direction of the substrate, and the top surface has a frame shape.

  Preferably, the top surface has a first surface and a second surface that are spaced apart from each other in the second direction and extend along the first direction, and the optical element has the first surface in the thickness direction view. It is arrange | positioned between 1 surface and the said 2nd surface, and the dimension of the said 1st surface in the said 2nd direction is the same as the dimension of the said 2nd surface in the said 2nd direction.

  Preferably, the frame portion includes a first outer surface that is flush with the first side surface, and a second outer surface that is flush with the second side surface, the first outer surface and the first side surface. 2 The outer surface is flat.

  Preferably, the frame portion includes a third outer surface that is flush with the first end surface, and a fourth outer surface that is flush with the second end surface, and the third outer surface and the first outer surface. 4 The outer surface is flat.

  Preferably, the frame portion has a bottom surface facing the substrate.

  Preferably, the apparatus further includes a frame bonding layer that is interposed between the frame and the substrate and bonds the frame to the substrate.

  Preferably, the frame bonding layer is made of an insulating material.

  Preferably, a translucent resin portion that covers the optical element is further provided.

  According to a second aspect of the present invention, an optical device provided by the first aspect of the present invention, a circuit board, between the first back pad and the circuit board, and the second back pad and the There is provided a mounting structure of an optical device including a solder layer interposed between circuit boards.

  According to the third aspect of the present invention, a step of preparing a substrate, a step of forming a first back surface conductive layer and a second back surface conductive layer on the back surface of the substrate, and a plurality of openings on the main surface of the substrate A step of disposing a frame portion formed with, a step of disposing a plurality of optical elements on the main surface of the substrate, and a step of cutting and solidifying the substrate and the frame portion, The first back surface conductive layer and the second back surface conductive layer are separated from each other in a first direction and extend along a second direction perpendicular to the first direction and the thickness direction of the substrate, In the solidifying step, a method for manufacturing an optical device is provided in which a part of the first back surface conductive layer and a part of the second back surface conductive layer are cut along the first direction by a dicing blade. Is done.

  Preferably, in the step of arranging, the frame portion is bonded to the main surface of the substrate with an adhesive.

  Preferably, a plurality of through holes are formed in the substrate along the second direction.

  Preferably, in the solidifying step, a portion of the substrate between two through holes adjacent to each other in the second direction among the plurality of through holes is cut by the dicing blade.

  Preferably, before the solidifying step, a region sandwiched between the two through holes is exposed on the main surface of the substrate.

  Preferably, in the step of solidifying, between the two through holes adjacent to each other in the second direction among the plurality of through holes, from the midpoint of the two through holes to the second direction. The location on the substrate that has shifted is cut by the dicing blade.

  Preferably, in the step of solidifying, the substrate and the frame portion are cut based on the frame portion.

  Preferably, the method further includes a step of forming a main surface conductive layer on the main surface of the substrate, and in the step of disposing the plurality of optical elements, the plurality of optical elements are disposed on the main surface conductive layer.

  Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.

It is a bottom view of the conventional optical apparatus. It is a front view of the optical apparatus concerning 1st Embodiment of this invention. FIG. 3 is a plan view of the optical device shown in FIG. 2. It is sectional drawing which follows the IV-IV line of FIG. FIG. 3 is a bottom view of the optical device shown in FIG. 2. It is a bottom view of the optical apparatus concerning the modification of 1st Embodiment of this invention. It is a bottom view which shows 1 process of the manufacturing method of the optical apparatus concerning 1st Embodiment of this invention. It is sectional drawing which follows the VIII-VIII line of FIG. It is sectional drawing which follows the IX-IX line of FIG. FIG. 9 is a cross-sectional view showing a step subsequent to FIG. 8. FIG. 10 is a cross-sectional view showing a step subsequent to FIG. 9. FIG. 11 is a cross-sectional view showing a step subsequent to FIG. 10. FIG. 12 is a cross-sectional view showing a step subsequent to FIG. 11. FIG. 14 is a bottom view showing one process following FIG. 12 and FIG. 13. It is sectional drawing which follows the XV-XV line | wire of FIG. It is sectional drawing which follows the XVI-XVI line of FIG. It is a bottom view which shows 1 process of the manufacturing method of the optical apparatus shown in FIG.

  Hereinafter, embodiments of the present invention will be specifically described with reference to the drawings.

<First Embodiment>
A first embodiment of the present invention will be described with reference to FIGS.

  FIG. 2 is a front view of the optical device according to the first embodiment of the present invention. FIG. 3 is a plan view of the optical device shown in FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. FIG. 5 is a bottom view of the optical device shown in FIG.

  The optical device A1 shown in these drawings includes a base material 1, an optical element 4, a frame portion 6, an element bonding layer 71, a frame bonding layer 73, a translucent resin portion 77, and a wire 78. Prepare.

