KR20150077088A - Light emitting device - Google Patents

Abstract

Disclosed is a light emitting apparatus. The light emitting apparatus comprises at least three separated frames; a substrate including at least two insulation layer located between the frames; and multiple light emitting devices located on the substrate, wherein the frames are arranged in line, at least two light emitting devices among the multiple light emitting devices are located on at least two frames among the frames respectively, and the frames are electrically connected to the multiple light emitting devices. Accordingly, provided is a light emitting apparatus having high heat radiation efficiency, and small size.

Description

[0001] LIGHT EMITTING DEVICE [0002]

The present invention relates to a light emitting device, and more particularly to a high output light emitting device including a substrate including a plurality of frames and a plurality of light emitting elements.

BACKGROUND ART [0002] Light emitting devices are inorganic semiconductor devices that emit light generated by recombination of electrons and holes. Recently, they are used in various fields such as displays, automobile lamps, and general lighting. Since the light emitting device has a long life span, low power consumption, and a high response speed, the light emitting device such as the light emitting device package including the light emitting device is expected to replace the conventional light source.

In general, a light emitting device package is manufactured by mounting a light emitting chip on a substrate, and electrically connecting a light emitting chip and a lead frame formed on the substrate. A ceramic substrate, a PCB substrate, or the like is used as the substrate, and the light emitting device package is manufactured by dicing or braking the substrate to individualize the substrate. However, the light emitting device including the lead frame has a disadvantage in that the lifetime is shortened due to discoloration or damage of the lead frame, and the heat emission efficiency is lowered. In order to overcome these disadvantages, a technique has been proposed in which the substrate itself is manufactured by using a metal such as an Al substrate.

A light emitting device package in which such a substrate itself is made of a metal is manufactured such that at least two metal frames are insulated by an insulating layer. A plurality of metal frames are repeatedly arranged, a plate in which an insulating layer is disposed between each metal frame is formed, a plurality of light emitting devices are arranged on the plate, and the plate is divided and cut into individual package units .

However, it is impossible to form a pattern in such a metal frame. Accordingly, when a plurality of light emitting devices are applied to the light emitting device package having the metal frame substrate, a separate submount is formed on the metal frame substrate, and the light emitting devices are mounted on the submount.

For example, FIG. 1 shows a conventional light emitting device package including a plurality of light emitting elements. Referring to FIG. 1, the light emitting device package includes a first metal frame 11, a second metal frame 13, and an insulating layer 15 disposed between the first and second metal frames 11 and 13 And a plurality of light emitting devices 40 mounted in a cavity 17 formed on an upper surface of the substrate 10. [ However, since it is not possible to pattern the metal frame as described above, the conventional light emitting device package is positioned between the substrate 10 and the plurality of light emitting elements 40 to electrically connect the plurality of light emitting elements 40 Mount 50 to be connected to the sub-mount 50.

Since the submount 50 is interposed between the metal frames and the plurality of light emitting devices 40, the efficiency of emitting heat generated from the plurality of light emitting devices 40 is extremely low. Therefore, the efficiency and reliability of the light emitting devices due to heat may be lowered, and the effect that can be provided by using the metal frame as the substrate 10 is reduced. Further, due to the heat dissipation problem, there may be a limit to realizing a high output light emitting device package.

Therefore, a light emitting device that includes a plurality of light emitting elements and can have a high heat dissipation efficiency is required.

A problem to be solved by the present invention is to provide a substrate including a metal capable of mounting a plurality of light emitting elements without using a submount, thereby providing a light emitting device with improved heat emission efficiency.

Another object of the present invention is to provide a substrate capable of providing various types of electrical connection between a plurality of light emitting devices, and a light emitting device including the substrate.

A light emitting device according to an aspect of the present invention includes: a substrate including at least three spaced-apart frames, at least two insulating layers positioned between the frames; And a plurality of light emitting elements located on the substrate, wherein the frames are arranged side by side, at least two of the plurality of light emitting elements are respectively located on at least two of the frames, Are electrically connected to the plurality of light emitting elements.

The plurality of light emitting devices may be electrically connected in a form of at least one of serial, parallel, and anti-parallel.

The frames may also include a first frame, a third frame, and a second frame positioned between the first and third frames, wherein the insulating layers are positioned between the first and second frames And a second insulating layer disposed between the second and third frames.

The plurality of light emitting devices may include light emitting devices located on the first frame and the second frame.

Furthermore, the plurality of light emitting devices may include a first light emitting device and a second light emitting device located on the first frame, and a third light emitting device and a fourth light emitting device located on the second frame, The first and second light emitting devices may be connected in parallel to each other. The third and fourth light emitting devices may be connected in parallel to each other. The first and third light emitting devices may be connected in series.

