JP6842485B2 - LED module - Google Patents

Description

The present invention relates to an LED module.

FIG. 32 shows an example of a conventional LED module (see, for example, Patent Document 1). The LED module 900 shown in the figure has a structure in which three LED chips 931, 932, 933 are mounted on a long rectangular substrate 910. A plurality of electrodes 921, 922, 922, 924 are formed on the substrate 910. LED chips 921, 922, 923 are die-bonded to the electrodes 921, 922, 923, respectively. The electrode 924 is a so-called common electrode, and is conductive to each of the LED chips 931, 932, 933 via a wire. The three LED chips 931, 932, 933 are surrounded by a case 950. The case 950 is made of a substantially frame-shaped translucent resin, and the inner space thereof is filled with a translucent resin (not shown). The LED module 900 is configured as a so-called side view type LED module, which is mounted on a mounting board or the like with the lower surface in the drawing extending in the longitudinal direction of the board 910 as a mounting surface. The LED chips 931, 932, 933 emit red light, green light, and blue light, respectively. By mixing the light from these LED chips 931, 932, 933, the LED module 900 is oriented to emit white light.

However, the demand for miniaturization of the LED module 900 is increasing year by year. For example, in order to suppress the protruding height from the mounting board on which the LED module 900 is mounted, it is necessary to further narrow the width of the board 910. Along with this, the space for mounting the LED chips 931, 932, 933 becomes narrower. As the space for mounting the LED chip 931, 932, 933, in addition to the installation space of the LED chip 931, 932, 933 itself, the wires connected to these and the wires of the common electrode 924 are connected. Space is needed to place the LED parts. Further, the ratio of the electrodes 922 and 923 to the substrate 910 is not small. Therefore, it was not easy to narrow the width of the substrate 910.

In addition to the side-view type LED module described above, a top-view type LED module is also known. The top view type is also required to be miniaturized. A top view type LED module is disclosed in, for example, Patent Document 1.

Japanese Unexamined Patent Publication No. 2006-24794

The present invention has been conceived under the above circumstances, and its main object is to provide an LED module capable of miniaturization.

According to the first aspect of the present invention, a substrate having a main surface and a back surface facing opposite sides, a main surface electrode formed on the main surface, and a plurality of substrates connected to the main surface electrode and penetrating the substrate. Among the plurality of LED chips, the penetrating electrode, a plurality of LED chips arranged on the main surface electrode along the first direction, and a case arranged on the main surface and surrounding the main surface electrode are provided. Three of these are provided with LED modules that emit red light, green light, and blue light, respectively.

Preferably, the main surface electrode has a portion interposed between the main surface and the case.

Preferably, a plurality of wires each bonded to any one of the plurality of LED chips and the main surface electrode are further provided.

Preferably, a back surface electrode formed on the back surface and connected to each of the plurality of through electrodes, and an insulating film formed on the back surface are further provided.

Preferably, the end of the wire overlaps the back electrode or the insulating film in the thickness direction of the substrate.

Preferably, the insulating film is formed in a region of the back surface other than the region where the back surface electrode is formed in the thickness direction of the substrate as a whole.

Preferably, the back surface electrode includes a plurality of mounting pad portions separated from each other, the insulating film includes a first strip-shaped insulating portion extending in a longitudinal shape, and the first strip-shaped insulating portion includes the plurality of mounting portions. It is arranged at a position sandwiched between any two of the pad portions.

Preferably, the back surface has an exposed portion exposed from the insulating film, and the exposed portion is located at an end of the back surface in the direction in which the first band-shaped insulating portion extends, and the first band-shaped insulating portion is located. Is continuous with the exposed portion in the thickness direction of the substrate.

Preferably, the insulating film includes a second strip-shaped insulating portion extending in a longitudinal direction in a direction intersecting the direction in which the first strip-shaped insulating portion extends, and the second strip-shaped insulating portion includes the plurality of mounting pad portions. It is arranged at a position sandwiched between any two of the above.

Preferably, the second strip-shaped insulating portion reaches the edge of the back surface.

Preferably, the main surface electrode includes a first conductive portion and a second conductive portion insulated from the first conductive portion, and the first conductive portion includes any one of the plurality of LED chips. One is arranged.

Preferably, the first conductive portion includes a first die pad and a first wire bonding pad conducting the first die pad, and the first die pad is any one of the plurality of LED chips. One is arranged, any one of the plurality of wires is bonded to the first wire bonding pad, and the first die pad is separated from the first wire bonding pad via a gap.

Preferably, the first wire bonding pad is separated from the first die pad in a second direction intersecting the first direction.

Preferably, the first die pad is located between the second conductive portion and the first wire bonding pad.

Preferably, the first conductive portion has a first circular pad that overlaps with any one of the plurality of through electrodes in the thickness direction of the substrate, and the first circular pad is the first wire bonding. Conducting to the pad.

Preferably, the first circular pad has a portion interposed between the case and the substrate.

Preferably, the first conductive portion has a strip-shaped portion that conducts to the first die pad.

Preferably, the second conductive portion has a wire bonding wiring portion to which any one of the plurality of wires is bonded.

Preferably, any one of the plurality of wires is bonded to the second conductive portion.

Preferably, the second conductive portion has a second circular wiring portion that overlaps with any one of the plurality of through electrodes in the thickness direction of the substrate, and the second circular wiring portion is wire bonding. It is conducting to the wiring part.

Preferably, the second circular wiring portion is connected to the wire bonding wiring portion.

Preferably, the second circular wiring portion has a portion interposed between the case and the substrate.

Preferably, a plurality of bonding layers are further provided, each of which is interposed between any one of the plurality of LED chips and the main surface electrode.

Preferably, any one of the plurality of bonding layers has conductivity.

Preferably, any one of the plurality of bonding layers has an insulating property.

Preferably, an adhesive layer interposed between the case and the substrate is further provided.

Preferably, any one of the plurality of through electrodes overlaps the case in the thickness direction of the substrate.

Preferably, the case has an enclosing surface that surrounds the plurality of LED chips.

Preferably, the case has a case side that faces away from the area surrounded by the enclosing surface.

Preferably, the substrate has a substrate side surface that is flush with the case side surface.

Preferably, the case has a bottom surface that faces the main surface and connects to the surrounding surface and the side surface of the case.

Preferably, the bottom surface has a frame shape and is flat from the surrounding surface to the side surface of the case.

Preferably, the surrounding surface is inclined with respect to the thickness direction of the substrate so as to form an acute angle with the bottom surface.

Preferably, all of the plurality of LED chips are arranged on the first die pad.

Preferably, any one of the plurality of wires extends in a direction inclined with respect to the first direction and the direction orthogonal to the first direction in the thickness direction of the substrate.

Preferably, the first conductive portion has a second die pad that is separated from the first die pad, and a third die pad that is separated from both the first die pad and the second die pad. Only one of the plurality of LED chips is arranged on the first die pad, only one of the plurality of LED chips is arranged on the second die pad, and the third die pad is arranged with only one of the plurality of LED chips. , Only one of the plurality of LED chips is arranged.

According to the second aspect of the present invention, the LED module provided by the second aspect of the present invention includes a mounting board and a solder layer interposed between the mounting board and the back surface. An LED module mounting structure is provided.

According to the third aspect of the present invention, a substrate having a main surface, a main surface electrode formed on the main surface, a plurality of through electrodes connected to the main surface electrode and penetrating the substrate, and the main surface. Provided is an LED module comprising a plurality of LED chips arranged along one direction on an electrode, and the distance between the plurality of LED chips is 100 to 150 μm.