  As shown in FIGS. 2 to 5, the base material 1 includes a substrate 11 and a wiring part 12.

  The substrate 11 is for arranging the optical element 4. In the present embodiment, the substrate 11 has a rectangular shape. The substrate 11 is made of an insulating material. An example of such an insulating material is an insulating resin. An example of such an insulating resin is a glass epoxy resin. In the present embodiment, the first direction X and the second direction Y are defined as shown in FIG. The second direction Y is orthogonal to the first direction X and the thickness direction Z of the substrate 11.

  The substrate 11 includes a main surface 111, a back surface 112, a first side surface 113, a second side surface 114, a first end surface 115, and a second end surface 116. In the present embodiment, the main surface 111, the back surface 112, the first side surface 113, the second side surface 114, the first end surface 115, and the second end surface 116 are all flat.

  The main surface 111 and the back surface 112 face opposite to each other. Specifically, the main surface 111 faces one of the thickness directions Z of the substrate 11 (direction Z1). The back surface 112 faces the other one of the thickness directions Z of the substrate 11 (direction Z2).

  As shown in FIG. 5, the back surface 112 has a first edge 112A, a second edge 112B, a first side 112C, and a second side 112D.

  The first edge 112A and the second edge 112B each extend along the first direction X and are separated from each other in the second direction Y. The first side 112C and the second side 112D each extend along the second direction Y and are separated from each other in the first direction X. On the back surface 112, a first notch 112G and a second notch 112H are formed. The first notch 112G is recessed from the first side 112C. The second notch 112H is recessed from the second side 112D. Both the edge of the first notch 112G and the edge of the second notch 112H have an arc shape.

  The first side surface 113 faces one side in the second direction Y. The second side surface 114 faces away from the first side surface 113. The first end surface 115 faces one side in the first direction X. The second end face 116 faces away from the first end face 115.

  The substrate 11 is formed with a first recess 11G and a second recess 11H. The first recess 11 </ b> G is recessed from the first end surface 115. The second recess 11 </ b> H is recessed from the second end surface 116. The edge on the direction Z2 side of the first recess 11G constitutes the edge of the first notch 112G. An edge on the direction Z2 side of the second recess 11H constitutes an edge of the second notch 112H. Both the cross-sectional shape of the first recess 11G by a plane orthogonal to the thickness direction Z and the cross-sectional shape of the second recess 11H by a plane orthogonal to the thickness direction Z are arcuate.

  As shown in FIG. 5, in the optical device A1, the virtual straight line L1 extending along the first direction X overlaps the center C1 of the back surface 112 in the second direction Y. The virtual straight line L1 includes a portion that is located closest to the second back surface pad 122D (described later) in the first notch 112G and a portion that is positioned closest to the first back surface pad 122A (described later) in the second notch 112H. It is a straight line that connects. Unlike the present embodiment, the virtual straight line L1 extending along the first direction X is located at a position shifted from the center of the back surface 112 in the second direction Y, as in the optical device A1 ′ shown in FIG. In some cases.

  The wiring portion 12 shown in FIGS. 4 and 5 is formed on the substrate 11. The wiring portion 12 functions to supply power to the optical element 4. The wiring part 12 has a predetermined pattern shape in the thickness direction Z view. The pattern shape of the wiring part 12 can be changed as appropriate. The wiring part 12 is formed by plating. The wiring part 12 has a structure in which, for example, a Ni layer and an Au layer are stacked. The wiring part 12 is not formed on the first side surface 113, the second side surface 114, the first end surface 115, and the second end surface 116. That is. The first side surface 113, the second side surface 114, the first end surface 115, and the second end surface 116 are all exposed from the wiring portion 12.

  The wiring portion 12 includes a main surface electrode 121, a back surface electrode 122, a first connection electrode 12G, and a second connection electrode 12H.

  Main surface electrode 121 is formed on main surface 111. The optical element 4 is disposed on the main surface electrode 121. The main surface electrode 121 has a die bonding part 121A and a wire bonding part 121B. The optical element 4 is bonded to the die bonding portion 121A. A wire 78 is bonded to the wire bonding portion 121B.

  The back electrode 122 is formed on the back surface 112. The back electrode 122 includes a first back pad 122A and a second back pad 122D. The first back pad 122A and the second back pad 122D are separated from each other in the first direction X. Each of the first back pad 122A and the second back pad 122D is formed from the first edge 112A to the second edge 112B.

  The first back surface pad 122A has a first strip portion 122B and a pair of first extending portions 122C.

  The first strip portion 122B has a shape extending along the second direction Y. The first strip 122B is formed from the first edge 112A to the second edge 112B. The first strip portion 122B is separated from the first side 112C. A region R <b> 11 sandwiched between the first belt-like portion 122 </ b> B and the first side 112 </ b> C in the back surface 112 is exposed from the wiring portion 12.

