JP2018142708A - Led module and packaging structure of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an LED module capable of improving a yield.SOLUTION: An LED module comprises: a substrate 200 including a main surface 201, a back surface, and a bottom surface 203; a first light emission element 401 arranged on the main surface; a conductive layer 300 formed on the substrate, and conducted to the first light emission element; a first conductive junction layer interposed between the first light emission element and the conductive layer; a main surface insulation film 600 formed on the main surface and covering a part of the conductive layer; and a first wire 501. The main surface and the back surface have a long rectangular shape and are directed opposite to each other. The bottom surface connects a long side of the main surface and the long side of the back surface and is a component side. The conductive layer includes a first wire bonding part 323 in which the first wire is bonded. The main insulation film includes a first insulation part 610. The first insulation part includes a position interposed between the first light emission element and the first bonding part in a thickness direction Z view of the substrate as a direction orthogonal to the main surface.SELECTED DRAWING: Figure 3

Description

  The present invention relates to an LED module and a mounting structure of the LED module.

  Conventionally, an LED module that emits desired light is known (for example, see Patent Document 1). As shown in FIG. 1, the LED module 900 disclosed in the same document includes a substrate 920, wiring 930, LED chips 940, and wires 950. The wiring 930 is formed on the substrate 920. The wiring 930 includes a wire bonding pad 931 to which the wire 950 is bonded. The LED chip 940 is disposed on the wiring 930.

  In such a conventional LED module 900, the LED chip 940 is disposed on the wiring 930 through, for example, silver paste (not shown in FIG. 1). If the silver paste reaches the wire bonding pad 931 when the LED chip 940 is disposed, the portion of the wiring 930 where the LED chip 940 is disposed and the wire bonding pad 931 are short-circuited. This hinders yield improvement.

JP 2012-169326 A

  The present invention has been conceived under the circumstances described above, and its main object is to provide an LED module capable of improving the yield.

  According to the first aspect of the present invention, a substrate having a main surface, a back surface, and a bottom surface, a first light emitting element disposed on the main surface, and a conductive material formed on the substrate and conducting to the first light emitting element. A first conductive bonding layer interposed between the first light emitting element and the conductive layer; a main surface insulating film formed on the main surface and covering a part of the conductive layer; A wire, and the main surface and the back surface are oriented in opposite directions and have a long rectangular shape, and the bottom surface connects the long side of the main surface and the long side of the back surface, and is mounted The conductive layer includes a first wire bonding portion to which the first wire is bonded; the main surface insulating film includes a first insulating portion; and the first insulating portion is formed on the main surface. In the thickness direction view of the substrate that is orthogonal to the first light emitting element and the substrate, Has a portion interposed between one wire bonding portion, LED module is provided.

  Preferably, the first insulating portion crosses the first light emitting element in the longitudinal direction of the main surface.

  Preferably, the first insulating portion is formed from one end of the main surface in the short direction of the main surface to the other end of the main surface in the short direction of the main surface.

  Preferably, the first insulating portion has a strip shape extending along a short direction of the main surface.

  Preferably, the first insulating part is separated from the first wire bonding part.

  Preferably, the first wire bonding portion is spaced apart from the first light emitting element in the longitudinal direction.

  Preferably, the first wire is bonded to the first light emitting element.

  Preferably, the first wire straddles the first insulating portion.

  Preferably, the conductive layer includes a first belt-like portion that is electrically connected to the first wire bonding portion and extends along a longitudinal direction of the main surface, and the first belt-like portion is connected to the first light emitting element. On the other hand, the main surface is spaced apart in the short direction.

  Preferably, the first strip portion is connected to the first wire bonding portion.

  Preferably, the conductive layer includes a first main surface individual electrode to which the first light emitting element is bonded, and the first band-shaped portion is in a short direction of the main surface with respect to the first main surface individual electrode. It is separated.

  Preferably, a separation distance between the first belt-like portion and the first principal surface individual electrode is 0.04 to 0.08 mm.

  Preferably, the main surface insulating film includes a first covering portion that covers the first strip-shaped portion, and the first covering portion extends to a side where the first light emitting element is located with respect to the first strip-shaped portion. Yes.

  Preferably, the first covering portion has a strip shape extending along the longitudinal direction of the main surface.

  Preferably, the width of the first covering portion is larger than the width of the first strip portion.

  Preferably, the first covering portion is connected to the first insulating portion.

  Preferably, the conductive layer includes a first main surface individual electrode to which the first light emitting element is bonded, and the first covering portion is in a short direction of the main surface with respect to the first main surface individual electrode. It is spaced apart, and the separation distance between the first covering portion and the first main surface individual electrode is 0.02 to 0.06 mm.

  Preferably, a second wire is further provided, the conductive layer includes a second wire bonding portion to which the second wire is bonded, the main surface insulating film includes a second insulating portion, and the second insulating portion. Has a portion interposed between the first light emitting element and the second wire bonding part in the thickness direction of the substrate, and the first light emitting element includes the second insulating part and the first insulating part. It is arrange | positioned between insulation parts.

  Preferably, the second insulating portion crosses the first light emitting element in the longitudinal direction of the main surface.

  Preferably, the second insulating portion is formed from one end of the main surface in the short direction of the main surface to the other end of the main surface in the short direction of the main surface.

  Preferably, the second insulating portion has a strip shape extending along a short direction of the main surface.

  Preferably, the second insulating part is separated from the second wire bonding part.

  Preferably, the second wire bonding portion is separated from the first light emitting element in the longitudinal direction of the main surface.

  Preferably, the second wire bonding portion is electrically connected to the first wire bonding portion.

  Preferably, the second wire bonding part is connected to the first belt-like part.

  Preferably, the second insulating portion is connected to the first covering portion.

  Preferably, at least three sides of the first light emitting element are surrounded by the main surface insulating film by the first insulating portion, the second insulating portion, and the first covering portion.