In some embodiments, the frames may comprise first through sixth frames, wherein the insulating layers comprise a first insulating layer, a second insulating layer spaced apart from the first insulating layer, And a third insulating layer that intersects the second insulating layer.

In addition, the plurality of light emitting devices may include first to fourth light emitting devices positioned on the first to fourth frames, respectively, and the first to fourth light emitting devices may be connected in series with each other.

The at least two frames and the plurality of light emitting devices respectively disposed on the at least two frames may be electrically connected to each other.

In other embodiments, the substrate includes: an upper surface on which the plurality of light emitting elements are located; And a pad covering at least a part of the lower surface.

Also, the bottom surface of the substrate may include a bottom surface of the frames, and the pad may at least partially cover the bottom surface of the frames.

Further, the substrate may include a first side and a second side opposite the first side, the frames including a first frame located on the first side and a second frame on the second side The pad may include a first pad at least partially covering the lower surface of the first frame and a second pad at least partially covering the lower surface of the second frame, have.

The pad may further include one or more pads covering a bottom surface of one or more frames positioned between the first and second frames.

The substrate may further include a first insulating portion covering a bottom surface of the at least one frame positioned between the first and second frames.

Wherein the substrate comprises: a lower surface of the insulating layers included in a lower surface of the substrate; And a second insulating portion covering the lower surfaces of the insulating layers.

The first insulating portion and the second insulating portion may be formed of the same material, and the first insulating portion may include a solder resist.

The first insulating portion may include an oxide film or a solder resist.

In some embodiments, the frames may comprise metal frames.

In addition, the frames may include Al.

The frames may comprise at least two or more frames comprising different metals.

The frames may include first through fourth frames arranged in order and the plurality of light emitting elements may be located on the second frame and the third frame, Al, and the second and third frames may comprise Cu.

The substrate may further include a cavity formed on an upper surface thereof, and the plurality of light emitting elements may be mounted in the cavity.

The light emitting device may further include a lens positioned on the substrate.

The cavity may further include an end portion formed on a side surface thereof, and the lens may be mounted on the end portion.

The substrate may further include at least one concave portion formed on a side surface of the substrate, and the concave portion may overlap the insulating layer exposed on the side surface of the substrate.

Furthermore, the substrate may include an upper surface on which the plurality of light emitting devices are located and a lower surface opposed thereto, and the recess may be open from the lower surface of the substrate and have a top clogged shape.

The substrate may further include an insulating material filling the recess.

In addition, the light emitting device may further include an adhesion assisting layer positioned between the plurality of light emitting elements and the substrate.

The light emitting device of the present invention can include a plurality of light emitting elements without using a submount, and can have a high heat emission efficiency. Further, since the submount is not included, the light emitting device can be miniaturized, and a light emitting device having high output due to high heat emission efficiency can be provided. In addition, since the arrangement of the frames and the insulating layers can be varied, the electrical connection form of the light emitting devices can be variously adjusted as needed.

1 is a perspective view illustrating a conventional light emitting device package.
2A to 2C are a perspective view, a plan view, and a cross-sectional view for illustrating a light emitting device according to an embodiment of the present invention.
3 is a plan view illustrating a light emitting device according to another embodiment of the present invention.
4 is a plan view illustrating a light emitting device according to another embodiment of the present invention.
5 is a cross-sectional view illustrating a light emitting device according to another embodiment of the present invention.
6 is a cross-sectional view illustrating a light emitting device according to another embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are provided by way of example so that those skilled in the art can sufficiently convey the spirit of the present invention. Therefore, the present invention is not limited to the embodiments described below, but may be embodied in other forms. In the drawings, the width, length, thickness, etc. of components may be exaggerated for convenience. It is also to be understood that when an element is referred to as being "above" or "above" another element, But also includes the case where there are other components in between. Like reference numerals designate like elements throughout the specification.

A light emitting device according to embodiments of the present invention includes a substrate including at least three spaced apart frames, at least two or more insulating layers positioned between the frames, and a plurality of light emitting devices . At this time, the frames may be arranged side by side so that the substrate may have a structure in which insulating layers are interposed between a plurality of frames and laminated in a horizontal direction. Further, the plurality of light emitting elements are located on at least a part of the frames and can be electrically connected to the plurality of frames. Thus, a light emitting device including a plurality of light emitting elements can be provided without including a separate submount for electrically connecting a plurality of light emitting elements.