  The pair of first extending portions 122C extends from the first strip portion 122B along the edge of the first cutout 112G. Each of the pair of first extending portions 122C reaches the first side 112C. In this way, the first back surface pad 122A has a portion along the edge of the first notch 112G.

  The second back surface pad 122D has a second strip portion 122E and a pair of second extending portions 122F.

  The second strip portion 122E has a shape extending along the second direction Y. The second strip portion 122E and the first strip portion 122B are separated from each other in the first direction X. Between the second strip portion 122E and the first side 112C, the first strip portion 122B is located. The second strip portion 122E is formed from the first edge 112A to the second edge 112B. The second strip portion 122E is separated from the second side 112D. A region R12 between the second belt-like portion 122E and the second side 112D in the back surface 112 is exposed from the wiring portion 12.

  The pair of second extending portions 122F extends from the second strip portion 122E along the edge of the second notch 112H. Each of the pair of second extending portions 122F reaches the second side 112D. In this way, the second back surface pad 122D has a portion along the edge of the second notch 112H.

  The first connection electrode 12G makes the main surface electrode 121 and the first back surface pad 122A conductive. In the present embodiment, the first connection electrode 12G is formed on the inner surface of the first recess 11G. The second connection electrode 12H makes the main surface electrode 121 and the second back surface pad 122D conductive. In the present embodiment, the second connection electrode 12H is formed on the inner surface of the second recess 11H.

  The optical element 4 shown in FIGS. 3 and 4 is disposed on the main surface 111, and specifically, disposed on the wiring portion 12 (the die bonding portion 121A in the main surface electrode 121). The optical element 4 is a light emitting element or a light receiving element. In the present embodiment, the optical element 4 is a light emitting element, for example, a bare chip LED. The bare chip LED has an n-type semiconductor layer, an active layer, and a p-type semiconductor layer. The n-type semiconductor layer is stacked on the active layer. The active layer is stacked on the p-type semiconductor layer. The active layer is located between the n-type semiconductor layer and the p-type semiconductor layer. The n-type semiconductor layer, the active layer, and the p-type semiconductor layer are made of, for example, GaN. The bare chip LED has two electrode pads (not shown).

  4 is in direct contact with both the optical element 4 and the wiring portion 12 (specifically, the wire bonding portion 121B in the main surface electrode 121). Thereby, the optical element 4 and the wiring part 12 are electrically connected.

  As shown in FIGS. 2 to 5, the frame portion 6 is disposed on the substrate 1. Specifically, each frame portion 6 is bonded to the substrate 11 via the frame bonding layer 73. In the present embodiment, the wiring portion 12 and the frame bonding layer 73 are interposed between the frame portion 6 and the substrate 11. As shown in FIG. 3, the frame 6 surrounds the optical element 4 when viewed in the thickness direction Z. The frame portion 6 is in direct contact with the frame portion bonding layer 73. The frame part 6 is in direct contact with the translucent resin part 77. In this embodiment, the frame part 6 also fulfills a function (a function as a reflector) that causes more light from the optical element 4 to travel in the direction Z1.

  The frame part 6 consists of white resin, for example. As white resin which comprises the frame part 6, a liquid crystal polymer or a polybutylene terephthalate is mentioned, for example. In addition, the material constituting the frame portion 6 may be a thermoplastic resin and a nylon resin mixed with titanium oxide. In this embodiment, the frame portion 6 is formed by mold molding. An example of such mold molding is an injection molding method.

  An opening is formed in the frame portion 6. The optical element 4 is accommodated in the opening of the frame portion 6. In the present embodiment, one optical element 4 is accommodated in the opening. Unlike the present embodiment, the number of optical elements 4 accommodated in the opening is not one but may be two or more. Unlike the present embodiment, a plurality of openings each surrounding the optical element 4 may be formed in the frame portion 6.

  The frame portion 6 includes an inner peripheral surface 61, a top surface 63, a bottom surface 67, a first outer surface 651, a second outer surface 652, a third outer surface 653, and a fourth outer surface 654. .

  As shown in FIGS. 3 and 4, the inner peripheral surface 61 defines an opening in the frame portion 6. The inner peripheral surface 61 surrounds the optical element 4. In the present embodiment, the inner peripheral surface 61 is inclined with respect to the thickness direction Z of the substrate 11 so as to move away from the optical element 4 in the thickness direction Z view as the distance from the substrate 11 increases in the thickness direction Z of the substrate 11. Yes. Unlike the present embodiment, the inner peripheral surface 61 may be erected along the thickness direction Z.

  The top surface 63 faces the direction from the back surface 112 toward the main surface 111 in the thickness direction Z of the substrate 11. In the present embodiment, the top surface 63 is flat. The top surface 63 has a frame shape. The top surface 63 has a first surface 631 and a second surface 632. The first surface 631 and the second surface 632 are separated from each other in the second direction Y and extend along the first direction X. The optical element 4 is disposed between the first surface 631 and the second surface 632 in the thickness direction Z view. The dimension of the first surface 631 in the second direction Y is the same as the dimension of the second surface 632 in the second direction Y. In the optical device A1 'shown in FIG. 6, the dimension of the first surface 631 in the second direction Y is the same as the dimension of the second surface 632 in the second direction Y.