  Preferably, the conductive layer includes a first main surface individual electrode to which the first light emitting element is bonded, and the conductive layer includes a first through wiring penetrating the substrate, and the first main surface individual electrode. Comprises a first die bonding portion to which the first light emitting element is bonded, and a first adjacent portion connected to the first die bonding portion and adjacent to the first die bonding portion, and the first adjacent portion. The portion overlaps the first through wiring in the thickness direction view.

  Preferably, the second insulating portion overlaps the first adjacent portion in the thickness direction view.

  Preferably, further comprising: a second light emitting element disposed on the main surface; and a second conductive bonding layer interposed between the second light emitting element and the conductive layer, and the first light emitting element and The second light emitting elements are spaced apart from each other in the longitudinal direction of the main surface, and the second wire bonding portion is formed between the first light emitting element and the second light emitting element in a short direction view of the main surface. Located between.

  Preferably, the second wire is bonded to the second light emitting element.

  Preferably, the conductive layer includes a main surface end individual electrode to which the second light emitting element is bonded, and a separation distance between the main surface end individual electrode and the second wire bonding unit is 0.07 to 0.07. 0.13 mm.

  Preferably, the first light emitting device further includes a third light emitting device disposed on the main surface, and a third conductive bonding layer interposed between the third light emitting device and the conductive layer. The main surface is located between the second light emitting element and the third light emitting element in the short direction view, and the main surface insulating film includes a third insulating part, and the third insulating part is And a portion interposed between the third light emitting element and the first wire bonding portion in the thickness direction of the substrate.

  Preferably, the conductive layer includes a second main surface individual electrode to which the third light emitting element is bonded, and the third insulating portion covers a part of the second main surface individual electrode.

  Preferably, the conductive layer includes a second through wiring penetrating the substrate, and the second main surface individual electrode includes a second die bonding portion to which the third light emitting element is bonded, and the second die bonding. And a second adjacent portion adjacent to the second die bonding portion, and the second adjacent portion overlaps the second through wiring in the thickness direction view.

  Preferably, the third insulating portion overlaps the second adjacent portion in the thickness direction view.

  Preferably, the conductive layer includes a second strip portion that is electrically connected to the first wire bonding portion and extends along a longitudinal direction of the main surface, and the second strip portion is connected to the third light emitting element. On the other hand, the main surface is spaced apart in the short direction.

  Preferably, the second strip portion is connected to the first wire bonding portion.

  Preferably, the main surface insulating film includes a second covering portion that covers the second strip-shaped portion, and the second covering portion extends to a side where the third light emitting element is located with respect to the second strip-shaped portion. Yes.

  Preferably, the second covering portion has a strip shape extending along the longitudinal direction of the main surface.

  Preferably, the width of the second covering portion is larger than the width of the second strip portion.

  Preferably, the second covering portion is connected to the third insulating portion.

  Preferably, the substrate has a side surface connecting the main surface and the back surface, the substrate is recessed from the side surface and the bottom surface, and the main surface and the back surface in the thickness direction of the substrate. And the conductive layer includes corner groove wiring formed on the inner surface of the corner groove.

  Preferably, the cross-sectional shape of the corner groove is a quarter circle shape.

  Preferably, the conductive layer further includes a back electrode formed on the back surface.

  Preferably, a translucent resin that covers the first light emitting element is further provided.

  According to a second aspect of the present invention, there is provided an LED module mounting structure comprising the LED module provided by the first aspect of the present invention and a circuit board facing the bottom surface.

  Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.

It is a top view of the conventional LED module. It is a top view of the LED module concerning 1st Embodiment of this invention. It is the figure which abbreviate | omitted translucent resin from FIG. It is the figure which abbreviate | omitted the main surface insulating film from FIG. It is the figure which abbreviate | omitted the light emitting element and the wire from FIG. It is a front view of the LED module shown in FIG. It is the figure of the LED module seen from the opposite side to FIG. It is the figure which looked at the LED module shown in FIG. 2 from the bottom. It is sectional drawing which follows the IX-IX line of FIG. It is a partial expanded sectional view which follows the XX line of FIG. FIG. 4 is a partially enlarged cross-sectional view taken along line XI-XI in FIG. 3. It is a figure which shows the mounting structure concerning 1st Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be specifically described with reference to the drawings.

<First Embodiment>
A first embodiment of the present invention will be described with reference to FIGS.

  FIG. 2 is a plan view of the LED module according to the first embodiment of the present invention. FIG. 6 is a front view of the LED module shown in FIG. FIG. 7 is a view of the LED module as viewed from the side opposite to FIG. FIG. 8 is a view of the LED module shown in FIG. 2 as viewed from below. 9 is a cross-sectional view taken along line IX-IX in FIG.

  The LED module A1 shown in these drawings includes a substrate 200, a conductive layer 300, a plurality of light emitting elements (first light emitting element 401, second light emitting element 402, and third light emitting element 403), and a plurality of conductive junctions. Layers (first conductive bonding layer 411, second conductive bonding layer 412, and third conductive bonding layer 413), and a plurality of wires (first wire 501, second wire 502, and third wire 503) , A main surface insulating film 600, a back surface insulating film 710, and a translucent resin 720.

  FIG. 3 is a diagram in which the translucent resin is omitted from FIG. FIG. 4 is a view in which the main surface insulating film is omitted from FIG.

  The LED module A1 is a so-called side view type LED module that is mounted on the circuit board 801 in the posture shown in FIG.

  The substrate 200 is made of an insulating material. An example of such an insulating material is glass epoxy resin.

  The substrate 200 has a main surface 201, a back surface 202, a bottom surface 203, and two side surfaces 204 and 205.

  The main surface 201, the back surface 202, the bottom surface 203, and the two side surfaces 204 and 205 are all flat. The main surface 201 and the back surface 202 face in opposite directions and have a long rectangular shape. The thickness direction Z of the substrate 200 coincides with the direction orthogonal to the main surface 201. The bottom surface 203 connects the long side of the main surface 201 and the long side of the back surface 202, and is a mounting surface. The side surfaces 204 and 205 face opposite sides. The side surfaces 204 and 205 connect the main surface 201 and the back surface 202, respectively.

  In the substrate 200, two first through holes 211, a second through hole 212, and two corner grooves 221 and 222 are formed.