The embodiments described below will be described with respect to a light emitting device including a predetermined number of frames, insulating layers, and light emitting elements. It should be understood, however, that the embodiments described below are for illustrative purposes only, and do not limit the scope of the present invention.

2A to 2C are a perspective view (a), a plan view (b), and a sectional view (c) for explaining a light emitting device according to an embodiment of the present invention. Particularly, the sectional view shown in Fig. 2C shows a section cut along the line A-A in Fig. 2B.

2A to 2C, a light emitting device includes a substrate 100 and a plurality of light emitting devices 211, 213, 215, and 217. The light emitting device may further include adhesion assisting layers 221, 223, 225 and 227 positioned between the plurality of light emitting devices 211, 213, 215 and 217, a plurality of light emitting devices 211, 213, 215 and 217 (Not shown), and wires W1, W2, W3, and W4, which are positioned on the substrate W1. Furthermore, the light emitting device may further include a molding unit (not shown) for sealing the plurality of light emitting devices 211, 213, 215, and 217.

The substrate 100 includes at least three spaced apart frames 110 and at least two insulating layers 120 positioned between the frames 110. The at least two insulating layers 120 may be formed of any suitable material. In the present embodiment, the frames 110 may include a first frame 111, a second frame 113, and a third frame 115, and the insulating layer 120 may include a first insulating layer 121 And a second insulating layer 123, as shown in FIG.

The first to third frames 111, 113, and 115 may be disposed apart from each other, but may be disposed side by side. The first to third frames 111, 113 and 115 may be arranged in a horizontal direction so that the upper surface of the substrate 100 is separated from the upper surface of the first to third frames 111, And the lower surface of the substrate 110 may include the lower surfaces of the first through third frames 111, 113, At this time, the second frame 113 may be positioned between the first and third frames 111 and 115.

The upper areas of the first to third frames 111, 113, and 115 may be formed differently from each other as shown, but the present invention is not limited thereto.

The frames 110 may include Al, Ag, Cu, Ni, etc. In particular, in the present embodiment, the frames 110 may comprise Al. Accordingly, the workability of the substrate 100 can be improved, and the reliability can be improved. For example, when at least one of the light emitting elements emits light having a peak wavelength of the UV region, discoloration or damage of the frames 110 including Al can be prevented, and reliability and lifetime of the light emitting device Can be improved. In addition, since the frames 110 include the metal, the heat radiation efficiency can be improved, and the light emitting device can have an excellent heat radiation efficiency without a separate heat sink. Further, since the frames 110 can have high electrical conductivity including the metal, the light emitting device of the present invention does not require a separate lead frame in addition to the substrate 100.

The first and second insulating layers 121 and 123 may be located between the first frame 111 and the second frame 113 and between the second frame 113 and the third frame 115, respectively. The upper and lower surfaces of the substrate 100 may include the upper surfaces of the first and second insulating layers 121 and 123 and the lower surfaces of the first and second insulating layers 121 and 123, respectively.

The insulating layers 120 may comprise various insulating materials known to those of ordinary skill in the art and may be formed, for example, from ceramics, polymeric materials, and the like. In addition, the insulating layer 120 may further include a light-reflective substance such as TiO _2.

On the other hand, the substrate 100 may include a first side 100a and a second side 100b opposite to the first side 110a. One side of the first frame 111 may be exposed on the first side 100a and one side of the third frame 115 may be exposed on the second side 100b.

The first frame 111 and the third frame 115 positioned on the first side 100a and the second side 100b may function as the electrodes of the light emitting device, respectively. That is, when the light emitting device is mounted on a separate secondary substrate or the like, the lower surfaces of the first frame 111 and the third frame 115 can be electrically contacted to the secondary substrate to function as electrodes. However, the present invention is not limited thereto, and other frames may serve as electrodes of the light emitting device, if necessary.

The substrate 100 may further include an insulating material 130, a pad 140, a cavity 150, and an insulating portion 160, which will be described in detail below.

The insulating material 130 may include a first insulating material 131 and a second insulating material 133. The insulating material 130 may be formed on a side surface of the substrate 100 on which the insulating layer 120 is exposed, Lt; / RTI > The first insulating material 131 may be formed in a region where the first insulating layer 121 is exposed and the second insulating material 133 may be formed in a region where the second insulating layer 123 is exposed.

Specifically, the insulating material 130 may be formed around the exposed region of the insulating layer 120, and may be formed such that a portion of the exposed region of the insulating layer 120 is filled with the recessed portion. The width of the concave portion may be larger than the width of the insulating layer 120, but is not limited thereto. In addition, the concave portion may be opened from the lower surface of the substrate 100 and have a top clogged shape. Alternatively, the concave portion may have a shape penetrating from the lower surface of the substrate 100 to the upper surface.