According to the fourth aspect of the present invention, a substrate having a main surface and a back surface which are long rectangular shapes facing in opposite directions, and a bottom surface connecting the long sides of the main surface and the back surface, and the main surface of the substrate. An LED module comprising one or more supported LED chips, a wiring formed on the substrate and conducting conduction to the LED chip, and having the bottom surface as a mounting surface, wherein the substrate is The pad having one or more through holes penetrating from the main surface to the back surface, and the wiring is formed on the main surface and conducting to the LED chip, the back electrode formed on the back surface, and the above. Provided is an LED module characterized by having a pad and a through electrode formed on the inner surface of the through hole while conducting the back electrode.

Preferably, the wiring exposes all of the bottom surfaces of the substrate.

Preferably, the three LED chips are spaced apart from each other in the longitudinal direction of the main surface.

Preferably, the substrate has three through holes and the wiring has three through electrodes.

Preferably, the wiring has a bonding pad as the pad, includes a first wire connecting one of the three LED chips and the bonding pad, and of the three through holes. One and the bonding pad overlap each other, and one of the three through electrodes and the bonding pad are conductive.

Preferably, the wiring has two die bonding pads as the pads in which two of the three LED chips are die bonded, and the two die bonding pads and the two through holes are formed. They overlap in the thickness direction of the above substrates.

Preferably, the back electrode has two individual electrodes, each of which conducts with the two die bonding pads via the two through electrodes.

Preferably, the substrate has a pair of side surfaces connecting the main surface and the back surface at both ends in the longitudinal direction, and is interposed between the side surfaces and the bottom surface, and the thickness of the substrate. Two corner grooves are formed to reach the main surface and the back surface in the direction, and the wiring has two corner groove wirings formed on the inner surfaces of the two corner grooves.

Preferably, the back electrode is connected to one of the two corner groove wirings and is connected to the other end common electrode that conducts with the three LED chips, and the other of the two corner groove wirings. It has an end individual electrode that conducts to any one of the LED chips.

Preferably, the wiring has a back connecting wiring that is formed on the back surface and connects the through electrode and the end common electrode that are not conductive to the two individual electrodes.

Preferably, the corner groove has a quadrangular cross section.

Preferably, a reflector formed on the main surface and having a reflecting surface surrounding the three LED chips and a translucent resin filled in a region surrounded by the reflecting surfaces and covering the three LED chips. It has a part and.

Preferably, a second wire for connecting one of the three LED chips and the bonding pad is further provided, and the second wire is one of the three LED chips in the thickness direction of the substrate. It has a portion that overlaps with the LED chip to which the first wire is connected.

Preferably, the center of the LED chip to which the first wire of the three LED chips is connected is on the main surface of the center of the LED chip to which the second wire of the three LED chips is connected. It is located at a shifted position in the lateral direction.

Preferably, one of the three through holes is formed from a portion of the three LED chips that overlaps the LED chip to which the second wire is connected and the LED chip in the thickness direction of the substrate. It has a protruding part.

Preferably, an insulating film covering the back electrode is further provided.

Preferably, the insulating film covers the back surface connecting wiring.

Preferably, the insulating film exposes at least a part of each of the individual electrodes.

Preferably, the insulating film covers the portion of each of the individual electrodes that is close to the back surface connecting wiring.

Preferably, the insulating film exposes the end common electrode and the end individual electrode.

Other features and advantages of the present invention will become more apparent with the detailed description given below with reference to the accompanying drawings.

It is sectional drawing which shows the mounting structure of the LED module which concerns on 1st Embodiment of this invention. It is a top view of the LED module which concerns on 1st Embodiment of this invention. FIG. 2 is a plan view in which the case and the adhesive layer are omitted. It is a bottom view of the LED module which concerns on 1st Embodiment of this invention. It is sectional drawing which follows the VV line of FIG. It is sectional drawing which follows the VI-VI line of FIG. It is a top view which shows one step of the process of manufacturing the LED module which concerns on 1st Embodiment of this invention. FIG. 6 is a cross-sectional view taken along the line VIII-VII of FIG. It is sectional drawing which shows the process of forming a case. It is a top view which shows the process which follows FIG. It is sectional drawing which follows the XI-XI line of FIG. It is a top view which shows the process which follows FIG. It is sectional drawing which follows the XIII-XIII line of FIG. It is a partially enlarged sectional view which shows the vicinity of the back surface of the substrate in the process of bonding a wire in the process of manufacturing the LED module of this invention. It is a top view of the LED module which concerns on 2nd Embodiment of this invention. FIG. 15 is a plan view in which the case and the adhesive layer are omitted. It is a bottom view of the LED module which concerns on 2nd Embodiment of this invention. FIG. 5 is a cross-sectional view taken along the line XVIII-XVIII of FIG. It is a front view of the main part which shows the LED module based on 1st reference example of this invention. It is a transmission sectional view taken along the line XX-XX of FIG. It is a bottom view which shows the LED module of FIG. It is a rear view which shows the LED module of FIG. It is a side view which shows the LED module of FIG. It is a front view of the main part which shows the LED module based on the 2nd reference example of this invention. It is a transmission sectional view taken along the line XXV-XXV of FIG. It is a bottom view which shows the LED module of FIG. It is a rear view which shows the LED module of FIG. It is a front view of the main part which shows the LED module based on 3rd Embodiment of this invention. FIG. 8 is a transmission sectional view taken along the line XXIX-XXIX of FIG. 28. It is a bottom view which shows the LED module of FIG. It is a rear view which shows the LED module of FIG. 28. It is a front view of the main part which shows an example of the conventional LED module.

Hereinafter, embodiments of the present invention will be specifically described with reference to the drawings.

The first embodiment of the present invention will be described with reference to FIGS. 1 to 14.

The LED module mounting structure B1 shown in FIG. 1 includes an LED module A1, a mounting board 871, and a solder layer 872.

The mounting board 871 is, for example, a printed wiring board. The mounting substrate 871 includes, for example, an insulating substrate and a pattern electrode (not shown) formed on the insulating substrate. The LED module A1 is mounted on the mounting board 871. A solder layer 872 is interposed between the LED module A1 and the mounting substrate 871. The solder layer 872 joins the LED module A1 and the mounting board 871.

FIG. 2 is a plan view of the LED module according to the present embodiment. FIG. 3 is a plan view in which the case and the adhesive layer are omitted from FIG. FIG. 4 is a bottom view of the LED module according to the present embodiment. FIG. 5 is a cross-sectional view taken along the line VV of FIG. FIG. 6 is a cross-sectional view taken along the line VI-VI of FIG.

The LED module A1 shown in these figures is a top view type. That is, the LED module A1 emits light in the thickness direction of the mounting substrate 871. The LED module A1 includes a substrate 1, a main surface electrode 2, a plurality of through electrodes 31, a back surface electrode 4, an LED chip 511,512,513, a bonding layer 521,522,523, and a sealing resin portion 59. A case 6, an adhesive layer 71, an insulating film 74, and a plurality of wires 81 are provided. In FIG. 2, the sealing resin portion 59 is omitted for convenience of understanding. Further, FIG. 5 corresponds to an enlarged view of the LED module A1 shown in FIG. In FIG. 1, for convenience of understanding, the bonding layers 521, 522, 523 and the adhesive layer 71 are omitted. In FIGS. 2 and 3, the bonding layers 522 and 523 are omitted. The dimensions of the LED module A1 in the direction X and the direction Y are, for example, about 1.6 to 1.8 mm.

The LED chips 511, 512, 513 are light sources of the LED module A1. The LED chips 511, 512, 513 have a structure in which a p-type semiconductor layer, an n-type semiconductor layer, and an active layer are laminated. The active layer is sandwiched between a p-type semiconductor layer and an n-type semiconductor layer. In the present embodiment, the LED chip 511 emits red light, the LED chip 512 emits green light, and the LED chip 513 emits blue light. A plurality of LED chips 511, 512, 513 are arranged along the direction X. The separation distance between the LED chips 511, 512, 513 is preferably 100 to 150 μm.