  The first through hole 211 and the second through hole 212 shown in FIGS. 3 to 5, 9, and the like are disposed on the opposite side of the bottom surface 203 in the short direction Y of the main surface 201. The first through hole 211 and the second through hole 212 penetrate the substrate 200 in the thickness direction Z and reach the back surface 202 from the main surface 201.

  The corner groove 221 is recessed from the side surface 204 and the bottom surface 203. The corner groove 221 reaches the main surface 201 and the back surface 202 in the thickness direction Z of the substrate 200. The corner groove 222 is recessed from the side surface 205 and the bottom surface 203. The corner groove 222 reaches the main surface 201 and the back surface 202 in the thickness direction Z of the substrate 200. The cross-sectional shape of the corner grooves 221 and 222 is a quadrant.

  The conductive layer 300 constitutes a path for supplying power to the first light emitting element 401, the second light emitting element 402, and the third light emitting element 403. The conductive layer 300 is electrically connected to the first light emitting element 401, the second light emitting element 402, and the third light emitting element 403.

  4 and 5, the conductive layer 300 includes a first main surface individual electrode 310A, a second main surface individual electrode 310B, a first main surface common electrode 320, and a main surface end individual electrode 330. , Corner groove wirings 341, 342, first through wiring 351, second through wiring 352, and back electrode 370. The conductive layer 300 has a structure in which, for example, Cu plating, Ni plating, and Au plating are laminated.

  The first light emitting element 401 is bonded to the first main surface individual electrode 310A. The first main surface individual electrode 310A includes a first die bonding portion 311A and a first adjacent portion 312A. The first light emitting element 401 is bonded to the first die bonding portion 311A. In the present embodiment, the first die bonding portion 311A has a rectangular shape. The first adjacent portion 312A is connected to the first die bonding portion 311A and is adjacent to the first die bonding portion 311A. In the present embodiment, the first adjacent portion 312A is located on the left side of the first die bonding portion 311A in FIGS. The first adjacent portion 312A has a shape in which a semicircular portion and a rectangular portion are combined.

  The third light emitting element 403 is bonded to the second main surface individual electrode 310B. The second main surface individual electrode 310B includes a second die bonding portion 311B and a second adjacent portion 312B. The third light emitting element 403 is bonded to the second die bonding portion 311B. In the present embodiment, the second die bonding portion 311B has a rectangular shape. The second adjacent portion 312B is connected to the second die bonding portion 311B and is adjacent to the second die bonding portion 311B. In the present embodiment, the second adjacent portion 312B is located on the left side of the second die bonding portion 311B in FIGS. The second adjacent portion 312B has a shape in which a semicircular portion and a rectangular portion are combined.

  The main surface end individual electrode 330 is located at an end in the longitudinal direction X of the main surface 201. The main surface end individual electrode 330 is formed in the vicinity of a portion of the main surface 201 connected to the corner groove 222. The second light emitting element 402 is bonded to the main surface end individual electrode 330.

  The main surface end individual electrode 330 includes a base 331, a die bonding part 333, and a connecting part 335.

  The base 331 is located at the end in the longitudinal direction X of the main surface 201. The base 331 is formed in the vicinity of a portion connected to the corner groove 222 in the main surface 201. The second light emitting element 402 is bonded to the die bonding part 333. In the present embodiment, the die bonding part 333 has a rectangular shape. The die bonding part 333, the first die bonding part 311A, and the second die bonding part 311B are arranged along the longitudinal direction X. The connecting portion 335 connects the base portion 331 and the die bonding portion 333. The connecting portion 335 is connected to the base portion 331 and the die bonding portion 333. The connecting portion 335 has a strip shape extending along the longitudinal direction X.

  A first wire 501, a second wire 502, and a third wire 503 are bonded to the first main surface common electrode 320. The first main surface common electrode 320 includes a base portion 321, a first wire bonding portion 323, a second wire bonding portion 324, a first strip portion 326, and a second strip portion 327.

  The base 321 is located at the end in the longitudinal direction X of the main surface 201. The base 321 is formed in the vicinity of a portion connected to the corner groove 221 in the main surface 201. The base 321 has a quarter ring shape.

  The first wire 501 and the third wire 503 are bonded to the first wire bonding portion 323. In the present embodiment, the first wire bonding portion 323 has a rectangular shape. The first wire bonding portion 323 is separated from the first light emitting element 401 and the third light emitting element 403 in the longitudinal direction X. The first wire bonding portion 323 is located between the first light emitting element 401 and the third light emitting element 403 in the short direction Y view. The first wire bonding portion 323 is located between the first die bonding portion 311A and the second die bonding portion 311B, and is separated from the first die bonding portion 311A and the second die bonding portion 311B.

  A second wire 502 is bonded to the second wire bonding portion 324. In the present embodiment, the second wire bonding portion 324 has a rectangular shape. The second wire bonding portion 324 is separated from the first light emitting element 401 and the second light emitting element 402 in the longitudinal direction X. The second wire bonding portion 324 is located between the first light emitting element 401 and the second light emitting element 402 in the short direction Y view. The second wire bonding portion 324 is located between the first die bonding portion 311A and the die bonding portion 333 in the longitudinal direction X, and is separated from the first die bonding portion 311A and the die bonding portion 333. . The separation distance L5 between the second wire bonding portion 324 and the main surface end individual electrode 330 (die bonding portion 333) is, for example, 0.07 to 0.13 mm. The center of the second wire bonding part 324 is located at a position shifted in the lateral direction Y from the center of the first die bonding part 311A and the center of the die bonding part 333.

  The first strip 326 is electrically connected to the first wire bonding part 323 and the second wire bonding part 324. The first strip portion 326 is connected to the first wire bonding portion 323 and the second wire bonding portion 324. The first belt-like portion 326 extends along the longitudinal direction X of the main surface 201. The first belt-like portion 326 is separated from the first light emitting element 401 in the short direction Y of the main surface 201. The first strip 326 is spaced apart from the first main surface individual electrode 310A in the short direction Y of the main surface 201. The separation distance L1 between the first strip 326 and the first main surface individual electrode 310A is: For example, it is 0.04 to 0.08 mm.