The insulating material 130 may include an insulating material and may include, for example, photoresist, silicon, epoxy, and the like.

As such, since the concave portion is formed between the adjacent frames on the side surface of the substrate 100, it is possible to effectively prevent short-circuiting from occurring due to physical and / or electrical contact between adjacent frames. Therefore, the reliability and electrical stability of the light emitting device of the present invention can be improved. In particular, it is possible to effectively prevent the physical contact between the frames from occurring due to dicing in the process of manufacturing the substrate 100.

However, the insulating material 130 may be omitted, and only the recesses may be formed on the side surface of the substrate 100.

The pad 140 may at least partially cover the lower surface of the substrate 100 and, in particular, may at least partially cover the lower surface of the frames 110. Of the lower surface region of the substrate 100, the pad 140 may be located on a region other than the lower surface region of the insulating layer 120.

The pad 140 may include a first pad 141 and a third pad 145 and the first and third pads 141 and 145 may be formed on the lower surface of the first and third frames 111 and 115, As shown in FIG.

When the light emitting device is mounted on a separate secondary substrate or the like, the pad 140 may function to stably mount the device electrically and thermally. Thus, the pad 140 may comprise a material that is highly conductive and can be soldered. For example, the pad 140 may include Ni, Ag, Au, Cu, Ti, and the like, and may include a single layer or a multilayer structure. Accordingly, in the present embodiment, the first pad 141 and the third pad 145 may function as electrode pads having different polarities.

The pad 140 may further include a second pad 143 and the second pad 143 may be positioned on at least a part of the lower surface of the second frame 113. The first through third pads 141, 143, and 145 may be spaced apart from each other, so that the first through third frames 111, 113, and 115 are not electrically connected to each other.

The insulating portion 160 may be located on a part of the lower surface of the substrate 100 and may cover the insulating layer 120 exposed on the lower surface of the substrate 100 in particular. Further, the insulating portion 160 may be located between adjacent pads 140.

The insulating portion 160 may include a first insulating portion 161 and a second insulating portion 163 and the first and second insulating portions 161 and 163 may include first and second insulating layers 121 and 121, And 123 can be covered. The first insulating portion 161 may be positioned between the first pad 141 and the second pad 143 and the second insulating portion 163 may be positioned between the second pad 143 and the third pad 143. [ 145, respectively. Accordingly, the insulating portion 160 can effectively prevent the electrical contact between the adjacent pads 140. [0064]

In addition, the lower surface of the insulating portion 160 and the lower surface of the pad 140 may be formed to be parallel to each other. Therefore, the lower surface of the substrate 100 can be formed horizontally and flat, so that the light emitting device can be stably mounted on a secondary substrate or the like.

The insulating portion 160 may include an insulating material, and may include, for example, an oxide film or a solder resist. Particularly, when the insulating portion 160 includes the solder resist, when the light emitting device is soldered to the secondary substrate or the like, it is possible to prevent the solder from being formed on the insulating portion 160, So that it is possible to prevent electrical shorts from being generated.

The width of the insulating portion 160 may be wider than the width of the insulating layer 120. In this case, the insulating portion 160 may further cover a part of the lower surface of the frames 110. [ However, the present invention is not limited thereto.

Further, the substrate 100 may further include a cavity 150 formed by being embedded from the upper surface thereof.

The cavity 150 may be formed in a partially embedded form of the first to third metal frames 111, 113 and 115, the first insulating layer 121 and the second insulating layer 123 . Accordingly, the first to third metal frames 111, 113, and 115, the first insulating layer 121, and the second insulating layer 123 are partially exposed to the inner surface of the cavity 150. In particular, the bottom surface of the cavity 150 may include a portion of the upper surface of the first to third metal frames 111, 113 and 115, the first insulating layer 121 and the second insulating layer 123.

The cavity 150 may include an inclined side surface 153 and the inclined side surface 153 may allow light to be emitted more efficiently toward the upper side of the light emitting device. Further, the cavity 150 may further include an end portion 151 formed on a part of the side surface thereof, and a lens (not shown) may be mounted on the end portion 151. Accordingly, the end portion 151 may be omitted as needed.

The substrate 100 may further include a groove (not shown) formed to be embedded from the side surface of the cavity 150, in particular, toward the outside of the substrate 100 from the side surface of the end portion 151.