  The first outer surface 651, the second outer surface 652, the third outer surface 653, and the fourth outer surface 654 face outward of the frame portion 6 as viewed in the thickness direction Z. The first outer side surface 651 is flush with the first side surface 113. The second outer surface 652 is flush with the second side surface 114. The third outer surface 653 is flush with the first end surface 115. The fourth outer surface 654 is flush with the second end surface 116. The first outer surface 651, the second outer surface 652, the third outer surface 653, and the fourth outer surface 654 are all flat.

  The bottom surface 67 is a surface facing the substrate 1. The bottom surface 67 has a frame shape and is flat.

  Unlike this embodiment, the frame part 6 does not need to exhibit the function as a reflector, and may consist of a translucent material.

  The element bonding layer 71 shown in FIG. 4 bonds the optical element 4 and the wiring portion 12. The element bonding layer 71 is interposed between the optical element 4 and the wiring part 12. The element bonding layer 71 is in direct contact with both the optical element 4 and the wiring portion 12. In the present embodiment, the element bonding layer 71 is made of a conductive material. Examples of the conductive material constituting the element bonding layer 71 include solder or Ag. Unlike the present embodiment, the element bonding layer 71 may be made of an insulating material.

  As shown in FIG. 4, the translucent resin portion 77 covers the optical element 4. The translucent resin portion 77 is filled in the opening of the frame portion 6. Thereby, the inner peripheral surface 61 of the frame part 6 and the translucent resin part 77 are in direct contact. The translucent resin part 77 transmits the light emitted from the optical element 4. In the present embodiment, the translucent resin portion 77 is made of a transparent resin, and examples of such a transparent resin include an epoxy resin, a silicone resin, and a polyvinyl resin. A phosphor may be mixed in the translucent resin portion 77. Unlike the present embodiment, the optical device A1 may not include the translucent resin portion 77.

  As illustrated in FIGS. 2 and 4, the frame bonding layer 73 is interposed between the frame 6 and the substrate 11, and bonds the frame 6 to the substrate 11. The frame bonding layer 73 is made of an insulating material. In the present embodiment, the frame bonding layer 73 is derived from an adhesive (described later). An example of such an adhesive is an epoxy adhesive.

  As shown in FIG. 2, the optical device A1 constitutes a mounting structure B1 of the optical device together with a circuit board 801 and a solder layer 802. The solder layer 802 is interposed between the first back surface pad 122A and the circuit board 801 and between the second back surface pad 122D and the circuit board 801. In this way, the optical device A1 is mounted on the circuit board 801.

  Next, a method for manufacturing the optical device A1 will be described. The same or similar configurations as those described above are denoted by the same reference numerals as described above for convenience of understanding.

  FIG. 7 is a bottom view showing one step of the method of manufacturing the optical device according to the first embodiment of the present invention. 8 is a cross-sectional view taken along line VIII-VIII in FIG. 9 is a cross-sectional view taken along line IX-IX in FIG.

  First, the substrate 11 shown in FIGS. 7 to 9 is prepared. A plurality of through holes 1T are formed in the substrate 11 along the second direction Y.

  Next, the wiring part 12 is formed on the substrate 11. The wiring part 12 may be formed by plating. A main surface conductive layer 120 is formed on the main surface 111 of the substrate 11 by the formation process of the wiring portion 12. A back surface conductive layer 123 is formed on the back surface 112 of the substrate 11. The back surface conductive layer 123 includes a first back surface conductive layer 123A and a second back surface conductive layer 123D. The first back surface conductive layer 123 </ b> A and the second back surface conductive layer 123 </ b> D are separated from each other in the first direction X and extend along the second direction Y orthogonal to the first direction X and the thickness direction Z of the substrate 11. ing. Although illustration is omitted, a connecting electrode is formed on the inner surface of the through hole 1T. The connection electrode is the first connection electrode 12G or the second connection electrode 12H described above.

  Next, as shown in FIGS. 10 and 11, the frame portion 6 is disposed on the main surface 111 of the substrate 11. Specifically, the frame portion 6 is bonded to the main surface 111 of the substrate 11 with an adhesive. Next, a plurality of optical elements 4 are arranged on the main surface 111 of the substrate 11. Specifically, the plurality of optical elements 4 are arranged on the main surface conductive layer 120 via the element bonding layer 71. Next, the wire 78 is bonded to the optical element 4 and the main surface conductive layer 120. The frame portion 6 may be disposed on the substrate 11 after the step of placing the optical element 4 on the substrate 11.