  The second strip portion 327 is electrically connected to the first wire bonding portion 323 and the second wire bonding portion 324. The second strip portion 327 is connected to the first wire bonding portion 323 and the base portion 321. The second strip portion 327 extends along the longitudinal direction X of the main surface 201. The second strip 327 is separated from the third light emitting element 403 in the short direction Y of the main surface 201. The second strip 327 is spaced apart from the second major surface individual electrode 310B in the short direction Y of the major surface 201. The separation distance L1 between the second strip 327 and the second major surface individual electrode 310B is: For example, it is 0.04 to 0.08 mm.

  The corner groove wirings 341 and 342 are formed so as to cover the inner surfaces of the corner grooves 221 and 222 of the substrate 200, respectively. The corner groove wirings 341 and 342 reach the back surface 202 from the main surface 201.

The first through wiring 351 shown in FIG. 9 penetrates the substrate 200. The first through wiring 351 is formed on the inner surface of the first through hole 211 and has a cylindrical shape. The first through wiring 351 reaches the back surface 202 from the main surface 201. The first through wiring 351 in the thickness direction Z view
The first adjoining portion 312A overlaps. In the present embodiment, the inside of the first through wiring 351 is filled with a filling resin 351A.

  The second through wiring 352 shown in FIG. 9 penetrates the substrate 200. The second through wiring 352 is formed on the inner surface of the second through hole 212 and has a cylindrical shape. The second through wiring 352 reaches the back surface 202 from the main surface 201. As viewed in the thickness direction Z, the second adjacent portion 312B overlaps the second through wiring 352. In the present embodiment, the inside of the second through wiring 352 is filled with a filling resin 352A.

  As shown in FIGS. 8 and 9, the back electrode 370 is formed on the back surface 202. In the present embodiment, the back electrode 370 includes individual electrodes 371, 372, a back end individual electrode 374, and an end common electrode 375.

  The individual electrodes 371, 372, the back end individual electrode 374, and the end common electrode 375 are arranged in parallel in the longitudinal direction X. The individual electrodes 371 and 372 are sandwiched between the back end individual electrode 374 and the end common electrode 375. The individual electrode 371 overlaps the first through hole 211 in the thickness direction Z view and is connected to the first through wiring 351. The individual electrode 372 overlaps with the second through hole 212 in the thickness direction Z view and is connected to the second through wiring 352. The back end individual electrode 374 is provided at one end of the back 202 and is connected to the corner groove wiring 342. The end common electrode 375 is provided at the other end of the back surface 202 and is connected to the corner groove wiring 341.

  Note that the conductive layer 300 is not formed on the bottom surface 203, and the entire bottom surface 203 is exposed.

  A main surface insulating film 600 shown in FIGS. 3, 9, etc. is formed on the main surface 201 and covers a part of the conductive layer 300. In FIG. 3, the main surface insulating film 600 is shown by hatching. Main surface insulating film 600 may be referred to as a resist layer. The main surface insulating film 600 includes a first insulating portion 610, a second insulating portion 620, a third insulating portion 630, a first covering portion 640, a second covering portion 650, a connecting portion 660, and a first insulation. A band-shaped portion 670 and a second insulating band-shaped portion 680 are included.

  The first insulating portion 610 has a portion interposed between the first light emitting element 401 and the first wire bonding portion 323 in the thickness direction Z view. The first insulating portion 610 traverses the first light emitting element 401 in the longitudinal direction X of the main surface 201. The first insulating portion 610 is formed from one end of the main surface 201 in the short direction Y of the main surface 201 to the other end of the main surface 201 in the short direction Y of the main surface 201. The first insulating portion 610 has a strip shape extending along the short direction Y of the main surface 201. The first insulating part 610 is separated from the first wire bonding part 323.

  The second insulating portion 620 has a portion interposed between the first light emitting element 401 and the second wire bonding portion 324 when viewed in the thickness direction Z of the substrate 200. The first light emitting element 401 is disposed between the second insulating part 620 and the first insulating part 610. The second insulating part 620 crosses the first light emitting element 401 in the longitudinal direction X of the main surface 201. The second insulating portion 620 is formed from one end of the main surface 201 in the short direction Y of the main surface 201 to the other end of the main surface 201 in the short direction Y of the main surface 201. The second insulating portion 620 has a strip shape extending along the short direction Y of the main surface 201. The second insulating part 620 is separated from the second wire bonding part 324. The second insulating portion 620 overlaps a part of the first main surface individual electrode 310A. Specifically, the second insulating portion 620 overlaps a part of the first adjacent portion 312A.

  The third insulating portion 630 has a portion interposed between the third light emitting element 403 and the first wire bonding portion 323 when viewed in the thickness direction Z of the substrate 200. A first wire bonding portion 323 is disposed between the third insulating portion 630 and the first insulating portion 610. The third insulating portion 630 crosses the third light emitting element 403 in the longitudinal direction X of the main surface 201. The third insulating portion 630 is formed from one end of the main surface 201 in the short direction Y of the main surface 201 to the other end of the main surface 201 in the short direction Y of the main surface 201. The third insulating portion 630 has a strip shape extending along the short direction Y of the main surface 201. The third insulating part 630 is separated from the first wire bonding part 323. The third insulating portion 630 overlaps part of the second main surface individual electrode 310B. Specifically, the third insulating portion 630 overlaps a part of the second adjacent portion 312B.

  The first covering portion 640 covers the first strip portion 326. The first covering portion 640 has a strip shape extending along the longitudinal direction X of the main surface 201. The width of the first covering portion 640 is larger than the width of the first strip portion 326. Therefore, the first covering portion 640 extends to the side where the first light emitting element 401 is located with respect to the first belt-like portion 326. The first covering portion 640 is connected to the first insulating portion 610 and the second insulating portion 620. The first covering portion 640 is separated from the first main surface individual electrode 310 </ b> A in the short direction Y of the main surface 201. The separation distance L2 between the first covering portion 640 and the first main surface individual electrode 310A is smaller than the separation distance L1, for example, 0.02 to 0.06 mm.