When a lens (not shown) is further formed on the cavity 150, the inside of the cavity 150 can be sealed by adhering the lens to the end portion 151 using an adhesive. At this time, if the groove is not formed, the lens may be separated from the substrate 100 due to the air compressed in the cavity 150 during the attachment of the lens, and adhesion failure may easily occur. For example, compressed air is generated in the cavity 150 when the lens is pressed against the substrate 100 with the adhesive interposed therebetween using the lens holder. When the lens holder is removed, the lens may be detached from the substrate 100 by the compressed air. Also, during curing of the adhesive, air in the cavity 150 may expand, and the lens may fall from the substrate 100 by increasing the air pressure in the cavity 150.

However, since the groove is formed on the side surface of the cavity 150, the air in the cavity 150 can be discharged to the outside during the lens adhesion. Accordingly, the possibility that the lens is separated from the substrate 100 during the lens bonding process is greatly reduced, so that the defective lens of the light emitting device can be prevented.

When the light emitting device further includes a molding part (not shown), the molding part may be formed to fill the cavity 150. [ The molding part may include a resin or the like.

Referring again to FIGS. 2A to 2C, the light emitting device of this embodiment can include a plurality of light emitting devices located on the substrate 100, and further, the plurality of light emitting devices and the frames 110 can be electrically Wires W1 to W4 to be connected to the substrate 100 and adhesion auxiliary layers 221, 223, 225 and 227 positioned between the substrate 100 and the plurality of light emitting elements.

The plurality of light emitting devices may include a first light emitting device 211, a second light emitting device 213, a third light emitting device 215, and a fourth light emitting device 217.

The plurality of light emitting devices may be positioned on the upper surface of the substrate 100, particularly, on the upper surface of at least one of the frames 110. Specifically, for example, the first and second light emitting devices 211 and 213 may be positioned on the first frame 111, and the third and fourth light emitting devices 215 and 217 may be positioned on the second frame 113 ). ≪ / RTI > Further, each of the light emitting elements can be electrically connected to the frames located thereunder. However, the present invention is not limited thereto.

The plurality of light emitting devices may be mounted on the upper surface of the frames 110 through at least one of bonding using a conductive adhesive such as soldering, Ag adhesive, and eutectic bonding. On the other hand, in the case where a plurality of light emitting devices and the adhesion supporting layers are further disposed between the light emitting devices and the frames 110, the bonding between the plurality of light emitting devices and the adhesion supporting layers and the bonding between the adhesion supporting layers and the frames 110, Bonding using a conductive adhesive such as soldering, Ag adhesive, and eutectic bonding.

The plurality of light emitting devices may be electrically connected in a form of at least one of serial, parallel, and anti-parallel. For example, as in the present embodiment, the first and second light emitting devices 211 and 213 are connected in parallel by being in electrical contact with the first frame 111 in contact with the first frame 111, and the third and fourth light emitting devices 215, and 217 may be electrically connected to each other in parallel by contacting their lower surfaces with the second frame 113. The first and second light emitting devices 211 and 213 are connected to the second frame 113 through the first and second wires W1 and W2 respectively so that the first light emitting device 211 and the third light emitting device 211, And the fourth light emitting devices 215 and 217 may be connected to each other in series. Therefore, the second light emitting device 213 and the third and fourth light emitting devices 215 and 217 may be connected in series with each other.

Meanwhile, the third and fourth light emitting devices 215 and 217 may be electrically connected to the third frame 115 through the third and fourth wires W3 and W4, respectively. Accordingly, the first frame 111 and the third frame 115 are connected to each other so as to serve as leads having different polarities, thereby supplying power to the light emitting device.

According to the present embodiment, it is possible to provide a light emitting device including a plurality of light emitting elements mounted on the frames 110 without forming a separate submount. Therefore, the heat generated from the plurality of light emitting elements can be effectively discharged to the outside of the light emitting device, and the heat emission efficiency of the light emitting device can be improved. Thus, the reliability and efficiency of the light emitting device can be improved. Furthermore, since no additional submount is required, the manufacturing process of the light emitting device can be simplified, and the light emitting device can be miniaturized. That is, as compared with the light emitting device including the conventional submount, the volume of the light emitting device can be reduced by the volume occupied by the submount.

Therefore, the light emitting device of the present invention can be miniaturized while having high heat emission efficiency as compared with the conventional light emitting device.

The first to fourth light emitting devices 211, 213, 215, and 217 may include a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer disposed between the first and second conductive semiconductor layers. May be a light emitting diode. The first to fourth light emitting devices 211, 213, 215, and 217 may be various types of light emitting diodes. For example, the first to fourth light emitting devices 211, 213, 215, and 217 may be formed in various shapes, .