The substrate 1 has a rectangular shape in a plan view. The substrate 1 is made of, for example, a glass epoxy resin. The substrate 1 has a main surface 11, a substrate side surface 12, and a back surface 13. The main surface 11 and the back surface 13 face opposite to each other. The substrate side surface 12 faces either one of the directions X or one of the directions Y. The substrate side surface 12 is connected to both the main surface 11 and the back surface 13. The main surface 11, the side surface 12 of the substrate, and the back surface 13 are all flat. A solder layer 872 is interposed between the back surface 13 and the mounting substrate 871.

The main surface electrode 2 is formed on the main surface 11. The main surface electrode 2 includes a first conductive portion 24 and a plurality of second conductive portions 25. Copper, nickel, and gold are laminated on each other in the main surface electrode 2. The same applies to the through electrode 31 and the back surface electrode 4 described later.

Any one of the LED chips 511, 512, 513 is arranged in the first conductive portion 24. The first conductive portion 24 has a die pad 241, a wire bonding pad 242, a circular pad 243, and a strip-shaped portion 244 and 245.

The die pad 241 has a rectangular shape. Any one of the LED chips 511, 512, and 513 is arranged on the die pad 241. In the present embodiment, any of the LED chips 511, 512, 513 is arranged on the die pad 241.

The wire bonding pad 242 has a rectangular shape. In the present embodiment, the wire bonding pad 242 has a rectangular shape whose long side coincides with the direction X. Any one of the plurality of wires 81 is bonded to the wire bonding pad 242. In the present embodiment, two of the plurality of wires 81 are bonded to the wire bonding pad 242. The die pads 241 are separated from the wire bonding pads 242 via a gap. Specifically, the wire bonding pad 242 is separated from the die pad 241 in the direction Y intersecting the direction X (in the present embodiment, orthogonal to the direction X). The length of the wire 81 in the direction Z view is, for example, 0.4 to 0.6 mm.

The circular pad 243 has a circular shape in the Z direction. In the present embodiment, the circular pad 243 is arranged on the side where the wire bonding pad 242 is located with respect to the die pad 241. The circular pad 243 is arranged on the X side of the wire bonding pad 242. The circular pad 243 is conductive to the die pad 241 and the wire bonding pad 242.

The band-shaped portion 244 extends in a band shape along the direction Y. The band-shaped portion 244 is conductive to the die pad 241. In the present embodiment, the strip-shaped portion 244 also conducts to the circular pad 243. The strip 244 is connected to the die pad 241 and the circular pad 243.

The band-shaped portion 245 extends in a band shape along the direction X. The strip 245 is conductive to the die pad 241. In the present embodiment, the strip-shaped portion 245 also conducts to the circular pad 243. The strip 245 is connected to the wire bonding pad 242 and the circular pad 243. The thinner the strip 245, the larger the area where the main surface 11 is exposed. When the reflectance of the main surface 11 is larger than the reflectance of the band-shaped portion 245, it is preferable that the exposed area of the main surface 11 is large in that the intensity of light toward the direction Z of the LED module A1 is increased. ..

As described above, the die pad 241, the wire bonding pad 242, the circular pad 243, and the strip-shaped portions 244 and 245 are electrically connected to each other.

A plurality of (three in this embodiment) second conductive portions 25 are each insulated from the first conductive portion 24. Each of the plurality of second conductive portions 25 is bonded to any one of the plurality of wires 81. The die pad 241 is located between two of the plurality of second conductive portions 25. Further, a die pad 241 is located between one of the plurality of second conductive portions 25 and the wire bonding pad 242.

Each of the plurality of second conductive portions 25 has a wire bonding wiring portion 251 and a circular wiring portion 252.

The wire bonding wiring portion 251 has a rectangular shape. Any one of the plurality of wires 81 is bonded to the wire bonding wiring unit 251. The die pads 241 are separated from the wire bonding wiring portion 251 through a gap. Specifically, the wire bonding wiring portion 251 is separated from the die pad 241 in the direction Y intersecting the direction X (in the present embodiment, orthogonal to the direction X).

The circular wiring portion 252 has a circular shape in the Z direction. The circular wiring portion 252 is arranged on the direction X side with respect to the wire bonding wiring portion 251. The circular wiring portion 252 is conductive to the wire bonding wiring portion 251.

Each of the plurality of wires 81 (five in this embodiment) is bonded to any one of the plurality of LED chips 511, 512, 513 and the main surface electrode 2. Each wire 81 is made of gold, silver, or copper. In this embodiment, each wire 81 is made of gold. Each wire 81 extends in a direction inclined with respect to a direction X and a direction Y orthogonal to the direction X in the thickness direction Z of the substrate 1. The height of each wire 81 from the LED chips 511, 512, 513 is, for example, 110 to 130 μm.

The bonding layer 521 is interposed between the LED chip 511 and the main surface electrode 2. In the present embodiment, the bonding layer 521 is interposed between the LED chip 511 and the die pad 241 (first conductive portion 24). The bonding layer 521 has a function of bonding the LED chip 511 to the main surface electrode 2 (in the present embodiment, the die pad 241 or the first conductive portion 24). The bonding layer 521 has conductivity. In order to form the conductive bonding layer 521, for example, a silver paste may be used. Since the bonding layer 521 has conductivity, the LED chip 511 and the main surface electrode 2 (in this embodiment, the die pad 241 or the first conductive portion 24) are conductive via the bonding layer 521. The bonding layer 521 occupies a wider area than the area occupied by the LED chip 511 in the direction Z view. When the shape of the bonding layer 521 in the direction Z is circular, the diameter of the circular shape is, for example, about 1.5 to 2 times the length of one side of the rectangle defining the LED chip 511.

The bonding layer 522 is interposed between the LED chip 512 and the main surface electrode 2. In the present embodiment, the bonding layer 522 is interposed between the LED chip 512 and the die pad 241 (first conductive portion 24). The bonding layer 522 has a function of bonding the LED chip 512 to the main surface electrode 2 (in the present embodiment, the die pad 241 or the first conductive portion 24). In this embodiment, the bonding layer 522 has an insulating property.

The bonding layer 523 is interposed between the LED chip 513 and the main surface electrode 2. In the present embodiment, the bonding layer 523 is interposed between the LED chip 513 and the die pad 241 (first conductive portion 24). The bonding layer 523 has a function of bonding the LED chip 513 to the main surface electrode 2 (in the present embodiment, the die pad 241 or the first conductive portion 24). In this embodiment, the bonding layer 523 has an insulating property.

The back surface electrode 4 is formed on the back surface 13. The back surface electrode 4 is a mounting electrode. A solder layer 872 (see FIG. 1) is interposed between the back surface electrode 4 and the mounting substrate 871. The back surface electrode 4 includes a plurality of mounting pad portions 41 (four in this embodiment).

Each of the plurality of mounting pad portions 41 has a rectangular shape. Of course, the shape of each mounting pad portion 41 is not limited to a rectangular shape. The plurality of mounting pad portions 41 are separated from each other.

Each of the plurality of through electrodes 31 penetrates the substrate 1. More specifically, each through electrode 31 penetrates the substrate 1 from the main surface 11 to the back surface 13. Each through electrode 31 covers the inner surface of the through hole formed in the substrate 1. In this embodiment, each through electrode 31 has a film shape. Therefore, each through electrode 31 has a cylindrical shape extending along the direction Z. In the present embodiment, the space surrounded by the through electrodes 31 is filled with resin. Each through electrode 31 is connected to a main surface electrode 2 and a back surface electrode 4. More specifically, the circular pad 243 is connected to any one of the plurality of through electrodes 31 and overlaps the through electrodes 31 in the direction Z view. Each of the circular wiring portions 252 is connected to any one of the plurality of through electrodes 31 and overlaps the through electrodes 31 in the direction Z view.