  The second covering portion 650 covers the second strip portion 327. Second covering portion 650 has a strip shape extending along longitudinal direction X of main surface 201. The width of the second covering portion 650 is larger than the width of the second strip portion 327. Therefore, the second covering portion 650 extends to the side where the third light emitting element 403 is located with respect to the second strip portion 327. The second covering portion 650 is connected to the third insulating portion 630 and the second insulating band-shaped portion 680. The second covering portion 650 is separated from the second main surface individual electrode 310B in the short direction Y of the main surface 201. The separation distance L2 between the second covering portion 650 and the second main surface individual electrode 310B is smaller than the separation distance L1, for example, 0.02 to 0.06 mm.

  The connecting part 660 covers the first wire bonding part 323. The connecting portion 660 has a strip shape extending along the longitudinal direction X of the main surface 201. The connecting part 660 is connected to the third insulating part 630 and the first insulating part 610.

  The first insulating strip 670 is formed at a position near the end of the main surface 201 in the longitudinal direction X. The second light emitting element 402 is disposed between the first insulating strip portion 670 and the second insulating portion 620. The first insulating strip 670 crosses the second light emitting element 402 in the longitudinal direction X of the main surface 201. The first insulating strip 670 is formed from one end of the main surface 201 in the short direction Y of the main surface 201 to the other end of the main surface 201 in the short direction Y of the main surface 201. The first insulating strip 670 is a strip extending along the short direction Y of the main surface 201. The first insulating strip 670 overlaps a part of the main surface end individual electrode 330. Specifically, the first insulating strip 670 overlaps a part of the base 331 and a part of the connecting part 335. The first insulating strip portion 670 is for preventing the solder 802 from entering between the main surface 201 and the translucent resin 720 when forming the solder 802 (described later).

The second insulating strip-shaped portion 680 is formed at a position near the end portion in the longitudinal direction X of the main surface 201. The third light emitting element 403 is disposed between the second insulating strip 680 and the third insulating part 630. The second insulating strip 680 crosses the third light emitting element 403 in the longitudinal direction X of the main surface 201. The second insulating strip 680 is formed from one end of the main surface 201 in the short direction Y of the main surface 201 to the other end of the main surface 201 in the short direction Y of the main surface 201. The second insulating strip 680 is a strip extending along the short direction Y of the main surface 201. The second insulating strip 680 overlaps a part of the first main surface common electrode 320. Specifically, the second insulating strip 680 overlaps part of the base 321 and part of the second strip 327. The second insulating strip-shaped portion 680 is for preventing the solder 802 from entering between the main surface 201 and the translucent resin 720 when forming the solder 802 (described later).

  A back insulating film 710 shown in FIGS. 8 and 9 is formed on the back surface 202 and covers a part of the conductive layer 300. In FIG. 8, the back insulating film 710 is shown using virtual lines, and the region occupied by the back insulating film 710 is hatched. The back insulating film 710 may be referred to as a resist layer. The back insulating film 710 covers a portion of the back surface 202 exposed from the back electrode 370 and a part of each of the individual electrodes 371 and 372.

  The 1st light emitting element 401, the 2nd light emitting element 402, and the 3rd light emitting element 403 are the light sources of LED module A1, and are arrange | positioned at the main surface 201. FIG. Each of the first light emitting element 401, the second light emitting element 402, and the third light emitting element 403 has a structure in which, for example, a p-type semiconductor layer, an n-type semiconductor layer, and an active layer sandwiched therebetween are stacked.

  The first light emitting element 401 emits red light, for example. In the first light emitting element 401, at least three sides are surrounded by the main surface insulating film 600 by the first insulating portion 610, the second insulating portion 620, and the first covering portion 640. The second light emitting element 402 emits green light, for example. The third light emitting element 403 emits blue light, for example. In the third light emitting element 403, at least three sides are surrounded by the main surface insulating film 600 by the third insulating portion 630, the second insulating band-shaped portion 680, and the second covering portion 650.

  A first conductive bonding layer 411 shown in FIG. 9 is interposed between the first light emitting element 401 and the conductive layer 300. The first conductive bonding layer 411 is derived from, for example, a silver paste. When the fluid (for example, silver paste) before hardening of the first conductive bonding layer 411 enters between the first main surface individual electrode 310A and the first strip portion 326, the first conductive bonding layer 411 has the first main bonding layer 411. It may be formed also in the gap between the surface individual electrode 310A and the first strip 326 (see FIG. 10). In addition, the first conductive bonding layer 411 may be in contact with the first insulating portion 610, the second insulating portion 620, and the first covering portion 640.

  The second conductive bonding layer 412 is interposed between the second light emitting element 402 and the conductive layer 300. The second conductive bonding layer 412 is derived from, for example, a silver paste.

  The third conductive bonding layer 413 is interposed between the third light emitting element 403 and the conductive layer 300. The third conductive bonding layer 413 is derived from, for example, a silver paste. When the fluid (for example, silver paste) before curing of the third conductive bonding layer 413 enters between the second main surface individual electrode 310B and the second strip 327, the third conductive bonding layer 413 It may also be formed in the gap between the main surface individual electrode 310B and the second strip 327 (see FIG. 11). In addition, the third conductive bonding layer 413 may be in contact with the third insulating portion 630, the second insulating strip 680, and the second covering portion 650.

  The first wire 501 shown in FIGS. 3 and 4 is bonded to the first light emitting element 401 and the first wire bonding portion 323. The first wire 501 straddles the first insulating portion 610. The second wire 502 is bonded to the second light emitting element 402 and the second wire bonding part 324. The third wire 503 is bonded to the third light emitting element 403 and the first wire bonding portion 323. The third wire 503 straddles the third insulating portion 630.