In this embodiment, the first to fourth light emitting devices 211, 213, 215, and 217 may be vertical light emitting devices. For example, the upper surface of each light emitting device has n-type polarity, Lt; / RTI > In this case, the first frame 111 functions as a p-type lead, and the third frame 115 functions as an n-type lead.

However, the present invention is not limited thereto. For example, when at least one of the first to fourth light emitting devices 211, 213, 215, and 217 is a flip chip type light emitting diode, the light emitting device, which is a flip chip type light emitting diode, . In this case, the wire may be omitted. In addition, when at least one of the first to fourth light emitting devices 211, 213, 215, and 217 is a horizontal light emitting diode, the light emitting device as the horizontal light emitting diode is electrically connected to the frames through two or more wires . ≪ / RTI >

The plurality of light emitting elements can be adjusted to emit light having peak wavelengths of various wavelength ranges as needed. Hereinafter, a detailed description of well-known technical matters related to the light emitting device will be omitted.

The adhesion-assisting layers may include first to fourth adhesion-assisting layers 221, 223, 225, and 227, and each of the first to fourth adhesion-assisting layers 221, 223, 225, The light emitting devices 211, 213, 215, and 217 may be located between the light emitting devices 211, 213, 215, and 217 and the substrate 100.

When the light emitting elements are mounted on the frames 110, the adhesion assisting layers can serve to stably mount the light emitting elements. For example, when the first to fourth light emitting devices 211, 213, 215, and 217 are mounted on the frames 110 through soldering, the wettability between the Sn base solder and the frames 110 is improved. Further, even when the light emitting elements are mounted on the frames 110 by using an adhesive method other than soldering, for example, by using a conductive adhesive or by using process bonding, the light emitting elements are more stably held by the adhesive- (110). ≪ / RTI >

The adhesion-promoting layers may include at least one of Ni, Ag, Ni, Au, Cu, Sn, Pb, and Sb and may include a single layer or a multilayer structure.

The area of each of the first to fourth adhesion-assisting layers 221, 223, 225, and 227 may be larger than the area of the light-emitting devices, for example, as shown in FIG. 1 to the fourth light emitting devices 211, 213, 215, and 217, respectively. However, the present invention is not limited thereto.

Further, the adhesion-assisting layer may have a thickness of 1 to 20 占 퐉, and further may have a thickness of 4 to 20 占 퐉, and may have a thickness of, for example, about 6 占 퐉. By forming the adhesion-assisting layer to the above-described thickness, the light emitting elements can be mounted more stably on the frames 110.

Hereinafter, a light emitting device according to another embodiment of the present invention will be described with reference to FIGS. 3 to 6. FIG.

The light emitting device according to the embodiment described with reference to Figs. 3 to 6 is substantially similar to the light emitting device of Figs. 2A to 2C, but differs in some configurations. Hereinafter, the similar description will be omitted, and the differences will be described. It should be noted that the present invention is not limited by these embodiments, and these embodiments are all included in the scope of the invention described in FIGS. 2A to 2C.

3 is a plan view illustrating a light emitting device according to another embodiment of the present invention.

Referring to FIG. 3, the frames 110 include first through sixth frames 111 through 116, and the frames 110 may be spaced apart from each other. The insulating layers 120 may be disposed between the frames 110 and the insulating layers 120 may include first to third insulating layers 121,

The first to sixth frames 111 to 116 can be formed by being arranged side by side in a 2x3 form on a plan view. The first insulating layer 121 and the second insulating layer 123 may be spaced apart from each other so that the third insulating layer 125 intersects the first and second insulating layers 121 and 123 Can be located. Thus, the insulating layers 120 may be in the form of dividing the frames 110.

At this time, the first to fourth light emitting devices 211, 213, 215, and 217 may be mounted on the first to fourth frames 111 to 114 to be electrically connected to each other. The first light emitting device 211 is connected to the second frame 112 through the first wire W1 and the second light emitting device 213 is connected to the third frame 113 via the second wire W2. The third light emitting device 215 is connected to the fourth frame 114 through the third wire W3 and the fourth light emitting device 217 is connected to the fifth frame 115 through the fourth wire W4, Lt; / RTI > Accordingly, the first to fourth light emitting devices 211, 213, 215, and 217 may be connected to each other in series. Accordingly, the first frame 111 and the fifth frame 115 can function as the leads of different polarities, respectively.

On the other hand, insulating materials 131, 133, and 135 for filling recesses may be formed on the exposed side of the insulating layers 120 of the substrate 110. Between the respective light emitting devices and the substrate 110, 1 to fourth adhesion-assisting layers 221, 223, 225, and 227 may be further formed.

4 is a plan view illustrating a light emitting device according to another embodiment of the present invention.