The insulating film 74 is formed on the back surface 13. The insulating film 74 is a resist layer and is called a solder resist. The insulating film 74 prevents the solder layer 872 from adhering to the back surface 13. In the present embodiment, the insulating film 74 is formed in a region of the back surface 13 other than the region where the back surface electrode 4 is formed in the thickness direction Z of the substrate 1 as a whole. The end portions of the wires 81 overlap the insulating film 74 or the back surface electrode 4 in the thickness direction Z of the substrate 1.

The insulating film 74 includes a plurality of (two in this embodiment) first strip-shaped insulating portion 741 and a plurality of (two in this embodiment) second strip-shaped insulating portion 742.

Each first strip-shaped insulating portion 741 extends in a longitudinal shape. In this embodiment, each first strip-shaped insulating portion 741 extends in the direction X. Each of the first strip-shaped insulating portions 741 is arranged at a position sandwiched between any two of the plurality of mounting pad portions 41. More specifically, the one arranged on the left side in FIG. 4 of the plurality of first strip-shaped insulating portions 741 is arranged at a position sandwiched between the two on the left side of the plurality of mounting pad portions 41. There is. On the other hand, the one arranged on the right side in FIG. 4 of the plurality of first strip-shaped insulating portions 741 is arranged at a position sandwiched between the two on the right side of the plurality of mounting pad portions 41. Each first strip-shaped insulating portion 741 does not reach the edge 17 of the back surface 13. That is, the exposed portion 15 is located at the end of the back surface 13 in the direction in which the one arranged on the left side in FIG. 4 of the plurality of first strip-shaped insulating portions 741 extends (direction X in the present embodiment). .. Of the plurality of first strip-shaped insulating portions 741, the one arranged on the left side in FIG. 4 is continuous with the exposed portion 15. The exposed portion 15 is formed on the substrate 1 because the insulating film extending in the direction X is not formed on the substrate 1'in order to prevent the substrate 1'described later from bending. Similarly, the exposed portion 15 is located at the end of the back surface 13 in the direction in which the one arranged on the right side in FIG. 4 of the plurality of first strip-shaped insulating portions 741 extends (direction X in the present embodiment). There is. Of the plurality of first strip-shaped insulating portions 741, the one arranged on the right side in FIG. 4 is continuous with the exposed portion 15. The exposed portion 15 is formed on the substrate 1 because the insulating film extending in the direction X is not formed on the substrate 1'. If the insulating film extending in the direction X is not formed on the substrate 1', the deflection of the substrate 1'described later can be prevented.

Each second strip-shaped insulating portion 742 extends in a longitudinal shape. Each second strip-shaped insulating portion 742 extends in a direction intersecting the direction in which each first strip-shaped insulating portion 741 extends. In the present embodiment, each second strip-shaped insulating portion 742 extends in the direction Y. Each second strip-shaped insulating portion 742 is arranged at a position sandwiched between any two of the plurality of mounting pad portions 41. More specifically, the one arranged on the upper side in FIG. 4 of the plurality of second strip-shaped insulating portions 742 is arranged at a position sandwiched between the upper two of the plurality of mounting pad portions 41. There is. On the other hand, the lower side of the plurality of second strip-shaped insulating portions 742 in FIG. 4 is arranged at a position sandwiched between the lower two of the plurality of mounting pad portions 41. Each second strip-shaped insulating portion 742 reaches the edge 17 of the back surface 13.

The case 6 is arranged on the main surface 11. The case 6 surrounds a plurality of LED chips 511, 512, 513. In this embodiment, the case 6 has a frame shape. The case 6 is made of an insulating material. Examples of the insulating material include polyphthalamide (PPA), liquid crystal polymer (LCP), silicone resin, and epoxy resin. The case 6 may be white or black, or may be a color other than white or black. A main surface electrode 2 is interposed between the case 6 and the main surface 11. More specifically, a circular pad 243 is interposed between the case 6 and the main surface 11. Further, a plurality of circular wiring portions 252 are interposed between the case 6 and the main surface 11. By ensuring that the main surface electrode 2 is interposed between the case 6 and the main surface 11, it is possible to prevent the case 6 from tilting with respect to the main surface 11. The case 6 overlaps with any of the plurality of through electrodes 31 in the direction Z view.

The case 6 has a surrounding surface 61, a case side surface 62, and a bottom surface 63.

The surrounding surface 61 surrounds a plurality of LED chips 511, 512, 513. The surrounding surface 61 is inclined with respect to the thickness direction Z of the substrate 1 so as to form an acute angle with the bottom surface 63. The angle of inclination of the surrounding surface 61 with respect to the bottom surface 63 is, for example, 80 to 85 degrees.

The case side surface 62 faces the side opposite to the area surrounded by the surrounding surface 61. The closest distance between the case side surface 62 and the surrounding surface 61 is, for example, 50 to 100 μm. The case side surface 62 is flush with the substrate side surface 12.

The bottom surface 63 faces the main surface 11. The bottom surface 63 has a frame shape. The bottom surface 63 is flat from the surrounding surface 61 to the case side surface 62. The main surface electrode 2 is interposed between the bottom surface 63 and the main surface 11. More specifically, a circular pad 243 is interposed between the bottom surface 63 and the main surface 11. Further, a plurality of circular wiring portions 252 are interposed between the bottom surface 63 and the main surface 11.

The adhesive layer 71 adheres the case 6 to the main surface 11. The adhesive layer 71 is for fixing the case 6 to the substrate 1. The adhesive layer 71 is interposed between the case 6 and the substrate 1. More specifically, the adhesive layer 71 is interposed between the main surface 11 and the bottom surface 63. The adhesive layer 71 is, for example, a cured liquid adhesive. Liquid adhesives include, for example, UV-based adhesives and acrylic-based adhesives.

The sealing resin portion 59 is arranged in a region surrounded by the case 6. The sealing resin portion 59 covers the main surface 11, the main surface electrode 2, a plurality of LED chips 511, 512, 513, the bonding layer 521, 522, 523, the surrounding surface 61, and the adhesive layer 71. There is. The sealing resin portion 59 is made of a transparent resin or a resin capable of transmitting light from a plurality of LED chips 511, 512, 513.

Next, the manufacturing method of the LED module A1 will be briefly described. The same or similar elements as above are designated by the same reference numerals as above.

FIG. 7 is a plan view showing one step of the process of manufacturing the LED module A1. FIG. 8 is a cross-sectional view taken along the line VIII-VII of FIG. These figures show the intermediate product 881 manufactured in the manufacturing process of the LED module A1. The substrate 1'in the intermediate product 881 is later diced to become a plurality of the above-mentioned substrates 1. In the intermediate product 881, the above-mentioned LED chips 511, 512, 513 and the like are already arranged on the substrate 1'.

FIG. 9 is a cross-sectional view showing one step of the method of forming the case 6'. Case 6'becomes a plurality of the above-mentioned cases 6 by dicing later. As shown in the figure, a first mold 891 and a second mold 892 are used to form the case 6'. With the second mold 892 applied to the first mold 891, the resin material is poured into the space sandwiched between the first mold 891 and the second mold 892. Case 6'is obtained by curing the resin material.

Next, as shown in FIGS. 10 and 11, the case 6'is attached to the substrate 1'via the above-mentioned adhesive layer 71 (omitted in FIGS. 10 and 11).

Next, as shown in FIGS. 12 and 13, after the sealing resin portion 59 is formed, the case 6'and the substrate 1'are collectively diced by the dicing blade 895. Through the above steps, the production of the LED module A1 is completed.

Next, the action and effect of this embodiment will be described.

The LED module A1 includes a plurality of through electrodes 31. Each through electrode 31 is connected to the main surface electrode 2 and the back surface electrode 4 and penetrates the substrate 1. According to such a configuration, it is not necessary to form an electrode for conducting the main surface electrode 2 and the back surface electrode 4 on the substrate side surface 12 of the substrate 1. Therefore, it is not necessary to form an extra space on the main surface 11 for routing the main surface electrode 2 around the side surface 12 of the substrate. Therefore, the size of the main surface 11 can be reduced. The miniaturization of the main surface 11 is suitable for miniaturizing the LED module A1.