  Next, as shown in FIGS. 12 and 13, a translucent resin portion 77 that covers the optical element 4 is formed.

  FIG. 14 is a bottom view showing a step subsequent to FIGS. 15 is a cross-sectional view taken along line XV-XV in FIG. 16 is a cross-sectional view taken along line XVI-XVI in FIG.

  Next, as shown in FIGS. 14-16, the board | substrate 11 and the frame part 6 are cut | disconnected and solidified. 14 to 16, the cutting region Dc1 along the first direction X by the dicing blade 881 and the cutting region Dc2 along the second direction Y by the dicing blade 881 are indicated by hatching.

  In the solidifying step, the substrate 11 and the frame part 6 are cut with the frame part 6 as a reference. Thereby, the dimension of the 1st surface 631 in the 2nd direction Y becomes the same as the dimension of the 2nd surface 632 in the 2nd direction Y as mentioned above. Further, in cutting the substrate 11 and the frame portion 6, a portion on the substrate 11 between the two through holes 1 </ b> T adjacent to each other in the second direction Y among the plurality of through holes 1 </ b> T is cut by the dicing blade 881. Accordingly, in addition to the substrate 11 and the frame portion 6, a part of the first back surface conductive layer 123A and a part of the second back surface conductive layer 123D are cut along the first direction X by the dicing blade 881. A back pad 122A and a second back pad 122D are formed. By cutting along the first direction X, the first side surface 113 and the second side surface 114 of the substrate 11 are formed, and the first outer surface 651 and the second outer surface 652 of the frame portion 6 are formed. Similarly, the substrate 11 and the frame part 6 are cut along the second direction Y by the dicing blade 881. By cutting along the second direction Y, the first end surface 115 and the second end surface 116 of the substrate 11 are formed, and the third outer surface 653 and the fourth outer surface 654 of the frame portion 6 are formed.

  As shown in FIG. 14, in the step of solidifying, between the two through holes 1T adjacent to each other in the second direction Y among the plurality of through holes 1T, the midpoint P1 of the two through holes 1T It is preferable to cut the position at a position by a dicing blade 881. However, as shown in FIG. 17, in the step of solidifying, between the two through holes 1 </ b> T adjacent in the second direction Y among the plurality of through holes 1 </ b> T, the midpoint of the two through holes 1 </ b> T A portion of the substrate 11 that is shifted in the second direction Y from P1 may be cut by the dicing blade 881. In this case, as described above, the virtual straight line L1 extending along the first direction X is located at a position shifted from the center of the back surface 112 in the second direction Y, and the optical device A1 ′ shown in FIG. Manufactured.

  Next, the effect of this embodiment is demonstrated.

  In the manufacturing method of the optical device A1, the first back surface conductive layer 123A and the second back surface conductive layer 123D are separated from each other in the first direction X, and are orthogonal to the first direction X and the thickness direction Z of the substrate 11. Extends along the second direction Y. In the solidifying step, the dicing blade 881 cuts a part of the first back surface conductive layer 123A and a part of the second back surface conductive layer 123D along the first direction X. Through such a manufacturing method, in the optical device A1, the first back surface pad 122A and the second back surface pad 122D are each formed from the first edge 112A to the second edge 112B. According to such a configuration, even if the cutting region Dc1 by the dicing blade 881 along the first direction X is displaced in the second direction Y, the second direction Y of the first back surface pad 122A and the second back surface pad 122D. A large dimension can be secured. As a result, it is possible to avoid a problem that mounting displacement occurs when the optical device A1 is mounted on the circuit board 801.

  In the case of a product in which the frame portion 6 is bonded to the substrate 11 as in the present embodiment, the position of the frame portion 6 may be displaced with respect to the substrate 11. In such a case, when the substrate 11 and the frame portion 6 are cut with reference to the frame portion 6 as in the present embodiment, the cutting region Dc1 by the dicing blade 881 along the first direction X as shown in FIG. , The position may be displaced in the second direction Y. As described above, even when the cutting region Dc1 is displaced in the second direction Y, the first back surface pad 122A and the second back surface pad 122D can have a large dimension in the second direction Y. It is possible to avoid a problem that mounting displacement occurs when the optical device A1 is mounted on the circuit board 801. Moreover, when the board | substrate 11 and the frame part 6 are cut | disconnected on the basis of the frame part 6 like this embodiment, the frame part 6 becomes a shape other than a desired shape (for example, a part of inner peripheral surface 61 is a dicing blade). 881) can be avoided. For example, when the frame portion 6 functions as a reflector, it is possible to prevent a decrease in luminance and light leakage of the optical device A1 that may occur when the inner peripheral surface 61 that functions as a light reflecting surface is removed. Thus, according to this embodiment, generation | occurrence | production of inferior goods can be avoided. As described above, according to the present embodiment, it is possible to avoid a problem that a mounting deviation occurs, and it is also possible to avoid the occurrence of defective products.