  The translucent resin 720 is provided on the main surface 201 of the substrate 200 and covers the first light emitting element 401, the second light emitting element 402, and the third light emitting element 403. The translucent resin 720 is made of a transparent resin such as an epoxy resin. Alternatively, the light-transmitting resin 720 is made of a resin that can transmit light from the first light-emitting element 401, the second light-emitting element 402, and the third light-emitting element 403. In the present embodiment, the transversal resin 720 has a trapezoidal shape in the short-side direction Y, and a rectangular shape in the longitudinal direction X.

  As shown in FIG. 12, the LED module A1 is mounted on a circuit board 801 via solder 802. The LED module A1, the circuit board 801, and the solder 802 constitute an LED module mounting structure B1. Since the bottom surface 203 is the mounting surface as described above, the bottom surface 203 faces the circuit board 801 in the mounting structure B1. The solder 802 contacts the individual electrodes 371 and 372 and electrode pads (not shown) on the circuit board 801. Further, the solder 802 is in contact with the back end individual electrode 374, the end common electrode 375, and an electrode pad (not shown) on the circuit board 801. The corner grooves 221 and 222 are filled with part of the solder 802.

  Next, the effect of this embodiment is demonstrated.

  In the present embodiment, the main surface insulating film 600 includes a first insulating portion 610. The first insulating portion 610 has a portion interposed between the first light emitting element 401 and the first wire bonding portion 323 when viewed in the thickness direction Z of the substrate 200, which is a direction orthogonal to the main surface 201. According to such a configuration, even if a fluid (for example, silver paste) before curing of the first conductive bonding layer 411 enters between the first main surface individual electrode 310A and the first strip portion 326, the fluid flows. It is possible to prevent the first wire bonding portion 323 from being reached. As a result, the first conductive bonding layer 411 can be prevented from coming into contact with the first wire bonding portion 323. As a result, it is possible to avoid the disadvantage that the first conductive bonding layer 411 and the first wire bonding portion 323 are short-circuited. This is suitable for improving the yield of the LED module A1.

  In the present embodiment, the separation distance L1 between the first strip 326 and the first main surface individual electrode 310A is 0.04 to 0.08 mm, which is very small. In such a configuration, when a fluid (for example, silver paste) before curing of the first conductive bonding layer 411 enters between the first main surface individual electrode 310A and the first strip portion 326, a capillary phenomenon (or a capillary phenomenon). The fluid is likely to flow toward the first wire bonding portion 323 due to a phenomenon similar to the above. Therefore, the configuration of the present embodiment that can prevent the first conductive bonding layer 411 from coming into contact with the first wire bonding portion 323 has a disadvantage that the first conductive bonding layer 411 and the first wire bonding portion 323 are short-circuited. Very suitable to avoid.

  In the present embodiment, the main surface insulating film 600 includes a first covering portion 640 that covers the first strip portion 326. The first covering portion 640 extends to the side where the first light emitting element 401 is located with respect to the first belt-like portion 326. According to such a configuration, the first conductive bonding layer 411 can be prevented from coming into contact with the first belt-like portion 326. As a result, it is possible to avoid a problem that the first conductive bonding layer 411 and the first belt-shaped portion 326 are short-circuited. This is suitable for improving the yield of the LED module A1.

In the present embodiment, the main surface insulating film 600 includes the second insulating portion 620. The second insulating portion 620 has a portion interposed between the first light emitting element 401 and the second wire bonding portion 324 when viewed in the thickness direction Z of the substrate 200. The first light emitting element 401 is disposed between the second insulating part 620 and the first insulating part 610. According to such a configuration, even if a fluid (for example, silver paste) before curing of the first conductive bonding layer 411 enters between the first main surface individual electrode 310A and the first strip portion 326, the fluid flows. It is possible to prevent the second wire bonding portion 324 from being reached. As a result, the first conductive bonding layer 411 can be prevented from coming into contact with the second wire bonding portion 324. As a result, it is possible to avoid the disadvantage that the first conductive bonding layer 411 and the second wire bonding portion 324 are short-circuited. This is suitable for improving the yield of the LED module A1.

  In the present embodiment, the first light emitting element 401 and the second light emitting element 402 are separated from each other in the longitudinal direction X of the main surface 201. The second wire bonding portion 324 is located between the first light emitting element 401 and the second light emitting element 402 in the short direction Y view of the main surface 201. According to such a configuration, it is not necessary to provide the first belt-like portion 326 that connects the first wire bonding portion 323 and the second wire bonding portion 324 at a position overlapping the second light emitting element 402 in the longitudinal direction X. Therefore, it is possible to avoid the fluid (for example, silver paste) before hardening of the second conductive bonding layer 412 from reaching the second wire bonding portion 324 through the first strip portion 326. This can prevent the second conductive bonding layer 412 from coming into contact with the second wire bonding portion 324. As a result, the inconvenience that the second conductive bonding layer 412 and the second wire bonding portion 324 are short-circuited can be avoided. This is suitable for improving the yield of the LED module A1.

  In the present embodiment, the separation distance L5 between the second wire bonding portion 324 and the main surface end individual electrode 330 (die bonding portion 333) is, for example, 0.07 to 0.13 mm and relatively large. The separation distance L5 is a dimension suitable for preventing the fluid (for example, silver paste) before hardening of the second conductive bonding layer 412 from reaching the second wire bonding portion 324.

  In the present embodiment, the main surface insulating film 600 includes a third insulating portion 630. The third insulating portion 630 has a portion interposed between the third light emitting element 403 and the first wire bonding portion 323 when viewed in the thickness direction Z of the substrate 200, which is a direction orthogonal to the main surface 201. According to such a configuration, even if a fluid (for example, silver paste) before curing of the third conductive bonding layer 413 enters between the second main surface individual electrode 310B and the second strip portion 327, the fluid flows. It is possible to prevent the first wire bonding portion 323 from being reached. Thereby, it is possible to prevent the third conductive bonding layer 413 from coming into contact with the first wire bonding portion 323. As a result, the inconvenience that the third conductive bonding layer 413 and the first wire bonding portion 323 are short-circuited can be avoided. This is suitable for improving the yield of the LED module A1.