Unlike the present embodiment, in order to make the main surface electrode 2 and the back surface electrode 4 conductive, it is conceivable to form a connecting electrode exposed in a direction orthogonal to the thickness direction Z of the substrate 1. The connecting electrode is formed in a semicircular groove recessed from the side surface 12 of the substrate. The semicircular groove is formed by dividing a circular hole formed in the substrate 1'. Forming the two LED modules A1 into small circular holes formed in the substrate 1'may cause inconvenience in the conventional technique. For example, if the circular hole is formed small, it is necessary to reduce the width of the frame-shaped portion of the case. Then, it is conceivable that the cross-sectional area of the space through which the resin material flows between the first mold 891 and the second mold 892 becomes small, and the resin material does not spread to the space. Therefore, it is necessary to make the circular hole having a certain size or more. When the size of the circular hole is to be larger than a certain size and the main surface 11 is to be miniaturized, a connecting electrode formed in a semicircular groove and another connecting electrode adjacent to the connecting electrode are connected. The electrodes will be in close proximity. If the contact electrodes are adjacent to each other, the contact electrodes may be short-circuited via the solder layer when the LED module is mounted.

On the other hand, in the LED module A1, such a connecting electrode is not formed. Therefore, according to the LED module A1, miniaturization can be achieved without the above-mentioned inconvenience.

In the LED module A1, the end of the wire 81 overlaps the back electrode 4 or the insulating film 74 in the thickness direction Z of the substrate 1. According to such a configuration, the back surface electrode 4 or the insulating film 74 is located at a position of the back surface 13 that overlaps with the end of the wire 81 in the direction Z view. FIG. 14 shows a partially enlarged cross-sectional view showing the vicinity of the back surface of the substrate 1'in the process of bonding the wires 81 in the process of manufacturing the LED module. According to the present embodiment, when the wire 81 is bonded to any one of a plurality of LED chips 511, 512, 513 or the main surface electrode 2, ultrasonic waves flowing through the wire 81 are passed through the back surface electrode 4 or the insulating film 74. Therefore, it can be efficiently flowed to the stage 882. Therefore, the wire 81 can be reliably bonded to any one of the plurality of LED chips 511, 512, 513, or to the two main surface electrodes.

If the above-mentioned semicircular groove (circular hole before dicing of the substrate 1') is formed on the substrate 1, the liquid becomes the adhesive layer 71 when the case 6'is adhered to the substrate 1'. Adhesive may drip into the circular holes. Conventionally, the case 6 is provided with a recess recessed from the bottom surface 63 in order to prevent the liquid adhesive from dripping into the circular hole. In order to provide the case 6 with a recess recessed from the bottom surface 63, a mold for forming the recess must be prepared. It takes time and money to prepare such a mold. On the other hand, in the present embodiment, the substrate 1'is not formed with a hole through which the liquid adhesive drips. Therefore, it is not necessary to provide the case 6 with a recess recessed from the bottom surface 63. Therefore, it is not necessary to perform extra processing on the second mold 892. From the above, according to the present embodiment, it is possible to reduce both the labor and cost for manufacturing the second mold 892. Since it is not necessary to provide the case 6 with a recess recessed from the bottom surface 63, the case 6 has the bottom surface 63 in the LED module A1. The bottom surface 63 is flat from the surrounding surface 61 to the case side surface 62.

It is assumed that a plurality of LED chips 511, 512, 513 are arranged on separate die pads that are separated from each other. The die pads that are separated from each other need to be separated from each other by a distance of, for example, about 75 μm. Therefore, when a plurality of LED chips 511, 512, 513 are arranged on separate die pads that are separated from each other, it is necessary to secure a separation distance between the die pads, and it is difficult to bring the LED chips 511, 512, 513 close to each other. Is. On the other hand, in the present embodiment, since the plurality of LED chips 511, 512, 513 are arranged on one die pad 241, it is not necessary to secure the separation distance between the die pads in the first place. Therefore, the separation distance between the plurality of LED chips 511, 512, 513 can be reduced. Being able to reduce the separation distance between the plurality of LED chips 511, 512, 513 is suitable for reducing the size of the LED module A1.

In the LED module A1, each wire 81 extends in a direction inclined with respect to the direction X and the direction Y orthogonal to the direction X in the thickness direction Z of the substrate 1. According to such a configuration, in the direction Z view, it is suitable to reduce the size of the LED module A1 in the direction Y as compared with the case where each wire 81 extends straight in the direction Y.

In the LED module A1, the die pads 241 are separated from the wire bonding pads 242 via a gap. According to such a configuration, even if the liquid resin material to be the bonding layer 522 or the bonding layer 523 moves from the die pad 241 to the wire bonding pad 242 when the bonding layer 522 or the bonding layer 523 is formed. It can be retained between the die pad 241 and the wire bonding pad 242. Therefore, it is possible to prevent the bonding layer 522 and the bonding layer 523 from covering the wire bonding pad 242. Therefore, the region of the wire bonding pad 242 to which the wire 81 should be bonded can be reliably exposed without being covered by the bonding layer 522 or the bonding layer 523.

A second embodiment of the present invention will be described with reference to FIGS. 15 to 18.

FIG. 15 is a plan view of the LED module according to the present embodiment. FIG. 16 is a plan view in which the case and the adhesive layer are omitted from FIG. FIG. 17 is a bottom view of the LED module according to this embodiment. FIG. 18 is a cross-sectional view taken along the line XVIII-XVIII of FIG.

The LED module A2 shown in the figure is sealed with a substrate 1, a main surface electrode 2, a plurality of through electrodes 31, a back surface electrode 4, an LED chip 511,512,513, and a bonding layer 521,522,523. A stop resin portion 59, a case 6, an adhesive layer 71, an insulating film 74, and a plurality of wires 81 are provided. Each configuration of the substrate 1, the LED chip 511, 512, 513, the bonding layer 521, 522, 523, the sealing resin portion 59, the case 6, the adhesive layer 71, the insulating film 74, and the plurality of wires 81 is the above-mentioned LED module. Since it is the same as A1, the description thereof will be omitted. In FIG. 15, the sealing resin portion 59 is omitted for convenience of understanding.

The main surface electrode 2 is formed on the main surface 11. The main surface electrode 2 includes a first conductive portion 24 and a plurality of second conductive portions 25. Since the plurality of second conductive portions 25 are the same as those in the LED module A1, the description thereof will be omitted.

Any one of the LED chips 511, 512, 513 is arranged in the first conductive portion 24. The first conductive portion 24 includes a plurality of (three) die pads 241a, 241b, 241c, a plurality of (three) wire bonding pads 242a, 242b, 242c, and a plurality of (three) circular pads 243a, 243b, 243c. And a plurality of (three) strips 244a, 244b, 244c.

The die pad 241a has a rectangular shape. An LED chip 511 is arranged on the die pad 241a.

The wire bonding pad 242a has a rectangular shape. In the present embodiment, none of the plurality of wires 81 is bonded to the wire bonding pad 242a. The die pads 241a are separated from the wire bonding pads 242a via a gap. The wire bonding pad 242a is separated from the die pad 241a in a direction Y intersecting the direction X (in this embodiment, orthogonal to the direction X).

The circular pad 243a has a circular shape in the Z direction. The circular pad 243a is conductive to the die pad 241a and the wire bonding pad 242a.

The band-shaped portion 244a extends in a band shape along the direction Y. The band-shaped portion 244a is conductive to the die pad 241a. In the present embodiment, the strip-shaped portion 244a also conducts to the circular pad 243a. The strip 244a is connected to the die pad 241a and the circular pad 243a.