Referring to FIG. 4, the frames 110 include first through fifth frames 111, 113, 115, 117, and 119, and the frames 110 may be spaced apart from each other. The insulating layers 120 may be disposed between the frames 110 and the insulating layers 120 may include first to fourth insulating layers 121, . The first through fifth frames 111, 113, 115, 117, and 119 may be sequentially arranged in parallel with the insulating layers 120 disposed therebetween.

At this time, the first and second light emitting devices 211 and 212 are disposed on the first frame 111 and may be connected in parallel with each other. Similarly, the third and fourth light emitting devices 213 and 214, the fifth and sixth light emitting devices 215 and 216, and the seventh and eighth light emitting devices 217 and 218 are connected to the second frame 113 ), The third frame 115, and the fourth frame 117. [ Further, the light emitting elements disposed on the same frame may be connected in parallel with each other.

Further, the wires connect the light emitting elements and the frame adjacent to each light emitting element. That is, the first and second wires W1 and W2 connect the first light emitting device 211 and the second light emitting device 212 to the second frame 113, respectively. Similarly, the third to eighth light emitting devices 213 to 218 may be connected to the adjacent frames by the wires W3 to W8. Accordingly, the first, third, fifth, and seventh light emitting devices 211, 213, 215, and 217 may be connected in series with each other. That is, a light emitting device in which four groups of two light emitting elements connected in parallel are connected in series can be realized. Accordingly, the first frame 111 and the fifth frame 119 can function as the leads of different polarities, respectively.

Insulating materials 131, 133, 137, and 139 filling recesses may be formed on the side of the substrate 110 on which the insulating layers 120 are exposed, and between the respective light emitting devices and the substrate 110 The first to eighth adhesion-assisting layers 221 to 228 may be further formed.

3 and 4, the number of the frames 110 and the number of the insulating layers 120 may be variously determined according to the connection type of the light emitting devices. Also, the arrangement of the frames 110 and the insulating layer 120 can be variously adjusted according to the connection type of the light emitting devices, and the light output of the light emitting device can be controlled.

Particularly, since the light emitting device of the present invention can be miniaturized while having a high heat emission efficiency, a light emitting device including relatively more light emitting devices and having high output can be realized.

However, the present invention is not limited thereto, and the arrangement and connection relation between the plurality of frames, the plurality of insulating layers, and the plurality of light emitting elements may be variously modified as needed.

5 is a cross-sectional view illustrating a light emitting device according to another embodiment of the present invention.

Referring to FIG. 5, the frames 110 may include a plurality of frames, and in particular, may include at least two frames containing different metals.

The frames 110 may include a first frame 111, a second-1 frame 113a, a second-second frame 113b, and a third frame 115, The two frames 113a and 113b may be positioned between the first and third frames 111 and 115. [ At this time, the light emitting devices 211 and 215 may be positioned on the 2-1 and 2-2 frames 113a and 113b.

Alternatively, the frames 110 may comprise different metals, for example, the first and third frames 111 and 115 may comprise Al, and the second -1 and second 2 frames (113a, 113b) may include Cu. In this way, the metal included in each frame can be changed in consideration of the characteristics of each frame. Considering that the first and third frames 111 and 115 serve as leads and the second and first frames 2 I and 2 I frames 113 a and 113 b serve as electrode patterns and heat sinks, The substrate 100 can be manufactured so that Al and Cu are included in each of them. As described above, the frames 110 include at least two or more frames including different metals, so that the electrical and thermal characteristics of the light emitting device can be further improved.

6 is a cross-sectional view illustrating a light emitting device according to another embodiment of the present invention.

6A and 6B are substantially similar to the light emitting device of FIGS. 2A to 2C, but differ from each other in that an insulating portion is formed instead of the second pad 143 on the bottom surface of the second frame 113.

First, referring to FIG. 6A, a third insulating portion 170 may be formed between the first and second insulating portions 161 and 163. That is, the third insulating portion 170 may cover the lower surface of the second frame 113. The third insulating portion 170 may include an insulating material such as an oxide, a nitride, or a solder resist. Accordingly, the first pad 141 and the third pad 145 of the light emitting device are electrically connected to each other to effectively prevent electrical short-circuiting.

Furthermore, the third insulating portion 170 may be formed of the same material as the first and second insulating portions 161 and 163. In this case, as shown in FIG. 6 (b), the first to third insulating portions may be formed as an integral insulating portion 165. When the insulating portion 165 includes solder resist, the first pad 141 and the third pad 145 are electrically connected to each other in the process of mounting the light emitting device on a separate substrate such as a secondary substrate, Can be prevented more effectively.