  In the present embodiment, the separation distance L1 between the second strip portion 327 and the second main surface individual electrode 310B is 0.04 to 0.08 mm, which is very small. In such a configuration, when a fluid (for example, silver paste) before curing of the third conductive bonding layer 413 enters between the second main surface individual electrode 310B and the second strip portion 327, the fluid is caused by capillary action. Tends to flow toward the first wire bonding portion 323. Therefore, the configuration of the present embodiment that can prevent the third conductive bonding layer 413 from coming into contact with the first wire bonding portion 323 has a disadvantage that the third conductive bonding layer 413 and the first wire bonding portion 323 are short-circuited. Very suitable to avoid.

  In the present embodiment, the main surface insulating film 600 includes a second covering portion 650 that covers the second strip portion 327. The second covering portion 650 extends to the side where the third light emitting element 403 is located with respect to the second strip portion 327. According to such a configuration, it is possible to prevent the third conductive bonding layer 413 from coming into contact with the second strip portion 327. As a result, it is possible to avoid a problem that the third conductive bonding layer 413 and the second belt-shaped portion 327 are short-circuited. This is suitable for improving the yield of the LED module A1.

In the present embodiment, the main surface insulating film 600 includes a second insulating strip 680. The second insulating strip 680 has a portion interposed between the third light emitting element 403 and the base 321 when viewed in the thickness direction Z of the substrate 200. The third light emitting element 403 is disposed between the second insulating strip portion 680 and the third insulating portion 630. According to such a configuration, even if a fluid (for example, silver paste) before curing of the third conductive bonding layer 413 enters between the second main surface individual electrode 310B and the second strip portion 327, the fluid flows. , It is possible to prevent the base 321 from being reached. Thereby, it is possible to prevent the third conductive bonding layer 413 from coming into contact with the base portion 321. As a result, the inconvenience that the third conductive bonding layer 413 and the base 321 are short-circuited can be avoided. This is suitable for improving the yield of the LED module A1.

  The present invention is not limited to the embodiment described above. The specific configuration of each part of the present invention can be changed in various ways.

  In the above-described embodiment, the example in which the main surface insulating film 600 includes any of the first insulating portion 610, the second insulating portion 620, and the third insulating portion 630 is shown, but the present invention is not limited to this. For example, the main surface insulating film 600 may not include the second insulating portion 620 and the third insulating portion 630.

200 Substrate 201 Main surface 202 Back surface 203 Bottom surface 204 Side surface 211 First through hole 212 Second through hole 221 Corner groove 222 Corner groove 300 Conductive layer 310A First main surface individual electrode 310B Second main surface individual electrode 311A First die Bonding section 311B Second die bonding section 312A First adjacent section 312B Second adjacent section 320 First main surface common electrode 321 Base section 323 First wire bonding section 324 Second wire bonding section 326 First strip section 327 Second strip section 330 Main surface end individual electrode 331 Base 333 Die bonding part 335 Connecting part 341 Corner groove wiring 342 Corner groove wiring 351 First through wiring 351A Filling resin 352 Second through wiring 352A Filling resin 370 Rear electrode 371 Individual electrode 372 Individual electrode 374 Back surface Individual electric terminal Electrode 375 End common electrode 401 First light emitting element 402 Second light emitting element 403 Third light emitting element 411 First conductive bonding layer 412 Second conductive bonding layer 413 Third conductive bonding layer 501 First wire 502 Second wire 503 Third wire 600 Main surface insulating film 610 First insulating portion 620 Second insulating portion 630 Third insulating portion 640 First covering portion 650 Second covering portion 660 Connecting portion 670 First insulating strip portion 680 Second insulating strip portion 710 Back insulating film 720 Translucent resin 801 Circuit board 802 Solder A1 LED module B1 Mounting structure L1, L2, L5 Separation distance X Longitudinal direction Y Short direction Z Thickness direction

Claims (47)