  In the state shown in FIGS. 10 and 11, the optical element 4 is usually accurately arranged with respect to the frame portion 6. Therefore, if the board | substrate 11 and the frame part 6 can be cut | disconnected on the basis of the frame part 6 like this embodiment, it can prevent that the position of the optical element 4 in optical apparatus A1 shifts | deviates from a desired position. Therefore, the optical characteristics of the optical device A1 can be set to desired characteristics. When the optical element 4 is a light emitting element, the optical device A1 can emit light having a desired intensity. When the optical element 4 is a light receiving element, the optical device A1 can receive a sufficient amount of light.

  In cutting the substrate 11 and the frame portion 6, a portion of the plurality of through holes 1 </ b> T between the two through holes 1 </ b> T adjacent to each other in the second direction Y has a low strength and is cut by the dicing blade 881. Hateful. In the present embodiment, before the solidifying step, the region R1 sandwiched between the two through holes 1T in the back surface 112 of the substrate 11 is exposed from the back surface conductive layer 123. According to such a configuration, the area to be cut (removed) by the dicing blade 881 in the back surface conductive layer 123 can be reduced. Therefore, the cutting process by the dicing blade 881 can be performed more suitably.

  The present invention is not limited to the embodiment described above. The specific configuration of each part of the present invention can be changed in various ways.

DESCRIPTION OF SYMBOLS 1 Base material 11 Board | substrate 111 Main surface 112 Back surface 112A 1st edge 112B 2nd edge 112C 1st edge 112D 2nd edge 112G 1st notch 112H 2nd notch 113 1st side surface 114 2nd side surface 115 1st end surface 116 1st 2 end face 11G 1st recessed part 11H 2nd recessed part 12 Wiring part 120 Main surface conductive layer 121 Main surface electrode 121A Die bonding part 121B Wire bonding part 122 Back surface electrode 122A 1st back surface pad 122B 1st strip | belt-shaped part 122C 1st extension part 122D 2nd back surface pad 122E 2nd strip | belt-shaped part 122F 2nd extension part 123 Back surface conductive layer 123A 1st back surface conductive layer 123D 2nd back surface conductive layer 12G 1st connection electrode 12H 2nd connection electrode 1T Through-hole 4 Optical element 6 Frame part 61 Inner peripheral surface 63 Top surface 631 First surface 632 Second surface 651 First outer surface 652 Second outer surface 65 Third outer surface 654 Fourth outer surface 67 Bottom surface 71 Element bonding layer 73 Frame portion bonding layer 77 Translucent resin portion 78 Wire 801 Circuit board 802 Solder layer 881 Dicing blades A1, A1 ′ Optical device B1 Optical device mounting structure C1 Center Dc1, Dc2 Cutting area L1 Virtual straight line P1 Middle points R1, R11, R12 Area X First direction Y Second direction Z Thickness direction Z1, Z2 direction

Claims (45)