The die pad 241a, the wire bonding pad 242a, the circular pad 243a, and the strip-shaped portion 244a are integrated.

The die pad 241b, the wire bonding pad 242b, the circular pad 243b, and the strip-shaped portion 244b are substantially the same as the die pad 241a, the wire bonding pad 242a, the circular pad 243a, and the strip-shaped portion 244a, respectively.

The die pad 241b has a rectangular shape. An LED chip 512 is arranged on the die pad 241b.

The wire bonding pad 242b has a rectangular shape. In the present embodiment, one of the plurality of wires 81 is bonded to the wire bonding pad 242b. The die pads 241b are separated from the wire bonding pads 242b via a gap. The wire bonding pad 242b is separated from the die pad 241b in a direction Y intersecting the direction X (in this embodiment, orthogonal to the direction X).

The circular pad 243b has a circular shape in the Z direction. The circular pad 243b is conductive to the die pad 241b and the wire bonding pad 242b.

The band-shaped portion 244b extends in a band shape along the direction Y. The band-shaped portion 244b is conductive to the die pad 241b. In the present embodiment, the strip-shaped portion 244b is also conducting to the circular pad 243b. The strip 244b is connected to the die pad 241b and the circular pad 243b.

The die pad 241b, the wire bonding pad 242b, the circular pad 243b, and the strip-shaped portion 244b are integrated.

The die pad 241c, the wire bonding pad 242c, the circular pad 243c, and the strip-shaped portion 244c are substantially the same as the die pad 241a, the wire bonding pad 242a, the circular pad 243a, and the strip-shaped portion 244a, respectively.

The die pad 241c has a rectangular shape. An LED chip 513 is arranged on the die pad 241c.

The wire bonding pad 242c has a rectangular shape. In the present embodiment, one of the plurality of wires 81 is bonded to the wire bonding pad 242c. The die pads 241c are separated from the wire bonding pads 242c via a gap. The wire bonding pad 242c is separated from the die pad 241c in a direction Y intersecting the direction X (in this embodiment, orthogonal to the direction X).

The circular pad 243c has a circular shape in the Z direction. The circular pad 243c is conductive to the die pad 241c and the wire bonding pad 242c.

The band-shaped portion 244c extends in a band shape along the direction Y. The band-shaped portion 244c is conductive to the die pad 241c. In the present embodiment, the strip-shaped portion 244c also conducts to the circular pad 243c. The strip 244c is connected to the die pad 241c and the circular pad 243c.

The die pad 241c, the wire bonding pad 242c, the circular pad 243c, and the strip-shaped portion 244c are integrated.

The die pads 241a, 241b, and 241c are separated from each other.

The back surface electrode 4 is different from the LED module A1 in that the number of mounting pad portions 41 is 6, but the other points are the same as those in the LED module A1, so the description thereof will be omitted.

Next, the action and effect of this embodiment will be described.

The LED module A2, like the LED module A1, is suitable for miniaturization.

In the LED module A2, the end portion of the wire 81 overlaps the back surface electrode 4 or the insulating film 74 in the thickness direction Z view of the substrate 1. According to such a configuration, the wires 81 can be reliably bonded as described with respect to the LED module A1.

According to the present embodiment, both the labor and the cost for manufacturing the second mold 892 can be reduced as described for the LED module A1. Since it is not necessary to provide the case 6 with a recess recessed from the bottom surface 63, the case 6 has the bottom surface 63 in the LED module A2. The bottom surface 63 is flat from the surrounding surface 61 to the case side surface 62.

19 to 23 show an LED module based on the first reference example of the present invention. The LED module 101 of this reference example includes a substrate 200, wiring 300, three LED chips 401, 402, 403, and a translucent resin portion 700. The LED module 101 is configured as a so-called side view type LED module, which is mounted on, for example, the mounting board 801 in the posture shown in FIG. 23. In this reference example, the LED module 101 has an x-direction dimension of about 3.0 mm, a y-direction dimension of about 0.43 mm, and a z-direction dimension of about 1.3 mm.

The substrate 200 is an insulating substrate made of, for example, a glass epoxy resin, has an elongated rectangular shape with the x direction as the longitudinal direction and the y direction as the lateral direction, and the z direction as the thickness direction. The substrate 200 has a main surface 201, a back surface 202, a bottom surface 203, and two side surfaces 204. Further, the substrate 200 is formed with two through holes 211,212 and two corner grooves 221,222. As shown in FIGS. 19 and 22, the through holes 211 and 212 are arranged on the side opposite to the bottom surface 203 in the y direction. In this reference example, the substrate 200 has an x-direction dimension of about 3.0 mm, a y-direction dimension of about 0.43 mm, and a z-direction dimension of about 0.5 mm.

The two through holes 211 and 212 penetrate the substrate 200 in the z direction and reach from the main surface 201 to the back surface 202. The corner grooves 221 and 222 are interposed between the side surface 204 and the bottom surface 203 and extend in the z direction. The corner grooves 221 and 222 extend from the main surface 201 to the back surface 202 and have a quarter-circular cross section.

The wiring 300 constitutes a path for supplying electric power to the three LED chips 401, 402, 403, and is a die bonding pad 301, 302, 303, two quarter annular portions 321 and a main surface connecting wiring 322, and a branch. It has a shaped wiring 323, a corner groove wiring 341, 342, a through electrode 351, 352, and a back electrode 370. The wiring 300 has a structure in which, for example, Cu plating, Ni plating, and Au plating are laminated.

The die bonding pads 301, 302, 303 are arranged in the x direction, and the LED chips 401, 402, 403 are die bonded. The die bonding pads 301 and 302 have a shape in which a square portion and a circular portion are combined. The circular portions of the die bonding pads 301 and 302 are arranged on opposite sides in the x direction. The die bonding pad 303 has a square-shaped portion and a strip-shaped portion extending from the square portion in the x direction.

The quaternary annular portion 321 is formed in the vicinity of the portion of the main surface 201 that is connected to the corner grooves 221,222. The main surface connecting wiring 322 has a band shape extending in the x direction from the quarter annular portion 321 near the corner groove 221 and is arranged near one end of the main surface 201 in the y direction. The branch wiring 323 extends in the y direction from the middle portion of the main surface connecting wiring 322 toward between the die bonding pads 301 and 302.

The corner groove wirings 341 and 342 are formed so as to cover the inner surfaces of the corner grooves 221 and 222 of the substrate 200, and reach from the main surface 201 to the back surface 202. Through electrodes 351 and 352 are formed on the inner surfaces of through holes 211 and 212 and have a cylindrical shape. Through electrodes 351 and 352 reach from the main surface 201 to the back surface 202. In this reference example, the filling resin 602 is filled inside the through electrodes 351 and 352.

The back electrode 370 is formed on the back surface 202, and in this reference example, it is composed of individual electrodes 371 and 372, end individual electrodes 374, and end common electrodes 375. The individual electrodes 371 and 372, the end individual electrodes 374, and the end common electrode 375 are arranged in the x direction. The individual electrodes 371 and 372 are sandwiched between the end individual electrodes 374 and the end common electrodes 375. The individual electrode 371 overlaps with the through hole 211 in the z-direction view and is connected to the through electrode 351. The individual electrode 372 overlaps the through hole 212 in the z-direction view and is connected to the through electrode 352. The end individual electrode 374 is provided near one end of the back surface 202 and is connected to the corner groove wiring 342. The end common electrode 375 is provided near the other end of the back surface 202, and is connected to the corner groove wiring 341.