A substrate having a main surface, a back surface, and a bottom surface;
A first light emitting element disposed on the main surface;
A conductive layer formed on the substrate and conducting to the first light emitting element;
A first conductive bonding layer interposed between the first light emitting element and the conductive layer;
A main surface insulating film formed on the main surface and covering a part of the conductive layer;
A first wire;
The main surface and the back surface are oriented in opposite directions and have a long rectangular shape, the bottom surface connects a long side of the main surface and a long side of the back surface, and is a mounting surface,
The conductive layer includes a first wire bonding portion to which the first wire is bonded,
The main surface insulating film includes a first insulating portion, and the first insulating portion is bonded to the first light emitting element and the first wire bonding in a thickness direction of the substrate that is a direction orthogonal to the main surface. The LED module which has the site | part interposed between parts.   2. The LED module according to claim 1, wherein the first insulating portion traverses the first light emitting element when viewed in the longitudinal direction of the main surface.   The first insulating portion is formed from one end of the main surface in the short direction of the main surface to the other end of the main surface in the short direction of the main surface. The LED module described.   The LED module according to any one of claims 1 to 3, wherein the first insulating portion has a strip shape extending along a short direction of the main surface.   The LED module according to claim 1, wherein the first insulating portion is separated from the first wire bonding portion.   The LED module according to any one of claims 1 to 5, wherein the first wire bonding portion is spaced apart from the first light emitting element in the longitudinal direction.   The LED module according to claim 1, wherein the first wire is bonded to the first light emitting element.   The LED module according to claim 1, wherein the first wire straddles the first insulating portion. The conductive layer includes a first belt-shaped portion that is electrically connected to the first wire bonding portion and extends along a longitudinal direction of the main surface,
2. The LED module according to claim 1, wherein the first belt-shaped portion is separated from the first light emitting element in a short direction of the main surface.   The LED module according to claim 9, wherein the first belt-like portion is connected to the first wire bonding portion. The conductive layer includes a first main surface individual electrode to which the first light emitting element is bonded,
11. The LED module according to claim 9, wherein the first belt-like portion is spaced apart from the first main surface individual electrode in a short direction of the main surface.   The LED module according to claim 11, wherein a separation distance between the first belt-like portion and the first main surface individual electrode is 0.04 to 0.08 mm. The main surface insulating film includes a first covering portion that covers the first belt-shaped portion,
The LED module according to claim 9, wherein the first covering portion extends to a side where the first light emitting element is located with respect to the first strip-shaped portion.   The LED module according to claim 13, wherein the first covering portion has a strip shape extending along a longitudinal direction of the main surface.   The LED module according to claim 14, wherein a width of the first covering portion is larger than a width of the first belt-like portion.   The LED module according to claim 13, wherein the first covering portion is connected to the first insulating portion. The conductive layer includes a first main surface individual electrode to which the first light emitting element is bonded,
The first covering portion is separated from the first main surface individual electrode in the short direction of the main surface,
The LED module according to any one of claims 13 to 16, wherein a distance between the first covering portion and the first main surface individual electrode is 0.02 to 0.06 mm. A second wire;
The conductive layer includes a second wire bonding portion to which the second wire is bonded,
The main surface insulating film includes a second insulating portion, and the second insulating portion includes a portion interposed between the first light emitting element and the second wire bonding portion in the thickness direction of the substrate. Have
The LED module according to claim 13, wherein the first light emitting element is disposed between the second insulating portion and the first insulating portion.   The LED module according to claim 18, wherein the second insulating portion crosses the first light emitting element when viewed in the longitudinal direction of the main surface.   The second insulating portion is formed from one end of the main surface in the short direction of the main surface to the other end of the main surface in the short direction of the main surface. The LED module described.   The LED module according to any one of claims 18 to 20, wherein the second insulating portion has a strip shape extending along a short direction of the main surface.   The LED module according to any one of claims 18 to 21, wherein the second insulating portion is separated from the second wire bonding portion.   The LED module according to any one of claims 18 to 22, wherein the second wire bonding portion is spaced apart from the first light emitting element in a longitudinal direction of the main surface.   The LED module according to any one of claims 18 to 23, wherein the second wire bonding portion is electrically connected to the first wire bonding portion.   The LED module according to any one of claims 18 to 24, wherein the second wire bonding portion is connected to the first belt-like portion.   The LED module according to any one of claims 18 to 25, wherein the second insulating portion is connected to the first covering portion.   27. The LED module according to claim 26, wherein the first light emitting element is surrounded by the main surface insulating film in at least three directions by the first insulating portion, the second insulating portion, and the first covering portion. The conductive layer includes a first main surface individual electrode to which the first light emitting element is bonded,
The conductive layer includes a first through wiring that penetrates the substrate,
The first main surface individual electrode includes a first die bonding portion to which the first light emitting element is bonded, and a first adjacent portion that is connected to the first die bonding portion and is adjacent to the first die bonding portion. Have
The LED module according to claim 18, wherein the first adjacent portion overlaps the first through wiring in the thickness direction view.   29. The LED module according to claim 28, wherein the second insulating portion overlaps the first adjacent portion in the thickness direction view. A second light emitting element disposed on the main surface;
A second conductive bonding layer interposed between the second light emitting element and the conductive layer,
The first light emitting element and the second light emitting element are separated from each other in the longitudinal direction of the main surface,
19. The LED module according to claim 18, wherein the second wire bonding portion is located between the first light emitting element and the second light emitting element in a short direction view of the main surface.   The LED module according to claim 30, wherein the second wire is bonded to the second light emitting element. The conductive layer includes a main surface end individual electrode to which the second light emitting element is bonded,
The LED module according to claim 30, wherein a separation distance between the main surface end individual electrode and the second wire bonding portion is 0.07 to 0.13 mm. A third light emitting element disposed on the main surface;
A third conductive bonding layer interposed between the third light emitting element and the conductive layer,
The first light emitting element is located between the second light emitting element and the third light emitting element in a short direction view of the main surface,
The main surface insulating film includes a third insulating portion, and the third insulating portion includes a portion interposed between the third light emitting element and the first wire bonding portion in the thickness direction of the substrate. The LED module according to claim 30. The conductive layer includes a second main surface individual electrode to which the third light emitting element is bonded,
The LED module according to claim 33, wherein the third insulating portion covers a part of the second principal surface individual electrode. The conductive layer includes a second through wiring that penetrates the substrate,
The second main surface individual electrode includes a second die bonding portion to which the third light emitting element is bonded, and a second adjacent portion that is connected to the second die bonding portion and adjacent to the second die bonding portion. Have
The LED module according to claim 34, wherein the second adjacent portion overlaps the second through-wiring when viewed in the thickness direction.   36. The LED module according to claim 35, wherein the third insulating portion overlaps the second adjacent portion when viewed in the thickness direction. The conductive layer includes a second strip portion that is electrically connected to the first wire bonding portion and extends along a longitudinal direction of the main surface,
34. The LED module according to claim 33, wherein the second belt-shaped portion is separated from the third light emitting element in a short direction of the main surface.   38. The LED module according to claim 37, wherein the second strip portion is connected to the first wire bonding portion. The main surface insulating film includes a second covering portion that covers the second belt-shaped portion,
38. The LED module according to claim 37, wherein the second covering portion extends to a side where the third light emitting element is located with respect to the second strip-shaped portion.   40. The LED module according to claim 39, wherein the second covering portion has a strip shape extending along a longitudinal direction of the main surface.   41. The LED module according to claim 40, wherein a width of the second covering portion is larger than a width of the second strip portion.   40. The LED module according to claim 39, wherein the second covering portion is connected to the third insulating portion. The substrate has a side surface connecting the main surface and the back surface;
The substrate is formed with corner grooves that are recessed from the side surface and the bottom surface and reach the main surface and the back surface in the thickness direction of the substrate,
The LED module according to claim 1, wherein the conductive layer includes corner groove wiring formed on an inner surface of the corner groove.   44. The LED module according to claim 43, wherein a cross-sectional shape of the corner groove is a quarter circle shape.   The LED module according to any one of claims 1 to 44, wherein the conductive layer further includes a back electrode formed on the back surface.   The LED module according to claim 1, further comprising a translucent resin that covers the first light emitting element. The LED module according to any one of claims 1 to 46;
An LED module mounting structure comprising: a circuit board facing the bottom surface.

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