A substrate having a main surface and a back surface facing away from each other;
A wiring portion formed on the substrate;
An optical element disposed on the main surface;
An opening accommodating the optical element is formed, and a frame portion disposed on the substrate,
The back surface has a first edge and a second edge, each extending along a first direction and spaced apart from each other in a second direction perpendicular to the first direction and the thickness direction of the substrate. ,
The wiring portion includes a first back pad and a second back pad formed on the back surface,
The first back pad and the second back pad are spaced apart from each other in the first direction;
The first back pad and the second back pad are each formed from the first edge to the second edge,
The back surface has a first side and a second side, each extending along the second direction, and spaced apart from each other in the first direction;
The first back pad has an edge extending from a position away from the first side of the first edge from the first edge side toward the second edge side in the thickness direction view of the substrate;
The back surface of the substrate has an exposed portion exposed from the first back surface pad and the second back surface pad, and a part of the exposed portion is the first side in the thickness direction of the substrate. And the first edge and the edge of the first back pad,
A first notch that is recessed from the first side and a second notch that is recessed from the second side are formed on the back surface,
The first back pad has a portion along an edge of the first notch,
The second back pad has a portion along the edge of the second notch ,
The first back pad has a first strip, the second back pad has a second strip,
Each of the first belt-like portion and the second belt-like portion has a shape extending along the second direction,
The first belt-like portion is located between the first side and the second belt-like portion,
The optical device, wherein the first belt-like portion is separated from the first side, and the second belt-like portion is separated from the second side . 2. The optical device according to claim 1 , wherein the first belt-shaped portion and the second belt-shaped portion are separated from each other in the first direction. It said first strip portion and said second strip portion each of which is formed over the second edge from the first edge, the optical device according to claim 1 or claim 2. A region sandwiched between the first belt-like portion and the first side in the back surface and a region sandwiched between the second belt-like portion and the second side in the back surface are exposed from the wiring portion. The optical device according to claim 1 . The first back pad has a pair of first extending portions extending from the first belt-shaped portion along an edge of the first notch, and each of the pair of first extending portions is the first To one side,
The second back surface pad has a pair of second extending portions extending from the second belt-shaped portion along an edge of the second notch, and each of the pair of second extending portions is the first The optical device according to claim 1 , wherein the optical device reaches two sides. Both edge and the second cut-out edge of the first notch is arc-shaped, the optical device according to any one of 請 Motomeko 1 to claim 5. The virtual straight line extending along the first direction is located at a position shifted from the center of the back surface in the second direction,
The imaginary straight line is a straight line connecting a portion located closest to the second back surface pad in the first cutout and a portion located closest to the first back surface pad in the second cutout. 1 or an optical device according to any one of claims 6. The substrate has a first side surface facing one side in the second direction and a second side surface facing the opposite side to the first side surface,
The optical device according to claim 1, wherein both the first side surface and the second side surface are flat. The optical device according to claim 8 , wherein both the entire first side surface and the entire second side surface are exposed from the wiring portion. The substrate has a first end surface facing one of the first directions, and a second end surface facing the opposite side of the first end surface;
The optical device according to claim 8 or 9 , wherein both the first end surface and the second end surface are flat. Wherein both the entire whole and the second end surface of the first end surface is exposed from the wiring part, the optical device according to claim 1 0. A first recess that is recessed from the first end surface and a second recess that is recessed from the second end surface are formed on the substrate ,
The edge of the first notch is constituted by a part of the first recess,
The second notch edge is constituted by a portion of the second recess, the optical device according to claim 1 0 or claim 1 1. The wiring portion includes a main surface electrode, a first connection electrode, and a second connection electrode,
The main surface electrode is formed on the main surface, and the optical element is disposed on the main surface electrode,
The first connection electrode is electrically connected to the main surface electrode and the first back surface pad,
The second contact electrode, said that by conducting a main surface electrode and the second back surface pad, the optical device according to claim 1 2. The first connection electrode is formed on the inner surface of the first recess,
The second contact electrode is formed on the inner surface of the second recess, the optical device according to claim 1 3. Further comprising a wire bonded to the optical element;
The main surface electrodes, said has a die bonding portion of the optical element is bonded, and the wire bonding portion to which the wire is bonded, the optical apparatus of claim 1 3 or claim 1 4. Further comprising a device bonding layer interposed between the optical element and the wiring part, the optical device according to any one of claims 1 to 1 5. The optical device according to claim 16 , wherein the element bonding layer is made of a conductive material. The frame portion has an inner peripheral surface surrounding the optical element, the optical device according to any one of claims 1 to 1 7. The inner peripheral surface, said in the thickness direction as viewed enough away from the substrate in the thickness direction of the substrate away from the optical element is inclined with respect to the thickness direction of the substrate, to claim 18 The optical device described. The frame portion has a top surface facing a direction toward the main surface from the back surface of the thickness direction of the substrate, the top surface exhibits a frame-like, any of claims 1 to 19 An optical device according to 1. The top surface has a first surface and a second surface that are spaced apart from each other in the second direction and extend along the first direction;
The optical element is disposed between the first surface and the second surface in the thickness direction view,
The dimensions of the first surface in the second direction, wherein the same as the dimension of the second surface in the second direction, the optical device according to claim 2 0. The frame includes a first outer surface that is flush with the first side surface, and a second outer surface that is flush with the second side surface, and the first outer surface and the second outer surface. it is flat, the optical device according to claim 1 0. The frame includes a third outer surface that is flush with the first end surface, and a fourth outer surface that is flush with the second end surface, and the third outer surface and the fourth outer surface. it is flat, the optical device according to claim 2 2. The frame portion has a bottom surface facing the substrate, the optical device according to any one of claims 1 to 2 3. Interposed between the frame portion and the substrate, further comprising a frame portion bonding layer for bonding the frame portion to the substrate, the optical device according to any one of claims 1 to 2 4. The optical device according to claim 25 , wherein the frame bonding layer is made of an insulating material. Further comprising a light-transmitting resin portion covering the optical element, the optical device according to any one of claims 1 to 2 6. An optical device according to any one of claims 1 to 2 7,