In this reference example, a plurality of insulating films 601 are provided on the back surface 202. These insulating films 601 cover the portion of the back surface 202 exposed from the back surface electrode 370 and a part of the individual electrodes 371 and 372. Further, the wiring 300 is not formed on the bottom surface 203, and all of the bottom surface 203 is exposed. When the LED module 101 is mounted on the mounting board 801 shown in FIG. 23, a solder fillet 802 is formed in contact with a pad (not shown) of the mounting board 801 and individual electrodes 371 and 372. Further, not only the solder fillet 802 is formed on the end individual electrode 374 and the end common electrode 375, but also a part of the solder fillet 802 is formed on the end individual electrode 374 or the end common electrode 375 and the mounting substrate 801. It will be filled in the space surrounded by.

The LED chips 401, 402, and 403 are light sources of the LED module 101, and have a structure in which, for example, a p-type semiconductor layer, an n-type semiconductor layer, and an active layer sandwiched between them are laminated. The LED chip 401 is die-bonded to the die bonding pad 301 and emits blue light, for example. The LED chip 402 is die-bonded to the die bonding pad 302 and emits red light, for example. The LED chip 403 is die-bonded to the die bonding pad 303, and emits green light, for example. The LED chips 401 and 402 are each connected to the branch wiring 323 by a wire 500. The LED chip 403 is connected to the main surface connecting wiring 322 by a wire 500. The separation distance between the LED chips 401, 402, and 403 is preferably 100 to 150 μm.

The individual electrode 371 is electrically connected to the LED chip 401 via the through electrode 351. The individual electrode 372 is conducting with the LED chip 402 via the through electrode 352. The end individual electrode 374 is conducting with the LED chip 403 via the corner groove wiring 342. The end common electrode 375 is electrically connected to the LED chips 401, 402, and 403 via the corner groove wiring 341.

The translucent resin portion 700 is provided on the main surface 201 of the substrate 200 and covers the LED chips 401, 402, and 403. The translucent resin portion 700 is made of a transparent resin such as an epoxy resin or a resin capable of transmitting light from the LED chips 401, 402, 403. In this reference example, the shape of the translucent resin portion 700 in the y direction is trapezoidal, and the shape in the x direction is rectangular. The z-direction dimension of the translucent resin portion 700 is, for example, about 0.8 mm.

Next, the operation of the LED module 101 will be described.

According to this reference example, the path from the individual electrodes 371 and 372 via the through electrodes 351 and 352 is used as a path for supplying electric power to the LED chips 401 and 402. This path has no portion that goes around from the main surface 201 or the back surface 202 to the bottom surface 203. Therefore, it is possible to reduce the space to be secured on the main surface 201 and the back surface 202 in order to form the wiring 300. Therefore, the size of the LED module 101 can be reduced.

The path from the end individual electrode 374 and the end common electrode 375 via the corner groove wirings 341 and 342 is used as a path for supplying electric power to the LED chips 401, 402, and 403. As a result, the bottom surface 203 is not covered by the wiring 300 at all. That is, there is no portion where the wiring 300 wraps around from the main surface 201 or the back surface 202 to the bottom surface 203. Therefore, the space to be secured on the main surface 201 and the back surface 202 for forming the wiring 300 can be further reduced.

As shown in FIG. 22, the through holes 211 and 212 are on the side separated from the bottom surface 203 in the y direction. As a result, even if the individual electrodes 371 and 372 are unintentionally deformed due to the presence of the through holes 211 and 212, it is possible to prevent the mounting posture of the LED module 101 from being disturbed by this deformation.

In FIGS. 24 to 31, elements that are the same as or similar to those of the reference example are designated by the same reference numerals as those of the reference example.

24 to 27 show an LED module based on the second reference example of the present invention. The LED module 102 of this reference example includes three through holes 211,212,213, and has three individual electrodes 371,372,373 and two end common electrodes 375,376. Further, the LED module 102 includes a reflector 710. The LED module 102 has an x-direction dimension of about 2.0 mm, a y-direction dimension of about 0.5 mm, and a z-direction dimension of about 0.9 mm. In FIG. 24, the translucent resin portion 700 is omitted for convenience of understanding.

Three through holes 211,212, 213 are formed in the substrate 200. Through electrodes 351 and 352, 353 (through electrodes 351 and 353 are not shown) are formed on the inner surfaces of these through holes 211,212 and 213. The individual electrodes 371,372,373 are connected to the through electrodes 351,352,353 in this order. Three die bonding pads 301, 302, and 303 are formed on the main surface 201. The three LED chips 401, 402, 403 are die-bonded to the die bonding pads 301, 302, 303, and are electrically connected to the through electrodes 351,352,353. Through holes 211 and 213 (through electrodes 351 and 353) are arranged on the upper side in the drawing in FIG. 24 with respect to the LED chips 401 and 403. The through hole 212 (through electrode 352) is arranged on the lower side in the drawing in FIG. 24 with respect to the LED chip 402.

Two bonding pads 311, 312 are formed on the main surface 201. The bonding pad 311 and the LED chip 401 are connected by a wire 500. The bonding pad 312 and the LED chips 402 and 403 are connected by wires 500, respectively. The bonding pad 311 is connected to one of the quarter annular portions 321 and is electrically connected to the end common electrode 375 via the corner groove wiring 341. The bonding pad 312 is connected to the other quarter annular portion 321 and conducts with the end common electrode 376 via the corner groove wiring 342.

The reflector 710 is made of, for example, a white resin and is formed on the main surface 201. The reflector 710 has a reflecting surface 711. The reflecting surface 711 surrounds the LED chips 401, 402, 403 and functions to reflect the light traveling in the x direction or the y direction from the LED chips 401, 402, 403 in the z direction. The z-direction dimension of the reflector 710 is, for example, about 0.4 mm. The region surrounded by the reflector 710 is filled with the translucent resin portion 700.

The LED module 102 can also be miniaturized by such a reference example. By arranging the LED chips 401, 402, 403 and the through holes 211,212,213 in a so-called staggered arrangement, the x-direction dimension of the substrate 200 can be reduced.

28 to 31 show an LED module based on the third embodiment of the present invention. The LED module 103 of the present embodiment is different from the LED module 102 described above in the configuration of the wiring 300 on the main surface 201 and the back surface 202. The LED module 103 has an x-direction dimension of about 2.7 mm, a y-direction dimension of about 0.5 mm, and a z-direction dimension of about 0.9 mm. In FIG. 28, the translucent resin portion 700 is omitted for convenience of understanding. In FIG. 31, the region where the insulating film 601 is formed is represented by hatching.

In the present embodiment, the die bonding pad 303 is connected to the quarter annular portion 321. The quarter annular portion 321 is connected to the corner groove wiring 342. The back electrode 370 has an end individual electrode 374. The end individual electrode 374 is connected to the corner groove wiring 342. The bonding pad 312 connected to the LED chip 403 by the wire 500 is connected to the through electrode 353 (not shown) formed in the through hole 213. The back electrode 370 has a back connecting wiring 378. The rear connecting wiring 378 connects the through electrode 353 and the end common electrode 375. On the main surface 201, the bonding pad 311 and the LED chips 401 and 402 are connected by wires 500, respectively. The bonding pad 311 is conductive to the end common electrode 375 via the corner groove wiring 341. As a result, the end common electrode 375 is conductive not only to the LED chips 401 and 402 but also to the LED chip 403. The through holes 211 and 212 overlap with the LED chips 401 and 402 in the z-direction view.

The wire 500 that connects the LED chip 402 and the bonding pad 311 among the plurality of wires 500 has a portion that overlaps with the LED chip 401 in the direction z view. The center of the LED chip 401 is located at a position deviated from the center of the LED chip 402 in the direction y. The through hole 212 has a portion that overlaps the LED chip 402 and a portion that protrudes from the LED chip 402 in the z-direction.

The insulating film 601 covers the back electrode 370. Specifically, the insulating film 601 covers the back connecting wiring 378. The insulating film 601 exposes at least a part of the individual electrodes 371 and 372. The insulating film 601 covers the portion of the individual electrodes 371 and 372 that is close to the back connecting wiring 378. This makes it possible to prevent the insulating film 601 from being turned over. The insulating film 601 exposes both the end individual electrodes 374 and the end common electrodes 375.