The present invention is not limited to the above-described various embodiments and features, and various modifications and changes may be made without departing from the technical idea of the present invention.

Claims (27)

A substrate comprising at least three spaced apart frames, at least two insulating layers positioned between the frames; And
And a plurality of light emitting elements positioned on the substrate,
The frames are arranged side by side,
Wherein at least two light emitting elements of the plurality of light emitting elements are respectively located on at least two frames of the frames, and the frames are electrically connected to the plurality of light emitting elements. The method according to claim 1,
Wherein the plurality of light emitting devices are electrically connected in the form of at least one of serial, parallel, and anti-parallel. The method of claim 2,
Wherein the frames comprise a first frame, a third frame, and a second frame located between the first and third frames,
Wherein the insulating layers comprise a first insulating layer positioned between the first and second frames, and a second insulating layer positioned between the second and third frames. The method of claim 3,
Wherein the plurality of light emitting elements include light emitting elements located on the first frame and the second frame. The method of claim 4,
Wherein the plurality of light emitting devices includes a first light emitting device and a second light emitting device located on the first frame and a third light emitting device and a fourth light emitting device located on the second frame,
The first and second light emitting devices are connected in parallel to each other, and the third and fourth light emitting devices are connected in parallel to each other, and the first and third light emitting devices are connected in series with each other. The method of claim 2,
Wherein the frames include first through sixth frames,
Wherein the insulating layers comprise a first insulating layer, a second insulating layer spaced apart from the first insulating layer, and a third insulating layer crossing the first insulating layer and the second insulating layer. The method of claim 6,
Wherein the plurality of light emitting elements includes first to fourth light emitting elements positioned above each of the first frame to the fourth frame,
Wherein the first to fourth light emitting devices are connected in series with each other. The method according to claim 1,
Wherein the at least two frames and the plurality of light emitting elements respectively disposed on the at least two frames are electrically connected to each other. The method according to claim 1,
Wherein:
An upper surface on which the plurality of light emitting elements are located, and a lower surface opposed to the upper surface; And
And a pad covering at least a part of the lower surface. The method of claim 9,
Wherein a bottom surface of the substrate includes a bottom surface of the frames, and the pad at least partially covers a bottom surface of the frames. The method of claim 10,
The substrate includes a first side and a second side opposite the first side,
The frames including a first frame positioned on the first side face side and a second frame positioned on the second side face side,
Wherein the pad comprises a first pad at least partially covering the lower surface of the first frame and a second pad at least partially covering the lower surface of the second frame. The method of claim 11,
Wherein the pad further comprises at least one pad covering a bottom surface of one or more frames positioned between the first and second frames. The method of claim 11,
Wherein the substrate further comprises a first insulating portion covering a bottom surface of at least one frame positioned between the first and second frames. 14. The method of claim 13,
Wherein:
A lower surface of the insulating layers included in a lower surface of the substrate; And
And a second insulating portion covering the lower surfaces of the insulating layers. 15. The method of claim 14,
Wherein the first insulating portion and the second insulating portion are formed of the same material, and the first insulating portion includes a solder resist. 14. The method of claim 13,
Wherein the first insulating portion includes an oxide film or a solder resist. The method according to claim 1,
Wherein the frames comprise metal frames. 18. The method of claim 17,
Wherein the frames comprise Al. 18. The method of claim 17,
Wherein the frames comprise at least two or more frames comprising different metals. The method of claim 19,
Wherein the frames include first through fourth frames arranged in order, the plurality of light emitting elements are located on the second frame and the third frame,
Wherein the first and fourth frames comprise Al, and the second and third frames comprise Cu. The method according to claim 1,
Wherein the substrate further includes a cavity formed on an upper surface thereof, and the plurality of light emitting elements are mounted in the cavity. 23. The method of claim 21,
And a lens positioned on the substrate. 23. The method of claim 22,
Wherein the cavity further comprises an end formed on a side thereof,
And the lens is mounted on the end portion. The method according to claim 1,
Wherein the substrate further comprises at least one concave portion formed on a side surface of the substrate,
Wherein the concave portion overlaps with an insulating layer exposed on a side surface of the substrate. 27. The method of claim 24,
Wherein the substrate includes an upper surface on which the plurality of light emitting elements are located and a lower surface located opposite to the upper surface,
Wherein the concave portion is open from a lower surface of the substrate and has an upper clogged shape. The method of claim 24 or 25,
Wherein the substrate further comprises an insulating material filling the recess. The method according to claim 1,
And an adhesion-assisting layer positioned between the plurality of light-emitting elements and the substrate.

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