A circuit board;
A mounting structure for an optical device, comprising: a solder layer interposed between the first back pad and the circuit board; and a solder layer interposed between the second back pad and the circuit board. An optical device manufacturing method comprising:
The optical device comprises:
A substrate having a main surface and a back surface facing away from each other;
A wiring portion formed on the substrate;
An optical element disposed on the main surface;
An opening accommodating the optical element is formed, and a frame portion disposed on the substrate,
The back surface has a first edge and a second edge, each extending along a first direction and spaced apart from each other in a second direction perpendicular to the first direction and the thickness direction of the substrate. ,
The wiring portion includes a first back pad and a second back pad formed on the back surface,
The first back pad and the second back pad are spaced apart from each other in the first direction;
The first back pad and the second back pad are each formed from the first edge to the second edge,
The back surface has a first side and a second side, each extending along the second direction, and spaced apart from each other in the first direction;
The first back pad has an edge extending from a position away from the first side of the first edge from the first edge side toward the second edge side in the thickness direction view of the substrate;
The back surface of the substrate has an exposed portion exposed from the first back surface pad and the second back surface pad, and a part of the exposed portion is the first side in the thickness direction of the substrate. And the first edge and the edge of the first back pad,
Preparing a substrate;
Forming a first back surface conductive layer and a second back surface conductive layer on the back surface of the substrate;
A step of disposing a frame portion having a plurality of openings formed on the main surface of the substrate;
Arranging a plurality of optical elements on the main surface of the substrate;
Cutting and solidifying the substrate and the frame part,
The first back surface conductive layer and the second back surface conductive layer are spaced apart from each other in a first direction and extend along a second direction orthogonal to the first direction and the thickness direction of the substrate,
In the solidifying step, a part of the first back surface conductive layer and a part of the second back surface conductive layer are cut along the first direction by a dicing blade. 30. The method of manufacturing an optical device according to claim 29 , wherein, in the arranging step, the frame portion is bonded to the main surface of the substrate with an adhesive. On the substrate, the second along a direction a plurality of through holes are formed, a manufacturing method of an optical device according to claim 3 0. Wherein in the step of solid pieces, the point in the substrate between the two through holes adjacent to each other in the second directions of the plurality of through-holes and cut by the dicing blade, according to claim 3 1 Manufacturing method of the optical device. Wherein before the step of solid pieces, of the main surface of the substrate, the region between the two through holes is exposed, a manufacturing method of the optical device according to claim 3 2. In the solidifying step, among the plurality of through holes, the two through holes adjacent to each other in the second direction are shifted from the midpoint of the two through holes in the second direction. the portions in the substrate is cut by the dicing blade, a manufacturing method of an optical device according to claim 3 1. 30. The method of manufacturing an optical device according to claim 29 , wherein, in the solidifying step, the substrate and the frame part are cut with the frame part as a reference. A step of forming a main surface conductive layer on the main surface of the substrate;
Wherein in the plurality of placing the optical element, placing said plurality of optical elements to the main surface conductive layer, the manufacturing method of the optical device according to any one of claims 29 to claim 35. A substrate having a first surface facing one side of the first direction and a second surface facing the other side of the first direction;
A first conductive portion formed continuously from the first surface of the substrate to the second surface;
A second conductive portion formed separately from the first conductive portion and continuously formed from the first surface of the substrate to the second surface;
A semiconductor element disposed on the first conductive portion on the first surface of the substrate;
In the first direction view, the second surface has a first side and a second side that are parallel to each other, and a third side and a fourth side that extend in a direction intersecting the first side and are parallel to each other. ,
The first conductive portion on the second surface is spaced apart from the third side and continuously formed from the first side to the second side, and the first side and the second side. A second part formed continuously from the side and curved from the third side to the first part,
The second conductive portion on the second surface includes a third portion that is spaced apart from the fourth side and is continuously formed from the first side to the second side, the first side, and the second side. have a fourth portion which is continuously formed curved from spaced and the third side from the side to the third portion,
The second surface is formed with a first notch that is recessed from the third side and a second notch that is recessed from the fourth side,
The second portion of the first conductive portion has a portion along an edge of the first notch,
It said fourth portion of said second conductive portion, that has a portion along the second cut-out edges, the semiconductor device. Both the edge and the second cut-out edge of the first notch is formed in a circular arc shape, the semiconductor device according to claim 3 7. Further comprising a wire bonded to the semiconductor element,
38. The semiconductor device according to claim 37 , wherein the wire is bonded to the second conductive portion. The semiconductor element and further comprising a layer interposed between the first conductive portion, the semiconductor device according to any one of claims 3 7 to claim 39. Dimension in said first direction of said first conductive portion on the first surface of the substrate, than the dimension in the first direction of the substrate, a small, in any one of claims 3 7 through claim 4 0 The semiconductor device described. The separation distance between the first conductive portion on the second surface of the substrate and the second conductive portion on the second surface of the substrate is the first portion of the first conductive portion and the third portion. than the distance between the sides, a large semiconductor device according to any one of claims 3 7 through claim 4 1. The substrate has a third surface and a fourth surface, and the third surface and the fourth surface connect the first surface and the second surface, respectively.
It said third surface includes a first side, said fourth surface comprises a second side, the semiconductor device according to claim 3 7. The first conductive portion and the second conductive portion each having said third surface flush surface, the semiconductor device according to claim 4 3. The first conductive portion and the second conductive portion each having the fourth surface flush with the surface, the semiconductor device according to claim 4 4.

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