The LED module 103 can also be miniaturized according to such an embodiment. By superimposing the through holes 211 and 212 on the LED chips 401 and 402 in the z direction, the miniaturization of the substrate 200, that is, the miniaturization of the LED module 103 can be further promoted.

In the LED module 103, the wire 500 that connects the LED chip 402 and the bonding pad 311 among the plurality of wires 500 has a portion that overlaps with the LED chip 401 in the direction z view. According to such a configuration, the wire 500 can be bonded to the LED chip 402 and the bonding pad 311 arranged on opposite sides of the LED chip 401. Therefore, it is not necessary to form a bonding pad for bonding the wire 500 bonded to the LED chip 402 between the LED chip 402 and the LED chip 401 or between the LED chip 402 and the LED chip 403. Therefore, the separation distance between the LED chip 402 and the LED chip 401 or the separation distance between the LED chip 402 and the LED chip 403 can be reduced.

In the LED module 103, the center of the LED chip 401 is located at a position deviated from the center of the LED chip 402 in the direction y. This is suitable for preventing the wire 500 connected to the LED chip 401 and the wire 500 connected to the LED chip 402 from coming into contact with each other. It is also suitable for preventing the capillary used when forming the wire 500 from coming into contact with another wire 500.

In the LED module 103, the through hole 212 has a portion that overlaps the LED chip 402 and a portion that protrudes from the LED chip 402 in the direction z view. According to such a configuration, the separation distance between the individual electrode 372 overlapping the through hole 212 and the back surface connecting wiring 378 can be separated to some extent.

In the LED module 103, the insulating film 601 covers the back connecting wiring 378. According to such a configuration, it is possible to prevent the solder in contact with the individual electrode 371 and the individual electrode 372 from adhering to the back surface connecting wiring 378. Therefore, it is possible to prevent a problem that the individual electrode 371 and the individual electrode 372 are short-circuited with the rear connecting wiring 378 via the solder.

The present invention is not limited to the above-described embodiments. The specific configuration of each part of the present invention can be freely redesigned.

B1 mounting structure 871 mounting board 872 solder layer A1, A2 LED module 1, 1'board 11 main surface 12 board side surface 13 back surface 15 exposed part 17 edge 2 main surface electrode 24 first conductive part 241,241a, 241b, 241c die pad 242, 242a, 242b, 242c Wire bonding pad 243, 243a, 243b, 243c Circular pad 244, 245, 244a, 244b, 244c Band 25 Second conductive part 251 Wire bonding wiring part 252 Circular wiring part 31 Penetration electrode 4 Back side electrode 41 Mounting pad part 511,512,513 LED chip 521,522,523 Bonding layer 59 Encapsulating resin part 6,6'Case 61 Surrounding surface 62 Case side surface 63 Bottom surface 71 Adhesive layer 74 Insulating film 741 First band-shaped insulating part 742 2 Band-shaped insulation 81 Wire 881 Intermediate product 882 Stage 891 1st mold 892 2nd mold 895 Dying blades 101, 102, 103 LED module 200 Board 201 Main surface 202 Back surface 203 Bottom surface 204 Side surfaces 211,212, 213 Through holes 221 , 222 Corner groove 300 Wiring 301, 302, 303 Die bonding pad (pad)
311, 312 Bonding pad (pad)
321 Quarter ring part 322 Main surface communication wiring 323 Branch wiring 341,342 Corner groove wiring 351,352,353 Through electrode 370 Back electrode 371,372,373 Individual electrode 374 End individual electrode 375,376 End common electrode 378 Back Communication wiring 401, 402, 403 LED chip 500 Wire 601 Insulation film 602 Filling resin 700 Translucent resin part 710 Reflector 711 Reflection surface 801 Mounting board 802 Handa fillet

Claims (6)

A substrate having a main surface and a back surface facing opposite sides in the thickness direction,
With the main surface electrodes formed on the main surface,
The first LED chip, the second LED chip, and the third LED chip arranged in order from one side to the other side along the first direction perpendicular to the thickness direction on the main surface electrode.
A first wire bonded to the first LED chip and the main surface electrode,
A second wire bonded to the second LED chip and the main surface electrode,
A third wire bonded to the third LED chip and the main surface electrode,
A case arranged on the main surface and surrounding the first to third LED chips is provided.
The main surface electrode includes a first conductive portion and includes a first conductive portion.
The first conductive portion includes a first die pad and a first wire bonding pad conducting the first die pad.
The first die pad and the first wire bonding pad are arranged apart from each other through a gap in the thickness direction and the second direction perpendicular to the first direction.
The first to third LED chips are arranged on the first die pad.
The second wire and the third wire are bonded to the first wire bonding pad.
The main surface electrode further includes a second conductive portion insulated from the first conductive portion.
The second conductive portion is arranged on one side of the first direction with respect to the first wire bonding pad, and the first wire is bonded.
The first wire bonding pad overlaps the portion of the first die pad that overlaps the first LED chip and the second LED chip in the thickness direction, and is the thickness of the first die pad that overlaps in the second direction. The portion overlapping the third LED chip in the directional view and the portion overlapping the third LED chip in the directional view are separated from each other in the second directional view.
The second conductive portion overlaps the portion of the first die pad that overlaps with the first LED chip in the thickness direction view and overlaps with the portion of the first die pad that overlaps with the first LED chip in the thickness direction view, and the first die pad of the first die pad that overlaps with the thickness direction view. It is separated from the portion overlapping the 2LED chip and the 3rd LED chip in the 2nd direction view.
A plurality of through electrodes connected to the main surface electrode and penetrating the substrate,
A back surface electrode formed on the back surface and connected to each of the plurality of through electrodes is further provided.
The first conductive portion further has a circular circular pad interposed between the first die pad and the first wire bonding pad.
The circular pad is connected to any of the plurality of through electrodes,
The through electrode connected to the circular pad is included in the circular pad in a plan view.
The circular pad is arranged in the second direction with respect to the first die pad, and is arranged on the other side of the first direction with respect to the first wire bonding pad.
The first conductive portion further includes a first strip-shaped portion connecting the first die pad and the circular pad, and a second strip-shaped portion connecting the circular pad and the first wire bonding pad.
The size of the first wire bonding pad in the second direction is larger than the size of the second band-shaped portion in the second direction.
The main surface electrodes are arranged inside the outer edge of the main surface when viewed in the thickness direction.
The case is an LED module that reaches the outer edge of the main surface when viewed in the thickness direction. The LED module according to claim 1, wherein the first die pad has an elongated rectangular shape with the first direction as a longitudinal direction. The LED module according to claim 2, wherein the first wire bonding pad has an elongated rectangular shape with the first direction as a longitudinal direction. The second conductive portion has a second wire bonding wiring portion and a circular second circular wiring portion.
The first wire is bonded to the second wire bonding wiring portion.
One of the plurality of through electrodes is connected to the second circular wiring portion,
The LED module according to any one of claims 1 to 3 , wherein the through electrode connected to the second circular wiring portion is included in the second circular wiring portion in a plan view. The main surface electrode further includes a third conductive portion insulated from the first conductive portion.
The third conductive portion is arranged on the side opposite to the first wire bonding pad with the first die pad sandwiched in the second direction.
The LED module according to any one of claims 1 to 4 , further comprising an additional second wire bonded to the second LED chip and the third conductive portion. The main surface electrode further includes a fourth conductive portion insulated from the first conductive portion.
The fourth conductive portion is arranged on the side opposite to the first wire bonding pad with the first die pad sandwiched in the second direction, and on the other side of the first direction with respect to the third conductive portion. Have been placed and
The LED module according to claim 5 , further comprising an additional third wire bonded to the third LED chip and the fourth conductive portion.

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